SG11201705711QA - Anisotropic conductive film - Google Patents
Anisotropic conductive filmInfo
- Publication number
- SG11201705711QA SG11201705711QA SG11201705711QA SG11201705711QA SG11201705711QA SG 11201705711Q A SG11201705711Q A SG 11201705711QA SG 11201705711Q A SG11201705711Q A SG 11201705711QA SG 11201705711Q A SG11201705711Q A SG 11201705711QA SG 11201705711Q A SG11201705711Q A SG 11201705711QA
- Authority
- SG
- Singapore
- Prior art keywords
- conductive film
- anisotropic conductive
- anisotropic
- film
- conductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015004597 | 2015-01-13 | ||
PCT/JP2016/050858 WO2016114314A1 (en) | 2015-01-13 | 2016-01-13 | Anisotropic conductive film |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201705711QA true SG11201705711QA (en) | 2017-08-30 |
Family
ID=56405855
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201909698R SG10201909698RA (en) | 2015-01-13 | 2016-01-13 | Anisotropic conductive film |
SG11201705711QA SG11201705711QA (en) | 2015-01-13 | 2016-01-13 | Anisotropic conductive film |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201909698R SG10201909698RA (en) | 2015-01-13 | 2016-01-13 | Anisotropic conductive film |
Country Status (8)
Country | Link |
---|---|
US (2) | US11591499B2 (en) |
JP (3) | JP6394613B2 (en) |
KR (3) | KR101929951B1 (en) |
CN (2) | CN110265174B (en) |
PH (1) | PH12017501262A1 (en) |
SG (2) | SG10201909698RA (en) |
TW (2) | TWI787601B (en) |
WO (1) | WO2016114314A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7052254B2 (en) * | 2016-11-04 | 2022-04-12 | デクセリアルズ株式会社 | Filler-containing film |
SG10201909698RA (en) * | 2015-01-13 | 2019-11-28 | Dexerials Corp | Anisotropic conductive film |
WO2017191772A1 (en) * | 2016-05-05 | 2017-11-09 | デクセリアルズ株式会社 | Filler alignment film |
JP6187665B1 (en) * | 2016-10-18 | 2017-08-30 | デクセリアルズ株式会社 | Anisotropic conductive film |
JP7256351B2 (en) * | 2016-11-30 | 2023-04-12 | デクセリアルズ株式会社 | Conductive particle arrangement film, manufacturing method thereof, inspection probe unit, continuity inspection method |
CN116253914A (en) * | 2016-12-01 | 2023-06-13 | 迪睿合株式会社 | Filler-containing film |
JP7047282B2 (en) | 2016-12-01 | 2022-04-05 | デクセリアルズ株式会社 | Filler-containing film |
US20190279935A1 (en) * | 2016-12-29 | 2019-09-12 | Intel Corporation | Semiconductor package having package substrate containing non-homogeneous dielectric layer |
CN116505675A (en) * | 2017-09-15 | 2023-07-28 | 台达电子工业股份有限公司 | DC brushless motor fan |
JP7020029B2 (en) * | 2017-09-28 | 2022-02-16 | 昭和電工マテリアルズ株式会社 | Conductive adhesive film |
WO2019074060A1 (en) * | 2017-10-12 | 2019-04-18 | 富士フイルム株式会社 | Composite material |
KR102254470B1 (en) * | 2018-07-12 | 2021-05-21 | 에이치엔에스하이텍(주) | Manufacturing method for anisotropic conductive adhesive film |
CN109943253B (en) * | 2019-03-29 | 2020-08-18 | 京东方科技集团股份有限公司 | Anisotropic conductive adhesive, preparation method and display device |
JP6794591B1 (en) * | 2019-05-20 | 2020-12-02 | タツタ電線株式会社 | Conductive adhesive sheet |
US20230287248A1 (en) * | 2020-07-29 | 2023-09-14 | 3M Innovative Properties Company | Electrically Conductive Adhesive Film |
CN112898776B (en) * | 2021-01-22 | 2022-12-02 | 镇江中垒新材料科技有限公司 | Anisotropic conductive sheet and preparation method thereof |
WO2023152840A1 (en) * | 2022-02-09 | 2023-08-17 | 株式会社レゾナック | Member for forming wiring, method for forming wiring layer using member for forming wiring, and wiring forming member |
WO2023153443A1 (en) * | 2022-02-09 | 2023-08-17 | 株式会社レゾナック | Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring member |
JP2024040759A (en) * | 2022-09-13 | 2024-03-26 | デクセリアルズ株式会社 | Manufacturing method of individual film, individual film, and display device manufacturing method and display device |
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US4731282A (en) * | 1983-10-14 | 1988-03-15 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film |
JPS62229714A (en) * | 1986-03-31 | 1987-10-08 | 日東電工株式会社 | Anisotropic conductive sheet |
JPS63102110A (en) | 1986-10-17 | 1988-05-07 | 富士ゼロックス株式会社 | Anisotropic conductor and making thereof |
JPS6414886A (en) | 1987-07-09 | 1989-01-19 | Ricoh Kk | Bond for terminal connection and connecting method |
US20010046021A1 (en) * | 1997-08-28 | 2001-11-29 | Takeshi Kozuka | A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device |
JP3491595B2 (en) | 2000-02-25 | 2004-01-26 | ソニーケミカル株式会社 | Anisotropic conductive adhesive film |
JP2001307555A (en) | 2000-04-17 | 2001-11-02 | Sony Corp | Anisotropic conductive film, its assembly method, and circuit board using the same |
JP2004035686A (en) * | 2002-07-02 | 2004-02-05 | Bridgestone Corp | Anisotropic electrically conductive film |
JP2004164692A (en) * | 2002-11-08 | 2004-06-10 | Toshiba Corp | Magnetic recording medium and manufacturing method thereof |
JP5196703B2 (en) | 2004-01-15 | 2013-05-15 | デクセリアルズ株式会社 | Adhesive film |
WO2006075381A1 (en) * | 2005-01-14 | 2006-07-20 | Renesas Technology Corp. | Camera module and semiconductor device |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
JP4887700B2 (en) | 2005-09-09 | 2012-02-29 | 住友ベークライト株式会社 | Anisotropic conductive film and electronic / electrical equipment |
JP4720814B2 (en) * | 2007-10-29 | 2011-07-13 | 住友電気工業株式会社 | Wiring board connection method |
JP5934109B2 (en) | 2010-01-11 | 2016-06-15 | フレクストロニクス エイピー エルエルシーFlextronics Ap,Llc | Camera module with molded tape flip chip imaging device mounting and manufacturing method |
JP5471504B2 (en) | 2010-01-25 | 2014-04-16 | 日立化成株式会社 | Anisotropic conductive film |
JP2012099729A (en) | 2010-11-04 | 2012-05-24 | Toshiba Corp | Template, method of forming template, and method of manufacturing semiconductor device |
JP5310750B2 (en) | 2011-01-19 | 2013-10-09 | デクセリアルズ株式会社 | Anisotropic conductive film |
JP5685473B2 (en) | 2011-04-06 | 2015-03-18 | デクセリアルズ株式会社 | Anisotropic conductive film, method for manufacturing bonded body, and bonded body |
JP5803393B2 (en) | 2011-08-02 | 2015-11-04 | 日立化成株式会社 | Insulating coated conductive particles and anisotropic conductive adhesive film |
JP2013110226A (en) * | 2011-11-18 | 2013-06-06 | Lasertec Corp | Alignment method and manufacturing method of mask |
JP5737278B2 (en) * | 2011-12-21 | 2015-06-17 | 日立化成株式会社 | Circuit connection material, connection body, and method of manufacturing connection body |
JP5939918B2 (en) | 2012-07-20 | 2016-06-22 | 矢崎総業株式会社 | In-vehicle camera device |
KR20170044766A (en) | 2012-08-01 | 2017-04-25 | 데쿠세리아루즈 가부시키가이샤 | Method for manufacturing anisotropically conductive film, anisotropically conductive film, and connective structure |
CN104541416B (en) * | 2012-08-24 | 2017-07-04 | 迪睿合电子材料有限公司 | The manufacture method and anisotropic conductive film of anisotropic conductive film |
KR101716945B1 (en) * | 2012-08-24 | 2017-03-15 | 데쿠세리아루즈 가부시키가이샤 | Anisotropic conductive film and manufacturing method therefor |
JP5964187B2 (en) | 2012-09-18 | 2016-08-03 | デクセリアルズ株式会社 | Anisotropic conductive film, connection method, and joined body |
JP2014102943A (en) * | 2012-11-19 | 2014-06-05 | Dexerials Corp | Anisotropic conductive film, connection method and joined body |
KR101474123B1 (en) * | 2013-04-23 | 2014-12-17 | 삼성전기주식회사 | Printed circuit board and camera module |
CN105359342B (en) * | 2013-07-31 | 2018-02-23 | 迪睿合株式会社 | Anisotropic conductive film and its manufacture method |
JP6119718B2 (en) * | 2013-11-19 | 2017-04-26 | デクセリアルズ株式会社 | Anisotropic conductive film and connection structure |
JP5682720B2 (en) * | 2014-03-27 | 2015-03-11 | デクセリアルズ株式会社 | Anisotropic conductive adhesive film and manufacturing method thereof |
SG10201909698RA (en) * | 2015-01-13 | 2019-11-28 | Dexerials Corp | Anisotropic conductive film |
-
2016
- 2016-01-13 SG SG10201909698R patent/SG10201909698RA/en unknown
- 2016-01-13 TW TW109113326A patent/TWI787601B/en active
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- 2016-01-13 KR KR1020187035936A patent/KR102276325B1/en active IP Right Grant
- 2016-01-13 US US15/541,881 patent/US11591499B2/en active Active
- 2016-01-13 KR KR1020217021181A patent/KR102542797B1/en active IP Right Grant
- 2016-01-13 CN CN201910329405.2A patent/CN110265174B/en active Active
- 2016-01-13 JP JP2016004456A patent/JP6394613B2/en active Active
- 2016-01-13 WO PCT/JP2016/050858 patent/WO2016114314A1/en active Application Filing
- 2016-01-13 SG SG11201705711QA patent/SG11201705711QA/en unknown
- 2016-01-13 CN CN201680004711.3A patent/CN107112067B/en active Active
- 2016-01-13 TW TW105101043A patent/TWI694128B/en active
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JP6489516B2 (en) | 2019-03-27 |
TWI787601B (en) | 2022-12-21 |
CN107112067A (en) | 2017-08-29 |
CN110265174B (en) | 2022-06-28 |
WO2016114314A1 (en) | 2016-07-21 |
TW201700664A (en) | 2017-01-01 |
TW202313881A (en) | 2023-04-01 |
US20180002575A1 (en) | 2018-01-04 |
KR20170088985A (en) | 2017-08-02 |
CN110265174A (en) | 2019-09-20 |
JP6504307B1 (en) | 2019-04-24 |
CN107112067B (en) | 2019-04-16 |
JP2019087536A (en) | 2019-06-06 |
SG10201909698RA (en) | 2019-11-28 |
JP2016131152A (en) | 2016-07-21 |
KR102542797B1 (en) | 2023-06-14 |
KR20210088023A (en) | 2021-07-13 |
US20230159797A1 (en) | 2023-05-25 |
TWI694128B (en) | 2020-05-21 |
PH12017501262A1 (en) | 2018-01-15 |
TW202033698A (en) | 2020-09-16 |
KR101929951B1 (en) | 2018-12-18 |
KR20180135110A (en) | 2018-12-19 |
JP6394613B2 (en) | 2018-09-26 |
US11591499B2 (en) | 2023-02-28 |
KR102276325B1 (en) | 2021-07-13 |
JP2018200880A (en) | 2018-12-20 |
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