CN107408770A - The connection method of connection sheet, flexible flat cable, the connecting structure of flexible flat cable and flexible flat cable - Google Patents
The connection method of connection sheet, flexible flat cable, the connecting structure of flexible flat cable and flexible flat cable Download PDFInfo
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- CN107408770A CN107408770A CN201580078241.0A CN201580078241A CN107408770A CN 107408770 A CN107408770 A CN 107408770A CN 201580078241 A CN201580078241 A CN 201580078241A CN 107408770 A CN107408770 A CN 107408770A
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- Prior art keywords
- mentioned
- conductive paste
- flat cable
- flexible flat
- connection sheet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
- H02G1/14—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for joining or terminating cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Insulated Conductors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Purpose is to provide a kind of connection sheet, and the connection sheet can improve the conduction between the distribution of connecting object, and can promote slimming and the space saving of coupling part.The connection sheet of the present invention is used for the electrical connection of the flexible flat cable with multiple distributions, and the connection sheet possesses：Multiple conductive paste portions, they are bandings, are accordingly configured side by side with above-mentioned multiple distributions when overlooking, the adhesive comprising conductive particle and the particle；And bonding agent portion, it is at least configured between above-mentioned multiple conductive paste portions, and main component is used as using thermoplastic resin.Above-mentioned bonding agent portion is configurable to surround above-mentioned multiple conductive paste portions when overlooking.The average thickness in above-mentioned conductive paste portion and the average thickness in bonding agent portion can be with identical.The mean breadth in above-mentioned conductive paste portion can be less than the mean breadth of above-mentioned distribution.Can also possess binding agent portion, the binding agent portion is configured at identical layer with above-mentioned conductive paste portion and bonding agent portion.
Description
Technical field
The present invention relates to connection sheet, flexible flat cable, flexible flat cable connecting structure and flexible flat cable
Connection method.
Background technology
Flexible flat cable is used in the electrical connection for the electronic unit being contained in electronic instrument.The flexible flat cable
With the structure for being coated multiple conductors of flat ribbon by insulating barrier.The flexible flat cable passes through usual end and special company
Device connection is connect, is electrically connected via the special connector and other conductors.
If however, special connector as use, coupling part becomes big, runs counter to the slimming of electronic unit, saves
The requirement such as spatialization.
Therefore, currently, it is also proposed that by that can promote the slimming of electronic unit without using special connector, save sky
Between change etc. connecting structure.As such connecting structure, such as " circuit substrate and electrode connector and the manufacturer are enumerated
Method " (with reference to Japanese Unexamined Patent Publication 7-226569 publications).
Connecting structure described in the publication has following structure, i.e. on basement membrane via thermoplastic adhesive's oxidant layer layer
The 1st folded conductor is connected with other conductors (the 2nd conductor).Connecting structure described in the publication is characterised by, in advance by the 1st
The thickness that conductor is bonded in epilamellar thermoplastic adhesive's oxidant layer sets larger.For the connecting structure described in the publication,
When being thermally compressed to the 1st conductor and the 2nd conductor, the thermoplastic adhesive for forming above-mentioned thermoplastic adhesive's oxidant layer is flowed
Will be filled around above-mentioned 1st conductor and the 2nd conductor, thus, it is possible to which the 1st conductor and the 2nd conductor are firmly attached.
Patent document 1：Japanese Unexamined Patent Publication 7-226569 publications
The content of the invention
However, connecting structure described in above-mentioned publication passes through the thermoplastic filled around the 1st conductor and the 2nd conductor
Property bonding agent and the 1st conductor and the 2nd conductor are connected, and the opposite face of the 1st conductor and the 2nd conductor is not electrically connected each other
Connect, therefore with the problem of can not reliably electrically connecting the 1st conductor and the 2nd conductor.In addition, for described in above-mentioned publication
Connecting structure, thermoplastic adhesive flowed between the 1st conductor and the opposite face of the 2nd conductor, thus in the presence of the 1st conductor with
And the 2nd conductor the possibility that further deteriorates of conduction.
The present invention is exactly to propose in view of the above problems, and its object is to provide one kind to improve conduction and rush
Enter the slimming of coupling part and the connection sheet of space saving, flexible flat cable, flexible flat cable connecting structure with
And the connection method of flexible flat cable.
The connection sheet that the of the invention mode proposed to solve above-mentioned problem is related to, it is used for having multiple match somebody with somebody
The electrical connection of the flexible flat cable of line, the connection sheet possess：Multiple conductive paste portions, they are bandings, overlook when with
Above-mentioned multiple distributions accordingly configure side by side, the adhesive comprising conductive particle and the particle；And bonding agent portion, its
At least it is configured between above-mentioned multiple conductive paste portions, main component is used as using thermoplastic resin.
The flexible flat cable that another mode of the invention proposed to solve above-mentioned problem is related to has multiple
Distribution, the flexible flat cable is in the region that at least one face side of above-mentioned multiple distributions is exposed, with above-mentioned more when overlooking
Individual distribution and the mode of above-mentioned multiple conductive paste portion matchings are bonded to the connection sheet.
The connection structure for the flexible flat cable that another mode of the invention proposed to solve above-mentioned problem is related to
Make and possess with multiple distributions, the connecting structure of the flexible flat cable：At least one face side of above-mentioned multiple distributions is exposed
Flexible flat cable；The connection sheet, its flexible flat cable exposed area, with overlook when above-mentioned multiple distributions and
The mode of above-mentioned multiple conductive paste portion matchings is engaged；And other multiple distributions, they are individually coupled to above-mentioned connection sheet
Multiple conductive paste portions side opposite with the composition surface of above-mentioned multiple distributions surface.
The connection side for the flexible flat cable that another mode of the invention proposed to solve above-mentioned problem is related to
Method, the flexible flat cable have multiple distributions, and the connection method of the flexible flat cable has following processes：Expose process,
At least one face side of multiple distributions of above-mentioned flexible flat cable is exposed；1st overlapping step, in the flexible flat cable
Exposed area, make the connection sheet weight in a manner of above-mentioned multiple distributions and the matching of above-mentioned multiple conductive paste portions when to overlook
It is folded；2nd overlapping step, make to be overlapped in above-mentioned multiple conductive paste portions respectively as other multiple distributions of connecting object with it is upper
State the surface of the opposite side of faying surface of multiple distributions；And crimping process, area is exposed to overlapping above-mentioned flexible flat cable
Domain, connection sheet and other multiple distributions are thermally compressed.
The effect of invention
The connection sheet of the present invention, flexible flat cable, the connecting structure of flexible flat cable and flexible flat cable
Connection method can improve conduction and promote slimming and the space saving of coupling part.
Brief description of the drawings
Fig. 1 is the schematic oblique of a part of section for the flexible flat cable being related to comprising an embodiment of the invention
View.
Fig. 2 is the schematic exploded oblique view of Fig. 1 flexible flat cable.
Fig. 3 is the schematic plan of Fig. 1 flexible flat cable.
Fig. 4 is the line A-A enlarged partial sectional view of Fig. 3 flexible flat cable.
Fig. 5 is the schematic strabismus for the connection sheet for representing the flexible flat cable that an embodiment of the invention is related to
Figure.
Fig. 6 A are the schematic oblique views of the overlapping step of the manufacture method for the flexible flat cable for illustrating Fig. 1.
Fig. 6 B are the schematic oblique views of the crimping process of the manufacture method for the flexible flat cable for illustrating Fig. 1.
Fig. 6 C are the schematic oblique views of the stripping process of the manufacture method for the flexible flat cable for illustrating Fig. 1.
Fig. 7 is the schematic sectional for the connecting structure for representing the flexible flat cable that an embodiment of the invention is related to
Figure.
Fig. 8 A are the 2nd overlapping works of the connection method for illustrating the flexible flat cable that an embodiment of the invention is related to
The schematic oblique view of sequence.
Fig. 8 B are the crimping process for the connection method for illustrating the flexible flat cable that an embodiment of the invention is related to
Schematic oblique view.
Fig. 9 is the schematic oblique view for representing the connection sheets different from Fig. 5 connection sheet that embodiment is related to.
Embodiment
[explanations of embodiments of the present invention]
First, embodiments of the present invention are enumerated and illustrated.
The connection sheet that one mode of the present invention is related to is used for the electrical connection of the flexible flat cable with multiple distributions, should
Connection sheet possesses：Multiple conductive paste portions, they are bandings, are accordingly matched somebody with somebody side by side with above-mentioned multiple distributions when overlooking
Put, the adhesive comprising conductive particle and the particle；And bonding agent portion, it is at least configured at above-mentioned multiple conductive pastes
Between portion, main component is used as using thermoplastic resin.
The connection sheet is configured to, and multiple conductive paste portions engage respectively with the surface of multiple distributions of flexible flat cable,
And bonding agent portion is configured between the plurality of conductive paste portion.Therefore, the connection sheet can be incited somebody to action by above-mentioned conductive paste portion
Above-mentioned distribution and other distributions as connecting object carry out physical bonding in facing part, and are electrically connected.
In addition, the connection sheet can ensure the mutual insulating properties of adjacent distribution by above-mentioned bonding agent portion, and improve and be connected pair
Cementability and conduction between the distribution of elephant.Thus, the connection sheet can improve the conducting between the distribution of connecting object
Property, and by promoting the slimming of coupling part and space saving without using special connector.
Above-mentioned bonding agent portion is configurable to surround above-mentioned multiple conductive paste portions when overlooking.So, by will be above-mentioned
Bonding agent portion is configured to surround above-mentioned multiple conductive paste portions when overlooking, anti-short between adjacent distribution so as to promote
Road effect, and can further improve the cementability between the distribution of connecting object.
The average thickness in above-mentioned conductive paste portion and the average thickness in bonding agent portion can be with identical.So, led by above-mentioned
The average thickness in electrical cream portion is identical with the average thickness in bonding agent portion, anti-short between adjacent distribution child so as to promote
Road effect, and can further improve the cementability between the distribution of connecting object.
The mean breadth in above-mentioned conductive paste portion can be less than the mean breadth of above-mentioned distribution.So, above-mentioned conduction is passed through
Property cream portion mean breadth be less than above-mentioned distribution mean breadth, so as to promote between adjacent distribution it is anti-short circuit effect
Fruit, and can further improve the cementability between the distribution of connecting object.
The softening of the polymer for forming the adhesive in above-mentioned conductive paste portion and the polymer for forming above-mentioned bonding agent portion
Temperature is preferably greater than or equal to 40 DEG C and is less than or equal to 70 DEG C.So, by forming the adhesive in above-mentioned conductive paste portion
Polymer and form above-mentioned bonding agent portion polymer softening temperature within the above range, so as to which above-mentioned polymer becomes
Easily softened at a lower temperature.Therefore, above-mentioned conductive paste portion and bonding agent portion is made to diffuse between connecting object
Gap and become easily to improve cementability.
Binding agent portion can be also equipped with, the binding agent portion is configured at identical with above-mentioned conductive paste portion and bonding agent portion
Layer.So, by being also equipped with binding agent portion, the binding agent portion is configured at identical with above-mentioned conductive paste portion and bonding agent portion
Layer, so as to temporarily be fixed to the connection sheet and flexible flat cable by the binding agent portion.Thus, by for example temporary transient
The connection sheet and flexible flat cable are thermally compressed under stationary state, so as to prevent the connection sheet and flexibility flat
The position deviation during thermo-compression bonding of horizontal line cable, can by the connection sheet and flexible flat cable in desired position easily and can
Engaged by ground.In addition, according to the structure, can omit to for the fixture of the connection sheet and flexible flat cable positioning to be entered
Exercise the workload of used time.
Can also possess mould release membrance, the release film layer is laminated on a surface in above-mentioned conductive paste portion and bonding agent portion.
So, by being also equipped with mould release membrance, the release film layer is laminated on a surface in conductive paste portion and bonding agent portion, so as to
Improve operability.In addition, for example above-mentioned mould release membrance is peeled off before it will be attached each other to connecting object, thus
It can prevent foreign matter, dust from adhering to above-mentioned multiple conductive paste portions and bonding agent portion and improving conduction and cementability.
The flexible flat cable that the mode of the present invention is related to has multiple distributions, and the flexible flat cable is above-mentioned more
The region that at least one face side of individual distribution is exposed, with above-mentioned multiple distributions and above-mentioned multiple conductive paste portions when overlooking
The mode matched somebody with somebody is bonded to the connection sheet.
The flexible flat cable can by above-mentioned conductive paste portion by above-mentioned distribution and be used as connecting object other
Distribution carries out physical bonding in facing part, and is electrically connected, and is ensured by above-mentioned bonding agent portion adjacent
The mutual insulating properties of distribution, and improve cementability and conduction between the distribution of connecting object.Thus, the flexible flat
Cable can improve the conduction before the distribution of connecting object, and promote slimming and the space saving of coupling part.
The connecting structure for the flexible flat cable that the mode of the present invention is related to, the flexible flat cable have multiple match somebody with somebody
Line, the connecting structure of the flexible flat cable possess the flexible flat that at least one face side of above-mentioned multiple distributions is exposed
Cable；The connection sheet, its flexible flat cable exposed area, with above-mentioned multiple distributions and above-mentioned multiple conductions when overlooking
Property cream portion matching mode be engaged；And other multiple distributions, they are individually coupled to multiple electric conductivity of above-mentioned connection sheet
The surface of the side opposite with the composition surface of above-mentioned multiple distributions in cream portion.
For the connecting structure of the flexible flat cable, multiple electric conductivity of the connection sheet are bonded to respectively in multiple distributions
Cream portion, it is more that other are bonded to respectively on the surface of the side opposite with the composition surface of above-mentioned multiple distributions in above-mentioned multiple conductive paste portions
Individual distribution, thus as described as, it is possible to increase the conduction between the distribution of connecting object, and promote coupling part it is thin
Type and space saving.
The connection method for the flexible flat cable that the mode of the present invention is related to, the flexible flat cable have multiple match somebody with somebody
Line, the connection method of the flexible flat cable have following processes：Expose process, by multiple distributions of above-mentioned flexible flat cable
At least one face side expose；1st overlapping step, in the exposed area of the flexible flat cable, with above-mentioned more when overlooking
Individual distribution and the mode of above-mentioned multiple conductive paste portion matchings make the connection sheet overlapping；2nd overlapping step, makes respectively as connection
Other multiple distributions of object are overlapped in the table of the side opposite with the faying surface of above-mentioned multiple distributions in above-mentioned multiple conductive paste portions
Face；And crimping process, the exposed area of overlapping above-mentioned flexible flat cable, connection sheet and other multiple distributions are carried out
Thermo-compression bonding.
The connection method of the flexible flat cable is as has been described, it is possible to increase the conducting between the distribution of connecting object
Property, and promote slimming and the space saving of coupling part.
In addition, in the present invention, " average thickness in conductive paste portion is identical with the average thickness in bonding agent portion " represents,
The average thickness in multiple conductive paste portions at the section after deciding what is right and what is wrong in the width direction and the average thickness phase in multiple bonding agent portions
Together, " identical " refers to that average thickness ratio is more than or equal to 9/10 less than or equal to 11/10, preferably refers to be more than or equal to 19/
20 and less than or equal to 21/20." softening temperature " refers to the softening temperature determined according to JIS-K7196 (1991)." banding "
Elongate form when referring to overlook.
[details of embodiments of the present invention]
Below, suitably referring to the drawings, connection sheet, flexible flat cable, the flexibility being related to embodiments of the present invention are flat
The connection method of the connecting structure and flexible flat cable of horizontal line cable illustrates.
[first embodiment]
＜ flexible flat cables ＞
Fig. 1~Fig. 3 flexible flat cable 1 possesses：Flat cable main body 2, the connection sheet of flexible flat cable 3 are (below,
Also referred to as " connection sheet 3 ") and reinforced sheet 4.Flexible flat cable 1 has flexibility.
(flat cable main body)
Flat cable main body 2 mainly has：Multiple distributions 5, it is configured with striated；And bond layer 7, it is to wrap
The mode for enclosing multiple distributions 5 is configured at the insulating barrier of positive and negative (specifically in a manner of surrounding the side face of multiple distributions 5).Separately
Outside, in flat cable main body 2, a pair of dielectric films 6a, 6b coat the positive and negative of multiple distributions 5 via bond layer 7.In addition,
" positive and negative " is to be defined as a face side as front for convenience, and another face side is as reverse side, is not tool
Body limits the content of the structure of the flexible flat cable of the present invention.Substantially put down in the same plane in addition, " striated " represents
The state (that is, the state configured side by side) arranged capablely, " almost parallel " refer to central shaft angulation for ± 10 ° with
It is interior.
(distribution)
Distribution 5 is made up of conductor.Multiple distributions 5 are formed with strip and tabular.One at one side of multiple distributions 5
Individual face side (face side in present embodiment) is exposed.Distribution 5 is formed by the material with conduction.Master as distribution 5
Composition is wanted, enumerates such as copper.In addition, " main component " refers to the most composition of content, refer to that for example content is more than or equal to 50
Quality % composition.
As the lower limit of the average length in the exposed portion (exposed area B described later) of multiple distributions 5, preferably 2mm,
More preferably 3mm.On the other hand, the upper limit as above-mentioned average length, preferably 10mm, more preferably 5mm.It is if above-mentioned flat
The above-mentioned lower limit of equal curtailment, then the adhesive strength between other distributions and conduction are possible to become insufficient.On the contrary,
If above-mentioned average length exceedes the above-mentioned upper limit, coupling part is possible to become too much.
For multiple distributions 5, implement plating processing on surface, handled by the plating to be laminated with plating layer on surface
(not shown).As plating processing, enumerate such as gold-plated, silver-plated, tin plating.It can be handled by plating to prevent multiple match somebody with somebody
Breakage etc. occurs for the exposed portion of line 5.
As the lower limit of the average thickness (including plating layer) of distribution 5, more preferably preferably 10 μm, 25 μm.The opposing party
Face, as the upper limit of the average thickness of distribution 5, preferably 100 μm, more preferably 80 μm.If the average thickness deficiency of distribution 5
Above-mentioned lower limit, then conduction be possible to become insufficient.On the contrary, if the average thickness of distribution 5 exceedes the above-mentioned upper limit, this is soft
Property flat cable 1 is possible to become blocked up.
As the lower limit of the mean breadth (including plating layer) of distribution 5, more preferably preferably 0.1mm, 0.2mm.It is another
Aspect, as the upper limit of the mean breadth of distribution 5, preferably 1mm, more preferably 0.4mm.If the mean breadth of distribution 5 is not
The above-mentioned lower limit of foot, then conduction be possible to become insufficient.On the contrary, if the mean breadth of distribution 5 exceedes the above-mentioned upper limit, it is somebody's turn to do
The width of flexible flat cable 1 is possible to become too much.
As the lower limit of the average headway of distribution 5, preferably 0.2mm, more preferably 0.3mm.On the other hand, as distribution
The upper limit of 5 average headway, preferably 1.5mm, more preferably 1.2mm.If the above-mentioned lower limit of average headway deficiency of distribution 5,
Then adjacent distribution 5 is likely to contact each other.On the contrary, if the average headway of distribution 5 exceedes the above-mentioned upper limit, the flexible flat
The width of cable 1 is possible to become too much.
The radical of distribution 5 can be increased and decreased as needed, be not particularly limited, and can be set to be greater than or equal to 10
Root and less than or equal to 60.
(bond layer)
As the bonding agent for forming bond layer 7, it is not particularly limited, but preferably flexibility, the bonding of excellent heat resistance
Agent, enumerate such as epoxy resin, polyimides, polyester, phenolic resin, polyurethane, acrylic resin, melamine resin, polyamide
The bonding agent of the various resinaes such as acid imide.
The average thickness (average distance between distribution 5 and dielectric film 6a) and bonding of the face side of bond layer 7
The average thickness (average distance between distribution 5 and dielectric film 6b) of the reverse side of oxidant layer 7 is roughly equal.As bond layer
The lower limit of the average thickness of 7 face side and the average thickness of the reverse side of bond layer 7, preferably 5 μm, more preferably 15
μm.On the other hand, the upper limit as above-mentioned average thickness, preferably 50 μm, more preferably 40 μm.If above-mentioned average thickness is not
The above-mentioned lower limit of foot, then the adhesive strength between multiple distributions 5 and dielectric film 6a, 6b be possible to become insufficient.If on the contrary,
State average thickness and exceed the above-mentioned upper limit, then the flexible flat cable 1 is possible to become blocked up.
(dielectric film)
Dielectric film 6a, 6b are made up of the sheet component with flexible and electrical insulating property.As the dielectric film 6a, 6b, tool
Resin film can be used for body.As the main component of the resin film, it is adapted to use such as polyimides, poly terephthalic acid
Glycol ester etc..
As the lower limit of dielectric film 6a, 6b average thickness, preferably 5 μm, more preferably 10 μm.On the other hand, as
The upper limit of dielectric film 6a, 6b average thickness, preferably 40 μm, more preferably 20 μm.If dielectric film 6a, 6b average thickness
The above-mentioned lower limit of deficiency, then dielectric film 6a, 6b intensity be possible to become insufficient.If on the contrary, dielectric film 6a, 6b average thickness
Degree exceedes the above-mentioned upper limit, then the flexible flat cable 1 is possible to become blocked up.
(connection sheet)
Connection sheet 3 is used for the electrical connection of the flexible flat cable with multiple distributions 5.Specifically, connection sheet 3 is by flexibility
Flat cable electrically connects with other distributions, and the flexible flat cable possesses：Multiple distributions 5, it is configured with striated；And bonding
Oxidant layer 7, it is the insulating barrier that positive and negative is configured in a manner of surrounding multiple distributions 5.Connection sheet 3 at least with multiple distributions 5
The surface side engagement for the exposed area B that one face side is exposed.Connection sheet 3 has：Multiple conductive paste portions 8, they
Correspond to multiple distributions 5 during vertical view and configure side by side；And bonding agent portion 9, its be at least configured at multiple conductive paste portions 8 it
Between.That is, the exposed area B that the flexible flat cable 1 exposes at least one face side of multiple distributions 5, with more when overlooking
Individual distribution 5 and the mode of multiple conductive paste portions 8 matching are bonded to the connection sheet 3.In addition, as shown in figure 4, multiple conductive pastes
One surface in portion 8 and bonding agent portion 9 has based on each surface tension and with the section shape of substantially arched sigmoid.By
This, when a surface in multiple conductive paste portions 8 and bonding agent portion 9 and other distributions, substrate etc. are thermally compressed, prevents
The only mixing between multiple conductive paste portions 8 and bonding agent portion 9.As a result, it is easy to improve multiple distributions 5 and as connection pair
Conduction between other distributions of elephant, and be easy to bond layer 9 and other substrates etc. being bonded securely.
(conductive paste portion)
Conductive paste portion 8 is by the conductive paste shape including the adhesive comprising conductive particle and the conductive particle
Into.Conductive paste portion 8 is formed with banding.
As above-mentioned conductive particle, the metallic particles such as silver, platinum, gold, copper, nickel, palladium, scolding tin is enumerated, can be with
They are more than or equal to 2 kinds with monomer or mixing and used.Wherein, preferably show excellent electric conductivity silver powder,
Silver coating copper powders, soldering tin powder etc., especially preferential flakey silver powder.As above-mentioned conductive particle, by using scale
Shape silver powder, conduction is improved so as to increase contact area.In addition, " flakey " refers to, orthogonal 3 directions
Size in the size of (length direction, width, thickness direction), 1 direction (thickness direction) is less than or equal to it
The maximum of size on his 2 directions (length direction, width) 1/2, preferably greater than or equal to 1/50 and be less than or
Shape equal to 1/5.
As the lower limit of the average grain diameter of above-mentioned conductive particle, preferably 0.3 μm, more preferably 0.5 μm.The opposing party
Face, as the upper limit of the average grain diameter of above-mentioned conductive particle, preferably 20 μm, more preferably 10 μm.If above-mentioned electric conductivity
The above-mentioned lower limit of average grain diameter deficiency of particle, it is likely that can not fully obtain conduction.If on the contrary, above-mentioned electric conductivity
The average grain diameter of grain exceedes the above-mentioned upper limit, then in the case where for example forming conductive paste portion 8 using silk-screen printing, it is possible to
Clogging is produced in silk screen.In addition, " average grain diameter " refers to accumulate 50% volume mean diameter (median particle diameter), can pass through
Such as apply the particle size distribution device (" Machine of laser Doppler method and fill Co., Ltd. " " Na ノ ト ラ ッ Network " (note of system
Volume trade mark) particle size distribution device " UPA-EX150 ") and be measured.
As the lower limit of the content of the above-mentioned conductive particle in conductive paste portion 8, preferably 40 volume %, it is more preferably
45 volume %.On the other hand, as above-mentioned conductive particle content the upper limit, preferably 95 volume %, more preferably 85 bodies
Product %.If the above-mentioned lower limit of containing ratio deficiency of above-mentioned conductive particle, distribution 5 and as connecting object other distributions it
Between electrical connectivity be likely to decrease.On the contrary, if the content of above-mentioned conductive particle exceedes the above-mentioned upper limit, conductive paste
Mobility reduces, it is possible to is difficult to be formed conductive paste portion 8, or distribution 5 and other distributions as connecting object glue
Intensity is connect to be likely to decrease.
As the main component of above-mentioned adhesive, such as acrylic resin, polyamide, polyolefin, fluororesin, poly- is enumerated
The thermoplastic resins such as ester, silicones.
As the lower limit of the softening temperature for the polymer for forming above-mentioned adhesive, more preferably preferably 40 DEG C, 50 DEG C.Separately
On the one hand, as the polymer for forming above-mentioned adhesive softening temperature the upper limit, preferably 70 DEG C, more preferably 65 DEG C.Such as
Fruit forms the above-mentioned lower limit of softening temperature deficiency of the polymer of above-mentioned adhesive, then heat resistance is possible to become insufficient.On the contrary,
If the softening temperature for forming the polymer of above-mentioned adhesive exceedes the above-mentioned upper limit, conductive paste portion 8 is being engaged in distribution 5
A surface when and hot pressing jointing temp when being bonded using distribution 5 and as other distributions of connecting object be possible to
Uprise.As a result, in the thermo-compression bonding, the bond layer 11 of reinforced sheet 4 described later softens, it is possible to becomes to be difficult to connection sheet
3 are stably held in a surface of distribution 5.
As the lower limit of the glass transition temperature for the polymer for forming above-mentioned adhesive, preferably 30 DEG C, more preferably 35
℃.If forming the above-mentioned lower limit of glass transition temperature deficiency of the polymer of above-mentioned adhesive, the intensity in conductive paste portion 8 has
It may become insufficient.On the other hand, as the polymer for forming above-mentioned adhesive glass transition temperature the upper limit, it is not special
Do not limit, such as 60 DEG C can be set to.In addition, glass transition temperature represents, in being determined according to JIS-K7121 (1987)
Between put glass transition temperature.
Curing agent can be added to above-mentioned adhesive.As the curing agent, such as amine curing agent, polyurethane amine are enumerated
Curing agent, Isocyanates curing agent, acid and acid anhydride type curing agent, basic activated hydrogen compound, the 3rd amine, imidazoles
Deng.Also, in addition to mentioned component, the auxiliary agents such as thickener, levelling agent can also be added to above-mentioned adhesive.
Conductive paste portion 8 when overlooking as shown in figure 3, be formed as approximate rectangular shape.In addition, as shown in figure 4, electric conductivity
The central shaft of the central shaft and distribution 5 parallel to length direction in cream portion 8 is substantially uniform.
The mean breadth in conductive paste portion 8 is less than the mean breadth of distribution 5.In addition, the width in conductive paste portion 8
Both ends are configured at the inner side at the both ends of the width of distribution 5.That is, conductive paste portion 8 is contained in distribution 5 when overlooking.This
Sample, the mean breadth of distribution 5 is less than by the mean breadth in conductive paste portion 8, carried out by conductive paste portion 8 and other distributions
During bonding, conductive paste portion 8 is easily held in a surface of distribution 5.Thus, when being attached with other distributions, even if
Conductive paste portion 8 is somewhat flowed, and can also prevent from producing short circuit between multiple distributions 5.In addition, " conductive paste portion 8 is averaged
Width " refers to, it is on the direction parallel with the width of distribution 5, conductive paste portion 8 with it is flat at the composition surface of distribution 5
Equal length.
As the lower limit of the mean breadth in conductive paste portion 8, preferably 0.08mm, more preferably 0.14mm.On the other hand,
As the upper limit of the mean breadth in conductive paste portion 8, preferably 0.5mm, more preferably 0.3mm.If conductive paste portion 8 is flat
The equal above-mentioned lower limit of short of width, then distribution 5 and it is likely to decrease as the electrical connectivity between other distributions of connecting object.Phase
Instead, if the mean breadth in conductive paste portion 8 exceedes the above-mentioned upper limit, the area in bonding agent portion 9 diminishes, therefore viscous with substrate
Connecing property is possible to become insufficient.
As distribution 5 mean breadth and conductive paste portion 8 mean breadth difference lower limit, preferably 0.02mm, more
Preferably 0.05mm.On the other hand, the poor upper limit as above-mentioned mean breadth, more preferably preferably 0.5mm, 0.2mm.It is logical
Cross and the difference of above-mentioned mean breadth is arranged in above range, so as to easily and reliably prevent between multiple distributions 5
Short circuit, and improve the electrical connectivity between distribution.
As the lower limit of the average thickness in conductive paste portion 8, preferably 0.01mm, more preferably 0.015mm.The opposing party
Face, as the upper limit of the average thickness in conductive paste portion 8, preferably 0.05mm, more preferably 0.035mm.If conductive paste
The above-mentioned lower limit of average thickness deficiency in portion 8, then bonding agent can flow between the opposite face of conductive paste portion 8 and distribution 5, by
The conduction of this conductive paste portion 8 and distribution 5 is likely to occur deterioration.On the contrary, if the average thickness in conductive paste portion 8 surpasses
The above-mentioned upper limit is crossed, then the cementability between substrate is possible to become insufficient.
As the lower limit of the average length (average length direction length) in conductive paste portion 8, preferably 0.5mm, more preferably
For 1mm.On the other hand, as conductive paste portion 8 average length the upper limit, preferably 5mm, more preferably 3mm.It is if conductive
Property cream portion 8 the above-mentioned lower limit of average length deficiency, then distribution 5 and have as the electrical connectivity between other distributions of connecting object
It may become insufficient.On the contrary, if the average length in conductive paste portion 8 exceedes the above-mentioned upper limit, connection sheet 3 is possible to need not
Strategic point becomes big.
(bonding agent portion)
Bonding agent portion 9 is used as main component using thermoplastic resin.Bonding agent portion 9 by by heating and the hot melt adhesion that melts
Agent is formed.Bonding agent portion is configured to surround multiple conductive paste portions 8 when overlooking, such as outer rim is into approximate rectangular shape.This
Sample, it is configured to surround multiple conductive paste portions 8 when overlooking by bonding agent portion 9, so that it can be reliably prevented that adjacent matches somebody with somebody
Short circuit between line, and can further improve the cementability between the distribution of connecting object.
As above-mentioned thermoplastic resin, such as acrylic resin, polyamide, polyolefin, fluororesin, polyester, silicon tree are enumerated
Fat etc..Wherein, as above-mentioned thermoplastic resin, the preferably excellent polyester such as mouldability, insulating properties.
As the lower limit of the softening temperature for the polymer for forming bonding agent portion 9, more preferably preferably 40 DEG C, 50 DEG C.Separately
On the one hand, as the polymer for forming bonding agent portion 9 softening temperature the upper limit, preferably 70 DEG C, more preferably 65 DEG C.If
The above-mentioned lower limit of softening temperature deficiency of the polymer in bonding agent portion 9 is formed, then heat resistance is possible to become insufficient.On the contrary, such as
The softening temperature that fruit forms the polymer in bonding agent portion 9 exceedes the above-mentioned upper limit, then bonding agent portion 9 is being laminated in into reinforced sheet 4
Hot pressing jointing temp when during one surface of bond layer 11 and being adhered to other substrates etc. is possible to uprise.As a result,
Bond layer 11 softens during the thermo-compression bonding, it is possible to can not be reliably Nian Jie with other substrates etc. by bonding agent portion 9.
In addition, form the softening temperature of the polymer in conductive paste portion 8 and form the softening of the polymer in bonding agent portion 9
Temperature is preferably all in above range.So, form the softening temperature of the polymer in conductive paste portion 8 and form bonding agent
The softening temperature of the polymer in portion 9 is in above range, and thus above-mentioned polymer becomes easily at a lower temperature to soften.
Therefore, become easily to be reliably connected at conductive paste portion 8 distribution of connecting object, and bonding agent portion 9 is reliably glued
It is connected to other substrates etc..In addition, according to said structure, easily make the softening temperature of above-mentioned polymer become more viscous than reinforced sheet 4
The softening temperature for connecing oxidant layer 11 is low.Thus, suppress the softening of the bond layer 11 of reinforced sheet 4, become conductive paste portion 8 easily
And bonding agent portion 9 is adhered to desired position.
As the lower limit of the glass transition temperature for the polymer for forming bonding agent portion 9, preferably 30 DEG C, more preferably 35
℃.If forming the above-mentioned lower limit of glass transition temperature deficiency of the polymer in bonding agent portion 9, the intensity in bonding agent portion 9 has can
It can become insufficient.On the other hand, as the polymer for forming bonding agent portion 9 glass transition temperature the upper limit, not especially
Limit, such as 60 DEG C can be set to.
Furthermore it is possible to curing agent, thickener, hot solvent etc. are added with making an addition to adding for above-mentioned adhesive to bonding agent portion 9
Add agent identical additive.
As the lower limit of the mean breadth in the bonding agent portion 9 being laminated between multiple conductive paste portions 8, it is preferably
0.12mm, more preferably 0.22mm.On the other hand, being averaged as the bonding agent portion 9 being laminated between multiple conductive paste portions 8
The upper limit of width, preferably 0.52mm, more preferably 0.42mm.If it is laminated in the bonding agent between multiple conductive paste portions 8
The above-mentioned lower limit of mean breadth deficiency in portion 9, then bond area diminishes, therefore the cementability between substrate is possible to become not fill
Point.It is conductive on the contrary, if the mean breadth in the bonding agent portion 9 being laminated between multiple conductive paste portions 8 exceedes the above-mentioned upper limit
The narrowed width in property cream portion 8, distribution 5 and is likely to decrease as the electrical connectivity between other distributions of connecting object.
In addition, the outside configuration in a pair of conductive cream portion 8 for being laminated in two side ends in multiple conductive paste portions 8 is viscous
The mean breadth for meeting agent portion 9 is identical without the mean breadth in the bonding agent portion 9 with being configured between multiple conductive paste portions 8.Make
For be configured at a pair of conductive cream portion 8 of above-mentioned two side ends outside configure bonding agent portion 9 mean breadth, such as in order to
Cementability is improved, the mean breadth in the bonding agent portion 9 configured between multiple conductive paste portions 8 can be more than.In this case,
As the mean breadth in the bonding agent portion 9 configured in the outside for being configured at a pair of conductive cream portion 8 of above-mentioned two side ends, such as can
Enough it is set to be more than or equal to 0.22mm and be less than or equal to 1mm or so.
As the lower limit of the average thickness in bonding agent portion 9, preferably 0.01mm, more preferably 0.015mm.On the other hand,
As the average thickness upper limit in bonding agent portion 9, more preferably preferably 0.05mm, 0.035mm.If bonding agent portion 9 is averaged
The above-mentioned lower limit of thickness deficiency, then it is possible to become insufficient with the cementability between other substrates etc..If on the contrary, bonding agent portion
9 average thickness exceedes the above-mentioned upper limit, then bonding agent can be flowed between the opposite face of conductive paste portion 8 and distribution 5, so as to
The conduction of conductive paste portion 8 and distribution 5 is likely to occur deterioration.
It is additionally, it is preferred that identical with the average thickness in bonding agent portion 9 for the average thickness in conductive paste portion 8.So, by leading
The average thickness in electrical cream portion 8 is identical with the average thickness in bonding agent portion 9, anti-short between multiple distributions 5 so as to promote
Road effect, and can further improve distribution 5 and as the electrical connectivity between other distributions of connecting object.
As bonding agent portion 9 average length (length in the direction parallel with the length direction in conductive paste portion 8) and lead
The lower limit of the difference of the average length in electrical cream portion 8, more preferably preferably 1mm, 1.5mm.On the other hand, as above-mentioned average long
The poor upper limit of degree, more preferably preferably 5mm, 3mm.If the above-mentioned lower limit of difference deficiency of above-mentioned average length, it is likely that
Conductive paste portion 8 can not reliably be surrounded when overlooking, as a result, being possible to become easily to produce between multiple distributions 5
Short circuit.On the contrary, if the difference of above-mentioned average length exceedes the above-mentioned upper limit, the area of plane in bonding agent portion 9 is possible to become
Greatly.
(reinforced sheet)
Reinforced sheet 4 is configured at a side of the flexible flat cable 1 comprising exposed area B.Reinforced sheet 4 has：Insulation
Layer 10；And bond layer 11, it is laminated in a face side of insulating barrier 10, is laminated with a surface of bond layer 11
Multiple distributions 5.Multiple distributions 5 that reinforced sheet 4 exposes from another surface protection in exposed area B, and in order to be thermally compressed
When conductive paste portion 8 is stably connected with as other distributions of connecting object and bonding agent portion 9 and other substrates etc. is steady
Surely it is bonded and conductive paste portion 8 and bonding agent portion 9 is supported from another surface.Reinforced sheet 4 is preferably configured as
Bright, more preferably it is configured to water white transparency.
(insulating barrier)
Insulating barrier 10 is made up of the sheet component with flexible and electrical insulating property.As the insulating barrier 10, specifically
Resin film can be used.As the main component of the resin film, it is adapted to use such as polyimides, polyethylene terephthalate
Deng.
As the lower limit of the softening temperature for the polymer for forming insulating barrier 10, preferably 100 DEG C, be more preferably 110 DEG C, more
Preferably 120 DEG C.If form the above-mentioned lower limit of softening temperature deficiency of the polymer of insulating barrier 10, the electric conductivity in thermo-compression bonding
Cream portion 8 and bonding agent portion 9 are possible to soften and deform together.On the other hand, as the soft of the polymer for forming insulating barrier 10
Change the upper limit of temperature, be not particularly limited, such as 200 DEG C can be set to.
As the lower limit of the glass transition temperature for the polymer for forming insulating barrier 10, preferably 50 DEG C, be more preferably 60 DEG C,
More preferably 65 DEG C.If the above-mentioned lower limit of glass transition temperature deficiency of the polymer of insulating barrier 10 is formed, after above-mentioned crimping
Intensity be possible to become insufficient.On the other hand, as insulating barrier 10 glass transition temperature the upper limit, especially limit
It is fixed, such as 200 DEG C can be set to.
As the lower limit of the average thickness of insulating barrier 10, preferably 50 μm, more preferably 80 μm.On the other hand, as exhausted
The upper limit of the average thickness of edge layer 10, preferably 200 μm, more preferably 150 μm.If in the average thickness deficiency of insulating barrier 10
Lower limit is stated, then the intensity of insulating barrier 10 is possible to become insufficient.On the contrary, if the average thickness of insulating barrier 10 exceedes on above-mentioned
Limit, then heat is possible to become to be difficult to be transferred to conductive paste portion 8 and bonding agent portion 9 when being thermally compressed.
(bond layer)
As the bonding agent for forming bond layer 11, it is not particularly limited, but preferably flexibility, the bonding of excellent heat resistance
Agent, enumerate such as epoxy resin, polyimides, polyester, phenolic resin, polyurethane, acrylic resin, melamine resin, polyamide
The bonding agent of the various resinaes such as acid imide.Wherein, for thermoplasticity, preferably softening temperature is higher than composition conductive paste portion
The bonding agent of 8 polymer and the polymer in composition bonding agent portion 9.
As the lower limit of the softening temperature for the polymer for forming bond layer 11, more preferably preferably 70 DEG C, 75 DEG C.Such as
Fruit forms the above-mentioned lower limit of softening temperature deficiency of the polymer of bond layer 11, then bond layer 11 can soften when being thermally compressed, and have
Possibly stably the conductive paste portion 8 and bonding agent portion 9 of the face side stacking in the bond layer 11 can not be carried out
Support.In addition, as a result, conductive paste portion 8 and bonding agent portion 9 are mutually mixed, the electrical connectivity between distribution is possible to become
Must be insufficient, and, it is possible to short circuit is produced between multiple distributions 5.On the other hand, as the polymerization for forming bond layer 11
The upper limit of the softening temperature of thing, is not particularly limited, and can be set to such as 200 DEG C.
Preferably comprise softening of the softening temperature higher than the polymer for forming conductive paste portion 8 of the polymer of bond layer 11
The softening temperature of the polymer in temperature and composition bonding agent portion 9.In addition, the softening as the polymer for forming bond layer 11
Temperature and form conductive paste portion 8 polymer softening temperature and form bonding agent portion 9 polymer softening temperature it
The lower limit of difference, more preferably preferably 10 DEG C, 15 DEG C.If the above-mentioned lower limit of difference deficiency of above-mentioned softening temperature, when being thermally compressed
The possibility that bond layer 11 softens uprises.On the other hand, the poor upper limit as above-mentioned softening temperature, is not particularly limited,
Such as 160 DEG C can be set to.
As the lower limit of the glass transition temperature for the polymer for forming bond layer 11, preferably 50 DEG C, be more preferably 60
DEG C, more preferably 70 DEG C.If form the above-mentioned lower limit of glass transition temperature deficiency of the polymer of bond layer 11, above-mentioned heat
Intensity after crimping is possible to become insufficient.On the other hand, the gamma transition temperature as the polymer for forming bond layer 11
The upper limit of degree, is not particularly limited, and can be set to such as 200 DEG C.
As the lower limit of the average thickness of bond layer 11, preferably 5 μm, more preferably 15 μm.On the other hand, as viscous
Connect the upper limit of the average thickness of oxidant layer 11, preferably 50 μm, more preferably 40 μm.If in the average thickness deficiency of bond layer 11
Lower limit is stated, then adhesive strength is possible to become insufficient.On the contrary, if the average thickness of bond layer 11 exceedes the above-mentioned upper limit,
The flexible flat cable 1 is possible to unnecessarily thickening.
＜ advantages ＞
The flexible flat cable 1 by distribution 5 and can be used as other distributions of connecting object and existed by conductive paste portion 8
Facing part carries out physical bonding, and is electrically connected.In addition, the flexible flat cable 1 can pass through bonding agent portion 9
Ensure the mutual insulating properties of adjacent distribution, and improve cementability and conduction between the distribution of connecting object.Thus,
The flexible flat cable 1 can improve the conduction between the distribution of connecting object, and by without using special connector and
Slimming and the space saving of coupling part can be promoted.
The connection sheet 3 is configured to, and above-mentioned multiple conductive paste portions 8 engage respectively with the front of multiple distributions 5, and are bonded
Agent portion 9 is configured between the plurality of conductive paste portion 8.Therefore, the connection sheet 3 can by conductive paste portion 8 by distribution 5 with
And carry out physical bonding in the part of opposite face as other distributions of connecting object and be electrically connected.In addition, the connection
Piece 3 can ensure the mutual insulating properties of adjacent distribution by bonding agent portion 9, and improve between the distribution of connecting object
Cementability and conduction.Thus, the connection sheet 3 can improve the conduction between the distribution of connecting object, and can promote
Enter slimming and the space saving of coupling part.
The manufacture method ＞ of ＜ flexible flat cables
Below, the manufacture method of Fig. 1~Fig. 3 flexible flat cable 1 is illustrated.The manufacture method of the flexible flat cable 1
Have：Expose process, a face side of multiple distributions 5 is exposed；Overlapping step (the 1st overlapping step), is passing through above-mentioned dew
The exposed area B for going out process and exposing, multiple distributions 5 and multiple conductive paste portions 8 make Fig. 5's in a manner of matching when to overlook
Connection sheet 21 is overlapping；Crimping process, the hot pressing of connection sheet 21 is connected to a surface of multiple distributions 5, by multiple distributions 5 and
Multiple conductive paste portions 8 are engaged correspondingly；And stripping process, the mould release membrance 22 of connection sheet 21 is peeled off.
First, the connection sheet 21 of Fig. 5 to being used in the manufacture method of the flexible flat cable illustrates.
(connection sheet)
The conductive cream portion 8 of connection sheet 21 and bonding agent portion 9, mould release membrance 22.
Mould release membrance 22 is laminated in a surface in conductive paste portion 8 and bonding agent portion 9.As mould release membrance 22, can make
With for example with polyethylene, polypropylene, vinyl-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, poly terephthalic acid second
The synthetic resin of diol ester etc. is synthetic resin film, sheet rubber, paper, cloth, non-woven fabrics, mesh, foamed sheet, the gold of main component
Category paper tinsel, the appropriate membranous body being made up of their layered product etc..In addition, mould release membrance 22 can also in order to improve fissility and
The surface for being laminated with conductive paste portion 8 and bonding agent portion 9 sets peel ply, alternatively, it is also possible to implement silicidation, long alkane
The lift-off processings such as base processing, fluorination treatment.Wherein, conductive paste portion 8 and bonding agent portion 9 preferably are laminated with mould release membrance 22
Surface peel ply using melamine resin as main component is set.So, it is used as main component by setting using melamine resin
Peel ply, so as to reliably prevent from shelling when peeling off conductive paste portion 8 and bonding agent portion 9 from mould release membrance 22
Absciss layer is attached to the release surface, can prevent the bonding force caused by the attachment of peel ply from reducing.The connection sheet 21, which possesses, to be led
The mould release membrance 22 of one surface stacking in electrical cream portion 8 and bonding agent portion 9, thus, it is possible to improve operability.In addition, pass through example
Such as mould release membrance 22 is peeled off before it will be attached each other to connecting object, so as to prevent foreign matter, dust to
Multiple conductive paste portions 8 and bonding agent portion 9 are adhered to, and improve conduction and cementability.
Multiple conductive paste portions 8 are laminated on the surface of mould release membrance 22, and it is right between multiple conductive paste portions 8
Bonding agent portion 9 is laminated, and is consequently formed connection sheet 21.As the laminating method in the conductive paste portion 8 and bonding agent portion 9,
Enumerate the method realized by printing or application.As above-mentioned printing process, such as silk-screen printing, intaglio printing, glue are enumerated
Version printing, flexographic printing, ink jet printing, dispensing printing etc..In addition, as above-mentioned coating process, enumerate such as blade coating, squeeze
Pressure type coating, roll coating etc..
Conductive paste portion 8 and bonding agent portion 9 can use solvent and be formed, to improve printing or coating.Make
For the solvent, it is not particularly limited, can enumerates such as esters, ethers, ketone, ether-ether class, ethanol class, hydro carbons, amine
Organic solvent, can be from them using a kind or more than or equal to 2 kinds.In addition, conductive paste portion 8 is being formed by printing
In the case of, preferably using the excellent high boiling solvent of printing, specifically preferably using diethylene glycol-ether acetate,
Butyl diglycol-ether acetate etc..In addition, in the case where forming bonding agent portion 9 by printing, preferably using for example
Isophorone.
(exposing process)
Expose process above-mentioned, first peel off dielectric film 6a, 6b of two surface sides at a side of multiple distributions 5,
And bond layer 7 is removed.Then, expose process above-mentioned, match somebody with somebody in another face side of the multiple distributions 5 exposed
Put reinforced sheet 4.Specifically, reinforced sheet 4 is abutted with another surface of multiple distributions 5 with a surface of bond layer 11
Mode is configured.Thus, the exposed area B for exposing a face side of multiple distributions 5 is formed.In addition, reinforced sheet 4 configures
Side during to overlook abuts with another surface of the multiple distributions 5 exposed, and another side is overlapping with dielectric film 6b.
(overlapping step)
In above-mentioned overlapping step, as shown in Figure 6A, make multiple weights of conductive paste portion 8 of each connection sheet 21 when overlooking
It is laminated on expose face side of multiple distributions 5.Now, can be from such as reinforced sheet 4 in the case where reinforced sheet 4 is transparent
Another face side the position in multiple conductive paste portions 8 and multiple distributions 5 is confirmed, and be to easily and reliably somebody's turn to do
Overlapping activity.
(crimping process)
In above-mentioned crimping process, as shown in Figure 6B, to by above-mentioned overlapping step and overlapping multiple distributions 5 and conduction
Property cream portion 8 be thermally compressed, and the bonding agent portion 9 to being configured between multiple conductive paste portions 8 and multiple distributions 5 and add
The bond layer 11 of strong piece 4 is thermally compressed.Thus, obtain being laminated on a surface in conductive paste portion 8 and bonding agent portion 9
There is the flexible flat cable 31 of mould release membrance 22.
As the lower limit of the hot pressing jointing temp in above-mentioned crimping process, preferably 70 DEG C, more preferably 80 DEG C.The opposing party
Face, as the upper limit of above-mentioned hot pressing jointing temp, preferably 110 DEG C, more preferably 100 DEG C.If above-mentioned hot pressing jointing temp deficiency
Above-mentioned lower limit, it is possible to can not fully obtain between connection sheet 21 and multiple distributions 5 and the bond layer 11 of reinforced sheet 4
Adhesive strength.On the contrary, if above-mentioned hot pressing jointing temp exceedes the above-mentioned upper limit, it is likely that melts to the bond layer of reinforced sheet 4
Stably adhesive sheet 21 can not be bonded untill 11.
As the lower limit of the thermo-compression bonding load in above-mentioned crimping process, more preferably preferably 10N, 20N.On the other hand,
As the upper limit of the thermo-compression bonding load in above-mentioned crimping process, more preferably preferably 50N, 40N.If above-mentioned thermo-compression bonding load
The above-mentioned lower limit of deficiency, it is likely that can not fully obtain the bond layer 11 of connection sheet 21 and multiple distributions 5 and reinforced sheet 4
Between adhesive strength.On the contrary, if above-mentioned thermo-compression bonding load exceedes the above-mentioned upper limit, it is likely that melts to the viscous of reinforced sheet 4
Stably adhesive sheet 21 can not be bonded untill connecing oxidant layer 11.
As the lower limit of the thermo-compression bonding time in above-mentioned crimping process, more preferably preferably 1 second, 2 seconds.On the other hand,
As the upper limit of the thermo-compression bonding time in above-mentioned crimping process, more preferably preferably 6 seconds, 4 seconds.If the above-mentioned thermo-compression bonding time
The above-mentioned lower limit of deficiency, it is likely that can not fully obtain the bond layer 11 of connection sheet 21 and multiple distributions 5 and reinforced sheet 4
Between adhesive strength.On the contrary, if the above-mentioned thermo-compression bonding time exceedes the above-mentioned upper limit, it is likely that melts to the viscous of reinforced sheet 4
Stably adhesive sheet 21 can not be bonded untill connecing oxidant layer 11.
In above-mentioned crimping process, it is higher than in the softening temperature of the polymer for the bond layer 11 for forming reinforced sheet 4 and forms
In the case of the softening temperature of the softening temperature of the polymer in conductive paste portion 8 and the polymer in composition bonding agent portion 9, even if
The polymer for forming conductive paste portion 8 and the polymer for forming bonding agent portion 9 soften, and can also prevent from forming bonding agent
The softening of the polymer of layer 11.Therefore, it is possible to be supported by bond layer 11 to opposite side, and can be stably by conduction
Property cream portion 8 and bonding agent portion 9 are adhered on a surface of bond layer 11.In addition, so by bond layer 11 to another
Side is supported, the mixing in conductive paste portion 8 and bonding agent portion 9 when thus preventing from being thermally compressed.Thus, multiple distributions are prevented
Short circuit between 5.
(stripping process)
In above-mentioned stripping process, as shown in Figure 6 C, by a superficial layer in conductive paste portion 8 and bonding agent portion 9
Folded mould release membrance 22 is peeled off.Thus, Fig. 1~Fig. 3 flexible flat cable 1 is obtained.
The connecting structure ＞ of ＜ flexible flat cables
Below, reference picture 7 illustrates to the connecting structure of the flexible flat cable 1.
In Fig. 7 connecting structure, at least one face side of multiple distributions 5 is exposed, in multiple distributions 5 that this exposes
One surface is laminated with multiple conductive parts 23 respectively, and thermoplastic adhesive portion 24 is laminated between multiple conductive parts 23.In Fig. 7
Connecting structure in, in the exposed area B that at least one surface of multiple distributions 5 is exposed, with multiple distributions 5 when overlooking and more
The mode that individual conductive paste portion 8 matches engages connection sheet 3.That is, each conductive part 23 is made up of the conductive paste portion 8 of connection sheet 3,
Thermoplastic adhesive portion 24 is made up of the bonding agent portion 9 of connection sheet 3.In addition, Fig. 7 connecting structure has and the flexible flat
The electrode base board 41 that cable 1 electrically connects.
Electrode base board 41 has：Substrate 42；And multiple distributions (electrode layer) 43, its another face side in substrate 42
(the bonding surface side with flexible flat cable 1) is laminated with striated.In Fig. 7 connecting structure, in multiple conductive paste portions 8
The surface of side opposite with the composition surface of multiple distributions 5 is bonded to multiple distributions 43.That is, multiple distributions 43 be configured at overlook when with
The overlapping position of multiple conductive parts 23, and directly it is laminated in a surface of each conductive part 23.Multiple distributions 43 are by straight
Connect a surface for being laminated in conductive part 23 and turned on the conductive part 23, electrically connected via the conductive part 23 with multiple distributions 5.
Substrate 42 is preferably set to transparent, is more preferably set to water white transparency.As the main component of substrate 42, example is enumerated
Such as soda-lime glass, alkali-free glass glass, synthetic resin etc..
As the main component of distribution 43, such as indium tin oxide (ITO), indium-zinc oxide (IZO), zinc oxide are enumerated
(ZnO), azo oxide (AZO), zinc gallium oxide (GZO), fluorine-doped tin oxide (FTO), niobium titanium oxide (TNO), cadmium tin
The metals such as metal oxide, copper, the silver such as oxide (CTO).
As the mean breadth of distribution 43, be not particularly limited, can be set to be greater than or be less than equal to 0.1mm or
Equal to 0.8mm or so.In addition, the average thickness as distribution 43, is not particularly limited, can be set to be greater than or be equal to
0.1 μm and less than or equal to 30 μm or so.As the average headway of distribution 43, the average headway phase with conductive part 23 can be set to
Together.
＜ advantages ＞
For the connecting structure of the flexible flat cable, multiple conductions of the connection sheet 3 are bonded to respectively in multiple distributions 5
Property cream portion 8, other are bonded on the surface of the side opposite with the composition surface of multiple distributions 5 in above-mentioned multiple conductive paste portions 8 respectively
Multiple distributions 43, therefore, it is possible to improve the conduction between multiple distributions 5 and multiple distributions 43, and it can promote to connect
Partial slimming and space saving.
The connection method ＞ of ＜ flexible flat cables
Below, reference picture 8A and Fig. 8 B, the connection method to Fig. 1~Fig. 3 flexible flat cable 1 illustrate.
The connection method of the flexible flat cable has following processes：Expose process, by least one table of multiple distributions 5
Expose surface side；1st overlapping step, exposing the exposed area B of multiple distributions 5, with multiple distributions 5 and multiple conductions when overlooking
Property cream portion 8 match mode make connection sheet 21 overlapping；2nd overlapping step, make other multiple distributions respectively as connecting object
It is overlapped in the surface of the side opposite with the faying surface of multiple distributions 5 in multiple conductive paste portions 8；And crimping process, to overlapping
Exposed area B, connection sheet 21 and other multiple distributions of flexible flat cable 1 are thermally compressed.In addition, in the following description
In, the situation that the electrode base board 41 of Fig. 1~Fig. 3 flexible flat cable 1 and Fig. 6 is attached is illustrated.
It is above-mentioned to expose process and identical, the 1st overlapping step of exposing process in the manufacture method of above-mentioned flexible flat cable
It is identical with the overlapping step in the manufacture method of above-mentioned flexible flat cable, therefore omit the description.
(the 2nd overlapping step)
Above-mentioned 2nd overlapping step is carried out after the stripping process in the manufacture method of above-mentioned flexible flat cable.
Above-mentioned 2nd overlapping step as shown in Figure 8 A, makes multiple distributions 43 be overlapped in multiple the leading in the engagement of a surface of multiple distributions 5
One surface in electrical cream portion 8.Now, it is transparent in reinforced sheet 4 and in the case that substrate 42 is transparent, it is able to confirm that multiple conductions
Property cream portion 8 and the position of multiple distributions 43, and can to easily and reliably carry out the overlapping activity.
(crimping process)
In above-mentioned crimping process, as shown in Figure 8 B, multiple conductive paste portions 8 and multiple distributions 43 are thermally compressed,
And the bonding agent portion 9 configured to substrate 42 and between multiple conductive paste portions 8 is thermally compressed.Thus, multiple electric conductivity
Cream portion 8 is changed into multiple conductive parts 23, and bonding agent portion 9 is changed into thermoplastic adhesive portion 24, so as to obtain Fig. 7 connecting structure.
As the lower limit of the hot pressing jointing temp in above-mentioned crimping process, preferably 80 DEG C, more preferably 90 DEG C.The opposing party
Face, as the upper limit of above-mentioned hot pressing jointing temp, preferably 140 DEG C, more preferably 130 DEG C.If above-mentioned hot pressing jointing temp deficiency
Above-mentioned lower limit, it is likely that can not fully obtain multiple conductive paste portions 8 and bonding agent portion 9 and substrate 42 and distribution 43
Between adhesive strength.On the contrary, if above-mentioned hot pressing jointing temp exceedes the above-mentioned upper limit, it is likely that melts to the viscous of reinforced sheet 4
Stably multiple conductive paste portions 8 and bonding agent portion 9 and substrate 42 and distribution 43 can not be glued untill connecing the grade of oxidant layer 11
Connect.
As the lower limit of the thermo-compression bonding load in above-mentioned crimping process, more preferably preferably 10N, 20N.On the other hand,
As the upper limit of the thermo-compression bonding load in above-mentioned crimping process, more preferably preferably 50N, 40N.If above-mentioned thermo-compression bonding load
The above-mentioned lower limit of deficiency, it is likely that can not fully obtain multiple conductive paste portions 8 and bonding agent portion 9 and substrate 42 and match somebody with somebody
Adhesive strength between line 43.On the contrary, if above-mentioned thermo-compression bonding load exceedes the above-mentioned upper limit, it is likely that melts to reinforced sheet 4
The grade of bond layer 11 untill and can not be stably by multiple conductive paste portions 8 and bonding agent portion 9 and substrate 42 and distribution
43 bondings.
As the lower limit of the thermo-compression bonding time in above-mentioned crimping process, more preferably preferably 6 seconds, 8 seconds.On the other hand,
As the upper limit of the thermo-compression bonding time in above-mentioned crimping process, more preferably preferably 14 seconds, 12 seconds.If during above-mentioned thermo-compression bonding
Between the above-mentioned lower limit of deficiency, it is likely that can not fully obtain multiple conductive paste portions 8 and bonding agent portion 9 and substrate 42 and
Adhesive strength between distribution 43.On the contrary, if the above-mentioned thermo-compression bonding time exceedes the above-mentioned upper limit, it is likely that melts to reinforced sheet
Can not be stably by multiple conductive paste portions 8 and bonding agent portion 9 and substrate 42 and electrode untill 4 grade of bond layer 11
Layer 43 is bonded.
In above-mentioned crimping process, it is higher than in the softening temperature of the polymer for the bond layer 11 for forming reinforced sheet 4 and forms
In the case of the softening temperature of the softening temperature of the polymer in conductive paste portion 8 and the polymer in composition bonding agent portion 9, even if
The polymer for forming conductive paste portion 8 and the polymer for forming bonding agent portion 9 soften, and are also prevented from forming bond layer 11
Polymer softening.Therefore, it is possible to be supported by bond layer 11 to opposite side, and can be stably by multiple conductions
Property cream portion 8 and bonding agent portion 9 and substrate 42 and distribution 43 are bonded.In addition, so opposite side is entered by bond layer 11
Row support, thus prevents multiple conductive paste portions 8 and bonding agent portion 9 during thermo-compression bonding from mixing.Thus, prevent multiple distributions 5 it
Between short circuit.
＜ advantages ＞
Company's method of the flexible flat cable can improve the conduction between the distribution of connecting object, and can promote
The slimming of coupling part and space saving.
[second embodiment]
＜ connection sheets ＞
The flexible flat cable that Fig. 9 connection sheet 51 substitutes Fig. 5 connection sheet 21 and is used to have multiple distributions is electrically connected
Connect.Fig. 9 conductive cream portion 8 of connection sheet 51, bonding agent portion 59, binding agent portion 60 and mould release membrance 22.Connection for Fig. 9
Piece 51, mould release membrance 22 is laminated with a surface in conductive paste portion 8, bonding agent portion 59 and binding agent portion 60.Conductive paste
Portion 8, bonding agent portion 59 and binding agent portion 60 are configured at identical layer.Conductive paste portion 8 in Fig. 9 connection sheet 51 and release
Film 22 is identical with the conductive paste portion 8 of Fig. 5 connection sheet 21 and mould release membrance 22, therefore marks identical label, omits the description.
(bonding agent portion)
Bonding agent portion 59 is at least configured between multiple conductive paste portions 8.Specifically, bonding agent portion 59 and multiple conductions
Property cream portion 8 be configured at side by side it is between multiple conductive paste portions 8 and in multiple conductive paste portions 8, be laminated in two side ends
The outside in a pair of conductive cream portion 8.Each bonding agent portion 59 is formed as rectangular shape when overlooking.
Mean breadth as the multiple bonding agent portions 59 configured between multiple conductive paste portions 8, in multiple electric conductivity
A pair of conductive cream portion 8 for being laminated in two side ends in cream portion 8 outside configuration a pair of bonding agent portions 59 mean breadth, with
And the average thickness in multiple bonding agent portions 59, it can be set to identical with Fig. 1~Fig. 3 flexible flat cable 1.
Average length (the length in the direction parallel with the length direction in conductive paste portion 8 as multiple bonding agent portions 59
Degree), it is preferably identical with the average length in multiple conductive paste portions 8.By the average length in multiple bonding agent portions 59 and more
The average length in individual conductive paste portion 8 is identical, so as to ensure the mutual insulation of adjacent distribution by multiple bonding agent portions 59
Property, and it is easy to binding agent portion 60 described later being configured at two sides of the length direction in multiple conductive paste portions 8.It is in addition, " multiple
The average length in bonding agent portion 59 and the average length in multiple conductive paste portions 8 are identical " refer to, multiple bonding agent portions 59 are put down
The difference of equal length and the average length in multiple conductive paste portions 8 is less than or equal to ± 1mm, preferably lower than or equal to ± 0.5mm.
Multiple bonding agent portions 59 are used as main component using thermoplastic resin.Multiple bonding agent portions 59 by heating by being melted
Hot-melt adhesive form.As above-mentioned thermoplastic resin, enumerate for example acrylic resin, polyamide, polyolefin, fluororesin,
Polyester, silicones etc..Wherein, as above-mentioned thermoplastic resin, the preferably excellent polyester such as mouldability, insulating properties.
As the lower limit of the softening temperature for the polymer for forming multiple bonding agent portions 59, preferably 80 DEG C, more preferably 100
℃.On the other hand, as the polymer for forming multiple bonding agent portions 59 softening temperature the upper limit, preferably 130 DEG C, more preferably
For 120 DEG C.For the connection sheet 51, because binding agent portion 60 described later has caking property at normal temperatures, therefore can pass through
Connection sheet 51 is temporarily fixed to carry out hot pressing to both in the state of the exposed area B of flexible flat cable 1 by binding agent portion 60
Connect.Therefore, in the case of the softening temperature of polymer in bonding agent portion 59 is formed higher than in above range, can also incite somebody to action
Connection sheet 51 and exposed area B are engaged in desired position.Thus, the connection sheet 51 will form the poly- of bonding agent portion 59
The softening temperature of compound is set to be more than or equal to above-mentioned lower limit, thus, it is possible to fully improve heat resistance.On the other hand, if structure
Softening temperature into the polymer in bonding agent portion 59 exceedes the above-mentioned upper limit, it is likely that hot pressing jointing temp becomes too high and multiple and matched somebody with somebody
Aging occurs for line 5, reinforced sheet 4.
As the lower limit of the glass transition temperature for the polymer for forming bonding agent portion 59, preferably 50 DEG C, more preferably 60
℃.Above-mentioned lower limit is more than or equal to by the glass transition temperature for the polymer for forming bonding agent portion 59, so as to fill
Ground is divided to improve the intensity in bonding agent portion 59.On the other hand, the glass transition temperature as the polymer that forms bonding agent portion 59
The upper limit, it is not particularly limited, such as 100 DEG C can be set to.
As the weight average molecular weight for the polymer for forming bonding agent portion 59, can be set to be greater than or equal to 10,000 and
Less than 25,000.In addition, above-mentioned weight average molecular weight is using gel permeation chromatography (GPC) device, using N- methyl -2- pyrroles
The value that alkanone determines as developing solvent, using monodisperse polystyrene as standard.
As the lower limit of the limiting viscosity for the polymer for forming bonding agent portion 59, preferably 0.3dl/g, it is more preferably
0.4dl/g.On the other hand, as the polymer for forming bonding agent portion 59 limiting viscosity the upper limit, preferably 0.7dl/g, more
Preferably 0.6dl/g.If forming the above-mentioned lower limit of limiting viscosity deficiency of the polymer in bonding agent portion 59, bonding agent portion 59
Mouldability is likely to decrease.On the contrary, if the limiting viscosity for forming the polymer in bonding agent portion 59 exceedes the above-mentioned upper limit, it is bonded
Property is possible to become insufficient.In addition, " limiting viscosity " refer to using Ubbelohde viscometer 25 DEG C phenol and tetrachloroethanes it is mixed
Obtained value is measured in bonding solvent.
As the lower limit of the hydroxyl value for the polymer for forming bonding agent portion 59, preferably 1mgKOH/g, it is more preferably
3mgKOH/g.Above-mentioned lower limit is more than or equal to by the hydroxyl value for the polymer for forming bonding agent portion 59, so as to gluing
Connect agent portion 59 thermo-compression bonding substrate be glass substrate on surface with silanol group (- SiOH) etc. in the case of, pass through to be formed
Siloxanes key (- Si-O-Si-), so as to improve adhesive strength.In addition, the hydroxyl as the polymer for forming bonding agent portion 59
The upper limit of base value, is not particularly limited, and can be set to such as 30mgKOH/g.
Furthermore it is possible to the scope in the binding function without prejudice to bonding agent portion 59 is added curing agent to bonding agent portion 59, increased
Thick dose, the additive such as hot solvent.
(binding agent portion)
Binding agent portion 60 is configured at two sides of the length direction in multiple conductive paste portions 8 and multiple bonding agent portions 59.
Each binding agent portion 60 is formed as being used as length using the width in multiple conductive paste portions 8 and multiple bonding agent portions 59 when overlooking
The rectangular shape in direction.The length direction length in each binding agent portion 60 and multiple conductive paste portions 8 and multiple bonding agent portions
59 total width is identical.Thus, multiple conductive paste portions 8, multiple bonding agent portions 59 and a pair of binding agent portions 60 are as whole
Body and overlook when be formed as rectangular shape.
Mean breadth (the length with multiple conductive paste portions 8 and multiple bonding agent portions 59 as each binding agent portion 60
The average length in the parallel direction in direction) lower limit, preferably 0.5mm, more preferably 0.8mm.On the other hand, as each bonding
The upper limit of the mean breadth in agent portion 60, preferably 3mm, more preferably 2mm.If in the mean breadth deficiency in each binding agent portion 60
State lower limit, it is likely that can not fully obtain the temporary transient fixing function realized by binding agent portion 60.In addition, if each binding agent
The above-mentioned lower limit of mean breadth deficiency in portion 60, it is likely that can not be existed by multiple bonding agent portions 59 and a pair of binding agent portions 60
Multiple conductive paste portions 8 are reliably surrounded during vertical view, as a result, being possible to easily produce short circuit between multiple distributions 5.Phase
Instead, if the mean breadth in each binding agent portion 60 exceedes the above-mentioned upper limit, the area of plane in binding agent portion 60 is possible to become
Greatly.
As the lower limit of the area of plane of every 20 distributions in each binding agent portion 60, preferably 6mm2, more preferably 8mm2。
On the other hand, as each binding agent portion 60 every 20 distributions 20 the area of plane the upper limit, preferably 15mm2, more preferably
12mm2., cannot be sufficiently sticky if the above-mentioned lower limit of above-mentioned area of plane deficiency in each binding agent portion 60, it is temporarily fixed
Function is possible to become insufficient.On the contrary, if the above-mentioned area of plane in each binding agent portion 60 exceedes the above-mentioned upper limit, the connection
Piece 51 is possible to become too much.
As the lower limit of the average thickness in a pair of binding agent portions 60, preferably 20 μm, more preferably 50 μm.On the other hand,
As the upper limit of the average thickness in a pair of binding agent portions 60, preferably 130 μm, more preferably 100 μm.If a pair of binding agent portions
The 60 above-mentioned lower limit of average thickness deficiency, it is likely that can not fully play the temporary transient fixed work(realized by binding agent portion 60
Energy.On the contrary, if the average thickness in a pair of binding agent portions 60 exceedes the above-mentioned upper limit, it is likely that can not fully promote connecting portion
The slimming divided.
The average thickness in a pair of binding agent portions 60 is preferably thicker than the flat of multiple conductive paste portions 8 and multiple bonding agent portions 59
Equal thickness.The flat of multiple conductive paste portions 8 and multiple bonding agent portions 59 is thicker than by the average thickness in a pair of bonding agent portions 60
Equal thickness, so as in the state for the exposed area B that connection sheet 51 is temporarily fixed to flexible flat cable 1 by binding agent portion 60
Under be easy to be thermally compressed both.It is used as the average thickness in a pair of binding agent portions 60 and multiple conductive paste portions 8 and multiple
The lower limit of the difference of the average thickness in bonding agent portion 59, preferably 10 μm, more preferably 40 μm.On the other hand, as above-mentioned average
The poor upper limit of thickness, preferably 100 μm, more preferably 70 μm.If the above-mentioned lower limit of difference deficiency of above-mentioned average thickness, has
The temporary transient fixing function by a pair of binding agent portions 60 realized possibly can not be played fully.If on the contrary, above-mentioned average thickness
Difference exceed the above-mentioned upper limit, then in thermo-compression bonding, a pair of binding agent portions 60 can be to multiple conductive paste portions 8 and multiple bonding agents
The side of portion 59 is flowed, and cementability and conduction are likely to decrease.
Binding agent portion 60 is used as main component using thermoplastic resin.Binding agent portion 60 has viscosity, has at normal temperatures viscous
Tie power.That is, binding agent portion 60 is made up of pressure sensitive adhesives.As above-mentioned thermoplastic resin, such as acrylic resin, polyamides are enumerated
Amine, polyolefin, fluororesin, polyester, silicones etc..Wherein, it is excellent as above-mentioned thermoplastic resin, preferably mouldability, insulating properties etc.
Different polyester.
As the lower limit of the softening temperature for the polymer for forming binding agent portion 60, more preferably preferably 20 DEG C, 300 DEG C.
If forming the above-mentioned lower limit of softening temperature deficiency of the polymer in binding agent portion 60, heat resistance is possible to become insufficient.Separately
On the one hand, as the polymer for forming binding agent portion 60 softening temperature the upper limit, as long as can be melted in thermo-compression bonding
Temperature, it is not particularly limited, such as 60 DEG C can be set to.
It is preferably -50 DEG C as the lower limit of the glass transition temperature for the polymer for forming binding agent portion 60, more preferably -
40℃.On the other hand, as the polymer for forming binding agent portion 60 glass transition temperature the upper limit, it is preferably 20 DEG C, more excellent
Elect 0 DEG C as.If form the above-mentioned lower limit of glass transition temperature deficiency of the polymer in binding agent portion 60, it is likely that be difficult to maintain
The shape in binding agent portion 60.On the contrary, if the glass transition temperature for forming the polymer in binding agent portion 60 exceedes the above-mentioned upper limit,
Viscosity becomes insufficient, it is possible to can not fully obtain the cohesive force under normal temperature.
As the weight average molecular weight for the polymer for forming binding agent portion 60, can be set to for example more than 25,000 be less than or
Equal to 50,000.
As the lower limit of the limiting viscosity for the polymer for forming binding agent portion 60, preferably 0.6dl/g, it is more preferably
0.8dl/g.On the other hand, as the polymer for forming binding agent portion 60 limiting viscosity the upper limit, preferably 1.3dl/g, more
Preferably 1.1dl/g.If forming the above-mentioned lower limit of limiting viscosity deficiency of the polymer in binding agent portion 60, binding agent portion 60
Viscosity is possible to become insufficient.On the contrary, if the limiting viscosity for forming the polymer in binding agent portion 60 exceedes the above-mentioned upper limit,
Screening characteristics is likely to decrease.
As the lower limit of the hydroxyl value for the polymer for forming binding agent portion 60, preferably 1mgKOH/g, it is more preferably
3mgKOH/g.Above-mentioned lower limit is more than or equal to by the hydroxyl value for the polymer for forming binding agent portion 60, so as to gluing
In the case that the substrate that knot agent portion 60 bonds is glass substrate on surface with silanol group (- SiOH) etc., by forming silicon
Oxygen alkane key (- Si-O-Si-), so as to improve adhesion strength.In addition, the hydroxyl as the polymer for forming binding agent portion 60
The upper limit of value, is not particularly limited, and can be set to such as 30mgKOH/g.
Furthermore it is possible to the scope in the attachment function without prejudice to binding agent portion 60 is added curing agent to binding agent portion 60, increased
Thick dose, adhesive, the additive such as hot solvent.In addition, binding agent portion 60 be mainly by the area of plane to binding agent portion 60 with
And form being adjusted for glass transition temperature of the polymer in binding agent portion 60 and have sticking binding agent portion, therefore can be with
Adhesive is not added to binding agent portion 60.
Connection sheet 51 is formed by following manner, i.e. carries out layer to multiple conductive paste portions 8 on the surface of mould release membrance 22
It is folded, and bonding agent portion 59 is laminated between multiple conductive paste portions 8, in multiple conductive paste portions 8 and multiple viscous
Two sides for connecing the length direction in agent portion 59 are laminated to a pair of binding agent portions 60, are consequently formed connection sheet 51.Led as this
The layered manner in electrical cream portion 8, bonding agent portion 59 and binding agent portion 60, enumerates and passes through printing with the identical of Fig. 5 connection sheet 21
Or the method that application is realized.
＜ advantages ＞
The connection sheet 51 possesses the binding agent portion 60 that identical layer is configured at conductive paste portion 8 and bonding agent portion 59, because
This, can temporarily be fixed the exposed area B of the connection sheet 51 and flexible flat cable by binding agent portion 60.Accordingly, for
The connection sheet 51, heat is carried out to the exposed area B of the connection sheet 51 and flexible flat cable under such as temporary fixing state
Crimping, can be to easily and reliably so as to prevent the position deviation during thermo-compression bonding of the connection sheet 51 and exposed area B
The connection sheet 51 and exposed area B are engaged in desired position.In addition, according to the connection sheet 51, can omit pair
Workload during for the fixture of the connection sheet 51 and exposed area B positioning to be used.
[other embodiment]
It is believed that embodiment of disclosure in every respect be illustrate, and and nonrestrictive content.The present invention
Scope be not limited to the structure of above-mentioned embodiment, but shown by claims, it is intended that include and claims
Impartial content and being had altered in the range of.
Such as the connection sheet need not must have mould release membrance.Thus, the flexible flat cable can also be in the following manner
Form connection sheet, i.e. for example directly conductive paste portion is laminated on a surface of multiple distributions, in the plurality of electric conductivity
Bonding agent portion is laminated between cream portion, is consequently formed connection sheet.
Above-mentioned bonding agent portion can also need not surround multiple conductive paste portions when overlooking.Do not surrounded as bonding agent portion more
The structure in individual conductive paste portion, enumerate the lamination adhesive portion for example only between the multiple conductive paste portions configured with striated
Structure, multiple conductive paste portions length direction both sides do not have bonding agent portion structure.
The mean breadth in above-mentioned conductive paste portion can also need not be less than the mean breadth of distribution.For the flexible flat
Cable, though the mean breadth in above-mentioned conductive paste portion be more than or equal to distribution mean breadth, by the conductive paste portion it
Between placement of adhesives portion, can also prevent the short circuit between conductive paste portion.
Above-mentioned conductive paste portion need not must be formed as approximate rectangular shape when overlooking, such as can be polygon shape
Shape, elliptical shape etc..
Possess the feelings for being configured at the binding agent portion with conductive paste portion and bonding agent portion identical layer even in the connection sheet
Under condition, both ends of the binding agent portion without the length direction that must be configured at multiple conductive paste portions and multiple bonding agent portions
Side., can also be for example only in multiple conductive paste portions and one end of the length direction in multiple bonding agent portions for the connection sheet
Side configuration binding agent portion, bonding agent portion is continuously set in another side.In addition, above-mentioned binding agent portion can also be configured at multiple lead
Between electrical cream portion.
The flexible flat cable must need not be configured with another face side of a side of flexible flat cable main body
Reinforced sheet.The flexible flat cable can also be for example only to the dielectric film of the face side configuration in a side of multiple distributions
And bond layer is peeled off, in the release surface to multiple conductive paste portions and the bonding being laminated between conductive paste portion
Agent portion is laminated.
The flexible flat cable must need not be connected with above-mentioned electrode base board, can be connected with various conductive components.
Industrial applicibility
As described above, the connecting structure and flexibility of the connection sheet of the present invention, flexible flat cable, flexible flat cable are flat
The connection method of horizontal line cable can improve the conduction between the distribution of connecting object, and can promote the slim of coupling part
Change and space saving, it is consequently adapted to and the connection such as electrode base board.
The explanation of label
1st, 31 flexible flat cable
2 flat cable main bodys
The connection sheet (connection sheet) of 3 flexible flat cables
4 reinforced sheets
5 distributions
6a, 6b dielectric film
7 bond layers
8 conductive paste portions
9 bonding agent portions
10 insulating barriers
11 bond layers
21 connection sheets
22 mould release membrances
23 conductive parts
24 thermoplastic adhesive portions
41 electrode base boards
42 substrates
43 distributions
51 connection sheets
59 bonding agent portions
60 binding agent portions
B exposed area
Claims (10)
1. a kind of connection sheet, it is used for the electrical connection with the flexible flat cable of multiple distributions, and the connection sheet possesses：
Multiple conductive paste portions, they are bandings, are accordingly configured side by side with above-mentioned multiple distributions when overlooking, comprising leading
The adhesive of conductive particles and the particle；And
Bonding agent portion, it is at least configured between above-mentioned multiple conductive paste portions, and main component is used as using thermoplastic resin.
2. connection sheet according to claim 1, wherein,
Above-mentioned bonding agent portion is configured to surround above-mentioned multiple conductive paste portions when overlooking.
3. connection sheet according to claim 1 or 2, wherein,
The average thickness in above-mentioned conductive paste portion is identical with the average thickness in bonding agent portion.
4. connection sheet according to any one of claim 1 to 3, wherein,
The mean breadth in above-mentioned conductive paste portion is less than the mean breadth of above-mentioned distribution.
5. connection sheet according to any one of claim 1 to 4, wherein,
The softening temperature of the polymer for forming the adhesive in above-mentioned conductive paste portion and the polymer for forming above-mentioned bonding agent portion
It is less than or equal to 70 DEG C more than or equal to 40 DEG C.
6. connection sheet according to any one of claim 1 to 5, wherein,
The connection sheet is also equipped with binding agent portion, and the binding agent portion is configured at identical with above-mentioned conductive paste portion and bonding agent portion
Layer.
7. connection sheet according to any one of claim 1 to 6, wherein,
The connection sheet is also equipped with mould release membrance, and the release film layer is laminated on a table in above-mentioned conductive paste portion and bonding agent portion
Face.
8. a kind of flexible flat cable, it has multiple distributions,
The flexible flat cable is in the region that at least one face side of above-mentioned multiple distributions is exposed, with above-mentioned multiple when overlooking
Distribution and the mode of above-mentioned multiple conductive paste portion matchings are bonded to the connection sheet any one of claim 1 to 7.
9. a kind of connecting structure of flexible flat cable, the flexible flat cable have multiple distributions,
The connecting structure of the flexible flat cable possesses：
The flexible flat cable that at least one face side of above-mentioned multiple distributions is exposed；
Connection sheet any one of claim 1 to 6, its flexible flat cable exposed area, with overlook when
Above-mentioned multiple distributions and the mode of above-mentioned multiple conductive paste portion matchings are engaged；And
Other multiple distributions, what they were individually coupled to multiple conductive paste portions of above-mentioned connection sheet connects with above-mentioned multiple distributions
The surface of the opposite side in conjunction face.
10. a kind of connection method of flexible flat cable, the flexible flat cable have multiple distributions,
The connection method of the flexible flat cable has following processes：
Expose process, at least one face side of multiple distributions of above-mentioned flexible flat cable is exposed；
1st overlapping step, in the exposed area of the flexible flat cable, with above-mentioned multiple distributions when overlooking and above-mentioned multiple lead
The mode of electrical cream portion matching makes the connection sheet any one of claim 1 to 7 overlapping；
2nd overlapping step, make to be overlapped in respectively as other multiple distributions of connecting object above-mentioned multiple conductive paste portions with
The surface of the opposite side of faying surface of above-mentioned multiple distributions；And
Crimping process, heat is carried out to the exposed area of overlapping above-mentioned flexible flat cable, connection sheet and other multiple distributions
Crimping.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015063495 | 2015-03-25 | ||
| JP2015-063495 | 2015-03-25 | ||
| PCT/JP2015/077375 WO2016151898A1 (en) | 2015-03-25 | 2015-09-28 | Connection sheet, flexible flat cable, flexible flat cable connection structure, and flexible flat cable connection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107408770A true CN107408770A (en) | 2017-11-28 |
Family
ID=56977034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580078241.0A Pending CN107408770A (en) | 2015-03-25 | 2015-09-28 | The connection method of connection sheet, flexible flat cable, the connecting structure of flexible flat cable and flexible flat cable |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2016151898A1 (en) |
| CN (1) | CN107408770A (en) |
| WO (1) | WO2016151898A1 (en) |
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| CN110402050A (en) * | 2018-04-24 | 2019-11-01 | 佳能株式会社 | Flat cable and electronic device |
| CN112189240A (en) * | 2018-05-25 | 2021-01-05 | 株式会社自动网络技术研究所 | Laminated wiring member |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP7089430B2 (en) * | 2018-07-25 | 2022-06-22 | 信越ポリマー株式会社 | Manufacturing method of conductive connection material |
| WO2023075652A1 (en) * | 2021-10-28 | 2023-05-04 | Telefonaktiebolaget Lm Ericsson (Publ) | A method of producing a printed circuit board, and a printed circuit board |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2016151898A1 (en) | 2016-09-29 |
| JPWO2016151898A1 (en) | 2018-01-11 |
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Application publication date: 20171128 |
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