JP7185252B2 - 接続構造体の作製方法 - Google Patents
接続構造体の作製方法 Download PDFInfo
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- JP7185252B2 JP7185252B2 JP2018015667A JP2018015667A JP7185252B2 JP 7185252 B2 JP7185252 B2 JP 7185252B2 JP 2018015667 A JP2018015667 A JP 2018015667A JP 2018015667 A JP2018015667 A JP 2018015667A JP 7185252 B2 JP7185252 B2 JP 7185252B2
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Description
[接続構造体の構造]
図1は、本発明の一実施形態に係る接続構造体の構造を示す。図1(A)は、本発明の一実施形態に係る接続構造体の平面図である。図1(B)は、図1(A)のA-A’断面図である。図1(C)は、図1(B)の領域Bにおける導電性粒子の拡大断面図である。
次に、図2から図5を用いて、本発明の一実施形態に係る接続構造体の作製方法について説明する。尚、本実施形態においては、既存の第1の電子部品101および第2の電子部品111を用いることが可能であるため、その説明は省略し、図2から図5においては、接続構造体100を形成する方法を詳しく説明する。
本実施形態に係る接続構造体の構造は、第1実施形態に係る接続構造体の構造と同じである。本実施形態に係る接続構造体の作製方法は、第2の組成物30’を第2の面の第2の電極114および第2の電極114以外の領域に配置すること以外、第1実施形態に係る接続構造体の作製方法と同じである。第1実施形態と同じである説明は省略し、ここでは第1実施形態に係る接続構造体の作製方法と相違する部分について説明する。
図6を用いて、本発明の一実施形態に係る接続構造体の作製方法について説明する。尚、本実施形態においては、既存の第1の電子部品101および第2の電子部品111を用いることが可能であるため、その説明は省略し、図6においては、接続構造体100を形成する方法を詳しく説明する。
本実施形態に係る接続構造体の構造は、第2の樹脂30が第2の電極114上に配置されること以外、第1実施形態に係る接続構造体の構造と同じである。本実施形態に係る接続構造体の作製方法は、複数の導電性粒子10と第1の組成物20’との混合物を第2の面の第2の電極114上に配置し、第2の組成物30’を第1の面の第1の電極110および第1の電極110以外の領域に配置すること以外、第1実施形態に係る接続構造体の作製方法と同じである。第1実施形態と同じである説明は省略し、ここでは第1実施形態に係る接続構造体および接続構造体の作製方法と相違する部分について説明する。
図7は、本発明の一実施形態に係る接続構造体の構造を示す。図7(A)は、本発明の一実施形態に係る接続構造体の平面図である。図7(B)は、図7(A)のD-D’断面図である。図7(C)は、図7(B)の領域Eにおける導電性粒子の拡大断面図である。
図8を用いて、本発明の一実施形態に係る接続構造体の作製方法について説明する。尚、本実施形態においては、既存の第1の電子部品101および第2の電子部品111を用いることが可能であるため、その説明は省略し、図8においては、接続構造体100aを形成する方法を詳しく説明する。
本実施形態に係る接続構造体の構造は、第3実施形態に係る接続構造体の構造と同じである。本実施形態に係る接続構造体の作製方法は、第2の組成物30’を第2面の第2の電極114および第2の電極114以外の領域に配置すること以外、第3実施形態に係る接続構造体の作製方法と同じである。第1実施形態および第3実施形態と同じである説明は省略し、ここでは第1実施形態および第3実施形態に係る接続構造体の作製方法と相違する部分について説明する。
図9を用いて、本発明の一実施形態に係る接続構造体の作製方法について説明する。尚、本実施形態においては、既存の第1の電子部品101および第2の電子部品111を用いることが可能であるため、その説明は省略し、図9においては、接続構造体100aを形成する方法を詳しく説明する。
本実施形態に係る接続構造体の構造は、第1の樹脂20が第1の部材102の第1の電極以外の領域にも配置されること以外、第1実施形態に係る接続構造体の構造と同じである。本実施形態に係る接続構造体の作製方法は、第1の組成物20’を第1の面の第1の電極110以外の領域にも配置すること以外、第1実施形態に係る接続構造体の作製方法と同じである。第1実施形態と同じである説明は省略し、ここでは第1実施形態に係る接続構造体および接続構造体の作製方法と相違する部分について説明する。
図10は、本発明の一実施形態に係る接続構造体の構造を示す。図10(A)は、本発明の一実施形態に係る接続構造体の平面図である。図10(B)は、図10(A)のF-F’断面図である。図10(C)は、図10(B)の領域Gにおける導電性粒子の拡大断面図である。
次に、図11から図14を用いて、本発明の一実施形態に係る接続構造体の作製方法について説明する。尚、本実施形態においては、既存の第1の電子部品101および第2の電子部品111を用いることが可能であるため、その説明は省略し、図11から図14においては、接続構造体100bを形成する方法を詳しく説明する。
本実施形態に係る接続構造体の構造は、第5実施形態に係る接続構造体の構造と同じである。本実施形態に係る接続構造体の作製方法は、第2の組成物30’を第2の面の第2の電極114および第2の電極114以外の領域に配置すること以外、第5実施形態に係る接続構造体の作製方法と同じである。第1実施形態および第5実施形態と同じである説明は省略し、ここでは第1実施形態および第5実施形態に係る接続構造体の作製方法と相違する部分について説明する。
図15を用いて、本発明の一実施形態に係る接続構造体の作製方法について説明する。尚、本実施形態においては、既存の第1の電子部品101および第2の電子部品111を用いることが可能であるため、その説明は省略し、図15においては、接続構造体100bを形成する方法を詳しく説明する。
本実施形態に係る接続構造体の構造は、第1の樹脂20が第2の部材112の第2の電極以外の領域にも配置されること以外、第3実施形態に係る接続構造体の構造と同じである。本実施形態に係る接続構造体の構造は、第1の面と第2の面との間に配置される第1の樹脂20と第2の樹脂30との積層順が異なること以外、第5実施形態に係る接続構造体の構造と同じである。本実施形態に係る接続構造体の作製方法は、第1の組成物20’を第2の面の第2の電極114および第2の電極114以外の領域に配置し、第2の組成物30’を第2の面の第2の電極114および第2の電極114以外の領域に配置すること以外、第1実施形態および第5実施形態に係る接続構造体の作製方法と同じである。第1実施形態および第5実施形態と同じである説明は省略し、ここでは第1実施形態および第5実施形態に係る接続構造体および接続構造体の作製方法と相違する部分について説明する。
図16は、本発明の一実施形態に係る接続構造体の構造を示す。図16(A)は、本発明の一実施形態に係る接続構造体の平面図である。図16(B)は、図16(A)のI-I’断面図である。図16(C)は、図16(B)の領域Jにおける導電性粒子の拡大断面図である。
図17を用いて、本発明の一実施形態に係る接続構造体の作製方法について説明する。尚、本実施形態においては、既存の第1の電子部品101および第2の電子部品111を用いることが可能であるため、その説明は省略し、図17においては、接続構造体100cを形成する方法を詳しく説明する。
本実施形態に係る接続構造体の構造は、第7実施形態に係る接続構造体の構造と同じである。本実施形態に係る接続構造体の作製方法は、第2の組成物30’を第1の面の第1の電極110および第1の電極110以外の領域に配置すること以外、第7実施形態に係る接続構造体の作製方法と同じである。第1実施形態、第5実施形態、および第7実施形態と同じである説明は省略し、ここでは第1実施形態、第5実施形態、および第7実施形態に係る接続構造体の作製方法と相違する部分について説明する。
図18を用いて、本発明の一実施形態に係る接続構造体の作製方法について説明する。尚、本実施形態においては、既存の第1の電子部品101および第2の電子部品111を用いることが可能であるため、その説明は省略し、図18においては、接続構造体100cを形成する方法を詳しく説明する。
・第1の電極110の幅(短辺)(A1)=9μm
・第1の電極110同士の距離(B1)=6μm
・第1の電極110のピッチ(A1+B1=C1)=15μm
・第1の電極110の長さ(長辺)(D1)=105μm
・第1の電極110の面積(A1×D1)=945μm2
・第1の電極110当たりに配置される導電性粒子10の数=19個
・第1の電極110の幅(短辺)(A2)=9μm
・第1の電極110同士の距離(B2)=6μm
・第1の電極110のピッチ(A2+B2=C2)=15μm
・第1の電極110の長さ(長辺)(D2)=105μm
・第1の電極110の面積(A2×D2)=945μm2
・第1の電極110当たりに配置される導電性粒子10の数=26個
・第1の電極110の幅(短辺)(A3)=9μm
・第1の電極110同士の距離(B3)=6μm
・第1の電極110のピッチ(A3+B3=C3)=15μm
・第1の電極110の長さ(長辺)(D3)=78μm
・第1の電極110の面積(A3×D3)=702μm2
・導電性粒子10と第1の樹脂20が配置される1つの領域の面積=40μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域の総面積=280μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域の数=7個
・導電性粒子10と第1の樹脂20が配置される1つの領域当たりに配置される導電性粒子10の数=2個
・1つの電極当たりに配置される導電性粒子10の数=14個
・第1の電極110の幅(短辺)(A4)=12μm
・第1の電極110同士の距離(B4)=9μm
・第1の電極110のピッチ(A4+B4=C4)=21μm
・第1の電極110の長さ(長辺)(D4)=105μm
・第1の電極110の面積(A4×D4)=1260μm2
・導電性粒子10と第1の樹脂20が配置される1つの領域の面積=113μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域の総面積=791μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域の数=7個
・導電性粒子10と第1の樹脂20が配置される1つの領域当たりに配置される導電性粒子10の数=7個
・第1の電極110当たりに配置される導電性粒子10の数=49個
・第1の電極110の幅(短辺)(A5)=9μm
・第1の電極110同士の距離(B5)=6μm
・第1の電極110のピッチ(A5+B5=C5)=15μm
・第1の電極110の長さ(長辺)(D5)=84μm
・第1の電極110の面積(A5×D5)=756μm2
・導電性粒子10と第1の樹脂20が配置される1つの領域の面積=64μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域の総面積=448μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域の数=7個
・導電性粒子10と第1の樹脂20が配置される1つの領域当たりに配置される導電性粒子10の数=3個
・1つの電極当たりに配置される導電性粒子10の数=21個
・第1の電極110の幅(短辺)(A6)=21μm
・第1の電極110同士の距離(B6)=10μm
・第1の電極110のピッチ(A6+B6=C6)=31μm
・第1の電極110の長さ(長辺)(D6)=21μm
・第1の電極110の面積(A6×D6)=441μm2
・導電性粒子10と第1の樹脂20が配置される領域αの面積=64μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域αの総面積=128μm2
・導電性粒子10と第1の樹脂20が配置される領域αの数=2個
・領域α当たりに配置される導電性粒子10の数=3個
・導電性粒子10と第1の樹脂20が配置される領域βの面積=40μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域βの総面積=80μm
・導電性粒子10と第1の樹脂20が配置される領域βの数=2個
・領域β当たりに配置される導電性粒子10の数=2個
・1つの電極当たりに配置される導電性粒子10の数=10個
・第1の電極110の幅(短辺)(A7)=15μm
・第1の電極110同士の距離(B7)=10μm
・第1の電極110のピッチ(A7+B7=C7)=25μm
・第1の電極110の長さ(長辺)(D7)=30μm
・第1の電極110の面積(A7×D7)=450μm2
・導電性粒子10と第1の樹脂20が配置される1つの領域の面積=113μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域の総面積=226μm2
・1つの電極当たりに導電性粒子10と第1の樹脂20が配置される領域の数=2個
・導電性粒子10と第1の樹脂20が配置される1つの領域当たりに配置される導電性粒子10の数=7個
・1つの電極当たりに配置される導電性粒子10の数=14個
Claims (18)
- 第1の部材の第1の面の上に、前記第1の面に配置された第1の電極を覆って凸凹構造を形成するように導電性粒子と第1の組成物とを配置し、ここで、前記凸凹構造のうち、凸構造は前記第1の電極の上に配置されるとともに前記第1の組成物及び前記導電性粒子を含み、凹構造は前記第1の電極以外の領域の上に配置されるとともに前記第1の組成物を含み、
前記第1の面の前記第1の電極と第1の電極以外の領域の上に第2の組成物を配置し、
前記第1の面と、第2の電極が配置された第2の部材の第2の面とを、前記第1の電極と前記第2の電極が対向するように配置し、
前記第1の部材および前記第2の部材を押圧し、
前記第1の組成物及び前記第2の組成物を硬化させる、ことを含む接続構造体の作製方法。 - 第1の部材の第1の面の上に、前記第1の面に配置された第1の電極を覆って凸凹構造を形成するように導電性粒子と第1の組成物とを配置し、ここで、前記凸凹構造のうち、凸構造は前記第1の電極の上に配置されるとともに前記第1の組成物及び前記導電性粒子を含み、凹構造は前記第1の電極以外の領域の上に配置されるとともに前記第1の組成物を含み、
第2の部材の第2の面に配置された第2の電極の上と第2の電極以外の領域の上に第2の組成物を配置し、
前記第1の面と、前記第2の面とを、前記第1の電極と前記第2の電極が対向するように配置し、
前記第1の部材および前記第2の部材を押圧し、
前記第1の組成物及び前記第2の組成物を硬化させる、ことを含む接続構造体の作製方法。 - 前記導電性粒子を、前記第1の電極の面積400μm2あたり少なくとも7個以上20個以下配置する、請求項1または2に記載の接続構造体の作製方法。
- 前記導電性粒子と前記第1の組成物とをオフセット印刷法により配置する請求項1乃至3の何れか1項に記載の接続構造体の作製方法。
- 前記導電性粒子と前記第1の組成物とをパッド印刷法により配置する請求項1乃至4の何れか1項に記載の接続構造体の作製方法。
- 前記パッド印刷法は、平板凹版を用いる請求項5に記載の接続構造体の作製方法。
- 前記第1の組成物の粘度は、前記第2の組成物の粘度より高い請求項1乃至6の何れか1項に記載の接続構造体の作製方法。
- 前記導電性粒子を、前記第1の組成物に20体積%以上60体積%以下の範囲で混合された状態で前記第1の組成物と共に前記第1の電極上に配置する請求項1乃至7の何れか1項に記載の接続構造体の作製方法。
- 前記第1の組成物および前記第2の組成物は、ラジカル重合型樹脂を含む請求項1乃至8の何れか1項に記載の接続構造体の作製方法。
- 前記第2の組成物は、エチレン性不飽和化合物とチオール化合物とを含むエン/チオール系硬化性樹脂を含み、前記エチレン性不飽和化合物と前記チオール化合物のうち少なくとも一方の硬化成分が9,9-ビスアリールフルオレン化合物である請求項1乃至9の何れか1項に記載の接続構造体の作製方法。
- 前記第1の組成物および前記第2の組成物は、光硬化開始成分を含む請求項1乃至10の何れか1項に記載の接続構造体の作製方法。
- 前記第1の組成物および前記第2の組成物を光照射によって硬化させる請求項1乃至11の何れか1項に記載の接続構造体の作製方法。
- 前記第1の組成物および前記第2の組成物は、遮蔽部硬化性活性化合物を含む請求項1乃至12の何れか1項に記載の接続構造体の作製方法。
- 前記第1の組成物は、嫌気性硬化開始成分を含む請求項1乃至13の何れか1項に記載の接続構造体の作製方法。
- 前記第1の部材および前記第2の部材の押圧と、前記第1の組成物及び前記第2の組成物の硬化とを、同時に行う請求項1乃至14の何れか1項に記載の接続構造体の作製方法。
- 前記第1の部材および前記第2の部材の押圧により、前記導電性粒子を前記第1の電極及び前記第2の電極に接させる請求項1乃至15の何れか1項に記載の接続構造体の作製方法。
- 前記導電性粒子と前記第1の組成物とを配置する前に、
前記第1の電極の端部を覆い、前記第1の電極の上面を露出させる開口部を有する絶縁膜を形成する、請求項1乃至16の何れか1項に記載の接続構造体の作製方法。 - 前記第1の組成物を、前記第1の電極上であって前記開口部の内側の領域、および前記第1の電極上であって前記開口部の外側の領域、ならびに前記第1の面の前記第1の電極
以外の領域の上に連続するように配置し、前記第1の組成物及び前記第2の組成物で前記第1の部材及び前記第2の部材の間を充填する、請求項17に記載の接続構造体の作製方法。
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WO2017086455A1 (ja) | 2015-11-20 | 2017-05-26 | 積水化学工業株式会社 | 粒子、接続材料及び接続構造体 |
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US20210398931A1 (en) | 2021-12-23 |
CN116612912A (zh) | 2023-08-18 |
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US10804235B2 (en) | 2020-10-13 |
US20190237424A1 (en) | 2019-08-01 |
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US11735556B2 (en) | 2023-08-22 |
JP2023024438A (ja) | 2023-02-16 |
JP2019134087A (ja) | 2019-08-08 |
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US10580751B2 (en) | 2020-03-03 |
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