JP2007298608A - Method for manufacturing optical component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical component, with which color shift and degradation of resolution are reduced. <P>SOLUTION: In the method for fabricating an optical component by bonding and fixing optical components 5, 11 together with a photocurable adhesive 17, light alternately irradiates the photocurable adhesive at a first illuminance H1 and at a second illuminance H2 that is lower than the first illuminance for making the photocurable adhesive cured. The light irradiates the photocurable adhesive from a plurality of different directions. Optical components can be bonded and fixed together, at a plurality of places with photocuring adhesives. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an optical component, and more particularly to a method for manufacturing an optical component used in an imaging apparatus such as a video camera.

As one form of an optical component used in an imaging apparatus such as a video camera, incident light is decomposed into light of different wavelengths, for example, three primary colors {R (red), G (green), B (blue)} of light. Solid-state image sensor prism assembly comprising a color separation prism and three solid-state image sensors that separately receive each incident light (referred to as R light, G light, and B light) color-separated by the color separation prism There is.
A video camera using the above-described solid-state imaging element prism assembly is called a three-plate type video camera, and this three-plate type video camera generally performs color separation using a color filter or the like to perform one solid-state imaging. Compared with a video camera that receives light from the element, it is possible to perform imaging with better image quality in color reproducibility and the like.

An example of a manufacturing method of this solid-state imaging element prism assembly is described in Patent Document 1.
JP 2005-227365 A

By the way, as the resolution of an imaging device such as a video camera is increased, the resolution of a solid-state imaging device is required to be increased. In order to increase the resolution without increasing the outer shape of the solid-state image sensor, studies have been made to reduce the pixel area of the solid-state image sensor.
In the case of a three-plate video camera, if the pixel area of the solid-state image sensor is reduced, high alignment accuracy between the solid-state image sensors (R, G, B) is required. However, these solid-state image sensors are used as color separation prisms. When the adhesive is fixed using an adhesive or the like, the position of the solid-state imaging element that has been aligned in advance may be displaced due to the curing shrinkage of the adhesive when the adhesive is cured.
For example, when the size of one pixel is 2.5 μm square, if the alignment accuracy between the solid-state imaging devices is larger than ± (plus / minus) 20% (corresponding to ± 0.5 μm), the color shift and resolution deteriorate. Such a problem may occur.

  Therefore, the problem to be solved by the present invention is to provide a method of manufacturing an optical component that reduces color misregistration and resolution deterioration.

In order to solve the above problems, each invention of the present application has the following means.
1) In the method of manufacturing an optical component formed by bonding and fixing the optical components (5, 11) using a photocurable adhesive (17), the first illuminance is applied to the photocurable adhesive. (H1) and a second illuminance (L1) lower than the first illuminance, and alternately irradiating the photocurable adhesive, thereby curing the photocurable adhesive, and manufacturing an optical component Is the method.
2) In the curing step, the light curable adhesive is irradiated with the light from a plurality of different directions.
3) In the method of manufacturing an optical component in which the optical components (5, 11) are bonded and fixed to each other at a plurality of locations with a photocurable adhesive (17), the photocurable adhesives (17a, 17b, 17c and 17d) are irradiated with light alternately with a first illuminance (H1) and a second illuminance (L1) lower than the first illuminance, thereby curing each of the photocurable adhesives. It is a manufacturing method of the optical component characterized by having a hardening process.
4) The method for producing an optical component according to 3), wherein, in the curing step, the light is irradiated onto each of the photocurable adhesives from a plurality of different directions.
5) In the method for producing an optical component according to 4), in the curing step, it is possible to independently set a light amount for each predetermined time of the light irradiated to each of the photocurable adhesives. is there.
6) In the process of curing each of the photocurable adhesives, when the other of the optical components is displaced in one direction, the photocurable adhesive is positioned in a direction opposite to the one direction. 5. The optical system according to item 5), wherein the amount of light irradiating the agent per predetermined time is larger than the amount of light irradiating the photocurable adhesive located in the one direction per predetermined time. It is a manufacturing method of components.
7) The method for manufacturing an optical component according to any one of 1) to 6), wherein in the curing step, the light amount of the light per predetermined time is increased gradually or stepwise. It is.

According to the optical component manufacturing method described in the above items 1) to 6) according to the present invention, it is possible to reduce color misregistration and resolution deterioration.
In addition, according to the method of manufacturing an optical component described in the above item 7) according to the present invention, it is possible to reduce color shift and deterioration of resolution, and it is possible to reduce the time for irradiating light to the photocurable adhesive. Can be improved.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to FIGS.
In the embodiments of the optical component manufacturing method of the present invention, a method for bonding and fixing the solid-state imaging device to the color separation prism by different bonding methods will be described below as first to third embodiments.
FIG. 1 is a schematic cross-sectional view for explaining a solid-state imaging element prism assembly in first to third embodiments of a method for manufacturing an optical component according to the present invention.
2 and 3 are a schematic cross-sectional view and a plan view for explaining the first embodiment of the optical component manufacturing method of the present invention.
4 to 6 are perspective views for explaining a first embodiment of the method of manufacturing an optical component according to the present invention.
FIG. 7 is a schematic diagram for explaining a method for adjusting the position of the solid-state imaging device.
FIG. 8 is a perspective view and a schematic view for explaining the first embodiment of the method for producing an optical component of the present invention.
FIG. 9 is a plan view for explaining a second embodiment of the optical component manufacturing method of the present invention.
FIG. 10 is a perspective view and a plan view for explaining a second embodiment of the optical component manufacturing method of the present invention.

First, the configuration of solid-state image sensor prism assemblies 50, 100, and 150, which are one form of optical components manufactured by the procedures of first to third embodiments described later, will be described with reference to FIG.
As shown in FIG. 1, the solid-state image pickup device prism assembly 50, 100, 150 includes a color separation prism 5 in which three prisms 1, 2, 3 are integrally bonded together by a known method, and one surface of the prism 1. A first solid-state imaging device 9 bonded and fixed to the 1a side; a second solid-state imaging device 10 bonded and fixed to the one surface 2a side of the prism 2; and a third solid-state image fixed to the first surface 3a side of the prism 3 And a solid-state image sensor 11.
Each solid-state image sensor 9, 10, 11 has light receiving areas 9a, 10a, 11a in which a plurality of pixels are formed.

Here, the prism 1 is referred to as a G prism 1, the prism 2 is referred to as a B prism 2, and the prism 3 is referred to as an R prism 3.
The solid-state imaging devices 9, 10, and 11 are CCD (Charge Coupled Devices), MOS (Metal Oxide Semiconductor), CMOS (Complementary Metal Oxide Semiconductor), and the like.

The surface 1b of the G prism 1 on the side to be joined with the B prism 2 reflects only the green light component (sometimes referred to as G light) in the region having a wavelength near 500 nm and transmits the light components of other colors. A first dichroic film 13 is formed.
Further, the surface 2b of the B prism 2 on the side to be bonded to the R prism 3 reflects only the blue light component (sometimes referred to as B light) in the region having a wavelength of around 450 nm to reflect light components of other colors. A second dichroic film 15 to be transmitted is formed.
These first and second dichroic films 13 and 15 can be formed by a known method.

  Further, the one surface 1 a, 2 a, 3 a side of the three prisms 1, 2, 3 and the solid-state imaging devices 9, 10, 11 are fixed by a photo-curable adhesive 17, respectively.

Next, the function of the above-described solid-state image sensor prism assembly 50, 100, 150 will be described.
As shown in FIG. 1, incident light L transmitted from the outside through the imaging lens 18 enters the G prism 1 from the incident surface 1 c side of the G prism 1.
The incident light L incident on the inside of the G prism 1 is reflected only by the first dichroic film 13 and the G light reflected by the first dichroic film 13 is the first solid-state imaging device. 9 is incident on the light receiving region 9a.
The incident light L transmitted through the first dichroic film 13 becomes incident light L1 containing no green light component, and this incident light L1 enters the inside of the B prism 2, and only the B light is incident on the second dichroic film 15. The B light reflected by the second dichroic film 15 is incident on the light receiving region 10a of the second solid-state imaging device 10.
The incident light L1 that has passed through the second dichroic film 15 becomes incident light L2 that is a red light component (sometimes referred to as R light), and this incident light L2 passes through the G prism 3 and passes through the third solid state. The light enters the light receiving region 11 a of the image sensor 11.

  Each solid-state imaging device 9, 10, 11 receives incident light (G light, B light, R light) incident on the light receiving regions 9a, 10a, 11a, respectively, as a G image signal, a B image signal, and an R image. Output as a signal.

  In addition, these image signals output from the above-described solid-state imaging element prism assemblies 50, 100, and 150 can be recorded on a recording medium or displayed as a full-color image.

Next, a method for manufacturing the above-described solid-state image pickup element prism assembly 50, particularly a method for bonding and fixing the solid-state image pickup element to the color separation prism by the first bonding method will be described as a first embodiment.
In the first embodiment, a method of bonding and fixing the third solid-state imaging device 11 to the one surface 3a of the R prism 3 in the color separation prism 5 by the first bonding method will be described with reference to FIGS. .

<First embodiment>
First, as shown in FIG. 2, the above-described color separation prism 5 is formed by a known method.
Next, as shown in FIG. 3, a predetermined amount of liquid or ink-like photocurable resin 17 is provided in the vicinity of the four corners of the outer peripheral portion of the surface of the third solid-state imaging device 11 on the side having the light receiving region 11a. Are applied respectively. The photocurable resin 17 applied in the vicinity of the four corners will be referred to as photocurable resins 17a, 17b, 17c, and 17d.
In the first embodiment, the external perspective dimension of the third solid-state image sensor 11 is 10 mm square, and the external dimension of the light receiving region 11 a formed at the center of the third solid-state image sensor 11 is 4 mm square.
Further, as a photocurable resin 17, the accumulated amount of light necessary for curing is used as the ^{3000mJ / cm 2 ~5000mJ / cm 2} .

When the photocurable resins 17 a, 17 b, 17 c, and 17 d are applied to the third solid-state imaging device 11, the third solid-state imaging device 11 is bonded and fixed to the one surface 3 a of the R prism 3 in the color separation prism 5. The application positions and application amounts of the photocurable resins 17a, 17b, 17c, and 17d are set so that the photocurable resins 17a, 17b, 17c, and 17d do not reach the light receiving region 11a of the third solid-state imaging device 11, respectively. It is desirable to do.
Therefore, in the first embodiment, the external perspective dimensions of the photocurable resins 17a, 17b, 17c, and 17d when the third solid-state imaging device 11 is bonded and fixed to the one surface 3a of the R prism 3 (broken line in FIG. 3). R17a, R17b, R17c, and R17d are each 2 mm in diameter, and gaps s17a, s17b, s17c, and s17d between the photocurable resins 17a, 17b, 17c, and 17d and the light receiving region 11a are respectively provided. The application position and application amount of the photocurable resins 17a, 17b, 17c, and 17d were set so as to be 0.5 mm.

Next, a method of fixing the third solid-state imaging element 11 to the one surface 3a of the R prism 3 in the color separation prism 5 with the photocurable resins 17a, 17b, 17c, and 17d using the element bonding apparatus 20 shown in FIG. Will be described.
In FIG. 4, the third solid-state imaging device 11, the color separation prism 5, and the photocurable resins 17a, 17b, 17c, and 17d are indicated by broken lines.

First, the element bonding apparatus 20 will be described.
As shown in FIG. 4, the element bonding apparatus 20 includes a stage 21 for fixing the color separation prism 5, a holding unit 22 for holding the third solid-state imaging device 11, and a holding unit 22 in the x and y directions, which will be described later. , Z direction, θa direction, θb direction, θc direction, a driving unit 23 that moves and rotates, a first light source unit 24 that emits R light, G light, and B light each having a predetermined image pattern, and a photocurable resin 17a. , 17b, 17c, and 17d are irradiated with light to cure the photocurable resins 17a, 17b, 17c, and 17d, and the irradiation units 25a, 25b, 25c, and 25d are irradiated with light. Has a second light source unit 26 for supplying.
The stage 21 is made of a transparent member that can transmit G light, B light, and R light, respectively.
The first light source unit 24 is disposed on the side opposite to the side on which the color separation prism 5 of the stage 21 is fixed, and the emitted R light, G light, and B light are applied to the color separation prism 5. Is arranged.
The irradiation units 25a, 25b, 25c, and 25d are light beams that are used when the third solid-state imaging device 11 is bonded and fixed to the one surface 3a of the R prism 3 of the color separation prism 5 with the photocurable resins 17a, 17b, 17c, and 17d. It arrange | positions so that it may each be located in each vicinity of curable resin 17a, 17b, 17c, 17d.

  Next, a method of bonding and fixing the third solid-state imaging device 11 to the one surface 3a of the R prism 3 in the color separation prism 5 with the photocurable resins 17a, 17b, 17c, and 17d using the element bonding apparatus 20 will be described. 5 and FIG.

First, as shown in FIG. 5, the color separation prism 5 is fixed to the stage 21, and the surface of the third solid-state imaging device 11 opposite to the surface on which the light receiving region 11 a is formed is held by the holding unit 22. Hold on.
Next, as shown in FIG. 6, the surface of the third solid-state imaging device 11 on which the light receiving region 11 a is formed and the one surface 3 a of the R prism 3 in the color separation prism 5 are substantially parallel to each other. The holding portion 22 is moved so that the resins 17a, 17b, 17c, and 17d are in contact with the one surface 3a of the R prism 3, respectively.

Thereafter, R light having a predetermined image pattern is transmitted from the first light source unit 24 through the stage 21 and the color separation prism 5 to irradiate the light receiving region 11 a of the third solid-state imaging device 11.
The R light irradiated on the light receiving area 11a is converted into an image signal, and this image pattern is displayed on a monitor (not shown). This displayed image pattern is referred to as an image pattern 28R.
Then, the holding unit 22 is moved and rotated in the x, y, z, θa, θb, and θc directions shown in FIG. 6 so that the image pattern 28R matches the preset reference pattern 30. Thus, the position of the third solid-state image sensor 11 is adjusted.

Here, a method for adjusting the position of the solid-state imaging device will be described with reference to FIG.
As a method for adjusting the position of the solid-state imaging device, for example, there are the following five items.
(A) Horizontal and vertical shift adjustment As shown in FIG. 7A, the image pattern 28R is aligned in the horizontal direction (lateral direction in FIG. 7) and vertical direction (vertical direction in FIG. 7) so as to coincide with the reference pattern 30. (Direction).
The image pattern can be shifted in the horizontal direction by moving the holding portion 22 in the element bonding apparatus 20 described above in the x direction shown in FIG. 5, and the image pattern can be shifted in the vertical direction by moving in the y direction. Can be made.
(B) Rotation Adjustment As shown in FIG. 7B, the image pattern 28R is rotated in the direction of the arrow so as to coincide with the reference pattern 30.
By rotating the holding portion 22 in the θa direction shown in FIG. 5, the image pattern 28R can be rotated in the direction of the arrow shown in FIG. 8 or in the direction opposite to the arrow.
(C) Registration Adjustment In addition to the third solid-state image pickup device 11, the first solid-state image pickup device 9 and the second solid-state image pickup device 10 are also subjected to the shift adjustment and the rotation adjustment described above, respectively. ), Corresponding pixels of each image pattern (R image pattern, G image pattern, B image pattern) are matched.
In FIG. 7C, the G image pattern 28G and the B image pattern 28B are respectively aligned with the R image pattern 28R, but the present invention is not limited to this, and the R image pattern is included in the G image pattern 28G. The 28R and B image patterns 28B may be aligned with each other, and the R image pattern 28R and the G image pattern 28G may be aligned with the B image pattern 28B, respectively.
(D) Back focus adjustment The focus adjustment of the image pattern 28R is performed so that the surface on which the light receiving region 11a of the third solid-state imaging device 11 is formed becomes the imaging surface. The focus adjustment of the image pattern can be performed by moving the holding unit 20 in the z direction (corresponding to the optical axis direction of the G light) shown in FIG.
(E) Tilt adjustment The horizontal and vertical focus adjustment of the image pattern 28R is performed. The horizontal focus adjustment of the image pattern can be performed by moving the holding unit 22 in the θb direction shown in FIG. 6, and the vertical focus adjustment of the image pattern can be performed by moving the holding unit 22 in the θc direction. it can.

Next, as shown in FIG. 8A, in a state where the third solid-state imaging device 11 whose position is adjusted by the position adjustment method described above is held by the holding unit 22, for example, the irradiation units 25a, 25b, 25c, The light curable resins 17a, 17b, 17c, and 17d are cured by irradiating light from 25d.
Normally, when curing a photocurable resin, light is irradiated for a predetermined time at a constant illuminance, but in the first embodiment, as shown in FIG. One of the features is that the photo-curable resins 17a, 17b, 17c, and 17d are cured by alternately irradiating with (H1> L1).

The method of irradiating light with a constant illuminance H1 is advantageous for improving the productivity because the photocurable resin can be cured in a relatively short time, but the amount of curing shrinkage during curing is large. Due to this curing shrinkage, the third solid-state imaging device 11 may shift after curing.
On the other hand, the method of irradiating light having an illuminance (<H1) lower than the illuminance H1 has a small amount of curing shrinkage at the time of curing, so that the amount of deviation of the third solid-state imaging element 11 after curing can be reduced by this curing shrinkage. However, the photocurable resin may not be sufficiently cured even if the curing reaction is delayed and a predetermined integrated light amount is reached.
In addition, this method of irradiating light with low illuminance results in a portion where the crosslinking reaction does not occur at low illuminance, so the crosslink density of the cured photocurable resin is lower than when cured at illuminance H1, The strength of the resin itself may be reduced.
Therefore, as a result of intensive experiments by the inventors, the amount of curing shrinkage can be reduced by irradiating light alternately with different illuminances H1, L1 (H1> L1), and the photocurable resin can be sufficiently applied with a predetermined integrated light amount. It was found that it can be cured.

In the first embodiment, the illuminance H1 is 500 mW / cm ² , the illuminance L1 is 100 mW / cm ² , the irradiation time T1 at the illuminance H1 and the irradiation time T2 at the illuminance L1 are each 1 second, and the integrated light amount is 4000 mJ / cm ^2. Irradiated so that

Further, the curing rate of the photocurable resin can be adjusted by the illuminances H1 and L1 and the irradiation times T1 and T2.
For example, when the integrated light quantity is constant, by reducing at least one of the illuminances H1 and L1, and by increasing the ratio (T2 / T1) of the irradiation time T2 to the irradiation time T1, the photocurable resin The curing rate of can be slowed.
In addition, the slower the curing speed of the photocurable resin, the longer the time until the photocurable resin is cured and the worse the productivity. Therefore, the shrinkage of productivity and shrinkage of curing in the photocurable resin. It is desirable to set the optimal illuminances H1, L1 and irradiation times T1, T2 in balance.

The photocurable resins 17a, 17b, 17c, and 17d are respectively cured by the irradiation method described above, and the third solid-state imaging device 11 is bonded and fixed to the one surface 3a of the R prism 3 in the color separation prism 5. In this state, the cured photocurable resins 17a, 17b, 17c, and 17d have residual stress due to curing shrinkage because the third solid-state imaging device 11 is held by the holding unit 22.
Thereafter, the holding unit 22 holding the third solid-state image sensor 11 is retracted from the solid-state image sensor 11. At that time, the photocurable resins 17a, 17b, 17c, and 17d are deformed in the directions in which the respective residual stresses work, and the solid-state imaging device 11 is shifted in the direction of the surface 3a of the R prism 3 along with the deformation.
However, since the cured shrinkage amount of the cured photocurable resins 17a, 17b, 17c, and 17d is reduced by the irradiation method described above, the shift amount of the solid-state imaging device 11 due to the cure shrinkage is reduced.
It was confirmed that the deviation amount of the solid-state imaging device 11 in the direction of the surface 3a of the R prism 3 was 0.2 μm according to the irradiation conditions in the first example.

As described above, in the first embodiment, the method of fixing the third solid-state imaging device 11 to the one surface 3 a of the R prism 3 in the color separation prism 5 has been described. However, one surface 1 a of the G prism 1 in the color separation prism 5. The method for fixing the first solid-state imaging device 9 and the method for fixing the second solid-state imaging device 10 to the one surface 2a of the B prism 2 in the color separation prism 5 are also the same methods as described above. be able to.
Then, using the same method as described above, the first solid-state imaging device 9 is further fixed to the one surface 1a of the G prism 1, and the second solid-state imaging device 10 is fixed to the one surface 2a of the B prism 2. Thus, the above-described solid-state image sensor prism assembly 50 is obtained.

Next, a method for manufacturing the solid-state image sensor prism assembly 100, which is an embodiment of the optical component, in particular, a method for bonding and fixing the solid-state image sensor to the color separation prism by the second bonding method will be described as a second embodiment.
In the second embodiment, as in the first embodiment, a method of bonding and fixing the third solid-state imaging device 11 to the one surface 3a of the R prism 3 in the color separation prism 5 will be described with reference to FIG.
FIG. 9 is a perspective plan view of the vicinity of the irradiation part in the element bonding apparatus 20 as viewed from above in FIG.

Second Embodiment [Refer to FIG. 9]
In the first embodiment, in the element bonding apparatus 20, as shown in FIG. 9A, irradiation units 25a, 25b, 25c, and 25d for curing the photocurable resins 17a, 17b, 17c, and 17d Although the number is one for each photocurable resin, in the second embodiment, as shown in FIG. 9 (b), the difference is that there are two for each photocurable resin. Other procedures and manufacturing conditions are the same as in the first embodiment.

  As shown in FIG. 9B, the irradiating unit 25a and the irradiating unit 65a irradiate the photocurable resin 17a with light to cure it, and the irradiating unit 25b and the irradiating unit 65b are applied to the photocurable resin 17b. The light is irradiated to cure this, and the irradiation part 25c and the irradiation part 65c irradiate the photocurable resin 17c with light to cure it, and the irradiation part 25d and the irradiation part 65d are applied to the photocurable resin 17d. This is cured by irradiating light.

Further, the irradiation unit 25a and the irradiation unit 65a are configured such that the irradiation direction of irradiating light to the photocurable resin 17a is substantially parallel to the one surface 3a of the R prism 3 in the color separation prism 5 and is orthogonal to each other. Are arranged respectively.
The irradiation unit 25b and the irradiation unit 65b are configured so that the irradiation direction of irradiating light to the photocurable resin 17b is substantially parallel to the one surface 3a of the R prism 3 in the color separation prism 5 and orthogonal to each other. Each is arranged.
The irradiating unit 25c and the irradiating unit 65c are configured so that the irradiation direction of irradiating the photocurable resin 17c with light is substantially parallel to the one surface 3a of the R prism 3 in the color separation prism 5 and is orthogonal to each other. Each is arranged.
The irradiating unit 25d and the irradiating unit 65d are configured such that the irradiation direction of irradiating the photocurable resin 17d with light is substantially parallel to the one surface 3a of the R prism 3 in the color separation prism 5 and is orthogonal to each other. Each is arranged.

  By curing the photocurable resins 17a, 17b, 17c, and 17d using the element bonding apparatus 20 having the above-described configuration, that is, in a plurality of different directions with respect to one photocurable resin (second embodiment). By irradiating light from two different directions in the example, the photocurable resins 17a, 17b, 17c, and 17d can be cured more uniformly, respectively, so that the photocurable resins 17a, 17b, 17c, and 17d are cured. It is possible to disperse the direction of curing shrinkage when performing. Therefore, since it is possible to reduce the concentration of shrinkage stress in the cured photocurable resins 17a, 17b, 17c, and 17d in one direction, the residual stress of the cured photocurable resins 17a, 17b, 17c, and 17d This can be further reduced than in the first embodiment.

Next, a method for manufacturing a solid-state image sensor prism assembly 150, which is an embodiment of an optical component, in particular, a method for bonding and fixing a solid-state image sensor to a color separation prism by a third bonding method will be described as a third embodiment.
In the third embodiment, as in the first embodiment, a method of bonding and fixing the third solid-state imaging device 11 to one surface 3a of the R prism 3 in the color separation prism 5 will be described with reference to FIG.
FIG. 10 is a perspective view and a plan view for explaining a third embodiment in the method of manufacturing an optical component of the present invention.

<Third Embodiment> [See FIG. 10]
In the first example, in the element bonding apparatus 20, the second light source unit 26 is a common light source that supplies light to the irradiation units 25a, 25b, 25c, and 25d. However, in the third example, the irradiation unit 25a, The difference is that light sources 75a, 75b, 75c, and 75d are provided corresponding to 25b, 25c, and 25d, respectively.
As shown in FIG. 10A, the light source 75a is a light source that supplies light to the irradiation unit 25a, the light source 75b is a light source that supplies light to the irradiation unit 25b, and the light source 75c supplies light to the irradiation unit 25c. The light source 75d is a light source that supplies light to the irradiation unit 25d.
In the first embodiment, the photocurable resins 17a, 17b, 17c, and 17d are cured with the third solid-state imaging device 11 held by the holding portion 22. However, in the third embodiment, The difference is that the position of the solid-state image pickup device 11 is adjusted by the above-described method, and then the holding unit 22 is retracted from the third solid-state image pickup device 11 and thereafter the photocurable resins 17a, 17b, 17c, and 17d are cured.

A method for curing the photocurable resins 17a, 17b, 17c, and 17d in the third embodiment will be described.
As shown in FIG. 10A, in the element bonding apparatus 20, R light having a predetermined image pattern is transmitted from the first light source unit 24 through the color separation prism 5 and received by the third solid-state imaging device 11. The region 11a is irradiated. The R light irradiated on the light receiving area 11a is converted into an image signal and displayed as an image pattern R28 on a monitor (not shown).
The light curable resins 17a, 17b, 17c, and 17d are irradiated with light from the irradiation units 25a, 25b, 25c, and 25d while monitoring the position of the image pattern R28 with respect to the reference pattern 30 described above.

When the position of the image pattern R28 is shifted from the reference pattern 30 in the process of curing the photocurable resins 17a, 17b, 17c, and 17d, for example, the position of the third solid-state imaging device 11 is the irradiation unit. When deviating to the 25c, 25d side (left side in FIG. 10B), the light quantity per predetermined time in the integrated light quantity of the light emitted from the irradiation parts 25a, 25b is changed according to the amount of deviation. It is adjusted to be larger than the amount of light at every predetermined time of 25d.
The amount of light for each predetermined time can be adjusted by the illuminances H1 and L1 and the irradiation times T1 and T2 shown in FIG. For example, by increasing at least one of the illuminances H1 and L1, and increasing the ratio of the irradiation time T1 to the irradiation time T2 (T1 / T2), the amount of light in the predetermined time (T1 + T2) is increased. Can do.

  Due to the adjustment described above, the photocurable resins 17a and 17b are more cured than the photocurable resins 17c and 17d. Due to this difference in curing shrinkage, the position of the third solid-state imaging device 11 can be moved to the irradiation units 25a and 25b, so that the shift amount can be corrected. Therefore, by correcting the shift amount, the image pattern R28 can be matched with the reference pattern 30 {corresponding to the position of the broken line in FIG. 10B}.

  As described above, even when the position of the image pattern R28 is shifted with respect to the reference pattern 30 in the process of curing the photocurable resins 17a, 17b, 17c, and 17d, they are positioned on the side opposite to the shifted direction. Depending on the amount of deviation, the amount of light emitted from the irradiating unit that irradiates light to the photocurable resin that is irradiating the photocurable resin at the same time of the irradiating unit that irradiates the photocurable resin located on the shifted side. Since the photo-curing resins 17a, 17b, 17c, and 17d can be cured while correcting the shift by increasing the amount of light, the third solid-state imaging is performed by matching the image pattern R28 with the reference pattern 30. The element 11 can be bonded and fixed to one surface 3 a of the R prism 3 in the color separation prism 5.

  Similarly, the first solid-state imaging device 9 can be bonded and fixed to the one surface 1a of the G prism 1 in the color separation prism 5 by using the above-described method so that the position of the image pattern G28 coincides with the reference pattern 30. The second solid-state imaging device 10 can be adhered and fixed to the one surface 2 a of the B prism 2 in the color separation prism 5 by matching the position of the image pattern B 28 with the reference pattern 30.

Next, a modification of the first to third embodiments described above will be described with reference to FIG.
FIG. 11 is a schematic diagram for explaining a modification of the first to third embodiments in the method of manufacturing an optical component.

<Modification> [See FIG. 11]
In the first to third embodiments, the photocurable resin is cured by alternately irradiating light with different illuminances (H1, L1) every predetermined time (T1, T2). Since the reaction occurs more aggressively in the initial stage where curing starts than in the later stage where curing is completed, the amount of photocuring resin that cures and shrinks is generally greater in the initial stage where curing begins. .
Therefore, in the modification, when the photocurable resin is cured, in the curing process, the light amount per predetermined time (for example, T1 + T2) in the integrated light amount of the irradiated light is increased gradually or stepwise. Features.
The above-described curing method can reduce the amount of curing shrinkage when the photo-curable resin is cured, and can reduce the curing time because it can achieve a predetermined integrated light amount in a shorter time. Can be improved.

  For example, as shown in FIG. 11A, the lower illuminance (referred to as low illuminance) L12 is constant, and the irradiation time T12 in the low illuminance L12 and the higher illuminance (referred to as high illuminance) H11a, H11b, H11c. In the case where the irradiation time T11 is the same, by increasing the high illuminance stepwise (H11a <H11b <H11c), the curing rate of the photocurable resin is slow at the initial stage when the curing starts, and the curing progresses. Can be speeded up step by step.

  Further, as shown in FIG. 11B, when the high illuminance H21 is constant and the irradiation time T22 at the low illuminances L22a, L22b, L22c, L22d, and L22e is the same as the irradiation time T21 at the high illuminance H21, By gradually increasing the illuminance (L22a <L22b <L22c <L22d <L22e), the curing rate of the photo-curing resin can be slow at the initial stage where curing starts and gradually increased as the curing proceeds. it can.

  In addition, as shown in FIG. 11C, when the high illuminance H31 and the low illuminance L32 are constant, the irradiation times T31a, T31b, T31c, T31d, T31e, T31f, T31g, T31h, and T31i at the high illuminance H31 are set. Gradually longer (T31a <T31b <T31c <T31d <T31e <T31f <T31g <T31h <T31i), and the irradiation times T32a, T32b, T32c, T32d, T32e, T32f, T32g, and T32h at low illuminance L32 are gradually increased. By shortening (T32a> T32b> T32c> T32d> T32e> T32f> T32g> T32h), the curing rate of the photocurable resin is slow at the initial stage where curing starts, and gradually increases with the progress of curing. be able to.

  The embodiment of the present invention is not limited to the configuration and procedure described above, and it goes without saying that modifications may be made without departing from the scope of the present invention.

  For example, in the first to third embodiments and the modified examples, the application positions of the photocurable adhesive in the solid-state imaging device are four, but the present invention is not limited to this, and the application positions are two or more. By applying in a ring shape along the outer periphery of the application surface of the solid-state imaging device, the same effects as those of the first to third embodiments and the modification can be obtained.

  In the first to third embodiments and the modified examples, the photocurable adhesive is applied to the solid-state imaging device side. However, the present invention is not limited to this, and the photocurable adhesive is applied to the prism side. It may be.

  In the first to third embodiments and the modified examples, each irradiation unit is arranged so that light is irradiated from a direction parallel to the surface of the prism. However, the present invention is not limited to this, and photocuring is performed. Each irradiation part can be arrange | positioned in arbitrary positions and angles if it is a position and angle which can harden | cure an adhesive.

  In the third embodiment, a light source is provided for each irradiation unit. However, the present invention is not limited to this. Light emitted from one light source is applied to each irradiation unit using, for example, a mechanical shutter. You may make it distribute.

  In the first to third embodiments and the modification, the method for manufacturing an optical component that requires positioning of a solid-state imaging device such as a CCD, MOS, CMOS, etc. has been described. The present invention can also be used when positioning a transmissive liquid crystal display element or the like.

It is typical sectional drawing for demonstrating the solid-state image sensor prism assembly in 1st Example and 2nd Example of the manufacturing method of the optical component of this invention. It is typical sectional drawing and a top view for demonstrating 1st Example of the manufacturing method of the optical component of this invention. It is typical sectional drawing and a top view for demonstrating 1st Example of the manufacturing method of the optical component of this invention. It is a perspective view for demonstrating 1st Example of the manufacturing method of the optical component of this invention. It is a perspective view for demonstrating 1st Example of the manufacturing method of the optical component of this invention. It is a perspective view for demonstrating 1st Example of the manufacturing method of the optical component of this invention. It is a schematic diagram for demonstrating the position adjustment method of a solid-state image sensor. It is the perspective view and schematic diagram for demonstrating 1st Example of the manufacturing method of the optical component of this invention. It is a top view for demonstrating 2nd Example of the manufacturing method of the optical component of this invention. It is the perspective view and top view for demonstrating the 3rd Example of the manufacturing method of the optical component of this invention. It is a schematic diagram for demonstrating the modification of the 1st-3rd Example of the manufacturing method of the optical component of this invention.

Explanation of symbols

1, 2, 3 prism, 1a, 2a, 3a surface, 5 color separation prism, 9, 10, 11 solid-state imaging device, 9a, 10a, 11a light receiving area, 13, 15 dichroic film, 17, 17a, 17b, 17c, 17d photo-curing resin, 18 imaging lens, 20 element bonding apparatus, 21 stage, 22 holding unit, 23 driving unit, 24, 26, 75a, 75b, 75c, 75d light source unit, 25a, 25b, 25c, 25d, 65a, 65b, 65c, 65d Irradiation part, 28R image pattern, 30 reference pattern, 50, 100, 150 solid-state image sensor prism assembly, L, L1, L2 light, R17a, R17b, R17c, R17d external dimensions, s17a, s17b, s17c , S17d gap, H1, L1 illuminance, T1, T2 Cum time

Claims (7)

In the method of manufacturing an optical component obtained by bonding and fixing optical components using a photocurable adhesive,
A curing step of curing the photocurable adhesive by alternately irradiating light with a first illuminance and a second illuminance lower than the first illuminance on the photocurable adhesive. A method of manufacturing an optical component, comprising:   2. The method of manufacturing an optical component according to claim 1, wherein, in the curing step, the light curable adhesive is irradiated from a plurality of different directions. In the manufacturing method of the optical component formed by adhering and fixing the optical components to each other at a plurality of locations with a photocurable adhesive,
A curing step of curing each photocurable adhesive by alternately irradiating each photocurable adhesive with light at a first illuminance and a second illuminance lower than the first illuminance. A method of manufacturing an optical component, comprising:   4. The method of manufacturing an optical component according to claim 3, wherein, in the curing step, the light is irradiated to each of the photocurable adhesives from a plurality of different directions.   5. The method of manufacturing an optical component according to claim 4, wherein in the curing step, the light amount of the light irradiated to each of the photocurable adhesives can be set independently for each predetermined time.   In the process of curing each photocurable adhesive, when the other of the optical components is shifted in one direction, the photocurable adhesive is positioned in the opposite direction to the one direction. 6. The optical component according to claim 5, wherein a light amount per predetermined time of the light to be irradiated is made larger than a light amount per predetermined time of the light irradiated to the photocurable adhesive located in the one direction. Production method.   The method of manufacturing an optical component according to claim 1, wherein in the curing step, the light amount of the light for each predetermined time is increased gradually or stepwise.

Images