TWI581972B - A method of manufacturing a connecting body, and a method of connecting an electronic component - Google Patents

A method of manufacturing a connecting body, and a method of connecting an electronic component Download PDF

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Publication number
TWI581972B
TWI581972B TW102109780A TW102109780A TWI581972B TW I581972 B TWI581972 B TW I581972B TW 102109780 A TW102109780 A TW 102109780A TW 102109780 A TW102109780 A TW 102109780A TW I581972 B TWI581972 B TW I581972B
Authority
TW
Taiwan
Prior art keywords
connection
connection region
electronic component
substrate
light
Prior art date
Application number
TW102109780A
Other languages
Chinese (zh)
Other versions
TW201345724A (en
Inventor
Keisuke Inase
Original Assignee
Dexerials Corp
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Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW201345724A publication Critical patent/TW201345724A/en
Application granted granted Critical
Publication of TWI581972B publication Critical patent/TWI581972B/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Description

連接體之製造方法、及電子零件之連接方法 Method for manufacturing connector and method for connecting electronic components

本發明係關於一種使用光硬化型之接著劑而連接電子零件等之連接體之製造方法、及使用光硬化型之接著劑連接電子零件等之連接方法。 The present invention relates to a method for producing a connector for connecting an electronic component or the like using a photocurable adhesive, and a connection method for connecting an electronic component or the like using a photocurable adhesive.

本申請案係以在日本於2012年3月23日所申請之日本專利申請案編號日本特願2012-68140為基礎而主張優先權，藉由參照將該申請案引用於本申請案中。 The present application claims priority on the basis of Japanese Patent Application No. 2012-68140, filed on Jan.

自先前以來，作為電視或PC監控器、行動電話、可攜式遊戲機、平板PC或車載用監控器等各種顯示機構，大多使用液晶顯示裝置。近年來，於此種液晶顯示裝置中，就微間距化、輕量薄型化等觀點而言，採用將液晶驅動用IC直接構裝於液晶顯示面板之基板上之所謂之COG(chip on glass)或將形成有液晶驅動電路之可撓性基板直接構裝於液晶顯示面板之基板上之所謂之FOG(film on glass)。 Since the past, liquid crystal display devices have been widely used as various display mechanisms such as televisions, PC monitors, mobile phones, portable game machines, tablet PCs, and vehicle monitors. In the liquid crystal display device, a so-called COG (chip on glass) in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel is used in terms of fine pitch, light weight, and the like. Or a so-called FOG (film on glass) in which a flexible substrate on which a liquid crystal driving circuit is formed is directly mounted on a substrate of a liquid crystal display panel.

例如採用COG構裝方式之液晶顯示裝置100如圖11所示，具有實現用於液晶顯示之主要功能之液晶顯示面板104，該液晶顯示面板104具有由玻璃基板等所構成之相互對向之兩片透明基板102、103。並且，液晶顯示面板104中，該等兩透明基板102、103藉由框狀之密封件105相互貼合，並且設置有於由兩透明基板102、103及密封件105所圍繞之空間內封入液晶106之面板顯示部107。 For example, as shown in FIG. 11, the liquid crystal display device 100 using the COG mounting method has a liquid crystal display panel 104 that realizes a main function for liquid crystal display, and the liquid crystal display panel 104 has two mutually opposing substrates composed of a glass substrate or the like. Sheet transparent substrates 102, 103. Further, in the liquid crystal display panel 104, the two transparent substrates 102 and 103 are bonded to each other by a frame-shaped sealing member 105, and are provided with a liquid crystal enclosed in a space surrounded by the two transparent substrates 102 and 103 and the sealing member 105. The panel display unit 107 of 106.

透明基板102、103於相互對向之兩內側表面以相互交叉之 方式形成有由ITO(氧化銦錫)等所構成之條紋狀之一對透明電極108、109。並且，兩透明基板102、103藉由該等兩透明電極108、109之該交叉部位而構成作為液晶顯示之最小單位之像素。 The transparent substrates 102, 103 cross each other on opposite inner side surfaces In this manner, a pair of stripe-shaped transparent electrodes 108 and 109 made of ITO (indium tin oxide) or the like are formed. Further, the two transparent substrates 102 and 103 constitute pixels which are the smallest unit of the liquid crystal display by the intersection of the two transparent electrodes 108 and 109.

兩透明基板102、103中，一個透明基板103形成為平面尺寸大於另一個透明基板102，於該較大地形成之透明基板103之緣部103a形成有透明電極109之端子部109a。又，於兩透明電極108、109上形成有經實施特定之摩擦處理之配向膜111、112，藉由該配向膜111、112，液晶分子之初期配向受到限制。進而，於兩透明電極108、109之外側配設有一對偏光板118、119，藉由該等兩偏光板118、119，自背光裝置等光源120之透過光之振動方向受到限制。 Of the two transparent substrates 102 and 103, one transparent substrate 103 is formed to have a larger planar size than the other transparent substrate 102, and a terminal portion 109a of the transparent electrode 109 is formed on the edge portion 103a of the largely formed transparent substrate 103. Further, alignment films 111 and 112 subjected to a specific rubbing treatment are formed on the two transparent electrodes 108 and 109, and the alignment of the liquid crystal molecules is restricted by the alignment films 111 and 112. Further, a pair of polarizing plates 118 and 119 are disposed on the outer sides of the two transparent electrodes 108 and 109, and the directions of vibration of the transmitted light from the light source 120 such as the backlight device are restricted by the two polarizing plates 118 and 119.

於端子部109a上經由異向性導電膜114而熱壓接有液晶驅動用IC115。異向性導電膜114係於熱硬化型黏合劑樹脂中混入有導電性粒子而製成膜狀者，藉由於2個導體間進行加熱壓接而利用導電粒子取得導體間之電性導通，藉由黏合劑樹脂保持導體間之機械性連接。液晶驅動用IC115可藉由對像素選擇性地施加液晶驅動電壓而使液晶之配向部分地變化而進行特定之液晶顯示。再者，作為構成異向性導電膜114之接著劑，通常使用可靠性最高之熱硬化性之接著劑。 The liquid crystal driving IC 115 is thermocompression-bonded to the terminal portion 109a via the anisotropic conductive film 114. The anisotropic conductive film 114 is formed by mixing conductive particles into a thermosetting adhesive resin to form a film. The conductive conduction between the two conductors is used to obtain electrical conduction between the conductors by using the conductive particles. The mechanical connection between the conductors is maintained by the adhesive resin. The liquid crystal driving IC 115 can perform a specific liquid crystal display by partially applying a liquid crystal driving voltage to a pixel to partially change the alignment of the liquid crystal. Further, as the adhesive constituting the anisotropic conductive film 114, the most reliable thermosetting adhesive is usually used.

於經由此種異向性導電膜114將液晶驅動用IC115連接於端子部109a之情形時，首先，藉由未圖示之暫時壓接機構將異向性導電膜114暫時壓接於透明電極109之端子部109a上。繼而，將液晶驅動用IC115載置於異向性導電膜114上後，如圖12所示，藉由熱壓頭等熱壓接手段121將液晶驅動用IC115與異向性導電膜114一同向端子部109a側按壓，並且使熱壓接手段121發熱。藉由該熱壓接手段121產生之發熱，異向性導電膜114產生熱硬化反應，藉此，液晶驅動用IC115經由異向性導電膜114而接著於端子部109a上。 When the liquid crystal driving IC 115 is connected to the terminal portion 109a via the anisotropic conductive film 114, first, the anisotropic conductive film 114 is temporarily pressure-bonded to the transparent electrode 109 by a temporary pressure bonding mechanism (not shown). On the terminal portion 109a. Then, after the liquid crystal driving IC 115 is placed on the anisotropic conductive film 114, as shown in FIG. 12, the liquid crystal driving IC 115 and the anisotropic conductive film 114 are aligned together by a thermocompression bonding means 121 such as a thermal head. The terminal portion 109a side is pressed, and the thermocompression bonding means 121 is heated. By the heat generated by the thermocompression bonding apparatus 121, the anisotropic conductive film 114 is thermally hardened, whereby the liquid crystal driving IC 115 is connected to the terminal portion 109a via the anisotropic conductive film 114.

然而，於使用此種異向性導電膜之連接方法中，熱加壓溫度高，對液晶驅動用IC115等電子零件或透明基板103之熱衝擊變大。 However, in the connection method using such an anisotropic conductive film, the heat-pressing temperature is high, and the thermal shock to the electronic component such as the liquid crystal driving IC 115 or the transparent substrate 103 is increased.

因此，亦提出有代替此種使用熱硬化型接著劑之異向性導電膜114而使用紫外線硬化型接著劑之連接方法。於使用紫外線硬化型接著劑之連接方法中，加熱至接著劑因熱而軟化流動而於透明電極109之端子部109a與液晶驅動用IC115之電極間夾持導電性粒子所充分之溫度而停止，並藉由紫外線照射使接著劑硬化。 Therefore, a connection method using an ultraviolet curable adhesive instead of the anisotropic conductive film 114 using a thermosetting adhesive is also proposed. In the connection method using the ultraviolet curable adhesive, the adhesive is heated to a softening flow by heat, and is stopped at a temperature sufficient to sandwich the conductive particles between the terminal portion 109a of the transparent electrode 109 and the electrode of the liquid crystal driving IC 115. The adhesive is hardened by ultraviolet irradiation.

然而，即便於使用該紫外線硬化型接著劑之連接方法中，亦會伴隨藉由紫外線照射之硬化而產生接著劑之收縮。因此，有如下之虞：由於該收縮而於夾持液晶106之透明基板103之IC連接部產生翹曲，因此失去面板顯示部107中之透明基板102、103間之間隙之面均勻性，並且液晶之配向紊亂，引起顯示不均等不良情況。又，亦有因產生於透明基板103之IC連接部之翹曲而引起液晶驅動用IC115之連接不良之虞。 However, even in the connection method using the ultraviolet curable adhesive, shrinkage of the adhesive is caused by hardening by ultraviolet irradiation. Therefore, there is a possibility that the IC connection portion of the transparent substrate 103 sandwiching the liquid crystal 106 is warped due to the shrinkage, and thus the surface uniformity of the gap between the transparent substrates 102 and 103 in the panel display portion 107 is lost, and The alignment of the liquid crystal is disordered, causing uneven display. Further, there is a problem in that the connection of the liquid crystal driving IC 115 is caused by the warpage of the IC connecting portion of the transparent substrate 103.

[專利文獻1]WO00/46315號公報 [Patent Document 1] WO00/46315

因此，本發明係解決上述課題者，其目的在於提供一種藉由使用紫外線硬化型接著劑而於低溫下進行電子零件之連接，並且抑制因接著劑之硬化收縮而產生之應變，改善電子零件之連接不良的連接體之製造方法、及電子零件之連接方法。 Therefore, the present invention has been made in view of the above problems, and an object of the invention is to provide an electronic component that can be connected at a low temperature by using an ultraviolet curable adhesive, and can suppress strain caused by hardening and shrinkage of an adhesive. A method of manufacturing a connector having poor connection and a method of connecting electronic components.

為了解決上述課題，本發明之連接體之製造方法具有經由光硬化型接著劑將電子零件配置於基板上之步驟、及對上述接著劑照射光而使其硬化之步驟，並且將上述基板與上述電子零件連接之區域分割為多個連接區域，對每個上述連接區域錯開上述光之照射開始時間點而進行硬化。 In order to solve the above problems, the method for producing a connector of the present invention includes a step of disposing an electronic component on a substrate via a photocurable adhesive, and a step of irradiating the adhesive with the light to be cured, and the substrate and the above The area where the electronic component is connected is divided into a plurality of connection regions, and each of the connection regions is hardened by shifting the light irradiation start time point.

又，本發明之電子零件之連接方法係如下者：其具有經由光 硬化型接著劑將電子零件配置於基板上之步驟、及對上述接著劑照射光而使其硬化之步驟，並且將上述基板與上述電子零件連接之區域分割為多個連接區域，對每個上述連接區域錯開上述光之照射開始時間點而進行硬化。 Moreover, the connection method of the electronic component of the present invention is as follows: it has a light passing through a step of disposing an electronic component on a substrate, and a step of irradiating the adhesive with the curing agent, and dividing the region where the substrate and the electronic component are connected into a plurality of connection regions, for each of the above The connection region is hardened by staggering the light irradiation start time point.

根據本發明，藉由錯開光照射時間點而使各連接區域硬化開始之時間點不同，可一面依序吸收各連接區域中之因硬化收縮而引起之應變，一面實現電子零件與基板之連接。 According to the present invention, the time at which the curing of the respective connection regions is started is different by shifting the light irradiation time point, and the connection between the electronic component and the substrate can be realized while sequentially absorbing the strain due to the hardening shrinkage in each of the connection regions.

1、114‧‧‧異向性導電膜 1, 114‧‧‧ anisotropic conductive film

2‧‧‧剝離膜 2‧‧‧Release film

3‧‧‧導電性粒子含有層 3‧‧‧ Conductive particle containing layer

4‧‧‧導電性粒子 4‧‧‧Electrical particles

10、104‧‧‧液晶顯示面板 10, 104‧‧‧ LCD panel

11、12、102、103‧‧‧透明基板 11, 12, 102, 103‧‧‧ transparent substrate

12a、103a‧‧‧緣部 12a, 103a‧‧‧ edge

13、105‧‧‧密封件 13, 105‧‧‧ Seals

14、106‧‧‧液晶 14, 106‧‧‧ LCD

15、107‧‧‧面板顯示部 15, 107‧‧‧ panel display

16、17、108、109‧‧‧透明電極 16, 17, 108, 109‧‧‧ transparent electrodes

17a、109a‧‧‧端子部 17a, 109a‧‧‧ Terminals

18‧‧‧電子零件 18‧‧‧Electronic parts

20‧‧‧COG構裝部 20‧‧‧COG Construction Department

21‧‧‧可撓性基板 21‧‧‧Flexible substrate

22‧‧‧FOG構裝部 22‧‧‧FOG Construction Department

24、111、112‧‧‧配向膜 24, 111, 112‧‧‧ alignment film

25、26、118、119‧‧‧偏光板 25, 26, 118, 119‧‧‧ polarizing plates

30‧‧‧加熱按壓頭 30‧‧‧heating press head

31‧‧‧紫外線照射器 31‧‧‧UV illuminator

31a、31b、31c、31d、31e、31f、31g、31h、31i‧‧‧紫外線照射部 31a, 31b, 31c, 31d, 31e, 31f, 31g, 31h, 31i‧‧‧ ultraviolet irradiation unit

40‧‧‧玻璃基板 40‧‧‧ glass substrate

41‧‧‧觸針 41‧‧‧ stylus

42‧‧‧凸塊 42‧‧‧Bumps

43‧‧‧金屬配線 43‧‧‧Metal wiring

100‧‧‧液晶顯示裝置 100‧‧‧Liquid crystal display device

115‧‧‧液晶驅動用IC 115‧‧‧LCD driver IC

120‧‧‧光源 120‧‧‧Light source

121‧‧‧熱壓接手段 121‧‧‧Hot crimping means

CH1、CH2、CH3、CH4、CH5、CH6、CH7、CH8、CH9‧‧‧連接區域 CH1, CH2, CH3, CH4, CH5, CH6, CH7, CH8, CH9‧‧‧ connection areas

圖1係表示應用有本發明之構裝步驟之剖面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing the steps of the application to which the present invention is applied.

圖2係表示異向性導電膜之剖面圖。 Fig. 2 is a cross-sectional view showing an anisotropic conductive film.

圖3係表示藉由將電子零件及玻璃基板連接而形成之連接區域之立體圖。 3 is a perspective view showing a connection region formed by connecting an electronic component and a glass substrate.

圖4A~D係表示應用有本發明之紫外線照射之開始時間點的俯視圖。 4A to 4D are plan views showing the starting point of time at which the ultraviolet irradiation of the present invention is applied.

圖5A及圖5B係表示本發明之其他實施形態之俯視圖。 5A and 5B are plan views showing other embodiments of the present invention.

圖6A~圖6E係表示本發明之其他實施形態之俯視圖。 6A to 6E are plan views showing other embodiments of the present invention.

圖7A~圖7C係表示本發明之其他實施形態之俯視圖。 7A to 7C are plan views showing other embodiments of the present invention.

圖8係表示本發明之其他實施形態之俯視圖。 Fig. 8 is a plan view showing another embodiment of the present invention.

圖9係用以說明實施例及比較例之玻璃基板之翹曲之測定方法的圖。 Fig. 9 is a view for explaining a method of measuring warpage of the glass substrate of the examples and the comparative examples.

圖10係用以說明實施例及比較例之導通電阻之測定方法的圖。 Fig. 10 is a view for explaining a method of measuring on-resistance of the examples and the comparative examples.

圖11係表示先前之液晶顯示面板之剖面圖。 Figure 11 is a cross-sectional view showing a prior liquid crystal display panel.

圖12係表示先前之液晶顯示面板之COG構裝步驟之剖面圖。 Figure 12 is a cross-sectional view showing the COG construction step of the prior liquid crystal display panel.

以下，一面參照圖式一面對應用有本發明之連接體之製造方法及連接方法詳細地進行說明。再者，當然，本發明並非僅限定於以下之實施形態，可在不脫離本發明之主旨之範圍內進行各種變更。又，圖式係 模式性者，各尺寸之比率等有時與現實不同。具體之尺寸等應參酌以下之說明進行判斷。又，當然，即便於圖式相互間亦包含相互之尺寸之關係或比率不同之部分。 Hereinafter, a manufacturing method and a connecting method to which the connecting body of the present invention is applied will be described in detail with reference to the drawings. It is a matter of course that the present invention is not limited to the embodiments described below, and various modifications can be made without departing from the spirit and scope of the invention. Again, the schema Patterns, ratios of dimensions, etc. are sometimes different from reality. The specific dimensions and the like should be judged by considering the following instructions. Further, of course, even if the drawings contain mutually different sizes or ratios.

以下，以將電子零件連接於基板而作為連接對象物及被連接對象物之情形為例進行說明，但本技術亦可應用於基板與電子零件之連接以外。例如，進行於液晶顯示面板之玻璃基板上構裝液晶驅動用之IC晶片之所謂之COG(chip on glass)構裝。該液晶顯示面板10如圖1所示，由玻璃基板等所構成之兩片透明基板11、12係對向配置，且該等透明基板11、12係藉由框狀之密封件13相互貼合。並且，液晶顯示面板10藉由於由透明基板11、12所圍繞之空間內封入液晶14而形成有面板顯示部15。 Hereinafter, a case where the electronic component is connected to the substrate as the connection target and the object to be connected will be described as an example. However, the present technology can also be applied to the connection between the substrate and the electronic component. For example, a so-called COG (chip on glass) package in which an IC chip for liquid crystal driving is mounted on a glass substrate of a liquid crystal display panel is used. As shown in FIG. 1, the liquid crystal display panel 10 has two transparent substrates 11 and 12 which are formed by a glass substrate or the like, and the transparent substrates 11 and 12 are bonded to each other by a frame-shaped sealing member 13. . Further, the liquid crystal display panel 10 is formed with the panel display portion 15 by enclosing the liquid crystal 14 in a space surrounded by the transparent substrates 11 and 12.

透明基板11、12於相互對向之兩內側表面以相互交叉之方式形成有由ITO(氧化銦錫)等所構成之條紋狀之一對透明電極16、17。並且，兩透明電極16、17藉由該等兩透明電極16、17之該交叉部位構成作為液晶顯示之最小單位之像素。 The transparent substrates 11 and 12 are formed with a pair of stripe-shaped transparent electrodes 16 and 17 made of ITO (indium tin oxide) or the like so as to intersect each other on the inner side surfaces facing each other. Further, the two transparent electrodes 16 and 17 constitute pixels which are the smallest unit of the liquid crystal display by the intersection of the two transparent electrodes 16 and 17.

兩透明基板11、12中，一個透明基板12形成為平面尺寸大於另一個透明基板11，於該較大地形成之透明基板12之緣部12a，設置有構裝有液晶驅動用IC等電子零件18之COG構裝部20，又，於COG構裝部20之外側附近，設置有構裝有形成有液晶驅動電路之可撓性基板21之FOG構裝部22。 Among the two transparent substrates 11 and 12, one transparent substrate 12 is formed to have a larger planar size than the other transparent substrate 11. The edge portion 12a of the largely formed transparent substrate 12 is provided with an electronic component 18 such as a liquid crystal driving IC. Further, in the COG mounting portion 20, a FOG mounting portion 22 in which a flexible substrate 21 on which a liquid crystal driving circuit is formed is disposed is provided in the vicinity of the outer side of the COG mounting portion 20.

再者，液晶驅動用IC或液晶驅動電路可藉由對像素選擇性地施加液晶驅動電壓而使液晶之配向部分地變化而進行特定之液晶顯示。 Further, the liquid crystal driving IC or the liquid crystal driving circuit can perform liquid crystal display by partially changing the alignment of the liquid crystal by selectively applying a liquid crystal driving voltage to the pixels.

於各構裝部20、22形成有透明電極17之端子部17a。於端子部17a上，使用異向性導電膜1作為導電性接著劑而連接有液晶驅動用IC等電子零件18或可撓性基板21。異向性導電膜1係如下者：其含有導電性粒子4，經由導電性粒子4而將電子零件18或可撓性基板21之電極與形成 於透明基板12之緣部12a之透明電極17之端子部17a電性連接。該異向性導電膜1係紫外線硬化型接著劑，藉由下述之利用加熱按壓頭30進行熱壓接而流動化，並於端子部17a與電子零件18或可撓性基板21之各電極之間壓碎導電性粒子4，藉由利用紫外線照射器31照射紫外線而使導電性粒子4以壓碎之狀態硬化。藉此，異向性導電膜1將透明基板12與電子零件18或可撓性基板21電性、機械性地連接。 The terminal portion 17a of the transparent electrode 17 is formed in each of the structures 20 and 22. An electronic component 18 such as a liquid crystal driving IC or a flexible substrate 21 is connected to the terminal portion 17a by using the anisotropic conductive film 1 as a conductive adhesive. The anisotropic conductive film 1 is one in which the conductive particles 4 are contained, and the electrodes of the electronic component 18 or the flexible substrate 21 are formed via the conductive particles 4 The terminal portion 17a of the transparent electrode 17 on the edge portion 12a of the transparent substrate 12 is electrically connected. The anisotropic conductive film 1 is an ultraviolet curable adhesive, and is fluidized by thermocompression bonding using a heating pressing head 30 as follows, and is applied to the electrodes of the terminal portion 17a and the electronic component 18 or the flexible substrate 21. The conductive particles 4 are crushed between each other, and the conductive particles 4 are hardened by being irradiated with ultraviolet rays by the ultraviolet ray irradiator 31. Thereby, the anisotropic conductive film 1 electrically and mechanically connects the transparent substrate 12 to the electronic component 18 or the flexible substrate 21.

又，於兩透明電極16、17上形成有經實施特定之摩擦處理之配向膜24，藉由該配向膜24限制液晶分子之初期配向。進而，於兩透明基板11、12之外側配設有一對偏光板25、26，藉由該等兩偏光板25、26限制自背光裝置等光源(未圖示)之透過光之振動方向。 Further, an alignment film 24 subjected to a specific rubbing treatment is formed on the two transparent electrodes 16 and 17, and the alignment film 24 restricts the initial alignment of the liquid crystal molecules. Further, a pair of polarizing plates 25 and 26 are disposed on the outer sides of the two transparent substrates 11 and 12, and the two polarizing plates 25 and 26 restrict the vibration direction of the transmitted light from a light source (not shown) such as a backlight device.

[異向性導電膜] [Anisotropic Conductive Film]

異向性導電膜(ACF，Anisotropic Conductive Film)1如圖2所示，通常係於成為基材之剝離膜2上形成有導電性粒子含有層3者。異向性導電膜1如圖1所示，係用於藉由於形成於液晶顯示面板10之透明基板12之透明電極17與電子零件18或可撓性基板21之間介隔導電性粒子含有層3而將液晶顯示面板10與電子零件18或可撓性基板21連接並導通。 As shown in FIG. 2, an anisotropic conductive film (ACF) 1 is usually formed by forming a conductive particle-containing layer 3 on a release film 2 which is a substrate. As shown in FIG. 1, the anisotropic conductive film 1 is used to form a conductive particle-containing layer between the transparent electrode 17 formed on the transparent substrate 12 of the liquid crystal display panel 10 and the electronic component 18 or the flexible substrate 21. 3. The liquid crystal display panel 10 is connected to the electronic component 18 or the flexible substrate 21 and is electrically connected.

作為剝離膜2，可使用異向性導電膜中通常所使用之例如聚對苯二甲酸乙二酯膜等基材。 As the release film 2, a substrate such as a polyethylene terephthalate film which is generally used in an anisotropic conductive film can be used.

導電性粒子含有層3係將導電性粒子4分散於黏合劑中而成者。黏合劑係含有膜形成樹脂、硬化性樹脂、硬化劑、矽烷偶合劑等者，與通常之異向性導電膜中所使用之黏合劑相同。 The conductive particle-containing layer 3 is obtained by dispersing the conductive particles 4 in a binder. The binder contains a film-forming resin, a curable resin, a curing agent, a decane coupling agent, and the like, and is the same as the binder used in a general anisotropic conductive film.

作為膜形成樹脂，較佳為平均分子量為10000~80000左右之樹脂。作為膜形成樹脂，可列舉苯氧基樹脂、環氧樹脂、變形環氧樹脂、胺酯樹脂(urethane resin)等各種樹脂。其中，就膜形成狀態、連接可靠性等觀點而言，尤佳為苯氧基樹脂。 The film-forming resin is preferably a resin having an average molecular weight of about 10,000 to 80,000. Examples of the film-forming resin include various resins such as a phenoxy resin, an epoxy resin, a deformed epoxy resin, and an urethane resin. Among them, a phenoxy resin is particularly preferable from the viewpoints of film formation state, connection reliability, and the like.

作為硬化性樹脂，並無特別限定，可列舉環氧樹脂、丙烯酸樹脂等。 The curable resin is not particularly limited, and examples thereof include an epoxy resin and an acrylic resin.

作為環氧樹脂，並無特別限制，可根據目的適當選擇。作為具體例，例如可列舉萘型環氧樹脂、聯苯型環氧樹脂、酚系酚醛清漆型環氧樹脂、雙酚型環氧樹脂、茋型環氧樹脂、三苯酚甲烷型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚型環氧樹脂、二環戊二烯型環氧樹脂、三苯基甲烷型環氧樹脂等。該等可為單獨，亦可為2種以上之組合。 The epoxy resin is not particularly limited and may be appropriately selected depending on the purpose. Specific examples thereof include a naphthalene type epoxy resin, a biphenyl type epoxy resin, a phenol novolak type epoxy resin, a bisphenol type epoxy resin, a fluorene type epoxy resin, and a trisphenol methane type epoxy resin. A phenol aralkyl type epoxy resin, a naphthol type epoxy resin, a dicyclopentadiene type epoxy resin, a triphenylmethane type epoxy resin, or the like. These may be used alone or in combination of two or more.

作為丙烯酸樹脂，並無特別限制，可根據目的適當選擇，作為具體例，例如可列舉丙烯酸甲酯、丙烯酸乙酯、丙烯酸異丙酯、丙烯酸異丁酯、環氧丙烯酸酯、乙二醇二丙烯酸酯、二乙二醇二丙烯酸酯，三羥甲基丙烷三丙烯酸酯、二羥甲基三環癸烷二丙烯酸酯、1,4-丁二醇四丙烯酸酯、2-羥基-1,3-二丙烯醯氧基丙烷、2,2-雙[4-(丙烯醯氧基甲氧基)苯基]丙烷、2,2-雙[4-(丙烯醯氧基乙氧基)苯基]丙烷、丙烯酸二環戊烯酯、丙烯酸三環癸酯、異氰尿酸三(丙烯醯氧基乙基)酯、丙烯酸胺酯、環氧丙烯酸酯等。該等可為單獨，亦可為2種以上之組合。 The acrylic resin is not particularly limited and may be appropriately selected according to the purpose. Specific examples thereof include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, and ethylene glycol diacrylate. Ester, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, 1,4-butanediol tetraacrylate, 2-hydroxy-1,3- Dipropylene methoxypropane, 2,2-bis[4-(acryloxymethoxy)phenyl]propane, 2,2-bis[4-(acryloxyethoxy)phenyl]propane And dicyclopentenyl acrylate, tricyclodecyl acrylate, tris(propylene methoxyethyl) isocyanurate, urethane acrylate, epoxy acrylate, and the like. These may be used alone or in combination of two or more.

作為硬化劑，只要為光硬化型則並無特別限制，可根據目的適當選擇，於硬化性樹脂為環氧樹脂之情形時較佳為陽離子系硬化劑，於硬化性樹脂為丙烯酸樹脂之情形時較佳為自由基系硬化劑。 The curing agent is not particularly limited as long as it is a photocuring type, and may be appropriately selected according to the purpose. When the curable resin is an epoxy resin, it is preferably a cationic curing agent, and when the curable resin is an acrylic resin. A radical-based hardener is preferred.

作為陽離子系硬化劑，並無特別限制，可根據目的適當選擇，例如可列舉鋶鹽、鎓鹽等，該等之中較佳為芳香族鋶鹽。作為自由基系硬化劑，並無特別限制，可根據目的適當選擇，例如可列舉有機過氧化物。 The cationic curing agent is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include an onium salt and a phosphonium salt, and among these, an aromatic onium salt is preferred. The radical curing agent is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include an organic peroxide.

作為矽烷偶合劑，可列舉環氧系、胺基系、巰基-硫系、脲系等。藉由添加矽烷偶合劑，可提高有機材料與無機材料之界面上之接著性。 Examples of the decane coupling agent include epoxy-based, amine-based, thiol-sulfur-based, and urea-based. By adding a decane coupling agent, the adhesion at the interface between the organic material and the inorganic material can be improved.

作為導電性粒子4，可列舉於異向性導電膜中所使用之公知之任何導電性粒子。作為導電性粒子4，例如可列舉鎳、鐵、銅、鋁、錫、鉛、鉻、鈷、銀、金等各種金屬或金屬合金之粒子、於金屬氧化物、碳、石墨、玻璃、陶瓷、塑膠等之粒子之表面塗覆有金屬者，或於該等粒子之表面進而塗覆有絕緣薄膜者等。於為在樹脂粒子之表面塗覆有金屬者之情形時，作為樹脂粒子，例如可列舉環氧樹脂、酚系樹脂、丙烯酸系樹脂、丙烯腈-苯乙烯(AS)樹脂、苯并胍胺樹脂、二乙烯基苯系樹脂、苯乙烯系樹脂等之粒子。 The conductive particles 4 include any of the known conductive particles used in the anisotropic conductive film. Examples of the conductive particles 4 include particles of various metals such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, and metal alloys, and metal oxides, carbon, graphite, glass, ceramics, and the like. The surface of the particles such as plastic is coated with a metal, or the surface of the particles is coated with an insulating film or the like. When the surface of the resin particle is coated with a metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile-styrene (AS) resin, and a benzoguanamine resin. A particle such as a divinylbenzene resin or a styrene resin.

[製造方法] [Production method]

繼而，對經由異向性導電膜1而將電子零件18或可撓性基板21連接於透明基板12之透明電極17上之連接體之製造步驟進行說明。首先，將異向性導電膜1暫時壓接於透明電極17上。暫時壓接異向性導電膜1之方法係以導電性粒子含有層3成為透明電極17側之方式將異向性導電膜1配置於液晶顯示面板10之透明基板12之透明電極17上。 Next, a manufacturing procedure of the connecting body in which the electronic component 18 or the flexible substrate 21 is connected to the transparent electrode 17 of the transparent substrate 12 via the anisotropic conductive film 1 will be described. First, the anisotropic conductive film 1 is temporarily pressure-bonded to the transparent electrode 17. In the method of temporarily pressing the anisotropic conductive film 1 , the anisotropic conductive film 1 is placed on the transparent electrode 17 of the transparent substrate 12 of the liquid crystal display panel 10 such that the conductive particle-containing layer 3 is on the side of the transparent electrode 17 .

繼而，將導電性粒子含有層3配置於透明電極17上之後，例如藉由加熱按壓頭30自剝離膜2側對導電性粒子含有層3進行加熱及加壓，使加熱按壓頭30離開剝離膜2，並將剝離膜2自透明電極17上之導電性粒子含有層3剝離，藉此，僅將導電性粒子含有層3暫時壓接於透明電極17上。藉由加熱按壓頭30之暫時壓接係一面以微弱之壓力(例如0.1MPa~2MPa左右)將剝離膜2之上表面按壓至透明電極17側一面進行加熱。其中，加熱溫度係設為異向性導電膜1中之環氧樹脂或丙烯酸樹脂等熱硬化性樹脂未硬化之程度之溫度(例如70~100℃左右)。 Then, after the conductive particle-containing layer 3 is placed on the transparent electrode 17, the conductive particle-containing layer 3 is heated and pressurized from the side of the release film 2 by heating the pressing head 30, and the heated pressing head 30 is separated from the release film. 2, the release film 2 is peeled off from the conductive particle-containing layer 3 on the transparent electrode 17, whereby only the conductive particle-containing layer 3 is temporarily pressure-bonded to the transparent electrode 17. The upper surface of the release film 2 is pressed against the side of the transparent electrode 17 by a slight pressure (for example, about 0.1 MPa to 2 MPa) by heating the temporary pressure bonding system of the pressing head 30, and heating is performed. In addition, the heating temperature is a temperature (for example, about 70 to 100 ° C) in which the thermosetting resin such as an epoxy resin or an acrylic resin in the anisotropic conductive film 1 is not cured.

繼而，以透明基板12之透明電極17與電子零件18之電極端子經由導電性粒子含有層3而相對向之方式配置電子零件18。 Then, the electronic component 18 is disposed such that the transparent electrode 17 of the transparent substrate 12 and the electrode terminal of the electronic component 18 pass through the conductive particle-containing layer 3 to face each other.

繼而，藉由配置於透明基板12之下部之紫外線照射器31而 照射紫外線，使導電性粒子含有層3硬化，將電子零件18連接於透明基板12。此時，本連接步驟中，透明電極17之端子部17a與電子零件18連接之區域係如圖3所示般分割為多個連接區域，對各連接區域錯開紫外線之照射開始時間點而進行硬化。 Then, by the ultraviolet illuminator 31 disposed at the lower portion of the transparent substrate 12 When the ultraviolet ray is irradiated, the conductive particle-containing layer 3 is cured, and the electronic component 18 is connected to the transparent substrate 12. At this time, in the connection step, the region where the terminal portion 17a of the transparent electrode 17 is connected to the electronic component 18 is divided into a plurality of connection regions as shown in FIG. 3, and the connection region is hardened by shifting the ultraviolet irradiation start time point. .

電子零件18之電極端子與透明電極17之端子部17a連接之區域被適當分割為多個連接區域，例如於藉由使電子零件18之電極端子與透明電極17連接而形成多通道之情形時係分割為各通道。或，電子零件18之電極端子與透明電極17之端子部17a連接之區域亦可以均等之面積將整個區域分割為多個區域。圖3中，作為一例，顯示如下情形：於電子零件18及透明電極17之端子部17a設置有藉由連接而構成通道之第1~第5之5個連接區域CH1~CH5。第1~第5連接區域CH1~CH5係大致均等地配置於經由異向性導電膜1而連接電子零件18之端子部與透明電極17之端子部17a的整個區域。 A region where the electrode terminal of the electronic component 18 is connected to the terminal portion 17a of the transparent electrode 17 is appropriately divided into a plurality of connection regions, for example, when the electrode terminal of the electronic component 18 is connected to the transparent electrode 17 to form a plurality of channels. Split into channels. Alternatively, the region where the electrode terminal of the electronic component 18 is connected to the terminal portion 17a of the transparent electrode 17 may divide the entire region into a plurality of regions. In the example shown in FIG. 3, the terminal portions 17a of the electronic component 18 and the transparent electrode 17 are provided with the first to fifth connection regions CH1 to CH5 that constitute the channel by connection. The first to fifth connection regions CH1 to CH5 are substantially uniformly disposed in the entire region where the terminal portion of the electronic component 18 and the terminal portion 17a of the transparent electrode 17 are connected via the anisotropic conductive film 1.

又，紫外線照射器31例如對應於第1~第5連接區域CH1~CH5而設置有第1~第5紫外線照射部31a~31e。紫外線照射器31可對紫外線照射部31a~31e分別進行照射控制，藉此，本連接步驟中，可對每個連接區域錯開紫外線照射時間點而進行硬化。再者，使各紫外線照射部31a~31e與鄰接之紫外線照射部之照射範圍一部分重複，不存在紫外線照射不到之部分。 Moreover, the ultraviolet ray irradiator 31 is provided with the first to fifth ultraviolet ray irradiation portions 31a to 31e, for example, corresponding to the first to fifth connection regions CH1 to CH5. The ultraviolet ray irradiator 31 can perform irradiation control on the ultraviolet ray irradiation portions 31a to 31e, respectively, whereby in the connection step, each of the connection regions can be hardened by shifting the ultraviolet ray irradiation time point. Further, the ultraviolet irradiation portions 31a to 31e are partially overlapped with the irradiation range of the adjacent ultraviolet irradiation portions, and there is no portion where the ultraviolet rays are not irradiated.

如此，藉由錯開紫外線照射之時間點，各連接區域之硬化開始之時間點不同，可一面依序吸收各連接區域中之因硬化收縮而產生之應變，一面實現電子零件18與透明基板12之連接。認為其原因在於：藉由使各連接區域之硬化開始之時間點不同，於最先照射到紫外線之連接區域開始硬化而產生黏合劑之硬化收縮時，鄰接於該連接區域之未照射紫外線之連接區域中黏合劑未硬化而具有流動性，因此流動至照射到紫外線之連接 區域側，藉此，可吸收紫外線照射之連接區域中之因硬化收縮而產生之應變。 In this way, by staggering the time point of ultraviolet irradiation, the time at which the curing of each connection region starts is different, and the strain generated by the hardening shrinkage in each of the connection regions can be sequentially absorbed while the electronic component 18 and the transparent substrate 12 are realized. connection. The reason is considered to be that, when the bonding time of each connection region is different, when the bonding region where the ultraviolet ray is first irradiated starts to harden and the curing shrinkage of the adhesive occurs, the connection of the ultraviolet ray adjacent to the connection region is not irradiated. The adhesive in the area is not hardened and has fluidity, so it flows to the connection that is exposed to ultraviolet rays. On the side of the region, the strain due to hardening shrinkage in the connection region irradiated with ultraviolet rays can be absorbed.

具體而言，圖3所示之第1~第5連接區域CH1~CH5中，如圖4A所示，自第3紫外線照射部31c開始紫外線之照射，自位於中央部之第3連接區域CH3進行硬化。繼而，開始自第3紫外線照射部31c之照射後，經過特定時間後，例如1秒後，如圖4B所示，開始自鄰接之第2、第4紫外線照射部31b、31d之紫外線照射，使第2、第4連接區域CH2、CH4硬化。最後，開始自第2、第4紫外線照射部31b、31d之照射後，經過特定時間後，例如1秒後，如圖4C所示，開始自兩端之第1、第5紫外線照射部31a、31e之紫外線照射，使第1、第5連接區域CH1、CH5硬化。 Specifically, as shown in FIG. 4A, the first to fifth connection regions CH1 to CH5 shown in FIG. 3 are irradiated with ultraviolet rays from the third ultraviolet ray irradiation portion 31c, and are carried out from the third connection region CH3 located at the center portion. hardening. Then, after the irradiation of the third ultraviolet ray irradiation unit 31c, after a predetermined period of time, for example, as shown in FIG. 4B, the ultraviolet ray irradiation from the adjacent second and fourth ultraviolet ray irradiation units 31b and 31d is started. The second and fourth connection regions CH2 and CH4 are hardened. Finally, after the irradiation of the second and fourth ultraviolet irradiation units 31b and 31d, after a predetermined period of time, for example, as shown in FIG. 4C, the first and fifth ultraviolet irradiation units 31a from both ends are started. The ultraviolet irradiation of 31e hardens the first and fifth connection regions CH1 and CH5.

如此，根據本連接步驟，藉由使對第1~第5連接區域CH1~CH5之紫外線照射時間點不同而利用鄰接之第2、第4連接區域CH2、CH4之未硬化之黏合劑吸收位於中央部之第3連接區域CH3之硬化時之應變，並利用鄰接之第1、第5連接區域CH1、CH5之未硬化之黏合劑吸收第2、第4連接區域CH2、CH4之硬化時之應變。 As described above, according to the present connection step, the uncured adhesive of the second and fourth connection regions CH2 and CH4 adjacent to each other is absorbed in the center by making the ultraviolet irradiation time points of the first to fifth connection regions CH1 to CH5 different. The strain at the time of curing of the third connection region CH3 of the portion absorbs the strain at the time of curing of the second and fourth connection regions CH2 and CH4 by the uncured adhesive of the adjacent first and fifth connection regions CH1 and CH5.

與此相對，於對第1~第5連接區域CH1~CH5同時照射紫外線之情形時，由於各連接區域CH1~CH5同時開始硬化，因此無法吸收鄰接之連接區域之應變。因此，根據本連接步驟，可抑制透明基板12之應變，並且可防止電子零件18之連接不良。 On the other hand, when the first to fifth connection regions CH1 to CH5 are simultaneously irradiated with ultraviolet rays, since the connection regions CH1 to CH5 are simultaneously hardened, the strain of the adjacent connection region cannot be absorbed. Therefore, according to this connection step, the strain of the transparent substrate 12 can be suppressed, and the connection failure of the electronic component 18 can be prevented.

又，於對未與未紫外線照射之連接區域鄰接之連接區域照射紫外線之情形時，藉由照射紫外線硬化所需之最低限度之照射量，可將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。 Further, when ultraviolet rays are applied to the connection region which is not adjacent to the connection region where the ultraviolet ray is not irradiated, the strain caused by the hardening and contraction of the adhesive can be suppressed to the minimum irradiation amount required for the ultraviolet ray curing. at the lowest limit.

具體而言，本連接步驟中，可於對最後照射到紫外線之第1、第5連接區域CH1、CH5照射紫外線硬化所需之最低限度之照射量之後，停止對整個連接區域CH1~CH5之紫外線照射。例如，紫外線照射器31於 開始自第1、第5紫外線照射部31a、31e之照射後經過特定時間後，例如2秒後，如圖4D所示，停止自全部紫外線照射部31a~31e之照射。 Specifically, in the connection step, the ultraviolet rays to the entire connection region CH1 to CH5 can be stopped after the first and fifth connection regions CH1 and CH5 which are finally irradiated with ultraviolet rays are irradiated with the minimum amount of irradiation required for ultraviolet curing. Irradiation. For example, the ultraviolet illuminator 31 is After a predetermined period of time has elapsed since the irradiation of the first and fifth ultraviolet irradiation units 31a and 31e, for example, two seconds later, as shown in FIG. 4D, the irradiation from all the ultraviolet irradiation units 31a to 31e is stopped.

如此，由於最後照射到紫外線之第1、第5連接區域CH1、CH5不存在具備吸收硬化收縮之未硬化之黏合劑之鄰接區域，因此藉由停止於照射紫外線硬化所需之最低限度之照射量，可將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。 In this manner, since the first and fifth connection regions CH1 and CH5 which are finally irradiated with ultraviolet rays do not have an adjacent region of the uncured adhesive having absorption hardening shrinkage, the minimum amount of irradiation required for stopping the ultraviolet curing is stopped. The strain caused by the hardening shrinkage of the adhesive can be suppressed to a minimum.

再者，本連接步驟中，只要錯開開始紫外線照射時間點而進行硬化即可，未必需要使紫外線照射之結束時期於各連接區域CH1~CH5中一致。 In the connection step, it is only necessary to perform the curing by shifting the ultraviolet irradiation time point, and it is not necessary to make the end period of the ultraviolet irradiation uniform in the respective connection regions CH1 to CH5.

將電子零件18連接於透明基板12之透明電極17上之後，以相同之方式進行將可撓性基板21構裝於透明基板12之透明電極17上之所謂之FOG(film on glass)構裝。藉此，可製造經由異向性導電膜1將透明基板12與電子零件18或可撓性基板21連接之連接體。再者，該等COG構裝與FOG構裝亦可同時進行。 After the electronic component 18 is connected to the transparent electrode 17 of the transparent substrate 12, a so-called FOG (film on glass) structure in which the flexible substrate 21 is mounted on the transparent electrode 17 of the transparent substrate 12 is performed in the same manner. Thereby, a connector in which the transparent substrate 12 is connected to the electronic component 18 or the flexible substrate 21 via the anisotropic conductive film 1 can be manufactured. Furthermore, the COG construction and the FOG construction can also be performed simultaneously.

以上，以將液晶驅動用IC直接構裝於液晶顯示面板之玻璃基板上之COG構裝、及將可撓性基板直接構裝於液晶顯示面板之基板上之FOG構裝為例進行了說明，但本技術可用於COG構裝、FOG構裝以外之其他各種連接。 The COG package in which the liquid crystal driving IC is directly mounted on the glass substrate of the liquid crystal display panel and the FOG structure in which the flexible substrate is directly mounted on the substrate of the liquid crystal display panel have been described as an example. However, the technology can be used for various connections other than COG construction and FOG construction.

[其他時間點1] [Other time points 1]

又，最先開始紫外線照射之區域亦可不為一處，可於不相互鄰接之複數處同時開始紫外線照射。例如，亦可如圖5A所示，自第2及第4連接區域CH2、CH4開始紫外線照射。 Further, the area where the ultraviolet ray is first irradiated may not be one place, and the ultraviolet ray irradiation may be simultaneously started at a plurality of places which are not adjacent to each other. For example, as shown in FIG. 5A, ultraviolet irradiation may be started from the second and fourth connection regions CH2 and CH4.

此情形時亦可藉由鄰接於照射到紫外線之連接區域之連接區域、例如第1、第3、第5連接區域CH1、CH3、CH5中之未硬化之黏合劑向第2及第4連接區域CH2、CH4流動而吸收照射到紫外線之第2及第4 連接區域CH2、CH4中之應變。又，此情形時亦如圖5B所示，於對第1、第3、第5連接區域CH1、CH3、CH5等未與未紫外線照射之連接區域鄰接之連接區域照射紫外線之情形時，可藉由照射紫外線硬化所需之最低限度之照射量而將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。 In this case, the second and fourth connection regions may also be bonded to the second and fourth connection regions by an unhardened adhesive adjacent to the connection region of the connection region where the ultraviolet rays are irradiated, for example, the first, third, and fifth connection regions CH1, CH3, and CH5. CH2, CH4 flow and absorb the second and fourth rays of ultraviolet light The strain in the connection areas CH2, CH4. Further, in this case, as shown in FIG. 5B, when ultraviolet rays are irradiated to the connection regions which are not adjacent to the connection region where the ultraviolet rays are not irradiated, such as the first, third, and fifth connection regions CH1, CH3, and CH5, The strain caused by the hardening shrinkage of the adhesive is suppressed to a minimum by the minimum amount of irradiation required for the ultraviolet curing.

[其他時間點2] [Other time points 2]

又，本連接步驟中，亦可自分割為多個之連接區域之一個端部照射紫外線。例如，如圖6A所示，紫外線照射器31開始自第1紫外線照射部31a向第1連接區域CH1之紫外線照射，經過特定時間後，例如1秒後，開始自第2紫外線照射部31b向第2連接區域CH2之紫外線照射(圖6B)，依序每經過1秒開始向鄰接之連接區域之紫外線照射(圖6C~圖6E)直到達第5連接區域CH5。 Further, in the connection step, ultraviolet rays may be irradiated from one end portion of the plurality of connection regions divided. For example, as shown in FIG. 6A, the ultraviolet ray irradiator 31 starts to irradiate the ultraviolet rays from the first ultraviolet ray irradiation unit 31a to the first connection region CH1, and after a predetermined period of time, for example, one second, the second ultraviolet ray irradiation unit 31b is started. 2 Ultraviolet irradiation of the connection region CH2 (Fig. 6B), ultraviolet irradiation (Fig. 6C to Fig. 6E) to the adjacent connection region is started every one second in sequence until reaching the fifth connection region CH5.

此情形時亦可藉由鄰接於照射到紫外線之連接區域之連接區域、例如鄰接於第1連接區域CH1之第2連接區域CH2中之未硬化之黏合劑向第1連接區域CH1流動而吸收照射到紫外線之第1連接區域CH1中之應變。又，此情形時亦於對未與未照射紫外線之連接區域鄰接之連接區域例如連接區域CH5照射紫外線之情形時，可藉由照射紫外線硬化所需之最低限度之照射量而將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。 In this case, the irradiation may be absorbed by flowing into the first connection region CH1 by a bonding region adjacent to the connection region where the ultraviolet rays are irradiated, for example, an unhardened adhesive adjacent to the second connection region CH2 of the first connection region CH1. The strain in the first connection region CH1 of the ultraviolet rays. Further, in this case as well, when the ultraviolet ray is applied to the connection region which is not adjacent to the connection region where the ultraviolet ray is not irradiated, for example, the connection region CH5 can be irradiated with the minimum amount of irradiation required for the ultraviolet ray hardening. The strain suppression caused by hardening shrinkage is minimal.

[其他時間點3] [Other time points 3]

又，本連接步驟中，亦可自分割為多個之連接區域之多個端部照射紫外線。例如，如圖7A所示，紫外線照射器31開始自第1紫外線照射部31a向第1連接區域CH1之紫外線照射，同時開始自第5紫外線照射部31e向第5連接區域CH5之紫外線照射。經過特定時間後，例如1秒後，如圖7B所示，開始自第2紫外線照射部31b向第2連接區域CH2之紫外線照射，同時開始自第4紫外線照射部31d向第4連接區域CH4之紫外線照射。進 而，經過特定時間後，例如1秒後，如圖7C所示，開始自第3紫外線照射部31c向第3連接區域CH3之紫外線照射。 Further, in the connection step, the plurality of end portions divided into the plurality of connection regions may be irradiated with ultraviolet rays. For example, as shown in FIG. 7A, the ultraviolet ray irradiator 31 starts the ultraviolet ray irradiation from the first ultraviolet ray irradiation unit 31a to the first connection region CH1, and starts the ultraviolet ray irradiation from the fifth ultraviolet ray irradiation unit 31e to the fifth connection region CH5. After a predetermined period of time, for example, as shown in FIG. 7B, ultraviolet light irradiation from the second ultraviolet ray irradiation unit 31b to the second connection region CH2 is started, and the fourth ultraviolet ray irradiation unit 31d is started to the fourth connection region CH4. UV irradiation. Enter On the other hand, for example, after a certain period of time, for example, as shown in FIG. 7C, ultraviolet irradiation from the third ultraviolet ray irradiation unit 31c to the third connection region CH3 is started.

此情形時亦可藉由鄰接於照射到紫外線之連接區域之連接區域、例如鄰接於第1、第5連接區域CH1、CH5之第1、第4連接區域CH2、CH4中之未硬化黏合劑向第1、第5連接區域CH1、CH5流動而吸收照射到紫外線之第1、第5連接區域CH1、CH5中之應變。又，此情形時亦於對未與未照射紫外線之連接區域鄰接之第3連接區域CH3照射紫外線之情形時，可藉由照射紫外線硬化所需之最低限度之照射量而將伴隨黏合劑之硬化收縮而產生之應變抑制為最低限度。 In this case, the uncured adhesive may be adjacent to the connection region of the connection region irradiated with ultraviolet rays, for example, the first and fourth connection regions CH2 and CH4 adjacent to the first and fifth connection regions CH1 and CH5. The first and fifth connection regions CH1 and CH5 flow to absorb the strain applied to the first and fifth connection regions CH1 and CH5 of the ultraviolet rays. Further, in this case, when the third connection region CH3 which is not adjacent to the connection region where the ultraviolet ray is not irradiated is irradiated with ultraviolet rays, the adhesion with the adhesive can be hardened by the minimum amount of irradiation required for the ultraviolet ray curing. Strain suppression due to shrinkage is minimal.

[其他時間點4] [Other time points 4]

上述中，將透明電極17之端子部17a與電子零件18連接之區域分割為排列成一行之連接區域，但亦可如圖8所示，分割為於平面上在XY方向上劃分之連接區域。此情形時亦可藉由以自中央向端部、自端部向端部、或自多個端部向中央等之方式錯開各連接區域之紫外線照射開始之時間點進行硬化而吸收伴隨黏合劑之硬化收縮而產生之應變。 In the above description, the region where the terminal portion 17a of the transparent electrode 17 and the electronic component 18 are connected is divided into a connection region arranged in a line, but as shown in Fig. 8, the connection region may be divided into a connection region which is divided in the XY direction on the plane. In this case, it is also possible to harden and absorb the accompanying adhesive by shifting the ultraviolet irradiation from the center to the end, from the end to the end, or from the end to the center. The strain caused by the hardening shrinkage.

又，上述中，使用紫外線硬化型黏合劑，但本發明只要可藉由照射而使黏合劑硬化，則亦可使用紫外線以外之光。又，上述中，作為導電性接著劑，對具有膜形狀之異向性導電膜1進行了說明，但即便為膏狀亦無問題。本申請案中，將含有導電性粒子4之異向性導電膜1等膜狀之導電性接著膜或膏狀之導電性接著膏定義為「接著劑」。 Further, in the above, an ultraviolet curable adhesive is used. However, in the present invention, light other than ultraviolet rays can be used as long as the adhesive can be cured by irradiation. Moreover, in the above description, the anisotropic conductive film 1 having a film shape has been described as a conductive adhesive, but there is no problem even in the form of a paste. In the present application, a film-shaped conductive adhesive film such as an anisotropic conductive film 1 containing conductive particles 4 or a paste-like conductive paste is defined as an "adhesive".

[實施例] [Examples]

繼而，對本發明之實施例進行說明。本實施例中，形成設置有藉由將設置於玻璃基板上之透明電極與設置於IC晶片上之電極端子連接而構成5個通道之第1~第5連接區域CH1~CH5的連接體樣品(參照圖3)，對各連接體樣品根據導通電阻值(Ω)評價IC晶片與基板之連接狀態， 對顯示不均藉由測定基板之翹曲量(μm)而進行代替評價。 Next, an embodiment of the present invention will be described. In the present embodiment, a connection sample in which the first to fifth connection regions CH1 to CH5 of the five channels are formed by connecting the transparent electrode provided on the glass substrate to the electrode terminal provided on the IC wafer is formed ( Referring to FIG. 3), the connection state of the IC wafer and the substrate is evaluated based on the on-resistance value (Ω) for each of the connector samples. The display unevenness was measured by measuring the amount of warpage (μm) of the substrate.

用於連接之異向性導電膜係由接著劑層所構成，該接著劑層係由厚度18μm之導電性粒子含有層(ACF層)所構成。ACF層係使如下成分於溶劑中熔融而製作混合溶液，並將該混合溶液塗佈於PET膜上，利用烘箱進行乾燥，成形為膜狀：苯氧基樹脂(YP-70：新日鐵化學股份有限公司製造)：20質量份 The anisotropic conductive film for connection is composed of an adhesive layer composed of a conductive particle-containing layer (ACF layer) having a thickness of 18 μm. The ACF layer is obtained by melting a solvent in a solvent to prepare a mixed solution, and applying the mixed solution to a PET film, and drying it in an oven to form a film: phenoxy resin (YP-70: Nippon Steel Chemical Co., Ltd.) Co., Ltd.): 20 parts by mass

液狀環氧樹脂(EP-828：三菱化學股份有限公司製造)：30質量份 Liquid epoxy resin (EP-828: manufactured by Mitsubishi Chemical Corporation): 30 parts by mass

固形環氧樹脂(YD014：新日鐵化學股份有限公司製造)：20質量份 Solid epoxy resin (YD014: manufactured by Nippon Steel Chemical Co., Ltd.): 20 parts by mass

導電性粒子(AUL704：積水化學工業股份有限公司製造)：30質量份 Conductive particles (AUL704: manufactured by Sekisui Chemical Co., Ltd.): 30 parts by mass

陽離子系硬化劑(LW-S1：San-Apro股份有限公司製造)：5質量份。 Cationic hardener (LW-S1: manufactured by San-Apro Co., Ltd.): 5 parts by mass.

以厚度成為18μm之方式調整該ACF而進行積層層壓，藉此獲得異向性導電膜。實施例及比較例中所使用之異向性導電膜係寬4.0mm×長40.0mm。 The ACF was adjusted so as to have a thickness of 18 μm to carry out lamination lamination, whereby an anisotropic conductive film was obtained. The anisotropic conductive film used in the examples and the comparative examples was 4.0 mm wide by 40.0 mm long.

作為評價元件，使用外形：1.8mm×34.0mm As an evaluation component, the shape is used: 1.8 mm × 34.0 mm

厚度：0.5mm Thickness: 0.5mm

且形成有導通測定用配線之評價用IC。 Further, an evaluation IC for conducting the measurement wiring is formed.

作為評價用IC所連接之評價基材，使用玻璃厚度0.5mm且形成有導通測定用配線之玻璃基板。 As the evaluation substrate to which the evaluation IC was connected, a glass substrate having a glass thickness of 0.5 mm and having a conduction measurement wiring was used.

於該玻璃基板上經由上述異向性導電膜配置評價用IC，藉由利用加熱按壓頭之熱加壓及紫外線照射進行連接，藉此形成連接體樣品。加熱按壓頭之熱加壓面為10.0mm×40.0mm，於加熱按壓頭之熱加壓面實施厚度0.05mm之氟樹脂加工作為緩衝材料。加熱按壓頭之溫度條件均為110℃，按壓條件均為70MPa、5秒。 The evaluation IC was placed on the glass substrate via the anisotropic conductive film, and the connection sample was formed by thermal compression and ultraviolet irradiation using a heated pressing head. The hot pressing surface of the heating pressing head was 10.0 mm × 40.0 mm, and a fluororesin having a thickness of 0.05 mm was processed as a cushioning material on the hot pressing surface of the heating pressing head. The temperature conditions for heating the pressing head were both 110 ° C, and the pressing conditions were both 70 MPa and 5 seconds.

紫外線照射係於利用設定為特定溫度之加熱按壓頭之 評價用IC之熱加壓開始後5秒之間進行，對各連接區域自熱加壓開始後經過特定時間後開始照射，自利用加熱按壓頭之熱加壓開始5秒後一律停止照射。自利用加熱按壓頭之評價用IC之熱加壓開始起至對實施例及比較例之各連接區域CH1~CH5之紫外線照射之經過時間係如表1所示。 Ultraviolet irradiation is performed by using a heated pressing head set to a specific temperature The evaluation was performed 5 seconds after the start of the thermal pressurization of the IC, and the irradiation was started after a certain period of time after the start of the auto-pressurization of each of the connection regions, and the irradiation was stopped after 5 seconds from the start of the hot press using the heated press head. The elapsed time from the start of the thermal pressurization of the evaluation IC using the heating press head to the ultraviolet irradiation of each of the connection regions CH1 to CH5 of the examples and the comparative examples is shown in Table 1.

實施例1中，將至對第3連接區域CH3之紫外線照射前之經過時間設為0秒，將至對第1、第2、第4、第5連接區域CH1、CH2、CH4、CH5之紫外線照射前之經過時間均設為1秒。即，實施例1中，第3連接區域CH3之紫外線照射時間為5秒，第1、第2、第4、第5連接區域CH1、CH2、CH4、CH5之紫外線照射時間為4秒。 In the first embodiment, the elapsed time until the ultraviolet irradiation of the third connection region CH3 is set to 0 seconds, and the ultraviolet rays are applied to the first, second, fourth, and fifth connection regions CH1, CH2, CH4, and CH5. The elapsed time before irradiation was set to 1 second. That is, in Example 1, the ultraviolet irradiation time of the third connection region CH3 was 5 seconds, and the ultraviolet irradiation time of the first, second, fourth, and fifth connection regions CH1, CH2, CH4, and CH5 was 4 seconds.

實施例2中，將至對第3~第5連接區域CH3~CH5之紫外線照射前之經過時間設為1秒，將至對第2連接區域CH2之紫外線照射前之經過時間設為2秒，將至對第1連接區域CH1之紫外線照射前之經過時間設為3秒。即，實施例2中，第3~第5連接區域CH3~CH5之紫外線照射時間為4秒，第2連接區域CH2之紫外線照射時間為3秒，第1連接區域CH1之紫外線照射時間為2秒。 In the second embodiment, the elapsed time until the ultraviolet irradiation of the third to fifth connection regions CH3 to CH5 is set to 1 second, and the elapsed time until the ultraviolet irradiation of the second connection region CH2 is set to 2 seconds. The elapsed time until the ultraviolet irradiation of the first connection region CH1 was set to 3 seconds. That is, in the second embodiment, the ultraviolet irradiation time of the third to fifth connection regions CH3 to CH5 is 4 seconds, the ultraviolet irradiation time of the second connection region CH2 is 3 seconds, and the ultraviolet irradiation time of the first connection region CH1 is 2 seconds. .

實施例3中，將至對第3連接區域CH3之紫外線照射前之經過時間設為1秒，將至對第2、第4連接區域CH2、CH4之紫外線照射前之經過時間設為2秒，將至對第1、第5連接區域CH1、CH5之紫外線照射前之經過時間設為3秒。即，實施例3中，第3連接區域CH3之紫外線照射時間為4秒，第2、第4連接區域CH2、CH4之紫外線照射時間為3秒，第1、第5連接區域CH1、CH5之紫外線照射時間為2秒。 In the third embodiment, the elapsed time until the ultraviolet irradiation of the third connection region CH3 is set to 1 second, and the elapsed time until the ultraviolet irradiation of the second and fourth connection regions CH2 and CH4 is set to 2 seconds. The elapsed time until the ultraviolet irradiation of the first and fifth connection regions CH1 and CH5 was set to 3 seconds. That is, in the third embodiment, the ultraviolet irradiation time of the third connection region CH3 is 4 seconds, and the ultraviolet irradiation time of the second and fourth connection regions CH2 and CH4 is 3 seconds, and the ultraviolet rays of the first and fifth connection regions CH1 and CH5 are The irradiation time is 2 seconds.

實施例4中，將至對第1、第5連接區域CH1、CH5之紫外線照射前之經過時間設為1秒，將至對第2、第4連接區域CH2、CH4之紫外線照射前之經過時間設為3秒，將至對第3連接區域CH3之紫外線照射前之經過時間設為4秒。即，實施例4中，第1、第5連接區域CH1、CH5之紫外線照射時間為4秒，第2、第4連接區域CH2、CH4之紫外線照射時間為2秒，第3連接區域CH3之紫外線照射時間為1秒。 In the fourth embodiment, the elapsed time until the ultraviolet irradiation of the first and fifth connection regions CH1 and CH5 is set to 1 second, and the elapsed time until the ultraviolet rays are irradiated to the second and fourth connection regions CH2 and CH4. When it is set to 3 seconds, the elapsed time until the ultraviolet irradiation of the third connection region CH3 is set to 4 seconds. That is, in the fourth embodiment, the ultraviolet irradiation time of the first and fifth connection regions CH1 and CH5 is 4 seconds, the ultraviolet irradiation time of the second and fourth connection regions CH2 and CH4 is 2 seconds, and the ultraviolet rays of the third connection region CH3. The irradiation time is 1 second.

比較例1中，將至對第1~第5連接區域CH1~CH5之紫外 線照射前之經過時間一律設為0秒。即，比較例1中，第1~第5連接區域CH1~CH5之紫外線照射時間一律為5秒。 In Comparative Example 1, the ultraviolet to the first to fifth connection regions CH1 to CH5 The elapsed time before the line irradiation is always set to 0 seconds. That is, in Comparative Example 1, the ultraviolet irradiation time of the first to fifth connection regions CH1 to CH5 was uniformly 5 seconds.

比較例2中，將至對第1~第5連接區域CH1~CH5之紫外線照射前之經過時間一律設為4秒。即，比較例2中，第1~第5連接區域CH1~CH5之紫外線照射時間一律為1秒。 In Comparative Example 2, the elapsed time until the ultraviolet irradiation of the first to fifth connection regions CH1 to CH5 was uniformly set to 4 seconds. That is, in Comparative Example 2, the ultraviolet irradiation time of the first to fifth connection regions CH1 to CH5 was uniformly 1 second.

再者，將紫外線照射時間與實施例及比較例之異向性導電膜之硬化收縮率之關係示於表2中。所謂硬化收縮率係指異向性導電膜伴隨紫外線硬化而收縮之比率，可藉由下式求出：硬化收縮率=(接著劑層之硬化物比重-接著劑層之樹脂液比重)/接著劑層之硬化物比重×100。 In addition, the relationship between the ultraviolet irradiation time and the curing shrinkage ratio of the anisotropic conductive films of the examples and the comparative examples is shown in Table 2. The hardening shrinkage ratio refers to the ratio of shrinkage of the anisotropic conductive film with ultraviolet curing, and can be obtained by the following formula: curing shrinkage ratio = (specific gravity of the adhesive layer - specific gravity of the resin layer of the adhesive layer) / The specific gravity of the hardened layer of the agent layer is ×100.

於以上條件下進行加熱按壓及紫外線照射而形成評價用IC連接於玻璃基板之連接體樣品，對各樣品測定翹曲(μm)之大小及導通電阻值(Ω)。 The connection sample of the evaluation IC connected to the glass substrate was formed by heat pressing and ultraviolet irradiation under the above conditions, and the magnitude of the warpage (μm) and the on-resistance value (Ω) were measured for each sample.

翹曲之測定方法係使用觸針式表面粗糙度計(SE-3H：小阪研究所股份有限公司製造)，如圖9所示，使觸針41自接合體樣品之玻璃基板40下面掃描，測定評價用IC之連接後之玻璃基板面之翹曲量(μm)。 The measurement method of the warp is performed by using a stylus type surface roughness meter (SE-3H: manufactured by Kosaka Research Institute Co., Ltd.), and the stylus 41 is scanned from the underside of the glass substrate 40 of the bonded body sample as shown in FIG. The amount of warpage (μm) of the glass substrate surface after the connection of the IC for evaluation was evaluated.

導通電阻值之測定係於實施將連接體樣品於85℃、85%RH之環境下放置500小時之高溫高濕試驗之後，如圖10所示，將電流計A、電壓計V連接於與評價用IC之凸塊42連接之玻璃基板40之金屬配線43，藉由所謂之四端子法測定流通1mA電流時之導通電阻值。將結果示於表2中。 The on-resistance value is determined by performing a high-temperature and high-humidity test in which the connector sample is placed in an environment of 85 ° C and 85% RH for 500 hours. As shown in FIG. 10, the ammeter A and the voltmeter V are connected to The metal wiring 43 of the glass substrate 40 connected to the bump 42 of the IC was evaluated, and the on-resistance value at the time of flowing a current of 1 mA was measured by a so-called four-terminal method. The results are shown in Table 2.

如表2所示，各實施例中，由於在第1~第5連接區域CH1~CH5間錯開紫外線之照射時間點而進行硬化，因此利用鄰接之連接區域之未硬化之黏合劑吸收先前進行紫外線照射之連接區域之硬化時之應變。因此，根據各實施例，翹曲量亦抑制為最大11.3μm，又，連接電阻亦最大為12.4Ω。因此可知：藉由本連接步驟，可抑制玻璃基板之應變，並且可防止評價用IC之連接不良。 As shown in Table 2, in each of the examples, since the first to fifth connection regions CH1 to CH5 are hardened by shifting the irradiation time of the ultraviolet rays, the uncured adhesive which is adjacent to the connection region absorbs the ultraviolet rays previously. The strain at the time of hardening of the joined region of the illumination. Therefore, according to each embodiment, the amount of warpage is also suppressed to a maximum of 11.3 μm, and the connection resistance is also at most 12.4 Ω. Therefore, it is understood that the strain of the glass substrate can be suppressed by the connection step, and the connection failure of the evaluation IC can be prevented.

與此相對，與熱加壓同時地對第1~第5連接區域CH1~CH5開始照射紫外線之比較例1中，各連接區域CH1~CH5同時開始硬化，又，紫外線照射時間亦較長，硬化收縮率亦較大為2.7%，因此無法吸收鄰接之連接區域之應變，翹曲量較大為14.5μm，又，連接電阻亦成為15.1Ω。 On the other hand, in Comparative Example 1 in which the first to fifth connection regions CH1 to CH5 were irradiated with ultraviolet rays simultaneously with the hot press, the respective connection regions CH1 to CH5 were simultaneously hardened, and the ultraviolet irradiation time was also long and hardened. The shrinkage ratio was also 2.7%, so that the strain of the adjacent joined region could not be absorbed, the warpage amount was as large as 14.5 μm, and the connection resistance was also 15.1 Ω.

又，自熱加壓經過4秒後對第1~第5連接區域CH1~CH5開始照射紫外線之比較例2中，硬化收縮率較小為1.1%，因此翹曲抑制為 5.0μm，但硬化不充分，高溫高濕試驗後之連接電阻成為110.8Ω。 Further, in Comparative Example 2 in which the first to fifth connection regions CH1 to CH5 were irradiated with ultraviolet rays after 4 seconds from the hot pressurization, the hardening shrinkage ratio was as small as 1.1%, so the warpage suppression was 5.0 μm, but the hardening was insufficient, and the connection resistance after the high-temperature and high-humidity test was 110.8 Ω.

觀察各實施例，於自中央之第3連接區域CH3開始照射且依次朝向端部照射紫外線之實施例3或自端部之連接區域CH1、CH5朝向中央部照射紫外線之實施例4中，翹曲量及連接電阻較良好。認為其原因在於：由於對照射到紫外線之連接區域必定設置有未照射紫外線之連接區域，因此於較多之連接區域中，可藉由鄰接之連接區域之未硬化之黏合劑吸收硬化時之應變。 In each of the examples, the embodiment 3 was irradiated with ultraviolet rays from the third connection region CH3 in the center and sequentially irradiated with ultraviolet rays toward the end portions, or the connection regions CH1 and CH5 from the end portions were irradiated with ultraviolet rays toward the central portion, and warpage was observed. The amount and connection resistance are good. The reason is considered to be that since the connection region to which the ultraviolet ray is irradiated is necessarily provided with the connection region where the ultraviolet ray is not irradiated, in many connection regions, the strain at the time of hardening can be absorbed by the uncured adhesive adjacent to the connection region. .

其中，實施例3中，將對端部之連接區域CH1、CH5之紫外線照射設為最後，並且照射時間亦較短，硬化收縮率亦降低。由於玻璃基板之翹曲自中央部朝外側增大，因此外側(端部)之硬化收縮率變低之實施例3最可抑制翹曲。 In the third embodiment, the ultraviolet irradiation of the connection regions CH1 and CH5 at the end portions is the last, and the irradiation time is also short, and the hardening shrinkage ratio is also lowered. Since the warpage of the glass substrate increases from the center portion toward the outside, the third embodiment in which the hardening shrinkage ratio of the outer side (end portion) becomes low can suppress the warpage most.

3‧‧‧導電性粒子含有層 3‧‧‧ Conductive particle containing layer

12‧‧‧透明基板 12‧‧‧Transparent substrate

17‧‧‧透明電極 17‧‧‧Transparent electrode

18‧‧‧電子零件 18‧‧‧Electronic parts

31‧‧‧紫外線照射器 31‧‧‧UV illuminator

31a、31b、31c、31d、31e‧‧‧紫外線照射部 31a, 31b, 31c, 31d, 31e‧‧‧ UV irradiation department

CH1、CH2、CH3、CH4、CH5‧‧‧連接區域 CH1, CH2, CH3, CH4, CH5‧‧‧ connection area

Claims (9)

一種連接體之製造方法，該連接體係於下述基板上連接有下述電子零件者，該製造方法具有下述步驟：經由光硬化型接著劑將電子零件配置於基板上，及利用複數光源來對該接著劑照射光而使其硬化；將該基板與該電子零件連接之區域分割為多個連接區域，被分割為多個的該連接區域相互鄰接地並列，對每個該連接區域，分別對對應之該光源進行照射控制，並錯開該光照射開始時間點而進行硬化。 A method of manufacturing a connector in which an electronic component is connected to a substrate having a step of arranging an electronic component on a substrate via a photocurable adhesive and using a plurality of light sources The adhesive is irradiated with light to be cured; the region where the substrate is connected to the electronic component is divided into a plurality of connection regions, and the plurality of connection regions are divided into a plurality of adjacent regions, and for each of the connection regions, Irradiation control is performed on the corresponding light source, and the light irradiation start time point is shifted to perform hardening. 如申請專利範圍第1項之連接體之製造方法，其中，自分割為多個之該連接區域的任意一個或多個開始該光照射，經過特定時間後，開始對該任意一個或多個連接區域以外之連接區域照射該光。 The method of manufacturing a connector according to claim 1, wherein the light irradiation is started from any one or more of the plurality of connected regions, and after a certain period of time, the one or more connections are started. The connection area outside the area illuminates the light. 如申請專利範圍第2項之連接體之製造方法，其中，對最後照射該光之連接區域照射光硬化所需之最低限度的照射量後，停止對整個連接區域之光照射。 The method for producing a connector according to the second aspect of the invention, wherein the light irradiation of the entire connection region is stopped after the minimum irradiation amount required for photohardening is irradiated to the connection region where the light is finally irradiated. 如申請專利範圍第2項之連接體之製造方法，其中，自分割為多個之該連接區域中該基板與該電子零件連接區域的中央連接區域開始該光之照射，經過特定時間後，開始對該中央連接區域以外之連接區域照射該光。 The method for manufacturing a connector according to the second aspect of the invention, wherein the light is irradiated from a central connection region of the connection region between the substrate and the electronic component in the connection region divided into a plurality of regions, and after a certain period of time, start The light is irradiated to the connection region other than the central connection region. 如申請專利範圍第4項之連接體之製造方法，其中，自該中央連接區域朝向該基板與該電子零件連接區域的端部之該連接區域分階段地延遲開始該光照射之時間點。 The method of manufacturing a connector according to the fourth aspect of the invention, wherein the connection region from the central connection region toward the end of the substrate and the electronic component connection region is delayed in a stepwise manner at which the light irradiation is started. 如申請專利範圍第2項之連接體之製造方法，其中，自該基板與該電子零件連接區域的一個或多個端部之該連接區域開始該光照射， 經過特定時間後，對該一個或多個端部之連接區域以外的連接區域開始該光照射。 The method of manufacturing a connector according to claim 2, wherein the light is irradiated from the connection region of the one or more ends of the substrate and the electronic component connection region, After a certain period of time, the light is irradiated to the connection area other than the connection area of the one or more ends. 如申請專利範圍第6項之連接體之製造方法，其中，自該基板與該電子零件連接區域的一個端部之該連接區域開始該光照射，朝向該基板與該電子零件連接區域的其他端部之該連接區域分階段地延遲開始該光照射之時間點。 The method of manufacturing a connector according to claim 6, wherein the light is irradiated from the connection region of the end portion of the substrate and the electronic component connection region toward the other end of the substrate and the electronic component connection region. The connection region of the portion delays the time point at which the light irradiation is started in stages. 如申請專利範圍第6項之連接體之製造方法，其中，自該基板與該電子零件連接區域的多個端部之該連接區域開始該光照射，朝向該基板與該電子零件連接區域的中央之該連接區域分階段地延遲開始該光照射之時間點。 The method of manufacturing a connector according to claim 6, wherein the light is irradiated from the connection region between the substrate and the plurality of end portions of the electronic component connection region toward the center of the substrate and the electronic component connection region. The connection area delays the point in time at which the light irradiation is started in stages. 一種電子零件之連接方法，其將下述電子零件連接於下述基板上，具有下述步驟：經由光硬化型接著劑將電子零件配置於基板上，及利用複數光源來對該接著劑照射光而使其硬化；將該基板與該電子零件連接之區域分割為多個連接區域，被分割為多個的該連接區域相互鄰接地並列，對每個該連接區域，分別對對應之該光源進行照射控制，並錯開該光照射開始之時間點而進行硬化。 A method of connecting electronic components, wherein the electronic component is connected to a substrate, wherein the electronic component is placed on the substrate via a photocurable adhesive, and the adhesive is irradiated with a plurality of light sources. And hardening; the region where the substrate is connected to the electronic component is divided into a plurality of connection regions, and the plurality of connection regions are divided into adjacent rows, and the corresponding light source is respectively performed for each of the connection regions The irradiation is controlled, and the hardening is performed by staggering the time point at which the light irradiation starts.
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