JP2003080705A - Ink jet recording head, its manufacturing method and ink jet recorder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink jet recording head, its manufacturing method and an ink jet recorder in which deformation and cracking of a substrate are prevented. SOLUTION: The ink jet recording head comprises a nozzle plate 20 having a plurality of nozzle openings, a channel forming substrate 10 where pressure generating chambers 12 communicating with the nozzle openings 21 are defined, and piezoelectric elements 300 provided on one side of the channel forming substrate 10 through a diaphragm and generating a pressure variation in the pressure generating chambers 12. A reservoir forming substrate 30 having a reservoir part 31 constituting at least a part of a reservoir 150 becoming a common ink chamber for respective pressure generating chambers 12 is bonded to the piezoelectric element 300 side of the channel forming substrate 10, and mounting parts 110 being connected with an external wire 100 for driving the piezoelectric elements 300 are provided on the channel forming substrate 10 and a mounting substrate 120 made of a member different from that of the reservoir forming substrate 30 thus preventing the channel forming substrate 10 and the reservoir forming substrate 30 from cracking by heat at the time of connecting the external wire 100.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric element in which a part of a pressure generating chamber communicating with a nozzle opening for ejecting ink droplets is constituted by a vibrating plate, and a piezoelectric element is formed on the surface of the vibrating plate. The present invention relates to an inkjet recording head that ejects ink droplets by displacement, a method for manufacturing the same, and an inkjet recording device.

[0002]

2. Description of the Related Art A part of a pressure generating chamber that communicates with a nozzle opening for ejecting ink droplets is composed of a vibrating plate, and the vibrating plate is deformed by a piezoelectric element to pressurize ink in the pressure generating chamber to eject it from the nozzle opening. Two types of inkjet recording heads that eject ink droplets have been put into practical use: one that uses a longitudinal vibration mode piezoelectric actuator that expands and contracts in the axial direction of a piezoelectric element, and one that uses a flexural vibration mode piezoelectric actuator. ing.

The former allows the volume of the pressure generating chamber to be changed by bringing the end face of the piezoelectric element into contact with the vibrating plate, and a head suitable for high-density printing can be manufactured. There is a problem in that the manufacturing process is complicated because a difficult process of matching the array pitch of the openings and cutting into comb teeth or a work of positioning and fixing the cut piezoelectric element in the pressure generating chamber are required.

On the other hand, in the latter, the piezoelectric element can be formed on the vibration plate by a relatively simple process of sticking a green sheet of a piezoelectric material in conformity with the shape of the pressure generating chamber and firing it. However, due to the use of flexural vibration, a certain area is required, and there is a problem that high-density arrangement is difficult.

On the other hand, in order to eliminate the disadvantage of the latter recording head, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique as disclosed in Japanese Patent Laid-Open No. 5-286131. It has been proposed that the piezoelectric material layer is cut into a shape corresponding to the pressure generating chamber by a lithographic method and a piezoelectric element is formed so as to be independent for each pressure generating chamber.

Further, such a piezoelectric element is bonded to, for example, a flow path forming substrate defining a pressure generating chamber or to the piezoelectric element side of the flow path forming substrate to form a common ink chamber of the pressure generating chamber. Is connected to the external wiring on the reservoir forming substrate on which the reservoir is formed. That is, the wiring electrode is extended from the piezoelectric element to the mounting portion provided in the vicinity of the end portion of the flow path forming substrate or the reservoir forming substrate, and the F
By connecting an external wiring such as a PC, the piezoelectric element and the external wiring are electrically connected via the wiring electrode.

[0007]

However, in the ink jet recording head having such a structure, heating is required when connecting the external wiring to the mounting portion, and the heat causes the flow path forming substrate or the reservoir forming substrate to be heated. There is a problem that warpage occurs and the substrate is cracked.

More specifically, the flow path forming substrate or the reservoir forming substrate is made of a material such as a silicon single crystal substrate which is relatively hard and easily cracked in order to form the pressure generating chamber or the reservoir with high accuracy and high density. Is used. On the other hand, the nozzle plate provided with the nozzle openings is made of, for example, a metal material such as stainless steel. When the external wiring is heated, there is a problem in that each member has a different thermal expansion coefficient, so that warpage occurs and the flow path forming substrate or the reservoir forming substrate is cracked.

In view of such circumstances, it is an object of the present invention to provide an ink jet type recording head capable of preventing deformation and cracking of a substrate, a method of manufacturing the same, and an ink jet type recording apparatus.

[0010]

According to a first aspect of the present invention which solves the above-mentioned problems, a nozzle plate having a plurality of nozzle openings formed therein and a pressure generating chamber communicating with the nozzle openings are defined. An ink jet recording head comprising a flow path forming substrate and a piezoelectric element provided on one surface side of the flow path forming substrate via a vibration plate to generate a pressure change in the pressure generating chamber, wherein the flow path forming substrate is formed. To the piezoelectric element side of the substrate, a reservoir forming substrate having a reservoir portion forming at least a part of a reservoir serving as a common ink chamber of each pressure generating chamber is joined, and external wiring for driving the piezoelectric element. In the ink jet recording head, a mounting portion to which is connected is provided on a mounting substrate that is a member separate from the flow path forming substrate and the reservoir forming substrate.

In the first aspect, since the mounting portion is provided on the mounting substrate, the temperature of the flow path forming substrate and the reservoir forming substrate may rise due to heat when connecting the external wiring to the mounting portion. Therefore, it is possible to prevent deformation and cracking.

A second aspect of the present invention is the ink jet recording head according to the first aspect, characterized in that the mounting substrate is joined to the nozzle plate.

According to the second aspect of the present invention, the mounting substrate can be easily fixed near the flow path forming substrate.

A third aspect of the present invention is the ink jet recording head according to the first aspect, characterized in that the mounting substrate is bonded onto the flow path forming substrate.

In the third aspect, the mounting substrate can be easily fixed near the flow path forming substrate.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the mounting portion and the wiring for driving the piezoelectric element are electrically connected by wire bonding. It is a characteristic inkjet recording head.

According to the fourth aspect, the mounting portion and the wiring can be satisfactorily connected without causing cracks in the flow path forming substrate and the reservoir forming substrate.

A fifth aspect of the present invention is the ink jet recording according to the fourth aspect, characterized in that the lead-out wiring led out from the piezoelectric element and the mounting portion are electrically connected by wire bonding. On the head.

In the fifth aspect, the mounting portion and the lead-out wiring can be satisfactorily connected without causing cracks in the flow path forming substrate and the reservoir forming substrate.

According to a sixth aspect of the present invention, in the fourth aspect, a drive circuit for driving the piezoelectric element is mounted on the flow path forming substrate or the reservoir forming substrate, and is extended from the drive circuit. An ink jet recording head is characterized in that the drive wiring and the mounting portion are electrically connected by wire bonding.

In the sixth aspect, the flow path forming substrate and the reservoir forming substrate can be prevented from cracking, the mounting portion and the drive wiring can be satisfactorily connected, and the drive circuit is mounted on the reservoir forming substrate. Therefore, the size of the head can be reduced.

In a seventh aspect of the present invention, in any one of the first to sixth aspects, the pressure generating chamber is formed in a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed and formed. The inkjet recording head is characterized by being formed by a lithography method.

In the seventh aspect, an ink jet recording head having high density nozzle openings can be manufactured in a large amount and relatively easily.

An eighth aspect of the present invention is an ink jet recording apparatus having the ink jet recording head according to any one of the first to seventh aspects.

In the eighth aspect, it is possible to realize an ink jet recording apparatus with stable ink ejection characteristics of the head and improved reliability.

A ninth aspect of the present invention is a nozzle plate in which a plurality of nozzle openings are formed, a flow path forming substrate defining a pressure generating chamber communicating with the nozzle openings, and the flow path forming substrate. A piezoelectric element that is provided on one surface side via a vibration plate to generate a pressure change in the pressure generating chamber, and a common ink chamber of each pressure generating chamber on the piezoelectric element side of the flow path forming substrate. And a reservoir forming substrate having a reservoir portion forming at least a part of the reservoir, the method of manufacturing an ink jet recording head, wherein the flow path forming substrate and the mounting substrate formed of a member different from the reservoir forming substrate, Forming a mounting portion for forming the piezoelectric element and connecting the external wiring to the mounting portion; and fixing the mounting substrate to which the external wiring is connected close to the flow path forming substrate. And that step, in the manufacturing method of the ink jet recording head, characterized by a step of the wirings electrically connected to drive the piezoelectric element and the mounting portion.

In the ninth aspect, since the external wiring is connected to the mounting portion before fixing the mounting substrate, heat when connecting the external wiring to the mounting portion is not transmitted to other members.
Therefore, the flow path forming substrate and the reservoir forming substrate can be prevented from cracking, and the external wiring can be satisfactorily connected. Further, since the external wiring can be connected at a relatively high temperature, the joint strength is improved.

A tenth aspect of the present invention is the method for manufacturing an ink jet recording head according to the ninth aspect, characterized in that the mounting portion and the wiring are electrically connected by wire bonding.

In the tenth aspect, the mounting portion and the wiring can be electrically connected relatively easily.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below based on embodiments.

(Embodiment 1) FIG. 1 is an exploded perspective view showing an ink jet recording head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view and a sectional view of FIG.

As shown in the figure, the flow path forming substrate 10 is a silicon single crystal substrate having a plane orientation (110) in this embodiment. The flow path forming substrate 10 is usually 150 to 3
A thickness of about 00 μm is used, preferably 18
The thickness is preferably about 0 to 280 μm, more preferably about 220 μm. This is because the array density can be increased while maintaining the rigidity of the partition wall between the adjacent pressure generating chambers.

One surface of the flow path forming substrate 10 is an opening surface, and the other surface is provided with an elastic film 50 made of silicon dioxide formed by thermal oxidation in advance and having a thickness of 1 to 2 μm.

On the other hand, on the opening surface of the flow path forming substrate 10, a silicon single crystal substrate is anisotropically etched,
Pressure generating chambers 12 partitioned by a plurality of partition walls 11 are arranged side by side in the width direction, and on the outer side in the longitudinal direction, the pressure generating chambers 12 communicate with a reservoir portion of a reservoir forming substrate, which will be described later, and a common ink chamber of each pressure generating chamber 12. A communication portion 13 that forms a part of the reservoir is formed, and is connected to one end portion in the longitudinal direction of each pressure generating chamber 12 via an ink supply passage 14.

Here, anisotropic etching is performed by utilizing the difference in etching rate of the silicon single crystal substrate. For example, in this embodiment, the silicon single crystal substrate is set to K.
When it is dipped in an alkaline solution such as OH, it is gradually eroded and the first (111) plane perpendicular to the (110) plane and the first (111) plane
Forms an angle of about 70 degrees with the (111) plane of
A second (111) plane that makes an angle of about 35 degrees with the (0) plane appears, and the etching rate of the (111) plane is about 1/180 of the etching rate of the (110) plane. Is done using. By such anisotropic etching, it is possible to perform precision machining based on the depth machining of the parallelogram shape formed by the two first (111) planes and the two diagonal second (111) planes. The pressure generating chambers 12 can be arranged in high density.

In this embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane, and the short side is formed by the second (111) plane. The pressure generating chamber 12 is provided in the flow path forming substrate 1
It is formed by etching through almost 0 to reach the elastic film 50. Here, the elastic film 50 is
The amount of the alkaline solution that etches the silicon single crystal substrate is extremely small. Further, each ink supply passage 14 communicating with one end of each pressure generation chamber 12 is formed shallower than the pressure generation chamber 12, and keeps the flow resistance of the ink flowing into the pressure generation chamber 12 constant. That is, the ink supply path 14 is formed by etching the silicon single crystal substrate halfway in the thickness direction (half etching). The half etching is performed by adjusting the etching time.

On the opening surface side of the flow path forming substrate 10,
A nozzle plate 20 having a nozzle opening 21 that communicates with the pressure generating chamber 12 on the side opposite to the ink supply path 14 is fixed via an adhesive or a heat-welding film. The nozzle plate 20 has a thickness of, for example, 0.1 to 1
mm, a coefficient of linear expansion of 300 ° C. or less, for example, 2.5 to
It is made of glass ceramics of 4.5 [× 10 ⁻⁶ / ° C.] or rust-free steel. The nozzle plate 20 entirely covers one surface of the flow path forming substrate 10 with one surface, and also serves as a reinforcing plate that protects the silicon single crystal substrate from impact and external force. Further, the nozzle plate 20 is used as the flow path forming substrate 10.
It may be made of a material having substantially the same thermal expansion coefficient. In this case, since the flow path forming substrate 10 and the nozzle plate 20 have substantially the same deformation due to heat, they can be easily joined using a thermosetting adhesive or the like.

Here, the size of the pressure generating chamber 12 that applies the ink droplet ejection pressure to the ink and the size of the nozzle opening 21 that ejects the ink droplet depend on the amount of the ejected ink droplet, the ejection speed, and the ejection frequency. Optimized. For example,
When recording 360 ink drops per inch, it is necessary to accurately form the nozzle openings 21 with a diameter of several tens of μm.

On the other hand, a thickness of, for example, about 0.2 μm is formed on the elastic film 50 on the side opposite to the opening surface of the flow path forming substrate 10.
The lower electrode film 60, the piezoelectric layer 70 having a thickness of, for example, about 1 μm, and the upper electrode film 80 having a thickness of, for example, about 0.1 μm are laminated in a process described below to form the piezoelectric element 30.
Configures 0. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. Generally, one of the electrodes of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. Further, here, a portion which is composed of one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric strain is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In the present embodiment, the lower electrode film 60 is the common electrode of the piezoelectric element 300, and the upper electrode film 80 is the individual electrode of the piezoelectric element 300.
There is no problem in reversing this due to the driving circuit and wiring.
In any case, the piezoelectric active portion is formed for each pressure generating chamber. Further, here, the piezoelectric element 300 and the vibration plate that is displaced by the driving of the piezoelectric element 300 are collectively referred to as a piezoelectric actuator.

Further, a lead electrode 90 made of, for example, gold (Au) is extended from the vicinity of one end in the longitudinal direction of the upper electrode film 80 of the piezoelectric element 300 to the vicinity of the end of the flow path forming substrate 10.

Further, outside the flow path forming substrate 10, for example, an external wiring 1 such as a flexible cable (FPC) is provided.
Mounting board 1 provided with mounting section 110 to which 00 is connected
20 is provided close to the flow path forming substrate 10.
The mounting portion 110 on the mounting substrate 120 and the lead electrode 90 are electrically connected via the connection wiring 130.

That is, in this embodiment, the mounting substrate 12
0 is bonded to the nozzle plate 20 with a predetermined gap from the flow path forming substrate 10, and the mounting portion 110 is provided with an adhesive layer 140 made of, for example, anisotropic conductive agent (ACF) or solder. The external wiring 100 is connected via the.
The mounting portion 110 and the lead electrode 90 are electrically connected by the connection wiring 130 extended by wire bonding.

As described above, in this embodiment, the external wiring 1 is provided on the mounting substrate 120, which is a member separate from the flow path forming substrate 10.
The mounting section 110 to which 00 is connected is provided.
0 and the lead electrode 90 are electrically connected by wire bonding, so that the flow path forming substrate 10 is heated by the heat when the external wiring 100 is connected to the mounting portion 110.
It is possible to prevent the deformation and cracks from occurring due to the rise in temperature.

The procedure for electrically connecting the external wiring 100 and the lead electrode 90 is not particularly limited, but the following procedure is preferable.

That is, as shown in FIG. 3A, the external wiring 100 is arranged on the mounting portion 110 of the mounting substrate via the adhesive layer 140, and the adhesive layer 1 is placed on the external wiring 100.
The external wiring 100 is connected to the mounting portion 110 by pressing the heating tool 40 while heating it with the mounting tool (heating device) 200.

When the external wiring 100 is connected to the mounting portion 110, the heating temperature is about 105 ° C. to 200 ° C. when the anisotropic conductive agent (ACF) is used as the adhesive layer 140. When using, about 130 ℃ ~ 300 ℃
However, it is necessary to improve the bonding strength by bonding at a relatively high temperature.

Next, as shown in FIG. 3B, the mounting substrate 120 to which the external wiring 100 is connected and the nozzle plate 2 are connected.
0 and 0 are joined using, for example, a thermosetting adhesive or the like.

After that, as shown in FIG. 3C, by wire bonding, each mounting portion 110 to which the external wiring 100 is connected and each lead electrode 90 are connected to each other.
It is electrically connected via 30.

Thus, in this embodiment, the mounting substrate 1
Since the mounting board 120 and the nozzle plate 20 are joined after the external wiring 100 is connected to the mounting portion 110 provided on the mounting portion 110, heat generated when the external wiring 100 is connected to the mounting portion 110 is generated by another member. There is no transmission to. Therefore, the flow path forming substrate 10 and the like can be prevented from cracking and the external wiring 100 can be heated to a relatively high temperature to be mounted, so that the bonding strength of the external wiring 100 can be improved.

In this embodiment, the mounting substrate 120 having the external wiring 100 connected to the mounting portion 110 is joined to the nozzle plate 20, but the present invention is not limited to this.
Of course, the external wiring 100 may be connected to the mounting portion 110 after the mounting substrate 120 and the nozzle plate 20 are joined. Even in this case, since a space is secured between the mounting substrate 120 and the flow path forming substrate 10, the temperature rise of the flow path forming substrate 10 due to heat when connecting the external wiring 100 to the mounting portion 110 is significantly suppressed. be able to.

In any case, the mounting portion 110 is provided on the mounting substrate 120, which is a member separate from the flow passage forming substrate 10, so that the flow passage forming substrate 1 can be connected when the external wiring 100 is connected.
It is possible to prevent cracks from occurring at 0 and the like.

Further, the piezoelectric element 300 of the flow path forming substrate 10
A reservoir forming substrate 30 having a reservoir portion 31 forming at least a part of the reservoir 150 is joined to the side. In the present embodiment, the reservoir portion 31 penetrates the reservoir forming substrate 30 in the thickness direction, and the pressure generating chamber 12
Is formed over the width direction of the pressure generation chamber 12 and communicates with the communication portion 13 of the flow path forming substrate 10 as described above.
A reservoir 150 that serves as a common ink chamber of the same.

As the reservoir forming substrate 30, it is preferable to use a material having substantially the same coefficient of thermal expansion as that of the passage forming substrate 10, such as glass or a ceramic material. It was formed using a silicon single crystal substrate of the same material. As a result, as in the case of the nozzle plate 20 described above, it is possible to reliably bond the two even by using a thermosetting adhesive at a high temperature. Therefore, the manufacturing process can be simplified.

Further, the reservoir forming substrate 30 has
A compliance substrate 40 including a sealing film 41 and a fixing plate 42 is joined. Here, the sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm), and the sealing film 41 seals one surface of the reservoir portion 31. It has been stopped. Further, the fixing plate 42 is made of a hard material such as metal (for example, stainless steel having a thickness of 30 μm (SU
S) and the like). This fixed plate 42 reservoir 15
Since the region facing 0 is the opening 43 that is completely removed in the thickness direction, one surface of the reservoir 150 is sealed only by the sealing film 41 having flexibility, and the internal pressure changes. The flexible portion 32 is deformable by.

An ink inlet port 35 for supplying ink to the reservoir 150 is formed on the compliance substrate 40 outside the central portion in the longitudinal direction of the reservoir 150. Further, the reservoir forming substrate 30 is provided with an ink introducing passage 36 that connects the ink introducing port 35 and the side wall of the reservoir 150.

On the other hand, the piezoelectric element 3 of the reservoir forming substrate 30
In a region facing 00, a piezoelectric element holding portion 33 that can seal the space is provided in a state where a space that does not hinder the movement of the piezoelectric element 300 is secured, and the piezoelectric element 300 includes the piezoelectric element holding portion 33. It is sealed inside.

The ink jet recording head of the present embodiment as described above takes in ink from the ink introduction port 35 connected to an external ink supply means (not shown), and fills the interior from the reservoir 150 to the nozzle opening 21 with ink. Then, according to a recording signal from a driving circuit (not shown), a voltage is applied between the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generating chamber 12 via the external wiring, and the elastic film 50, By flexurally deforming the electrode film 60 and the piezoelectric layer 70, the pressure in each pressure generating chamber 12 is increased and an ink droplet is ejected from the nozzle opening 21.

(Second Embodiment) FIG. 4 is a plan view and a sectional view of an ink jet recording head according to a second embodiment.

The ink jet recording head of this embodiment is an example in which a drive circuit 160 for driving the piezoelectric element 300 is mounted. That is, in the present embodiment, as shown in FIG. 4, for example, a circuit board or a semiconductor integrated circuit (IC) for driving the piezoelectric element 300.
A driving circuit 160 such as the above is mounted on the reservoir forming substrate 30. Further, the drive circuit 160 and each piezoelectric element 30
The lead electrode 90 extracted from 0 is electrically connected to the lead electrode 90 through the through hole 34 provided in the reservoir forming substrate 30 by the connection wiring 130A extended by wire bonding. Further, the reservoir forming substrate 3
0, a drive wiring 170 for supplying a signal to the drive circuit 160 is extended to the vicinity of the end portion on the mounting substrate 120 side, and the drive wiring 170 and the mounting portion 110 are extended by wire bonding. The connection wiring 130B is electrically connected.

Even with such a configuration, the external wiring 100
Since the mounting portion 110 to which is connected is provided on the mounting substrate 120 which is a member different from the flow path forming substrate 10 and the reservoir forming substrate 30, as in the first embodiment, the flow path forming substrate 10 or the reservoir forming substrate 10 is formed. The external wiring 100 can be satisfactorily connected to the mounting portion 110 without causing cracks in the substrate 30.

(Third Embodiment) FIG. 5 is a plan view and a sectional view of an ink jet recording head according to a third embodiment.

The ink jet recording head of this embodiment is the same as that of the second embodiment except that the mounting substrate 120 is provided on the flow path forming substrate 10, as shown in FIG.

With such a structure, of course, the external wiring 100 can be satisfactorily connected to the mounting portion 110 without causing deformation or cracks in the flow path forming substrate 10 and the reservoir forming substrate 30.

(Other Embodiments) Although the respective embodiments of the present invention have been described above, the basic structure of the ink jet recording head is not limited to the above.

For example, in each of the above-mentioned embodiments, the thin film type ink jet recording head manufactured by applying the film formation and the lithographic process is taken as an example. However, the present invention is not limited to this. The present invention can also be applied to a thick film type ink jet recording head formed by a method such as attaching a sheet.

Further, the ink jet recording head of each of these embodiments constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on an ink jet recording apparatus. Figure 6
It is a schematic diagram showing an example of the ink jet type recording device.

As shown in FIG. 6, in the recording head units 1A and 1B having an ink jet recording head, the cartridges 2A and 2B constituting the ink supply means are detachably provided, and the recording head units 1A and 1B.
The carriage 3 on which B is mounted is provided on a carriage shaft 5 attached to the apparatus body 4 so as to be movable in the axial direction. The recording head units 1A and 1B are, for example,
The black ink composition and the color ink composition are respectively discharged.

The driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears (not shown) and the timing belt 7, so that the carriage 3 having the recording head units 1A and 1B mounted thereon follows the carriage shaft 5. Be moved. On the other hand, a platen 8 is provided on the apparatus main body 4 along the carriage shaft 5, and a recording sheet S, which is a recording medium such as paper fed by a feed roller (not shown), is conveyed on the platen 8. It is like this.

[0069]

As described above, according to the present invention, the mounting portion to which the external wiring is connected is provided on the mounting substrate which is a member different from the flow path forming substrate or the reservoir forming substrate. The external wiring can be satisfactorily connected at a relatively high temperature without causing cracks in the flow path forming substrate and the reservoir forming substrate due to heat when connecting the external wiring.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an ink jet recording head according to a first embodiment of the invention.

2A and 2B are a plan view and a sectional view of the ink jet recording head according to the first embodiment of the invention.

FIG. 3 is a cross-sectional view showing the manufacturing process of the ink jet recording head according to the first embodiment of the invention.

FIG. 4 is a plan view and a sectional view of an ink jet recording head according to a second embodiment of the invention.

5A and 5B are a plan view and a sectional view of an ink jet recording head according to a third embodiment of the invention.

FIG. 6 is a schematic diagram of an inkjet recording apparatus according to an embodiment of the present invention.

[Explanation of symbols]

10 Flow path forming substrate 12 Pressure generation chamber 20 nozzle plate 21 nozzle opening 30 Reservoir forming substrate 40 compliance board 60 Lower electrode film 70 Piezoelectric layer 80 Upper electrode film 100 external wiring 110 mounting section 120 mounting board 130 connection wiring 140 Adhesive layer 150 reservoir 160 drive circuit 170 drive wiring 200 mounting tools 300 Piezoelectric element

Claims (10)

[Claims] 1. A nozzle plate having a plurality of nozzle openings, a flow path forming substrate defining a pressure generating chamber communicating with the nozzle openings, and a diaphragm on one side of the flow path forming substrate. An ink jet recording head provided with a piezoelectric element that is provided via a pressure generating chamber to generate a pressure change in the pressure generating chamber, wherein a common ink chamber of each pressure generating chamber is provided on the piezoelectric element side of the flow path forming substrate. And a reservoir forming substrate having a reservoir portion forming at least a part of the reservoir, and an external wiring for driving the piezoelectric element is connected to the flow passage forming substrate and the reservoir forming substrate. An ink jet recording head, characterized in that it is provided on a mounting substrate that is a member separate from. 2. The ink jet recording head according to claim 1, wherein the mounting substrate is joined to the nozzle plate. 3. The ink jet recording head according to claim 1, wherein the mounting substrate is bonded onto the flow path forming substrate. 4. The ink jet recording head according to claim 1, wherein the mounting portion and a wiring for driving the piezoelectric element are electrically connected by wire bonding. 5. The ink jet recording head according to claim 4, wherein the lead-out wiring led out from the piezoelectric element and the mounting portion are electrically connected by wire bonding. 6. The drive circuit for driving the piezoelectric element is mounted on the flow path forming substrate or the reservoir forming substrate, and a drive wiring extending from the drive circuit and the mounting portion according to claim 4. An ink jet recording head characterized in that and are electrically connected by wire bonding. 7. The pressure generating chamber according to claim 1, wherein the pressure generating chamber is formed in a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed by film formation and a lithography method. An ink jet recording head characterized by being present. 8. An ink jet recording apparatus comprising the ink jet recording head according to claim 1. 9. A nozzle plate having a plurality of nozzle openings, a flow path forming substrate defining a pressure generating chamber communicating with the nozzle openings, and a vibrating plate on one side of the flow path forming substrate. A piezoelectric element which is provided via the pressure generating chamber to generate a pressure change, and the piezoelectric element side of the flow path forming substrate is provided with at least a part of a reservoir serving as a common ink chamber of each pressure generating chamber. A method of manufacturing an ink jet recording head, comprising: a reservoir forming substrate having a reservoir portion that forms the piezoelectric element on a mounting substrate that is a member separate from the flow passage forming substrate and the reservoir forming substrate. Forming a mounting portion and connecting the external wiring to the mounting portion; fixing the mounting substrate to which the external wiring is connected in proximity to the flow path forming substrate; Method of manufacturing the ink jet recording head is characterized in that a step of electrically connecting the wiring for driving the piezoelectric element and. 10. The method for manufacturing an ink jet recording head according to claim 9, wherein the mounting portion and the wiring are electrically connected by wire bonding.