SG11201606126RA - Conductive adhesive film - Google Patents
Conductive adhesive filmInfo
- Publication number
- SG11201606126RA SG11201606126RA SG11201606126RA SG11201606126RA SG11201606126RA SG 11201606126R A SG11201606126R A SG 11201606126RA SG 11201606126R A SG11201606126R A SG 11201606126RA SG 11201606126R A SG11201606126R A SG 11201606126RA SG 11201606126R A SG11201606126R A SG 11201606126RA
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive film
- conductive adhesive
- conductive
- film
- adhesive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014176359 | 2014-08-29 | ||
| PCT/JP2015/072709 WO2016031551A1 (en) | 2014-08-29 | 2015-08-10 | Conductive adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201606126RA true SG11201606126RA (en) | 2016-09-29 |
Family
ID=55399448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201606126RA SG11201606126RA (en) | 2014-08-29 | 2015-08-10 | Conductive adhesive film |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20170152411A1 (en) |
| EP (1) | EP3081610B1 (en) |
| JP (1) | JP6382228B2 (en) |
| KR (1) | KR101914849B1 (en) |
| CN (1) | CN106574151B (en) |
| HU (1) | HUE054751T2 (en) |
| MY (1) | MY178733A (en) |
| PH (1) | PH12017500373A1 (en) |
| SG (1) | SG11201606126RA (en) |
| WO (1) | WO2016031551A1 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017069559A (en) * | 2015-09-30 | 2017-04-06 | 日東電工株式会社 | Manufacturing method for power semiconductor device |
| JP2017069558A (en) * | 2015-09-30 | 2017-04-06 | 日東電工株式会社 | Manufacturing method for power semiconductor device |
| JP6864505B2 (en) * | 2016-06-24 | 2021-04-28 | 日東電工株式会社 | Heat-bonding sheet and heat-bonding sheet with dicing tape |
| JP6918445B2 (en) * | 2016-06-24 | 2021-08-11 | 日東電工株式会社 | Heat-bonding sheet and heat-bonding sheet with dicing tape |
| WO2017221613A1 (en) * | 2016-06-24 | 2017-12-28 | 日東電工株式会社 | Heat bonding sheet, and heat bonding sheet with dicing tape |
| JP6815132B2 (en) * | 2016-08-31 | 2021-01-20 | 日東電工株式会社 | Sheet for heat bonding and sheet for heat bonding with dicing tape |
| JP6858519B2 (en) * | 2016-09-21 | 2021-04-14 | 日東電工株式会社 | Sheet for heat bonding and sheet for heat bonding with dicing tape |
| EP3524228A4 (en) | 2016-10-04 | 2020-05-06 | Dow Silicones Corporation | Cosmetic composition or external composition, and cosmetic raw material composition |
| JP7005906B2 (en) * | 2017-02-21 | 2022-01-24 | 昭和電工マテリアルズ株式会社 | Multi-layer resin sheet, manufacturing method of multi-layer resin sheet, multi-layer resin sheet cured product, multi-layer resin sheet laminate, and multi-layer resin sheet laminate cured product |
| JP7219434B2 (en) * | 2018-04-27 | 2023-02-08 | 国立研究開発法人産業技術総合研究所 | Method for producing cyclic siloxane compound, cyclic siloxane compound, composition, and heat-resistant material |
| JP7198479B2 (en) * | 2018-08-31 | 2023-01-04 | 学校法人早稲田大学 | Semiconductor device bonding structure, method for producing semiconductor device bonding structure, and conductive bonding agent |
| US11414548B2 (en) * | 2019-01-22 | 2022-08-16 | Northeastern University | Enhanced radiation shielding with conformal, lightweight nanoparticle-polymer composite |
| CN112912192B (en) | 2019-03-15 | 2023-03-21 | 古河电气工业株式会社 | Composition containing metal particles and conductive adhesive film |
| EP4001373A4 (en) * | 2019-07-16 | 2023-08-09 | Furukawa Electric Co., Ltd. | Bonding film, tape for wafer processing, method for producing bonded object, and bonded object and pasted object |
| CN112358827A (en) * | 2020-11-10 | 2021-02-12 | 无锡帝科电子材料股份有限公司 | Preparation method of high-performance conductive adhesive |
| JP2022083853A (en) | 2020-11-25 | 2022-06-06 | パナソニックＩｐマネジメント株式会社 | Joint material and mounting structure using the same |
| CN117120573A (en) * | 2021-03-26 | 2023-11-24 | 日产化学株式会社 | Adhesive composition, laminate, method for producing laminate, and method for producing semiconductor substrate |
| WO2023080027A1 (en) * | 2021-11-02 | 2023-05-11 | 昭栄化学工業株式会社 | Thermosetting conductive resin composition and method for producing electronic component |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10208919A (en) * | 1997-01-22 | 1998-08-07 | Sumitomo Metal Mining Co Ltd | Resin-bonded magnet composition |
| US6706219B2 (en) * | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| JP3730209B2 (en) | 2002-11-14 | 2005-12-21 | 株式会社東郷製作所 | Conductive adhesive |
| JP4970767B2 (en) * | 2005-10-26 | 2012-07-11 | リンテック株式会社 | Insulating sheet for conductive bonding sheet, conductive bonding sheet, method for manufacturing conductive bonding sheet, and method for manufacturing electronic composite component |
| JP2008303253A (en) * | 2007-06-06 | 2008-12-18 | Diabond Industry Co Ltd | Silicone self-adhesive composition, screen printed matter using the same, and manufacturing method for the composition |
| JP5337034B2 (en) * | 2007-08-10 | 2013-11-06 | 旭化成イーマテリアルズ株式会社 | Adhesives and joints |
| JP2009227716A (en) * | 2008-03-19 | 2009-10-08 | Unitika Ltd | Polyarylate resin composition |
| JP2009242508A (en) * | 2008-03-31 | 2009-10-22 | Asahi Kasei E-Materials Corp | Adhesive and bonded body |
| CN102414831B (en) | 2009-03-11 | 2015-09-30 | 信越化学工业株式会社 | The connection sheet of electrode of solar battery, the manufacture method of solar module and solar module |
| KR101223350B1 (en) | 2010-01-08 | 2013-01-16 | 히다치 가세고교 가부시끼가이샤 | Circuit connecting adhesion film and circuit connecting structure |
| JP2012169573A (en) * | 2011-02-17 | 2012-09-06 | Furukawa Electric Co Ltd:The | Dicing die bond sheet and processing method of sapphire substrate for led |
| JP2013221082A (en) | 2012-04-17 | 2013-10-28 | Shin-Etsu Chemical Co Ltd | Addition-curing type silicone resin composition, and sheet comprising the composition, sheet-like cured product, and die attach material |
| US20140120356A1 (en) * | 2012-06-18 | 2014-05-01 | Ormet Circuits, Inc. | Conductive film adhesive |
-
2015
- 2015-08-10 JP JP2015557250A patent/JP6382228B2/en active Active
- 2015-08-10 WO PCT/JP2015/072709 patent/WO2016031551A1/en active Application Filing
- 2015-08-10 HU HUE15835176A patent/HUE054751T2/en unknown
- 2015-08-10 MY MYPI2016702285A patent/MY178733A/en unknown
- 2015-08-10 CN CN201580045111.7A patent/CN106574151B/en active Active
- 2015-08-10 KR KR1020167033469A patent/KR101914849B1/en active IP Right Grant
- 2015-08-10 EP EP15835176.7A patent/EP3081610B1/en active Active
- 2015-08-10 SG SG11201606126RA patent/SG11201606126RA/en unknown
-
2017
- 2017-02-09 US US15/428,580 patent/US20170152411A1/en not_active Abandoned
- 2017-02-28 PH PH12017500373A patent/PH12017500373A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016031551A1 (en) | 2016-03-03 |
| MY178733A (en) | 2020-10-20 |
| EP3081610B1 (en) | 2021-04-28 |
| HUE054751T2 (en) | 2021-09-28 |
| EP3081610A1 (en) | 2016-10-19 |
| US20170152411A1 (en) | 2017-06-01 |
| CN106574151A (en) | 2017-04-19 |
| EP3081610A4 (en) | 2017-08-23 |
| KR101914849B1 (en) | 2018-11-02 |
| PH12017500373B1 (en) | 2017-07-17 |
| PH12017500373A1 (en) | 2017-07-17 |
| JPWO2016031551A1 (en) | 2017-04-27 |
| KR20170005430A (en) | 2017-01-13 |
| JP6382228B2 (en) | 2018-08-29 |
| CN106574151B (en) | 2020-06-09 |
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