JP5785306B2 - 光反射性異方性導電接着剤及び発光装置 - Google Patents
光反射性異方性導電接着剤及び発光装置 Download PDFInfo
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Description
(異方性導電接着剤の作製)
白色針状無機粒子と、球状樹脂の表面を金メッキ処理した導電性粒子(粒径5μm)とをエポキシ硬化系接着剤(CEL2021P−MeHHPAを主成分とした接着性バインダ)からなる熱硬化性樹脂組成物に混合し、異方性導電接着剤を作製した。白色針状無機粒子の添加量は、熱硬化性樹脂組成物に対して12.0体積%とした。白色針状無機粒子としては、長方向粒径1.7μm、短方向粒径0.13μm(アスペクト比13.1)の二酸化チタン(TiO2)ウィスカを使用した。また、導電性粒子の添加量は、熱硬化性樹脂組成物に対して10質量%とした。
作製した異方性導電接着剤を白色板上に厚さ100μmとなるように塗布し、200℃で1分間加熱して硬化させた。得られた硬化物について、分光光度計(島津製作所社製 UV3100)を用いて硫酸バリウムを標準とした波長450nmの光に対する全反射率(鏡面反射及び拡散反射)を測定した。
100μmピッチの銅配線にNi/Au(5.0μm厚/0.3μm厚)メッキ処理した配線を有するガラスエポキシ基板に、バンプホルダ(FB700、カイジョー(株))を用いて15μm高の金(Au)バンプを形成した。この金バンプ付きエポキシ基板に、光反射性異方性導電接着剤を用いて、青色LED(Vf=3.2V(If=20mA))素子を200℃、20秒、1kg/チップの条件でフリップチップ実装し、テスト用LEDモジュールを得た。
得られたテスト用LEDモジュールについて、全光束量測定システム(積分全球)(LE−2100、大塚電子株式会社製)を用いて全光束量を測定した(測定条件 If=20mA(定電流制御))。
導通信頼性及びクラック発生の有無を、冷熱サイクル試験(TCT)により評価した。テスト用LEDモジュールをTCTに入れ、(a)−40℃で30分間←→100℃で30分間、1000サイクル、(b)−55℃、30分←→125℃、30分、1000サイクルを行った。すなわち、(a)−40℃及び100℃の雰囲気に各30分間曝し、これを1サイクルとする冷熱サイクルを1000サイクル行い、また(b)−55℃及び125℃の雰囲気に各30分間曝し、これを1サイクルとする冷熱サイクルを1000サイクル行った。
白色針状無機粒子として、長方向粒径50μm、短方向粒径3μm(アスペクト比16.7)の酸化亜鉛(ZnO)ウィスカ(パナテトラWZ−05F1、アムテック製)を使用した以外は、実施例1と同様の処理を行った。
白色針状無機粒子として、長方向粒径20μm、短方向粒径0.6μm(アスペクト比33.3)のチタン酸カリウムウィスカ(ティスモシリーズ、大塚化学製)を使用した以外は、実施例1と同様の処理を行った。
白色針状無機粒子として、長方向粒径50μm、短方向粒径3μm(アスペクト比16.7)の酸化亜鉛(ZnO)ウィスカ(パナテトラWZ−05F1、アムテック製)の表面をシランカップリング剤で処理したものを使用した以外は、実施例1と同様の処理を行った。
白色針状無機粒子として、長方向粒径50μm、短方向粒径3μm、アスペクト比16.7である酸化亜鉛(ZnO)ウィスカ(パナテトラWZ−05F1、アムテック製)を、熱硬化性樹脂組成物に対して9.0体積%の割合で添加するとともに、粒径0.6μm(アスペクト比1.0)の酸化亜鉛(ZnO)の白色球状無機粒子(I種、堺化学製)を、熱硬化性樹脂組成物に対して3.0体積%の割合で添加した以外は、実施例1と同様の処理を行った。
異方性導電接着剤に白色針状無機粒子を含有させない以外は、実施例1と同様の処理を行った。
実施例1の白色針状無機粒子に代え、粒径0.9μm(アスペクト比1.0)の酸化チタンの白色球状無機粒子を、熱硬化性樹脂組成物に対して12.0体積%の割合で添加した以外は、実施例1と同様の処理を行った。
実施例1の白色針状無機粒子に代え、0.6μm(アスペクト比1.0)の酸化亜鉛の白色球状無機粒子を、熱硬化性樹脂組成物に対して12.0体積%の割合で添加した以外は、実施例1と同様の処理を行った。
Claims (8)
- 発光素子を配線板に異方性導電接続するために使用する光反射性異方性導電接着剤であって、熱硬化性樹脂、導電性粒子、及び光反射性針状絶縁粒子としてチタン酸塩ウィスカを含有することを特徴とする光反射性異方性導電接着剤。
- 上記光反射性針状絶縁粒子のアスペクト比が、10よりも大きく35未満であることを特徴とする請求項1記載の光反射性異方性導電接着剤。
- 上記光反射性針状絶縁粒子のアスペクト比が、10よりも大きく20未満であることを特徴とする請求項1記載の光反射性異方性導電接着剤。
- 上記熱硬化性樹脂組成物における上記光反射性針状絶縁粒子の配合量が、該熱硬化性樹脂組成物に対して1〜50体積%であることを特徴とする請求項1乃至3の何れか1項記載の光反射性異方性導電接着剤。
- 光反射性球状絶縁粒子を更に含むことを特徴とする請求項1乃至4の何れか1項記載の光反射性異方性導電接着剤。
- 上記光反射性針状絶縁粒子は、上記光反射性球状絶縁粒子の体積量と同量以上の体積量で含有されていることを特徴とする請求項5記載の光反射性異方性導電接着剤。
- 請求項1乃至6の何れか1項記載の光反射性異方性導電接着剤を介して、発光素子がフリップチップ方式で配線板に実装されていることを特徴とする発光装置。
- 上記発光素子は、発光ダイオードであることを特徴とする請求項7記載の発光装置。
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