JP5768454B2 - 異方性導電フィルム - Google Patents
異方性導電フィルム Download PDFInfo
- Publication number
- JP5768454B2 JP5768454B2 JP2011090211A JP2011090211A JP5768454B2 JP 5768454 B2 JP5768454 B2 JP 5768454B2 JP 2011090211 A JP2011090211 A JP 2011090211A JP 2011090211 A JP2011090211 A JP 2011090211A JP 5768454 B2 JP5768454 B2 JP 5768454B2
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- Prior art keywords
- epoxy resin
- electronic component
- anisotropic conductive
- conductive film
- terminal
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- C09J7/10—Adhesives in the form of films or foils without carriers
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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Description
該エポキシ樹脂が、β−アルキルグリシジル型エポキシ樹脂とグリシジルエーテル型エポキシ樹脂とを質量比9:1〜2:8の割合で含有する異方性導電フィルムを提供する。
第1の電子部品の端子上に、前述の本発明の異方性導電フィルムを仮貼りする工程、
仮貼りされた異方性導電フィルム上に、第2の電子部品を、その端子が第1の電子部品の対応する端子と対向するように仮設置する工程、及び
第2の電子部品を加熱ボンダーで加熱しながら第1の電子部品に対して押圧し、第1の電子部品の端子と第2の電子部品の端子とを異方性導電接続する工程
を有する製造方法を提供する。
図1に示すように、第1の電子部品10の端子11上に、本発明の異方性導電フィルム20を仮貼りする。仮貼りは、後述する加熱ボンダー40(図3参照)を使用し、異方性導電フィルム20が熱硬化しないが粘着性を発現する温度に加熱しながら押圧することにより行うことができる。異方性導電フィルム20中には、導電性粒子21が分散している。
次に、図2に示すように、仮貼りされた異方性導電フィルム20上に、第2の電子部品30を、その端子31が第1の電子部品10の対応する端子11と対向するように仮設置する。仮設置は、後述する加熱ボンダー40(図3参照)を使用し、異方性導電フィルム20が熱硬化しないが粘着性を発現する温度に加熱しながら押圧することにより行うことができる。この仮設置の際、第2の電子部品30又は異方性導電フィルム20の位置ズレが生じた場合、必要に応じて、例えば、第1の電子部品10側を熱板で加熱して異方性導電フィルム20を軟化させ、第2の電子部品30を常法により引き剥がし、第1の電子部品10又は第2の電子部品30の表面に残存した熱硬化型エポキシ樹脂組成物をアセトンなどの有機溶剤で除去することができる。これにより良好なリペア性を実現することができる。
次に、図3に示すように、第2の電子部品30を加熱ボンダー40で加熱しながら第1の電子部品10に対して押圧する。すると、端子11と端子31とに挟まれた導電性粒子21が潰れ、第1の電子部品10の端子11と第2の電子部品30の端子31との間で電気的に導通する。これにより、図4に示すように、第1の電子部品10の端子11と第2の電子部品30の端子31とが異方性導電フィルム20により異方性導電接続されている接続構造体100が得られる。
<異方性導電フィルムの作成>
表1及び2の配合割合(質量部基準)で、熱可塑性樹脂(フェノキシ樹脂)、β−メチルグリシジル型エポキシ樹脂A、グリシジルエーテル型エポキシ樹脂B、シランカップリング剤、カチオン系硬化剤、応力緩和剤(ポリブタジエン粒子)及び導電性粒子を、撹拌装置を用いて均一に混合し、剥離フィルム上に乾燥厚が20μmとなるように塗布し、70℃のオーブン中で乾燥することにより、異方性導電フィルムを作成した。
実施例1〜12、比較例1〜7で得た異方性導電フィルムについて、以下に説明するように、示差走査熱量分析(反応開始温度、反応ピーク温度、発熱量減少率)、熱圧着条件を変化させて作成した接続構造体(COFとガラス基板との異方性導電接続体)の接続抵抗、接着強度及びリペア性を試験評価した。得られた結果を表1及び表2に示す。
1)DSC
異方性導電フィルムを、DSC装置(DSC−60、島津製作所社製)を用いて熱分析を行い、発熱開始温度(℃)、反応ピーク温度(℃)を測定した。実用上、低温速硬化性と保存性とを考慮し、発熱開始温度は90〜110℃であることが望ましく、また、発熱ピーク温度は100〜130℃であることが望ましい。
製造直後、又は30℃に1ヶ月、2ヶ月もしくは3ヶ月放置した異方性導電フィルムについて、DSC装置(DSC−60、島津製作所社製)を用いて熱分析を行い、総発熱量(j/g)を測定し、製造直後の異方性導電フィルムの総発熱量に対する、30℃に1ヶ月、2ヶ月もしくは3ヶ月放置した異方性導電フィルムの総発熱量の減少率(%)を算出した。実用上、1ヶ月後の減少率(%)が35%以下であることが望まれる。
評価用基材としてチップオンフィルム(COF)基材(38μm厚のポリイミドフィルム表面に、50μmピッチのCu8μm厚−Snメッキ電極ラインが形成された基材)と、インジウムスズ複合酸化物(ITO)からなるベタ電極が形成されたガラス基板とを用意した。
接続抵抗の測定の際に作成したものと同じ接続構造体を作成し、85℃及び85%RHの環境下に500時間放置した。次に、接続構造体のCOF基板を、引っ張り試験機(AND社製)を用い、引っ張り速度50mm/secで90°方向に剥離し、その時の剥離強度を測定した。実用上6N/cm以上であることが望まれる。
評価用基材としてチップオンフィルム(COF)基材(38μm厚のポリイミドフィルム表面に、50μmピッチのCu8μm厚−Snメッキ電極ラインが形成された基材)と、インジウムスズ複合酸化物(ITO)からなるベタ電極が形成されたガラス基板とを用意した。
*1 フェノキシ樹脂(JER−4210、三菱化学(株))
*2 1モルのビスフェノールAに2モルのβ−メチルエピクロロヒドリンを反応させたもの
*3 1モルのレゾルシノールに2モルのβ−メチルエピクロロヒドリンを反応させたもの
*4 jER−828、三菱化学(株)
*5 EP−4100S、(株)ADEKA
*6 平均粒径0.5μmのポリブタジエン粒子(RKB、レジナス化成(株))
*7 KBM−403、信越化学工業(株)
*8 アリールスルホニウム塩系硬化剤(SI−60、三新化学工業(株))+3%安定剤(p−ヒドロキシフェニルジメチルスルホニウムメチルサルフェート)
*9 アリールスルホニウム塩系硬化剤(SI−60、三新化学工業(株))+5%安定剤(p−ヒドロキシフェニルジメチルスルホニウムメチルサルフェート)
*10 アリールスルホニウム塩系硬化剤(SI−60、三新化学工業(株))+8%安定剤(p−ヒドロキシフェニルジメチルスルホニウムメチルサルフェート)
*11 アリールスルホニウム塩系硬化剤(SI−80、三新化学工業(株))+3%安定剤(p−ヒドロキシフェニルジメチルスルホニウムメチルサルフェート)
*12 ブライトGNR、日本化学工業(株)
*13 CEL2021P、ダイセル化学工業(株)
11、31 端子
20 異方性導電フィルム
21 導電性粒子
30 第2の電子部品
40 加熱ボンダー
100 接続構造体
Claims (11)
- エポキシ樹脂と、エポキシ樹脂用硬化剤としてカチオン系硬化剤と、膜形成用樹脂とを含む熱硬化型エポキシ樹脂組成物中に導電性粒子が分散している異方性導電フィルムにおいて、
該エポキシ樹脂が、β−アルキルグリシジル型エポキシ樹脂とグリシジルエーテル型エポキシ樹脂とを質量比9:1〜2:8の割合で含有する異方性導電フィルム。 - 該エポキシ樹脂が、β−アルキルグリシジル型エポキシ樹脂とグリシジルエーテル型エポキシ樹脂とを質量比8:2〜4:6の割合で含有する請求項1記載の異方性導電フィルム。
- 該β−アルキルグリシジル型エポキシ樹脂が、ジ(β−メチルグリシジル)レゾルシノールエーテルである請求項1又は2記載の異方性導電フィルム。
- 該グリシジルエーテル型エポキシ樹脂が、アルキレンオキサイド変性グリシジルエーテル型エポキシ樹脂である請求項1〜3のいずれかに記載の異方性導電フィルム。
- カチオン系硬化剤が、アリールスルホニウム塩系硬化剤である請求項1〜4のいずれかに記載の異方性導電フィルム。
- 第1の電子部品の端子と第2の電子部品の端子とが異方性導電フィルムにより異方性導電接続されている接続構造体の製造方法であって、
第1の電子部品の端子上に、請求項1〜5のいずれかに記載の異方性導電フィルムを仮貼りする工程、
仮貼りされた異方性導電フィルム上に、第2の電子部品を、その端子が第1の電子部品の対応する端子と対向するように仮設置する工程、及び
第2の電子部品を加熱ボンダーで加熱しながら第1の電子部品に対して押圧し、第1の電子部品の端子と第2の電子部品の端子とを異方性導電接続する工程
を有する製造方法。 - 第1の電子部品の端子と第2の電子部品の端子とが請求項1〜5のいずれかに記載の異方性導電フィルムにより異方性導電接続されてなる接続構造体。
- エポキシ樹脂と、エポキシ樹脂用硬化剤としてカチオン系硬化剤と、膜形成用樹脂とを含む熱硬化型エポキシ樹脂組成物中に導電性粒子が分散している異方性導電フィルムにおいて、
該エポキシ樹脂が、β−アルキルグリシジル型エポキシ樹脂とグリシジルエーテル型エポキシ樹脂とを質量比8:2〜4:6の割合で含有し、
該β−アルキルグリシジル型エポキシ樹脂が、ジ(β−メチルグリシジル)レゾルシノールエーテルである異方性導電フィルム。 - 該グリシジルエーテル型エポキシ樹脂が、アルキレンオキサイド変性グリシジルエーテル型エポキシ樹脂である請求項8記載の異方性導電フィルム。
- 第1の電子部品の端子と第2の電子部品の端子とが異方性導電フィルムにより異方性導電接続されている接続構造体の製造方法であって、
第1の電子部品の端子上に、請求項8又は9記載の異方性導電フィルムを仮貼りする工程、
仮貼りされた異方性導電フィルム上に、第2の電子部品を、その端子が第1の電子部品の対応する端子と対向するように仮設置する工程、及び
第2の電子部品を加熱ボンダーで加熱しながら第1の電子部品に対して押圧し、第1の電子部品の端子と第2の電子部品の端子とを異方性導電接続する工程
を有する製造方法。 - 第1の電子部品の端子と第2の電子部品の端子とが請求項8又は9記載の異方性導電フィルムにより異方性導電接続されてなる接続構造体。
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KR101712703B1 (ko) * | 2014-07-18 | 2017-03-06 | 삼성에스디아이 주식회사 | 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치 |
KR101706821B1 (ko) | 2014-09-01 | 2017-02-14 | 삼성에스디아이 주식회사 | 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치 |
KR102240963B1 (ko) * | 2014-10-28 | 2021-04-16 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 그 제조 방법, 및 접속 구조체 |
WO2017057920A1 (ko) * | 2015-09-30 | 2017-04-06 | 삼성에스디아이 주식회사 | 이방 도전성 필름 및 이를 이용한 디스플레이 장치 |
KR101900542B1 (ko) * | 2015-09-30 | 2018-09-19 | 삼성에스디아이 주식회사 | 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 디스플레이 장치 |
JP6672837B2 (ja) * | 2016-01-28 | 2020-03-25 | 日立化成株式会社 | 異方導電性接着剤組成物、フィルム状接着剤、接続構造体及び半導体装置 |
JP2018104653A (ja) * | 2016-12-28 | 2018-07-05 | 日立化成株式会社 | 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤 |
CN107248539B (zh) * | 2017-04-28 | 2020-02-07 | 厦门市三安光电科技有限公司 | 一种led封装工艺 |
JP6956190B2 (ja) * | 2017-08-29 | 2021-11-02 | 三菱重工業株式会社 | 硬化性組成物、硬化性ペースト材、硬化性シート材、硬化性型取り材、硬化方法および硬化物 |
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