JP2003080703A - Ink jet recording head and ink jet recorder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink jet recording head and an ink jet recorder in which the yield can be enhanced by preventing cracking of a substrate. SOLUTION: The ink jet recording head has a recording head body comprising a nozzle plate 20 having a plurality of nozzle openings for ejecting ink, a channel forming substrate 10 being bonded to the nozzle plate 20 thus forming pressure generating chambers 12 communicating with the nozzle openings, and piezoelectric elements 300 provided on the side of the channel forming substrate 10 opposite to the side being bonded to the nozzle plate 20. The recording head body comprises a substrate 30 being boded to the piezoelectric element 300 side of the channel forming substrate 10, and a mounting part for connecting a driving wire 130 of the piezoelectric element 300 electrically with an external wire 140 is provided on the bonding substrate 30. The channel forming substrate 10, and the like, are prevented from cracking at the time of connecting the external wire 140 with the driving wire 130 by clamping the external wire 140 between the bonding substrate 30 and a holding member 45 thereby securing it mechanically.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a vibrating plate which constitutes a part of a pressure generating chamber communicating with a nozzle opening for ejecting ink droplets, and a piezoelectric element is provided through the vibrating plate to displace the piezoelectric element. The present invention relates to an ink jet type recording head and an ink jet type recording apparatus for ejecting ink droplets.

[0002]

2. Description of the Related Art A part of a pressure generating chamber that communicates with a nozzle opening for ejecting ink droplets is composed of a vibrating plate, and the vibrating plate is deformed by a piezoelectric element to pressurize ink in the pressure generating chamber to eject it from the nozzle opening. Two types of inkjet recording heads that eject ink droplets have been put into practical use: one that uses a longitudinal vibration mode piezoelectric actuator that expands and contracts in the axial direction of a piezoelectric element, and one that uses a flexural vibration mode piezoelectric actuator. ing.

The former allows the volume of the pressure generating chamber to be changed by bringing the end face of the piezoelectric element into contact with the vibrating plate, and a head suitable for high-density printing can be manufactured. There is a problem in that the manufacturing process is complicated because a difficult process of matching the array pitch of the openings and cutting into comb teeth or a work of positioning and fixing the cut piezoelectric element in the pressure generating chamber are required.

On the other hand, in the latter, the piezoelectric element can be formed on the vibration plate by a relatively simple process of sticking a green sheet of a piezoelectric material in conformity with the shape of the pressure generating chamber and firing it. However, due to the use of flexural vibration, a certain area is required, and there is a problem that high-density arrangement is difficult.

On the other hand, in order to eliminate the disadvantage of the latter recording head, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique as disclosed in Japanese Patent Laid-Open No. 5-286131. It has been proposed that the piezoelectric material layer is cut into a shape corresponding to the pressure generating chamber by a lithographic method and a piezoelectric element is formed so as to be independent for each pressure generating chamber.

Further, such a piezoelectric element is bonded to, for example, a flow path forming substrate defining a pressure generating chamber or to the piezoelectric element side of the flow path forming substrate to form a common ink chamber of the pressure generating chamber. Is connected to the external wiring on the reservoir forming substrate on which the reservoir is formed. That is, the wiring electrode is extended from the piezoelectric element to the mounting portion provided in the vicinity of the end portion of the flow path forming substrate or the reservoir forming substrate, and the F
By connecting an external wiring such as a PC, the piezoelectric element and the external wiring are electrically connected via the wiring electrode.

[0007]

However, in the ink jet recording head having such a structure, heating is required when connecting the external wiring to the mounting portion, and the heat causes the flow path forming substrate or the reservoir forming substrate to be heated. There is a problem that warpage occurs and the substrate is cracked.

More specifically, the flow path forming substrate or the reservoir forming substrate is made of a material such as a silicon single crystal substrate which is relatively hard and easily cracked in order to form the pressure generating chamber or the reservoir with high accuracy and high density. Is used. On the other hand, the nozzle plate provided with the nozzle openings is made of, for example, a metal material such as stainless steel. When the external wiring is heated, there is a problem in that each member has a different thermal expansion coefficient, so that warpage occurs and the flow path forming substrate or the reservoir forming substrate is cracked.

In view of such circumstances, it is an object of the present invention to provide an ink jet type recording head and an ink jet type recording apparatus capable of preventing the substrate from cracking and improving the yield.

[0010]

According to a first aspect of the present invention for solving the above problems, a nozzle plate having a plurality of nozzle openings for ejecting ink, and a nozzle plate joined to the nozzle plates and communicating with the nozzle openings. A flow path forming substrate in which a pressure generating chamber is formed, and a piezoelectric element that is provided on a surface of the flow path forming substrate that is opposite to the bonding surface with the nozzle plate and that causes a pressure change in the pressure generating chamber. In an ink jet recording head including a recording head body having the recording head body, the recording head body has a bonding substrate bonded to the piezoelectric element side of the flow path forming substrate, and wiring for driving the piezoelectric element on the bonding substrate. A mounting portion for electrically connecting the electrode and the external wiring is provided, and the external wiring is sandwiched between the bonding substrate and the holding member and mechanically fixed. In an ink jet recording head is characterized.

In the first aspect, since heating is not required when mounting the external wiring, it is possible to prevent the flow path forming substrate or the bonding substrate from being cracked by the heat at this time.

A second aspect of the present invention is the head case according to the first aspect, wherein the holding member is joined to the joining substrate of the recording head body to fix the recording head body. And an inkjet recording head.

In the second aspect, the external wiring is mechanically fixed by being sandwiched between the joint substrate and the head case.

According to a third aspect of the present invention, in the first or second aspect, it further comprises a second holding member for holding the recording head body and the holding member and mechanically fixing them. It is a characteristic inkjet recording head.

In the third aspect, the external wiring can be more reliably fixed by the second holding member.

A fourth aspect of the present invention is the nozzle protection cover according to the first aspect, wherein the holding member is provided to cover the peripheral edge of the nozzle opening surface of the nozzle plate to protect the nozzle opening surface. The inkjet recording head is characterized by the fact that it is present.

In the fourth aspect, the external wiring is mechanically fixed by being sandwiched between the nozzle protection cover and the joining member.

A fifth aspect of the present invention is the ink jet recording head according to any one of the first to fourth aspects, characterized in that the external wiring and the connection wiring are provisionally joined.

In the fifth aspect, the fixing strength of the external wiring is significantly improved. Further, the external wiring can be fixed relatively easily by the holding member.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the pressure generating chamber is formed in a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed and formed. The inkjet recording head is characterized by being formed by a lithography method.

In the sixth aspect, an ink jet recording head having high density nozzle openings can be manufactured in a large amount and relatively easily.

A seventh aspect of the present invention is an ink jet recording apparatus comprising the ink jet recording head according to any one of the first to sixth aspects.

In the seventh aspect, it is possible to realize an ink jet recording apparatus in which the ink ejection characteristics of the head are stable and the reliability is improved.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below based on embodiments.

(Embodiment 1) FIG. 1 is an exploded perspective view showing an ink jet recording head according to Embodiment 1 of the present invention, FIG. 2 is a sectional view of FIG. 1, and FIG. It is a longitudinal cross-sectional view of the chamber, (b) is a cross-sectional view of the pressure generating chamber in the width direction.

As shown in the figure, the flow path forming substrate 10 constituting the recording head main body has a plane orientation (11) in this embodiment.
0) silicon single crystal substrate, and the flow path forming substrate 10
The pressure generating chambers 12 partitioned by the plurality of partition walls 11 are arranged in parallel in the width direction by anisotropically etching from one surface thereof. Further, on the outer side in the longitudinal direction of the pressure generating chamber 12, there is provided a communicating portion 13 that communicates with a reservoir portion 31 of a reservoir forming substrate 30 described later and constitutes a part of a reservoir that serves as a common ink chamber of each pressure generating chamber 12. Each of the pressure generating chambers 12 is formed and communicates with one end of the pressure generating chamber 12 in the longitudinal direction via the ink supply passage 14.

On the other surface of the flow path forming substrate 10,
Is, for example, silicon oxide (SiO 2 _Two), Etc., thickness
An elastic film 50 having a thickness of 1 to 2 μm is formed.

Here, the anisotropic etching is performed by utilizing the difference in etching rate of the silicon single crystal substrate. For example, in this embodiment, the silicon single crystal substrate is set to K.
When it is dipped in an alkaline solution such as OH, it is gradually eroded and the first (111) plane perpendicular to the (110) plane and the first (111) plane
Forms an angle of about 70 degrees with the (111) plane of
A second (111) plane that makes an angle of about 35 degrees with the (0) plane appears, and the etching rate of the (111) plane is about 1/180 of the etching rate of the (110) plane. Is done using. By such anisotropic etching, it is possible to perform precision machining based on the depth machining of the parallelogram shape formed by the two first (111) planes and the two diagonal second (111) planes. The pressure generating chambers 12 can be arranged in high density.

In this embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane, and the short side is formed by the second (111) plane. The pressure generating chamber 12 is provided in the flow path forming substrate 1
It is formed by etching through almost 0 to reach the elastic film 50. Here, the elastic film 50 is
The amount of the alkaline solution that etches the silicon single crystal substrate is extremely small. Further, each ink supply passage 14 communicating with one end of each pressure generation chamber 12 is formed shallower than the pressure generation chamber 12, and keeps the flow resistance of the ink flowing into the pressure generation chamber 12 constant. That is, the ink supply path 14 is formed by etching the silicon single crystal substrate halfway in the thickness direction (half etching). The half etching is performed by adjusting the etching time.

The thickness of the flow path forming substrate 10 in which the pressure generating chambers 12 and the like are formed is preferably selected in accordance with the density at which the pressure generating chambers 12 are arranged. For example, 180 per inch (180dp
When arranging the pressure generating chambers 12 to about i), the thickness of the flow path forming substrate 10 is preferably about 180 to 280 μm, and more preferably about 220 μm. Further, when the pressure generating chambers 12 are arranged at a relatively high density of, for example, about 360 dpi, the thickness of the flow path forming substrate 10 is preferably 100 μm or less. This is because the array density can be increased while maintaining the rigidity of the partition walls between the adjacent pressure generating chambers 12.

A nozzle plate 2 is formed on the opening surface side of the flow path forming substrate 10 with nozzle openings 21 communicating with the pressure generating chambers 12 on the side opposite to the ink supply paths 14.
0 is fixed via an adhesive or a heat-welding film. In the present embodiment, the nozzle plate 20 is made of, for example, non-rust steel having a thickness of 0.05 to 1 mm. The nozzle plate 20 also serves as a reinforcing plate that completely covers one surface of the flow path forming substrate 10 with one surface and protects the silicon single crystal substrate from impact and external force.

On the other hand, on the elastic film 50 provided on the flow path forming substrate 10, a lower electrode film 60 having a thickness of, for example, about 0.2 μm and a thickness of, for example, about 0.5 to 3 μm. The piezoelectric layer 70 and the upper electrode film 80 having a thickness of, for example, about 0.1 μm are laminated and formed in a process described later to form the piezoelectric element 30.
Configures 0. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. Generally, one of the electrodes of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. Further, here, a portion which is composed of one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric strain is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In the present embodiment, the lower electrode film 60 is the common electrode of the piezoelectric element 300, and the upper electrode film 80 is the individual electrode of the piezoelectric element 300.
There is no problem in reversing this due to the driving circuit and wiring.
In any case, the piezoelectric active portion is formed for each pressure generating chamber. Further, here, the piezoelectric element 300 and the vibration plate that is displaced by the driving of the piezoelectric element 300 are collectively referred to as a piezoelectric actuator.

Further, in this embodiment, the lead electrode 90 is formed from the vicinity of one longitudinal end of the upper electrode film 80 of the piezoelectric element 300.
Is extended to a region facing the peripheral wall of the pressure generating chamber 12, and the lead electrode 90 is electrically connected to a drive circuit 110 provided on the reservoir forming substrate 30, which will be described in detail later.

That is, the piezoelectric element 3 of the flow path forming substrate 10
A reservoir forming substrate 30 having a reservoir portion 31 forming at least a part of the reservoir 100 is bonded to the 00 side. In the present embodiment, the reservoir portion 31 is
The reservoir forming substrate 30 is formed so as to penetrate in the thickness direction and extend in the width direction of the pressure generating chamber 12. The reservoir portion 31 is communicated with the communication portion 13 of the flow path forming substrate 10 via the communication hole 51 that penetrates the elastic film 50 and the lower electrode film 60, and the common ink of each pressure generating chamber 12 is communicated. A reservoir 100 serving as a chamber is configured.

On the other hand, the piezoelectric element 3 of the reservoir forming substrate 30
In a region facing 00, a piezoelectric element holding portion 32 is provided that can seal the space while ensuring a space that does not hinder the movement of the piezoelectric element 300. Then, the piezoelectric element 300 is sealed in the piezoelectric element holding portion 32,
The destruction of the piezoelectric element 300 due to the external environment such as moisture in the atmosphere is prevented.

As the reservoir forming substrate 30, it is preferable to use a material having substantially the same coefficient of thermal expansion as that of the passage forming substrate 10 such as glass or ceramic material. It was formed using a silicon single crystal substrate of the same material as the formation substrate 10. As a result, it is possible to surely bond the two even if they are bonded at a high temperature using a thermosetting adhesive.

A compliance substrate 40 including a sealing film 41 and a fixing plate 42 is joined to the reservoir forming substrate 30. Here, the sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm), and the sealing film 41 seals one surface of the reservoir portion 31. It has been stopped. Further, like the nozzle plate 20, the fixing plate 42 is formed of, for example, a metal material such as stainless steel (SUS), and its thickness is preferably equal to or more than that of the nozzle plate 20.

An area of the fixing plate 42 facing the reservoir 100 is an opening 43 which is completely removed in the thickness direction, and one surface of the reservoir 100 is composed of only a flexible sealing film 41. The flexible portion 33 is sealed and can be deformed by a change in internal pressure.

A drive circuit 110 such as a semiconductor integrated circuit (IC) for driving the piezoelectric element 300 is mounted in a region of the reservoir forming substrate 30 facing the piezoelectric element holding portion 32. The drive circuit 110 is electrically connected to the lead electrode 90 extending from each piezoelectric element 300 by wire bonding or the like.

More specifically, a through hole 34 that penetrates the reservoir forming substrate 30 in the thickness direction is provided between the reservoir portion 31 of the reservoir forming substrate 30 and the piezoelectric element holding portion 32, and inside the through hole 34. The tip of each lead electrode 90 is exposed. Then, each of the lead electrodes 90 and the drive circuit 110 are electrically connected by a connection wiring 120 formed of a bonding wire extending in the through hole 34.

Further, on the reservoir forming substrate 30, a drive wiring 130, one end of which is connected to the drive circuit 110, is extended along the direction in which the pressure generating chambers 12 are arranged in parallel to the vicinity of the end of the reservoir forming substrate 30. There is. And this drive wiring 13
For example, a flexible cable (FP
The mounting portion is connected to the external wiring 140 such as C).

That is, a head case 45 for fixing the recording head body is bonded on the reservoir forming substrate 30 and the compliance substrate 40 of the recording head body thus constructed. This head case 4
5 has a recess 46 for accommodating the drive circuit 110, the connection wiring 120, etc., and the bottom surface of this recess 46 has the external wiring 1
A through hole 47 for drawing out 40 is formed.

The external wiring 140 is sandwiched between the reservoir forming substrate 30 and the head case 45 when the head case 45 is joined to the reservoir forming substrate 30 and the compliance substrate 40 with an adhesive or the like. Is mechanically fixed by and is drawn out from the inside of the recess 46 through a through hole 47 provided in the head case 45.

As described above, the external wiring 140 is mechanically fixed by being sandwiched between the reservoir forming substrate 30 and the head case 45, and the external wiring 140 and the drive wiring 1 are provided.
By electrically connecting 30 to each other, both can be surely connected without heating. Therefore, when connecting the drive wiring 130 and the external wiring 140, the flow path forming substrate 10 and the reservoir forming substrate 30 are not heated, so that cracks do not occur in these substrates.

Further, it is preferable that the external wiring 140 and the drive wiring 130 are temporarily bonded to each other before the reservoir forming substrate 30 and the head case 45 are bonded to each other. Further, it is preferable that the external wiring 140 and the driving wiring 130 are joined at a temperature at which cracks do not occur in the flow path forming substrate 10, the reservoir forming substrate 30 and the like. The two were joined by heating the agent (AFC) to about 100 ° C.

As another method, the passivation layer on the surface of the joint between the drive wiring 130 and the external wiring 140 is removed by, for example, argon plasma cleaning, and then the atoms are directly attached to each other without applying heat. You may make it join.

In this way, the external wiring 140 and the drive wiring 13
By temporarily bonding 0 and then mechanically fixing,
Since both can be connected more reliably, it is possible to prevent the occurrence of connection failure and improve reliability. In addition, since the external wiring 140 and the drive wiring 130 are bonded to each other in advance, the bonding between the reservoir forming substrate 30 and the head case 45 becomes relatively easy, so that the manufacturing efficiency can be improved.

When the external wiring 140 and the driving wiring 130 are bonded at a relatively low temperature, the bonding strength becomes relatively low, but the external wiring 140 and the driving wiring 130 are
As described above, the reservoir forming substrate 30 and the head case 4
There is no problem because it is mechanically fixed by being sandwiched between the two.

Such an ink jet recording head takes in ink from an external ink supply means (not shown) and fills the interior from the reservoir 100 to the nozzle openings 21 with ink, and then a recording signal from an external drive circuit (not shown). Accordingly, a voltage is applied between the upper electrode film 80 and the lower electrode film 60, and the elastic film 50, the lower electrode film 60, and the piezoelectric layer 70 are flexibly deformed.
The internal pressure increases and ink droplets are ejected from the nozzle openings 21.

(Embodiment 2) FIG. 3 is a sectional view showing a main part of an ink jet recording head according to Embodiment 2. As shown in FIG.

The present embodiment is an example in which the external wiring is more firmly mechanically fixed. As shown in FIG. 3, in the present embodiment, the flow path forming substrate 10, the nozzle plate 20, and the reservoir forming are formed. Recording head body composed of substrate 30 and compliance substrate 40 and head case 4
5, the recording head body and the head case 4
5 is the same as that of the first embodiment except that a fixing member 150 that engages with the recording head body 5 to mechanically fix the recording head main body and the head case 45 is further provided.

With this structure, the recording head body and the head case 45 can be firmly fixed to each other, so that the reservoir forming substrate 30 and the head case 45 can be fixed.
The external wiring 140 sandwiched between and can also be more firmly fixed. Therefore, it is possible to reliably prevent a connection failure or the like between the external wiring 140 and the drive wiring 130, and improve the reliability.

(Embodiment 3) FIG. 4 is a sectional view showing a main part of an ink jet recording head according to Embodiment 3. As shown in FIG.

The present embodiment is an example in which the external wiring 140 is mechanically fixed by the nozzle protection cover 160 for protecting the nozzle opening surface of the nozzle plate 20.

That is, as shown in FIG. 4, in this embodiment, the head case 45A has a size large enough to seal the drive circuit 110, and the drive wiring 130 and the external wiring 14 are provided.
The area to be the mounting portion for 0 is exposed to the outside. Further, the nozzle protection cover 160 is provided so as to include the recording head body including the flow path forming substrate 10, the nozzle plate 20, the reservoir forming substrate 30, and the compliance substrate 40, and the nozzle opening is provided on the nozzle plate 20 side. Has an opening 161 for exposing. The external wiring 140 is mechanically fixed by being sandwiched between the nozzle protection cover 160 and the reservoir forming substrate 30, whereby the drive wiring 130 and the external wiring 140 are electrically connected. .

With such a structure, it is possible to prevent the flow path forming substrate 10 and the reservoir forming substrate 30 from being cracked when the external wiring 140 is mounted, as in the above embodiment.

(Other Embodiments) Although the respective embodiments of the present invention have been described above, of course, the present invention is not limited to these embodiments.

For example, in the above-described embodiment, the external wiring is sandwiched and mechanically fixed by the reservoir forming substrate and the head case or the nozzle protection cover, but the invention is not limited to this, and in any case, Any member may be used as long as the external wiring is mechanically fixed.

Further, for example, although the above-described embodiment exemplifies the thin film type ink jet recording head which can be manufactured by applying the film formation and the lithographic process, of course, the invention is not limited to this and, for example, Various types such as those that form pressure generating chambers by laminating substrates, those that form a piezoelectric layer by attaching green sheets or screen printing, or those that form a piezoelectric layer by crystal growth such as hydrothermal method The present invention can be applied to an ink jet recording head having the above structure.

As described above, the present invention can be applied to ink jet recording heads having various structures as long as it does not violate the gist thereof.

The ink jet recording head of each of these embodiments constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on an ink jet recording apparatus. Figure 5
It is a schematic diagram showing an example of the ink jet type recording device.

As shown in FIG. 5, in the recording head units 1A and 1B having an ink jet recording head, the cartridges 2A and 2B constituting the ink supply means are detachably provided, and the recording head units 1A and 1B.
The carriage 3 on which B is mounted is provided on a carriage shaft 5 attached to the apparatus body 4 so as to be movable in the axial direction. The recording head units 1A and 1B are, for example,
The black ink composition and the color ink composition are respectively discharged.

The driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears (not shown) and the timing belt 7, so that the carriage 3 having the recording head units 1A and 1B mounted thereon follows the carriage shaft 5. Be moved. On the other hand, a platen 8 is provided on the apparatus body 4 along the carriage 3. The platen 8 can be rotated by the driving force of a paper feed motor (not shown) so that the recording sheet S, which is a recording medium such as paper fed by a paper feed roller or the like, is conveyed on the platen 8. Has become.

[0064]

As described above, according to the present invention, the external wiring is mechanically fixed by being sandwiched between the bonding substrate and the holding member so that the external wiring and the drive wiring are electrically connected. Therefore, the drive wiring and the external wiring can be reliably connected without heating. Therefore,
It is possible to prevent cracks from occurring in the flow path forming substrate and the like when connecting the drive wiring and the external wiring.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an ink jet recording head according to a first embodiment of the invention.

FIG. 2 is a sectional view of the ink jet recording head according to the first embodiment of the invention.

FIG. 3 is a sectional view of an ink jet recording head according to a second embodiment of the invention.

FIG. 4 is a sectional view of an ink jet recording head according to a third embodiment of the invention.

FIG. 5 is a schematic diagram of an inkjet recording apparatus according to an embodiment of the present invention.

[Explanation of symbols]

10 Flow path forming substrate 12 Pressure generation chamber 13 Communication 14 Ink supply path 20 nozzle plate 30 Reservoir forming substrate 40 compliance board 45 head case 50 elastic membrane 60 Lower electrode film 70 Piezoelectric layer 80 Upper electrode film 90 Lead electrode 110 drive circuit 120 connection wiring 130 drive wiring 140 external wiring 150 fixing member 160 nozzle protection cover 300 Piezoelectric element

Claims (7)

[Claims] 1. A nozzle plate having a plurality of nozzle openings for ejecting ink, a flow path forming substrate bonded to the nozzle plate and having a pressure generating chamber communicating with the nozzle opening, and a flow path forming substrate. An ink jet recording head comprising a recording head body having a piezoelectric element that is provided on a surface opposite to a surface of a substrate that is joined to the nozzle plate and that causes a pressure change in the pressure generating chamber, wherein the recording head body is A mounting portion is provided which has a bonding substrate bonded to the piezoelectric element side of the flow path forming substrate, and electrically connects the wiring electrode for driving the piezoelectric element and the external wiring on the bonding substrate, and An ink jet recording head, wherein the external wiring is sandwiched between the bonding substrate and a holding member and mechanically fixed. 2. The ink jet recording head according to claim 1, wherein the holding member is a head case that is bonded to the bonding substrate of the recording head body to fix the recording head body. 3. The ink jet recording head according to claim 1, further comprising a second holding member that holds the recording head main body and the holding member and mechanically fixes them. 4. The ink jet recording according to claim 1, wherein the holding member is a nozzle protection cover which is provided to cover a peripheral edge of a nozzle opening surface of the nozzle plate and protects the nozzle opening surface. head. 5. The ink jet recording head according to claim 1, wherein the external wiring and the connection wiring are temporarily joined. 6. The pressure generating chamber according to claim 1, wherein the pressure generating chamber is formed in a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed by film formation and a lithography method. An ink jet recording head characterized by being present. 7. An ink jet recording apparatus comprising the ink jet recording head according to claim 1.