JP4765511B2 - Device mounting structure, device mounting method, electronic apparatus, droplet discharge head, and droplet discharge apparatus - Google Patents

Description

  The present invention relates to a device mounting structure, a device mounting method, an electronic apparatus, a droplet discharge head, and a droplet discharge apparatus.

Conventionally, a wire bonding method is known as a method of arranging and electrically connecting a driving device such as an IC chip on a circuit board. For example, even in a droplet discharge head (inkjet recording head) used when applying a droplet discharge method (inkjet method) in forming an image or manufacturing a microdevice, a piezoelectric element for performing an ink discharge operation; A wire bonding method is used for connection to a drive circuit unit (IC chip or the like) that supplies an electric signal to a piezoelectric element (see, for example, Patent Document 1 and Patent Document 2).
JP 2003-159800 A JP 2004-284176 A

  In recent years, along with the high integration of IC chips and the like, external connection terminals such as IC chips tend to be narrowed and narrowed. Accordingly, the wiring pattern formed on the base substrate tends to be narrowed. Therefore, it is becoming difficult to apply the connection method using the wire bonding.

  In addition, in the method of forming an image and manufacturing a micro device based on the droplet discharge method, a nozzle opening provided in the droplet discharge head is used in order to realize high definition of the image and miniaturization of the micro device. It is preferable to make the distance (nozzle pitch) between the portions as small as possible (narrow). Since a plurality of the piezoelectric elements are formed corresponding to the nozzle openings, when the nozzle pitch is reduced, it is necessary to reduce the distance between the piezoelectric elements in accordance with the nozzle pitch. When the distance between the piezoelectric elements becomes small in this way, it becomes difficult to connect each of the plurality of piezoelectric elements and the driver IC by a wire bonding technique.

  Further, with the downsizing of electronic devices, there is an increasing need to electrically connect the device and the wiring of the base substrate through steps due to devices such as IC chips and steps due to the shape of the base substrate. .

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a device mounting structure and the like that can be preferably applied to a wiring pitch reduction or wiring connection through a step.

The present invention employs the following means in order to solve the above problems.
A device mounting structure according to the present invention is a device mounting structure in which a device is mounted on a base formed by joining a plurality of members, and the base and the device are electrically connected via a flexible substrate. The connecting portion between the flexible substrate and the base is formed integrally with the joint portion between the members, and the connecting portion between the flexible substrate and the base and / or the flexible substrate and the device. The connecting portion is characterized in that a bonding resin having substantially the same curing conditions as the resin for bonding the members to each other and kneaded with conductive particles is disposed.
According to the present invention, it is possible to electrically connect the flexible substrate and the base and / or the flexible substrate and the device simultaneously with solidifying the plurality of members with the adhesive, thereby improving the manufacturing efficiency. In addition, the flexible substrate and the base can be electrically connected simultaneously with the joining of the members. In addition, the device mounting structure can be made compact.

In addition, one of the members constituting the joining portion includes a digging portion that has substantially the same depth as the flexible substrate and accommodates the flexible substrate. It becomes possible to satisfactorily integrate the joint portion between the members.
Further, at least one of the members is made of a material different from that of the other members. Even if an adhesive resin that is solidified at a low temperature so as not to cause thermal deformation is used, the bonding has substantially the same curing conditions. Since the resin is used, electrical connection between the flexible substrate and the base can be reliably performed.

A device mounting method according to the present invention is a device mounting method in which a device is mounted on a base formed by joining a plurality of members, and the base and the device are electrically connected via a flexible substrate. In addition , the connection portion between the flexible substrate and the base is formed integrally with the joint portion between the members, and the members are joined together, and at the same time, the electrical connection between the flexible substrate and the base and / or the device. And electrical connection.
According to the present invention, it is possible to electrically connect the flexible substrate and the base and / or the flexible substrate and the device simultaneously with solidifying the plurality of members with the adhesive, thereby improving the manufacturing efficiency. In addition, the flexible substrate and the base can be electrically connected simultaneously with the joining of the members. In addition, the device mounting structure can be made compact.

In addition, in the case where the flexible substrate is bonded to the member prior to bonding the members, the flexible substrate and the base are electrically connected at the same time by bonding the members thereafter. Become.
In addition, at least one of the members is made of a material different from that of the other members, and in the step of joining the members, heat treatment is performed, and the adhesive resin is solidified at a low temperature so that thermal deformation does not occur. Even if it makes it, since the joining resin which has substantially the same hardening conditions is used, electrical connection with a flexible substrate, a base | substrate, etc. can be performed reliably.

In the electronic apparatus according to the present invention, an electronic device includes an electronic device mounted on a base using the above-described device mounting structure. In addition, the electronic apparatus includes an electronic device mounted on the base using the above-described device mounting method.
According to the present invention, an electronic device can be efficiently manufactured, and the cost of the electronic device can be reduced.

In the liquid droplet ejection head according to the present invention, the liquid droplet ejection head has the above-described device mounting structure. In addition, the droplet discharge head is manufactured using the above-described device mounting method.
According to the present invention, the droplet discharge head can be efficiently manufactured, and the cost of the droplet discharge head can be reduced.

In the liquid droplet ejection apparatus according to the present invention, the liquid droplet ejection apparatus includes the above-described liquid droplet ejection head.
According to the present invention, the cost of the droplet discharge device can be reduced.

[First Embodiment]
Hereinafter, a device mounting structure, a device mounting method, an electronic apparatus, and a droplet discharge head according to a first embodiment of the present invention will be described with reference to the drawings.
In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do.

[Droplet ejection head]
1 is an external perspective view showing an embodiment of a droplet discharge head, FIG. 2 is a partially cutaway perspective view of the droplet discharge head viewed from the nozzle opening side, and FIG. 3 is a line AA in FIG. It is a cross-sectional arrow view.

As shown in FIG. 1, the droplet discharge head 1 discharges a droplet of a functional liquid, and includes a nozzle substrate 16 having a nozzle opening 15 (see FIG. 2) from which the droplet is discharged; A flow path forming substrate 10 that is connected to the nozzle substrate 16 to form a flow path through which droplets flow, a vibration plate 400 that is connected to the flow path forming substrate 10 and is displaced by driving the piezoelectric element 300, and the vibration plate 400 A substrate 5 is provided that includes a reservoir forming substrate 20 connected to the reservoir 100 to form the reservoir 100.
Furthermore, the flexible board 500 (501-504) which has a wiring pattern (not shown) which has flexibility and electrically connects the drive circuit unit 200 and the piezoelectric element 300, and is mounted on each flexible board 500 and is piezoelectric. And a driving circuit unit (IC driver) 200 for driving the element 300.

The operation of the droplet discharge head 1 is controlled by an external controller CT. The pressure generating chamber 12 in which the functional liquid before being discharged from the nozzle opening 15 is disposed by the space surrounded by the flow path forming substrate 10, the nozzle substrate 16, and the vibration plate 400 (see FIG. 3). Is formed.
A reservoir 100 (see FIG. 3) that preliminarily holds the functional liquid before being supplied to the pressure generating chamber 12 is formed by the space surrounded by the reservoir forming substrate 20 and the flow path forming substrate 10.

As shown in FIG. 2, the nozzle substrate 16 is made of stainless steel, and is disposed so as to cover an opening provided on one surface of the flow path forming substrate 10.
The flow path forming substrate 10 and the nozzle substrate 16 are fixed via a resin 520 such as a thermosetting adhesive.
The nozzle substrate 16 is provided with a nozzle opening 15 for discharging droplets. A plurality of nozzle openings 15 are provided in the nozzle substrate 16. Specifically, the nozzle substrate 16 includes a first nozzle opening group 15A, a second nozzle opening group 15B, and a third nozzle opening group 15C that are configured by a plurality of nozzle openings 15 provided side by side in the Y-axis direction. , And the fourth nozzle opening group 15D.
The first nozzle opening group 15A and the second nozzle opening group 15B are disposed so as to face each other in the X-axis direction. The third nozzle opening group 15C is provided on the + Y side of the first nozzle opening group 15A, and the fourth nozzle opening group 15D is provided on the + Y side of the second nozzle opening group 15B. The third nozzle opening group 15C and the fourth nozzle opening group 15D are arranged so as to face each other in the X-axis direction.
In FIG. 2, each of the nozzle opening groups 15 </ b> A to 15 </ b> D is configured by six nozzle openings 15, but actually, for example, it is configured by about 720 nozzle openings 15. Yes.

A plurality of partition walls 11 are formed inside the flow path forming substrate 10. The flow path forming substrate 10 is formed of silicon, and the plurality of partition walls 11 are formed by anisotropically etching a silicon single crystal substrate that is a base material of the flow path forming substrate 10.
A plurality of pressure generating chambers 12 are formed as a space surrounded by the flow path forming substrate 10 having the plurality of partition walls 11, the nozzle substrate 16, and the diaphragm 400. A plurality of pressure generating chambers 12 are formed so as to correspond to the plurality of nozzle openings 15. That is, a plurality of pressure generation chambers 12 are provided side by side in the Y-axis direction so as to correspond to the plurality of nozzle openings 15 constituting each of the first to fourth nozzle opening groups 15A to 15D.
The first pressure generation chamber group 12A is configured by a plurality of pressure generation chambers 12 formed corresponding to the first nozzle opening group 15A. A second pressure generation chamber group 12B is constituted by a plurality of pressure generation chambers 12 formed corresponding to the second nozzle opening group 15B. A third pressure generation chamber group 12C is constituted by a plurality of pressure generation chambers 12 formed corresponding to the third nozzle opening group 15C. A fourth pressure generation chamber group 12D is configured by a plurality of pressure generation chambers 12 formed corresponding to the fourth nozzle opening group 15D.
The first pressure generation chamber group 12A and the second pressure generation chamber group 12B are arranged to face each other in the X-axis direction, and a partition wall 10K is formed between them. Similarly, the third pressure generation chamber group 12C and the fourth pressure generation chamber group 12D are arranged to face each other in the X-axis direction, and a partition wall 10K is formed between them.

  Further, as shown in FIG. 2, among the plurality of pressure generating chambers 12 forming the first pressure generating chamber group 12A, the −X side ends are closed by the partition wall 10K described above, and the + X side ends are mutually connected. Connected to the reservoir 100 (see FIG. 3).

As shown in FIG. 3, the reservoir 100 temporarily holds the functional liquid introduced from the functional liquid introduction port 25 and supplied to the pressure generation chamber 12. The reservoir 100 is formed on the reservoir forming substrate 20 so as to extend in the Y-axis direction, and is formed on the flow path forming substrate 10 so as to extend in the Y-axis direction. The communication part 13 which connects each is provided. That is, the reservoir 100 is a functional liquid holding chamber (ink chamber) common to the plurality of pressure generating chambers 12 constituting the first pressure generating chamber group 12A.
As a result, the functional liquid introduced from the functional liquid introduction port 25 flows into the reservoir 100 through the introduction path 26, and then passes through the supply path 14 to form a plurality of pressure generation chambers 12 constituting the first pressure generation chamber group 12 </ b> A. To be supplied to each of them.
A reservoir 100 similar to that described above is also connected to each of the pressure generation chambers 12 constituting each of the second, third, and fourth pressure generation chamber groups 12B, 12C, and 12D.

The vibration plate 400 disposed between the flow path forming substrate 10 and the reservoir forming substrate 20 includes an elastic film 50 covering one surface of the flow path forming substrate 10 and a lower electrode film 60 provided on the elastic film 50. I have.
The elastic film 50 is made of, for example, silicon dioxide having a thickness of about 1 to 2 μm. The lower electrode film 60 is made of, for example, a metal having a thickness of about 0.2 μm. In the present embodiment, the lower electrode film 60 is a common electrode for the plurality of piezoelectric elements 300.
The flow path forming substrate 10 and the reservoir forming substrate 20 are fixed through a resin 520 such as a thermosetting adhesive, for example.

The piezoelectric element 300 for displacing the diaphragm 400 includes a piezoelectric film 70 provided on the lower electrode film 60 and an upper electrode film 80 provided on the piezoelectric film 70.
The piezoelectric film 70 has a thickness of about 1 μm, for example, and the upper electrode film 80 has a thickness of about 0.1 μm, for example. The concept of the piezoelectric element 300 may include the lower electrode film 60 in addition to the piezoelectric film 70 and the upper electrode film 80. That is, the lower electrode film 60 in the present embodiment has both the function as the piezoelectric element 300 and the function as the diaphragm 400.
In this embodiment, the elastic film 50 and the lower electrode film 60 function as the diaphragm 400. However, the elastic film 50 may be omitted, and the lower electrode film 60 may also serve as the elastic film (50). .

  A plurality of the piezoelectric films 70 and the upper electrode films 80 (that is, the piezoelectric elements 300) are provided so as to correspond to the plurality of nozzle openings 15 and the pressure generating chambers 12, respectively. That is, the piezoelectric element 300 is provided for each nozzle opening 15 (for each pressure generation chamber 12). As described above, the lower electrode film 60 functions as a common electrode for the plurality of piezoelectric elements 300, and the upper electrode film 80 functions as an individual electrode for the plurality of piezoelectric elements 300.

  The first piezoelectric element group 300A is configured by a plurality of piezoelectric elements 300 arranged in the Y-axis direction corresponding to the respective nozzle openings 15 of the first nozzle opening group 15A. The plurality of piezoelectric elements 300 arranged in the Y-axis direction corresponding to each nozzle opening 15 of the second nozzle opening group 15B constitutes the second piezoelectric element group 300B. The first piezoelectric element group 300A and the second piezoelectric element group 300B are arranged to face each other in the X-axis direction. Similarly, the third piezoelectric element group 300C is configured by a plurality of piezoelectric elements 300 arranged in the Y-axis direction corresponding to the respective nozzle openings 15 of the third nozzle opening group 15C. A fourth piezoelectric element group 300D is configured by a plurality of piezoelectric elements 300 arranged in the Y-axis direction corresponding to the respective nozzle openings 15 of the fourth nozzle opening group 15D. The third piezoelectric element group 300C and the fourth piezoelectric element group 300D are disposed so as to face each other in the X-axis direction (note that the third and fourth piezoelectric element groups 300C and 300D are located on the back side of the drawing in FIG. 3). Formed, not shown).

On the reservoir forming substrate 20, a compliance substrate 30 having a sealing film 31 and a fixing plate 32 is bonded via a resin 520 such as a thermosetting adhesive.
The sealing film 31 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide film having a thickness of about 6 μm). The reservoir portion 21 is sealed by the sealing film 31. The fixing plate 32 is made of a hard material such as metal (for example, stainless steel having a thickness of about 30 μm).
A region of the fixed plate 32 corresponding to the reservoir 100 is an opening 33 that is completely removed in the thickness direction. Therefore, the upper part of the reservoir 100 is sealed only with a flexible sealing film 31 and is a flexible portion 22 that can be deformed by a change in internal pressure.

  When the functional liquid is supplied from the functional liquid introduction port 25 to the reservoir 100, for example, a pressure change occurs in the reservoir 100 due to the flow of the functional liquid when the piezoelectric element 300 is driven or the ambient heat. As described above, since the upper portion of the reservoir 100 is sealed with the flexible sealing film 31 (flexible portion 22), the flexible portion 22 is bent and deformed to absorb the pressure change. Therefore, the inside of the reservoir 100 is always maintained at a constant pressure. Other portions are held with sufficient strength by the fixing plate 32.

  A functional liquid introduction port 25 for supplying a functional liquid to the reservoir 100 is formed on the compliance substrate 30 outside the reservoir 100, and the functional liquid introduction port 25 and the reservoir are formed in the reservoir forming substrate 20. An introduction path 26 communicating with the 100 side walls is provided.

An opening 700 extending in the Y-axis direction is formed at the center of the reservoir forming substrate 20 in the X-axis direction. By the opening 700, the reservoir forming substrate 20 is divided into a first sealing portion 20A for sealing the first piezoelectric element group 300A and a second sealing portion 20B for sealing the second piezoelectric element group 300B ( (See FIG. 3).
Similarly, the opening 700 is divided into a third sealing portion 20C that seals the third piezoelectric element group 300C and a fourth sealing portion 20D that seals the fourth piezoelectric element group 300D (note that the first 3, the fourth sealing portions 20C and 20D are not shown).

  The first sealing portion 20 </ b> A has a groove portion 24 provided in a region facing the piezoelectric element 300. The groove portion 24 ensures a space that does not hinder the movement of the piezoelectric element 300 and seals the space. The groove portion 24 is formed in each of the first to fourth sealing portions 20A to 20D so as to cover the first to fourth piezoelectric element groups 300A to 300D. Of the piezoelectric element 300, at least the piezoelectric film 70 is sealed in the groove 24.

Thus, the reservoir forming substrate 20 has a function of sealing the piezoelectric element 300 by blocking the piezoelectric element 300 from the external environment. By sealing the piezoelectric element 300 with the reservoir forming substrate 20, deterioration of the piezoelectric element 300 due to an external environment such as moisture is prevented.
Further, in the present embodiment, the inside of the groove 24 is only sealed, but the inside of the groove 24 is reduced in humidity by, for example, evacuating the space in the groove 24 or using a nitrogen or argon atmosphere. The deterioration of the piezoelectric element 300 can be further reliably prevented.
A lead wire 90 (see FIG. 4) is connected from the upper electrode film 80 of the piezoelectric element 300 onto the flow path forming substrate 10, and the lead wire 90 extends to the opening 700 of the reservoir forming substrate 20. Has been. Then, by electrically connecting the lead-out wiring 90 and the flexible substrate 501, the piezoelectric element 300 can be driven.

  The reservoir forming substrate 20 is a rigid body. As a forming material of the reservoir forming substrate 20, it is preferable to use a material substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10 such as glass or ceramic material. In this embodiment, the same material as the flow path forming substrate 10 is used. A silicon single crystal substrate of material is used.

Returning to FIG. 1, the drive circuit unit 200 (200 </ b> A to 200 </ b> D) for driving the piezoelectric element 300 includes, for example, a circuit board or a semiconductor integrated circuit (IC) including a drive circuit, and each flexible board 501. It is mounted on one side of ~ 504.
Each of the flexible substrates 501 to 504 has flexibility, and is formed of an insulating film such as polyimide. As described above, the flexible substrates 501 to 504 are formed with a wiring pattern made of a conductive material such as copper.

FIG. 4 is a partially enlarged view showing an arrangement state of the flexible substrate 501.
The drive circuit unit 200A is electrically connected to the reservoir forming substrate 20 via an adhesive resin 515 such as a thermosetting adhesive. Note that a wiring pattern is formed on the reservoir forming substrate 20 as necessary, and this wiring pattern is electrically connected to a terminal of the drive circuit unit 200A. The drive circuit unit 200A is electrically connected to an external controller CT (see FIG. 1) via an external signal input unit 580 (see FIG. 1).
Further, terminal portions (not shown) formed at both ends of the flexible substrate 501 are connected to lead-out wirings 90 (piezoelectric elements) formed on the flow path forming substrate 10 via an adhesive resin 515 such as a thermosetting adhesive. 300 is electrically connected to the upper electrode film 80).

The adhesive resin 515 is kneaded with conductive metal particles 516. For example, when the drive circuit unit 200A is pressed against the reservoir forming substrate 20, the reservoir resin 515 is passed through the metal particles 516 included in the adhesive resin 515. The wiring pattern on the formation substrate 20 and the drive circuit unit 200A are electrically connected.
Similarly, when the flexible substrate 501 is pressed against the lead wire 90 on the flow path forming substrate 10, the lead wire 90 and the flexible substrate 501 are electrically connected via the metal particles 516 included in the adhesive resin 515. The
The adhesive resin 515 in which the metal particles 516 are kneaded is a resin that fixes the flow path forming substrate 10 and the nozzle substrate 16, a resin that fixes the flow path forming substrate 10 and the reservoir forming substrate 20, and a compliance with the reservoir forming substrate 20. It is the same resin as the resin that fixes the substrate 30 or a resin having substantially the same curing conditions.
Thus, by using a resin having the same curing conditions as those for fixing the flow path forming substrate 10, the nozzle substrate 16, the reservoir forming substrate 20, etc., the flow path forming substrate 10, the nozzle substrate 16, the reservoir forming substrate 20, etc. In the same process as the bonding process, it is possible to perform electrical connection between the reservoir forming substrate 20 and the drive circuit unit 200A and electrical connection between the lead-out wiring 90 on the flow path forming substrate 10 and the flexible substrate 501.

  An electrical connection portion between the flexible substrate 501 and the lead wiring 90 on the flow path forming substrate 10 may be fixed by the resin material 202. Since the electrical connection portion is a bottom portion in the opening 700 formed in the reservoir forming substrate 20, the resin material 202 may be filled in the opening 700. The resin material 202 prevents the connection portion between the flexible substrate 501 and the lead-out wiring 90 on the flow path forming substrate 10 from being peeled off.

Next, the operation of the droplet discharge head 1 having the above-described configuration will be described.
In order to eject the functional liquid droplets from the liquid droplet ejection head 1, the external controller CT drives an external functional liquid supply device (not shown) connected to the functional liquid inlet 25. The functional liquid sent out from the external functional liquid supply device fills the internal flow path of the droplet discharge head 1 from the functional liquid introduction port 25 to the reservoir 100 until reaching the nozzle opening 15.
Further, the external controller CT sends drive power and a command signal to the drive circuit unit 200 and the like via the external signal input unit 580 provided on the flexible boards 501 to 504. The drive circuit unit 200 applies a voltage between the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generation chamber 12 via the flexible substrates 501 to 504 based on a command from the external controller CT. Then, the elastic film 50, the lower electrode film 60, and the piezoelectric film 70 are displaced.
In this way, the pressure in each pressure generating chamber 12 is increased, and droplets are ejected from the nozzle openings 15.

Next, an example of a method for manufacturing the droplet discharge head 1 will be described with reference to FIG.
Note that the process of individually forming the flow path forming substrate 10, the reservoir forming substrate 20 and the like through a film forming process and an etching process is not different from the conventional process, and the description thereof is omitted.

First, as shown in FIG. 5A, the reservoir forming substrate 20 and the flow path forming substrate 10 are temporarily joined via a resin 520.
Similarly, as illustrated in FIG. 5B, the nozzle substrate 16 is temporarily bonded to the surface of the flow path forming substrate 10 opposite to the reservoir forming substrate 20 via a resin 520. Further, the compliance substrate 30 is temporarily bonded onto the reservoir forming substrate 20 via the resin 520.

  Further, as shown in FIG. 5C, the drive circuit units 200 for driving the piezoelectric elements 300 are temporarily mounted on the reservoir forming substrates 20 on both sides of the opening 700 via the resin 515 (electrically and temporarily connected). ) Further, the flexible substrate 501 and the lead wiring 90 on the flow path forming substrate 10 are electrically temporarily connected via the adhesive resin 515.

  Thereafter, in order to solidify the resin 520 and the resin 515, the nozzle substrate 16, the flow path forming substrate 10, the reservoir forming substrate 20, and the compliance substrate 30 are obtained after 5 to 30 hours have passed in a heating state at room temperature or about 60 ° C. Is fixed. At the same time, the reservoir forming substrate 20 and the drive circuit unit 200 are fixed and electrically connected. Further, the flexible substrate 501 and the lead wiring 90 on the flow path forming substrate 10 are also fixed and electrically connected.

  In this way, the resin 520 that fixes the member such as the nozzle substrate 16 and the resin 515 that electrically connects the flexible substrate 501 and the like are made into resins having substantially the same curing conditions, so that the solidification process is made the same. can do. Since the solidification process requiring a long time can be integrated, the manufacturing process of the droplet discharge head 1 can be made more efficient.

[Second Embodiment]
Hereinafter, a device mounting structure, a device mounting method, an electronic apparatus, and a droplet discharge head according to a second embodiment of the present invention will be described with reference to the drawings.
In the following description, the same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

FIG. 6 is a partially enlarged view showing an arrangement state of the flexible substrate 501.
The flexible substrate 501 is fixed to the upper surface and the lower surface of the reservoir forming substrate 20.
On the flexible substrate 501 fixed to the upper surface of the reservoir forming substrate 20, the drive circuit unit 200A is further fixed.
The flexible substrate 501 fixed to the lower surface of the reservoir forming substrate 20 is fixed in a state where it is accommodated in the digging portion 28 formed on the lower surface of the reservoir forming substrate 20. The depth of the digging portion 28 is substantially the same as the thickness of the flexible substrate 501. For this reason, the lower surface of the reservoir forming substrate 20 and the surface of the flexible substrate 501 accommodated in the digging portion 28 form the same surface.
Therefore, the reservoir forming substrate 20 and the flexible substrate 501 are integrated so that the piezoelectric element 300 can be sealed. At the same time, the flexible substrate 501 is also electrically connected to the lead-out wiring 90 (wiring connected to the upper electrode film 80 of the piezoelectric element 300) formed on the flow path forming substrate 10.

As described above, since the flexible substrate 501 is fixed to the upper surface and the lower surface of the reservoir forming substrate 20, the opening 700 can be formed to the minimum necessary. That is, the opening 700 formed in the reservoir forming substrate 20 is connected to the flexible substrate 501 and the lead-out wiring 90 on the flow-path forming substrate 10 in an electrical connection. It is a space for exposing. However, since the flexible substrate 501 can be electrically connected to the lead-out wiring 90 on the flow path forming substrate 10 while the flexible substrate 501 is fixed to the lower surface of the reservoir forming substrate 20, the size of the opening 700 is set. May be any size as long as the flexible substrate 501 can communicate.
For this reason, the groove part 24 and the piezoelectric element 300 formed in the reservoir forming substrate 20 can be arranged closer to each other. Furthermore, the pressure generation chamber 12 and the nozzle opening 15 of the flow path forming substrate 10 can be arranged closer to each other. Therefore, it is possible to form the droplet discharge head 2 having a high nozzle arrangement density.

Next, an example of a method for manufacturing the droplet discharge head 2 will be described with reference to FIG.
First, as shown in FIG. 7A, the flexible substrate 501 is fixed to the reservoir forming substrate 20 via the resin 520 or the resin 515.
Next, as shown in FIG. 7B, the reservoir forming substrate 20 and the flow path forming substrate 10 are temporarily joined via a resin 520. A resin 515 is used for a portion where the flexible substrate 501 fixed to the reservoir forming substrate 20 is bonded to the flow path forming substrate 10. As a result, the flexible substrate 501 and the lead wiring 90 on the flow path forming substrate 10 are electrically connected.

Next, as illustrated in FIG. 7C, the flow path forming substrate 10 and the nozzle substrate 16, and the reservoir forming substrate 20 and the compliance substrate 30 are temporarily bonded via a resin 520.
Further, as shown in FIG. 7D, the drive circuit unit 200 for driving the piezoelectric element 300 is temporarily mounted (electrically, electrically) on the flexible substrate 501 on the upper surface side of the reservoir forming substrate 20 via a resin 515. Temporary connection).

  Thereafter, in order to solidify the resin 520 and the resin 515, the nozzle substrate 16, the flow path forming substrate 10, the reservoir forming substrate 20, and the compliance substrate 30 are obtained after 5 to 30 hours have passed in a heating state at room temperature or about 60 ° C. Is fixed. At the same time, the flexible substrate 501 and the lead-out wiring 90 on the flow path forming substrate 10, and the flexible substrate 501 and the drive circuit unit 200 are fixed and electrically connected.

[Droplet discharge device]
Next, an example of a droplet discharge device IJ including the droplet discharge heads 1 and 2 described above will be described with reference to FIG.
FIG. 8 is a perspective view showing a schematic configuration of the droplet discharge device IJ.
The droplet discharge head constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on an ink jet recording apparatus.
As shown in FIG. 8, recording head units 801A and 801B having a droplet discharge head are detachably provided with cartridges 802A and 802B constituting ink supply means. A carriage 803 on which the recording head units 801A and 801B are mounted is attached to a carriage shaft 805 attached to the apparatus main body 804 so as to be movable in the axial direction.

The recording head units 801A and 801B, for example, discharge a black ink composition and a color ink composition, respectively. The driving force of the drive motor 806 is transmitted to the carriage 803 via a plurality of gears and a timing belt 807 (not shown). By this transmission, the carriage 803 on which the recording head units 801A and 801B are mounted moves along the carriage shaft 805. On the other hand, the apparatus main body 804 is provided with a platen 808 along the carriage shaft 805.
A recording sheet S, which is a recording medium such as paper fed by a paper feeding roller (not shown), is conveyed onto the platen 808.
Since the ink jet recording apparatus having the above configuration includes the droplet discharge heads 1 and 2 described above, the ink jet recording apparatus is small, highly reliable, and low in cost.

  In FIG. 8, an ink jet recording apparatus as a single printer is shown as an example of the liquid droplet ejection apparatus of the present invention. However, the present invention is not limited to this, and a printer realized by incorporating such a liquid droplet ejection head. It can also be applied to units. Such a printer unit is attached to a display device such as a television or an input device such as a whiteboard, and is used to print an image displayed or input by the display device or the input device.

  The droplet discharge head can also be applied to a droplet discharge apparatus for forming various devices by a liquid phase method. In this embodiment, as the functional liquid discharged from the droplet discharge head, a liquid crystal display device forming material for forming a liquid crystal display device, an organic EL forming material for forming an organic EL display device, an electronic circuit A material including a wiring pattern forming material for forming a wiring pattern is used. According to the manufacturing process in which these functional liquids are selectively arranged on a substrate by a droplet discharge device, the pattern arrangement of the functional material is possible without going through a photolithography process, so a liquid crystal display device, an organic EL device, a circuit board Etc. can be manufactured at low cost.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to these embodiments. Additions, omissions, substitutions, and other modifications can be made without departing from the spirit of the present invention. The present invention is not limited by the above description, but only by the scope of the appended claims.

1 is an external perspective view showing an embodiment of a droplet discharge head according to a first embodiment. It is a partially broken view of a perspective view of a droplet discharge head as seen from the nozzle opening side. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. It is the elements on larger scale which show the arrangement | positioning state of a flexible substrate. It is a figure which shows an example of the manufacturing method of a droplet discharge head in order of a process. It is the elements on larger scale which show the arrangement | positioning state of the flexible substrate which concerns on 2nd Embodiment. It is a figure which shows an example of the manufacturing method of a droplet discharge head in order of a process. It is a perspective view which shows schematic structure of a droplet discharge apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 2 ... Droplet discharge head, 5 ... Base | substrate, 10 ... Flow path formation board | substrate, 16 ... Nozzle board | substrate, 20 ... Reservoir formation board | substrate, 28 ... Engraving part, 30 ... Compliance board | substrate, 200 ... Drive circuit part, 300 ... Piezoelectric Element, 501 to 504 ... flexible substrate, 515 ... adhesive resin, 516 ... metal particle, 520 ... resin, 801A ... recording head unit, IJ ... droplet discharge device

Claims (11)

A device mounting structure in which a device is mounted on a base formed by joining a plurality of members, and the base and the device are electrically connected via a flexible substrate,
The connecting portion between the flexible substrate and the base is formed integrally with the joint between the members,
The connecting portion between the flexible substrate and the base and / or the connecting portion between the flexible substrate and the device has substantially the same curing conditions as the resin for joining the members and conductive particles are kneaded. A device mounting structure in which bonding resin is arranged.   2. The device mounting structure according to claim 1, wherein one of the members constituting the joining portion includes a digging portion that has substantially the same depth as the thickness of the flexible substrate and accommodates the flexible substrate. . At least one of the device package structure according to claim 1 or 2, characterized in that it consists of a material different from the other member of said member. A device mounting method comprising mounting a device on a base formed by joining a plurality of members, and electrically connecting the base and the device via a flexible substrate,
While forming the connection part of the flexible substrate and the base body integrally with the joint part between the members,
At the same time as joining the members, an electrical connection between the flexible substrate and the base and / or an electrical connection with the device is performed. The device mounting method according to claim 4 , wherein the flexible substrate is joined to the member prior to joining the members. At least one of the members is made of a material different from the other members,
The device mounting method according to claim 4 , wherein heat treatment is performed in the step of joining the members. Electronic device characterized by comprising an electronic device mounted on a substrate using the device package structure according to any one of claims 1 to claim 3. Electronic device characterized by comprising an electronic device mounted on a substrate using the device mounting method according to claims 4 to claim 6. Droplet discharge head is characterized by having a device mounting structure as claimed in any one of claims 3. Droplet discharge head is characterized in that claim 4 was prepared using a device packaging method according to any one of claims 6. Droplet discharge apparatus comprising: a droplet discharging head according to claim 9 or claim 10.

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