HK1198448A1 - 各向異性導電膜、連接方法及接合體 - Google Patents

各向異性導電膜、連接方法及接合體

Info

Publication number
HK1198448A1
HK1198448A1 HK14111980A HK14111980A HK1198448A1 HK 1198448 A1 HK1198448 A1 HK 1198448A1 HK 14111980 A HK14111980 A HK 14111980A HK 14111980 A HK14111980 A HK 14111980A HK 1198448 A1 HK1198448 A1 HK 1198448A1
Authority
HK
Hong Kong
Prior art keywords
conductive film
anisotropic conductive
connecting method
joined structure
joined
Prior art date
Application number
HK14111980A
Other languages
English (en)
Inventor
林慎
田中祐治
冢尾怜司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of HK1198448A1 publication Critical patent/HK1198448A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
HK14111980A 2013-04-04 2014-11-27 各向異性導電膜、連接方法及接合體 HK1198448A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013078773A JP6180159B2 (ja) 2013-04-04 2013-04-04 異方性導電フィルム、接続方法、及び接合体

Publications (1)

Publication Number Publication Date
HK1198448A1 true HK1198448A1 (zh) 2015-04-24

Family

ID=51667590

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14111980A HK1198448A1 (zh) 2013-04-04 2014-11-27 各向異性導電膜、連接方法及接合體

Country Status (5)

Country Link
JP (1) JP6180159B2 (zh)
KR (2) KR101618949B1 (zh)
CN (1) CN104099031B (zh)
HK (1) HK1198448A1 (zh)
TW (1) TWI588235B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016076096A1 (ja) * 2014-11-12 2016-05-19 デクセリアルズ株式会社 熱硬化性接着組成物
JP2017117864A (ja) * 2015-12-22 2017-06-29 日立化成株式会社 先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法
SG11201909029YA (en) * 2017-04-28 2019-10-30 Hitachi Chemical Co Ltd Sealing film, sealed structure, and method for producing sealed structure
CN109651987A (zh) * 2018-12-17 2019-04-19 深圳市华星光电技术有限公司 一种各向异性导电胶黏剂及其导电膜
JP7284110B2 (ja) 2019-07-19 2023-05-30 日本ゼオン株式会社 保存安定性と耐水性に優れるアクリルゴムベール
JP7296328B2 (ja) 2019-07-19 2023-06-22 日本ゼオン株式会社 保存安定性と加工性に優れるアクリルゴムベール
JP7233388B2 (ja) 2019-07-19 2023-03-06 日本ゼオン株式会社 保存安定性と加工性に優れるアクリルゴムベール
JP7292225B2 (ja) 2019-07-19 2023-06-16 日本ゼオン株式会社 加工性に優れるアクリルゴムシート
JP7296329B2 (ja) 2019-07-19 2023-06-22 日本ゼオン株式会社 保存安定性と加工性に優れるアクリルゴムシート
JP7284109B2 (ja) 2019-07-19 2023-05-30 日本ゼオン株式会社 保存安定性と耐水性に優れるアクリルゴムシート
JP2021072375A (ja) * 2019-10-31 2021-05-06 昭和電工マテリアルズ株式会社 基板搬送用サポートテープ及び電子機器装置の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652715A (ja) * 1992-07-30 1994-02-25 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2000129218A (ja) * 1998-10-26 2000-05-09 Nitto Denko Corp シート状接着剤組成物およびそれを用いた電子部品装置ならびにそのリペアー方法
JP2006199824A (ja) 2005-01-20 2006-08-03 Soken Chem & Eng Co Ltd 異方導電性接着テープおよび配線基板異方導電接着体
JP4697194B2 (ja) * 2006-10-13 2011-06-08 日立化成工業株式会社 太陽電池セルの接続方法及び太陽電池モジュール
EP2079084A4 (en) * 2006-10-17 2010-09-08 Hitachi Chemical Co Ltd COATED PARTICLE AND MANUFACTURING METHOD, ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION USING THE COATED PARTICLE, AND ANISOTROPIC CONDUCTIVE ADHESIVE FILM
JP4807523B2 (ja) * 2006-10-31 2011-11-02 ソニーケミカル＆インフォメーションデバイス株式会社 シート状軟磁性材料及びその製造方法
JP4869915B2 (ja) * 2006-12-28 2012-02-08 京セラケミカル株式会社 複合防弾板
JP2008231287A (ja) * 2007-03-22 2008-10-02 Toray Ind Inc 半導体装置用接着剤組成物、それを用いた接着剤シート、半導体用接着剤付きテープおよび銅張り積層板
JP5222490B2 (ja) * 2007-04-25 2013-06-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
JP5226562B2 (ja) 2008-03-27 2013-07-03 デクセリアルズ株式会社 異方性導電フィルム、並びに、接合体及びその製造方法
JP4985700B2 (ja) * 2008-04-28 2012-07-25 日立化成工業株式会社 接着剤リール
JP2010143988A (ja) * 2008-12-17 2010-07-01 Toagosei Co Ltd 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
KR101138799B1 (ko) * 2009-08-20 2012-04-24 제일모직주식회사 이방 도전성 필름용 조성물
JP5293779B2 (ja) * 2010-07-20 2013-09-18 日立化成株式会社 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール
JP5768454B2 (ja) 2011-04-14 2015-08-26 デクセリアルズ株式会社 異方性導電フィルム
JP6029990B2 (ja) * 2012-02-08 2016-11-24 日東電工株式会社 熱伝導性シート
CN105917462B (zh) * 2013-11-28 2019-10-15 日东电工株式会社 密封用热固化性树脂片及中空封装体的制造方法

Also Published As

Publication number Publication date
JP2014201657A (ja) 2014-10-27
JP6180159B2 (ja) 2017-08-16
CN104099031A (zh) 2014-10-15
TWI588235B (zh) 2017-06-21
KR20140120855A (ko) 2014-10-14
KR101618949B1 (ko) 2016-05-09
KR20160006641A (ko) 2016-01-19
CN104099031B (zh) 2017-04-12
TW201512364A (zh) 2015-04-01

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