CN103805087B - The manufacturing method of conductive adhesive, solar cell module and solar cell module - Google Patents
The manufacturing method of conductive adhesive, solar cell module and solar cell module Download PDFInfo
- Publication number
- CN103805087B CN103805087B CN201310558978.5A CN201310558978A CN103805087B CN 103805087 B CN103805087 B CN 103805087B CN 201310558978 A CN201310558978 A CN 201310558978A CN 103805087 B CN103805087 B CN 103805087B
- Authority
- CN
- China
- Prior art keywords
- resin
- conductive adhesive
- solidification
- particle
- joint line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 158
- 239000011347 resin Substances 0.000 claims abstract description 158
- 239000002245 particle Substances 0.000 claims abstract description 144
- 238000007711 solidification Methods 0.000 claims abstract description 93
- 230000008023 solidification Effects 0.000 claims abstract description 93
- 238000007747 plating Methods 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 102
- 239000000203 mixture Substances 0.000 claims description 85
- 230000005484 gravity Effects 0.000 claims description 51
- 229910052759 nickel Inorganic materials 0.000 claims description 51
- 229920001169 thermoplastic Polymers 0.000 claims description 43
- 239000004416 thermosoftening plastic Substances 0.000 claims description 43
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 25
- 229910052737 gold Inorganic materials 0.000 claims description 25
- 239000010931 gold Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 239000002313 adhesive film Substances 0.000 description 91
- 230000008859 change Effects 0.000 description 34
- 239000004840 adhesive resin Substances 0.000 description 31
- 229920006223 adhesive resin Polymers 0.000 description 31
- 239000010408 film Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 230000009194 climbing Effects 0.000 description 13
- 230000001351 cycling effect Effects 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 238000001723 curing Methods 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000007906 compression Methods 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000002562 thickening agent Substances 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000012945 sealing adhesive Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000005026 oriented polypropylene Substances 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000007900 aqueous suspension Substances 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 238000007596 consolidation process Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
- FYWSTUCDSVYLPV-UHFFFAOYSA-N nitrooxythallium Chemical compound [Tl+].[O-][N+]([O-])=O FYWSTUCDSVYLPV-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 150000003504 terephthalic acids Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention relates to the manufacturing methods of conductive adhesive, solar cell module and solar cell module.Bonding force and the excellent solar cell module conductive adhesive of connection reliability are provided.The conductive adhesive of the present invention is the conductive adhesive (17) of joint line (3) connection of the electrode (12) that will be formed in solar battery cell (2), (13) and the multiple solar battery cells (2) of connection, wherein at least contain curable resin, electroconductive particle and curing agent, electroconductive particle includes resin core metal plating particle or metallic, and the Tg after solidification is 140 DEG C or more.
Description
Technical field
The present invention relates to conductive adhesive, more particularly to the electric conductivity used in the manufacture of solar cell module is bonded
Agent, made of conductive adhesive solar cell module and the solar cell module using the conductive adhesive
Manufacturing method.
Background technology
In crystalline silicon solar cell module, multiple adjacent solar battery cells include by be used as connectors
The joint line connection of band-like copper foil through scolding tin coating etc..The surface electricity of the one end of joint line and a solar battery cell
Pole connects, and another side is connect with the backplate of adjacent solar battery cell, thus by each solar battery cell string
Connection connection.At this point, a surface side of the one end of joint line is Nian Jie with the surface electrode of a solar battery cell, another side
Another surface side it is Nian Jie with the backplate of adjacent solar battery cell.
Specifically, the connection as solar battery cell and joint line, on the light-receiving surface of solar battery cell
Pass through the Ag formed on the back side interconnecting piece of busbar electrode and solar battery cell that the silk-screen printing of silver paste material is formed
Electrode is handled by soldering with joint line and connect (patent document 1).In addition, other than the interconnecting piece at the solar battery cell back side
Region be formed with Al electrodes or Ag electrodes.
But for soldering, because to carry out the connection processing at a high temperature of about 260 DEG C, worry in the sun
Can battery unit warpage, joint line and surface electrode and backplate interconnecting piece at generate internal stress and help weldering
Under the action of residue of agent etc., the connection reliability between the surface electrode and backplate and joint line of solar battery cell
It reduces.
Therefore, it is used in the connection of the surface electrode of solar battery cell and backplate and joint line in the past
The electric conductivity adhesive film (patent document 2) that can be connected by the thermo-compression bonding processing under lower temperature.As such conduction
Property adhesive film, use and the spherical or squamaceous electroconductive particle that average grain diameter is several μm of grades be dispersed in thermohardening type and glue
In mixture resin combination and carry out electric conductivity adhesive film obtained by membranization.
Make electric conductivity adhesive film be present between surface electrode and joint line and between backplate and joint line after, from
Hot pressurization is carried out on joint line, thus adhesive resin shows mobility, flowed out between electrode, joint line, while real
Existing conducting between electroconductive particle and electrode and joint line, adhesive resin heat cure in this state.It is consequently formed multiple
The string that solar battery cell is connected in series with by joint line.
In the multiple solar battery cells being connect joint line with surface electrode and backplate with electric conductivity adhesive film,
Glass, translucency plastics etc. have the surface protecting material of translucency and include PET (polyethylene terephthalate (Poly
Ethylene Terephthalate)) etc. use ethylene-vinyl acetate copolymer resin between the back-protective material of films
(EVA) etc. the sealing material with translucency seals.
In addition, in film system solar cell module, similarly use scolding tin or electric conductivity adhesive film by joint line with
The p-type electrode formed in the one side of solar cell is connected with n-type electrode.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2004-356349 bulletins
Patent document 2：Japanese Unexamined Patent Publication 2008-135654 bulletins.
Invention content
Problems to be solved by the invention
It connects in the electrode of solar battery cell and the electric conductivity adhesive film of joint line, is mainly made in the past using nickel filler
For electroconductive particle.But various platings are implemented to the surface of solar battery cell sometimes, at this point, being contained using existing
When having the conductive adhesive of nickel filler, bonding force, the electrode of solar battery cell and the connection reliability of joint line are worried
It reduces.
Therefore, the purpose of the present invention is to provide the excellent conductive adhesive of bonding force and connection reliability, with the conduction
Property bonding agent made of solar cell module and using the conductive adhesive solar cell module manufacturing method.
Means for solving the problems
In order to solve the above problems, conductive adhesive of the invention be will be formed in solar battery cell electrode and
Connect multiple solar battery cells joint line connection conductive adhesive, wherein at least contain curable resin,
Electroconductive particle and curing agent, the electroconductive particle include resin core metal plating particle or metallic, the Tg after solidification
It is 140 DEG C or more.
In addition, the solar cell module of the present invention includes solar battery cell, the multiple solar cells of connection
The joint line of unit and it is arranged viscous in the electric conductivity being formed between the electrode of the solar battery cell and the joint line
Oxidant layer is connect, the conductive adhesive layer at least contains curable resin, electroconductive particle and curing agent, the electroconductive particle
Including resin core metal plating particle or metallic, the Tg after the solidification of the conductive adhesive layer is 140 DEG C or more.
In addition, the manufacturing method of the solar cell module of the present invention includes：Multiple solar-electricities of electrode will be formed with
Pool unit process arranged side by side；The joint line for connecting multiple solar battery cells is pre-configured in by conductive adhesive
The process of the electrode of the solar battery cell；Make the conductive adhesive with by heating pressing to the joint line
Solidification, the electrode is connected with the joint line, is connected the adjacent solar battery cell by the joint line
Process；The conductive adhesive at least contains curable resin, electroconductive particle and curing agent, and the electroconductive particle includes
Resin core metal plating particle or metallic, the Tg after solidification are 140 DEG C or more.
The effect of invention
According to the present invention, the bonding agent for being 140 DEG C or more by using the Tg after solidification as conductive adhesive, even if
Under the big harsh practical service environment of the difference of height of temperature, the electrode and joint line of solar battery cell can be also maintained
High connecting reliability.
Description of the drawings
[Fig. 1] is the exploded perspective view for the composition for indicating the solar cell module using the present invention.
[Fig. 2] is the sectional view for the string for indicating solar battery cell.
[Fig. 3] is the ground plan of solar battery cell.
[Fig. 4] is the sectional view for indicating electric conductivity adhesive film.
[Fig. 5] be indicate to be pasted with peeling base, the electric conductivity adhesive film for being wound into roll sectional view.
[Fig. 6] is the figure for the composition for indicating embodiment, and (A) is vertical view, and (B) is sectional view.
[Fig. 7] is the figure for the composition for indicating embodiment, and (A) is sectional view, and (B) is sectional view.
Specific implementation mode
In the following, being directed at conductive adhesive of the present invention while with reference to attached drawing, with the conductive adhesive system
At solar cell module and be described in detail using the manufacturing method of the solar cell module of the conductive adhesive.
In addition, certainly, the present invention is not limited only to following implementation, can carry out in the range of the technological thought without departing from the present invention
Various changes.In addition, attached drawing is ideograph, ratio of each size etc. is sometimes different from actual conditions.Specific size etc. should
Judge with reference to following explanation.In addition, certainly, attached drawing also includes the mutual size relationship portion different with ratio between each other
Point.
In the following, as solar cell module, illustrated by taking so-called crystalline silicon solar cell module as an example, but
Other than silicon systems solar cell module, it is contemplated that the present invention may be use with so-called film silicon systems, series of compounds, organic system, amount
Sub- point-type etc. uses the various solar cell modules of conductive adhesive.
[solar cell module]
It is as shown in FIG. 1 to 3 using the solar cell module 1 of the present invention, including led to by multiple solar battery cells 2
The string 4 being connected in series as the joint line 3 of connectors is crossed, which has the matrix 5 of multiple arrangements.In addition, solar-electricity
Pond module 1 is formed as described below：The sheet material 6 of the sealing adhesive of matrix 5 is clamped, and is set to the surface cover of light receiving side
Plate 7 and the backboard 8 for being set to back side are unified laminated, and the metal frames 9 such as aluminium are finally installed around.
As sealing adhesive, such as use the translucency sealing material such as ethylene-vinyl acetate copolymer resin (EVA)
Material.In addition, as surface cap 7, such as use the translucent materials such as glass, translucency plastics.In addition, as backboard 8, use
Laminated body etc. made of glass, aluminium foil are clamped with resin film.
As shown in Fig. 2, each solar battery cell 2 of solar cell module has photo-electric conversion element 10.Photoelectricity turns
It is monocrystalline silicon type photo-electric conversion element or polycrystalline silicon type photo-electric conversion element to change element 10.
In addition, photo-electric conversion element 10 is provided with finger electrode 12 in light receiving side, which produced to inside
Raw electricity carries out the surface electrode of current collection.Finger electrode 12 is formed by the following method：Solar battery cell 2 conduct by
On the surface of smooth surface by the coatings such as silk-screen printing such as Ag thickeners after, be burnt into.In addition, in finger electrode 12, in light
It is formed with substantially in parallel every 2mm all at a prescribed interval, for example in the whole face in face a plurality of with for example, about 50~200 μm of left sides
The lines of right width.In addition, the plating processing for the purpose of being appropriately carried out the surface of finger electrode 12 for antirust.
In solar battery cell 2, due to substantially vertical with each finger electrode 12, thus it is electric to finger-like as being not provided with
The electricity of pole 12 carries out the so-called no bus structure of the busbar electrode of current collection.Therefore, in solar battery cell 2, following joint lines 3
It is directly connect with finger electrode 12 by electric conductivity adhesive film 17.In addition, the present invention, which can also use, is formed with busbar electrode
Solar battery cell.
In addition, in photo-electric conversion element 10, the back side opposite with light-receiving surface is provided with the back side electricity comprising aluminium or silver
Pole 13.Backplate 13 is as shown in Figures 2 and 3, is formed at the back side of solar battery cell 2 by silk-screen printing or sputtering etc.
Such as the electrode comprising aluminium or silver.Backplate 13 has joint line interconnecting piece 14, and the joint line interconnecting piece 14 is by following
Electric conductivity adhesive film 17 is connect with joint line 3.In addition, the purpose of surface to backplate 13 is also appropriately carried out for antirust
Plating processing.
In addition, solar battery cell 2 will be formed in each finger electrode 12 on surface and the adjacent sun by joint line 3
The backplate 13 of energy battery unit 2 is electrically connected, and thereby constitutes the string 4 being connected in series with.Joint line 3 and finger electrode 12 and the back side
Electrode 13 is connected by following electric conductivity adhesive films 17.
[joint line]
Joint line 3 is as shown in Fig. 2, be the strip that will be electrically connected between adjacent solar battery cell 2X, 2Y, 2Z
The conductive substrate of shape.Joint line 3 for example cut by the copper foil or aluminum foil strip that will be rolled into thick 50~300 μm or by copper or
The fine wire of aluminium etc. is rolled into tabular, to obtain width roughly the same with electric conductivity adhesive film 17 1~3mm wide four
The copper wire of side.In addition, joint line 3 by implementing gold-plated, silver-plated, tin plating, plating scolding tin etc. come shape as needed to the four directions copper wire
At.
For joint line 3, using one side 3a as the viscous of the surface for being provided with finger electrode 12 with solar battery cell 2
Junction, using another side 3b as the bonding plane at the back side for being provided with backplate 13 with solar battery cell 2.
[conductive adhesive]
Then, electric conductivity adhesive film 17 is illustrated, which is by joint line 3 and solar cell list
The conductive adhesive that the surface of member 2 is connected with the back side.Electric conductivity adhesive film 17 as shown in figure 4, Thermocurable adhesive
Electroconductive particle 23 is contained with high density in resin 22, is shaped to membranaceous, is present in the surface and the back side of solar battery cell 2
Between joint line, to constitute the conductive adhesive for being conductively connected finger electrode 12 and backplate 13 with joint line
Layer.
For electric conductivity adhesive film 17 from the viewpoint of embedability, the lowest melt viscosity of adhesive resin 22 is preferably 100
~100000Pa s.If the lowest melt viscosity of electric conductivity adhesive film 17 is too low, in the mistake for being connected to formal solidification from low pressure
Resin flows in journey, is easy to happen bad connection or the exposing towards unit light-receiving surface, can also become the original that light receiving rate reduces
Cause.Even if in addition, lowest melt viscosity it is excessively high sometimes if be easy to break down when film is pasted, connection reliability is caused not
Good influence.In addition, about lowest melt viscosity, the sample of specified amount can be seated in rotary viscosimeter, on one side with rule
Fixed heating rate heating measures on one side.
In addition, viscosity of the electric conductivity adhesive film 17 near room temperature is preferably 10~10000kPa s, more preferably 10~
5000kPa s.The viscosity of electric conductivity adhesive film 17 is set in the range of 10~10000kPa s, thus by electric conductivity adhesive film 17
In the case of the one side 3a or another side 3b of joint line 3, winding are placed on the spool 25, it can prevent from being caused by so-called exposing
Adhesion, and viscous force as defined in capable of maintaining.
[adhesive resin]
The composition of the adhesive resin 22 of electric conductivity adhesive film 17 as long as being not particularly limited as long as damaging features described above, until
Contain curable resin, curing agent and electroconductive particle less, preferably comprises film and form resin, silane coupling agent.
As curable resin, it is not particularly limited, can be used for example commercially available as long as there is mobility at normal temperatures
Epoxy resin.As such epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, benzene can be specifically used
Phenol phenolic resin varnish type epoxy resin, bisphenol-type epoxy resin, Stilbene type epoxy resin, tris-phenol type epoxy resin, phenol virtue
Alkane type epoxy resin, naphthol type epoxy resin, dicyclopentadiene-type epoxy resin, triphenylmethane type epoxy resin etc..It
Both can be used alone, can also be used in combination.In addition it is also possible to other organic resins such as acrylic resin
Appropriately combined use.
As curing agent, the various latent curing agents such as heat-curing type, UV curing types can be used.Latent curing agent
It does not react usually, is activated by arbitrary releaser, initiation reaction.Releaser has heat, light, pressurization etc., can be selected according to purposes
Select use.Wherein, it is preferable to use the latent curing agents of heat-curing type in the application, by finger electrode 12, back side electricity
The heating of pole 13 presses to carry out formal solidification.In the case of using liquid epoxy resin, can use comprising imidazoles, amine,
The latent curing agent of sulfonium salt, salt etc..
Film forms resin and is equivalent to the high molecular weight resin that average molecular weight is 10000 or more, from the viewpoint of film formative
From the point of view of, preferably 10000~80000 or so average molecular weight.Resin is formed as film, epoxy resin, modified ring can be used
The various resins such as oxygen resin, polyurethane resin, phenoxy resin, wherein from the point of view of film forms the viewpoints such as state, connection reliability
It is preferable to use phenoxy resins.
As silane coupling agent, epoxy, amino system, sulfydryl thioether system, urea groups system etc. can be used.Wherein, in this reality
Apply in mode that it is preferable to use epoxy silane coupling agents.Thereby, the bonding of the interface of organic material and inorganic material can be improved
Property.
In addition, as other addition compositions, inorganic filler is preferably comprised.By containing inorganic filler, crimping can adjust
When resin layer mobility, improve particle-capture rate.As inorganic filler, can use silica, talcum, titanium oxide,
The type of calcium carbonate, magnesia etc., inorganic filler is not particularly limited.
Adhesive resin 22 as electric conductivity adhesive film 17 is, it is preferable to use the glass transition temperature (Tg) after solidification exists
140 DEG C or more of resin, the resin for the use of the Tg after solidification being particularly preferably 150 DEG C~180 DEG C.By making the Tg after solidification be
140 DEG C or more, even if high connecting reliability can be maintained if under the big harsh practical service environment of the difference of height of temperature.
On the other hand, it in the case that the Tg after the solidification of adhesive resin 22 is less than 140 DEG C, as described below, is followed in temperature
The notable raising of visible resistance value in the reliability test of ring.In addition, the Tg after solidification can be higher than 180 DEG C, but because solidification
Preceding Tg can also be increased, and may be impacted to connection reliability when being thermally compressed, so more preferably 180 DEG C or less.
In addition, in electric conductivity adhesive film 17,30 DEG C of elasticity modulus (E ') after the solidification of adhesive resin 22 are preferably
1GPa or more, particularly preferably 1.3~2.0GPa.
In addition, in electric conductivity adhesive film 17,125 DEG C of elasticity modulus (E ') after the solidification of adhesive resin 22 are preferably
0.5GPa or more, particularly preferably 0.8~1.0GPa.
If 30 DEG C of elasticity modulus (E ') are less than 1GPa or 125 DEG C of elasticity modulus (E ') and are less than 0.5GPa, relative to
Temperature cycles and the connection reliability of thermal shock are greatly reduced.
In addition, electric conductivity adhesive film 17 contains thermoplastic composition in adhesive resin 22, the thermoplastic composition contained
Preferably 35~55wt%, particularly preferably 40~50wt%.
In the case that thermoplastic composition is less than 35wt%, the adhesion properties of adhesive resin 22 reduce, and joint line 3 becomes to hold
It is easily peelable.In addition, thermoplastic composition is more than in the case of 50wt%, elasticity modulus is greatly reduced, relative to temperature cycles and heat
The connection reliability of impact is greatly reduced.
[electroconductive particle]
As electroconductive particle 23 used in electric conductivity adhesive film 17, resin core metal plating particle or clipped wire are used
Son.It is not particularly limited as metallic, the metallic such as nickel, gold, silver, copper can be enumerated.In addition, as resin core metal
Plating particle can enumerate and implement particle etc. obtained by gold-plated or nickel plating to resin particle.
Including 10% compressive strength of the electroconductive particle 23 of resin core metal plating particle is preferably 30~500MPa, more
Preferably 50~400MPa.Including if 10% compressive strength of the electroconductive particle 23 of resin core metal plating particle is less than
30MPa, then thermo-compression bonding when can be crushed excessively, if in addition, 10% compressive strength be higher than 500MPa, thermo-compression bonding when can not
It is fully broken.Therefore, it can not be all absorbed using electroconductive particle 23 under any circumstance because the line of joint line and electrode is swollen
The difference of swollen coefficient and the stress generated, damage conduction.
In addition, apparent gravity/true specific gravity of the electroconductive particle 23 comprising metallic be preferably 0.15 hereinafter, more preferably
0.05 or more and 0.1 or less.Including apparent gravity/true specific gravity of the electroconductive particle 23 of metallic is then glued if it is greater than 0.15
Electroconductive particle amount contained in mixture resin 22 is reduced, and particle-capture reduces.In addition, if apparent gravity/true specific gravity is small
In 0.04, then electroconductive particle amount increase, particle embedability reduces.At this point, also can not using electroconductive particle 23 come absorb because
For the stress that the difference of joint line and the linear expansion coefficient of electrode generates, conduction is damaged.
[manufacturing process of resin core metal plating particle]
Here, an example as electroconductive particle 23, i.e. resin core metal plating particle, to gold/nickel coated with resin particle
Manufacturing process illustrate.First, palladium chtalyst is supported by infusion process on 3 μm of divinylbenzene resin beads (5g)
Agent.Then, for the resin particle, object, sodium hypophosphite, sodium citrate, triethanolamine and thallium nitrate are closed with by nickel sulfate hexahydrate
The process for electroless nickel plating liquid (50 DEG C of pH12, plating solution temperature) being prepared carries out process for electroless nickel plating, obtains to surface and is formed with each
The nickel coated with resin particle of the nickel coating (metal layer) of kind phosphorus content is as conducting particles.The average grain diameter of gained conducting particles is
3~4 μm of range.
Sodium chloraurate 10g is dissolved in ion exchange water 1000mL, the nickel obtained as described above is mixed in acquired solution
Coated with resin particle 12g, is prepared aqueous suspension.ATS (Ammonium thiosulphate) 15g, sulfurous acid are put into gained aqueous suspension
Ammonium 80g and ammonium hydrogen phosphate 40g, to which gold plating bath be prepared.After putting into azanol 4g in gained gold plating bath, with ammonia by gold plating bath
PH adjust to 9, bath temperature is then maintained 60 DEG C 15~20 minutes or so, to obtain gold/nickel coated with resin particle.
[manufacturing process of metallic]
Addition sodium hydroxide and tartaric acid, are heated up to 65 DEG C while stirring in 306 liters of pure water.In the aqueous solution
39 liters of 60% hydrazine hydrate is added, is calculated as the nickel chloride aqueous solution of 5kg with nickel equivalent, so that nickel is precipitated by reduction reaction.Then, will
The liquid filters and washing, obtains nickel by powder.It by the nickel by powder at 80 DEG C after drying, crushes, classification, regular is various grains
Diameter.
[manufacturing process of electric conductivity adhesive film]
Fig. 5 is the figure of an example for the product form for schematically indicating electric conductivity adhesive film 17.In the electric conductivity adhesive film 17,
Adhesive resin layer is laminated in peeling base 24, is shaped to band-like.The band-like electric conductivity adhesive film winding is laminated in spool
25 so that peeling base 24 is located on the outer side.It is not particularly limited as peeling base 24, PET (poly terephthalic acids can be used
Glycol ester (Poly Ethylene Terephthalate)), OPP (oriented polypropylene (Oriented
Polypropylene)), PMP (poly- 4-methyl-1-pentene (Poly-4-methlpentene-1)), PTFE (polytetrafluoroethylene (PTFE)
(Polytetrafluoroethylene)) etc..In addition, electric conductivity adhesive film 17 can also be to have on adhesive resin layer
The composition of transparent cover film.
At this point, as the cover film being pasted onto on adhesive resin layer, above-mentioned joint line 3 can be used.Electric conductivity is bonded
In film 17, adhesive resin layer is laminated in the one side 3a of the bonding plane as the surface with solar battery cell 2 of joint line 3
Or the another side 3b of the bonding plane as the back side with solar battery cell 2.In this way, by joint line 3 and will lead in advance
Integration is laminated in electrical adhesive film 17, in actual use, by by the stripping of peeling base 24, by the viscous of electric conductivity adhesive film 17
Mixture resin layer is pasted onto on finger electrode 12 or the joint line interconnecting piece 14 of backplate 13, can realize joint line 3 and each electricity
The connection of pole 12,13.
Above, the electric conductivity adhesive film with film shape is illustrated, even if being that also there is no problem for paste.
In the application, the electric conductivity bonding thickener of the membranaceous electric conductivity adhesive film 17 or paste containing electroconductive particle is defined as
" conductive adhesive ".Use electric conductivity bonding thickener in the case of, can also in advance joint line 3 as with solar-electricity
It is coated with electric conductivity bonding thickener on the one side 3a of the bonding plane on the surface of pool unit 2, which is pasted onto too
On each electrode 12,13 of positive energy battery unit 2.
In addition, electric conductivity adhesive film 17 is not limited to spool-shape, can also be the company with the surface of solar battery cell 2
Connect the corresponding oblong-shaped of shape of the joint line interconnecting piece 14 of region or backplate 13.
In the case of being provided in the form of the spool product for being wrapped around electric conductivity adhesive film 17 as shown in Figure 5, led by making
The range that the viscosity of electrical adhesive film 17 is 10~10000kPa s, can prevent the deformation of electric conductivity adhesive film 17, maintain regulation
Size.It in addition, in the case that electric conductivity adhesive film 17 is laminated 2 or more with oblong-shaped, can similarly prevent from deforming, maintain
Defined size.
[manufacturing process of solar cell module]
Above-mentioned electric conductivity adhesive film 17 makes electroconductive particle 23, curable resin, curing agent, film form resin and silane idol
Connection agent is dissolved in solvent.As solvent, toluene, ethyl acetate etc. or their mixed solvent can be used.Obtained by dissolving
Resin generation solution coating makes solvent volatilize on peeling sheet, to obtain electric conductivity adhesive film 17.
By 2 of surface electrode and 2 17 pre-bonding of electric conductivity adhesive film for cutting into specific length of backplate
It is attached to the specified position at the table back side of solar battery cell 2.At this point, electric conductivity adhesive film 17 is pasted on solar cell in advance
The surface of unit 2 so that intersect with the multiple each finger electrodes 12 formed substantially in parallel, or be pasted onto backplate 13 in advance
Joint line interconnecting piece 14 on.
Then, the joint line 3 for similarly cutting into specific length is overlapped on electric conductivity adhesive film 17.Then,
For electric conductivity adhesive film 17, hot pressurization is carried out with defined temperature, pressure by heating welding on joint line 3, to
With the finger electrode 12 of joint line 3 and solar battery cell 2 and the joint line interconnecting piece 14 of backplate 13 by electric conductivity grain
Son 23 is clamped, and so that adhesive resin is cured in this state.
Thereby form the solar cell string 4 that multiple solar battery cells 2 are formed by connecting by joint line 3.For by
Matrix 5 made of 4 arrangement of multiple strings, will seal the sheet material 6 of the sealing adhesive of the translucency such as the EVA of solar battery cell 2
It is laminated in the table back side, and unified laminated, last with the surface cap 7 for being set to light receiving side and the backboard 8 for being set to back side
The metal frames 9 such as aluminium are installed around, complete solar cell module 1.
It, can be with by using the solar battery cell 2 of so-called no bus structure in addition, according to solar cell module
It need not carry out the alignment of busbar electrode and electric conductivity adhesive film 17 or joint line 3, realize manufacturing process's number and component number
It cuts down, and cuts down manufacturing cost.
[unified laminated]
In addition, for solar cell module 1, in addition to as described above on each electrode of solar battery cell 2 12,13
Other than technique after configuration electric conductivity adhesive film 17 and joint line 3, by carrying out hot pressurization on heating butt welding head line 3,
Electric conductivity adhesive film 17, joint line 3 and sealing solar-electricity can be stacked gradually on the surface of solar battery cell 2 and the back side
The sheet material 6 of the sealing adhesive of the translucency such as the EVA of pool unit 2 by depressurizing laminated unified progress lamination process, and will connect
The heat pressurization on each electrode 12,13 of head line 3.
[embodiment]
Then, the embodiment of the present invention is illustrated.In the present embodiment, as shown in Fig. 6 (A), (B), across following institute
The electric conductivity adhesive film 33 of the embodiment and comparative example stated parallelly is matched on the face that the glass substrate 31 for having aluminium is deposited in one side
2 joint lines 32 being made of the band-like copper foil being coated with through scolding tin are set, stacking EVA34, transparent PET film 35 carry out lamination process,
To manufacture evaluation connector 30.Then, for each evaluation connector 30, measurement is led from evaluation with the both ends of connector 30
The electric conduction after the conducting resistance for connecting initial stage, temperature cycling test between each one end 32a, 32b of 2 joint lines 32 gone out
The climbing of resistance.
Resistance value is the 4 terminal methods by using digimer (digimer 7555, Yokogawa Motor society system)
Find out the connection resistance (m Ω) when circulation 1A electric currents.The experimental condition of temperature cycling test is the atmosphere in -40 DEG C and 100 DEG C
In each exposure 30 minutes or more, as 1 cold cycling, carry out 200 cycles.In being evaluated shown in table 1, it will lead at initial stage
The resistance that is powered is denoted as zero less than 25m Ω, and initial stage conducting resistance is denoted as △ for 25m Ω~40m Ω, initial stage conducting resistance is existed
Being denoted as of 40m Ω or more ×.In addition, the climbing of the conducting resistance after temperature cycling test is denoted as zero less than 10%, it will
Climbing is denoted as △ 10% less than 20%, by climbing 20% or more be denoted as ×.
In addition, in the present embodiment, as shown in Fig. 7 (A), it is bonded across embodiments discussed below and the electric conductivity of comparative example
Film 33 and having in coated on one side parallelly configured on the face of the glass substrate 31 of Ag thickeners 2 it is band-like comprising being coated with through scolding tin
The joint line 32 of copper foil, stacking EVA34, PET film 35, carries out lamination process, to manufacture evaluation connector 30.Then, right
In each evaluation connector 30, after removing PET film and EVA, the bonding strength of joint line 32 is measured as shown in Fig. 7 (B).
Bonding strength is the joint line 32 that will be connect with evaluation connector 30 along the direction for being 90 ° relative to joint face
Measurement is pulled up with cupping machine (TENSILON, Orion Tyke society (オ リ エ Application テ ッ Network) system).It is evaluated shown in table 1
In, bonding strength is denoted as zero in 1.2N/mm or more, bonding strength is denoted as in 0.7N/mm less than 1.2N/mm
△, by bonding strength less than being denoted as of 0.7N/mm ×.
Then, in each embodiment and comparative example, the rising after bonding strength, initial stage conducting resistance, temperature cycling test
When rate is zero, overall merit is denoted as zero (good), when having any one target to have △, overall merit is denoted as △ (common),
Any one of have target have × when, overall merit is denoted as × (bad).
[the embodiment comparative example of resin core metal plating particle]
Tg after the electric conductivity adhesive film use solidification of embodiment 1 is 140 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 2 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 3 is 180 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 4 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.0GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 5 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.3GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 6 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 2.0GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 7 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.5GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 8 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.8GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 9 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 1.0GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 10 is 150 DEG C, the thermoplastic composition containing 35wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 11 is 150 DEG C, the thermoplastic composition containing 40wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 12 is 150 DEG C, the thermoplastic composition containing 55wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 13 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 30MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 14 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 50MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 15 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 400MPa is used.
Tg after the electric conductivity adhesive film use solidification of embodiment 16 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 500MPa is used.
Tg after the electric conductivity adhesive film use solidification of comparative example 1 is 130 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, gold/nickel coated with resin particle that 10% compressive strength is 200MPa is used.
[the embodiment comparative example of metallic]
Tg after the electric conductivity adhesive film use solidification of embodiment 17 is 140 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 18 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 19 is 180 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 20 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.0GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 21 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.3GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 22 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 2.0GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 23 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.5GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 24 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.8GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 25 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 1.0GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 26 is 150 DEG C, the thermoplastic composition containing 35wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 27 is 150 DEG C, the thermoplastic composition containing 40wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 28 is 150 DEG C, the thermoplastic composition containing 55wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
Tg after the electric conductivity adhesive film use solidification of embodiment 29 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.04.
Tg after the electric conductivity adhesive film use solidification of embodiment 30 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.075.
Tg after the electric conductivity adhesive film use solidification of embodiment 31 is 150 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.125.
Tg after the electric conductivity adhesive film use solidification of comparative example 2 is 130 DEG C, the thermoplastic composition containing 50wt%, consolidates
30 DEG C of elasticity modulus (E ') after change are that the resin conduct that 125 DEG C of elasticity modulus (E ') after 1.5GPa, solidification are 0.6GPa is viscous
Mixture resin.In addition, as electroconductive particle, the nickel particles for the use of apparent gravity/true specific gravity being 0.1.
In addition, 10% compressive strength of resin core metal plating particle uses micro-compression tester (MCTM- at room temperature
200, Shimadzu Seisakusho Ltd.'s system) in test load 3.00 (gf), load speed constant 2 (0.135gf/sec), 5.00 (μ of displacement scale
M) it, is measured under conditions of 50 (μm φ) of pressure.In addition, the apparent gravity of nickel particles with Scott volumeter (ASTM-B-329-98,
Cylinder well Physicochemical instrument society system) it measures.
[table 1]
As shown in table 1, in the electric conductivity adhesive film of Examples 1 to 31, because the use of the Tg after solidification being 140 DEG C or more
Resin is as adhesive resin, so even if can inhibit relatively low by the climbing of resistance value if after temperature cycling test.Separately
On the one hand, in Comparative Examples 1 and 2, because using the resin that the Tg after solidification is 130 DEG C as adhesive resin, temperature cycles
The climbing of resistance value after experiment is high.Thus, it can be known that by using the electric conductivity adhesive film of embodiment, even if in the height of temperature
Under the big practical service environment of low difference, good conducting reliability can be also maintained.
If embodiment 1 and embodiment 2,3 compared, it is used as adhesive resin, in the electric conductivity adhesive film of embodiment 1
The use of the Tg after solidification is 140 DEG C of resin, the resin for the use of the Tg after solidification being 150 DEG C in embodiment 2 makes in embodiment 3
The resin for being 180 DEG C with the Tg after solidification.The climbing of resistance value after temperature cycling test is that embodiment 2,3 is more good,
Thus, it can be known that as adhesive resin, resin that the Tg after preferred consolidation is 150 DEG C~180 DEG C.
Similarly, if embodiment 17 and embodiment 18,19 compared, the resistance value after temperature cycling test is understood
Climbing is that embodiment 18,19 is more good, therefore as adhesive resin, and the Tg after preferred consolidation is 150 DEG C~180 DEG C
Resin.
If embodiment 4 and embodiment 5,6 compared, it is used as adhesive resin, in the electric conductivity adhesive film of embodiment 4
Using the resin that 30 DEG C of elasticity modulus (E ') are 1.0GPa, the tree that 30 DEG C of elasticity modulus (E ') are 1.3GPa is used in embodiment 5
Fat uses the resin that 30 DEG C of elasticity modulus (E ') are 2.0GPa in embodiment 6.The climbing of resistance value after temperature cycling test
It is that embodiment 5,6 is more good, thus, it can be known that as adhesive resin, preferably 30 DEG C of elasticity modulus (E ') are 1.3~2.0GPa
Resin.
Similarly, if embodiment 20 and embodiment 21,22 compared, the resistance value after temperature cycling test is understood
Climbing is that embodiment 21,22 is more good, therefore as adhesive resin, preferably 30 DEG C of elasticity modulus (E ') are 1.3~
The resin of 2.0GPa.
If embodiment 7 and embodiment 8,9 compared, it is used as adhesive resin, in the electric conductivity adhesive film of embodiment 7
Using the resin that 125 DEG C of elasticity modulus (E ') are 0.5GPa, it is 0.8GPa's that 125 DEG C of elasticity modulus (E ') are used in embodiment 8
Resin uses the resin that 125 DEG C of elasticity modulus (E ') are 1.0GPa in embodiment 9.Resistance value after temperature cycling test it is upper
The rate of liter is that embodiment 8,9 is more good, thus, it can be known that as adhesive resin, preferably 125 DEG C of elasticity modulus (E ') for 0.8~
The resin of 1.0GPa.
Similarly, if embodiment 23 and embodiment 24,25 compared, the resistance value after temperature cycling test is understood
Climbing is that embodiment 24,25 is more good, therefore as adhesive resin, preferably 125 DEG C of elasticity modulus (E ') are 0.8~
The resin of 1.0GPa.
If embodiment 10 and embodiment 11,12 compared, in the electric conductivity adhesive film of embodiment 10, as adhesive
Resin, the resin of the thermoplastic composition containing 35wt%, in contrast, in embodiment 11 using the thermoplasticity containing 40wt% at
Point resin, the resin of the thermoplastic composition containing 55wt% is used in embodiment 12.Bonding strength be embodiment 11,12 more
Well, thus, it can be known that as adhesive resin, the preferably resin of the thermoplastic composition containing 40wt%~55wt%.
Similarly, if embodiment 26 and embodiment 27,28 compared, bonding strength is that embodiment 27,28 is more good
It is good, thus, it can be known that as adhesive resin, the preferably resin of the thermoplastic composition containing 40wt%~55wt%.
If embodiment 13 and embodiment 14 compared, 10% compressive strength of the electroconductive particle of embodiment 13 is
30MPa, in contrast, 10% compressive strength of the electroconductive particle of embodiment 14 is 50MPa.Moreover, initial stage conducting resistance is
Embodiment 14 is good, thus, it can be known that in the case of using resin core metal plating particle as electroconductive particle, preferably 10% pressure
Contracting intensity is 50MPa or more.
In addition, if embodiment 15 and embodiment 16 are compared, then 10% compression of the electroconductive particle of embodiment 15 is strong
Degree is 400MPa, and in contrast, 10% compressive strength of the electroconductive particle of embodiment 16 is 500MPa.Moreover, temperature cycles
The climbing of resistance value after experiment is that embodiment 15 is good, thus, it can be known that using resin core metal plating particle as conduction
Property particle in the case of, preferably 10% compressive strength be 400MPa or less.
In addition, if embodiment 29 and embodiment 30,31 are compared, then the apparent gravity of the electroconductive particle of embodiment 29/
True specific gravity is 0.04, and in contrast, apparent gravity/true specific gravity of the electroconductive particle of embodiment 30 is 0.075, and embodiment 31 is led
Apparent gravity/true specific gravity of conductive particles is 0.125.Moreover, the climbing of the resistance value after temperature cycling test be embodiment 30,
31 is good, thus, it can be known that in the case of using metallic as electroconductive particle, preferably apparent gravity/true specific gravity for 0.05 with
It is upper and 0.15 or less.
The explanation of symbol
1 solar cell module, 2 solar battery cells, 3 joint lines, 4 strings, 5 matrixes, 6 sheet materials, 7
Surface cap, 8 backboards, 9 metal frames, 12 finger electrodes, 13 backplates, 14 joint line interconnecting pieces, 17 are led
Electrical adhesive film, 22 adhesive resins, 23 electroconductive particles, 24 peeling base, 25 spools, 30 evaluations connection
Body, 31 glass substrates, 32 joint lines, 33 electric conductivity adhesive films, 34 EVA, 35 PET films.
Claims (3)
1. conductive adhesive is the electrode and the multiple solar cell lists of connection that will be formed in solar battery cell
The conductive adhesive of the joint line connection of member,
Wherein at least contain curable resin, electroconductive particle and curing agent,
The electroconductive particle is resin core metal plating particle or metallic, and the resin core metal plating particle
10% compressive strength is 50~400MPa, and the metallic is at least appointing in nickel particles, gold particle, silver particles and copper particle
Meaning is a kind of, and apparent gravity/true specific gravity of the metallic be 0.05 or more 0.15 hereinafter,
30 DEG C of elasticity modulus (E ') after the solidification of the conductive adhesive are 1.3~2.0GPa, and
125 DEG C of elasticity modulus (E ') after the solidification of the conductive adhesive are 0.6GPa or more,
Thermoplastic composition in the conductive adhesive is 40~55wt% relative to the total weight of resin,
Tg after the solidification of the conductive adhesive is 150~180 DEG C.
2. solar cell module,
It includes solar battery cell, the joint line of the multiple solar battery cells of connection and setting being formed in
The conductive adhesive layer between the electrode of solar battery cell and the joint line is stated,
The conductive adhesive layer at least contains curable resin, electroconductive particle and curing agent,
The electroconductive particle is resin core metal plating particle or metallic, and the resin core metal plating particle
10% compressive strength is 50~400MPa, and the metallic is at least appointing in nickel particles, gold particle, silver particles and copper particle
Meaning is a kind of, and apparent gravity/true specific gravity of the metallic be 0.05 or more 0.15 hereinafter,
30 DEG C of elasticity modulus (E ') after the solidification of the conductive adhesive are 1.3~2.0GPa, and
125 DEG C of elasticity modulus (E ') after the solidification of the conductive adhesive are 0.6GPa or more,
Thermoplastic composition in the conductive adhesive is 40~55wt% relative to the total weight of resin,
Tg after the solidification of the conductive adhesive layer is 150~180 DEG C.
3. the manufacturing method of solar cell module comprising：
By the multiple solar battery cells for being formed with electrode process arranged side by side；
The joint line for connecting multiple solar battery cells is pre-configured by conductive adhesive described in claim 1
In the process of the electrode of the solar battery cell；With
So that the conductive adhesive is cured by heating pressing to the joint line, the electrode and the joint line are connected
It connects, the process for being connected the adjacent solar battery cell by the joint line.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012248589A JP6030924B2 (en) | 2012-11-12 | 2012-11-12 | Conductive adhesive, solar cell module, and method for manufacturing solar cell module |
| JP2012-248589 | 2012-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103805087A CN103805087A (en) | 2014-05-21 |
| CN103805087B true CN103805087B (en) | 2018-10-19 |
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| CN201310558978.5A Active CN103805087B (en) | 2012-11-12 | 2013-11-12 | The manufacturing method of conductive adhesive, solar cell module and solar cell module |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6030924B2 (en) |
| KR (1) | KR20140061964A (en) |
| CN (1) | CN103805087B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6175935B2 (en) * | 2013-06-25 | 2017-08-09 | 日立化成株式会社 | Solar cell connection material, solar cell module using the same, and manufacturing method thereof |
| JP2016039198A (en) | 2014-08-06 | 2016-03-22 | セイコーエプソン株式会社 | Solar battery, electronic apparatus and method of manufacturing solar battery |
| JP6639079B2 (en) * | 2014-09-22 | 2020-02-05 | デクセリアルズ株式会社 | Anisotropic conductive material |
| CN107735477B (en) * | 2015-06-18 | 2020-09-11 | 思美定株式会社 | Conductive adhesive, conductive structure, and electronic component |
| CN105845754A (en) * | 2016-04-14 | 2016-08-10 | 泰州中来光电科技有限公司 | Solar energy cell module, preparing method, assembly and system for the cell module |
| JP6694763B2 (en) * | 2016-06-08 | 2020-05-20 | 信越ポリマー株式会社 | Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film |
| CN110061081B (en) * | 2019-05-28 | 2024-03-29 | 浙江晶科能源有限公司 | Photovoltaic cell array and photovoltaic module |
| CN110233186A (en) * | 2019-07-04 | 2019-09-13 | 江苏友科太阳能科技有限公司 | A kind of welding of high power gain and preparation method thereof |
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| JPS60258279A (en) * | 1984-06-05 | 1985-12-20 | Matsushita Electric Ind Co Ltd | Electrically conductive adhesive |
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| JP5499448B2 (en) * | 2008-07-16 | 2014-05-21 | デクセリアルズ株式会社 | Anisotropic conductive adhesive |
| KR101279975B1 (en) * | 2010-10-05 | 2013-07-05 | 제일모직주식회사 | Electrical connecting material between conductors |
| JP5707110B2 (en) * | 2010-11-26 | 2015-04-22 | デクセリアルズ株式会社 | Conductive adhesive material, solar cell module and manufacturing method thereof |
| JP2012119441A (en) * | 2010-11-30 | 2012-06-21 | Sony Chemical & Information Device Corp | Solar cell module and method for manufacturing the same |
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- 2012-11-12 JP JP2012248589A patent/JP6030924B2/en active Active
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- 2013-11-12 CN CN201310558978.5A patent/CN103805087B/en active Active
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|---|---|---|---|---|
| CN1293467A (en) * | 1999-09-14 | 2001-05-02 | 索尼化学株式会社 | Chip parts on glass and connecting material used thereof |
| CN101278027A (en) * | 2005-09-30 | 2008-10-01 | 住友电气工业株式会社 | Anisotropic conductive adhesive |
| CN102176481A (en) * | 2006-04-26 | 2011-09-07 | 日立化成工业株式会社 | Adhesive tape and solar cell module using the same |
| CN102568656A (en) * | 2010-12-29 | 2012-07-11 | 第一毛织株式会社 | Double-layered anisotropic conductive film and apparatus including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140061964A (en) | 2014-05-22 |
| JP6030924B2 (en) | 2016-11-24 |
| JP2014096532A (en) | 2014-05-22 |
| CN103805087A (en) | 2014-05-21 |
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