HK1198448A1 - Anisotropic conductive film, connecting method and joined structure - Google Patents

Anisotropic conductive film, connecting method and joined structure

Info

Publication number
HK1198448A1
HK1198448A1 HK14111980A HK14111980A HK1198448A1 HK 1198448 A1 HK1198448 A1 HK 1198448A1 HK 14111980 A HK14111980 A HK 14111980A HK 14111980 A HK14111980 A HK 14111980A HK 1198448 A1 HK1198448 A1 HK 1198448A1
Authority
HK
Hong Kong
Prior art keywords
conductive film
anisotropic conductive
connecting method
joined structure
joined
Prior art date
Application number
HK14111980A
Other languages
Chinese (zh)
Inventor
林慎
田中祐治
冢尾怜司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of HK1198448A1 publication Critical patent/HK1198448A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
HK14111980A 2013-04-04 2014-11-27 Anisotropic conductive film, connecting method and joined structure HK1198448A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013078773A JP6180159B2 (en) 2013-04-04 2013-04-04 Anisotropic conductive film, connection method, and joined body

Publications (1)

Publication Number Publication Date
HK1198448A1 true HK1198448A1 (en) 2015-04-24

Family

ID=51667590

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14111980A HK1198448A1 (en) 2013-04-04 2014-11-27 Anisotropic conductive film, connecting method and joined structure

Country Status (5)

Country Link
JP (1) JP6180159B2 (en)
KR (2) KR101618949B1 (en)
CN (1) CN104099031B (en)
HK (1) HK1198448A1 (en)
TW (1) TWI588235B (en)

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KR101941386B1 (en) * 2014-11-12 2019-01-22 데쿠세리아루즈 가부시키가이샤 Heat-curable adhesive composition
JP2017117864A (en) * 2015-12-22 2017-06-29 日立化成株式会社 First-supply type underfill material and cured product thereof, and electronic component device and manufacturing method thereof
SG11201909029YA (en) * 2017-04-28 2019-10-30 Hitachi Chemical Co Ltd Sealing film, sealed structure, and method for producing sealed structure
CN109651987A (en) * 2018-12-17 2019-04-19 深圳市华星光电技术有限公司 A kind of anisotropy conductiving glue sticks agent and its conductive film
JP7292225B2 (en) 2019-07-19 2023-06-16 日本ゼオン株式会社 Acrylic rubber sheet with excellent workability
JP7284110B2 (en) 2019-07-19 2023-05-30 日本ゼオン株式会社 Acrylic rubber veil with excellent storage stability and water resistance
JP7296328B2 (en) 2019-07-19 2023-06-22 日本ゼオン株式会社 Acrylic rubber veil with excellent storage stability and workability
JP7296329B2 (en) 2019-07-19 2023-06-22 日本ゼオン株式会社 Acrylic rubber sheet with excellent storage stability and workability
JP7284109B2 (en) 2019-07-19 2023-05-30 日本ゼオン株式会社 Acrylic rubber sheet with excellent storage stability and water resistance
JP7233388B2 (en) 2019-07-19 2023-03-06 日本ゼオン株式会社 Acrylic rubber veil with excellent storage stability and workability
JP2021072375A (en) * 2019-10-31 2021-05-06 昭和電工マテリアルズ株式会社 Support tape for substrate transfer, and manufacturing method for electronic apparatus device

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
JPH0652715A (en) * 1992-07-30 1994-02-25 Fuji Kobunshi Kogyo Kk Anisotropic conductive adhesive composite
JPH10168412A (en) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd Anisotropically conductive adhesive
JP2000129218A (en) * 1998-10-26 2000-05-09 Nitto Denko Corp Sheet-like adhesive composition, electronic component device prepared by using same, and method of repairing the device
JP2006199824A (en) 2005-01-20 2006-08-03 Soken Chem & Eng Co Ltd Anisotropic conductive adhesive tape and anisotropic conductive bonded circuit board
JP4697194B2 (en) * 2006-10-13 2011-06-08 日立化成工業株式会社 Solar cell connection method and solar cell module
KR101024467B1 (en) * 2006-10-17 2011-03-23 히다치 가세고교 가부시끼가이샤 Coated particle and method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive film
JP4807523B2 (en) * 2006-10-31 2011-11-02 ソニーケミカル＆インフォメーションデバイス株式会社 Sheet-like soft magnetic material and method for producing the same
JP4869915B2 (en) * 2006-12-28 2012-02-08 京セラケミカル株式会社 Compound bulletproof board
JP2008231287A (en) * 2007-03-22 2008-10-02 Toray Ind Inc Adhesive composition for semiconductor device, adhesive sheet using the same, tape with adhesive agent for semiconductor, and copper-clad laminate
JP5222490B2 (en) * 2007-04-25 2013-06-26 デクセリアルズ株式会社 Anisotropic conductive film and connection structure
JP5226562B2 (en) 2008-03-27 2013-07-03 デクセリアルズ株式会社 Anisotropic conductive film, joined body and method for producing the same
CN102017816A (en) * 2008-04-28 2011-04-13 日立化成工业株式会社 Circuit connecting material, film-like adhesive, adhesive reel, and circuit connecting structural body
JP2010143988A (en) * 2008-12-17 2010-07-01 Toagosei Co Ltd Adhesive composition and cover-lay film and flexible copper-clad laminate using the same
KR101138799B1 (en) * 2009-08-20 2012-04-24 제일모직주식회사 Composition For Anisotropic Conductive Film
JP5293779B2 (en) * 2010-07-20 2013-09-18 日立化成株式会社 Adhesive composition, circuit connection structure, semiconductor device and solar cell module
JP5768454B2 (en) 2011-04-14 2015-08-26 デクセリアルズ株式会社 Anisotropic conductive film
JP2013177564A (en) * 2012-02-08 2013-09-09 Nitto Denko Corp Heat-conductive sheet, particle aggregate powder for forming heat-conductive sheet and method for producing them
TW201522591A (en) * 2013-11-28 2015-06-16 Nitto Denko Corp Sealing thermosetting-resin sheet and hollow-package manufacturing method

Also Published As

Publication number Publication date
KR101618949B1 (en) 2016-05-09
CN104099031A (en) 2014-10-15
JP2014201657A (en) 2014-10-27
KR20160006641A (en) 2016-01-19
CN104099031B (en) 2017-04-12
TW201512364A (en) 2015-04-01
KR20140120855A (en) 2014-10-14
JP6180159B2 (en) 2017-08-16
TWI588235B (en) 2017-06-21

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