JP2006068989A - Liquid droplet ejecting head, liquid droplet ejecting apparatus, and manufacturing method for liquid droplet ejecting head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid droplet ejecting head in which a driving circuit part and a driving element can be connected with each other without the workability at the time of connection decreased even when a nozzle pitch is made small. <P>SOLUTION: The liquid droplet ejecting head 1 is equipped with the driving circuit parts 200, piezoelectric elements 300 driven by the driving circuit parts 200, a flexible substrate 500 with a flexibility, and wiring patterns 510 including terminal parts 512 set on the flexible substrate 500 and with a conductivity. The driving circuit part 200 and the piezoelectric element 300 are electrically connected with each other via the wiring pattern 510. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a droplet discharge head, a droplet discharge device, and a method for manufacturing a droplet discharge head.

A droplet discharge method (inkjet method) has been proposed as one method for manufacturing a microdevice. In this droplet discharge method, a functional liquid containing a material for forming a device is formed into droplets and discharged from a droplet discharge head. The following patent document discloses an example of a technique related to a droplet discharge head (inkjet recording head). In the droplet discharge head disclosed in this patent document, a drive circuit unit (IC driver) and a drive element (piezoelectric element) are connected by a wire bonding technique.
JP 2000-127379 A

  By the way, when manufacturing a microdevice based on the droplet discharge method, in order to meet the demand for further miniaturization of the microdevice, the distance between the nozzle openings provided in the droplet discharge head (nozzle pitch) Is preferably as small (narrow) as possible. Since a plurality of the piezoelectric elements are formed corresponding to the nozzle openings, if the nozzle pitch is reduced, the distance between the piezoelectric elements needs to be reduced according to the nozzle pitch. However, when the distance between the piezoelectric elements becomes small, it becomes difficult to connect each of the plurality of piezoelectric elements and the IC driver by a wire bonding technique.

  The present invention has been made in view of the above circumstances, and even if the nozzle pitch is reduced, the connection without reducing the workability when connecting the drive circuit unit (IC driver) and the drive element (piezoelectric element). It is an object of the present invention to provide a droplet discharge head capable of performing work, a droplet discharge apparatus including the droplet discharge head, and a method for manufacturing the droplet discharge head.

  In order to solve the above problems, a droplet discharge head according to the present invention is a droplet discharge head including a drive circuit unit and a drive element driven by the drive circuit unit. A conductive portion having conductivity provided on a flexible substrate, and the drive circuit portion and the drive element are electrically connected via the conductive portion.

  According to the present invention, since the drive circuit unit and the drive element are electrically connected via the conductive unit provided on the flexible substrate, the conductive unit corresponding to the nozzle pitch is formed on the flexible substrate by, for example, printing technology. By providing the conductive pattern with high accuracy, even if the distance between the drive elements is reduced (narrow) by reducing the nozzle pitch, each of the plurality of drive elements provided according to the nozzle pitch Electrical connection with the drive circuit unit can be performed with good workability.

  In the liquid droplet ejection head according to the aspect of the invention, the drive circuit unit is provided in a predetermined region on the flexible substrate, and the conductive unit includes the drive circuit unit and the drive element provided on the flexible substrate. The structure which electrically connects can be employ | adopted.

  According to the present invention, by providing the drive circuit unit on the flexible substrate provided with the conductive unit, the entire droplet discharge head can be made compact, and positioning of the conductive unit and the drive circuit unit is easy. Can also be done.

  In the liquid droplet ejection head according to the aspect of the invention, the drive circuit unit may be configured to be flip-chip mounted on the flexible substrate and connected to the conductive unit.

  According to the present invention, the drive circuit unit and the conductive unit can be electrically connected with good workability and good by flip-chip mounting the drive circuit unit on the flexible substrate.

  In the liquid droplet ejection head of the present invention, the liquid droplet ejection head includes a plurality of nozzle openings for ejecting liquid droplets, and a plurality of the drive elements are provided according to the nozzle openings, and the conductive portion is formed on the flexible substrate. A configuration having a plurality of terminal portions connected to each of the plurality of driving elements can be employed.

  According to the present invention, the distance between the drive elements can be reduced by reducing the nozzle pitch by providing terminal portions corresponding to a plurality of drive elements on the flexible substrate as a conductive pattern by, for example, printing technology. Even if the size is reduced, each of the plurality of drive elements arranged in accordance with the nozzle pitch and the terminal portion can be electrically connected with good workability and good.

  In the liquid droplet ejection head of the present invention, it is possible to employ a configuration in which at least a part of the flexible substrate provided with the terminal portion is bent and the terminal portion and the driving element are connected. it can.

  According to the present invention, it is possible to satisfactorily connect the terminal portion and the drive element by bending the flexible substrate and connecting the terminal portion and the drive element, and the connection state is maintained even after the connection work. It can be maintained well for a long time.

  In the droplet discharge head of the present invention, a configuration in which the terminal portion is provided in an edge region of the flexible substrate can be employed.

  According to the present invention, since the terminal portion is provided in the edge region of the flexible substrate, the connection work between the terminal portion and the drive element can be performed smoothly. Moreover, since the edge area | region of a flexible substrate bends easily, the workability | operativity at the time of connecting a terminal part and a drive element by bending a flexible substrate can be improved.

  In the droplet discharge head of the present invention, a configuration in which an opening is formed in a part of the flexible substrate and the terminal portion is provided in an edge region of the opening can be adopted.

  According to the present invention, it is also possible to provide a terminal portion in the edge region in the opening of the flexible substrate, improving the degree of freedom of the connection form between the terminal portion and the drive element, and thus the degree of freedom in designing the droplet discharge head. can do.

  In the liquid droplet ejection head according to the aspect of the invention, the terminal portion is provided in each of the first region and the second region facing the first region in the edge region in the opening. Can be adopted.

  According to the present invention, since the terminal portions are formed to face each other, the connection work between the terminal portions in the first region and the drive element and the connection work between the terminal portions in the second region and the drive element are performed. Each can be performed smoothly and substantially simultaneously, and the connection workability can be improved.

  In the liquid droplet ejection head of the present invention, a plurality of the nozzle openings provided side by side constitute a nozzle opening group, and a plurality of the nozzle openings are arranged so as to correspond to each of the nozzle openings constituting the nozzle opening group. A drive element group may be configured by the provided drive elements, and the drive element group may be arranged so as to correspond to each of the first and second regions.

  According to the present invention, each drive element of the drive element group arranged so as to correspond to each of the first and second regions, and a plurality of terminal portions provided in each of the first and second regions Can be connected almost simultaneously, so that the connection workability between the terminal portion and the drive element can be greatly improved.

  In the droplet discharge head of the present invention, a configuration in which a rigid body is disposed at a position facing the terminal portion and the driving element connected to each other can be employed.

  According to the present invention, when the terminal portion provided on the flexible substrate having flexibility and the drive element are connected, the rigid body is disposed at a position facing the terminal portion and the drive element, so that they are connected to each other. The terminal portion and the driving element can be favorably supported by a rigid body.

  In the liquid droplet ejection head according to the present invention, it is possible to adopt a configuration in which the connecting portion between the conductive portion and the driving element is resin-molded.

  According to the present invention, since the connecting portion between the conductive portion and the drive element is resin-molded, the connecting portion can be fixed while being protected.

  In the liquid droplet ejection head according to the aspect of the invention, the driving element may include a piezoelectric element and an electrode portion connected to the piezoelectric element, and the conductive portion may be connected to the electrode portion.

  According to the present invention, the drive signal from the drive circuit unit is satisfactorily transmitted to the electrode unit through the conductive unit, and the piezoelectric element can be driven in a desired state.

  In the liquid droplet ejection head of the present invention, a configuration in which a sealing member for sealing the piezoelectric element is provided and the flexible substrate and the sealing member are fixed by a resin mold can be adopted.

  According to the present invention, since the piezoelectric element is sealed with the sealing member, the deterioration of the piezoelectric element can be prevented. Moreover, since the flexible substrate is fixed by the sealing member with a resin mold, unnecessary deformation of the flexible substrate can be prevented.

  In the droplet discharge head of the present invention, a configuration in which the conductive portion and the driving element are connected by a brazing material can be employed.

  According to the present invention, electrical connection between the conductive portion and the drive element can be obtained by the brazing material.

  In the droplet discharge head of the present invention, a configuration in which the conductive portion and the driving element are connected by an anisotropic conductive material can be employed.

  According to the present invention, an electrically conductive portion and a drive element are electrically connected by an anisotropic conductive material including an anisotropic conductive film (ACF) and an anisotropic conductive paste (ACP). Connection can be obtained with good workability.

  The droplet discharge device of the present invention is a droplet discharge device provided with a droplet discharge head for discharging a droplet of a functional liquid, and the droplet discharge head described above is used as the droplet discharge head. It is characterized by.

  According to the present invention, a fine microdevice can be satisfactorily manufactured based on a droplet discharge method using a droplet discharge head having a small nozzle pitch.

  The method for manufacturing a droplet discharge head according to the present invention is a method for manufacturing a droplet discharge head including a drive circuit unit and a drive element driven by the drive circuit unit. A step of providing a conductive portion, a step of disposing the drive circuit portion on a flexible substrate provided with the conductive portion to electrically connect the drive circuit portion and the conductive portion, and the conductive portion. And electrically connecting the driving element.

  According to the present invention, by electrically connecting the drive circuit portion and the drive element via the conductive portion provided on the flexible substrate, the conductive portion corresponding to the nozzle pitch is formed on the flexible substrate by, for example, printing technology. By providing the conductive pattern with high accuracy in advance, even if the nozzle pitch is small, the electrical connection between the drive circuit unit and the plurality of drive elements arranged according to the nozzle pitch is excellent and workability is improved. Can be done well.

  In the method for manufacturing a droplet discharge head according to the present invention, when the conductive portion and the drive element are connected, a configuration in which the conductive portion and the drive element are sandwiched between rigid bodies can be employed.

  According to the present invention, the conductive part provided on the flexible substrate and the drive element are sandwiched and connected by a rigid body, whereby the connection work between the conductive part and the drive element can be performed satisfactorily.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do.

<Droplet ejection head>
An embodiment of a droplet discharge head will be described with reference to FIGS. 1 is an external perspective view showing an embodiment of a droplet discharge head, FIG. 2 is a partially broken view of the perspective view of the droplet discharge head as viewed from below, and FIG. 3 is a cross-sectional arrow along line AA in FIG. FIG. 4 is a view of the flexible substrate as viewed from the lower surface side.

  The liquid droplet ejection head 1 ejects functional liquid droplets, and is connected to a nozzle substrate 16 having a nozzle opening 15 from which liquid droplets are ejected, and an upper surface of the nozzle substrate 16. A flow path forming substrate 10 that forms a flow path that flows, a vibration plate 400 that is connected to the upper surface of the flow path forming substrate 10 and displaced by driving of the piezoelectric element 300, and a upper surface of the vibration plate 400 that forms the reservoir 100. A reservoir forming substrate 20, a flexible flexible substrate 500 provided on the upper surface side of the reservoir forming substrate 20, and a driving circuit for driving the piezoelectric element 300 provided on the lower surface 500A of the flexible substrate 500. Part (IC driver) 200 and a conductive part (conductor) that is provided on the lower surface 500A of the flexible substrate 500 and electrically connects the drive circuit part 200 and the piezoelectric element 300. It has pattern, the wiring pattern) 510. The operation of the droplet discharge head 1 is controlled by an external controller CT. The pressure generation chamber 12 in which the functional liquid before being discharged from the nozzle opening 15 is disposed is formed by a space surrounded by the flow path forming substrate 10, the nozzle substrate 16, and the vibration plate 400. . A reservoir 100 that preliminarily holds the functional liquid before being supplied to the pressure generating chamber 12 is formed by a space surrounded by the reservoir forming substrate 20 and the flow path forming substrate 10.

  The lower surface side of the flow path forming substrate 10 is open, and the nozzle substrate 16 is connected to the lower surface of the flow path forming substrate 10 so as to cover the opening. The lower surface of the flow path forming substrate 10 and the nozzle substrate 16 are fixed via, for example, an adhesive or a heat welding film. The nozzle substrate 16 is provided with a nozzle opening 15 for discharging droplets. As shown in FIG. 2, a plurality of nozzle openings 15 are provided in the nozzle substrate 16. Specifically, the nozzle substrate 16 includes a first nozzle opening group 15A, a second nozzle opening group 15B, and a third nozzle opening group 15C that are configured by a plurality of nozzle openings 15 provided side by side in the Y-axis direction. , And the fourth nozzle opening group 15D. The first nozzle opening group 15A and the second nozzle opening group 15B are disposed so as to face each other in the X-axis direction. The third nozzle opening group 15C is provided on the + Y side of the first nozzle opening group 15A, and the fourth nozzle opening group 15D is provided on the + Y side of the second nozzle opening group 15B. The third nozzle opening group 15C and the fourth nozzle opening group 15D are arranged so as to face each other in the X-axis direction.

  In FIG. 2, each of the nozzle opening groups 15 </ b> A to 15 </ b> D is illustrated as being configured by six nozzle openings 15, but actually, for example, configured by about 720 nozzle openings 15. Has been.

  A plurality of partition walls 11 are formed inside the flow path forming substrate 10. The flow path forming substrate 10 is formed of silicon, and the plurality of partition walls 11 are formed by anisotropically etching a silicon single crystal substrate that is a base material of the flow path forming substrate 10. A plurality of pressure generating chambers 12 are formed by a space surrounded by the flow path forming substrate 10 having the plurality of partition walls 11, the nozzle substrate 16, and the diaphragm 400. A plurality of pressure generating chambers 12 are formed so as to correspond to the plurality of nozzle openings 15. That is, a plurality of pressure generation chambers 12 are provided side by side in the Y-axis direction so as to correspond to the plurality of nozzle openings 15 constituting each of the first to fourth nozzle opening groups 15A to 15D. Then, a plurality of pressure generation chambers 12A corresponding to the first nozzle opening group 15A constitute a first pressure generation chamber group 12A, and a plurality of pressure generation chambers 12 corresponding to the second nozzle opening group 15B are formed. Constitutes a second pressure generation chamber group 12B, and a plurality of pressure generation chambers 12 corresponding to the third nozzle opening group 15C constitutes a third pressure generation chamber group 12C, corresponding to the fourth nozzle opening group 15D. Thus, a fourth pressure generation chamber group 12D is configured by the plurality of pressure generation chambers 12 formed. The first pressure generation chamber group 12A and the second pressure generation chamber group 12B are arranged to face each other in the X-axis direction, and a partition wall 10K is formed between them. Similarly, a partition 10K is also formed between the third pressure generation chamber group 12C and the fourth pressure generation chamber group 12D, and they are arranged to face each other in the X-axis direction.

  Here, as described above, the flow path forming substrate 10 including the partition walls 10K is formed of a silicon single crystal and is a rigid body.

  Of the plurality of pressure generating chambers 12 forming the first pressure generating chamber group 12A, the end on the −X side is closed by the partition wall 10K described above, but the end on the + X side is gathered so as to be connected to each other. And is connected to the reservoir 100. The reservoir 100 is introduced from the functional liquid introduction port 25 and temporarily holds the functional liquid before being supplied to the pressure generating chamber 12, and is formed on the reservoir forming substrate 20 so as to extend in the Y-axis direction. The reservoir portion 21 is formed on the flow path forming substrate 10 so as to extend in the Y-axis direction, and the communication portion 13 that connects the reservoir portion 21 and each of the pressure generating chambers 12 is provided. That is, the reservoir 100 is a functional liquid holding chamber (ink chamber) common to the plurality of pressure generating chambers 12 constituting the first pressure generating chamber group 12A. The functional liquid introduced from the functional liquid introduction port 25 flows into the reservoir 100 via the introduction path 26, and is supplied to each of the plurality of pressure generation chambers 12 constituting the first pressure generation chamber group 12A via the supply path 14. The

  A reservoir 100 similar to that described above is also connected to each of the pressure generation chambers 12 constituting each of the second, third, and fourth pressure generation chamber groups 12B, 12C, and 12D.

  The diaphragm 400 disposed between the flow path forming substrate 10 and the reservoir forming substrate 20 is provided on the elastic film 50 so as to cover the upper surface of the flow path forming substrate 10 and on the upper surface of the elastic film 50. And a lower electrode film 60. The elastic film 50 is made of, for example, silicon dioxide having a thickness of about 1 to 2 μm. The lower electrode film 60 is made of, for example, a metal having a thickness of about 0.2 μm. In the present embodiment, the lower electrode film 60 is a common electrode for the plurality of piezoelectric elements 300.

  The piezoelectric element 300 for displacing the diaphragm 400 includes a piezoelectric film 70 provided on the upper surface of the lower electrode film 60 and an upper electrode film 80 provided on the upper surface of the piezoelectric film 70. The piezoelectric film 70 has a thickness of about 1 μm, for example, and the upper electrode film 80 has a thickness of about 0.1 μm, for example. The concept of the piezoelectric element 300 may include the lower electrode film 60 in addition to the piezoelectric film 70 and the upper electrode film 80. That is, the lower electrode film 60 in the present embodiment has both the function as the piezoelectric element 300 and the function as the diaphragm 400. In this embodiment, the elastic film 50 and the lower electrode film 60 function as the diaphragm 400. However, the elastic film 50 may be omitted, and the lower electrode film 60 may also serve as the elastic film (50). .

  A plurality of piezoelectric films 70 and upper electrode films 80, that is, piezoelectric elements 300 are provided so as to correspond to the plurality of nozzle openings 15 and the pressure generation chambers 12, respectively. That is, the piezoelectric element 300 including the piezoelectric film 70 and the upper electrode film 80 is provided for each nozzle opening 15 (for each pressure generation chamber 12). As described above, the lower electrode film 60 functions as a common electrode for the plurality of piezoelectric elements 300, and the upper electrode film 80 functions as an individual electrode for the plurality of piezoelectric elements 300.

  In addition, the first piezoelectric element group 300A is configured by a plurality of piezoelectric elements 300 provided side by side in the Y-axis direction so as to correspond to each of the nozzle openings 15 constituting the first nozzle opening group 15A. A second piezoelectric element group 300B is configured by a plurality of piezoelectric elements 300 provided in a line in the Y-axis direction so as to correspond to each of the nozzle openings 15 constituting the two-nozzle opening group 15B. The first piezoelectric element group 300A and the second piezoelectric element group 300B are arranged to face each other in the X-axis direction. Similarly, the third and fourth piezoelectric elements are provided by a plurality of piezoelectric elements 300 arranged in the Y-axis direction so as to correspond to the respective nozzle openings 15 constituting the third and fourth nozzle opening groups 15C and 15D. The groups 300C and 300D are configured, and the third and fourth piezoelectric element groups 300C and 300D are arranged so as to face each other in the X-axis direction (note that the third and fourth piezoelectric element groups 300C, 300D is formed on the back side of the sheet of FIG. 3 and is not shown).

  A compliance substrate 30 having a sealing film 31 and a fixing plate 32 is bonded to the reservoir forming substrate 20. The sealing film 31 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide film having a thickness of about 6 μm), and the upper part of the reservoir portion 21 is sealed by the sealing film 31. The fixing plate 32 is made of a hard material such as metal (for example, stainless steel having a thickness of about 30 μm). In the fixed plate 32, the region corresponding to the reservoir 100 is an opening 33 that is completely removed in the thickness direction, so that the upper portion of the reservoir 100 is formed only by the flexible sealing film 31. The flexible portion 22 is sealed and can be deformed by a change in internal pressure.

  Normally, when the functional liquid is supplied to the reservoir 100 from the functional liquid inlet 25, a pressure change occurs in the reservoir 100 due to, for example, the flow of the functional liquid when the piezoelectric element 300 is driven or the ambient heat. However, as described above, since the upper portion of the reservoir 100 is sealed only by the sealing film 31 to form the flexible portion 22, the flexible portion 22 is bent and deformed to absorb the pressure change. Therefore, the inside of the reservoir 100 is always maintained at a constant pressure. The other parts are held at a sufficient strength by the fixing plate 32.

  A functional liquid introduction port 25 for supplying a functional liquid to the reservoir 100 is formed on the compliance substrate 30 outside the reservoir 100, and the functional liquid introduction port 25 and the reservoir 100 are formed on the reservoir forming substrate 20. There is provided an introduction path 26 that communicates with the side wall.

  A groove 700 extending in the Y-axis direction is formed in the central portion of the reservoir forming substrate 20 in the X-axis direction. By the groove portion 700, the reservoir forming substrate 20 is divided into a first sealing portion 20A for sealing the first piezoelectric element group 300A provided corresponding to the first pressure generating chamber group 12A, and a second pressure generating chamber group 12B. The second piezoelectric element group 300B provided correspondingly is divided into a second sealing portion 20B for sealing (see FIG. 3). Similarly, the groove portion 700 corresponds to the third sealing portion 20C for sealing the third piezoelectric element group 300C provided corresponding to the third pressure generation chamber group 12C and the fourth pressure generation chamber group 12D. It is divided into a fourth sealing portion 20D that seals the provided fourth piezoelectric element group 300D (note that the third and fourth sealing portions 20C and 20D are formed on the back side of FIG. 3). (Not shown). And in the groove part 700, a part of flow-path formation board | substrate 10 (partition 10K) is exposed.

  That is, in the reservoir forming substrate 20, a region facing the piezoelectric element 300 is provided with the piezoelectric element holding portion 24 that can seal the space while ensuring a space that does not hinder the movement of the piezoelectric element 300. ing. The piezoelectric element holding part 24 is formed in each of the first to fourth sealing parts 20A to 20D, and has a size covering the first to fourth piezoelectric element groups 300A to 300D. Of the piezoelectric elements 300, at least the piezoelectric film 70 is sealed in the piezoelectric element holding portion 24.

  As described above, the reservoir forming substrate 20 functions as a sealing member for sealing the piezoelectric element 300 by blocking the piezoelectric element 300 from the external environment. By sealing the piezoelectric element 300 with the reservoir forming substrate 20, it is possible to prevent the piezoelectric element 300 from being damaged by an external environment such as moisture. Further, in the present embodiment, the inside of the piezoelectric element holding unit 24 is only sealed, but for example, by making the space in the piezoelectric element holding unit 24 vacuum or a nitrogen or argon atmosphere or the like, The inside of the piezoelectric element holding portion 24 can be held at a low humidity, and destruction of the piezoelectric element 300 can be further reliably prevented.

  The reservoir forming substrate 20 is a rigid body, and as the material for forming the reservoir forming substrate 20, for example, a material substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10 such as glass or ceramic material is used. Preferably, in the present embodiment, a silicon single crystal substrate made of the same material as the flow path forming substrate 10 is used.

  As shown in FIG. 3, in the piezoelectric element 300 sealed by the piezoelectric element holding part 24 of the first sealing part 20A, the end portion on the −X side of the upper electrode film 80 is the first sealing part 20A. The groove portion 700 is disposed on the flow path forming substrate 10. As shown in FIG. 3, in the case where a part of the lower electrode film 60 is disposed on the flow path forming substrate 10 in the groove portion 700, an electrical connection between the upper electrode film 80 and the lower electrode film 60 is performed. An insulating film 600 for preventing connection is provided between the upper electrode film 80 and the lower electrode film 60. Similarly, in the piezoelectric element 300 sealed by the piezoelectric element holding part 24 of the second sealing part 20B, the + X side end of the upper electrode film 80 extends to the outside of the second sealing part 20B. The groove 700 is disposed on the flow path forming substrate 10. Similarly, although not shown, among the piezoelectric elements 300 sealed by the third and fourth sealing portions 20C and 20D, a part of the upper electrode film 80 is formed by the third and fourth sealing portions 20C. , 20D, and is disposed on the flow path forming substrate 10 in the groove portion 700 provided between the third and fourth sealing portions 20C, 20D.

  The drive circuit unit 200 for driving the piezoelectric element 300 includes, for example, a circuit board or a semiconductor integrated circuit (IC) including a drive circuit, and is connected to the lower surface 500 </ b> A of the flexible substrate 500. The piezoelectric element 300 is driven by the drive circuit unit 200. The flexible substrate 500 has flexibility, and is made of an insulating film member made of polyimide, for example. A conductive wiring pattern (conductive portion) 510 made of a conductive material such as copper is provided on the lower surface 500A of the flexible substrate 500 by a printing method or a method such as plating or etching.

  As shown in FIG. 4, a drive circuit unit 200 is provided in a predetermined region of the lower surface 500 </ b> A of the flexible substrate 500. The drive circuit unit 200 is flip-chip mounted on the lower surface 500 </ b> A of the flexible substrate 500 and connected to a part of the wiring pattern 510. A plurality (four) of drive circuit units 200 are provided according to the first to fourth nozzle opening groups 15A to 15D. Each of the first to fourth drive circuit units 200A to 200D provided according to the first to fourth nozzle opening groups 15A to 15D is flip-chip mounted on the flexible substrate 500, and then the flexible substrate is made of the resin 201. 500 is fixed.

  An opening 520 is formed in part of the flexible substrate 500. Specifically, the opening 520 is in a region between the first drive circuit unit 200A and the second drive circuit unit 200B and a region between the third drive circuit unit 200C and the fourth drive circuit unit 200D. It is formed so as to extend in the Y-axis direction. As shown in FIG. 4, notches 521 are formed at both ends in the Y-axis direction of the opening 520. The cutout portion 521 allows a part of the flexible substrate 500 (the edge region) 530 facing the opening 520 to be bent (bend) inside the opening 520. The edge region 530 is a region between the drive circuit units 200A to 200D and the opening 520, and the edge portion 530E of the edge region 530 that faces the opening 520 is substantially linear along the Y-axis direction. Is formed. That is, in the present embodiment, the edge region 530 is a rectangular region whose longitudinal direction is the Y-axis direction, and is bent so that the edge portion 530E rotates about the Y-axis (θY direction). ing.

  Of the lower surface 500 </ b> A of the flexible substrate 500, a terminal portion 512 constituting a part of the wiring pattern 510 is formed in the edge region 530 in the opening 520. In the first edge region 530A between the first drive circuit unit 200A and the opening 520, a plurality of terminal units 512 that are electrically connected to the first drive circuit unit 200A via the wiring pattern 510 are formed. . The plurality of terminal portions 512 provided in the first edge region 530A are connected to each of the plurality of piezoelectric elements 300 (upper electrode film 80) constituting the first piezoelectric element group 300A. A plurality of (for example, 720) elements are arranged in the Y-axis direction so as to correspond to the plurality of piezoelectric elements 300 constituting the group 300A, and constitute the first terminal group 512A. Therefore, when the terminal portion 512 and the piezoelectric element 300 are connected, the drive circuit portion 200 and the piezoelectric element 300 are electrically connected via the wiring pattern 510 including the terminal portion 512.

  Similarly, in the second edge region 530B between the second drive circuit unit 200B and the opening 520, a plurality (in the Y-axis direction (corresponding to the plurality of piezoelectric elements 300 constituting the second piezoelectric element group 300B) ( For example, 720) a second terminal group 512B including terminal portions 512 provided side by side is provided. The first edge region 530A and the second edge region 530B are disposed so as to face each other in the X-axis direction, and the first terminal group formed in each of the first and second edge regions 530A and 530B. The 512A and the second terminal group 512B are also configured to face each other in the X-axis direction.

  Similarly, in the third edge region 530C between the third drive circuit unit 200C and the opening 520, a plurality of elements in the Y-axis direction correspond to the plurality of piezoelectric elements 300 constituting the third piezoelectric element group 300C. A third terminal group 512C including terminal portions 512 provided in parallel (for example, 720) is provided, and the fourth edge region 530D between the fourth drive circuit portion 200D and the opening 520 includes a fourth terminal region 512C. A fourth terminal group 512D including a plurality of (for example, 720) terminal portions 512 arranged in the Y-axis direction so as to correspond to the plurality of piezoelectric elements 300 constituting the piezoelectric element group 300D is provided. The third edge region 530C and the fourth edge region 530D are arranged so as to face each other in the X-axis direction.

  Then, as shown in FIG. 3, the edge region 530 provided with the terminal portion 512 is positioned downward in a state where the lower surface 500A of the flexible substrate 500 and the piezoelectric element 300 are opposed to each other and the opening 520 and the groove 700 are positioned. The terminal portion 512 provided on the lower surface 500A in the edge region 530 is connected to the upper electrode film 80 disposed in the groove portion 700. Here, the first piezoelectric element group 300A is arranged so as to correspond to the first edge region 530A of the flexible substrate 500 and the first terminal group 512A provided in the first edge region 530A. The group 300B is arranged so as to correspond to the second edge region 530B of the flexible substrate 500 and the second terminal group 512B provided in the second edge region 530B. Therefore, each of the plurality of piezoelectric elements 300 (upper electrode film 80) constituting the first piezoelectric element group 300A and the plurality of terminal portions 512 constituting the first terminal group 512A are well connected, and the second Each of the plurality of piezoelectric elements 300 (upper electrode film 80) constituting the piezoelectric element group 300B and the plurality of terminal portions 512 constituting the second terminal group 512B are well connected.

  Similarly, each of the plurality of piezoelectric elements 300 constituting the third and fourth piezoelectric element groups 300C and 300D and the plurality of terminal portions 512 constituting the third and fourth terminal groups 512C and 512D are the third, The fourth edge regions 530C and 530D are connected in a bent state.

  Here, the terminal portion 512 and the piezoelectric element 300 (upper electrode film 80) include a brazing material, an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). They are connected by an anisotropic conductive material.

  As shown in FIG. 3, a resin 202 is disposed between the flexible substrate 500 and the reservoir forming substrate 20, and the flexible substrate 500 and the reservoir forming substrate 20 are fixed by a resin mold using the resin 202. Yes. Further, the resin 202 is also disposed inside the groove portion 700, and a connection portion between the terminal portion 512 and the piezoelectric element 300 (upper electrode film 80) is resin-molded.

  Next, the operation of the droplet discharge head 1 having the above-described configuration will be described. In order to eject the functional liquid droplets from the liquid droplet ejection head 1, the external controller CT drives an external functional liquid supply device (not shown) connected to the functional liquid inlet 25. The functional liquid sent out from the external functional liquid supply device fills the internal flow path of the droplet discharge head 1 from the functional liquid introduction port 25 to the reservoir 100 until reaching the nozzle opening 15. Further, the external controller CT sends drive power and a command signal to the drive circuit unit 200 and the like via an external signal input unit 580 provided on the flexible substrate 500. The flexible substrate 500 is provided with a wiring pattern 510, and a command signal or the like from the external signal input unit 580 is sent to the drive circuit unit 200 through the wiring pattern 510. Based on a command from the external controller CT, the drive circuit unit 200 is interposed between the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generation chamber 12 via the wiring pattern 510 including the terminal unit 512. A voltage is applied to displace the elastic film 50, the lower electrode film 60, and the piezoelectric film 70, thereby increasing the pressure in each pressure generating chamber 12 and ejecting droplets from the nozzle openings 15.

<Method for manufacturing droplet discharge head>
Next, a method for manufacturing the droplet discharge head 1 will be described with reference to a flowchart of FIG. 5 and a schematic diagram of FIG. In the following, the procedure for connecting the drive circuit unit 200 and the piezoelectric element 300 will be mainly described. Among the droplet discharge heads 1, the nozzle substrate 16, the flow path forming substrate 10, the reservoir forming substrate 20, the piezoelectric element 300, and the like. It is assumed that the manufacturing, connection and arrangement work has been completed.

  First, a wiring pattern 510 including a terminal portion 512 made of a conductive material such as copper is provided on the lower surface 500A of a flexible flexible substrate 500 made of polyimide or the like by a printing method such as plating or etching (see FIG. Step SA1). The wiring pattern 510 including the terminal portion 512 is formed with high accuracy according to the distance (nozzle pitch) between the nozzle openings 15, that is, the distance between the piezoelectric elements 300.

  Next, the drive circuit unit 200 is flip-chip mounted on a predetermined region (mounting region) on the lower surface 500A of the flexible substrate 500 (step SA2). Thereafter, the flexible substrate 500 and the drive circuit unit 200 are fixed by the resin 201 (step SA3).

  Thus, by providing the drive circuit unit 200 on the flexible substrate 500 provided with the wiring pattern 510, the entire droplet discharge head 1 can be made compact, and the wiring pattern 510, the drive circuit unit 200, and the like can be reduced. Can be easily positioned. Further, by flip-chip mounting the drive circuit unit 200 on the flexible substrate 500, electrical connection between the drive circuit unit 200 and the wiring pattern 510 can be performed with good workability and good.

  Next, the terminal portion 512 provided on the flexible substrate 500 is connected to the upper electrode film 80 of the piezoelectric element 300 (step SA4).

  When connecting the terminal portion 512 and the upper electrode film 80, as shown in FIG. 6, the edge region 530 of the flexible substrate 500 is pressed from above by the pressing member 800. Here, the pressing operation on the edge region 530 by the pressing member 800 is performed in a state where the opening 520 of the flexible substrate 500 and the groove 700 of the reservoir forming substrate 20 are aligned. In this aligned state, each of the plurality of piezoelectric elements 300 constituting the first piezoelectric element group 300A and the plurality of terminal parts 512 constituting the first terminal part 512A is aligned, and the second piezoelectric element Each of the plurality of piezoelectric elements 300 constituting the element group 300B and the plurality of terminal parts 512 constituting the second terminal part 512B are aligned. Similarly, the plurality of piezoelectric elements 300 constituting the third and fourth piezoelectric element groups 300C and 300D and the plurality of terminal parts 512 constituting the third and fourth terminal parts 512C and 512D are aligned. .

  The edge region 530 of the flexible substrate 500 is bent (bent) downward by being pressed by the pressing member 800, so that the terminal portion 512 provided on the lower surface 500A of the edge region 530 of the flexible substrate 500; The upper electrode film 80 of the piezoelectric element 300 exposed in the groove 700 can be connected. Here, since at least one of the terminal portion 512 and the upper electrode film 80 is provided with the brazing material or the anisotropic conductive material 900 in advance, the brazing material or the anisotropic conductive material 900 is used. By performing the pressing operation by the pressing member 800 in the interposed state, the electrical connection between the terminal portion 512 and the upper electrode film 80 (piezoelectric element 300) can be performed with good workability and good. When the brazing material is provided in advance, it is preferable that the brazing material is provided on the terminal portion 512 of the terminal portion 512 and the upper electrode film 80. As described above, the wiring pattern 510 is formed on the lower surface 500 </ b> A of the flexible substrate 500 by a printing technique including plating. The lower surface 500 </ b> A of the flexible substrate 500 is formed by a method similar to the method of forming the wiring pattern 510. This is because the brazing material can be arranged smoothly.

  Then, in the pressing operation by the pressing member 800 for connecting the terminal portion 512 provided on the flexible substrate 500 and the upper electrode film 80 of the piezoelectric element 300, as shown in FIG. The opposing first edge region 530A and second edge region 530B are simultaneously pressed. In the present embodiment, the −X side end portion of the upper electrode film 80 of the piezoelectric element 300 constituting the first piezoelectric element group 300A and the + X of the upper electrode film 80 of the piezoelectric element 300 constituting the second piezoelectric element group 300B. The side end portions are arranged in the same groove portion 700, and the first and second terminal groups 512A and 512B corresponding to the first and second piezoelectric element groups 300A and 300B are also opposed to each other with the opening portion 520 interposed therebetween. Are arranged to be. Therefore, the first edge region 530A and the second edge region 530B are simultaneously pressed by the pressing member 800 at the same time, so that each of the terminal portions 512 constituting the first terminal group 512A of the first edge region 530A and the first edge region 530A are Connection work with each of the piezoelectric elements 300 (upper electrode film 80) constituting the first piezoelectric element group 300A, and each of the terminal portions 512 constituting the second terminal group 512B of the second edge region 530A and the fourth piezoelectric element Connection work with each of the piezoelectric elements 300 (upper electrode films 80) constituting the group 300D can be smoothly performed almost simultaneously. Therefore, connection workability can be improved. Similarly, good connection workability can be obtained by pressing each of the third edge region 530C and the fourth edge region 540D almost simultaneously by the pressing member 800.

  In addition, the wiring pattern 510 including the terminal portion 512 corresponding to the nozzle pitch is accurately provided on the flexible substrate 500 by a printing technique, so that the nozzle pitch is reduced, thereby reducing the Y axis between the piezoelectric elements 300. Even if the distance in the direction is small (narrow), the electrical connection between each of the plurality of piezoelectric elements 300 (upper electrode film 80) provided in accordance with the nozzle pitch and the terminal portion 512 is excellent in workability and good. Can be done.

  When pressing downward from above by the pressing member 800, in the present embodiment, the partition wall 10K (the flow path forming substrate 10) which is a rigid body is disposed below the terminal portion 512 and the upper electrode film 80. Yes. That is, the terminal portion 512, the anisotropic conductive material 900, and the upper electrode film 80 are sandwiched between the rigid pressing member 800 and the rigid partition wall 10K. Therefore, the terminal portion 512 and the upper electrode film 80 can be satisfactorily connected by pressing the pressing member 800 toward the partition wall 10K. Moreover, the terminal part 512 and the upper electrode film | membrane 80 on the flexible substrate 500 after connecting can be favorably supported by the partition 10K which is a rigid body.

  After the connection operation between the terminal portion 512 and the upper electrode film 80 is completed, the flexible substrate 500 and the reservoir forming substrate 20 are fixed by the resin 202 and the connection portion between the terminal portion 512 and the upper electrode film 80 is covered ( Step SA5). Thereby, the position of the flexible substrate 500 is fixed, and the flexible substrate 500 itself is reinforced by the resin 202. Furthermore, the connection portion between the terminal portion 512 and the upper electrode film 80 is protected by the resin 202.

  In the present embodiment, after the flexible substrate 500 and the drive circuit unit 200 are connected, the terminal unit 512 and the piezoelectric element 300 (upper electrode film 80) are connected. After the terminal portion 512 provided and the piezoelectric element 300 are connected, the flexible substrate 500 and the drive circuit portion 200 may be connected.

  <Droplet ejection device>

  Next, an example of a droplet discharge device IJ provided with the above-described droplet discharge head 1 will be described with reference to FIG. FIG. 7 is a perspective view showing a schematic configuration of the droplet discharge device IJ.

  In FIG. 7, a droplet discharge device IJ includes a droplet discharge head 1, a drive shaft 4, a guide shaft 5, a controller CT, a stage 7, a cleaning mechanism 8, a base 9, and a heater 6. I have. The stage 7 supports the substrate P from which the functional liquid is discharged from the droplet discharge head 1, and includes a fixing mechanism (not shown) that fixes the substrate P at a reference position. The functional liquid is discharged from the nozzle opening of the droplet discharge head 1 onto the substrate P supported by the stage 7.

  A drive motor 2 is connected to the drive shaft 4. The drive motor 2 is a stepping motor or the like, and rotates the drive shaft 4 when a drive signal in the Y-axis direction is supplied from the controller CT. When the drive shaft 4 rotates, the droplet discharge head 1 moves in the Y-axis direction. The guide shaft 5 is fixed so as not to move with respect to the base 9. The stage 7 includes a drive motor 3. The drive motor 3 is a stepping motor or the like, and moves the stage 7 in the X-axis direction when a drive signal in the X-axis direction is supplied from the controller CT.

  The controller CT supplies a droplet discharge control voltage to the droplet discharge head 1. Further, the controller CT supplies a drive pulse signal for controlling the movement of the droplet discharge head 1 in the Y-axis direction to the drive motor 2 and also moves the stage 7 in the X-axis direction to the drive motor 3. A drive pulse signal for controlling is supplied.

  The cleaning mechanism 8 cleans the droplet discharge head 1 and includes a drive motor (not shown). By driving the drive motor, the cleaning mechanism 8 moves in the X-axis direction along the guide shaft 5. The movement of the cleaning mechanism 8 is also controlled by the controller CT. Here, the heater 6 is means for heat-treating the substrate P by lamp annealing, and performs evaporation and drying of the solvent contained in the functional liquid applied on the substrate P. The heater CT is also turned on and off by the controller CT.

  The droplet discharge device IJ discharges droplets onto the substrate P while relatively scanning the droplet discharge head 1 and the stage 7 supporting the substrate P.

  In the above-described embodiment, the functional liquid discharged from the droplet discharge head 1 includes a liquid crystal display device forming material for forming a liquid crystal display device and an organic EL forming device for forming an organic EL display device. It includes materials, wiring pattern forming materials for forming wiring patterns of electronic circuits, and the like. Thereby, the droplet discharge apparatus IJ can manufacture each of the above-described devices with the functional liquid discharged based on the droplet discharge method.

1 is an external perspective view of a droplet discharge head according to an embodiment of the present invention. It is the perspective view which looked at the droplet discharge head from the lower side. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. It is the figure which looked at the flexible substrate from the lower surface side. It is a flowchart for demonstrating an example of the manufacturing process of a droplet discharge head. It is a schematic diagram which shows a part of manufacturing process of a droplet discharge head. It is an external appearance perspective view which shows an example of a droplet discharge device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Droplet discharge head, 15 ... Nozzle opening, 15A-15D ... Nozzle opening group, 20 ... Reservoir formation substrate (sealing member), 70 ... Piezoelectric film (piezoelectric element), 80 ... Upper electrode film (electrode part) , 200... Driving circuit section, 201... Resin, 202... Resin, 300... Piezoelectric element (driving element), 300 A, 300 B. piezoelectric element group (driving element group), 500. ) 512 terminal portion 520 opening portion 530 (530A to 530D) edge region 530A first edge region (first region) 530B second edge region (second region) 900 Anisotropic conductive material, IJ ... Droplet ejection device

Claims (18)

In a droplet discharge head including a drive circuit unit and a drive element driven by the drive circuit unit,
A flexible substrate having flexibility;
A conductive portion having conductivity provided on the flexible substrate,
A droplet discharge head in which the drive circuit unit and the drive element are electrically connected via the conductive unit. The drive circuit unit is provided in a predetermined region on the flexible substrate,
The liquid droplet ejection head according to claim 1, wherein the conductive portion electrically connects the drive circuit portion provided on the flexible substrate and the drive element.   The droplet discharge head according to claim 2, wherein the drive circuit unit is flip-chip mounted on the flexible substrate and connected to the conductive unit. Provided with a plurality of nozzle openings for discharging droplets,
A plurality of the driving elements are provided according to the nozzle opening,
4. The liquid droplet ejection head according to claim 1, wherein the conductive portion has a plurality of terminal portions connected to the plurality of driving elements on the flexible substrate. 5.   5. The droplet discharge head according to claim 4, wherein at least a part of the flexible substrate provided with the terminal portion is bent to connect the terminal portion and the driving element.   The droplet discharge head according to claim 4, wherein the terminal portion is provided in an edge region of the flexible substrate. An opening is formed in a part of the flexible substrate,
The droplet discharge head according to claim 6, wherein the terminal portion is provided in an edge region of the opening.   8. The droplet discharge head according to claim 7, wherein the terminal portion is provided in each of a first region of the edge region in the opening and a second region facing the first region. A nozzle opening group is constituted by the nozzle openings provided in a plurality of rows,
A drive element group is constituted by the drive elements provided in a plurality so as to correspond to each of the nozzle openings constituting the nozzle opening group,
The liquid droplet ejection head according to claim 8, wherein the drive element group is disposed so as to correspond to each of the first and second regions.   10. The liquid droplet ejection head according to claim 4, wherein a rigid body is disposed at a position facing the terminal portion and the driving element that are connected to each other.   The droplet discharge head according to claim 1, wherein a connection portion between the conductive portion and the driving element is resin-molded. The drive element includes a piezoelectric element and an electrode portion connected to the piezoelectric element,
The droplet discharge head according to claim 1, wherein the conductive portion is connected to the electrode portion. A sealing member for sealing the piezoelectric element;
The droplet discharge head according to claim 12, wherein the flexible substrate and the sealing member are fixed by a resin mold.   The droplet discharge head according to claim 1, wherein the conductive portion and the driving element are connected by a brazing material.   The droplet discharge head according to claim 1, wherein the conductive portion and the driving element are connected by an anisotropic conductive material. In a liquid droplet ejection apparatus equipped with a liquid droplet ejection head that ejects functional liquid droplets,
A droplet discharge device using the droplet discharge head according to claim 1 as the droplet discharge head. In a method of manufacturing a droplet discharge head comprising a drive circuit unit and a drive element driven by the drive circuit unit,
Providing a conductive portion having conductivity on a flexible substrate having flexibility; and
Disposing the drive circuit unit on a flexible substrate provided with the conductive unit to electrically connect the drive circuit unit and the conductive unit;
A method of manufacturing a droplet discharge head, comprising: electrically connecting the conductive portion and the driving element. The method of manufacturing a droplet discharge head according to claim 17, wherein when the conductive portion and the driving element are connected, the conductive portion and the driving element are sandwiched between rigid bodies.

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