HK1249665A1 - 各向異性導電膜和連接結構體 - Google Patents

各向異性導電膜和連接結構體

Info

Publication number
HK1249665A1
HK1249665A1 HK18107998.7A HK18107998A HK1249665A1 HK 1249665 A1 HK1249665 A1 HK 1249665A1 HK 18107998 A HK18107998 A HK 18107998A HK 1249665 A1 HK1249665 A1 HK 1249665A1
Authority
HK
Hong Kong
Prior art keywords
conductive film
connection structure
anisotropic conductive
anisotropic
connection
Prior art date
Application number
HK18107998.7A
Other languages
English (en)
Inventor
塚尾憐司
三宅健
Original Assignee
迪睿合株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪睿合株式會社 filed Critical 迪睿合株式會社
Publication of HK1249665A1 publication Critical patent/HK1249665A1/zh

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Classifications

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    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
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    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
HK18107998.7A 2015-07-13 2018-06-22 各向異性導電膜和連接結構體 HK1249665A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015139491A JP6750197B2 (ja) 2015-07-13 2015-07-13 異方性導電フィルム及び接続構造体
PCT/JP2016/070391 WO2017010446A1 (ja) 2015-07-13 2016-07-11 異方性導電フィルム及び接続構造体

Publications (1)

Publication Number Publication Date
HK1249665A1 true HK1249665A1 (zh) 2018-11-02

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HK18107998.7A HK1249665A1 (zh) 2015-07-13 2018-06-22 各向異性導電膜和連接結構體

Country Status (7)

Country Link
US (1) US10269467B2 (zh)
JP (1) JP6750197B2 (zh)
KR (1) KR102011650B1 (zh)
CN (2) CN107735909B (zh)
HK (1) HK1249665A1 (zh)
TW (1) TWI703585B (zh)
WO (1) WO2017010446A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6945276B2 (ja) * 2016-03-31 2021-10-06 デクセリアルズ株式会社 異方性導電接続構造体
JP7062389B2 (ja) * 2017-08-23 2022-05-06 デクセリアルズ株式会社 異方性導電フィルム
JP7160302B2 (ja) 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
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