HK1245567A1 - Anisotropic conductive connection structure, anisotropic conductive connection method, and anisotropic conductive adhesive - Google Patents

Anisotropic conductive connection structure, anisotropic conductive connection method, and anisotropic conductive adhesive

Info

Publication number
HK1245567A1
HK1245567A1 HK18104540.7A HK18104540A HK1245567A1 HK 1245567 A1 HK1245567 A1 HK 1245567A1 HK 18104540 A HK18104540 A HK 18104540A HK 1245567 A1 HK1245567 A1 HK 1245567A1
Authority
HK
Hong Kong
Prior art keywords
anisotropic conductive
conductive connection
connection structure
connection method
adhesive
Prior art date
Application number
HK18104540.7A
Other languages
Chinese (zh)
Inventor
大關裕樹
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1245567A1 publication Critical patent/HK1245567A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
HK18104540.7A 2015-03-20 2018-04-06 Anisotropic conductive connection structure, anisotropic conductive connection method, and anisotropic conductive adhesive HK1245567A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015058068A JP2016178225A (en) 2015-03-20 2015-03-20 Anisotropic conductive connection structure, anisotropic conductive connection method, and anisotropic conductive adhesive
PCT/JP2016/057473 WO2016152543A1 (en) 2015-03-20 2016-03-09 Anisotropic conductive connection structure, anisotropic conductive connection method, and anisotropic conductive adhesive

Publications (1)

Publication Number Publication Date
HK1245567A1 true HK1245567A1 (en) 2018-08-24

Family

ID=56977311

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18104540.7A HK1245567A1 (en) 2015-03-20 2018-04-06 Anisotropic conductive connection structure, anisotropic conductive connection method, and anisotropic conductive adhesive

Country Status (6)

Country Link
JP (1) JP2016178225A (en)
KR (1) KR101991191B1 (en)
CN (2) CN107432084A (en)
HK (1) HK1245567A1 (en)
TW (1) TWI690250B (en)
WO (1) WO2016152543A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6604035B2 (en) * 2015-05-27 2019-11-13 ブラザー工業株式会社 Liquid ejection device and method of manufacturing liquid ejection device
GB2539684B (en) * 2015-06-24 2018-04-04 Dst Innovations Ltd Method of surface-mounting components
JP2018088498A (en) * 2016-11-29 2018-06-07 デクセリアルズ株式会社 Anisotropic Conductive Adhesive
CN113168935B (en) * 2018-11-21 2023-06-30 三井化学株式会社 Anisotropic conductive sheet, anisotropic conductive composite sheet, anisotropic conductive sheet set, electrical inspection device, and electrical inspection method
JP2021036575A (en) * 2018-12-17 2021-03-04 東芝ホクト電子株式会社 Light-emitting device, protecting method of junction part, manufacturing method of light-emitting device, and vehicle lamp
WO2023171294A1 (en) * 2022-03-08 2023-09-14 株式会社村田製作所 Stretchable device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541091U (en) * 1991-10-31 1993-06-01 住友ベークライト株式会社 Anisotropic conductive crimping device
JP2000165009A (en) * 1998-11-30 2000-06-16 Optrex Corp Electrode terminal connecting structure
JP3792554B2 (en) 2001-03-26 2006-07-05 シャープ株式会社 Display module and flexible wiring board connection method
JP3947532B2 (en) * 2004-07-08 2007-07-25 住友ベークライト株式会社 Anisotropic conductive adhesive film
JP2009135388A (en) 2007-10-30 2009-06-18 Hitachi Chem Co Ltd Circuit connecting method
CN104059547B (en) * 2008-09-30 2016-08-24 迪睿合电子材料有限公司 Anisotropic conductive adhesive and use the preparation method of connection structural bodies of this binding agent
JP5140816B2 (en) * 2009-03-31 2013-02-13 デクセリアルズ株式会社 JOINT BODY AND MANUFACTURING METHOD
JP5559723B2 (en) * 2011-02-23 2014-07-23 積水化学工業株式会社 Method for manufacturing connection structure

Also Published As

Publication number Publication date
KR20170113622A (en) 2017-10-12
TWI690250B (en) 2020-04-01
WO2016152543A1 (en) 2016-09-29
CN115151035A (en) 2022-10-04
CN107432084A (en) 2017-12-01
JP2016178225A (en) 2016-10-06
KR101991191B1 (en) 2019-06-19
TW201644337A (en) 2016-12-16

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