200521551 九、發明說明： 【發明所屬之技術領域】 本發明關於一種光罩。例如關於在對液晶顯示面板週邊 ^ $成之i外線硬化型密封材照射紫外線而使其硬化時重 疊在液晶顯示面板上的光罩。 【先前技術】 在製造液晶顯示裝置等之顯示裝置的工序中，存在有在 面板内充填液晶材料等之機能材料的工序。作為機能材料 的充填方法，舉例來說有浸潰式及塗佈式。在此等方法 中，採用了對貼合之主玻璃基板以個別面板或包含複數片 I板的長條狀物來逐—進行切割，並由密封材的開口部充 填機能材料後，將開口部加以密封的手法。然而，隨著竺 t面尺J的大型化’存在機能材料充填之製程時間_ time)長的問題。 近年，作為在面板内充填機能材料的其他方法， 充填方式(也被稱為滴下貼合方式所謂一滴二填 式為不在窜封圖案内設置開口’而在重疊前之一方的美 :二形成之密封圖案框内滴下機能材料後，在減麼下二 面^重蟹而貼合的方式。依據-滴充填方式，可因庫壹 的優=大型化’具有機能材料充填之製程時間大幅縮: 在一滴充填方式中，基於硬化時間上之 — 藉由加熱來硬化的密封材，因此，使用的二，用 線(UV)來硬化的密封材(以下’稱為uv硬化型3密二= 97729.doc 200521551 由uv照射及加熱之兩者來硬化的密封材（以下，稱為灣 熱併用硬化型密封材)。所以，-滴充填方式中，必須有 藉由UV照射來硬化密封材的工序。 UV照射X序中，通常使用到光罩。作為以的配置方 法’舉例來說有：非接觸方式，其係使光罩不接觸於貼合 基板；及接觸方式，其係使光罩接觸於貼合基板。 對於在非接觸方式及接觸方式中❹的光罩的材料，主 要要求的有以下三種特性：⑴為了將光罩與貼合基板_ 隔保持在固定，應為高剛性材料；⑺為了精度良好地形成 圖案，應為尺寸穩定性高的材料；（3)為了不使UV光線有 扣失應為具有特別南之透光率的材料。作為符合此三種 要件的材料，—般使用的為石英玻璃及低驗玻璃，惟基於 精度及吸熱寺方面之考量，被廣泛地使用的為石英玻璃。 另方面為了製作顯示裝置的玻璃的尺寸每年變大， 隨之光罩的尺寸也愈大型化。非接觸方式中使用的光罩比 接觸方式使用的光罩要求更高的剛性，因此，為了防止光 罩因為下彎及本身重量而破裂，有必要增加光罩的厚度。 例如㈣_75〇 _基板用的光罩，厚度有必要為$ _左 、、有此#王度之厚度的光罩，有必要使用具有特高 透光率的昂貴的石英玻璃，因此，難以抑制製造成本。 相對於此，接館古4 钱觸方式使用的光罩，其由於會接觸於貼人 基板’因此’相較於非接觸方式中使料光罩，所要㈣ Ο" 生:依此，可使光罩的厚度變薄，因此，可使用雖然 比石兴破璃透料低但較便宜的㈣玻卿來作為光罩。 97729.doc 200521551 隹在接觸方式中，藉由接觸，恐有造成圖案形成面受到污 染或破損之虞。 一專利文獻1中揭不了圖案形成面受到保護之接觸方式用 光罩。具體而言，專利文獻1揭示之光罩中，玻璃光罩之 圖案形成面的空白空間中有以固定之厚度設置間隔物，藉 由使此間隔物抵接於被曝光層之表面，使圖案形成面受到 保護。 [專利文獻1 ] 特開昭61-260633號公報 【發明内容】 —為了有效率地形成圖案，以減少空白空間為佳。然而， 實際上，除了光罩基板的外圍部之外，幾乎沒有圖案形成 面上的空白空間，因此，難以在光罩基板的中央部設置間 隔物。如此一纟，光罩的下垂會增大而使光罩與被曝光層 之間隔在面内不均勻，恐有導致圖案精度下降之虞。此 外，為了防止光罩下垂而增加光罩的厚度時，將會失去接 觸方式的優點，無法使用價廉的低鹼玻璃。因此，如專利 文獻1揭示般地在未形成圖案的空白區域設置間隔物並不 切實際。 本發明之目的在於一面保持光罩之圖案精度一面進行薄 型化，謀求降低光罩之製造成本。 本發明提供間隔物形成於遮光層之區域内的接觸方式用 光罩。詳細而言，本發明之光罩為經由含有光硬化性樹脂 之密封材而接觸重疊於貼合一對基板之貼合基板上，藉此 97729.doc 200521551 規疋照射於上述貼合基板之面上的光源光之區域者，其包 含··透明基板；遮光層，其係以上述密封材之區域至少被 上述光源光所照射之方式，形成於上述透明基板之一方面 上’·及間隔物，其係形成於上述遮光層的區域内。 含有光硬化性樹脂的密封材包含1/¥硬化型密封材及uv 暨熱併用硬化型密封材。密封材的圖案並不僅不具有開口 的框狀（封閉環狀），也包含具有開口的框狀（開口環狀）。 換言之，本發明之光罩並不僅適用於一滴充填方式，也適 用於由開口（注入口）注入機能材料的方式。 遮光層在典型上以遮蔽密封材之區域以外的區域之方式 形成，因此，在光罩之面内的佔有率高。如此一來，可將 遮光層=區域内形成之間隔物形成在光罩之面内的各種位 置上’藉由使光罩經由間隔物接觸於貼合基板，可大幅減 ^光罩的弓曲，使光罩與貼合基板的間隙約略保持固定。 藉 可面確保圖案的精度，一面減少光罩的厚度。 ，上述間隔物以比上述一對基板中接觸之基板硬度低的材 料來形成為俊。藉此，貼合基板面難以因為間隔物而受損。 匕卜本發明提供藉由一滴充填方式的貼合基板之製造 羊、田而3，本發明之方法為製造具有含機能材料之 «匕圍上述機能材料且含光硬化性樹脂之密封材、及經 由上返機能材料層及上述密封材而貼合之-對基板的貼合 基板者i且包含：在上述-對基板中之-方的基板面上， 將上述始、封材形成為框狀之工序；在上述密封材之框内滴 下上述機能材料之工序；貼合上述一對基板之工序；將本 97729.doc 200521551 發明之光罩重疊於上述貼合基板，使上述間隔物接觸上述 貼合基板之工序；及藉由經由上述光罩將光源光照射在上 述貼合基板上，使上述密封材硬化之工序。 機能材料層包含：藉由相互相對之電極間的電位差來調 變透光率之層、及藉由在相互相對之電極間流通之電流來 自發光之層。例如係液晶層、無機或有機電致發光（el) 層、發光氣體層、電泳層、電致變色層等。 依據本發明，可一面確保光罩之圖案精度，一面實施光 罩的薄型化。因此，透光率提升，可抑制光源光的損失。 此外可使用比石英玻璃透光率低但價廉的低驗玻璃，因 此，可減低製造成本。此外，遮光層不接觸到貼合基板 面’因此’沒有遮光層污染或破損之虞。 【實施方式】 以下’參照圖式來說明本發明之實施方式。以下的實施 方式中貼5基板乃以貼合液晶基板來說明，惟本發明中 之貼合基板也適用使像素光學性地依序轉換的圖像轉換面 板及可顯示立體影像的視差格栅面板。此外，圖像轉換面 板具有由對光線的偏光狀態進行調變之液晶面板、及依由 此液晶面板射出之光線之偏光狀態來轉換光路之複折射元 件構成之組合至少一組。此外，視差格柵面板能夠藉由具 有左眼用像素及右眼用像素的影像顯示元件之組合來顯示 立體影像。 圖1為模式性地顯示本實施方式之光罩之平面圖。圖2為 重疊本實施方式之光罩的貼合液晶基板之平面圖，而圖3 97729.doc 200521551 為此之剖面圖。此外，圖2及圖3所示之貼合液晶基板會被 分割成4個液晶顯示面板。 首先，參照圖2及圖3來說明貼合液晶基板之構造。貼合 液晶基板1具有：一對基板2、3 ;週邊密封材4，其係被兩 基板2、3所夾；及液晶層5，其係被兩基板2、3所夾，並 被週邊密封材4包圍。一方的基板2為彩色濾光基板，其具 有：彩色濾光層（未圖示）、由1丁〇(銦錫氧化物）等形成之透 明電極6、及由聚醯亞胺形成且被施以研磨處理的液晶配 向膜（未圖示）。 另一方之基板3為TFT (Thin Film Transistor;薄膜電晶 體）基板，其具有：複數條閘極匯流排線（未圖示），其係分 別向列方向延伸；複數條源極匯流排線（未圖示），其係與 問極匯流排線交叉而延伸；TFT(未圖示），其係設於閘極 匯流排線及源極匯流排線的交叉部附近；像素透明電極 7 ’其係介以TFT連接於源極匯流排線（未圖示），配置成矩 陣狀；及液晶配向膜（未圖示），其係被覆於像素透明電極7 上。再者，另一方之基板3上，在框狀的週邊密封材4之外 側，形成有為了分別對閘極匯流排線及源極匯流排線輸入 信號的端子8。 作為基板2、3的材料，舉例來說有：石英玻璃、鈉鈣玻 璃、硼矽酸玻璃、低鹼玻璃、無鹼玻璃等之玻璃、聚酯及 聚醯亞胺等之塑膠。 週邊密封材4含有丙烯酸樹脂及環氧樹脂等之uv硬化性 樹脂，藉由UV光源照射之^^^^光來硬化。本實施方式之光 97729.doc •10- 200521551 罩藉由接觸重疊於貼合液晶基板1上，規定照射於貼合液 曰曰基板1之面上之UV光線的區域。具體而言，藉由重疊光 罩，週邊密封材4之區域被照射，貼合液晶基板1之其他區 域例如貼合液晶基板1之顯示區域則被遮光。 以下參照圖1來說明本實施方式之光罩的構造。本實施 方式之光罩10具有：透明基板11 ;遮光層12，其係使UV 照射於週邊密封材4之區域般地，形成在透明基板丨丨之一 方面；間隔物13，其係形成於遮光層12之區域内，具有指 定厚度。 作為透明基板11 ’可使用一般的光罩所使用的板玻璃。 如後述，依據本實施方式之光罩，可使透明基板丨1之厚度 變薄，因此，不僅石英玻璃，也可使用價廉的低鹼玻璃。 此外，也可使用鈉鈣玻璃、硼矽酸玻璃、無鹼玻璃等其他 的玻璃、及聚酯等之塑膠。 遮光層12被形成為使貼合液晶基板1之週邊密封材4之區 域被照射，並使貼合液晶基板1之其他區域被遮光。具體 而言，如圖1所示，除對應於週邊密封材4之區域ua及透 明基板11之週邊區域lib以外的區域，形成有遮光層12。 典型上，使週邊密封材4之區域被照射般地形成之透光區 域11 a(沒有遮光層12之區域）在寬度上約略與週邊密封材* 相等，惟也可比週邊密封材4之區域更寬。其原因在於為 了使週邊密封材4硬化的光罩，相較於光刻法使用的光 罩，並不被要求嚴格的圖案精度。 遮光層12係利用對照射之UV具有遮光性之膜來圖案形 97729.doc 11 200521551 成。例如，可使用鉻酸單層膜、鉻膜及氧化鉻膜的疊層 膜、含有銀鹽明膠乳劑之乳化膜等，藉由光刻法及印刷 法’开> 成具有指定之光罩圖案的遮光層12。 間隔物13形成於遮光層12之區域内的複數個位置上。由 於，遮光層12形成在除了對應於週邊密封材之區域lu及 透明基板11之週邊區域1 lb以外的區域上，因此，在透明 基板11之面内的佔有率高。如此一來，形成間隔物13之位 置的k擇範圍大，可在透明基板11之面内的各種位置上形 成間隔物13。 作為間隔物13的材料，凡具有適當的尺寸穩定性者，或 具有能追隨光罩之膨脹收縮之可撓性者，均可加以使用。 然而’為了避免損傷貼合液晶基板1之表層的基板2，以使 用比基板2硬度低的材料為佳。例如能以施有可接著 (cementable)處理之PTFE(聚四氟乙烯）膠帶來形成間隔物13。 作為形成間隔物之手法，舉例來說有將具有上述特性之 材料形成為圓柱狀，膜厚以20 μπι以上500 μηι以下為佳， 且以50 /xm以上200 μηι以下左右為更佳，並以υν硬化型或 熱硬化型之接著劑貼合的方法等。此外，本實施方式中， 間隔物13的形狀為圓柱狀，然而，間隔物13的形狀並無特 別的限制。例如，也可為凸緣狀或帶狀。 本實施’式之光罩10中，間隔物13形成於遮光層12之區 域内，因此，可使間隔物13存在於透明基板丨丨之面内各 處。據此，藉由以接觸方式將光罩丨〇重疊於貼合液晶基板 1上’可使光罩10之下垂程度大幅減低，使得光罩丨〇與貼 97729.doc -12- 200521551 合液晶基板1之間隔保持成約略固定。藉此，可確保圖案 精度的同時，減少透明基板1 1之厚度。惟，以在光罩丨〇尚 未接觸到貼合液晶基板1時不會因為本身重量而破裂的厚 度為佳。例如為620 mmx750 mm尺寸的低鹼玻璃基板時， 厚度以0.7 mm左右為適。 接著，說明使用本發明之光罩1 〇來製造液晶顯示面板的 工序。首先，在一方的基板2上，藉由濺鍍法及印刷法 寻’依序开> 成色濾、光層、透明電極6及施有研磨處理之液 晶配向膜。此外，在另一方的基板3上，藉由光刻法及印 刷法等形成各種匯流排線、絕緣膜、TFT、及像素透明電 極7後’开）成被覆於像素透明電極7上之施有研磨處理的液 晶配向膜。 在兩基板2、3中任何一方基板的面上，藉由網版印刷方 式及佈方式’形成含有環氧樹脂的uv硬化型之週邊密 封材4。週邊密封材4之圖案為不具有起作用為液晶注入口 之開口的封閉環狀。在週邊密封材4之圖案框内，滴下例 如向列型液晶材料。藉由在真空處理室内貼合兩基板2、 3，使各液晶顯示面板内分別封入有液晶層5。 圖4為杈式性地顯示貼合基板丨與光罩丨〇重疊時之狀態之 剖面圖。如圖4所示般地，將光罩1〇重疊於貼合液晶基板 1 ’使光罩10之間隔物13接觸貼合液晶基板丨之一方的基板 面由於具有指定厚度之間隔物13存在於透明基板！ i 面内的各處上，因此，藉由以接觸方式使光罩10重疊於貼 合液晶基板i，可使光罩1〇與貼合液晶基…之間隔保持成 97729.doc 200521551 約略固定。 藉由介以光罩10而將UV光照射在貼合液晶基板1上，僅 貼合液晶基板1之面中的週邊密封材4之區域受到曝光，使 週邊密封材4硬化。接著，將貼合液晶基板分割成個別的 面板’經過倒角工序及偏光板貼付工序後，將驅動IC連接 於端子8°經由上述之工序，製成本實施方式之液晶顯示 面板。 本實施方式之光罩10中，遮光層12形成於透明基板丨丨之 一方面側上，並且，間隔物13形成於遮光層12上，惟也可 使遮光層12形成於透明基板丨丨之一方面側，並使間隔物i 3 形成於透明基板11之另一方面側。此外，本實施方式之液 晶顯不面板中，雖然作為液晶驅動元件使用的為TFT，惟 也可使用MIM (Metal Insulator Metal ;雙端子二極體）等其 他的主動式驅動元件，或也可為不使用驅動元件的被動 (多工配接器）驅動。此外，液晶顯示面板也可為透光型、 反射型、及透光反射兩用型中任何一者。 本實施方式中，作為介以光罩1〇而照射UV光的對象， 雖以液晶面板為例，惟對象之貼合基板並不以液晶面板為 限。例如PDP (Plasma Display Pand ;電漿顯示面板）、有 機或無機EL (Electro LUminescence ;電致發光）顯示面 板、電致變色顯示面板等也可為對象。 以上說明了本發明之實施方式，惟本發明之技術範圍並 不限於上述實施方式記載之範圍。上述實施方式為例示， 熟知本發明技術者當知上述各構造元件可做種種變更，且 97729.doc -14- 200521551 知如此之變更例也屬於本發明之技術範圍。 2003年11月26日争請之特願2003-395952之明細書、圖 式及申請專利範圍中揭示的内容，藉由參照而包含於本專 利之明細書令。 本表月之光罩可利用於為了使被一對基板夹住之感光性 密封材硬化的接觸方式用光罩。 【圖式簡單說明】 圖1為模式性地顯示實施方式之光罩之平面圖。 圖2為重豐貫施方式之光罩的貼合液晶基板之平面圖。 圖3為重豎貫施方式之光罩的貼合液晶基板之剖面圖。 圖4為模式性地顯示貼合基板丨與光罩ι〇重疊時之狀態之 剖面圖。 【主要元件符號說明】 1 貼合基板 2, 3 基板 4 週邊密封材 5 ，液晶層 6 透明電極 7 像素透明電極 8 端子 10 光罩 11 透明基板 12 遮光層 13 間隔物 97729.doc •15-200521551 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a photomask. For example, a photomask that is superimposed on a liquid crystal display panel when it is irradiated with ultraviolet rays on the periphery of the liquid crystal display panel. [Prior Art] In the process of manufacturing a display device such as a liquid crystal display device, there is a step of filling a panel with a functional material such as a liquid crystal material. Examples of filling methods for functional materials include dip type and coating type. In these methods, the main glass substrate to be bonded is cut individually by an individual panel or a strip including a plurality of I plates, and the opening portion of the sealing material is filled with a functional material, and the opening portion is then filled. Sealing method. However, with the increase in the size of the surface area J, there is a problem that the processing time of the functional material filling process is long. In recent years, as another method for filling functional materials into panels, the filling method (also known as the drop-and-laminate method is called the “drop-and-two-fill method, which does not provide openings in the channeling pattern,” but the beauty before the overlap: the second formation of After the functional material is dripped into the sealed pattern frame, the two sides are reduced to fit the weight of the crab. According to the -drop filling method, the processing time of filling with functional materials can be greatly reduced due to the superiority of Kuyi = large-scale: In the one-drop filling method, based on the curing time—the sealing material that is hardened by heating. Therefore, the second one is a sealing material that is hardened by wire (UV) (hereinafter referred to as uv curing type 3 dense two = 97729). .doc 200521551 A sealing material that is hardened by both UV irradiation and heating (hereinafter referred to as Bay-heat combined hardening type sealing material). Therefore, in the -drop filling method, a process of hardening the sealing material by UV irradiation is necessary. In the UV irradiation X sequence, a photomask is usually used. As an example of the arrangement method, there are: a non-contact method in which the photomask is not in contact with the bonding substrate; and a contact method in which the photomask is in contact Fit For the material of the photomask in the non-contact method and the contact method, the following three characteristics are mainly required: ⑴ In order to keep the photomask and the bonded substrate _ spacer fixed, it should be a highly rigid material; ⑺ For accuracy To form a good pattern, it should be a material with high dimensional stability; (3) In order to prevent the loss of UV light, it should be a material with a particularly high light transmittance. As a material that meets these three requirements, generally used is Quartz glass and low-spectrum glass are widely used because of their accuracy and endothermic considerations. On the other hand, the size of the glass used to make display devices has increased each year, and the size of the photomask has also increased. The photomask used in the non-contact method requires higher rigidity than the photomask used in the contact method. Therefore, in order to prevent the photomask from being broken due to bending and its own weight, it is necessary to increase the thickness of the photomask. For example, ㈣_75〇_Substrate The photomask used must have a thickness of $ _ 左, and a photomask with the thickness of # 王 度, it is necessary to use expensive quartz glass with extremely high light transmission, so it is difficult Reduction of manufacturing costs. In contrast, the photomask used in the contact mode can touch the printed circuit board 'so it' requires more material mask than the non-contact method. Therefore, the thickness of the photomask can be made thin. Therefore, it can be used as a photomask, although it is cheaper than Shixing Pingli. 97729.doc 200521551 隹 In the contact method, by contact, There is a possibility that the pattern forming surface may be contaminated or damaged.-Patent Document 1 does not disclose a photomask for a contact method in which the pattern forming surface is protected. Specifically, in the photomask disclosed in Patent Document 1, the pattern of the glass photomask In the blank space of the formation surface, a spacer is provided with a fixed thickness, and the pattern formation surface is protected by abutting the spacer on the surface of the exposed layer. [Patent Document 1] Japanese Patent Application Laid-Open No. 61-260633 [Summary of the Invention]-In order to form a pattern efficiently, it is preferable to reduce a blank space. However, practically, there is almost no empty space on the pattern forming surface except for the peripheral portion of the mask substrate, and therefore it is difficult to provide a spacer in the center portion of the mask substrate. As a result, the sag of the photomask will increase, and the space between the photomask and the exposed layer will be uneven in the plane, which may cause a decrease in pattern accuracy. In addition, if the thickness of the photomask is increased in order to prevent the photomask from sagging, the advantages of the contact method are lost, and inexpensive low-alkali glass cannot be used. Therefore, it is not practical to provide a spacer in a blank area where no pattern is formed as disclosed in Patent Document 1. The object of the present invention is to reduce the thickness of the mask while maintaining the pattern accuracy of the mask, and to reduce the manufacturing cost of the mask. The present invention provides a photomask for a contact method in which a spacer is formed in a region of a light-shielding layer. In detail, the photomask of the present invention is in contact with and superimposed on a bonded substrate to which a pair of substrates are bonded via a sealing material containing a photocurable resin, and thereby irradiates the surface of the bonded substrate according to 97729.doc 200521551. The light source light region includes a transparent substrate; the light-shielding layer is formed on one aspect of the transparent substrate such that the area of the sealing material is at least irradiated by the light source light; and the spacer. It is formed in the region of the light-shielding layer. The sealing material containing a photocurable resin includes a 1 / ¥ curable sealing material and a UV-curable heat-curing sealing material. The pattern of the sealing material includes not only a frame shape (closed ring) having an opening but also a frame shape (open ring) having an opening. In other words, the photomask of the present invention is not only suitable for a one-drop filling method, but also a method for injecting functional materials through an opening (injection port). The light-shielding layer is typically formed so as to shield a region other than the region of the sealing material, and therefore has a high occupation rate in the surface of the photomask. In this way, the spacers formed in the light-shielding layer = area can be formed at various positions in the face of the mask. By bringing the mask into contact with the bonding substrate through the spacer, the bow of the mask can be greatly reduced. , So that the gap between the photomask and the bonded substrate is kept approximately fixed. By ensuring the accuracy of the pattern, the thickness of the mask can be reduced. The spacer is formed of a material having a lower hardness than the substrate in contact with the pair of substrates. This makes it difficult for the bonded substrate surface to be damaged by the spacer. The present invention provides manufacturing of sheep and fields by laminating substrates by a drop filling method. The method of the present invention is to produce a sealing material having a functional material containing a functional material and a photocurable resin, and The bonding substrate to the substrate, which is bonded via the upper-returning functional material layer and the sealing material, includes: forming the above-mentioned starting and sealing materials into a frame shape on the substrate surface of the square substrate. The step of dropping the functional material in the frame of the sealing material; the step of laminating the pair of substrates; superimposing the photomask of the invention of 97729.doc 200521551 on the laminating substrate so that the spacer contacts the paste A step of bonding the substrate; and a step of curing the sealing material by irradiating the light source light onto the bonded substrate through the photomask. The functional material layer includes a layer that adjusts the light transmittance by a potential difference between the electrodes facing each other, and a layer that emits light by a current flowing between the electrodes facing each other. For example, it is a liquid crystal layer, an inorganic or organic electroluminescent (el) layer, a luminescent gas layer, an electrophoretic layer, an electrochromic layer, and the like. According to the present invention, it is possible to reduce the thickness of the photomask while ensuring the pattern accuracy of the photomask. Therefore, the transmittance is improved, and the loss of light from the light source can be suppressed. In addition, it is possible to use a low-priced, low-spectrum glass that has lower light transmittance than quartz glass, thereby reducing manufacturing costs. In addition, the light-shielding layer does not contact the surface of the bonded substrate. Therefore, the light-shielding layer is not likely to be contaminated or damaged. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following embodiments, the 5 substrates are described as being bonded to a liquid crystal substrate. However, the bonded substrates in the present invention are also applicable to an image conversion panel that converts pixels sequentially and optically, and a parallax grille panel that can display stereo images . In addition, the image conversion panel has at least one group consisting of a liquid crystal panel that adjusts a polarization state of light, and a birefringent element that converts an optical path according to the polarization state of light emitted from the liquid crystal panel. In addition, the parallax grid panel can display a stereoscopic image by a combination of image display elements having left-eye pixels and right-eye pixels. FIG. 1 is a plan view schematically showing a photomask according to this embodiment. FIG. 2 is a plan view of a laminated liquid crystal substrate superposed with a photomask of this embodiment, and FIG. 3 is a cross-sectional view of 97729.doc 200521551. In addition, the laminated liquid crystal substrate shown in FIG. 2 and FIG. 3 is divided into four liquid crystal display panels. First, a structure for bonding a liquid crystal substrate will be described with reference to FIGS. 2 and 3. The bonded liquid crystal substrate 1 includes: a pair of substrates 2 and 3; a peripheral sealing material 4 sandwiched between the two substrates 2 and 3; and a liquid crystal layer 5 sandwiched between the two substrates 2 and 3 and sealed by the periphery.材 4 Surrounding. One substrate 2 is a color filter substrate, which includes a color filter layer (not shown), a transparent electrode 6 made of 1but (Indium Tin Oxide), and the like, and a polyimide formed and applied. A polishing-processed liquid crystal alignment film (not shown). The other substrate 3 is a TFT (Thin Film Transistor) substrate, which includes: a plurality of gate bus lines (not shown), which respectively extend in a column direction; and a plurality of source bus lines ( (Not shown), which intersects and extends with the question bus; TFT (not shown), which is located near the intersection of the gate bus and the source bus; the pixel transparent electrode 7 ′ The TFTs are connected to a source bus bar (not shown) via a TFT and are arranged in a matrix; and a liquid crystal alignment film (not shown) is coated on the pixel transparent electrode 7. Furthermore, on the other substrate 3, a terminal 8 for inputting signals to the gate busbar and the source busbar is formed on the outside of the frame-shaped peripheral sealing material 4. Examples of the materials of the substrates 2 and 3 include glass such as quartz glass, soda lime glass, borosilicate glass, low-alkali glass, and alkali-free glass, and plastics such as polyester and polyimide. The peripheral sealing material 4 contains a UV-curable resin such as acrylic resin and epoxy resin, and is cured by ^^^^ light irradiated by a UV light source. The light of this embodiment 97729.doc • 10- 200521551 The cover overlaps the bonded liquid crystal substrate 1 by contact, and defines a region of UV light irradiated onto the surface of the bonding liquid substrate 1. Specifically, by overlapping the mask, the area of the peripheral sealing material 4 is irradiated, and other areas bonded to the liquid crystal substrate 1 such as the display area bonded to the liquid crystal substrate 1 are shielded from light. The structure of the photomask according to this embodiment will be described below with reference to FIG. 1. The photomask 10 of this embodiment includes a transparent substrate 11 and a light-shielding layer 12 formed on one side of the transparent substrate in a manner that UV is irradiated onto the peripheral sealing material 4; and a spacer 13 formed on The area of the light shielding layer 12 has a predetermined thickness. As the transparent substrate 11 ', a plate glass used in a general photomask can be used. As will be described later, according to the photomask of this embodiment, the thickness of the transparent substrate 1 can be made thin. Therefore, not only quartz glass but also low-cost alkali glass can be used. In addition, other glasses such as soda-lime glass, borosilicate glass, alkali-free glass, and polyester plastics can also be used. The light-shielding layer 12 is formed to irradiate a region where the peripheral sealing material 4 to which the liquid crystal substrate 1 is bonded, and to block other regions to which the liquid crystal substrate 1 is bonded. Specifically, as shown in FIG. 1, a light-shielding layer 12 is formed in a region other than the region ua corresponding to the peripheral sealing material 4 and the peripheral region lib of the transparent substrate 11. Typically, the light-transmitting area 11 a (the area without the light-shielding layer 12) formed by irradiating the area of the surrounding sealing material 4 is approximately equal to the width of the surrounding sealing material *, but it may be more than the area of the surrounding sealing material 4 width. The reason for this is that a mask for hardening the peripheral sealing material 4 does not require strict pattern accuracy as compared with a mask used for photolithography. The light-shielding layer 12 is patterned using a film having a light-shielding property against irradiated UV 97729.doc 11 200521551. For example, a monolayer film of chromic acid, a laminated film of chromium film and chromium oxide film, an emulsified film containing a silver salt gelatin emulsion, and the like can be used to form a designated mask pattern by photolithography and printing. 'S light-shielding layer 12. The spacers 13 are formed at a plurality of positions in the region of the light shielding layer 12. Since the light-shielding layer 12 is formed on a region other than the region lu corresponding to the peripheral sealing material and the peripheral region 1 lb of the transparent substrate 11, the occupation rate on the surface of the transparent substrate 11 is high. In this way, the k-selection range of the positions where the spacers 13 are formed is large, and the spacers 13 can be formed at various positions within the surface of the transparent substrate 11. As the material of the spacer 13, anyone who has appropriate dimensional stability or flexibility that can follow the expansion and contraction of the photomask can be used. However, in order to avoid damaging the substrate 2 bonded to the surface layer of the liquid crystal substrate 1, it is preferable to use a material having a lower hardness than the substrate 2. The spacer 13 can be formed, for example, with a PTFE (polytetrafluoroethylene) tape applied with a cementable treatment. As a method for forming the spacer, for example, a material having the above characteristics is formed into a cylindrical shape, and the film thickness is preferably from 20 μm to 500 μm, and more preferably from 50 / xm to 200 μm. νν hardening type or heat hardening type adhesive bonding method, etc. In this embodiment, the shape of the spacer 13 is cylindrical. However, the shape of the spacer 13 is not particularly limited. For example, it may be flange-shaped or band-shaped. In the photomask 10 of this embodiment type, the spacers 13 are formed in the area of the light-shielding layer 12, so that the spacers 13 can be present in various places on the surface of the transparent substrate. According to this, by overlapping the photomask on the bonded liquid crystal substrate 1 in a contact manner, the drooping degree of the photomask 10 can be greatly reduced, so that the photomask and the bonding 97297.doc -12- 200521551 are combined with the liquid crystal substrate. The interval of 1 remains approximately fixed. This can reduce the thickness of the transparent substrate 11 while ensuring pattern accuracy. However, it is preferable that the thickness is such that it does not break due to its own weight when the photomask 1 is not in contact with the bonded liquid crystal substrate 1. For example, when a low-alkali glass substrate with a size of 620 mmx750 mm is used, the thickness is preferably about 0.7 mm. Next, a process for manufacturing a liquid crystal display panel using the photomask 10 of the present invention will be described. First, on one of the substrates 2, a color filter, a light layer, a transparent electrode 6, and a liquid crystal alignment film subjected to a polishing process are sequentially searched by sputtering and printing. In addition, on the other substrate 3, various bus lines, insulating films, TFTs, and pixel transparent electrodes 7 are formed by photolithography and printing methods, and are then opened to cover the pixel transparent electrodes 7. Polished liquid crystal alignment film. A UV-curable peripheral sealing material 4 containing an epoxy resin is formed on the surface of one of the two substrates 2, 3 by a screen printing method or a cloth method '. The pattern of the peripheral sealing material 4 is a closed loop having no opening that functions as a liquid crystal injection port. In the pattern frame of the peripheral sealing material 4, for example, a nematic liquid crystal material is dropped. By bonding the two substrates 2 and 3 in a vacuum processing chamber, the liquid crystal layer 5 is sealed in each liquid crystal display panel. FIG. 4 is a cross-sectional view schematically showing a state when the bonded substrate 丨 and the photomask 丨 are overlapped. As shown in FIG. 4, the photomask 10 is overlapped on the bonded liquid crystal substrate 1 ′, and the spacer 13 of the photomask 10 is in contact with one of the bonded liquid crystal substrates. Transparent substrate! At various places in the plane of i, therefore, by overlapping the photomask 10 on the bonded liquid crystal substrate i in a contact manner, the interval between the photomask 10 and the bonded liquid crystal substrate can be maintained at approximately 97729.doc 200521551. UV light is irradiated onto the bonded liquid crystal substrate 1 through the photomask 10, and only the area of the peripheral sealing material 4 in the surface on which the liquid crystal substrate 1 is bonded is exposed, and the peripheral sealing material 4 is hardened. Next, the bonded liquid crystal substrate is divided into individual panels. After the chamfering step and the polarizing plate attaching step, the driver IC is connected to the terminal 8 ° and the liquid crystal display panel of this embodiment is completed through the above-mentioned steps. In the photomask 10 of this embodiment, the light-shielding layer 12 is formed on one side of the transparent substrate, and the spacers 13 are formed on the light-shielding layer 12, but the light-shielding layer 12 may also be formed on the transparent substrate. On one side, the spacer i 3 is formed on the other side of the transparent substrate 11. In addition, in the liquid crystal display panel of this embodiment, although a TFT is used as a liquid crystal driving element, other active driving elements such as MIM (Metal Insulator Metal) may be used, or may be Passive (multiplexed adapter) drive without drive elements. In addition, the liquid crystal display panel may be any of a transmissive type, a reflective type, and a transmissive and reflective type. In this embodiment, a liquid crystal panel is used as an example of the object to be irradiated with UV light through the photomask 10, but the target substrate is not limited to the liquid crystal panel. For example, PDP (Plasma Display Pand; Plasma Display Panel), organic or inorganic EL (Electro LUminescence) display panel, electrochromic display panel, etc. can also be targeted. As mentioned above, although embodiment of this invention was described, the technical scope of this invention is not limited to the range described in the said embodiment. The above embodiment is an example, and those skilled in the present invention should know that various structural elements described above can be modified in various ways, and 97729.doc -14-200521551 knows that such modified examples also belong to the technical scope of the present invention. The contents disclosed in the specification, drawings, and patent application scope of Patent Application No. 2003-395952, which was contested on November 26, 2003, are included in the detailed specification of this patent by reference. The photomask of this watch can be used as a photomask for a contact system in order to harden a photosensitive sealing material sandwiched between a pair of substrates. [Brief Description of the Drawings] FIG. 1 is a plan view schematically showing a photomask according to the embodiment. FIG. 2 is a plan view of a bonded liquid crystal substrate of a photomask of the heavy-duty method. FIG. 3 is a cross-sectional view of a laminated liquid crystal substrate of a photomask in the vertical mode. FIG. 4 is a cross-sectional view schematically showing a state when the bonded substrate 丨 and the photomask overlap. [Description of main component symbols] 1 Bonded substrate 2, 3 substrate 4 Peripheral sealing material 5, liquid crystal layer 6 Transparent electrode 7 Pixel transparent electrode 8 Terminal 10 Photomask 11 Transparent substrate 12 Light-shielding layer 13 Spacer 97729.doc • 15-