JP2010014764A - Method of manufacturing electro-optical apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase adhesive force between panels with an adhesive when manufacturing an electro-optical apparatus such as a liquid crystal apparatus formed by mutually layering a plurality of liquid crystal panels. <P>SOLUTION: A delay-curing type light curing adhesive is applied on a surface not opposed to a liquid crystal layer (150) of both surfaces of a counter substrate (120) of a first liquid crystal panel (100) to form an uncured adhesive layer (300a). The uncured adhesive layer (300a) is then irradiated with e.g. UV rays from an upper side to form an irradiated adhesive layer (300b). The adhesive layer (300b) begins to be cured after the lapse of a predetermined time from the irradiation with the UV rays. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a technical field of an electro-optical device manufacturing method for manufacturing an electro-optical device such as a liquid crystal display device in which a plurality of liquid crystal panels are stacked on each other.

  In a liquid crystal device which is an example of this type of electro-optical device, a plurality of liquid crystals are used for the purpose of increasing the contrast of an image compared to a single liquid crystal panel, that is, black is displayed with a darker luminance. Panels may be stacked on each other. In such a liquid crystal device, when a plurality of liquid crystal panels are bonded to each other, a photo-curing type adhesive that is superior in optical characteristics to a thermosetting adhesive is usually used so as not to impair the display characteristics of the liquid crystal device. An agent is used (for example, see Patent Documents 1 to 3).

JP 2006-276328 A JP 2007-310161 A JP 2008-15289 A

  However, a liquid crystal panel such as an active matrix liquid crystal panel has a semiconductor element such as a switching TFT for switching control of a pixel portion, various wirings, and a frame-shaped light shielding film called a so-called black matrix. There is a technical problem that it becomes difficult to irradiate light such as UV light to an uncured photocurable adhesive interposed between liquid crystal panels. More specifically, for example, when light is irradiated from the outer surface of two liquid crystal panels that are overlapped with each other via a photo-curable adhesive, a light shielding portion such as a light shielding film formed on the liquid crystal panel. The light is blocked, and the light does not reach the photocurable adhesive, or the light is not irradiated with a sufficient amount of light for curing. Therefore, when the mutual adhesion of the liquid crystal panels due to the curing of the photo-curing adhesive is insufficient, the display performance of the liquid crystal device displaying an image is deteriorated, or the reliability is deteriorated due to insufficient mechanical strength.

  In addition, by increasing the intensity of light or the amount of light emitted toward the photo-curing adhesive, it accelerates the photo-curing of the adhesive and increases the adhesive strength between the liquid crystal panels. Since the irradiation amount of light irradiated to the circuit portion including the semiconductor element such as the TFT and the liquid crystal increases, the electrical characteristics of the circuit portion or the optical characteristics of the liquid crystal are deteriorated.

  In addition, the trouble caused due to insufficient curing of the photo-curing adhesive is not only a decrease in display performance and a decrease in reliability generated in a liquid crystal device in which liquid crystal panels are bonded to each other. This also occurs in a liquid crystal display in which an optical element such as a protective film having a light shielding film formed on a transparent film main body is attached to a display section main body such as a liquid crystal panel via a photocurable adhesive.

  Therefore, the present invention has been made in view of the above-described problems. For example, when manufacturing an electro-optical device such as a liquid crystal device in which a plurality of liquid crystal panels are stacked on each other, the panels between adhesive panels are used. It is an object of the present invention to provide a method for manufacturing an electro-optical device capable of increasing the adhesive force.

  In order to solve the above problems, a method for manufacturing an electro-optical device according to the present invention includes (i) a first substrate, (ii) a second substrate disposed so as to face the first substrate, and (iii) the above-described A first electro-optical panel having a first light modulation layer sandwiched between the first substrate and the second substrate; an optical element stacked on the first electro-optical panel; the first electro-optical panel; An electro-optical device manufacturing method for manufacturing an electro-optical device having an adhesive layer for adhering elements to each other, wherein the delayed curing type photo-curing adhesive is applied to the first electro-optical panel or the optical element. After the application, the irradiation step of irradiating light to the photo-curing adhesive, and before the photo-curing adhesive irradiated with the light is cured, the photo-curing adhesive irradiated with the light before the curing The first electro-optical panel and the optical element are mutually connected. An adhesion step of forming the adhesive layer by curing the photo-curing adhesive irradiated with the light after being superposed and adhering the first electro-optical panel and the optical element to each other through the adhesive layer And.

  According to the method for manufacturing an electro-optical device according to the present invention, the first electro-optical panel is a liquid crystal panel including a first light modulation layer such as a liquid crystal layer, and is mutually connected to the optical element via the adhesive layer. Glued. The first electro-optical panel modulates incident light based on an image signal and displays an image in a display area during operation of the electro-optical device.

  The optical element is stacked on the first electro-optical panel. For example, the modulation element that further modulates the modulated light modulated by the first electro-optical panel, or protects the first electro-optical panel and directly modulates the light. It is a transparent member such as a transparent protective film that transmits light.

  Here, when a photocurable adhesive is used as an adhesive for adhering the first electro-optical panel and the optical element to each other, the transmittance is lowered by the constituent members of the first electro-optical panel and the optical element, and the adhesive Therefore, the photo-curing adhesive cannot be cured, and the first electro-optical panel and the optical element superimposed on each other cannot be bonded.

  Therefore, according to the method for manufacturing an electro-optical device according to the present invention, the photocurable adhesive can be cured by including the irradiation step and the bonding step, and the photocurable adhesive is interposed therebetween. The first electro-optical panel and the optical element can be bonded to each other.

  In the irradiating step, a delayed-curing type photo-curing adhesive is applied to the first electro-optical panel or the optical element, and then the light-curing adhesive is irradiated with light. Here, the “delay curing type” refers to a curing characteristic in which a photocuring adhesive irradiated with light is cured after a certain period of time has elapsed since the photocuring adhesive is irradiated with light such as UV. Therefore, at the time when light is applied to the delayed curable photocurable adhesive, the photocurable adhesive is not cured. Light irradiation such as UV light to the photo-curing adhesive is performed before the second electro-optical panel and the optical element are superimposed on each other.

  In the bonding step, the first electro-optical panel and the optical element are overlapped with each other through the photo-curing adhesive irradiated with the light before the photo-curing adhesive irradiated with the light is cured. Thereafter, the photo-curing adhesive irradiated with the light is cured to form the adhesive layer, and the first electro-optical panel and the optical element are bonded to each other through the adhesive layer.

  According to the bonding step, before the first electro-optical panel and the optical element are stacked on each other, that is, before the light curable adhesive interposed between the first electro-optical panel and the optical element cannot be irradiated with sufficient light. Furthermore, it is possible to irradiate the photocurable adhesive with light in advance. Thereafter, since the photocurable adhesive is cured after the first electro-optical panel and the optical element are overlapped with each other, an adhesive layer can be formed, and the first electro-optical panel and the optical element can be bonded to each other by the adhesive layer. In addition, the display performance of the electro-optical device for displaying an image is improved as compared with the case where the first electro-optical panel and the optical element are bonded to each other with an adhesive having only thermosetting property that does not have photo-curing property. It is possible.

  Therefore, according to the method for manufacturing the electro-optical device according to the present invention, even if the transmittance of the first electro-optical panel and the optical element is low and the integrated light amount necessary for the adhesive cannot be obtained, the first It is possible to bond the electro-optic panel and the optical element to each other.

  In one aspect of the method of manufacturing an electro-optical device according to the invention, the optical element includes (i) a third substrate, (ii) a fourth substrate disposed so as to face the third substrate, and (iii) It may be a second electro-optic panel having a second light modulation layer sandwiched between the third substrate and the fourth substrate.

  According to this aspect, the second electro-optical panel is, for example, a liquid crystal panel including the second light modulation layer such as a liquid crystal layer, like the first electro-optical panel, and the first electro-optical panel via the adhesive layer. Bonded to the panel. According to this aspect, when each of the first electro-optical panel and the second electro-optical panel is a liquid crystal panel, light can be modulated by each liquid crystal layer, and black is sunk blacker than a single liquid crystal panel. It is possible to display with high brightness and to increase the contrast of the image displayed in the display area.

  In this aspect, the first electro-optical panel includes a polarizing plate on a side of the second electro-optical panel facing the second electro-optical panel, and the adhesive layer includes the second electro-optical panel and the polarizing plate. It may be formed between.

  According to this aspect, for example, the UV light incident on the polarizing plate is absorbed by the photocurable adhesive, so that the damage caused by the UV light to the first or second light modulation layer made of liquid crystal or the like can be reduced.

  In another aspect of the method of manufacturing an electro-optical device according to the invention, the first substrate is an element substrate having a semiconductor element that drives a plurality of pixel portions formed in the display region, and the second substrate is The counter substrate is disposed so as to face the element substrate, and the photocurable adhesive may be applied onto the counter substrate in the irradiation step.

  According to this aspect, it is possible to reduce the deterioration of the element caused by irradiating the semiconductor element or the like with light, and to improve the display performance of the electro-optical device.

  In another aspect of the method of manufacturing an electro-optical device according to the invention, the first substrate is an element substrate having a semiconductor element that drives a plurality of pixel portions formed in the display region, and the second substrate is The counter substrate is disposed so as to face the element substrate, and the photocurable adhesive may be applied on the element substrate in the irradiation step.

  According to this aspect, it is possible to reduce the deterioration of the element caused by irradiating the semiconductor element or the like with light, and to improve the display performance of the electro-optical device.

  In another aspect of the method of manufacturing the electro-optical device according to the invention, the adhesive layer has a refractive index substantially the same as that of the surface member on the side adjacent to the adhesive layer of the first electro-optical panel or the second electro-optical panel. In addition, the first electro-optical panel and the second electro-optical panel may be formed on substantially the entire surface facing each other.

  According to this aspect, the first and second electro-optical panels can be bonded to each other without degrading the display performance of the electro-optical device.

  In another aspect of the method for manufacturing an electro-optical device according to the invention, the photo-curing adhesive irradiated with the light may be heated in the bonding step.

  According to this aspect, it is possible to accelerate the curing of the photo-curing adhesive.

  Such an operation and other advantages of the present invention will become apparent from the embodiments described below.

  Hereinafter, embodiments of a method for manufacturing an electro-optical device according to the invention will be described with reference to the drawings. Hereinafter, a method for manufacturing a liquid crystal device will be described as an example of a method for manufacturing an electro-optical device according to the invention.

<First Embodiment>
<1-1: Electro-optical device>
First, a schematic configuration of a liquid crystal device manufactured by the method of manufacturing a liquid crystal device according to the present embodiment will be described with reference to FIGS. FIG. 1 is an exploded perspective view of a liquid crystal device 1 manufactured by the method for manufacturing a liquid crystal device according to the present embodiment. FIG. 2 is a plan view of the liquid crystal device 1 according to the present embodiment. 3 is a cross-sectional view taken along the line III-III ′ of FIG.

  In FIG. 1, a liquid crystal device 1 includes a first liquid crystal panel 100 that is an example of a “first electro-optical panel” of the present invention, a second liquid crystal panel 200 that is an example of a “second electro-optical panel” of the present invention, and The adhesive layer 300 which is an example of the “adhesive layer” of the present invention is provided. In FIG. 1, the liquid crystal device 1 includes a polarizing plate 400 disposed on the upper side of the second liquid crystal panel 200 and a polarizing plate 500 disposed on the lower side of the first liquid crystal panel. The liquid crystal device 1 modulates light source light emitted from a light source (not shown) with two liquid crystal panels, thereby providing a higher contrast than when displaying an image using a single liquid crystal panel, that is, An image can be displayed with a gradation in which black is darker. When the liquid crystal device 1 displays an image, for example, the light source light incident on the image display region 100a which is a typical example of the “display region” of the present invention from the lower side in FIG. The modulated light is modulated by the second liquid crystal panel 200. The modulated light emitted from the image display area 200a of the second liquid crystal panel 200 is emitted upward in the figure through the polarizing plate 400, and corresponds to an image signal in an area overlapping the image display areas 100a and 200a when seen in a plan view. The displayed image is displayed.

  2 and 3, the first liquid crystal panel 100 includes a TFT array substrate 110 which is an example of the “first substrate” of the present invention, a counter substrate 120 which is an example of the “counter substrate” of the present invention, a light shielding film 153a, And a liquid crystal layer 150 as an example of the “first light modulation layer” of the present invention, and a seal portion 152.

  The TFT array substrate 110 is an element substrate on which semiconductor elements such as TFTs formed corresponding to each of a plurality of pixel portions are formed as will be described later. The counter substrate 120 is a substrate in which a color filter or the like is formed, and is configured to be able to emit light source light modulated according to an image signal as color light corresponding to each pixel unit.

  The light shielding film 153a is formed in a peripheral region extending in a frame shape around the image display region 100a so as to surround the image display region 100a. According to such a light shielding film 153a, it is possible to reduce the irradiation of light to the circuit portion formed in the peripheral region on the first liquid crystal panel during the operation of the liquid crystal device 1. Accordingly, it is possible to reduce light leakage or the like generated in the semiconductor element of the circuit portion when irradiated with light, and to reduce malfunction of the liquid crystal device 1. The counter substrate 120 is formed with a light shielding film 153b that overlaps the light shielding film 153a, and shields light incident on the TFT array substrate 110 from the counter substrate 120 side. This can reduce the occurrence of light leakage current in the circuit portion on the TFT array substrate 110.

  The second liquid crystal panel 200 includes a TFT array substrate 210 that is an example of the “third substrate” of the present invention, a counter substrate 220 that is an example of the “fourth substrate” of the present invention, and the “second light shielding film” of the present invention. The light shielding film 253a as an example, the liquid crystal layer 250 as an example of the “second light modulation layer” of the present invention, and a seal portion 253 are provided.

  The light shielding film 253a is formed in a peripheral region extending in a frame shape around the image display region 200a so as to surround the image display region 200a. According to such a light shielding film 253a, it is possible to reduce the irradiation of light to the circuit portion formed in the peripheral region on the second liquid crystal panel during the operation of the liquid crystal device 1. Therefore, it is possible to reduce light leakage or the like generated in the semiconductor element of the circuit portion when irradiated with light, and to reduce malfunction of the liquid crystal device 1. The counter substrate 220 is formed with a light shielding film 253b that overlaps the light shielding film 253a, and shields light incident on the TFT array substrate 210 from the counter substrate 220 side. This can reduce the occurrence of light leakage current in the circuit portion on the TFT array substrate 210.

  The first liquid crystal panel 100 and the second liquid crystal panel 200 are bonded to each other through a transparent adhesive layer 300. The adhesive layer 300 extends from the image display area 200a (100a) to the peripheral area of the image display area 200a (100a) when viewed in a plan view. The adhesive layer 300 is a layered portion obtained by curing a delayed curing type photocuring adhesive.

  Next, a detailed configuration of the first liquid crystal panel 100 will be described with reference to FIGS. 4 to 6. FIG. 4 is a plan view of the first liquid crystal panel 100. 5 is a cross-sectional view taken along the line VV ′ of FIG. The first liquid crystal panel 100 is a liquid crystal device that is driven by a TFT active matrix driving method with a built-in driving circuit. The second liquid crystal panel 200 has the same configuration as that of the first liquid crystal panel 100, and thus a detailed description thereof is omitted.

  4 and 5, in the first liquid crystal panel 100, the TFT array substrate 110 and the counter substrate 120 are arranged to face each other. A liquid crystal layer 150 is sealed between the TFT array substrate 110 and the counter substrate 120. The TFT array substrate 110 and the counter substrate 120 are bonded to each other by a seal portion 152 provided in a seal region located around the image display region 100a.

  The seal portion 152 is made of, for example, an ultraviolet curable resin or a thermosetting resin for bonding the TFT array substrate 110 and the counter substrate 120 to each other, and is applied on the TFT array substrate 110 or the counter substrate 120 in the manufacturing process. , Cured by ultraviolet irradiation, heating or the like. The seal portion 152 includes a gap material such as glass fiber or glass bead for setting the distance (inter-substrate gap) between the TFT array substrate 110 and the counter substrate 120 to a predetermined value.

  In parallel to the inside of the seal area where the seal portion 152 is disposed, light-shielding light-shielding films 153a and 153b that define the frame area of the image display area 10a are provided on the TFT array substrate 110 and the counter substrate 120, respectively. Yes. However, part or all of the light shielding films 153a and 153b may be built in the TFT array substrate 110 and the counter substrate 120, respectively.

  The first liquid crystal panel 100 includes a data line driving circuit 101 and a scanning line driving circuit 104. In the peripheral region, the data line drive circuit 101 and the external circuit connection terminal 102 are provided along one side of the TFT array substrate 110 in a region located outside the seal region where the seal portion 152 is disposed. The scanning line driving circuit 104 is provided along two sides adjacent to the one side so as to be covered with the light shielding films 153a and 153b. The scanning line driving circuit 104 is electrically connected to each other by a plurality of wirings 105 formed so as to be covered with the light shielding films 153a and 153b. Therefore, during operation of the liquid crystal device 1, it is possible to reduce the irradiation of light to circuit portions such as the data line driving circuit 104 formed in the peripheral region on the first liquid crystal panel 100. Therefore, light leakage or the like generated in the semiconductor element of the circuit portion when irradiated with light can be reduced, and malfunction of the liquid crystal device 1 can be reduced.

  At the four corners of the counter substrate 120, vertical conductive members 106 that function as vertical conductive terminals between the TFT array substrate 110 and the counter substrate 120 are disposed. On the other hand, the TFT array substrate 110 is provided with vertical conduction terminals in a region facing these corner portions. Thus, electrical conduction can be established between the TFT array substrate 110 and the counter substrate 120. If the vertical moving material 106 is not required in a transverse electric field mode or the like, it may not be provided.

  In FIG. 5, on the TFT array substrate 110, the alignment film 1 is formed on the plurality of pixel electrodes 9a after the formation of pixel switching TFTs, scanning lines, data lines and the like. On the other hand, on the counter substrate 120, in addition to the counter electrode 121, a lattice-shaped or striped light-shielding film 123, and an alignment film in the uppermost layer portion are formed. The liquid crystal layer 150 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.

  The first liquid crystal panel 100 modulates the light source light incident on the image display region 100a from the lower side in the figure during the operation, that is, the operation of the liquid crystal device 1, and emits the light to the image display region 200a of the second liquid crystal panel 200. To do.

  In addition to the circuit parts such as the data line driving circuit 101 and the scanning line driving circuit 104, the image signal on the image signal line is sampled on the TFT array substrate 110 shown in FIGS. A sampling circuit to be supplied, a precharge circuit for supplying a precharge signal of a predetermined voltage level to a plurality of data lines in advance of an image signal, in order to inspect the quality, defects, etc. of the electro-optical device during manufacturing or at the time of shipment An inspection circuit or the like may be formed.

  Next, a circuit configuration in the image display area 100a will be described with reference to FIG. FIG. 6 is a circuit diagram showing a circuit configuration in the image display area 100a of the first liquid crystal panel 100. As shown in FIG.

  In FIG. 6, each of a plurality of pixel portions 72 formed in a matrix that forms the image display region 100 a of the first liquid crystal panel 100 includes a pixel electrode 9 a, a TFT 30, and a liquid crystal element 150 a. The TFT 30 is electrically connected to the pixel electrode 9a, performs switching control of the pixel electrode 9a during operation of the liquid crystal device 1, and drives the liquid crystal element 150a according to the control. The data line 6a to which the image signal is supplied is electrically connected to the source of the TFT 30. The image signals S1, S2,..., Sn to be written to the data lines 6a may be supplied line-sequentially in this order, or may be supplied for each group to a plurality of adjacent data lines 6a. May be.

  The scanning line 3a is electrically connected to the gate of the TFT 30, and the first liquid crystal panel 100 applies the scanning signals G1, G2,..., Gm to the scanning line 3a in a pulsed manner in this order at a predetermined timing. It is configured to apply line-sequentially. The pixel electrode 9a is electrically connected to the drain of the TFT 30, and the image signal S1, S2,... Supplied from the data line 6a is closed by closing the switch of the TFT 30 serving as a switching element for a certain period. Sn is written at a predetermined timing. Image signals S1, S2,..., Sn written to the liquid crystal via the pixel electrode 9a are held for a certain period with the counter electrode formed on the counter substrate.

  The liquid crystal constituting the liquid crystal element 150a, that is, the liquid crystal constituting the liquid crystal layer 150 modulates light by changing the orientation and order of the molecular assembly depending on the voltage level of the voltage applied to the liquid crystal. Thereby, it is possible to control the gradation of the image displayed in the image display area 100a. If the display mode of the first liquid crystal panel 100 is a normally white mode, the transmittance with respect to the light source light is reduced according to the voltage applied in units of each pixel unit, and if the display mode is a normally black mode, each pixel. The transmittance with respect to the light source light is increased in accordance with the voltage applied in units, and light having a contrast corresponding to the image signal is emitted from the first liquid crystal panel 100 as a whole. The storage capacitor 70 has one terminal connected to the fixed potential line 310, and is added in parallel with the liquid crystal element 150a formed between the pixel electrode 9a and the counter electrode 121 in order to prevent the image signal from leaking. Yes.

<2-1: Manufacturing Method of Electro-Optical Device>
Next, a method for manufacturing the liquid crystal device according to the present embodiment will be described with reference to FIGS. FIG. 7 is a flowchart sequentially illustrating the main steps of the method for manufacturing the liquid crystal device according to the present embodiment. FIG. 8 is a process cross-sectional view showing in detail a part of the process of the manufacturing method of the liquid crystal device according to the present embodiment. In this embodiment, steps S11 and S12 described later constitute an example of the “irradiation step” of the present invention, and steps S31 and S32 constitute an example of the “adhesion step” of the present invention. .

  As shown in FIG. 7, the formation of the first liquid crystal panel 100 (step S10) and the formation of the second liquid crystal panel 200 (step S20) are performed in parallel or in succession. Next, a delay curable photocurable adhesive is applied to the first liquid crystal panel 100 (step S11), and then the applied photocurable adhesive is irradiated with light (step S12).

  More specifically, as shown in FIG. 8A, delayed curing is performed on the surface of the counter substrate 120 of the first liquid crystal panel 100, in other words, on the surface of the counter substrate 120 that does not face the liquid crystal layer 150. A mold photo-curing adhesive is applied to form an uncured adhesive layer 300a. Next, as shown in FIG. 8B, from the upper side in the figure, for example, UV light is irradiated onto the uncured adhesive layer 300a to form the light-irradiated adhesive layer 300b. The adhesive layer 300b starts to harden after a predetermined time has elapsed since the UV light was irradiated.

  In addition, by irradiating light to the adhesive applied on the counter substrate 210, it is possible to reduce light from being irradiated to circuit portions such as semiconductor elements formed on the TFT array substrate 110 and the counter substrate 120, respectively. it can. Thereby, deterioration of the element can be reduced and the display performance of the liquid crystal device 1 can be improved.

  In FIG. 7 again, the first liquid crystal panel 100 and the second liquid crystal panel 200 are overlapped with each other through the adhesive layer 300b before the adhesive layer 300b made of the photo-curing adhesive irradiated with light is cured. Thereafter, the first liquid crystal panel 100 and the second liquid crystal panel 200 are bonded to each other through the adhesive layer 300 formed by curing the uncured adhesive layer 300b (step S31).

  As described above, the first liquid crystal panel 100 and the second liquid crystal panel are bonded to each other through the adhesive layer 300 formed of the delayed-curing type photo-curing adhesive. 2 Light is not blocked or dimmed by optical members such as the light shielding films 153a, 153b, 253a, and 253b, which are constituent members of the liquid crystal panel 200, and circuits, polarizing plates, and color filters disposed in the periphery. The first liquid crystal panel 100 and the second liquid crystal panel 200 are bonded to each other, and the liquid crystal device 1 in which a plurality of liquid crystal panels are stacked can be manufactured.

  In addition, according to the method for manufacturing a liquid crystal device according to the present embodiment, an adhesive having only thermosetting properties that does not have photocurability is usually light transmissive compared to an adhesive having photocurability properties. The optical properties such as refractive index and refractive index are relatively inferior. However, according to the manufacturing method of the liquid crystal device according to the present embodiment, it is not necessary to irradiate the adhesive with light after the plurality of liquid crystal panels are overlapped with each other. Thus, the display performance of the liquid crystal device 1 for displaying an image can be improved as compared with the case where a plurality of liquid crystal panels are bonded to each other.

  In addition, according to the manufacturing method of the liquid crystal device according to this embodiment, after the uncured adhesive layer 300b is cured, or in parallel with the curing process in which the adhesive layer 300b is cured, the adhesive layer 300b is heated. Good (step S32). In addition to photocuring property, it is possible to accelerate | stimulate hardening of a photocuring adhesive agent by using the adhesive which has thermosetting, and adding a heating process.

<1-3: Modification of Electro-Optical Device>
Next, a modification of the liquid crystal device 1 will be described with reference to FIG. FIG. 9 is a cross-sectional view illustrating a configuration of a modification of the liquid crystal device 1. In the following description, parts common to the liquid crystal device 1 are denoted by common reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 9, the liquid crystal device 1 a according to the modification includes a polarizing plate 600 disposed on the side facing the second liquid crystal panel 200 when viewed from the first liquid crystal panel 100, and is a delayed curing type light. It differs from the liquid crystal device 1 in that an adhesive layer 300c formed by curing a cured adhesive is formed between the first liquid crystal panel 100 and the adhesive layer 300c.

  According to the adhesive layer 300c formed between the first liquid crystal panel 100 and the polarizing plate 600, for example, UV light incident on the polarizing plate 600 is absorbed by the photo-curable adhesive, and thus the liquid crystal layer 150 made of liquid crystal or the like. There is an advantage that damage caused by UV light can be reduced. Even when the adhesive layer 300c is formed between the second liquid crystal panel 200 and the polarizing plate 600, the same advantage can be obtained. The same advantage can be obtained even when the adhesive layer 300c is formed between the polarizing plate 600 and each of the first liquid crystal panel 100 and the second liquid crystal panel.

  Like the liquid crystal device 1, such a liquid crystal device 1 a irradiates light before the first liquid crystal panel 100, the second liquid crystal panel 200, and the polarizing plate 600 are overlapped with each other. Can be bonded by curing after overlapping.

Second Embodiment
Next, another embodiment of the method for manufacturing an electro-optical device according to the present invention and the configuration of the electro-optical device that can be manufactured by the manufacturing method will be described with reference to FIGS.

<2-1: Electro-optical device>
With reference to FIGS. 10 and 11, a configuration of a liquid crystal device which is an embodiment of the electro-optical device according to the present embodiment will be described. FIG. 10 is a plan view of the liquid crystal device according to the present embodiment. 11 is a cross-sectional view taken along the line XI-XI ′ of FIG.

  As shown in FIGS. 10 and 11, the liquid crystal device 1 b according to this embodiment includes a first liquid crystal panel 100, an adhesive layer 301 obtained by curing a delayed-curing photocuring adhesive, and an adhesive layer 301. A flat protective film 700 adhered to the first liquid crystal panel 100 and a light shielding film 153c formed around the image display region 100a are provided.

  The protective film 700 is an example of the “optical element” in the present invention, and is made of a transparent member such as glass. The protective film 700 protects the first liquid crystal panel 100 so that the instruction means does not directly touch the first liquid crystal panel 100 and transmits the display light emitted from the image display region 100a.

  The light shielding film 153c is formed in an area overlapping with each of the light shielding films 153a and 153b, and defines an area where an image is displayed in the in-plane area of the display surface 700S. According to the light shielding film 153c, after the protective film 700 and the first liquid crystal panel 100 are overlapped with each other, it is difficult to irradiate light to a portion of the uncured adhesive layer 301 that overlaps the light shielding film. It becomes difficult to bond the first liquid crystal panel 100 and the protective film 700 to each other via 301.

  However, similarly to the method for manufacturing the liquid crystal device according to the first embodiment, the first liquid crystal panel 100 and the protective film 700 are firmly adhered to each other with no gap by configuring the adhesive layer 301 with a delayed-curing type photo-curing adhesive. Therefore, reflection of light at the interface between the first liquid crystal panel 100 and the protective film 700 can be reduced, and the display performance of the liquid crystal device 1b can be improved.

<2-2: Electro-optical device manufacturing method>
Next, a method for manufacturing the liquid crystal device according to the present embodiment will be described with reference to FIGS. FIG. 12 is a flowchart showing in sequence the main steps in the method of manufacturing a liquid crystal device according to this embodiment. FIG. 13 is a process cross-sectional view showing in detail some steps of the method for manufacturing the liquid crystal device according to the present embodiment.

  As shown in FIG. 12, the first liquid crystal panel 100 is formed (step S10), and a delayed curing type photo-curing adhesive is applied on the first liquid crystal panel 100 (step S11). Next, the applied adhesive is irradiated with UV light (step S12). Thereafter, the first liquid crystal panel 100 and the protective film 700 are overlapped with each other via an uncured adhesive, and then the first liquid crystal panel 100 and the protection are secured via an adhesive that is cured after a predetermined time has elapsed from the time of light irradiation. The films 700 are bonded to each other (step S131).

  More specifically, as shown in FIG. 13A, an uncured adhesive layer 301a is formed by applying a delayed curing type photocuring adhesive to the surface of the counter substrate 120. Next, as shown in FIG. 13B, the uncured adhesive layer 301a is irradiated with light such as UV light, and the uncured adhesive layer 301a is protected on the first liquid crystal panel 100 before the uncured adhesive layer 301a is cured. The film 700 is placed so as to overlap. Thereafter, the adhesive layer 301 is formed by curing the uncured adhesive layer 301a after a certain period of time, and the liquid crystal device 1b is formed.

  In addition, as shown in FIG. 12, it is also possible to heat the applied adhesive in parallel with step S131, or to accelerate curing (step S32).

Therefore, according to the manufacturing method of the liquid crystal device according to the present embodiment, the first liquid crystal panel 100 and the protective film are provided even when the first liquid crystal panel 100 and the protective film 700 have a light shielding region and light is blocked. 700 can be glued together. In addition, since the protective film 700, which is a transparent member such as a transparent protective film, and the first liquid crystal panel 100 can be bonded to each other by the adhesive layer 301, light near the interface between the protective film 700 and the first liquid crystal panel 100 can be used. The reflection performance of the liquid crystal device 1b can be improved.
In the above, an example in which a light shielding film is formed on the protective film has been described, but the same effect can be obtained if there is a member whose light is attenuated by a colored layer or the like even if it is not a light shielding film. Further, even if there is no light-shielding film for the first liquid crystal panel, the same effect can be obtained because the light is reduced or shielded by optical members such as a circuit, a polarizing plate and a color filter disposed in the periphery.
As another example of the “optical element” of the present invention, there is a touch sensor or the like that is disposed on the liquid crystal device 1b and detects a position indicated by an instruction means such as a finger or a pen. In such a touch sensor as well, the light is reduced or reduced by a normal polarizing plate or a circular polarizing plate disposed on the surface for suppressing reflected light from the touch sensor, such as a light shielding film or a colored layer, as in the protective film. Since the light is shielded, the same effect can be obtained.

1 is an exploded perspective view showing a schematic configuration of a liquid crystal device according to a first embodiment of the present invention. 1 is a plan view of a liquid crystal device according to a first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along the line III-III ′ of FIG. 1. It is a top view of the 1st liquid crystal panel. FIG. 5 is a VV ′ cross-sectional view of FIG. 4. FIG. 3 is a circuit diagram illustrating a circuit configuration in an image display area of the liquid crystal device according to the first embodiment of the present invention. 4 is a flowchart sequentially illustrating main steps of the method for manufacturing the liquid crystal device according to the first embodiment of the present invention. It is process sectional drawing which showed the one part process of the manufacturing method of the liquid crystal device which concerns on 1st Embodiment of this invention in detail. It is sectional drawing which concerns on the modification of the liquid crystal device which concerns on 1st Embodiment of this invention. It is the top view which showed the structure of the liquid crystal device which concerns on 2nd Embodiment of this invention. It is XI-XI 'sectional drawing of FIG. 6 is a flowchart sequentially illustrating main steps of a method for manufacturing a liquid crystal device according to a second embodiment of the present invention. It is process sectional drawing which showed the one part process of the manufacturing method of the liquid crystal device which concerns on 2nd Embodiment of this invention in detail.

Explanation of symbols

1, 1a, 1b ... Liquid crystal device, 110, 210 ... TFT array substrate, 120, 220 ... Counter substrate, 300, 301 ... Adhesive layer, 153a, 153b, 153c, 253a, 253b ...・ Light shielding film

Claims (7)

(Ii) a first substrate; (ii) a second substrate disposed to face the first substrate; and (iii) a first light modulation layer sandwiched between the first substrate and the second substrate. To manufacture an electro-optical device comprising: a first electro-optical panel having an optical element stacked on the first electro-optical panel; and an adhesive layer that bonds the first electro-optical panel and the optical element to each other. A method of manufacturing the electro-optical device of
An irradiation step of irradiating the photo-curing adhesive with light after applying a delayed-curing photo-curing adhesive to the first electro-optical panel or the optical element;
Prior to curing of the light-curing adhesive irradiated with the light, the first electro-optical panel and the optical element are overlapped with each other via the light-curing adhesive irradiated with the light, and then the light An adhesive step of forming the adhesive layer by curing the photo-curing adhesive that has been irradiated with the adhesive, and adhering the first electro-optical panel and the optical element to each other through the adhesive layer. A method for manufacturing an electro-optical device. The optical element includes (i) a third substrate, (ii) a fourth substrate disposed so as to face the third substrate, and (iii) a second substrate sandwiched between the third substrate and the fourth substrate. The method of manufacturing an electro-optical device according to claim 1, wherein the electro-optical device is a second electro-optical panel having two light modulation layers. The first electro-optical panel includes a polarizing plate on a side of the second electro-optical panel facing the second electro-optical panel,
The method of manufacturing an electro-optical device according to claim 2, wherein the adhesive layer is formed between the second electro-optical panel and the polarizing plate. The first substrate is an element substrate having a semiconductor element that drives a plurality of pixel portions formed in the display region,
The second substrate is a counter substrate disposed to face the element substrate;
4. The method of manufacturing an electro-optical device according to claim 1, wherein in the irradiation step, the photocurable adhesive is applied on the counter substrate. 5. The first substrate is an element substrate having a semiconductor element that drives a plurality of pixel portions formed in the display region,
The second substrate is a counter substrate disposed to face the element substrate;
4. The method of manufacturing an electro-optical device according to claim 1, wherein in the irradiation step, the photocurable adhesive is applied onto the element substrate. 5.   The adhesive layer has substantially the same refractive index as that of the surface member adjacent to the adhesive layer of the first electro-optical panel or the second electro-optical panel, and the first electro-optical panel and the second electro-optical panel have the same refractive index. 4. The method of manufacturing an electro-optical device according to claim 2, wherein the electro-optical device is formed on substantially the entire surface facing each other. 5. 5. The method of manufacturing an electro-optical device according to claim 1, wherein, in the bonding step, the photo-curing adhesive irradiated with the light is heated.

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