JP6604035B2 - Liquid ejection device and method of manufacturing liquid ejection device - Google Patents

Description

The present invention relates to a liquid ejection device and a method for manufacturing the same .

  2. Description of the Related Art Conventionally, in the field of liquid ejection devices that eject liquid, a device using a piezoelectric element (piezoelectric actuator) is known as a configuration for ejecting liquid. In previous devices, piezoelectric actuators having a structure in which a plurality of piezoelectric sheets obtained by firing are laminated have been widely used (see, for example, Patent Document 1). In recent years, however, it has also been proposed to employ a micro device (so-called MEMS) in which thin films such as electrode films and piezoelectric films are sequentially formed on a substrate such as silicon by a semiconductor process and a plurality of piezoelectric elements are integrated. (For example, see Patent Document 2)

  The ink jet head of Patent Document 2 includes a nozzle plate, a pressure chamber forming substrate, a communication substrate, a plurality of piezoelectric elements, and the like. Each of the nozzle plate, the pressure chamber forming substrate, and the communication substrate is a substrate formed of silicon. A plurality of nozzles are formed on the nozzle plate. A plurality of pressure chambers corresponding to the plurality of nozzles are formed on the silicon pressure chamber forming substrate by etching. A communication substrate is disposed between the nozzle plate and the pressure chamber forming substrate, and the plurality of nozzles communicate with the plurality of pressure chambers via communication channels formed in the communication substrate. A thin film such as a lower electrode film, a piezoelectric film, and an upper electrode film is sequentially formed on the upper surface of the silicon pressure chamber forming substrate, so that a plurality of piezoelectric elements respectively corresponding to a plurality of pressure chambers are integrated. Is formed. In addition, a cover member is disposed on the upper surface of the pressure chamber forming substrate so as to cover the plurality of piezoelectric elements for the purpose of protecting and moisture-proofing the plurality of piezoelectric elements generated by the film formation. This cover member is also formed of silicon.

  A plurality of contacts connected to the electrodes of the plurality of piezoelectric elements are arranged on the upper surface of the pressure chamber forming substrate in an area exposed from the cover member. A wiring member (flexible cable) is joined to the exposed region of the pressure chamber forming substrate. A driving IC for applying a driving voltage to each piezoelectric element is mounted on the wiring.

JP 2014-189017 A JP 2014-54835 A (particularly FIG. 4)

  In the ink jet head of Patent Document 2, a plurality of pressure chambers are formed on a pressure chamber forming substrate by etching, and a plurality of piezoelectric elements are integrated on this substrate corresponding to a plurality of pressure chambers by film formation. Formed. Therefore, the pressure chamber forming substrate is a very expensive member among the constituent members of the ink jet head. Therefore, it is preferable to reduce the size of one pressure chamber forming substrate as much as possible for the purpose of reducing the cost by increasing the number of substrates taken from one wafer.

  However, when the size of the pressure chamber forming substrate is reduced, the exposed area from the cover member is reduced, and consequently, the bonding area of the wiring member is also reduced. When the joining area of the wiring member is small, the distance between the end of the wiring member and the cover member covering the plurality of piezoelectric elements is reduced. This may cause a short circuit between the contact of the wiring member and the silicon cover member.

  An object of the present invention is to reliably prevent a short circuit between the contact of the wiring member and the cover member.

A liquid ejection device according to a first aspect of the present invention includes a pressure chamber forming member in which a plurality of pressure chambers are formed, a plurality of piezoelectric elements provided in the pressure chamber forming member corresponding to the plurality of pressure chambers, A cover member provided on the pressure chamber forming member so as to cover the plurality of piezoelectric elements, and an exposed portion of the pressure chamber forming member which is not covered with the cover member, and connected to the plurality of piezoelectric elements, respectively. A plurality of first contacts, an insulating substrate, a plurality of second contacts disposed at a connection end of the substrate, and a plurality of second contacts disposed at the connection end of the substrate. An insulating bonding layer provided, and a wiring member bonded to the exposed portion of the pressure chamber forming member by the bonding layer in a state where the first contact and the second contact are conductive; With
The bonding layer is provided so as to cover an end surface of the connection end portion of the connection end portion of the substrate from the arrangement surface of the second contact to a surface opposite to the arrangement surface. To do.

  An insulating bonding layer is provided on the surface where the plurality of second contacts are arranged at the connection end of the substrate. The connection end of the substrate is bonded to the pressure chamber forming substrate by the bonding layer in a state where the first contact and the second contact are conducted. Moreover, in this invention, since the joining layer is provided from the arrangement | positioning surface of the 2nd contact of a connection end part to the surface on the opposite side to an arrangement | positioning surface, the end surface of a connection end part is reliably covered with a joining layer. Therefore, even when the wiring member is joined to the pressure chamber forming member in the immediate vicinity of the cover member, a short circuit between the second contact of the wiring member and the cover member is prevented.

  In the liquid ejection apparatus according to a second aspect of the present invention, in the first aspect, the bonding layer is formed of an anisotropic conductive material, and the bonding layer is electrically conductive in a portion between the first contact and the second contact. And has an insulating property at portions other than between the first contact and the second contact.

  In the present invention, the bonding layer is formed of an anisotropic conductive material. An anisotropic conductive material is formed by dispersing a conductive material in a resin material. When a load is applied from the outside, the anisotropic conductive material exhibits conductivity in a portion where the load is applied. When the wiring member is pressed in a state where the bonding layer made of the anisotropic conductive material is in contact with the first contact on the pressure chamber forming member side, the anisotropic conductive material is electrically conductive between the first contact and the second contact. The material is joined and the two contacts are connected. On the other hand, since the bonding layer made of an anisotropic conductive material maintains the insulating property when no load is applied, the end surface of the connecting end portion of the substrate is covered with the insulating layer.

  In the liquid ejection device according to a third aspect of the present invention, in the first or second aspect of the present invention, the first conductive portion including the second contact is located on the connection end portion of the substrate on the arrangement surface of the connection end portion. It extends to the end face.

  When the second contact extends to the end surface of the substrate and is exposed at the end surface, the second contact and the cover member are easily short-circuited when the wiring member is joined near the cover member. In this regard, in the present invention, since the end face of the substrate is covered with the bonding layer, a short circuit between the second contact and the cover member is reliably prevented.

  According to a fourth aspect of the present invention, in any one of the first to third aspects of the invention, the adhesion area of the bonding layer on the surface opposite to the arrangement surface of the connection end is on the arrangement surface. It is characterized by being smaller than the adhesion area.

  When joining the wiring member to the pressure chamber forming member, a jig is pressed against the surface of the connection end of the substrate opposite to the arrangement surface, and the connection end is pressed against the pressure chamber forming member. Here, since the bonding layer is also formed on the surface of the connection end opposite to the arrangement surface, it is conceivable that the bonding layer adheres to the jig when the wiring member is pressed. In the present invention, since the adhesion area of the bonding layer on the surface opposite to the arrangement surface is small, the bonding layer is difficult to adhere to the jig.

  In the liquid ejection device according to a fifth aspect of the present invention, in any one of the first to fourth aspects of the invention, a first conductive portion including the second contact point is formed on the arrangement surface of the connection end portion, and the connection end An insulating layer that partially covers the first conductive portion is formed in a region on the end surface side of the arrangement surface of the portion.

  When an insulating layer is provided in a region close to the end face at the connection end of the substrate, the thickness of the end face side portion of the connection end increases and the rigidity increases. Therefore, when the second contact is joined to the first contact, the end face side portion is warped, so that the end face of the substrate is slightly separated from the cover member. Thereby, the short circuit between the 2nd contact of a board | substrate and a cover member is prevented more reliably.

  In the liquid ejection device according to a sixth aspect, in the fifth aspect, the second conductive portion including a third contact connected to the common electrode of the plurality of piezoelectric elements on the arrangement surface of the wiring member is Arranged together with the first conductive part, the insulating layer is not formed in the region on the end face side in the vicinity of the second conductive part, and the second conductive part is formed in the insulating layer in the region on the end face side. It is characterized by being exposed from.

  In this invention, the 2nd electroconductive part containing a 3rd contact is arrange | positioned with the 1st electroconductive part containing a 2nd contact on the arrangement | positioning surface of the connection end part of a wiring member. Here, a large current flows through the third contact connected to the common electrode of the plurality of piezoelectric elements as compared with the second contact. For this reason, it is desired to reduce the electrical resistance of the current path between the common electrode and the third contact as much as possible. From this viewpoint, the insulating layer is not formed in the vicinity of the second conductive portion at the connection end, and the second conductive portion is exposed from the insulating layer.

According to a seventh aspect of the present invention, there is provided a liquid ejection device manufacturing method comprising: a pressure chamber forming member having a plurality of pressure chambers; and a plurality of piezoelectric elements provided on the pressure chamber forming member corresponding to the plurality of pressure chambers. A cover member provided on the pressure chamber forming member so as to cover the plurality of piezoelectric elements, and an exposed portion of the pressure chamber forming member that is not covered with the cover member, A wiring member having a plurality of connected first contacts, an insulating substrate, and a plurality of second contacts formed at a connection end of the substrate,
A layer forming step of providing an insulating bonding layer so as to cover an arrangement surface of the second contact and an end surface of the connection end at the connection end of the substrate; and the connection end of the wiring member A joining step of joining the wiring member to the pressure chamber forming member by the joining layer in a state of pressing the exposed portion of the pressure chamber forming member and electrically connecting the first contact and the second contact. It is characterized by that.

  In the present invention, a connection layer is provided at the connection end portion of the substrate so as to cover the arrangement surface of the second contact and the end surface of the connection end portion, and then the connection end portion of the wiring member is pressed against the pressure chamber forming member to be bonded. . In addition, since the end surface of the connection end portion of the substrate is covered with an insulating bonding layer, even when the wiring member is bonded to the pressure chamber forming member in the immediate vicinity of the cover member, the second contact of the wiring member A short circuit with the cover member is prevented.

  According to an eighth aspect of the present invention, there is provided a method for manufacturing a liquid ejection apparatus according to the seventh aspect, wherein the bonding layer is formed of an anisotropic conductive material in the layer forming step.

  When the wiring member is pressed in a state where the bonding layer made of the anisotropic conductive material is in contact with the first contact on the pressure chamber forming member side, the anisotropic conductive material is electrically conductive between the first contact and the second contact. The material is joined and the two contacts are connected. On the other hand, since the bonding layer made of an anisotropic conductive material maintains the insulating property when no load is applied, the end surface of the connecting end portion of the substrate is covered with the insulating layer.

  According to a ninth aspect of the present invention, in the seventh or eighth aspect of the invention, the substrate includes the plurality of second contacts and the plurality of inspection contacts respectively connected to the plurality of second contacts. A contact forming step for forming, and a cutting step for cutting the substrate between the plurality of second contacts and the plurality of inspection contacts, and in the layer forming step, after the cutting step, The bonding layer is formed on the connection end portion of the substrate on which the plurality of second contacts are formed so as to cover an arrangement surface of the second contact and a cut surface of the substrate.

  From the viewpoint of reducing the size of the liquid ejection device, it is preferable to reduce the size of the pressure chamber forming member by arranging the plurality of first contacts on the pressure chamber forming member side at a narrow pitch. However, if the arrangement pitch of the first contacts is reduced, the arrangement pitch of the second contacts on the wiring member side needs to be reduced accordingly, and as a result, the area of one second contact must be reduced. Disappear. At the time of manufacturing the wiring member, it is necessary to conduct a continuity test for each second contact. However, if the area of one second contact is reduced, it is difficult to test by applying a probe or the like to the second contact.

  In this regard, in the present invention, in addition to the second contact, an inspection contact connected to the second contact is formed on the substrate. The inspection contact is for conducting a continuity inspection by applying a probe or the like instead of the second contact, and after the inspection, the substrate is cut to remove the portion where the inspection contact is formed. In other words, since the inspection contact is formed at a portion to be removed later, unlike the second contact, the inspection contact can be disposed relatively freely and can be a contact having a large area. However, by cutting the substrate between the second contact and the inspection contact, a part of the conductive part connecting the second contact and the inspection contact is exposed at the cut end surface. Therefore, an insulating bonding layer is formed on the end portion of the substrate so as to cover the arrangement surface on the second contact side and the cut surface of the substrate. Thereby, when the wiring member is joined to the pressure chamber forming member, a short circuit between the second contact of the wiring member and the cover member is reliably prevented.

1 is a schematic plan view of a printer according to an embodiment. It is a top view of one head unit of an inkjet head. It is the A section enlarged view of FIG. FIG. 4 is a sectional view taken along line IV-IV in FIG. 3. It is the top view of COF, (a) is the figure which looked at COF from the arrangement | positioning surface side of a contact, (b) is the figure which looked at COF from the opposite side to the arrangement surface of a contact. FIG. 6 is a sectional view taken along line VI-VI in FIG. 5. It is a figure which shows the manufacturing process of COF. It is a figure which shows the process of joining COF to a flow-path board | substrate. It is a figure which shows COF of a modified form, (a) is a top view of COF before a joining layer is formed, (b) is a top view of COF after a joining layer is formed, (c) is (b) It is a CC sectional view taken on the line of FIG. It is a figure which shows the process of joining COF of FIG. 9 to a flow-path board | substrate. It is a figure which shows COF of another modification, (a) is a top view of COF before a joining layer is formed, (b) is a top view of COF after a joining layer is formed. It is sectional drawing of COF of another modification. It is sectional drawing of COF of another modification.

  Next, an embodiment of the present invention will be described. FIG. 1 is a schematic plan view of a printer according to the present embodiment. First, a schematic configuration of the inkjet printer 1 will be described with reference to FIG. 1 are defined as “front”, “rear”, “left”, and “right” of the printer. Also, the front side of the page is defined as “up”, and the other side of the page is defined as “down”. Below, it demonstrates using each direction word of front, back, left, right, up and down suitably.

(Schematic configuration of the printer)
As shown in FIG. 1, the inkjet printer 1 includes a platen 2, a carriage 3, an inkjet head 4, a transport mechanism 5, a control device 6, and the like.

  On the upper surface of the platen 2, a recording sheet 100 as a recording medium is placed. The carriage 3 is configured to be capable of reciprocating in the left-right direction (hereinafter also referred to as the scanning direction) along the two guide rails 10 and 11 in a region facing the platen 2. An endless belt 14 is connected to the carriage 3, and the endless belt 14 is driven by a carriage drive motor 15, whereby the carriage 3 moves in the scanning direction.

  The inkjet head 4 is attached to the carriage 3 and moves in the scanning direction together with the carriage 3. The ink jet head 4 includes four head units 16 arranged in the scanning direction. The four head units 16 are respectively connected to a cartridge holder 7 to which ink cartridges 17 of four colors (black, yellow, cyan, magenta) are mounted by tubes (not shown). Each head unit 16 has a plurality of nozzles 20 (see FIGS. 2 to 4) formed on the lower surface (the surface on the other side of the paper surface of FIG. 1). The nozzle 20 of each head unit 16 discharges the ink supplied from the ink cartridge 17 toward the recording paper 100 placed on the platen 2.

  The transport mechanism 5 includes two transport rollers 18 and 19 disposed so as to sandwich the platen 2 in the front-rear direction. The transport mechanism 5 transports the recording paper 100 placed on the platen 2 forward (hereinafter also referred to as a transport direction) by two transport rollers 18 and 19.

  The control device 6 includes a ROM (Read Only Memory), a RAM (Random Access Memory), an ASIC (Application Specific Integrated Circuit) including various control circuits, and the like. The control device 6 executes various processes such as printing on the recording paper 100 by the ASIC according to the program stored in the ROM. For example, in the printing process, the control device 6 controls the inkjet head 4, the carriage drive motor 15, and the like based on a print command input from an external device such as a PC, and prints an image or the like on the recording paper 100. . Specifically, an ink discharge operation for discharging ink while moving the inkjet head 4 in the scanning direction together with the carriage 3 and a transport operation for transporting the recording paper 100 in the transport direction by the transport rollers 18 and 19 alternately. To do.

(Details of inkjet head)
Next, the detailed configuration of the inkjet head 4 will be described. FIG. 2 is a top view of one head unit 16 of the inkjet head 4. Since the four head units 16 of the inkjet head 4 have the same configuration, only one of them will be described, and the description of the other head units 16 will be omitted. FIG. 3 is an enlarged view of a portion A in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

  As shown in FIGS. 2 to 4, the head unit 16 includes a flow path substrate 21, a nozzle plate 22, a piezoelectric actuator 24, a cover member 25, and a COF 50 (Chip On Film) that is a wiring member. In FIGS. 2 and 3, the cover member 25 and the COF 50 positioned above the flow path substrate 21 and the piezoelectric actuator 24 are simply shown by two-dot chain lines for simplification of the drawings.

(Channel substrate)
The flow path substrate 21 is a silicon single crystal substrate. A plurality of pressure chambers 26 are formed in the flow path substrate 21. The plurality of pressure chambers 26 are arranged in the transport direction and constitute two rows of pressure chambers arranged in the scanning direction. In addition, a vibration film 30 that covers the plurality of pressure chambers 26 is formed on the flow path substrate 21. The vibration film 30 is a film containing silicon dioxide (SiO ₂ ) or silicon nitride (SiNx) formed by oxidizing or nitriding a part of the surface of the silicon flow path substrate 21. A communication hole 30 a is formed in a portion of the vibrating membrane 30 that overlaps the inner end of each pressure chamber 26.

(Nozzle plate)
The nozzle plate 22 is bonded to the lower surface of the flow path substrate 21. The nozzle plate 22 is formed with a plurality of nozzles 20 that communicate with the plurality of pressure chambers 26 of the flow path substrate 21. As shown in FIG. 2, the plurality of nozzles 20 are arranged in the transport direction similarly to the plurality of pressure chambers 26 and constitute two nozzle rows arranged in the scanning direction. Between the two nozzle rows, the position of the nozzle 20 in the transport direction is shifted by half (P / 2) of the arrangement pitch P in each nozzle row. Although the material of the nozzle plate 22 is not particularly limited, it can be a silicon single crystal substrate in the same manner as the flow path substrate 21. Or you may employ | adopt the thing made from a synthetic resin.

(Piezoelectric actuator)
The piezoelectric actuator 24 imparts ejection energy for ejecting from the nozzle 20 to the ink in the plurality of pressure chambers 26. As shown in FIGS. 2 to 4, the piezoelectric actuator 24 includes a plurality of piezoelectric elements 39 arranged on the upper surface of the vibration film 30 respectively corresponding to the plurality of pressure chambers 26 arranged in two rows. .

  Hereinafter, the configuration of the piezoelectric element 39 will be described. In the present embodiment, a plurality of thin films including a film to be the lower electrode 31, a film to be the piezoelectric body 32, and a film to be the upper electrode 33 are sequentially formed on the upper surface of the vibration film 30, thereby An element 39 is formed.

  A lower electrode 31 is formed on the upper surface of the vibration film 30 so as to straddle the plurality of pressure chambers 26. The lower electrode 31 is a common electrode for the plurality of piezoelectric elements 39. The material of the lower electrode 31 is not particularly limited. For example, the lower electrode 31 is made of platinum (Pt). The thickness of the lower electrode 31 is, for example, 200 nm.

  Two piezoelectric bodies 32 are arranged on the lower electrode 31 corresponding to the two pressure chamber rows, respectively. One piezoelectric body 32 has a rectangular planar shape that is long in the transport direction, and is disposed so as to straddle a plurality of pressure chambers 26 constituting a corresponding pressure chamber row. The piezoelectric body 32 is made of, for example, a piezoelectric material mainly composed of lead zirconate titanate (PZT) which is a mixed crystal of lead titanate and lead zirconate. Alternatively, the piezoelectric body 32 may be formed of a lead-free piezoelectric material that does not contain lead. The piezoelectric body 32 can be formed by a film forming method such as a sol-gel method, a sputtering method, or a PLD method (pulse laser deposition method). The thickness of the piezoelectric body 32 is, for example, 10 μm or less, and preferably 1 μm.

  A plurality of upper electrodes 33 respectively corresponding to the plurality of pressure chambers 26 are formed on the upper surface of the piezoelectric body 32. The upper electrode 33 is made of, for example, platinum (Pt) or iridium (Ir). Further, the thickness of the upper electrode 33 is, for example, 100 nm.

  In the above configuration, one piezoelectric element is formed by one upper electrode 33, a portion facing the one pressure chamber 26 of the lower electrode 31 that is a common electrode, and a portion facing one pressure chamber 26 of the piezoelectric body 32. An element 39 is configured. The plurality of piezoelectric elements 39 are arranged in accordance with the arrangement of the plurality of pressure chambers 26 to form two left and right columns. Further, in each piezoelectric element 39, a portion sandwiched between the upper electrode 33 and the lower electrode 31 of the piezoelectric body 32 is hereinafter specifically referred to as an active portion 38.

  A wiring 35 is connected to the upper electrode 33 of each piezoelectric element 39. The wiring 35 is formed of aluminum (Al), gold (Au), or the like. Moreover, the thickness of the wiring 35 is 1 micrometer, for example. The wiring 35 extends from the upper electrode 33 in the scanning direction. More specifically, as shown in FIG. 2, the wiring 35 connected to the upper electrode 33 of the piezoelectric element 39 arranged on the left side extends from the corresponding upper electrode 33 to the left side. Further, the wiring 35 connected to the upper electrode 33 of the piezoelectric element 39 arranged on the right side extends from the corresponding upper electrode 33 to the right side.

(Cover member)
A cover member 25 that covers the plurality of piezoelectric elements 39 of the piezoelectric actuator 24 is disposed on the upper surface of the flow path substrate 21. As shown in FIGS. 2 to 4, the cover member 25 is a silicon single crystal substrate, like the flow path substrate 21.

  On the lower half of the cover member 25, two right and left cover portions 54 are formed. The cover member 25 is bonded to the upper surface of the central portion in the left-right direction of the flow path substrate 21 (vibrating film 30) with the two left and right cover portions 54 covering the two left and right piezoelectric bodies 32, respectively. The left and right end portions of the flow path substrate 21 are exposed portions 27 that are not covered by the cover member 25.

  In the upper half of the cover member 25, a reservoir 52 extending in the direction in which the pressure chambers 26 are arranged (in the direction perpendicular to the plane of FIG. 4) is formed. The reservoir 52 is connected to a cartridge holder 7 (see FIG. 1) in which the ink cartridge 17 is mounted by a tube (not shown). A plurality of ink supply channels 53 connected to the reservoir 52 are formed between the two cover portions 54 of the cover member 25. Each ink supply channel 53 communicates with a plurality of pressure chambers 26 of the channel substrate 21 through a communication hole 30 a formed in the vibration film 30. As a result, ink is supplied from the reservoir 52 to the plurality of pressure chambers 26 via the plurality of ink supply channels 53.

(Contacts formed on the flow path substrate)
As shown in FIGS. 2 to 4, a plurality of drive contacts 40 are arranged side by side in the transport direction at the left and right end portions (exposed portion 27) of the flow path substrate 21 exposed from the cover member 25. As shown in FIG. 2, the wiring 35 drawn leftward from the upper electrode 33 of the left piezoelectric element 39 is connected to the driving contact 40 disposed on the left exposed portion 27. In addition, the wiring 35 drawn rightward from the upper electrode 33 of the right piezoelectric element 39 is connected to the drive contact 40 disposed on the exposed portion 27 on the right side. Each exposed portion 27 is also provided with two ground contacts 41 connected to the lower electrode 31 which is a common electrode.

(COF)
As shown in FIG. 2, two COFs (Chip On Film) 50 that are wiring members are joined to the upper surfaces of the two exposed portions 27 of the flow path substrate 21. 5A and 5B are plan views of the COF 50, where FIG. 5A is a view of the COF 50 viewed from the contact placement surface side, and FIG. 5B is a view of the COF 50 viewed from the side opposite to the contact placement surface. 6 is a cross-sectional view taken along line VI-VI in FIG. As shown in FIG. 4, the COF 50 is joined to the flow path substrate 21 at one end, and a portion connected to the one end is bent and extends upward.

  As shown in FIGS. 4 to 6, the COF 50 includes a flexible substrate 55 that is formed of an insulating material such as polyimide and has a rectangular shape in plan view. In the following description of the configuration of the COF 50, the vertical direction in FIG. 5 is defined as “direction A” and the horizontal direction is defined as “direction B”.

  A driver IC 56 is disposed on one surface of the flexible substrate 55. An input wiring 57, an output wiring 58, and a ground wiring 59 are also formed on the surface of the flexible substrate 55 on which the driver IC 56 is disposed. The driver IC 56 is provided in the middle of the flexible substrate 55 in the direction A. A plurality of input wirings 57 are connected to a plurality of signal input portions of the driver IC 56, and a plurality of output wirings 58 are connected to a plurality of signal output portions of the driver IC 56. The plurality of input wirings 57 extend from the driver IC 56 to one side in the direction A. The plurality of output wirings 58 extend from the driver IC 56 to the other side in the direction A.

  One end of the flexible substrate 55 in the direction A is a connection end 61 connected to the control device 6 of the printer 1. In the connection end 61, a plurality of input contacts 57 a respectively provided at the tip ends of the plurality of input wirings 57 are arranged along the direction B. On the other hand, the other end in the direction A of the flexible substrate 55 is a connection end 62 connected to the piezoelectric actuator 24. A plurality of output contacts 58 b provided at the tip ends of the plurality of output wirings 58 are arranged along the direction B at the connection end 62. As shown in FIG. 5, in the present embodiment, the output wiring 58 includes a conductive portion 58 c that extends further in the direction A from the tip of the output contact 58 b to the end surface 62 c of the connection end portion 62.

  Two ground wirings 59 extending along the direction A are arranged at both ends in the direction B of the flexible substrate 55. Two ground contacts 59 a provided at one end portions of the two ground wirings 59 are arranged at the connection end 61. Similarly, at the connection end portion 62, two ground contacts 59b provided at the other end portions of the two ground wirings 59 are disposed. Although not shown, the ground wiring 59 is connected to the ground, and the potential of the ground wiring 59 is maintained at the ground potential.

  An insulating layer 60 made of a solder resist is formed on the surface of the flexible substrate 55 on the driver IC 56 side. The insulating layer 60 covers the plurality of input wirings 57, the plurality of output wirings 58, and the two ground wirings 59. However, the insulating layer 60 is not provided on the connection end portions 61 and 62 of the flexible substrate 55. Therefore, the input contact 57a, the output contact 58b, and the ground contacts 59a and 59b are not covered with the insulating layer 60.

  By the way, when the area of the exposed portion 27 of the flow path substrate 21 is reduced from the viewpoint of miniaturization of the flow path substrate 21 or the like, when the connection end 62 of the flexible substrate 55 is joined to the exposed portion 27, FIG. As shown in FIG. 4, the distance between the end surface 62c of the connection end 62 and the cover member 25 is reduced. For example, when the length L2 of the connection end 62 of the COF 50 is 500 μm and the length L1 of the exposed portion 27 of the flow path substrate 21 is a short value of about 800 μm, the end face 62c of the connection end 62 and the cover The separation distance from the member 25 is a very narrow value of 300 μm or less. This may cause a short circuit between the output wiring 58 (output contact 58 b) of the COF 50 and the silicon cover member 25. In particular, in this embodiment, since the output wiring 58 extends to the end surface 62c of the connection end 62, it can be said that the configuration is more likely to cause a short circuit.

  Therefore, in the present embodiment, the following configuration is employed to prevent a short circuit between the COF 50 and the cover member 25. First, the connection layer 62 is provided on the connection end portion 62 of the flexible substrate 55 so as to cover the plurality of output contacts 58b and the two ground contacts 59b. The bonding layer 63 is formed of an anisotropic conductive material in which conductive particles are dispersed in a thermosetting resin, and has the following characteristics. The bonding layer 63 maintains insulation in a state where no load is applied from the outside. On the other hand, when a load of a certain level or more is applied from the outside, the resin material is pushed out in the part where the load is applied, and the density of the conductive particles increases, and the local conductivity is expressed. To do. As the bonding layer 63, an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP) can be used.

  In addition, the bonding layer 63 covers the end surface 62c of the connection end 62 from the arrangement surface 62a of the output contact 58b to the surface 62b opposite to the arrangement surface 62a at the connection end 62 of the flexible substrate 55. Is provided. Thereby, the end of the output wiring 58 extending to the end surface 62 c of the connection end 62 is covered with the bonding layer 63. As shown in FIGS. 5 and 6, the adhesion area of the bonding layer 63 on the surface 62b opposite to the arrangement surface 62a of the connection end 62 is smaller than the adhesion area on the arrangement surface 62a. Specifically, the length Lb of the bonding layer 63 on the surface 62b opposite to the arrangement surface 62a is smaller than the length La on the arrangement surface 62a. For example, La = 500 μm and Lb = 100 μm.

  As will be described later, the connection end 62 of the flexible substrate 55 is pressed against the exposed portion 27 of the flow path substrate 21 while being heated. Thereby, the thermosetting resin of the bonding layer 63 covering the arrangement surface 62a of the connection end 62 is cured, and the COF 50 and the flow path substrate 21 are physically bonded. In addition, since a large load is locally applied to the bonding layer 63 between the driving contact 40 on the flow path substrate 21 side and the output contact 58b on the COF 50 side, conductivity is developed in the bonding layer 63 in this portion. The drive contact 40 and the output contact 58b are electrically connected. Similarly, between the ground contact 41 on the flow path substrate 21 side and the ground contact 59b on the COF 50 side, conductivity is developed in the bonding layer 63, and the two contacts 41 and 59b are conducted.

  On the other hand, since the bonding layer 63 is provided from the arrangement surface 62a of the connection end 62 to the surface 62b on the opposite side of the arrangement surface 62a, the end surface 62c of the connection end 62 is reliably covered with the bonding layer 63. In addition, since a large load does not act on the bonding layer 63 except for the portion covering each output contact 58b, the insulating property of the bonding layer 63 is maintained. That is, the end surface 62c of the connection end portion 62 is covered with the insulating layer. Therefore, even when the connection end 62 of the COF 50 is joined to the flow path substrate 21 in the immediate vicinity of the cover member 25, a short circuit between the output contact 58b of the COF 50 and the cover member 25 is prevented.

  The driver IC 56 generates and outputs a drive signal for driving the piezoelectric actuator 24 based on the control signal sent from the control device 6. The drive signal output from the driver IC 56 is input to the drive contact 40 from the output wiring 58 of the COF 50 and further supplied to each upper electrode 33 via the wiring 35 of the piezoelectric actuator 24. The potential of the upper electrode 33 to which the drive signal is supplied changes between a predetermined drive potential and a ground potential. On the other hand, the ground contact connected to the lower electrode 31 that is a common electrode is electrically connected to the ground wiring 59 of the COF 50. Thereby, the potential of the lower electrode 31 is always maintained at the ground potential.

  An operation of the piezoelectric element 39 when a drive signal is supplied from the driver IC 56 will be described. In a state where no drive signal is supplied, the potential of the upper electrode 33 is the ground potential, and is the same potential as the lower electrode 31. From this state, when a drive signal is supplied to an upper electrode 33 and a drive potential is applied to the upper electrode 33, the active portion 38 is caused to move in the thickness direction due to a potential difference between the upper electrode 33 and the lower electrode 31. A parallel electric field acts. Here, the active portion 38 extends in the thickness direction and contracts in the surface direction due to the inverse piezoelectric effect. Along with the contraction deformation of the active portion 38, the vibration film 30 is bent so as to protrude toward the pressure chamber 26 side. As a result, the volume of the pressure chamber 26 decreases and a pressure wave is generated in the pressure chamber 26, whereby ink droplets are ejected from the nozzle 20 communicating with the pressure chamber 26.

  Next, the manufacturing process of the head unit 16 described above will be described. First, the manufacturing process of the COF 50 will be described with reference to FIG.

(Wiring (contact) formation process)
First, as shown in FIG. 7A, a wiring pattern including an input wiring 57, an output wiring 58, and a ground wiring 59 is formed on one surface of the insulating flexible substrate 55.

  Here, from the viewpoint of miniaturization of the head unit 16, it is preferable to reduce the size of the flow path substrate 21 by arranging the plurality of drive contacts 40 on the flow path substrate 21 side at a narrow pitch. However, if the arrangement pitch of the drive contacts 40 is reduced, the arrangement pitch of the output contacts 58b on the COF 50 side needs to be reduced accordingly. As a result, the area of one output contact 58b must be reduced. . If the area of the output contact 58b is small, it will be difficult to conduct a continuity test using a probe as described later. Therefore, in the present embodiment, a test contact 58d that is electrically connected by the output contact 58b and the conductive portion 58c is also formed at a position ahead of each output contact 58b of the flexible substrate 55 as a contact for performing a continuity test. Similarly, the ground wiring 59 is also provided with a ground inspection contact 59d that is electrically connected by the ground contact 59b and the conductive portion 59c.

  As will be described later, the inspection contact 58d becomes unnecessary after completion of the continuity inspection, and is thus removed by cutting. That is, since the inspection contact 58d is formed in a portion of the flexible substrate 55 that will be removed later, the inspection contact 58d can be arranged freely as compared with the output contact 58b, and the area of one inspection contact 58d is increased. It is also possible to do. Specifically, in FIG. 7A, the plurality of inspection contacts 58 d are alternately arranged so that the positions in the direction A are shifted between the inspection contacts 58 d adjacent in the direction B. Thereby, the area of each inspection contact 58d is larger than that of the output contact 58b.

  After the wiring pattern is formed on the flexible substrate 55, an insulating layer 60 made of a solder resist is formed on the flexible substrate 55 so as to cover portions other than the contact points of the wirings 57, 58, 59. In addition, a driver IC 56 is mounted on the flexible substrate 55.

(Continuity inspection process)
Next, continuity inspection of each wiring 57, 58, 59 is performed by applying a probe to the contact of each wiring 57, 58, 59. Note that the continuity test is performed on the output wiring 58 by applying a probe not to the output contact 58b but to the inspection contact 58d having a large area disposed at the tip of the output contact 58b.

(Cutting process)
When the continuity test is finished, as shown in FIG. 7B, the flexible substrate 55 is cut between the plurality of output contacts 58b and the plurality of test contacts 58d. As a result, the plurality of output contacts 58 b are arranged at the end portion (connection end portion 62) of the flexible substrate 55.

(Layer formation process)
By cutting the flexible substrate 55 between the output contact 58b and the inspection contact 58d in the above-described cutting step, a part of the conductive portion 59c connecting the output contact 58b and the inspection contact 58d is cut off from the flexible substrate 55. The surface 62c is exposed. Therefore, as illustrated in FIG. 7C, the bonding layer 63 is formed so as to cover the cut surface 62 c of the flexible substrate 55. Specifically, as shown in FIG. 6, the end surface (cut surface) 62c of the connection end 62 is covered from the arrangement surface 62a of the connection end 62 of the flexible substrate 55 to the surface 62b opposite to the arrangement surface 62a. Thus, the bonding layer 63 is formed. The bonding layer 63 can be formed by attaching an anisotropic conductive film (ACF) to the connection end 62 of the flexible substrate 55 or applying an anisotropic conductive paste (ACP).

(Joining process)
Next, with reference to FIG. 8, a process of bonding the COF 50 to the flow path substrate 21 will be described. As shown in FIG. 8, the connection end 62 of the flexible substrate 55 is disposed on the exposed portion 27 of the flow path substrate 21 so that the disposition surface 62a on which the output contact 58b is disposed is downward. At this time, the output contact 58b of the COF 50 faces the drive contact 40 of the flow path substrate 21 with the bonding layer 63 interposed therebetween. In this state, the heater 65 is set on the upper surface of the COF 50, and the COF 50 is pressed against the flow path substrate 21 while heating the bonding layer 63 with the heater 65. When the bonding layer 63 is heated, the thermosetting resin is cured, and the COF 50 and the flow path substrate 21 are physically bonded. Furthermore, between the drive contact 40 and the output contact 58b, conductivity is developed in the bonding layer 63, and both the contacts are conducted. On the other hand, since the bonding layer 63 maintains the insulation in a state where no load is applied, the portion covering the end surface 62c of the connection end 62 is maintained in the insulation. Therefore, even when the COF 50 is joined to the flow path substrate 21 in the immediate vicinity of the cover member 25, a short circuit between the output contact 58b of the COF 50 and the cover member 25 is prevented.

  In the present embodiment, the bonding layer 63 is also formed on the surface of the connection end 62 opposite to the arrangement surface 62a. Therefore, it is conceivable that the bonding layer 63 adheres to the heater 65 when the heater 65 is applied to the connection end 62 and pressed against the flow path substrate 21. In this regard, in the present embodiment, the bonding layer 63 is less likely to adhere to the heater 65 because the adhesion area of the bonding layer 63 on the surface opposite to the arrangement surface 62a is smaller than the adhesion area on the arrangement surface 62a.

  In the embodiment described above, the head unit 16 of the inkjet head 4 corresponds to the “liquid ejecting apparatus” of the invention. The flow path substrate 21 corresponds to the “pressure chamber forming member” of the present invention. The COF corresponds to the “wiring member” of the present invention. The flexible substrate 55 corresponds to the “substrate” of the present invention. The drive contact 40 corresponds to the “first contact” of the present invention. The output contact 58b that conducts with the drive contact 40 corresponds to the “second contact” and the “main contact” of the present invention. The output wiring 58 corresponds to the “first conductive portion” of the present invention.

  Next, modified embodiments in which various modifications are made to the embodiment will be described. However, components having the same configuration as in the above embodiment are given the same reference numerals and description thereof is omitted as appropriate.

1] As shown in FIG. 9, the insulating layer 66 covers the output wiring 58 (conductive portion 58 c) partially in the region on the end surface 62 c side of the arrangement surface 62 a of the connection end portion 62 of the flexible substrate 55. May be formed. 9A and 9B are both plan views of the connection end 62 of the flexible substrate 55 as viewed from the arrangement surface 62a side. FIG. 9A is a view before the bonding layer 63 is formed. FIG. 4B is a view after the bonding layer 63 is formed. Moreover, FIG.9 (c) is CC sectional view taken on the line of FIG.9 (b). The insulating layer 66 may be the same as the insulating layer 60 made of a solder resist that covers most of the output wiring 58, but may be formed of a different insulating material.

  Thus, when the insulating layer 66 is provided in the region near the end surface 62c in the connection end portion 62 of the flexible substrate 55, the thickness of the end surface side portion of the connection end portion 62 is increased, and the rigidity is increased. Therefore, as shown in FIG. 10, when the connection end portion 62 is joined to the flow path substrate 21, the end face side portion is warped, so that the end face 62 c of the flexible substrate 55 is slightly separated from the cover member 25. Thereby, the short circuit between the output contact 58b of the flexible substrate 55 and the cover member 25 is prevented more reliably.

2] In the form shown in FIG. 9, the conductive portion 59 c of the ground wiring 59 ahead of the ground contact 59 b is also covered with the insulating layer 60. Here, the ground contact 59b is connected to the lower electrode 31 that is a common electrode of the plurality of piezoelectric elements 39, and a larger current flows than the output contact 58b. Therefore, it is desired to reduce the electrical resistance of the current path between the lower electrode 31 and the ground contact 59b as much as possible. Further, since the ground wiring 59 is always held at the ground potential, unlike the output contact 58b to which the drive voltage is applied, the necessity for preventing the contact with the cover member 25 is low. From the above viewpoint, as shown in FIG. 11, the insulating layer 66 is not formed in the region on the end surface 62 c side in the vicinity of the ground wiring 59 in the arrangement surface 62 a of the connection end portion 62. The wiring 59 may be exposed from the insulating layer 66 in the region on the end face 62c side. In the embodiment of FIG. 11, the ground contact 59b corresponds to the “third contact” of the present invention. The ground wiring 59 corresponds to the “second conductive portion” of the present invention.

3] In the above embodiment, the bonding layer 63 is provided from the arrangement surface 62a of the connection end 62 to the surface 62b on the opposite side of the arrangement surface 62a (see FIG. 6), but as shown in FIG. The layer 63 may be configured to cover only the arrangement surface 62 a and the end surface 62 c of the connection end portion 62.

4] In the above embodiment, the output wiring 58 extends to the end surface 62c of the connection end 62, but the output wiring 58 does not extend to the end surface 62c of the connection end 62 as shown in FIG. May be.

5] In the above embodiment, the bonding layer 63 provided on the connection end 62 of the flexible substrate 55 is formed of an anisotropic conductive material. However, the non-conductive adhesive (NCF or NCP). In this case, when the connection end 62 is pressed against the flow path substrate 21, a portion of the bonding layer 63 that covers the output contact 58 b is expanded outward, and the output terminal 58 b is electrically connected to the drive contact 40. In addition, in order to make it easy to spread the bonding layer 63 covering the output contact 58b outward, the drive contact 40 may be formed in a convex shape with the center portion protruding. Further, the bonding layer 63 may be composed of two or more layers including a layer made of an anisotropic conductive adhesive such as ACF or ACP and a layer made of a non-conductive adhesive such as NCF or NCP. Good.

6] In the above embodiment, as shown in FIG. 2, the COF 50 is joined to the exposed portions 27 on the left and right sides of the flow path substrate 21 with respect to the cover member. However, the configuration is not limited thereto. For example, in Patent Document 2 described above (FIG. 4 of JP-A-2014-54835), the cover member is formed in a frame shape, and the portion between the two piezoelectric element arrays on the pressure chamber forming substrate is It is exposed from the cover member, and the wiring member is joined to the exposed portion. The present invention can also be applied to the ink jet head having the above configuration.

7] In the above embodiment, the present invention is applied to an ink-jet head that prints an image or the like by ejecting ink onto a recording sheet. However, the liquid ejecting apparatus is used for various purposes other than printing an image or the like. The present invention can also be applied. For example, the present invention can also be applied to an industrial liquid discharge apparatus that discharges a conductive liquid onto a substrate to form a conductive pattern on the substrate surface. Further, the wiring member of the present invention is not limited to the wiring member of the liquid ejection device. Even in apparatuses other than the liquid ejection apparatus, by applying the present invention, it is possible to reliably prevent the main contact of the wiring member from being short-circuited with another conductive member around the wiring member.

4 Inkjet head 20 Nozzle 21 Flow path substrate 25 Cover member 26 Pressure chamber 27 Exposed portion 39 Piezoelectric element 40 Driving contact 50 COF
55 Flexible substrate 58 Output wiring 58b Output contact 58d Inspection contact 59 Ground wiring 59a Ground contact 59b Ground contact 62 Connection end 62a Arrangement surface 62b Surface opposite to the arrangement surface 62c End surface 63 Bonding layer 65 Heater 66 Insulation layer

Claims (11)

A pressure chamber forming member in which a plurality of pressure chambers are formed;
A plurality of piezoelectric elements provided corresponding to the plurality of pressure chambers in the pressure chamber forming member;
A cover member provided on the pressure chamber forming member so as to cover the plurality of piezoelectric elements;
A plurality of first contacts provided on an exposed portion of the pressure chamber forming member that is not covered by the cover member, each connected to the plurality of piezoelectric elements;
An anisotropic conductive material provided on an insulating substrate, a plurality of second contacts disposed at a connection end of the substrate, and a plurality of second contacts disposed at the connection end of the substrate A wiring member that is joined to the exposed portion of the pressure chamber forming member by the joining layer in a state in which the first contact and the second contact are conducted,
With
The bonding layer is provided so as to cover the end surface of the connection end portion from the connection surface of the second contact point to the surface opposite to the arrangement surface of the connection end portion of the substrate , and
The bonding layer has conductivity in a portion between the first contact and the second contact, and has insulation in a portion other than between the first contact and the second contact,
The liquid ejection device according to claim 1, wherein an adhesion area of the bonding layer on a surface opposite to the arrangement surface of the connection end is smaller than an adhesion area on the arrangement surface . A pressure chamber forming member in which a plurality of pressure chambers are formed;
A plurality of piezoelectric elements provided corresponding to the plurality of pressure chambers in the pressure chamber forming member;
A cover member provided on the pressure chamber forming member so as to cover the plurality of piezoelectric elements;
A plurality of first contacts provided on an exposed portion of the pressure chamber forming member that is not covered by the cover member, each connected to the plurality of piezoelectric elements;
An anisotropic conductive material provided on an insulating substrate, a plurality of second contacts disposed at a connection end of the substrate, and a plurality of second contacts disposed at the connection end of the substrate A wiring member that is joined to the exposed portion of the pressure chamber forming member by the joining layer in a state in which the first contact and the second contact are conducted,
With
The bonding layer is provided so as to cover the end surface of the connection end portion from the connection surface of the second contact point to the surface opposite to the arrangement surface of the connection end portion of the substrate , and
The bonding layer has conductivity in a portion between the first contact and the second contact, and has insulation in a portion other than between the first contact and the second contact,
A first conductive portion including the second contact is formed on the arrangement surface of the connection end;
The liquid ejection apparatus according to claim 1, wherein an insulating layer that partially covers the first conductive portion is formed in a region on the end surface side of the arrangement surface of the connection end portion . A pressure chamber forming member in which a plurality of pressure chambers are formed;
A plurality of piezoelectric elements provided corresponding to the plurality of pressure chambers in the pressure chamber forming member;
A cover member provided on the pressure chamber forming member so as to cover the plurality of piezoelectric elements;
A plurality of first contacts provided on an exposed portion of the pressure chamber forming member that is not covered by the cover member, each connected to the plurality of piezoelectric elements;
An anisotropic conductive material provided on an insulating substrate, a plurality of second contacts disposed at a connection end of the substrate, and a plurality of second contacts disposed at the connection end of the substrate A wiring member that is joined to the exposed portion of the pressure chamber forming member by the joining layer in a state in which the first contact and the second contact are conducted,
With
The bonding layer is provided so as to cover the end surface of the connection end portion from the connection surface of the second contact point to the surface opposite to the arrangement surface of the connection end portion of the substrate , and
The bonding layer has conductivity in a portion between the first contact and the second contact, and has insulation in a portion other than between the first contact and the second contact,
A liquid ejection device , wherein a gap is formed between the bonding layer and the cover member . A pressure chamber forming member in which a plurality of pressure chambers are formed;
A plurality of piezoelectric elements provided corresponding to the plurality of pressure chambers in the pressure chamber forming member;
A cover member provided on the pressure chamber forming member so as to cover the plurality of piezoelectric elements;
A plurality of first contacts provided on an exposed portion of the pressure chamber forming member that is not covered by the cover member, each connected to the plurality of piezoelectric elements;
Non-conductive adhesive provided on an insulating substrate, a plurality of second contacts disposed at the connection end of the substrate, and a plurality of second contacts disposed at the connection end of the substrate A wiring member that is joined to the exposed portion of the pressure chamber forming member by the joining layer in a state in which the first contact and the second contact are conducted,
With
The bonding layer is provided so as to cover the end surface of the connection end portion from the arrangement surface of the second contact point to the surface opposite to the arrangement surface of the connection end portion of the substrate .
The liquid ejection device according to claim 1, wherein an adhesion area of the bonding layer on a surface opposite to the arrangement surface of the connection end is smaller than an adhesion area on the arrangement surface . A pressure chamber forming member in which a plurality of pressure chambers are formed;
A plurality of piezoelectric elements provided corresponding to the plurality of pressure chambers in the pressure chamber forming member;
A cover member provided on the pressure chamber forming member so as to cover the plurality of piezoelectric elements;
A plurality of first contacts provided on an exposed portion of the pressure chamber forming member that is not covered by the cover member, each connected to the plurality of piezoelectric elements;
Non-conductive adhesive provided on an insulating substrate, a plurality of second contacts disposed at the connection end of the substrate, and a plurality of second contacts disposed at the connection end of the substrate A wiring member that is joined to the exposed portion of the pressure chamber forming member by the joining layer in a state in which the first contact and the second contact are conducted,
With
The bonding layer is provided so as to cover the end surface of the connection end portion from the arrangement surface of the second contact point to the surface opposite to the arrangement surface of the connection end portion of the substrate .
A first conductive portion including the second contact is formed on the arrangement surface of the connection end;
The liquid ejection apparatus according to claim 1, wherein an insulating layer that partially covers the first conductive portion is formed in a region on the end surface side of the arrangement surface of the connection end portion . A second conductive part including a third contact connected to a common electrode of the plurality of piezoelectric elements is disposed together with the first conductive part on the arrangement surface of the wiring member;
The insulating layer is not formed in the region on the end face side in the vicinity of the second conductive portion, and the second conductive portion is exposed from the insulating layer in the region on the end face side. The liquid ejection device according to claim 2 or 5 . In the arrangement surface of the connection end, wherein the first conductive portion including the second contact, any one of the preceding claims, characterized in that it extends to the end face of the connection end portion of the substrate Liquid discharge device. A pressure chamber forming member in which a plurality of pressure chambers are formed; a plurality of piezoelectric elements provided on the pressure chamber forming member corresponding to the plurality of pressure chambers; and the plurality of piezoelectric elements on the pressure chamber forming member. A cover member provided to cover, a plurality of first contacts provided on an exposed portion of the pressure chamber forming member not covered by the cover member, each connected to the plurality of piezoelectric elements, and insulating A wiring member having a substrate and a plurality of second contacts formed at a connection end of the substrate, and a method of manufacturing a liquid ejection apparatus comprising:
A layer forming step of providing a bonding layer formed of an anisotropic conductive material so as to cover an arrangement surface of the second contact and an end surface of the connection end at the connection end of the substrate;
In the state where the connection end portion of the wiring member is pressed against the exposed portion of the pressure chamber forming member and the first contact and the second contact are made conductive, the wiring member is formed by the bonding layer. A joining step for joining the member;
Have a,
In the layer forming step,
The method of manufacturing a liquid ejection device , wherein an adhesion area of the bonding layer on a surface opposite to the arrangement surface of the connection end is smaller than an adhesion area on the arrangement surface . A pressure chamber forming member in which a plurality of pressure chambers are formed; a plurality of piezoelectric elements provided on the pressure chamber forming member corresponding to the plurality of pressure chambers; and the plurality of piezoelectric elements on the pressure chamber forming member. A cover member provided to cover, a plurality of first contacts provided on an exposed portion of the pressure chamber forming member not covered by the cover member, each connected to the plurality of piezoelectric elements, and insulating A wiring member having a substrate and a plurality of second contacts formed at a connection end of the substrate, and a first conductive material including the second contact on a surface where the second contact is disposed at the connection end. A method of manufacturing a liquid ejection device in which a portion is formed ,
In the connection end portion of the substrate, so as to cover the end face of the placement surface of the second contact and the connection end, a layer forming step of forming a bonding layer formed of an anisotropic conductive material,
Forming an insulating layer partially covering the first conductive portion in a region on the end surface side of the arrangement surface of the connection end portion;
In the state where the connection end portion of the wiring member is pressed against the exposed portion of the pressure chamber forming member and the first contact and the second contact are made conductive, the wiring member is formed by the bonding layer. A joining step for joining the member;
A method for manufacturing a liquid ejection apparatus, comprising: A pressure chamber forming member in which a plurality of pressure chambers are formed; a plurality of piezoelectric elements provided on the pressure chamber forming member corresponding to the plurality of pressure chambers; and the plurality of piezoelectric elements on the pressure chamber forming member. A cover member provided to cover, a plurality of first contacts provided on an exposed portion of the pressure chamber forming member not covered by the cover member, each connected to the plurality of piezoelectric elements, and insulating A wiring member having a substrate and a plurality of second contacts formed at a connection end of the substrate, and a method of manufacturing a liquid ejection apparatus comprising:
A layer forming step of providing a bonding layer formed of a non-conductive adhesive so as to cover an arrangement surface of the second contact and an end surface of the connection end at the connection end of the substrate ;
In the state where the connection end portion of the wiring member is pressed against the exposed portion of the pressure chamber forming member and the first contact and the second contact are made conductive, the wiring member is formed by the bonding layer. A joining step for joining the member;
Have a,
In the layer forming step,
The method of manufacturing a liquid ejection device , wherein an adhesion area of the bonding layer on a surface opposite to the arrangement surface of the connection end is smaller than an adhesion area on the arrangement surface . A pressure chamber forming member in which a plurality of pressure chambers are formed; a plurality of piezoelectric elements provided on the pressure chamber forming member corresponding to the plurality of pressure chambers; and the plurality of piezoelectric elements on the pressure chamber forming member. A cover member provided to cover, a plurality of first contacts provided on an exposed portion of the pressure chamber forming member not covered by the cover member, each connected to the plurality of piezoelectric elements, and insulating A wiring member having a substrate and a plurality of second contacts formed at a connection end portion of the substrate, and a first conductive member including the second contact on the arrangement surface of the second contact at the connection end portion. A method of manufacturing a liquid ejection device in which a portion is formed ,
In the connection end portion of the substrate, so as to cover the end face of the placement surface of the second contact and the connection end, a layer forming step of forming a bonding layer formed of a non-conductive adhesive,
Forming an insulating layer partially covering the first conductive portion in a region on the end surface side of the arrangement surface of the connection end portion;
In the state where the connection end portion of the wiring member is pressed against the exposed portion of the pressure chamber forming member and the first contact and the second contact are conducted, the wiring member is formed by the bonding layer. A joining step for joining the member;
A method for manufacturing a liquid ejection apparatus, comprising:

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