KR101552976B1 - An emi shield film and method for fabricating the same - Google Patents

Abstract

The purpose of the present invention is to provide a method for manufacturing an EMI shielding sheet and the EMI shielding sheet manufactured thereby, capable of maintaining shielding performance and obtaining high bending properties, high chemical resistance, high heat resistance, and the easing of the attachment of an FPCB. The EMI shielding sheet according to the present invention includes a conductive adhesive layer (10), a shielding layer (20) which is stacked on one side of the conductive adhesive layer (10), and a protection layer (30) which is stacked on the shielding layer (20). The conductive adhesive layer (10) includes 0.5 to 30 parts by weight of conductive polymer and 30 to 150 parts by weight of conductive filler with regard to 100 parts by weight of binder resin composite.

Description

FIELD OF THE INVENTION [0001] The present invention relates to an electromagnetic wave shielding sheet,

The present invention relates to a method of shielding a printed circuit board (PCB), a flexible printed circuit board (FPCB), and the like, which are attached to and used in electronic components and devices in various electronic devices such as computers, communication devices, printers, mobile phones, To an electromagnetic wave shielding sheet and a manufacturing method thereof.

In recent years, the tendency of short-time shortening of electronic devices for portable mobile and display has been rapidly progressed, the speed of signal transmission between components in the device has been accelerated, and circuit boards have become more dense and micro- EMI, and electromagnetic interference) are increasing.

In order to effectively block such electromagnetic waves, it is necessary to cover the substrate circuit with a conductor film having excellent electrical conductivity, and to devise such that the electromagnetic wave generated from the inside can be attenuated through the conductor. The shielding method of such an electronic device is a shielding film method, Silver paste is coated on a printed circuit board, and a sputtering method in which metal particles are attached to a printed circuit board. In view of processability, reliability, and high performance, a sheet- Do.

As such a shielding sheet, a base film and a shielding layer (conductive layer) laminated thereon are used as a basic structure. Further, a reinforcing film for handling is provided on the base film side, It is common to attach a protective film.

In recent years, in the case of a flexible printed circuit board in which repeated bending characteristics are required, in the case of a metal thin film or a liquid paste paste, the bending property is poor and the application is limited, and the adhesive sheet with excellent heat resistance and excellent bendability and electrical conductivity The product demand of the shape is greatly increasing.

1, a conductive adhesive layer 8a and, if necessary, a shielding layer 8 of a metal thin film layer 8b are formed on one surface of the cover film 7. The electromagnetic shielding adhesive sheet of the first prior art, And a heat-resistant solvent-resistant adhesive layer (10) and a releasability-enhancing film (6) are sequentially laminated on the other surface (see Japanese Patent Application Laid-Open No. 2003-298285).

That is, in the past, by forming the adhesive film together with the plastic film using a thermoplastic adhesive on one side of the cover film 7, the adhesive force during heating and pressing increases and the strength of the adhesive layer itself decreases, There has been a problem of remaining on one side of the cover film 7. However, in the case of the first prior art, the heat-resistant / solvent-resistant adhesive layer 10 is used instead of the thermoplastic adhesive, will be.

However, in the case of the above first conventional technique, the cover film (7 in Fig. 1) used for the reinforcing shielding film is made of an engineering plastic such as polyphenylene sulfide (PPS), polyester, aromatic aramid plastic), so that the thickness of the cover film (7 in Fig. 1) is thick (for example, 12 占 퐉) and the rigidity is large. For this reason, the bending resistance of the cover film is lowered, and the bending resistance of the entire shielding film is deteriorated.

2, a shielding layer having a conductive adhesive layer (3) or a metal thin film (2) and a base film (1) made of an aromatic polyamide resin are used as the electromagnetic wave shielding adhesive sheet of the second prior art Shielding films are also known (see Japanese Patent Application Laid-Open No. 2004-273577).

In the case of the second prior art, the base film and the shielding layer used for the shielding film are made of an aromatic polyamide resin instead of polyphenylene sulfide (PPS), although the flexibility is improved. However, Is formed by the combination of the metal thin film 2 formed in contact with the base film 1 and the conductive adhesive layer 3 formed on the metal thin film 2 so that the bending resistance is still not good and, My bendability is also bad.

Japanese Patent Application Laid-Open No. 2003-298285 Japanese Patent Application Laid-Open No. 2004-273577

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an electromagnetic wave shielding sheet having high flexibility, chemical resistance, excellent heat resistance, and easiness in attaching an FPCB while shielding performance is still maintained. And an electromagnetic wave shielding sheet made of the same.

According to an aspect of the present invention, there is provided an electromagnetic wave shielding sheet comprising a conductive adhesive layer, a shielding layer laminated on one side of the conductive adhesive layer, A separation film 50 laminated on the upper surface of the protection layer 30 and a protection film 40 laminated on the lower surface of the conductive adhesive layer 10 Wherein the conductive adhesive layer (10) comprises 0.5 to 30 parts by weight of a conductive polymer and 30 to 150 parts by weight of a conductive filler based on 100 parts by weight of the binder resin composition, wherein the conductive filler , Silver powder, copper powder, nickel powder, iron powder, carbon, and carbon nanotubes Wherein the shielding layer (20) is a mixed conductive filler in which spherical and plate-like particle shapes are mixed, and the shielding layer (20) is composed of carbon black or carbon nanotube (CNT) Wherein the conductive filler of the conductive adhesive layer (10) has a particle size of 10 탆 or less and the insulating filler in the shielding layer (20) has a particle size of 5 탆 or less And the protective layer 30 is made of an ultraviolet curable resin to which an ultraviolet curing type acrylic copolymer is applied. The shielding layer 20 is formed by applying the insulating filler to at least one kind of binder resin selected from thermosetting resins, The composition for a shielding layer is formed by drying at 100 to 150 ° C for 2 to 5 minutes, and the conductive adhesive layer (10) is formed by applying a thermoplastic resin and at least one thermosetting resin The composition for a conductive adhesive layer coated with the conductive filler and the conductive polymer and stirred and then coated on the mixed binder resin is dried at 60 to 200 ° C for 10 seconds to 20 minutes and the thickness of the protective layer 30 is 4 μm The thickness of the shielding layer 20 is 2 占 퐉 to 10 占 퐉 and the thickness of the conductive adhesive layer is 5 占 퐉 to 20 占 퐉 and the thickness of the separation film 50 and the protective film 40 is Each having a thickness of 35 mu m to 100 mu m.

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According to another aspect of the present invention, there is provided a method of manufacturing an electromagnetic wave shielding sheet, wherein the shielding layer (20) ° C for 2 minutes to 5 minutes, and the conductive adhesive layer 10 is formed by drying the coated composition for a conductive adhesive layer at 110 to 160 ° C for 1 minute to 5 minutes.

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According to the present invention, there is provided a method of manufacturing an electromagnetic wave shielding sheet which is excellent in electromagnetic wave shielding performance, excellent in bending property, chemical resistance, heat resistance, and easy to adhere to FPCB.

Specifically, the protective layer of the present invention can enhance the function of the shielding layer because the protective layer protects the shielding layer from physical and chemical aspects from the external environment and has a self-insulating function.

In the present invention, the conductive polymer in the conductive adhesive layer is in the form of a very flexible gel and does not deteriorate the shielding function because it keeps connection with the conductive filler in spite of repetitive bending for a long time.

Other objects and advantages of the present invention will become apparent from the detailed description of the embodiments with reference to the attached drawings.

1 is a sectional view of an electromagnetic wave shielding film of a first prior art.
2 is a sectional view of a second prior art electromagnetic wave shielding film.
3 is a sectional view of an electromagnetic wave shielding sheet according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. It is to be understood that the invention is not limited to the disclosed embodiments and various changes and modifications may be made by those skilled in the art.

3 is a cross-sectional view of an electromagnetic wave shielding sheet which is an electrically conductive adhesive sheet for electromagnetic wave shielding according to a preferred embodiment of the present invention.

3, the electromagnetic wave shielding sheet according to the present invention includes a conductive adhesive layer 10, a shielding layer 20 laminated on one surface of the conductive adhesive layer 10, and a protective layer 30 laminated on the shielding layer 20, Structure. Further, the electromagnetic wave shielding sheet according to the present invention preferably further includes a separation film 50 laminated on the upper surface of the protective layer, and a protective film 40 laminated on the lower surface of the conductive adhesive layer.

The electromagnetic wave shielding sheet according to a preferred embodiment of the present invention will now be described by dividing it into a conductive adhesive layer 10, a shielding layer 20, a protective layer 30, a protective film 40 and a separation film 50.

In the shielding sheet of the present invention, the protective layer 30 is excellent in abrasion resistance after peeling off the separation film 50 corresponding to a kind of transfer paper to prevent wear and breakage of the shielding layer 20, The shielding layer 20 can be protected from other contaminants. In addition, the protective layer 30 has excellent blocking resistance and does not stick to other parts during a process requiring heating.

The protective layer 30 is made of a thermosetting or ultraviolet curable resin, preferably an ultraviolet curable acrylic copolymer. After curing, strong chemical bonds between the resin components and strong molecular bonding force of the three-dimensional network network structure are generated, resulting in excellent abrasion resistance, heat resistance and chemical resistance.

The thickness of the protective layer is suitably from 2 탆 to 50 탆, preferably from 4 to 20 탆. If the thickness is smaller than the thickness, the separation film 50 may be too thin and torn when peeling off the protective film 20, and the protective function of the shielding layer 20 is deteriorated. When the thickness is thicker than the above-mentioned thickness, the flexibility may be lowered.

According to the shielding sheet of the present invention, a shielding layer 20 laminated on one surface of the conductive adhesive layer 10 is included. The shielding layer 20 is formed of a binder resin composition and a composition for a shielding layer (conductive) composition containing carbon black or carbon nanotube (CNT) powder. When the shielding film is adhered on a foundation including a printed circuit, cracking of the hard layer can be prevented by a cushioning effect of the shielding layer 20.

As the resin used in the composition for a shielding layer, at least one resin selected from thermosetting resins can be used. Preferably, a heat-resistant acrylic resin, an epoxy resin or a polyurethane resin can be used.

The insulating filler in the shielding layer 20 protects the surface of the conductive adhesive layer 10 in the electromagnetic wave shielding sheet according to the present invention and prevents the possibility of electric short-circuiting from the external environment. Considering the economical aspect, it is more preferable to use a carbon black or a carbon nanotube material, particularly a particle size of 5 占 퐉 or less, which facilitates particle dispersion. The amount of the insulating filler is preferably 5 to 30 parts by weight based on 100 parts by weight of the binder resin composition. When the filler is 5 parts by weight or less, It is difficult to uniformly disperse and uniformly insulate. In addition, the volume fraction of the filler is increased, and the brittleness of the electromagnetic wave shielding sheet is increased, and cracks are easily generated in the shielding layer under repeated bending loads.

The carbon black that can be used as the filler of the present invention is not particularly limited as long as it is a commercialized product.

The shielding layer 20 may have a thickness of 1 占 퐉 to 50 占 퐉, preferably 2 占 퐉 to 10 占 퐉 in consideration of an easy implementation of the bendability. If the thickness is thinner than the above-mentioned thickness, the resin flow (resin floor) property of the shielding layer is low and it can be torn to the circuit step of the printed circuit board. If it is thicker than this thickness, the ductility of the shielding layer is lowered and the slide flexing property may be lowered.

The insulating composition can be coated by a method such as a comma coating, a gravure coating, a slot die coating, and a micro gravure coating. In the present invention, the coating composition is coated by a micro gravure coating method, And dried at 100 to 150 ° C for 2 to 5 minutes to obtain a cured shielding layer 20.

In the shielding sheet of the present invention, the separation film 50 laminated on the upper surface of the protection layer 30 and the protection film 40 laminated on the lower surface of the conductive adhesive layer 10 may be further included. The film prevents the electromagnetic wave shielding sheet from being contaminated by foreign substances from the external environment and protects the surface when attached to the FPCB at high temperature. In order to facilitate the peeling of the film from the electromagnetic wave shielding sheet, a base film formed of a material such as polyolefin or polyethylene terephthalate may be used, or a surface treated with a releasing agent such as silicone or fluorine may be used.

It may be preferable that the film has a thickness of 35 to 100 탆 from the viewpoint of solving the shrinkage problem occurring when the protective layer and the shielding layer are coated and improving the FPCB workability.

The conductive adhesive layer 10 is formed of a conductive adhesive layer composition including a mixed composition of a binder resin and a conductive polymer and a mixed conductive filler. The content is preferably 0.5 to 30 parts by weight of the conductive polymer and 30 to 150 parts by weight of the mixed conductive filler based on 100 parts by weight of the binder resin composition.

In the conductive adhesive layer composition, at least one resin selected from a thermoplastic resin and a thermosetting resin may be used as the resin, and the thermoplastic resin may be at least one selected from the group consisting of a polystyrene series resin, a vinyl acetate series resin, a polyester series resin, a polyolefin series resin, , Acrylic resin, and the like, and the thermosetting resin includes a phenol resin, an epoxy resin, a urethane resin, a melamine resin, and the like. Preferably, a polyester resin, an epoxy resin, a urethane resin, and an acrylic resin may be used alone or in combination.

In the thermoplastic resin, the acrylic copolymer is mutually bonded so that a film or sheet-like layer can be formed in a state where components of the binder resin composition are mixed in a state before curing, and is uniformly dispersed in the film or sheet layer after curing Thereby uniformly distributing and relaxing the stress generated in the film or sheet layer under the bending fatigue condition applied to the circuit board.

The thermosetting resin has excellent flowability due to a rapidly decreased viscosity before curing in heating and increases the flowability of the entire composition of the binder resin. After the thermal curing, chemical bonding reaction between the components of the thermosetting resin progresses, And the heat resistance and the moisture resistance of the film layer are increased.

The conductive polymer may be selected from the group consisting of polythiophene, derivatives of poly (3,4-ethylenedioxythiophene), polyaniline, polypyrrole and derivatives thereof, It is possible to use a polymer having polyacetylene, polyphenylene, polyphenylene, and conjugated structure.

It is said that the conductive polymer is preferably 0.5 to 30 parts by weight (more preferably 3 to 30 parts by weight) with respect to 100 parts by weight of the binder resin composition. When the content is less than the above content, the probability of the electrical contact is lowered The conductivity of the conductive adhesive layer is deteriorated. When the content is higher than the above range, the degree of crosslinking is lowered, and a transfer problem may occur when the separator is separated from the separator film, and the heat resistance is lowered. As the conductive polymer, for example, JI-65, which is an antistatic agent for a synthetic resin binder, may be used.

The conductive filler in the form of particles constituting the conductive filler is composed of at least one powder selected from the group consisting of gold powder, silver powder, copper powder, nickel powder, iron powder, carbon, and carbon nanotube excellent in electric conductivity . The conductive filler in the form of a particle may have a specific shape such as a spherical shape, a plate shape, and an amorphous shape, and it is preferable to mix the spherical shape and the plate shape appropriately in view of forming an electrical contact. The conductive filler preferably has a particle size of 10 mu m or less. In general, the thickness of the conductive adhesive layer is maintained in the range of 5 to 100 탆 from the viewpoint of realizing the bending property. When the particle size of the conductive filler in the form of particles is less than 10 탆, the probability of forming an electrical contact is lowered and the electrical conductivity may be lowered. Polymers offset this. However, if it exceeds 10 탆, the added particle size is too large as compared with the conductive adhesive layer thickness, and it may be difficult to obtain a conductive adhesive layer having uniform thickness and physical properties.

The amount of the conductive filler is preferably 30 to 150 parts by weight based on 100 parts by weight of the binder resin composition. If the content is less than the above range, the effect of increasing electrical contact formation is not sufficient. If the content is larger than the above range, It is difficult to uniformly disperse by the development.

The conductive adhesive layer may have a thickness of 5 占 퐉 to 20 占 퐉. If the thickness is thinner than the above-mentioned thickness, the step can not be filled and the coating film can be torn. If it is thicker than the above thickness, the bending property may be lowered.

Coating the composition of the conductive adhesive layer 10 on the shielding layer 20 and then drying to form a conductive adhesive layer on the shielding layer.

The composition of the conductive adhesive layer may be coated using a comma coating, a slot die coater, a lip-die coater, a gravure coater, a micro gravure coater, or a lip-die coating as a high viscosity.

In the present invention, it is possible to carry out the coating at a temperature of 60 to 200 ° C for 10 seconds to 20 minutes. In the present invention, the coating may be performed by a comma coating method, preferably at a temperature of 110 to 160 ° C for 1 to 5 minutes And the composition for the coated conductive adhesive layer is dried at 150 ° C for 3 to 5 minutes to form a semi-cured state.

The protective film may be provided on the conductive adhesive layer by coating the conductive adhesive layer composition and then laminating the protective film on the conductive adhesive layer composition. Alternatively, a protective film may be prepared by coating a composition for a conductive adhesive layer on the protective film and laminating the same with a shielding layer.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following examples are intended to explain the present invention more clearly and do not limit the scope of protection of the present invention.

[Example 1]

The protective layer 30 is prepared by coating 100 parts by weight of a UV curable acrylate copolymer on a 50 탆 polyester film 50 so as to have a thickness of 4.5 탆 after curing.

The shielding layer 20 was prepared by adding a proper amount of methyl ethyl ketone / toluene (5: 5) to a stirrer, adding 100 parts by weight of a polyester resin and 20 parts by weight of carbon and a curing agent and stirring to obtain a binder resin composition solution. The obtained binder solution was coated on the protective layer 30 with a bar coater and dried at 120 DEG C for 2 minutes to prepare a sheet having a thickness of 3.5 mu m.

To the conductive adhesive layer 10, an appropriate amount of toluene was added to a stirrer, and a thermoplastic resin, a thermosetting resin, a curing agent, and a curing accelerator were sequentially added and stirred to obtain a binder resin composition solution. Then, 100 parts by weight of the binder resin composition, 3 parts by weight of the conductive polymer, 20 parts by weight of the silver powder and 10 parts by weight of the copper powder were mixed with each other and then stirred.

The prepared solution was coated on the shielding layer 20 with a bar coater and dried at 130 DEG C for 3 minutes to prepare an electrically conductive adhesive sheet having a thickness of 10 mu m.

Table 1 shows the components and contents of the binder resin composition prepared in Examples 1 to 5 and Comparative Example 1, and the contents (in terms of parts) of the conductive adhesive layer and the shielding layer.

Polyester Film: Toray advanced material XB35

Carbon: Ebonic Carbon Black Korea HIBLACK 5L (particle diameter 35 nm)

Polyester resin: BURIM CHEMICAL, GR-HK4706

Thermoplastic resin 1: Polyester resin (ES-300, ES-300)

Thermosetting resin 1: Epoxy (Kukdo Chemical YD-127, equivalent: 183 g / eq, softening point: -)

Thermosetting resin 2: Bisphenol A epoxy (National Chemical Co. YD-012, equivalent: 650 g / eq, softening point: 85 캜)

Thermosetting resin 3: Cresol novolac epoxy (National Chemical Co., Ltd. YDCN-500-4P, equivalent: 206 g / eq, softening point: 63 캜)

Conductive Polymer: JI-65 (Sino-Japanese Oil Painting)

Copper powder: CUSP20 (Joining M 2 탆)

Silver powder: JSP-2F (JC 3μm)

(Evaluation of physical properties of electromagnetic wave shielding sheet)

The abrasion resistance, electrical conductivity, flexural strength, adhesive force, and heat resistance of the electromagnetic wave shielding sheet 10 prepared in Examples 1 to 5 and Comparative Example 1 were evaluated based on the following physical property evaluation methods, and the results are shown in Table 2.

① Wear resistance

After the electromagnetic wave shielding sheet was cut to a width of 20 mm and a length of 50 mm, the conductive adhesive layer (10) was cut on the copper foil surface of CCL (Copper Clad Laminate; copper foil thickness 35 m, polyimide film thickness 25 m) ) Were contacted with each other and cured at 160 DEG C for 1 hour to prepare a specimen for abrasion resistance measurement.

The electromagnetic wave shielding sheet is attached so that the shielding layer 20 faces upward and is reciprocated 1500 times under a condition of a reciprocating distance of 40 mm under a load of 500 g using a friction member. And the degree of abrasion was determined as follows. The results are shown in Table 2 using the following symbols.

?: No change in the surface of the shielding layer (good)

△: scratch marks on some shielding layer surfaces

X: The shielding layer is worn out and the lower conductive adhesive layer is exposed (defective)

② Electrical conductivity

A CCL terminal having a width of 5 mm and a length of 30 mm and having a hole having a diameter of 1 mm and a length of 30 mm was arranged side by side on the cover layer so as to have a hole interval of 50 mm and a step portion was disposed between the CCL terminals, And the conductive adhesive layer of the shielding sheet was covered, and then cured at 160 DEG C for 1 hour to prepare a specimen for electrical conductivity measurement.

Thereafter, the resistance between the CCL terminals was measured using a tester.

At this time, the stepped portion may be variously modified to 50, 100, 200, 400 탆 or the like.

③ Flexibility

The test piece for flexurality measurement was prepared by curing at 160 DEG C for 1 hour while the conductive adhesive layer was covered on the side of the cover layer of the CCL terminal having the circuit pattern having the width of 75 mu m and the length of 80 mm. After driving at a reciprocating distance of 20 mm at a reciprocating speed of 60 times per second while maintaining a bending radius of 1.0 mm, the electrical resistance according to the number of reciprocations was measured using a tester (in this case, a millimeter meter) % Was evaluated as the bending performance of the electrically conductive shielding sheet.

④ Adhesion

The electrically conductive shielding sheet was cured at 160 DEG C for 1 hour by bringing the conductive adhesive layer into contact with the copper foil surface of the single-sided CCL terminal 220 (copper foil 1 oz / PI film 1 mil) to prepare an adhesive force measurement specimen. After cutting to a width of 10 mm and a length of 50 mm, the adhesive strength of the adhesive sheet was measured by measuring the strength while peeling the electrically conductive shielding sheet at an angle of 180 with a tensile strength tester.

⑤ Heat resistance

In order to evaluate the soldering heat resistance of the electrically conductive shielding sheet, a specimen attached to the cross-sectional CCL was prepared in the same manner as the specimen for adhesion strength measurement. The specimen was cut into 20 mm width and 20 mm length, And the deformation and bubble formation on the surface of the adhesive film were evaluated according to the following criteria, and they are shown in Table 2.

○: No bubble formation or surface deformation (good)

Δ: No bubble formation, but surface deformation observed

X: Both bubble formation and surface deformation were observed (poor)

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Of course.

10: Conductive adhesive layer ( including conductive polymer) 20: Shielding layer (carbon black layer)
30: protective layer 40: protective film (release sheet)
50: Separation film (transfer paper)

Claims (10)

A conductive adhesive layer 10,
A shielding layer 20 laminated on one surface of the conductive adhesive layer 10,
A protective layer 30 laminated on the shield layer 20,
A separation film 50 laminated on the upper surface of the protective layer 30,
And a protective film (40) laminated on a lower surface of the conductive adhesive layer (10), the electromagnetic shielding sheet
The conductive adhesive layer 10 may include 0.5 to 30 parts by weight of the conductive polymer and 30 to 150 parts by weight of the conductive filler based on 100 parts by weight of the binder resin composition,
The conductive filler may be at least two kinds of conductive powders selected from the group consisting of gold powder, silver powder, copper powder, nickel powder, iron powder, carbon, and carbon nanotube Wherein the mixed conductive filler is a mixed conductive filler in which spherical and plate-
The shielding layer 20 comprises 5 to 30 parts by weight of an insulating filler composed of at least one material selected from carbon black or carbon nanotube (CNT) powder per 100 parts by weight of the binder resin composition,
The conductive filler of the conductive adhesive layer 10 has a particle size of 10 mu m or less,
In the shielding layer 20, the insulating filler has a particle size of 5 mu m or less,
The protective layer 30 is made of an ultraviolet curable resin to which an ultraviolet curing type acrylic copolymer is applied,
The shielding layer 20 is formed by drying a composition for a shielding layer coated with at least one kind of binder resin selected from thermosetting resins and stirring the applied insulating filler at 100 to 150 ° C for 2 to 5 minutes,
The conductive adhesive layer 10 is prepared by mixing the conductive filler and the conductive polymer into a binder resin in which a thermoplastic resin and at least one thermosetting resin are mixed and stirring and coating the conductive adhesive layer composition at a temperature of 60 to 200 ° C for 10 seconds to 20 seconds Lt; / RTI > minutes,
The thickness of the protective layer 30 is 4 탆 to 20 탆,
The thickness of the shielding layer 20 is 2 탆 to 10 탆,
The thickness of the conductive adhesive layer is 5 占 퐉 to 20 占 퐉,
Wherein the thickness of the separation film (50) and the thickness of the protective film (40) are respectively 35 占 퐉 to 100 占 퐉. delete delete delete delete delete delete delete delete A method of manufacturing the electromagnetic wave shielding sheet according to claim 1,
The shielding layer 20 is formed by drying the coated composition for shield layer at 100 to 150 ° C for 2 to 5 minutes,
Wherein the conductive adhesive layer (10) is formed by drying the coated composition for a conductive adhesive layer at 110 to 160 ° C for 1 minute to 5 minutes.

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