JP2015183118A - 接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体 - Google Patents
接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体 Download PDFInfo
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- JP2015183118A JP2015183118A JP2014061883A JP2014061883A JP2015183118A JP 2015183118 A JP2015183118 A JP 2015183118A JP 2014061883 A JP2014061883 A JP 2014061883A JP 2014061883 A JP2014061883 A JP 2014061883A JP 2015183118 A JP2015183118 A JP 2015183118A
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- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- LYYNQLKRDKNQMN-UHFFFAOYSA-L [dodecanoyloxy(dimethyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](C)(C)OC(=O)CCCCCCCCCCC LYYNQLKRDKNQMN-UHFFFAOYSA-L 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- 125000002723 alicyclic group Chemical group 0.000 description 1
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- 125000003277 amino group Chemical group 0.000 description 1
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- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000000440 benzylamino group Chemical group [H]N(*)C([H])([H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- CIKJANOSDPPCAU-UHFFFAOYSA-N ditert-butyl cyclohexane-1,4-dicarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1CCC(C(=O)OOC(C)(C)C)CC1 CIKJANOSDPPCAU-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- BNKAXGCRDYRABM-UHFFFAOYSA-N ethenyl dihydrogen phosphate Chemical compound OP(O)(=O)OC=C BNKAXGCRDYRABM-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- HJUFTIJOISQSKQ-UHFFFAOYSA-N fenoxycarb Chemical compound C1=CC(OCCNC(=O)OCC)=CC=C1OC1=CC=CC=C1 HJUFTIJOISQSKQ-UHFFFAOYSA-N 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009396 hybridization Methods 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000250 methylamino group Chemical group [H]N(*)C([H])([H])[H] 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- VNJISVYSDHJQFR-UHFFFAOYSA-N tert-butyl 4,4-dimethylpentaneperoxoate Chemical compound CC(C)(C)CCC(=O)OOC(C)(C)C VNJISVYSDHJQFR-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Abstract
【解決手段】(a)熱可塑性樹脂、(b)ラジカル重合性化合物、(c)ラジカル重合開始剤、及び、(d)(メタ)アクリロイルオキシ基を有しないエポキシ樹脂、を含有し、エポキシ樹脂のカチオン重合硬化剤を実質的に含有しない、接着剤組成物。
【選択図】なし
Description
式(1)中、R5は水素原子又はメチル基を示し、R6は(メタ)アクリロイルオキシ基を示し、w及びxはそれぞれ独立に1〜8の整数を示す。なお、同一分子中の複数のR5、R6、w及びxは、それぞれ同一でも異なっていてもよい。
式(4)中、R1、R2及びR3はそれぞれ独立に、水素原子、炭素数1〜5のアルキル基、炭素数1〜5のアルコキシ基、炭素数1〜5のアルコキシカルボニル基又はアリール基を示す。R1、R2及びR3のうち少なくとも1つはアルコキシ基である。R4は(メタ)アクリロイル基、(メタ)アクリロイルオキシ基、ビニル基、イソシアナート基、イミダゾール基、メルカプト基、アミノアルキル基で置換されていてもよいアミノ基、メチルアミノ基、ジメチルアミノ基、ベンジルアミノ基、フェニルアミノ基、シクロヘキシルアミノ基、モルホリノ基、ピペラジノ基、ウレイド基、グリシジル基又はグリシドキシ基を示す。aは0〜10の整数を示す。
なお、シランカップリング剤がアクリロイル基(アクリロイルオキシ基)等のラジカル重合性官能基を有する場合には、ラジカル重合性化合物として(b)成分に含まれるものとする。
接着剤組成物は、各種添加剤を含有してもよい。
還流冷却器、温度計及び撹拌機を備えたセパラブルフラスコに、エーテル結合を有するジオールであるポリプロピレングリコール(数平均分子量Mn=2000)1000質量部及び溶媒としてのメチルエチルケトン4000質量部を加え、40℃で30分間撹拌した。溶液を70℃まで昇温した後、触媒としてのジメチル錫ラウレート12.7mgを加えた。次いで、この溶液に対して、4,4’−ジフェニルメタンジイソシアネート125質量部をメチルエチルケトン125質量部に溶解して調製した溶液を、1時間かけて滴下した。その後、赤外分光光度計でNCOの吸収ピークが認められなくなるまでこの温度で撹拌を続けて、ポリウレタン樹脂のメチルエチルケトン溶液を得た。この溶液の固形分濃度(ポリウレタン樹脂の濃度)が30質量%となるように調整した。得られたポリウレタン樹脂の重量平均分子量は、GPC(ゲルパーミエーションクロマトグラフィー)による測定の結果、320000(標準ポリスチレン換算値)であった。以下にGPCの分析条件を表1に示す。
温度計、撹拌機、不活性ガス導入口、及び還流冷却器を装着した2リットルの四つ口フラスコに、ポリカーボネートジオール(アルドリッチ社製、Mn=2000)4000質量部と、2−ヒドロキシエチルアクリレート238質量部と、ハイドロキノンモノメチルエーテル0.49質量部と、スズ系触媒4.9質量部とを仕込んで反応液を調製した。70℃に加熱した反応液に対して、イソホロンジイソシアネート(IPDI)666質量部を3時間かけて均一に滴下し、反応させた。滴下完了後、15時間反応を継続し、電位差自動滴定装置(商品名AT−510、京都電子工業株式会社製)にてNCO含有量が0.2質量%となったことを確認した時点で反応を終了し、ウレタンアクリレートを得た。GPCによる分析の結果、ウレタンアクリレートの重量平均分子量は8500(標準ポリスチレン換算値)であった。なお、GPCによる分析は前述のポリウレタン樹脂の重量平均分子量の分析と同様の条件で行った。
撹拌装置、還流冷却器及び温度計を装着した反応器に、ビスフェノールF型エポキシ樹脂(商品名JER806、三菱化学株式会社製:ビスフェノールFのジグリシジルエーテル、エポキシ当量165)330質量部と、アクリル酸72質量部(エポキシ樹脂中のエポキシ基2モルに対してアクリル酸1モルの比率)と、ベンジルトリエチルアンモニウムクロライド1質量部と、t−ブチルカテコール0.1質量部とを仕込んで反応液を調製した。反応液を100℃で3時間撹拌しながら、エポキシ基とアクリル酸との反応を進行させた。反応終了後、反応液を室温に戻してから、ベンゼン300質量部を添加して生成物を溶解させた。続いて、これに炭酸ナトリウム水溶液及び蒸留水をこの順に添加して、溶液を3回ずつ洗浄した。その後、ベンゼンを充分に蒸留除去して、粗生成物を得た。粗生成物を液相クロマトグラフィーにより分析したところ、目的化合物であるエポキシ基を1つ有するアクリレート化合物の他に、エポキシ基を有しない2官能アクリレート化合物及び原料のビスフェノールF型エポキシ樹脂が粗生成物に含まれることが分かった。そこで、粗生成物を精製して、エポキシ基及びアクリロイルオキシ基を一つずつ有し、ビスフェノールF型の基本骨格を有するアクリレート化合物Aを得た。
ポリスチレン粒子の表面に、厚さ0.2μmのニッケル層を形成し、更にこのニッケル層の外側に、厚さ0.04μmの金層を形成させた。こうして平均粒径4μmの導電性粒子を作製した。
表2に示す原料を、表2に示す質量比で混合した。そこに上記導電性粒子を1.5体積%の割合で分散させて、フィルム状接着剤を形成するための塗工液を得た。この塗工液を厚み50μmのポリエチレンテレフタレート(PET)フィルムに塗工装置を用いて塗布した。塗膜を70℃で10分間熱風乾燥して、厚み18μmのフィルム状接着剤を形成させた。
・ポリウレタン樹脂、ウレタンアクリレート及びエポキシ基を有するアクリレート化合物A:上述のとおり合成したもの、
・フェノキシ樹脂:PKHC(ユニオンカーバイト社製、商品名:平均分子量45000)40gをメチルエチルケトン60gに溶解して調製した40質量%の溶液、
・エポキシ樹脂A:YX4000(三菱化学株式会社製、商品名:分子量384、エポキシ当量192、ビフェニル型エポキシ樹脂)、
・エポキシ樹脂B:YX7399(三菱化学株式会社製、商品名:分子量528、エポキシ当量264、ビフェニル型エポキシ樹脂)、
・エポキシ樹脂C:JER806(三菱化学株式会社製、商品名:分子量330、エポキシ当量165、ビスフェノールF型エポキシ樹脂)、
・リン酸エステル:2−メタクリロイルオキシエチルアシッドフォスフェート(商品名ライトエステルP−2M、共栄社化学株式会社製)、
・シランカップリング剤:3−メタクリロキシプロピルトリメトキシシラン(商品名KBM−503、信越化学工業株式会社製)、
・過酸化物:ラウロイルパーオキサイド(商品名パーロイルL、日油株式会社製:分子量398.6)、
・エポキシ樹脂のカチオン重合硬化剤:脂肪族スルホニウム塩系潜在性カチオン重合硬化剤(商品名アデカオプトマーCP−66、株式会社ADEKA製)
・無機微粒子:シリカ粒子(商品名R104、日本アエロジル株式会社製)10gをトルエン45g及び酢酸エチル45gの混合溶媒に分散させて調製した10質量%の分散液。
上記フィルム状接着剤を回路接続材料として用い、ライン幅75μm、ピッチ150μm及び厚さ18μmの銅回路を2200本有するフレキシブル回路板(FPC)と、ガラス基板及びガラス基板上に形成された厚さ0.2μmの酸化インジウム(ITO)の薄層を有するITO基板(厚さ1.1mm、表面抵抗20Ω/□)とを接続した。接続は、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング株式会社製)を用い、140℃、1MPaで5秒間の加熱及び加圧により行った。これにより、幅1.5mmにわたりFPCとITO基板とがフィルム状接着剤の硬化物により接続された接続体を作製した。
得られたFPCとITO基板との接続体の隣接回路間の抵抗値(接続抵抗)を、マルチメーターで測定した。抵抗値は、隣接回路間の抵抗37点の平均で示した。また、この接続体の接着強度を、JIS−Z0237に準じて90度剥離法で測定した。接着強度の測定装置として、テンシロンUTM−4(東洋ボールドウィン株式会社製、商品名、剥離強度50mm/min、25℃)を使用した。接続抵抗及び接着強度は、接続直後及び85℃、85%RHの恒温恒湿槽中に250時間保持後の接続体について測定した。評価結果を表3に示す。
顕微鏡(商品名ECLIPSE L200、株式会社ニコン製)を用いてITO基板及びSiN基板の接続体について、高温高湿試験後の回路接続材料の硬化物とFPCとの界面、及び硬化物とガラスとの界面における剥離の有無を調べた。剥離がない場合を「A」、剥離が実用上問題ない程度にわずかに認められる場合を「B」、剥離が実用上問題ある程度に認められる場合を「C」と判定した。評価結果を表3に示す。評価が「A」又は「B」であれば、剥離が実用上問題ない範囲のものということができる。
Claims (8)
- (a)熱可塑性樹脂、
(b)ラジカル重合性化合物、
(c)ラジカル重合開始剤、及び、
(d)(メタ)アクリロイルオキシ基を有しないエポキシ樹脂、
を含有し、エポキシ樹脂のカチオン重合硬化剤を実質的に含有しない、接着剤組成物。 - 前記エポキシ樹脂がビフェニル骨格を有する、請求項1に記載の接着剤組成物。
- (e)導電性粒子を更に含有する、請求項1又は2に記載の接着剤組成物。
- (a)熱可塑性樹脂、
(b)ラジカル重合性化合物、
(c)ラジカル重合開始剤、
(d)(メタ)アクリロイルオキシ基を有しないエポキシ樹脂、及び、
(e)導電性粒子、
を含有し、エポキシ樹脂のカチオン重合硬化剤を実質的に含有しない、異方導電性接着剤組成物。 - 前記エポキシ樹脂がビフェニル骨格を有する、請求項4に記載の異方導電性接着剤組成物。
- 請求項1〜3のいずれか一項に記載の接着剤組成物、又は請求項4若しくは5に記載の異方導電性接着剤組成物を含有し、
回路電極を有する回路部材同士を、それぞれの回路部材が有する回路電極同士が電気的に接続されるように接着するために用いられる回路接続材料。 - 第一の回路基板の主面上に第一の回路電極が形成された第一の回路部材と、
第二の回路基板の主面上に第二の回路電極が形成され、前記第二の回路電極と前記第一の回路電極とが対向するように配置された第二の回路部材と、
前記第一の回路部材と前記第二の回路部材との間に設けられ、前記第一の回路部材と前記第二の回路部材とを電気的に接続する接続部材と、を備え、
前記接続部材が、請求項1〜3のいずれか一項に記載の接着剤組成物、又は請求項4若しくは5に記載の異方導電性接着剤組成物の硬化物である、接続体。 - 前記第一の回路基板及び前記第二の回路基板のうちの一方がガラス基板である、請求項7に記載の接続体。
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