JP5293779B2 - 接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール - Google Patents
接着剤組成物、回路接続構造体、半導体装置及び太陽電池モジュール Download PDFInfo
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- JP5293779B2 JP5293779B2 JP2011156667A JP2011156667A JP5293779B2 JP 5293779 B2 JP5293779 B2 JP 5293779B2 JP 2011156667 A JP2011156667 A JP 2011156667A JP 2011156667 A JP2011156667 A JP 2011156667A JP 5293779 B2 JP5293779 B2 JP 5293779B2
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- acrylic rubber
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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Description
本実施形態に係る接着剤組成物は、アクリロニトリル由来の構造単位を5〜18質量%有するアクリルゴム(以下、場合により「(a)成分」と称する。)と、ウレタンアクリレート及び/又はウレタンメタクリレート(以下、場合により「(b)成分」と称する。)と、ラジカル重合開始剤(以下、場合により「(c)成分」と称する。)と、を含有する。
本実施形態に係る接着剤組成物は、アクリルゴムを含有する。そして、当該アクリルゴムは、アクリロニトリル由来の構造単位を、アクリルゴムの総量基準で5質量%以上、好ましくは8質量%以上、有する。アクリルゴムにおけるアクリロニトリル由来の構造単位の含有量が上記より少ないと、接着力が低くなる傾向がある。
本実施形態に係る接着剤組成物は、ウレタン(メタ)アクリレートを含有する。ここで、ウレタン(メタ)アクリレートとは、分子内に少なくとも1個のウレタン基と、少なくとも1個の(メタ)アクリロイル基と、を有する化合物である。
本実施形態に係る接着剤組成物は、ラジカル重合開始剤を含有する。ここで、ラジカル重合開始剤とは、加熱及び/又は光照射により分解して遊離ラジカルを発生し得る化合物である。
本実施形態に係る接着剤組成物は、さらに導電性粒子(以下、場合により「(d)成分」と称する。)を含有していてもよい。導電性粒子を含有する接着剤組成物は、異方導電性接着剤組成物として好適に用いることができる。
本実施形態に係る接着剤組成物は、上記以外の成分を含有していてもよい。
以下、本実施形態に係る接着剤組成物及びフィルム状接着剤を、それぞれ異方導電性接着剤組成物及び異方導電性フィルムとして使用し、回路基板の主面上に回路電極が形成されてなる2つの回路部材を接続する場合の一例について説明する。
フェノキシ樹脂(PKHC、ユニオンカーバイト社製品名、平均分子量45000)40gをメチルエチルケトン60gに溶解して、固形分40重量%の溶液とした。次に合成したアクリルゴム15gをトルエン42.5g、酢酸エチル42.5gの混合溶媒に溶解して固形分15重量%の溶液とした。これらを固形分比でフェノキシ樹脂:アクリルゴム=3:1の比で混合し、塗工機を用いて塗工後、70℃の熱風で10分乾燥させることで、厚み20umのフィルムを得た。得られたフィルムについて、Rheometric Scientific社製RSA IIを用いて以下の条件で測定を行った。得られた結果にて、tanδのピーク温度のうち低温側の温度をアクリルゴムのTgとした。
<測定条件>
昇温速度:5℃/分
振動数:1Hz
測定温度範囲:−40℃〜100℃
撹拌機、温度計、還流冷却器及び窒素導入管を備えた装置に、脱イオン水500g、ブチルアクリレート61g、エチルアクリレート23g、ヒドロキシエチルアクリレート3g、アクリロニトリル13gを加え窒素気流下、室温で1時間撹拌後、70℃まで加熱しそのまま3時間撹拌し、さらに90℃まで加熱して3時間撹拌した。得られた固体を回収後水洗、乾燥させることで重量平均分子量500000、Tg−10℃のアクリルゴム1を得た。このアクリルゴム1を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分15質量%の溶液とした。
アクリルゴム1と同様の装置に、脱イオン水500g、ブチルアクリレート66g、エチルアクリレート26g、ヒドロキシエチルアクリレート3g、アクリロニトリル5gを加え、アクリルゴム1と同様の条件にて加熱撹拌することで、重量平均分子量600000、Tg−17℃のアクリルゴム2を得た。このアクリルゴム2を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分15質量%の溶液とした。
アクリルゴム1と同様の装置に、脱イオン水500g、ブチルアクリレート60g、エチルアクリレート20g、ヒドロキシエチルアクリレート3g、アクリロニトリル17gを加え、アクリルゴム1と同様の条件にて加熱撹拌することで、重量平均分子量450000、Tg2℃のアクリルゴム3を得た。このアクリルゴム3を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分15質量%の溶液とした。
アクリルゴム1と同様の装置に、脱イオン水500g、ブチルアクリレート74g、エチルアクリレート10g、ヒドロキシエチルアクリレート3g、アクリロニトリル13gを加え、アクリルゴム1と同様の条件にて加熱撹拌することで、重量平均分子量550000、Tg−22℃のアクリルゴム4を得た。このアクリルゴム4を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分15質量%の溶液とした。
アクリルゴム1と同様の装置に、脱イオン水500g、ブチルアクリレート54g、エチルアクリレート30g、ヒドロキシエチルアクリレート3g、アクリロニトリル13gを加え、アクリルゴム1と同様の条件にて加熱撹拌することで、重量平均分子量650000、Tg12℃のアクリルゴム5を得た。このアクリルゴム5を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分15質量%の溶液とした。
アクリルゴム1と同様の装置に、脱イオン水500g、ブチルアクリレート84g、ヒドロキシエチルアクリレート3g、アクリロニトリル13gを加え、アクリルゴム1と同様の条件にて加熱撹拌することで、重量平均分子量420000、Tg−32℃のアクリルゴム6を得た。このアクリルゴム6を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分15質量%の溶液とした。
アクリルゴム1と同様の装置に、脱イオン水500g、ブチルアクリレート24g、エチルアクリレート60g、ヒドロキシエチルアクリレート3g、アクリロニトリル13gを加え、アクリルゴム1と同様の条件にて加熱撹拌することで、重量平均分子量710000、Tg26℃のアクリルゴム7を得た。このアクリルゴム7を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分15質量%の溶液とした。
アクリルゴム1と同様の装置に、脱イオン水500g、ブチルアクリレート64g、エチルアクリレート31g、ヒドロキシエチルアクリレート3g、アクリロニトリル2gを加え、アクリルゴム1と同様の条件にて加熱撹拌することで、重量平均分子量480000、Tg−18℃のアクリルゴム8を得た。このアクリルゴム8を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分15質量%の溶液とした。
アクリルゴム1と同様の装置に、脱イオン水500g、ブチルアクリレート57g、エチルアクリレート17g、ヒドロキシエチルアクリレート3g、アクリロニトリル23gを加え、アクリルゴム1と同様の条件にて加熱撹拌することで、重量平均分子量500000、Tg13℃のアクリルゴム9を得た。このアクリルゴム9を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分15質量%の溶液とした。
重量平均分子量800のポリカプロラクトンジオール400部と、2−ヒドロキシプロピルアクリレート131部、触媒としてジブチル錫ジラウレート0.5部、重合禁止剤としてハイドロキノンモノメチルエーテル1.0部を攪拌しながら50℃に加熱して混合した。次いで、イソホロンジイソシアネート222部を滴下し更に撹拌しながら80℃に昇温してウレタン化反応を行った。イソシアネート基の反応率が99%以上になったことを確認後、反応温度を下げて、重量平均分子量8500のウレタンアクリレートを得た。
ポリスチレン粒子の表面上に、厚さ0.2μmになるようにニッケルからなる層を設け、更にこのニッケルからなる層の表面上に、厚さ0.04μmになるように金からなる層を設けた。こうして平均粒径5μmの導電性粒子を作製した。
ビスフェノールA型エポキシ樹脂と、分子内にフルオレン環構造を有するフェノール化合物(4,4’−(9−フルオレニリデン)−ジフェニール)とから、重量平均分子量45000のフェノキシ樹脂を合成し、この樹脂を質量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分40質量%の溶液とした。
表2に示すアクリルゴム、上記ウレタンアクリレート、上記フェノキシ樹脂、リン酸エステルとしてジ(2−メタアクリロイルオキシエチル)アシッドフォスフェート(共栄社化学製、商品名P−2M)、ラジカル重合開始剤としてt−ヘキシルパーオキシ2−エチルヘキサノネート(日本油脂株式会社製、商品名パーキュアHO)を、それぞれ固形分質量比で表2に示す割合で配合し、接着剤組成物含有液を作製した。そして、この接着剤組成物含有液に、導電性粒子を接着剤組成物中の固形分の総体積を基準として3体積%分散させて、回路接続材料含有液を調製した。
得られた回路接続構造体について、隣接回路間の抵抗値(接続抵抗)を、マルチメータで測定した。抵抗値は隣接回路間の抵抗37点の平均で得た。得られた抵抗値を、初期接続抵抗として、表3に示す。
FPCが仮固定されサンプルについて、JIS−Z0237に準じて90度剥離法により接着強度(仮固定力)を評価した。また、FPCが本接続されたサンプルについても同様に、JIS−Z0237に準じて90度剥離法により接着強度(接着力)を評価した。ここで、仮固定力及び接着力の測定装置は、東洋ボールドウィン株式会社製テンシロンUTM−4(剥離速度50mm/min、25℃)を使用した。得られた仮固定力及び接着力を、表3に示す。
Claims (14)
- アクリロニトリル、アルキル(メタ)アクリレート及び極性基含有(メタ)アクリレートを単量体単位として有し、前記アクリロニトリル由来の構造単位を5〜18質量%有するアクリルゴムと、
ウレタン(メタ)アクリレートと、
ラジカル重合開始剤と、
を含有する、回路接続材料。 - 前記アクリルゴムが、前記極性基含有(メタ)アクリレート由来の構造単位を1〜5質量%有する、請求項1に記載の回路接続材料。
- 前記アクリルゴムが、前記アルキル(メタ)アクリレート由来の構造単位を77〜94質量%有する、請求項1又は2に記載の回路接続材料。
- 前記アクリルゴムのガラス転移温度が、−30〜20℃の範囲である、請求項1〜3のいずれか一項に記載の回路接続材料。
- 導電性粒子をさらに含有する、請求項1〜4のいずれか一項に記載の回路接続材料。
- 前記ウレタン(メタ)アクリレートの重量平均分子量が、5000〜30000である、請求項1〜5のいずれか一項に記載の回路接続材料。
- 前記アクリルゴムの含有量が、前記アクリルゴム、前記ウレタン(メタ)アクリレート及び前記ラジカル重合開始剤の総量基準で、1.5〜30質量%である、請求項1〜6のいずれか一項に記載の回路接続材料。
- 前記アクリルゴムの含有量が、前記アクリルゴム、前記ウレタン(メタ)アクリレート及び前記ラジカル重合開始剤の総量基準で、2.5〜20質量%である、請求項1〜7のいずれか一項に記載の回路接続材料。
- 前記ウレタン(メタ)アクリレートの含有量が、前記アクリルゴム、前記ウレタン(メタ)アクリレート及び前記ラジカル重合開始剤の総量基準で、5〜80質量%である、請求項1〜8のいずれか一項に記載の回路接続材料。
- 前記ラジカル重合開始剤の含有量が、前記アクリルゴム、前記ウレタン(メタ)アクリレート及び前記ラジカル重合開始剤の総量基準で、0.1〜30質量%である、請求項1〜9のいずれか一項に記載の回路接続材料。
- フィルム状に成形されている、請求項1〜10のいずれか一項に記載の回路接続材料。
- 対向配置された一対の回路部材と、
前記一対の回路部材の間に設けられ、前記一対の回路部材がそれぞれ有する回路電極同士が電気的に接続されるように回路部材同士を接着する接続部材と、を備え、
前記接続部材が、請求項1〜11のいずれか一項に記載の回路接続材料の硬化物を含有する、回路接続構造体。 - 半導体素子と、
前記半導体素子を搭載する基板と、
前記半導体素子及び前記基板の間に設けられ、前記半導体素子及び前記基板が電気的に接続されるように前記半導体素子及び前記基板を接着する接続部材と、
を備え、
前記接続部材が、請求項1〜11のいずれか一項に記載の回路接続材料の硬化物を含有する、半導体装置。 - 電極を有する太陽電池セルと、
配線部材と、
前記電極と前記配線部材が電気的に接続されるように、前記太陽電池セルと前記配線部材を接着する接続部材と、
を備え、
前記接続部材が、請求項1〜11のいずれか一項に記載の回路接続材料の硬化物を含有する、太陽電池モジュール。
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JP6231394B2 (ja) * | 2014-02-03 | 2017-11-15 | デクセリアルズ株式会社 | アクリル系接着剤の反応率測定方法、及びアクリル系接着剤 |
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CN112126004A (zh) * | 2019-06-25 | 2020-12-25 | 玮锋科技股份有限公司 | 低玻璃转移温度复合材料 |
Family Cites Families (13)
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JP5236144B2 (ja) * | 2004-08-09 | 2013-07-17 | 日立化成株式会社 | 接着剤組成物、回路接続構造体及び半導体装置 |
JP4760070B2 (ja) * | 2005-03-16 | 2011-08-31 | 日立化成工業株式会社 | 接着剤、回路接続用接着剤、接続体及び半導体装置 |
JP4760069B2 (ja) * | 2005-03-16 | 2011-08-31 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物及びそれを用いた回路接続構造体、半導体装置 |
JP5323310B2 (ja) * | 2005-11-10 | 2013-10-23 | 日立化成株式会社 | 接続構造及びその製造方法 |
JP2007214533A (ja) * | 2006-01-16 | 2007-08-23 | Hitachi Chem Co Ltd | 導電性接着フィルム及び太陽電池モジュール |
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JP5067927B2 (ja) * | 2007-03-27 | 2012-11-07 | 日東電工株式会社 | 半導体装置製造用接着フィルム |
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KR20210124721A (ko) * | 2020-04-07 | 2021-10-15 | 대주전자재료 주식회사 | 고온 이형 가능한 도전성 접착제 및 태양 전지 모듈 |
KR102315050B1 (ko) * | 2020-04-07 | 2021-10-21 | 대주전자재료 주식회사 | 고온 이형 가능한 도전성 접착제 및 태양 전지 모듈 |
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KR20120010169A (ko) | 2012-02-02 |
CN104867896A (zh) | 2015-08-26 |
TWI456016B (zh) | 2014-10-11 |
CN102399526A (zh) | 2012-04-04 |
JP2012041525A (ja) | 2012-03-01 |
CN104867896B (zh) | 2018-07-03 |
KR101379152B1 (ko) | 2014-03-31 |
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