JP2003200574A - Ink jet recording head and ink jet recorder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ink jet recording head and an ink jet recorder in which the cost and size can be reduced while enhancing the manufacturing efficiency. <P>SOLUTION: The ink jet recording head comprises a channel forming substrate 10 in which a pressure generating chamber 12 communicating with a nozzle opening is defined, and a piezoelectric element 300 consisting of a lower electrode 60 provided on one side of the channel forming substrate 10 through a diaphragm, a piezoelectric layer 70, and an upper electrode 80. The head is further provided with a bonding substrate 30 bonded to the piezoelectric element 300 side of the channel forming substrate 10 and mounting a driving IC 110 for driving the piezoelectric element 300. The driving IC 110 is flip-chip mounted on driving lines 121 and 122 arranged on the bonding substrate 30 and connected electrically therewith. On the other hand, the driving line 122 is connected electrically with lines 90 and 61 led out from the piezoelectric element 300 by wire bonding thus enhancing manufacturing efficiency. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric element, in which a part of a pressure generating chamber communicating with a nozzle opening for ejecting ink droplets is composed of a vibrating plate, and a piezoelectric element is formed on the surface of the vibrating plate. The present invention relates to an inkjet recording head and an inkjet recording device that eject ink droplets by displacement.

[0002]

2. Description of the Related Art A part of a pressure generating chamber that communicates with a nozzle opening for ejecting ink droplets is composed of a vibrating plate, and the vibrating plate is deformed by a piezoelectric element to pressurize ink in the pressure generating chamber to eject it from the nozzle opening. Two types of inkjet recording heads that eject ink droplets have been put into practical use: one that uses a longitudinal vibration mode piezoelectric actuator that expands and contracts in the axial direction of a piezoelectric element, and one that uses a flexural vibration mode piezoelectric actuator. ing.

The former allows the volume of the pressure generating chamber to be changed by bringing the end face of the piezoelectric element into contact with the vibrating plate, and a head suitable for high-density printing can be manufactured. There is a problem in that the manufacturing process is complicated because a difficult process of matching the array pitch of the openings and cutting into comb teeth or a work of positioning and fixing the cut piezoelectric element in the pressure generating chamber are required.

On the other hand, in the latter, the piezoelectric element can be formed on the vibration plate by a relatively simple process of sticking a green sheet of a piezoelectric material in conformity with the shape of the pressure generating chamber and firing it. However, due to the use of flexural vibration, a certain area is required, and there is a problem that high-density arrangement is difficult.

On the other hand, in order to eliminate the disadvantage of the latter recording head, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique as disclosed in Japanese Patent Laid-Open No. 5-286131. It has been proposed that the piezoelectric material layer is cut into a shape corresponding to the pressure generating chamber by a lithographic method and a piezoelectric element is formed so as to be independent for each pressure generating chamber.

Further, such a piezoelectric element is generally
It is driven by a drive IC (semiconductor integrated circuit) or the like, and the drive IC is mounted on, for example, a bonding substrate bonded to one surface side of the flow path forming substrate in which the pressure generating chamber is formed.
Then, the drive IC and the lead-out wiring and the like drawn out from each piezoelectric element are electrically connected to each other by a connection wiring made of a bonding wire, that is, by wire bonding.

[0007]

However, in such an ink jet recording head, the connection wiring is bonded on three surfaces of the flow path forming substrate, the bonding substrate and the driving IC. Therefore, it is necessary to adjust the position of the monitor camera and adjust the bonding position a plurality of times, resulting in poor manufacturing efficiency and high cost.

Further, there is a problem that the head becomes large in size in order to secure a space for providing a pad for bonding the connection wiring on the bonding substrate.

In view of such circumstances, it is an object of the present invention to provide an ink jet type recording head and an ink jet type recording apparatus capable of improving manufacturing efficiency, reducing cost, and downsizing.

[0010]

A first aspect of the present invention for solving the above-mentioned problems is to provide a flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening is defined, and one surface of the flow path forming substrate. In an ink jet recording head having a piezoelectric element composed of a lower electrode, a piezoelectric layer, and an upper electrode provided on a side through a vibration plate, the piezoelectric element is bonded to the piezoelectric element side of the flow path forming substrate and drives the piezoelectric element. A bonding substrate on which a driving IC is mounted is provided, and the driving IC is electrically connected to a driving wiring arranged on the bonding substrate by flip-chip mounting, and pulled out from the driving wiring and the piezoelectric element. An inkjet recording head is characterized in that it is electrically connected to a lead wire by wire bonding.

In the first aspect, since the drive IC and the drive wiring are electrically connected by flip chip mounting, the drive IC and the piezoelectric element are wire-bonded on two surfaces having different heights. Can be electrically connected to each other, which improves the manufacturing efficiency and reduces the manufacturing cost. Further, since the area for forming the pad for wire bonding can be reduced, the head can be downsized.

According to a second aspect of the present invention, in the first aspect, a mounting portion for electrically connecting the drive wiring and the external wiring is provided on the bonding substrate. It is on the recording head.

In the second aspect, the manufacturing efficiency is further improved and the size of the head can be reduced by connecting to the external wiring on the bonded substrate.

A third aspect of the present invention is the piezoelectric element holding method according to the first or second aspect, wherein the bonding substrate seals the space in a state in which the space is secured so as not to hinder the movement of the piezoelectric element. An inkjet recording head characterized by having a section.

In the third aspect, the piezoelectric element is sealed in the piezoelectric element holding portion, so that the piezoelectric element is prevented from being damaged due to the external environment.

A fourth aspect of the present invention is characterized in that, in any one of the first to third aspects, the bonding substrate has a reservoir portion that constitutes at least a part of a common ink chamber of each pressure generating chamber. Inkjet type recording head.

In the fourth aspect, since the joint substrate also serves as the reservoir forming substrate having the reservoir, there is no need to provide the reservoir forming substrate separately from the joint substrate, and the head can be miniaturized.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the pressure generating chamber is formed in a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed and formed. The inkjet recording head is characterized by being formed by a lithography method.

According to the fifth aspect, an ink jet recording head having high density nozzle openings can be manufactured in a large amount and relatively easily.

A sixth aspect of the present invention is an ink jet recording apparatus comprising the ink jet recording head according to any one of the first to fifth aspects.

According to the sixth aspect, it is possible to realize an ink jet type recording apparatus which has good print quality and is relatively inexpensive.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below based on embodiments.

(Embodiment 1) FIG. 1 is an exploded perspective view showing an ink jet recording head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view and a sectional view of FIG.

As shown in the figure, the flow path forming substrate 10 is made of a silicon single crystal substrate having a plane orientation (110) in this embodiment, and one surface thereof has a plurality of pressures formed by anisotropic etching. The generation chambers 12 are arranged side by side in the width direction. Further, on the outer side in the longitudinal direction of the pressure generating chamber 12, there is provided a communicating portion 13 that communicates with a reservoir portion 31 of a reservoir forming substrate 30 described later and constitutes a part of a reservoir that serves as a common ink chamber of each pressure generating chamber 12. Formed, each pressure generating chamber 1
The two longitudinal ends are communicated with each other via the ink supply paths 14.

Further, one surface of the flow path forming substrate 10 is an opening surface, and the other surface is made of an elastic film 50 made of silicon dioxide formed by thermal oxidation in advance and having a thickness of 1 to 2 μm.
Are formed.

Here, the anisotropic etching is performed by utilizing the difference in etching rate of the silicon single crystal substrate. For example, in this embodiment, the silicon single crystal substrate is set to K.
When it is dipped in an alkaline solution such as OH, it is gradually eroded and the first (111) plane perpendicular to the (110) plane and the first (111) plane
Forms an angle of about 70 degrees with the (111) plane of
A second (111) plane that makes an angle of about 35 degrees with the (0) plane appears, and the etching rate of the (111) plane is about 1/180 of the etching rate of the (110) plane. Is done using. By such anisotropic etching, it is possible to perform precision machining based on the depth machining of the parallelogram shape formed by the two first (111) planes and the two diagonal second (111) planes. The pressure generating chambers 12 can be arranged in high density.

In the present embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane, and the short side is formed by the second (111) plane. The pressure generating chamber 12 is provided in the flow path forming substrate 1
It is formed by etching through almost 0 to reach the elastic film 50. Here, the elastic film 50 is
The amount of the alkaline solution that etches the silicon single crystal substrate is extremely small. Further, each ink supply passage 14 communicating with one end of each pressure generation chamber 12 is formed shallower than the pressure generation chamber 12, and keeps the flow resistance of the ink flowing into the pressure generation chamber 12 constant. That is, the ink supply path 14 is formed by etching the silicon single crystal substrate halfway in the thickness direction (half etching). The half etching is performed by adjusting the etching time.

The thickness of the flow path forming substrate 10 in which the pressure generating chambers 12 and the like are formed is preferably selected in accordance with the density at which the pressure generating chambers 12 are arranged. For example, 180 per inch (180dp
When arranging the pressure generating chambers 12 to about i), the thickness of the flow path forming substrate 10 is preferably about 180 to 280 μm, and more preferably about 220 μm. Further, when the pressure generating chambers 12 are arranged at a relatively high density of, for example, about 360 dpi, the thickness of the flow path forming substrate 10 is preferably 100 μm or less. This is because the array density can be increased while maintaining the rigidity of the partition walls between the adjacent pressure generating chambers 12.

On the opening surface side of the flow path forming substrate 10,
A nozzle plate 20 having a nozzle opening 21 that communicates with the pressure generating chamber 12 on the side opposite to the ink supply path 14 is fixed via an adhesive or a heat-welding film. The nozzle plate 20 has a thickness of, for example, 0.1 to 1
mm, a coefficient of linear expansion of 300 ° C. or less, for example, 2.5 to
It is made of glass ceramics of 4.5 [× 10 ⁻⁶ / ° C.] or rust-free steel. The nozzle plate 20 entirely covers one surface of the flow path forming substrate 10 with one surface, and also serves as a reinforcing plate that protects the silicon single crystal substrate from impact and external force. Further, the nozzle plate 20 is used as the flow path forming substrate 10.
It may be made of a material having substantially the same thermal expansion coefficient. In this case, since the flow path forming substrate 10 and the nozzle plate 20 have substantially the same deformation due to heat, they can be easily joined using a thermosetting adhesive or the like.

Here, the size of the pressure generating chamber 12 that applies the ink drop ejection pressure to the ink and the size of the nozzle opening 21 that ejects the ink drop depend on the amount of the ejected ink drop, the ejection speed, and the ejection frequency. Optimized. For example,
When recording 360 ink drops per inch, it is necessary to accurately form the nozzle openings 21 with a diameter of several tens of μm.

On the other hand, a thickness of, for example, about 0.2 μm is formed on the elastic film 50 on the side opposite to the opening surface of the flow path forming substrate 10.
The lower electrode film 60, the piezoelectric layer 70 having a thickness of, for example, about 1 μm, and the upper electrode film 80 having a thickness of, for example, about 0.1 μm are laminated in a process described below to form the piezoelectric element 30.
Configures 0. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. Generally, one of the electrodes of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. Further, here, a portion which is composed of one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric strain is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In the present embodiment, the lower electrode film 60 is the common electrode of the piezoelectric element 300, and the upper electrode film 80 is the individual electrode of the piezoelectric element 300.
There is no problem even if this is reversed due to the drive IC and wiring.
In any case, the piezoelectric active portion is formed for each pressure generating chamber. Further, here, the piezoelectric element 300 and the vibration plate that is displaced by the driving of the piezoelectric element 300 are collectively referred to as a piezoelectric actuator.

In the vicinity of one longitudinal end of the upper electrode film 80 which is an individual electrode of the piezoelectric element 300, for example, gold (A
u) or the like is connected to the lead electrode 90, and the lead electrode 90 is drawn out to the vicinity of the end of the flow path forming substrate 10. On the other hand, the lower electrode film 60, which is a common electrode of the piezoelectric element 300, has a lead-out portion 61 that is drawn out to the vicinity of the end of the flow path forming substrate 10 along these lead electrodes 90.

A reservoir forming substrate 30 having a reservoir portion 31 forming at least a part of the reservoir 100 is further bonded onto the flow passage forming substrate 10 on which such a piezoelectric element 300 is formed. This reservoir 31
In the present embodiment, is formed so as to penetrate through the reservoir forming substrate 30 in the thickness direction and across the width direction of the pressure generating chamber 12, and is communicated with the communicating portion 13 of the flow path forming substrate 10 as described above. A reservoir 100 that serves as a common ink chamber for each pressure generating chamber 12.

Further, the piezoelectric element 3 of the reservoir forming substrate 30
In a region facing 00, a piezoelectric element holding portion 32 that can seal the space is provided in a state where a space that does not hinder the movement of the piezoelectric element 300 is secured, and the piezoelectric element 300 includes the piezoelectric element holding portion 32. It is sealed inside.

As such a reservoir forming substrate 30, it is preferable to use a material having substantially the same coefficient of thermal expansion as that of the passage forming substrate 10, such as glass or a ceramic material. In this embodiment, the passage forming substrate is used. It was formed using a silicon single crystal substrate of the same material as 10. As a result, as in the case of the nozzle plate 20 described above, it is possible to reliably bond the two even by using a thermosetting adhesive at a high temperature. Therefore, the manufacturing process can be simplified.

Further, on the reservoir forming substrate 30,
A drive IC (semiconductor integrated circuit) 110 for driving the piezoelectric element 300 is mounted. Specifically, the first drive wiring 121 and the second drive wiring 122 are formed in a predetermined pattern on the reservoir forming substrate 30, and the drive IC 110 has the first and second drive wirings 121. ，
122 is electrically connected by flip-chip mounting.

Here, the first drive wiring 121 is connected to the drive I
A connection part 121a for electrically connecting the C110 and the external wiring 130, one end of which is connected to the drive IC 110 and the other end is connected to the external wiring 130.
Has become.

The second drive wiring 122 is a drive IC.
110 for electrically connecting the lead electrode 90 or the lead-out portion 61 of the lower electrode film 60, one end of which is connected to the drive IC 110, and the other end of which is connected via a connecting wire 140 made of a bonding wire. Lead electrode 90
Alternatively, it is electrically connected to the lead portion 61 of the lower electrode film 60. That is, the second drive wiring 122 and the lead electrode 90 and the lead portion 61 of the lower electrode film 60 are electrically connected by wire bonding.

In such a configuration, since the drive IC 110 and the first drive wiring 121 and the second drive wiring 122 are electrically connected by flip-chip mounting, the second drive wiring 122 and the lead electrode 90 are formed. And lower electrode film 60
Since only the connection with the lead-out portion 61 of 1 is required to be performed by wire bonding, the manufacturing efficiency can be remarkably improved and the cost can be reduced.

Further, since only the connection between the second drive wiring 122 and the lead electrode 90 and the lead-out portion 61 of the lower electrode film 60 is performed by wire bonding, the space required for bonding can be reduced and the head can be miniaturized. Can be achieved.

A compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded to a region of the reservoir forming substrate 30 corresponding to the reservoir portion 31. Here, the sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm), and the sealing film 41 seals one surface of the reservoir portion 31. It has been stopped. The fixing plate 42 is made of a hard material such as metal (for example, a thickness of 30).
μm stainless steel (SUS) or the like). Since the region of the fixing plate 42 facing the reservoir 100 is the opening 43 that is completely removed in the thickness direction, one surface of the reservoir 100 is sealed with only the flexible sealing film 41. The flexible portion 33 is deformable by the change of the internal pressure.

The ink jet recording head thus constructed takes in ink from an external ink supply means (not shown), fills the interior from the reservoir 100 to the nozzle opening 21 with ink, and then according to the recording signal from the drive IC 110. By applying a voltage between the upper electrode film 80 and the lower electrode film 60, the elastic film 50, the lower electrode film 60 and the piezoelectric layer 7 are formed.
By flexurally deforming 0, the pressure inside the pressure generating chamber 12 increases, and ink droplets are ejected from the nozzle openings 21.

A method of manufacturing such an ink jet recording head will be described below with reference to FIGS. 3 to 5 are cross-sectional views of the pressure generating chamber 12 in the longitudinal direction.

First, as shown in FIG. 3A, the elastic film 50 is formed on one surface side of the flow path forming substrate 10. Specifically, a wafer of a single crystal silicon substrate that becomes the flow path forming substrate 10 is thermally oxidized in a diffusion furnace at about 1100 ° C. to form an elastic film 50 made of silicon dioxide.

Next, as shown in FIG. 3 (b), for example,
After the lower electrode film 60 made of platinum or the like is formed on the entire surface of the elastic film 50, it is patterned into a predetermined shape.

Next, as shown in FIG. 3C, for example,
Piezoelectric layer 7 made of lead zirconate titanate (PZT) or the like
0 and an upper electrode film 80 made of, for example, many metals such as aluminum, gold, nickel and platinum, or a conductive oxide, are sequentially laminated, and these are simultaneously patterned to form the piezoelectric element 300.

Next, as shown in FIG. 3D, a lead electrode 90 made of, for example, gold (Au) or the like is formed over the entire surface of the flow path forming substrate 10, and the piezoelectric element 300 is formed.
Patterning is performed in a predetermined shape so that each pattern is independent.

The above is the film forming process. After the film formation is performed in this manner, anisotropic etching of the silicon single crystal substrate with the above-mentioned alkaline solution is performed, and the result of FIG.
As shown in (a), the pressure generating chamber 12, the communication portion 13, and the ink supply passage 14 are formed. At the same time, the communication part 1
The elastic film 50 and the lower electrode film 60 in the region facing 3 are removed to form the penetrating portion 51.

Next, as shown in FIG. 4B, the reservoir formation substrate 3 in which the first and second drive wirings 121 and 122 are formed on the surface of the flow passage formation substrate 10 on the piezoelectric element 300 side.
0 is bonded with an adhesive or the like.

Next, as shown in FIG. 4C, the nozzle plate 20 having the nozzle openings 21 formed on the surface of the flow path forming substrate 10 opposite to the piezoelectric element 300 is bonded with an adhesive or the like. Further, the compliance substrate 40 including the sealing film 41 and the fixing plate 42 on the reservoir forming substrate 30.
And the reservoir portion 31 is sealed.

Next, as shown in FIG. 4D, the drive IC 110 is mounted on the reservoir forming substrate 30. That is, the drive IC 110 is flip-chip mounted on the first and second drive wirings 121 and 122 to electrically connect the two.

Thereafter, as shown in FIGS. 5A and 5B, the connection wiring 14 is formed by wire bonding.
Form 0. That is, the connection wiring 140 electrically connects the second drive wiring 122, the lead electrode 90 drawn from each piezoelectric element 300, and the lead-out portion 61 of the lower electrode film 60.

Here, in this embodiment, the drive IC 110 is used.
The first drive wiring 121 and the second drive wiring 122 are electrically connected by flip-chip mounting. Therefore, the second drive wiring 122 and the lead electrode 90
Also, only the connection of the lower electrode film 60 to the lead-out portion 61 may be performed by wire bonding.

That is, the surface for bonding the connection wiring 140 is on the flow path forming substrate 10 and the reservoir forming substrate 3.
0 is only two surfaces, and therefore, when bonding the connection wiring 140, the monitoring camera 200 of the bonding apparatus is used.
If the position adjustment and the position adjustment of the capillary 201 (adjustment of the bonding position) are performed only once, the bonding of all the connection wirings 140 can be continuously performed.

Therefore, the manufacturing time of the connection wiring 140 can be shortened and the yield can be improved, so that the cost can be remarkably reduced.

(Other Embodiments) Although the respective embodiments of the present invention have been described above, the basic structure of the ink jet recording head is not limited to the above.

For example, in the above-described embodiment, the connection portion to which the external wiring is connected to the first drive wiring provided on the reservoir forming substrate is provided, but the present invention is not limited to this, and the connection portion may be, for example. May be provided on another substrate, and the connecting portion and the first drive wiring provided on the reservoir forming substrate may be connected by wire bonding.
In such a configuration, it is desirable that the height of the substrate provided with the connecting portion is the same as the height of the flow path forming substrate or the reservoir forming substrate.

Further, for example, in the above-mentioned embodiment, the thin film type ink jet recording head manufactured by applying the film forming and the lithographic process is taken as an example. However, the present invention is not limited to this. The present invention can also be applied to a thick film type ink jet recording head formed by a method such as attaching a green sheet.

The ink jet recording head of each of these embodiments constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on an ink jet recording apparatus. Figure 6
It is a schematic diagram showing an example of the ink jet type recording device.

As shown in FIG. 6, in the recording head units 1A and 1B having an ink jet recording head, the cartridges 2A and 2B constituting the ink supply means are detachably provided, and the recording head units 1A and 1B.
The carriage 3 on which B is mounted is provided on a carriage shaft 5 attached to the apparatus body 4 so as to be movable in the axial direction. The recording head units 1A and 1B are, for example,
The black ink composition and the color ink composition are respectively discharged.

Then, the driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears (not shown) and the timing belt 7, so that the carriage 3 having the recording head units 1A and 1B mounted thereon follows the carriage shaft 5. Be moved. On the other hand, a platen 8 is provided on the apparatus main body 4 along the carriage shaft 5, and a recording sheet S, which is a recording medium such as paper fed by a feed roller (not shown), is conveyed on the platen 8. It is like this.

[0062]

As described above, according to the present invention, the drive wiring provided on the bonding substrate and the drive IC are electrically connected by flip-chip mounting, and the drive wiring and the lead-out wiring pulled out from the piezoelectric element. Since they are electrically connected to each other by wire bonding, the piezoelectric element, the drive IC, and the external wiring can be electrically connected to each other relatively easily, so that the manufacturing efficiency and the yield are improved. Therefore, the manufacturing cost can be remarkably reduced.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an ink jet recording head according to a first embodiment of the invention.

2A and 2B are a plan view and a sectional view of the ink jet recording head according to the first embodiment of the invention.

FIG. 3 is a cross-sectional view showing the manufacturing process of the ink jet recording head according to the first embodiment of the invention.

FIG. 4 is a cross-sectional view showing the manufacturing process of the inkjet recording head according to the first embodiment of the invention.

FIG. 5 is a cross-sectional view showing the manufacturing process of the ink jet recording head according to the first embodiment of the invention.

FIG. 6 is a schematic diagram of an inkjet recording apparatus according to an embodiment of the present invention.

[Explanation of symbols]

10 Flow path forming substrate 12 Pressure generation chamber 20 nozzle plate 21 nozzle opening 30 Reservoir forming substrate 40 compliance board 60 Lower electrode film 70 Piezoelectric layer 80 Upper electrode film 90 Lead electrode 100 reservoir 110 drive IC 121 First drive wiring 121a connection part 122 Second drive wiring 130 external wiring 140 connection wiring

Claims (6)

[Claims] 1. A flow path forming substrate defining a pressure generating chamber communicating with a nozzle opening, and a lower electrode, a piezoelectric layer and an upper electrode provided on one surface side of the flow path forming substrate via a vibrating plate. An ink jet recording head having a piezoelectric element formed of: a bonding substrate on which a driving IC for driving the piezoelectric element, which is bonded to the piezoelectric element side of the flow path forming substrate, is mounted; The drive wiring is electrically connected to the drive wiring arranged on the substrate by flip-chip mounting, and the drive wiring and the extraction wiring drawn out from the piezoelectric element are electrically connected by wire bonding. Inkjet recording head. 2. The ink jet recording head according to claim 1, wherein a mounting portion that electrically connects the drive wiring and the external wiring is provided on the bonding substrate. 3. The piezoelectric substrate according to claim 1, wherein the bonding substrate has a piezoelectric element holding portion that seals the space in a state in which the space is secured so as not to hinder the movement of the piezoelectric element. Inkjet recording head. 4. The ink jet recording head according to claim 1, wherein the bonding substrate has a reservoir portion that constitutes at least a part of a common ink chamber of each pressure generating chamber. 5. The pressure generating chamber according to claim 1, wherein the pressure generating chamber is formed in a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed by film formation and a lithography method. An ink jet recording head characterized by being present. 6. An ink jet recording apparatus comprising the ink jet recording head according to claim 1.