JP6347635B2 - 異方性導電接着剤 - Google Patents
異方性導電接着剤 Download PDFInfo
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- JP6347635B2 JP6347635B2 JP2014056263A JP2014056263A JP6347635B2 JP 6347635 B2 JP6347635 B2 JP 6347635B2 JP 2014056263 A JP2014056263 A JP 2014056263A JP 2014056263 A JP2014056263 A JP 2014056263A JP 6347635 B2 JP6347635 B2 JP 6347635B2
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- solder
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- anisotropic conductive
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
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Description
1.異方性導電接着剤
2.接続構造体及びその製造方法
3.実施例
本実施の形態における異方性導電接着剤は、樹脂粒子の最表面にAgを主成分とする金属層が形成された導電性粒子と、導電性粒子よりも平均粒径が小さいはんだ粒子と、はんだ粒子よりも平均粒径が小さい光反射性絶縁粒子とがバインダー(接着剤成分)中に分散されたものであり、その形状は、ペースト、フィルムなどであり、目的に応じて適宜選択することができる。
次に、前述した異方性導電接着剤を用いた接続構造体について説明する。本実施の形態における接続構造体は、第1の電子部品と、第2の電子部品と、樹脂粒子の最表面にAgを主成分とする金属層が形成された導電性粒子と、導電性粒子よりも平均粒径が小さいはんだ粒子と、はんだ粒子よりも平均粒径が小さい光反射性絶縁粒子と、導電性粒子、はんだ粒子、及び光反射性絶縁粒子を分散させるバインダーとを含有する異方性導電接着剤により、第1の電子部品と第2の電子部品とを接着してなる異方性導電膜とを備え、第1の電子部品の端子と第2の電子部品の端子とが、導電性粒子を介して電気的に接続されてなるとともに、はんだ粒子によってはんだ接合されている。
以下、本発明の実施例について詳細に説明するが、本発明はこれらの実施例に限定されるものではない。本実施例では、光反射性の導電性粒子とはんだ粒子と白色無機フィラーとを配合した異方性導電接着剤(ACP)を作製し、反射率を評価した。また、LED実装体を作製し、全光束量、放熱特性、及び電気特性について評価した。
粒径5μmの球状アクリル樹脂にスパッタリング法により、Ag合金(商品名:GB100、COBELCO社製)を厚み0.25μmで形成し、粒径5.5μmの光反射性の導電性粒子Aを作製した。
エポキシ硬化系接着剤(エポキシ樹脂(商品名:CEL2021P、(株)ダイセル化学製)及び酸無水物(MeHHPA、商品名:MH700、新日本理化(株)製)を主成分としたバインダー)中に、光反射性の導電性粒子を2体積%、はんだ粒子を5体積%、及び、白色無機フィラーとして酸化チタンを10体積%配合し、異方性導電接着剤を作製した。はんだ粒子として、平均粒径(D50)が、0.8μm、1.1μm、5.0μm、及び20.0μmのものを準備した(商品名:M707(Sn−3.0Ag−0.5Cu)、mp:217℃、千住金属工業社製)。
白色板に異方性導電接着剤を厚み100μとなるように塗布した後、200℃−1minの条件で加熱硬化した。硬化後の異方性導電膜の反射率を、分光光度計にて測定した。
異方性導電接着剤を用いてFC実装用LEDチップ(商品名:DA700、CREE社製、Vf=3.2V(If=350mA))をAu電極基板(セラミック基板、導体スペース=100μmP、Ni/Auメッキ=5.0/0.3μm)に搭載した。異方性導電接着剤をAu電極基板に塗布した後、LEDチップをアライメントして搭載し、260℃−10秒、荷重1000g/chipの条件で加熱圧着を行った。
積分球による全光束量測定装置(LE−2100、大塚電子(株))を用いて、LED実装体の全光束量を測定した。
過渡熱抵抗測定装置(T3STAR、Mentor Graphics社製)を用いて、0.1秒間点灯したときのLED実装体の熱抵抗値(℃/W)を測定した。測定条件はIf=350mA、Im=1mAで行った。
初期Vf値として、If=350mA時のVf値を測定した。また、85℃、85%RH環境下でLED実装体をIf=350mAで500時間点灯させ(高温高湿試験)、If=350mA時のVf値を測定した。なお、高温高湿試験は初期良品のみ行った。初期の評価は、リークが発生した場合を「×」、それ以外を「○」とした。高温高湿試験後の評価は、初期Vf値からの変動が5%以上の場合を「×」、初期Vf値からの変動が5%未満の場合を「○」とした。
表1に示すように、バインダーに対してNiめっき樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、はんだ粒子(粒径(D50):5.0μm)と、酸化チタン(粒径(D50):0.25μm)とを混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対してNiめっき樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、はんだ粒子(粒径(D50):1.1μm)と、酸化チタン(粒径(D50):0.25μm)とを混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対してNiめっき樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、はんだ粒子(粒径(D50):5.0μm)と、酸化チタン(粒径(D50):0.18μm)とを混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対してNiめっき樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、はんだ粒子(粒径(D50):5.0μm)と、酸化チタン(粒径(D50):1.00μm)とを混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対して球状樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、はんだ粒子(粒径(D50):5.0μm)と、酸化チタン(粒径(D50):0.25μm)とを混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対して球状樹脂粒子の表面をAgで被覆した外観が茶色の光反射性導電粒子(粒径(D50):5.5μm)を混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対してNiめっき樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、酸化チタン(粒径(D50):0.25μm)とを混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対してNiめっき樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、はんだ粒子(粒径(D50):20.0μm)と、酸化チタン(粒径(D50):0.25μm)とを混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対してNiめっき樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、はんだ粒子(粒径(D50):0.8μm)と、酸化チタン(粒径(D50):0.25μm)とを混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対してNiめっき樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、はんだ粒子(粒径(D50):5.0μm)と、酸化チタン(粒径(D50):0.02μm)とを混合し、異方性導電接着剤を作製した。
表1に示すように、バインダーに対してNiめっき樹脂粒子の表面をAg合金(Ag:Bi:Nd=99:0.7:0.3)で被覆した外観が灰色の光反射性導電粒子(粒径(D50):5.5μm)と、はんだ粒子(粒径(D50):5.0μm)と、酸化チタン(粒径(D50):3.00μm)とを混合し、異方性導電接着剤を作製した。
Claims (9)
- 樹脂粒子の最表面にAgを主成分とする金属層が形成された導電性粒子と、
前記導電性粒子よりも平均粒径が小さいはんだ粒子と、
前記はんだ粒子よりも平均粒径が小さい光反射性絶縁粒子と、
前記導電性粒子、前記はんだ粒子、及び前記光反射性絶縁粒子を分散させるバインダーと
を含有する異方性導電接着剤。 - 前記はんだ粒子の平均粒径が、前記導電性粒子の平均粒径の20%以上100%未満である請求項1記載の異方性導電接着剤。
- 前記光反射性絶縁粒子の平均粒径が、前記はんだ粒子の平均粒径の2%以上30%未満である請求項1又は2記載の異方性導電接着剤。
- 前記はんだ粒子の配合量が、前記導電性粒子の配合量よりも大きく、
前記光反射性絶縁粒子の配合量が、前記はんだ粒子の配合量よりも多い請求項1乃至3のいずれか1項に記載の異方性導電接着剤。 - 前記光反射性絶縁粒子が、酸化チタン、窒化ホウ素、酸化亜鉛及び酸化アルミニウムからなる群より選択される少なくとも1種である請求項1乃至4のいずれか1項に記載の異方性導電接着剤。
- 前記Agを主成分とする金属層が、Agを95.0atm%以上99.8atm%以下、Biを0.1atm%以上3.0atm%以下、Ndを0.1atm%以上2.0atm%以下含有する請求項1乃至5のいずれか1項に記載の異方性導電接着剤。
- 第1の電子部品と、
第2の電子部品と、
樹脂粒子の最表面にAgを主成分とする金属層が形成された導電性粒子と、前記導電性粒子よりも平均粒径が小さいはんだ粒子と、前記はんだ粒子よりも平均粒径が小さい光反射性絶縁粒子と、前記導電性粒子、前記はんだ粒子、及び前記光反射性絶縁粒子を分散させるバインダーとを含有する異方性導電接着剤により、前記第1の電子部品と前記第2の電子部品とを接着してなる異方性導電膜とを備え、
前記第1の電子部品の端子と前記第2の電子部品の端子とが、前記導電性粒子を介して電気的に接続されてなるとともに、前記はんだ粒子によってはんだ接合されてなる接続構造体。 - 前記第1の電子部品が、LED素子であり、
前記第2の電子部品が、基板である請求項7記載の接続構造体。 - 樹脂粒子の最表面にAgを主成分とする金属層が形成された導電性粒子と、前記導電性粒子よりも平均粒径が小さいはんだ粒子と、前記はんだ粒子よりも平均粒径が小さい光反射性絶縁粒子と、前記導電性粒子、前記はんだ粒子、及び前記光反射性絶縁粒子を分散させるバインダーとを含有する異方性導電接着剤を、第1の電子部品の端子と第2の電子部品の端子との間に挟み、第1の電子部品と第2の電子部品とを熱圧着する接続構造体の製造方法。
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JP2014056263A JP6347635B2 (ja) | 2014-03-19 | 2014-03-19 | 異方性導電接着剤 |
US15/116,081 US9670385B2 (en) | 2014-03-19 | 2015-02-13 | Anisotropic conductive adhesive |
TW104104889A TWI649765B (zh) | 2014-03-19 | 2015-02-13 | Anisotropic conductive adhesive |
CN201580014903.8A CN106062119B (zh) | 2014-03-19 | 2015-02-13 | 各向异性导电粘接剂 |
PCT/JP2015/053957 WO2015141343A1 (ja) | 2014-03-19 | 2015-02-13 | 異方性導電接着剤 |
EP15764663.9A EP3121237A4 (en) | 2014-03-19 | 2015-02-13 | Anisotropic conductive adhesive |
KR1020167018338A KR102339440B1 (ko) | 2014-03-19 | 2015-02-13 | 이방성 도전 접착제 |
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KR101583691B1 (ko) * | 2012-10-10 | 2016-01-08 | 제일모직주식회사 | 이방 전도성 접착 조성물 및 이를 이용한 이방 전도성 필름 |
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