JP2003153091A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an imaging device which combines an imaging part with good accuracy, easily adjusts a position and facilitates production. SOLUTION: A shielding layer 2 having an iris aperture for limiting a pencil of rays is formed in either plane part at an entrance surface side or an exit surface side of a photographing lens 1, and a color filter which transmits rays having a specific wavelength is provided in a protection member 3. Further, the photographing lens 1 is secured to the protection member 3 so as to have a predetermined gap via a spacer 8. Further, the photographing lens 1 is secured to the protection member 3 via beads 41 and an image pickup element 6 is secured to the protection member 3 via beads 51.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup device,
In particular, it relates to a structure of an image pickup module in which an image forming optical system and an image pickup element chip are integrated.

[0002]

2. Description of the Related Art Conventionally, as a miniaturized image pickup module, for example, an example of a distance measuring module is disclosed in Japanese Patent Laid-Open No. 9-0.
There is one in which an imaging lens and a semiconductor chip are integrated as disclosed in Japanese Patent No. 27606. FIG. 19 (A)
FIG. 3 is a sectional view showing the image pickup module of the publication. 8 in the figure
Reference numeral 1 is a lens member, and 80 is a semiconductor chip. The distance measuring module has a COG (chip on glass) structure, and a sensor chip 84 is attached to the lower surface of a glass substrate 83.

The lens member 81 is molded of plastic or glass, and has lenses 81L and 81R for forming two images in order to measure the distance to the object by the principle of triangulation. Further, the sensor chip 84 is provided with light receiving element portions 87L and 87R formed by a one-dimensional light receiving element array, and the object light passing through the lens 81L passes through the light receiving element portion 87L and passes through the lens 81R through the light receiving element portion 87R. The object light is imaged.

Further, FIG. 19 is provided on the upper surface of the glass substrate 83.
As shown in (B), a light-shielding layer 85 having a pattern is printed to form a diaphragm, while a light-shielding / conductive member 86 is formed on the lower surface of the glass substrate 83 as a connection terminal with the sensor chip 84 and an external terminal. There is. By adopting such a COG structure, a sensor package made of plastic or the like is unnecessary, and since a lens barrel is not required by integrating a lens, the manufacturing cost can be kept relatively low.

Further, as another conventional example, Japanese Patent Laid-Open No. 4-477.
The one disclosed in Japanese Patent Publication No. 69 is shown in FIG. The CCD (imaging means) 96 is attached to a recess of a case called a CCD substrate 97. Reference numeral 98 is a connection pin for connecting to an external substrate. A window glass 95 is fixed on a CCD substrate 97 to seal the CCD 98. A glass block 94 for adjusting the optical path length is fixed to the window glass 95, and a color filter glass 93 is fixed to the glass block 94. Further, an optical low-pass filter 91 is fixed to the color filter glass 93, and this optical low-pass filter 91 is for removing a frequency component corresponding to the pitch of the CCD sensor array in order to suppress the generation of false signals and moire. Is. Imaging device 900 configured in this way
A taking lens 92 is arranged on the optical axis of the.

Further, FIG. 21 shows a structure which is conventionally well used as a structure inside the image pickup device. The figure is a cross-sectional view of a pixel of the image sensor. A photoelectric conversion section 64 is formed on a silicon wafer, a wiring section 63 is formed on the photoelectric conversion section 64 (two wiring layers are provided in the example of the figure), and a color filter 71 is further formed thereon. The image pickup device 6 is configured by forming the microlens 62 thereon.

[0007]

However, as shown in FIG.
In the conventional configuration shown in FIG. 1, since the diaphragm 85 is formed as a separate member from the lens 81, the lens 81 is attached to the semiconductor chip 80 when the glass substrate 83 is attached to the sensor chip 84.
Precise position adjustment was required both when attaching the and the assembly was troublesome.

Further, in the conventional configuration shown in FIG. 20, the taking lens 92 is not fixed to the image pickup apparatus 900, and is not a sensor package-less configuration as in the configuration example of FIG. Cost was a problem. Further, since the image pickup device 900 and the photographing lens 92 cannot be accurately positioned, there is a problem when the photographing lens is a multi-lens, for example.

On the other hand, in the case of using the image pickup device shown in FIG. 21, since the color filter is formed in the image pickup device, the distance from the microlens to the photoelectric conversion portion becomes long (deep), and the microlens is formed. It was difficult to increase the apparent aperture ratio even when using.

The present invention has been made in view of the above conventional problems, and an object of the present invention is to provide an image pickup apparatus whose position can be adjusted easily and which can be easily manufactured.

[0011]

SUMMARY OF THE INVENTION An object of the present invention is to provide an image pickup means, a protective member for protecting the image pickup means, and a light flux from a subject which is fixed to the protective member. In an imaging device having an optical member for forming an image, the optical member has a plane portion having either one of an incident surface side and an emission surface side formed in a plane portion, and the aperture opening for limiting a light beam to the plane portion. The light-shielding layer having the above-mentioned structure is formed, and the protection member is provided with a filter that transmits a light beam having a specific wavelength.

The above object of the present invention is to provide an image pickup means,
In an image pickup apparatus having a protective member for protecting the image pickup unit and an optical member fixed to the protective member for forming an image of a light flux from a subject on the image pickup unit, the optical member is an incident surface side or Any one surface on the emission surface side is formed in a flat surface portion, a light shielding layer having a diaphragm opening for limiting a light flux is formed in the flat surface portion, and a filter that transmits a light ray of a specific wavelength is formed in the protective member. Is provided,
In addition, the optical member and the protective member are fixed to each other with a predetermined space therebetween via a spacer.

Further, the above object of the present invention is to provide an image pickup means,
In an image pickup apparatus having a protective member for protecting the image pickup unit and an optical member fixed to the protective member for forming an image of a light flux from a subject on the image pickup unit, the optical member is an incident surface side or Any one surface on the emission surface side is formed in a flat surface portion, a light shielding layer having a diaphragm opening for limiting a light flux is formed in the flat surface portion, and a filter that transmits a light ray of a specific wavelength is formed in the protective member. Is provided,
Further, the optical member and the protection member or the protection member and the image pickup means are fixed by a bead with a predetermined gap therebetween, which is achieved by an image pickup apparatus.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First Embodiment) FIG. 1 is a sectional view showing the arrangement of a first embodiment of the image pickup apparatus of the present invention. In FIG. 1, reference numeral 1 denotes a taking lens which is an optical member for focusing a light flux from a subject on a planned image forming plane,
A lens portion is formed on one surface and the other surface is a flat surface. A light blocking member 2 having a diaphragm opening for limiting a light flux is formed on a plane portion of the taking lens 1. Reference numeral 3 denotes a transparent protective member for protecting the surface of the image sensor 6, and a color filter 7 for wavelength-separating a light beam from a subject is provided on the lower surface of the protective member 3.
The image sensor 6 has a plurality of photoelectric conversion elements arranged two-dimensionally,
It is a means for capturing an image of a subject. The taking lens 1 and the protective member 3 are adhered with an adhesive 4, and the protective member 3 and the image pickup element 6 are adhered with an adhesive 5.

Here, a Bayer array used as a conventional array of image pickup devices will be described. FIG. 2 is a schematic view of an imaging device that is conventionally and often used. An image from the subject is formed on the image sensor 61 by the taking lens group 21,
An image can be obtained by capturing the image with the image sensor 61. The image pickup device 61 has a structure as shown in FIG. 3, where 61 mng is the first green pixel, 61 m
nb is a blue pixel, 61mnr is a red pixel, 61
mng2 is a second green pixel. m represents the array number of pixels in the horizontal direction, and n represents the array number of pixels in the vertical direction. These are regularly arranged structures as shown in FIG. 3, and are generally called Bayer arrays.

In such a pixel arrangement, green pixels have twice the number of pixels as blue and red pixels. Basically, it is possible to create a color image with the same number of three colors. However, since the image quality can be improved by increasing the number of green pixels having relatively high visibility, an image pickup device with such a Bayer array is used. Often. In this embodiment, an image equivalent to that of an image pickup device having a Bayer array is obtained, as will be described later in detail.

Next, the principle of image pickup by the image pickup apparatus of this embodiment will be described. As shown in FIG. 4, the taking lens 1 includes four lens units 102a to 102 on a flat transparent member.
d is formed. Focusing only on the lens 102a, the light flux from the subject travels to the protection member 3 through the lens portion 102a. The protection member 3 is RGB as shown in FIG.
Equipped with three color filters. 7g is the first green area, 7b is the blue area, 7r is the red area, and 7g2 is the second green area, and the luminous flux from the lens portion 102a is 60g.
Area (see FIG. 6).

The light flux that has passed through the protective member 3 is projected onto the image pickup device 6. As shown in FIG. 6, the image pickup device 6 is 60 g,
It is composed of four imaging regions 60b, 60r, 60g2, and the light flux from the lens portion 102a is imaged on the region of 60g. Similarly, the light flux from the lens unit 102b passes through the color filter 7b to 60b and the lens unit 1
The luminous flux from 02c passes through the color filter 7r and becomes 60r.
In addition, the light flux from the lens unit 102d has a color filter 7g.
Each of the images passes through 2 and forms an image on 60 g 2.

The four images thus formed are combined into one color image. At this time, by making the shapes of the four lens units 102a, 102b, 102c, and 102d slightly different, the four images become images shifted by half a pixel. FIG. 7 is a diagram showing a state in which pixels of each color are partially extracted and overlapped. Although the sizes of the pixels are expressed differently for the sake of clarity, the sizes and shapes are actually the same.

Focusing on the first green pixel 6013g, the blue pixel 6012b is 0.
It is shifted by 5 pixels, the red pixel 6012r is shifted by 0.5 pixel downward, and the second green pixel 601 is shifted.
2g2 is shifted by 0.5 pixels on the right side and the lower side. That is, the first green pixels 6012g and 60
Red pixel 6012r is inserted between 13g,
The blue pixel 6012b is inserted between the green pixels 6013g and 6023g, and the first green pixel 6
The second green pixel 6012g2 is inserted into the contact portions of 012g, 6022g, 6013g, and 6023g, and the pixel arrangement is as shown in FIG. That is,
In this case, an image equivalent to that of the image sensor having the Bayer array as shown in FIG. 3 can be obtained.

Next, the configuration of each part of the image pickup apparatus shown in FIG. 1 will be described. The taking lens 1 and the protective member 3 are made of transparent glass or transparent resin. When the taking lens 1 is made of glass, it can be produced by a glass molding method, and when it is made of resin, it can be produced by injection molding, compression molding or the like. Further, the taking lens 1 may have a structure in which a resin lens portion is added on a flat glass substrate by a replica manufacturing method.

As shown in FIG. 9, the image pickup lens 1 is provided with a light shielding member 2 having aperture openings 2a to 2d. This is provided on the flat surface of the taking lens 1, and is coated on the taking lens 1 by a method such as printing a light-shielding paint by offset printing or forming a light-shielding thin film by vapor deposition or plating. Has been formed.

Photographic lens 1, protective member 3 and protective member 3
The image pickup device 6 and the image pickup device 6 are adhered to each other with a thermo-ultraviolet curable resin. The thermo-ultraviolet curable epoxy resin is cured by heating and irradiation with ultraviolet rays. Epoxy resin can be preferably used for this purpose because it cures slowly, has no unevenness in curing shrinkage, and relaxes stress. Note that some epoxy resins are hardened by heating, but the reason why the thermal ultraviolet curing type is selected here is that the protection member 3 is heated sufficiently to cure the thermosetting epoxy resin. This is because the color filter 7, the resin portion of the taking lens 1 (when the resin molded by the above-described method is present), the microlens 62, the printing paint of the light shielding member 2, and the like may be deteriorated.

The following two methods can be used to bond the taking lens 1 and the protective member 3 and the protective member 3 and the image pickup device 6 together. As a first method, as shown in FIG. 10, first, the protection member 3 is placed on the image sensor 6,
After the epoxy resin of the adhesive 5 is applied and semi-cured by irradiation of ultraviolet rays, it is pressed and slightly heat-treated to be completely cured to manufacture the image pickup device module 301. Next, the adhesive 4 is applied to the image pickup device module 301, and the photographing lens 1 is placed on the adhesive 4 to adjust the position of each optical axis.

The position adjustment is performed in the direction of the optical axis (first axis direction) and in the direction of three axes of two axes (second and third axis directions) orthogonal to each other on a plane perpendicular to the optical axis. The deviation and the deviation in the rotation direction around the first, second, and third axes are performed for a total of six axes. After completing the adjustment for all the axes, the adhesive 4 is cured.

Next, as a second method, as shown in FIG. 11, first, the adhesive 4 is applied onto the protective member 3, the photographing lens 1 is placed on the adhesive 4, and the adhesive 4 is hardened. The element module 101 is manufactured. Next, the adhesive 5 is applied to the image pickup element 6, and the optical element module 101 is placed on the image pickup element 6 to adjust the position of the six axes and cure the adhesive 5. In either of the first and second methods, the position of the taking lens 1 and the image pickup device 6 is adjusted by using one of the two adhesive parts, which enables highly accurate positioning.

Next, the color filter will be described.
First, the conventional image sensor shown in FIG. 21 will be described.
In the image pickup device 6, after the photoelectric conversion section 64 and the wiring section 63 are formed on the silicon wafer, the color filter 71 is formed. When making a color filter of three colors of RGB, it can be formed by a method called a photoresist method using a photosensitive resin dyed with a predetermined spectral characteristic. In this method, first, a photosensitive resin dyed in red is applied thinly and uniformly, and a portion of the red that does not require a filter is masked and a light beam is emitted. Then, the portion exposed to the light ray is cured and the masked portion is not cured. A red filter can be formed at a predetermined position by removing the non-hardened portion by washing.

Next, a transparent resin is applied to fill the area where the red photosensitive resin has been removed. This is a process called flattening. Similarly, a green filter is formed on red and a blue filter is formed on green. The microlens 62 is formed on the color filter 71 formed by such a method by a photoresist method. In the image pickup device 6 having such a configuration, the color filter 71 exists between the microlens 62 and the photoelectric conversion unit 64, so that the photoelectric conversion unit 64 is located very deep from the microlens 62. The outermost light flux incident on the photoelectric conversion unit 64 in this case is shown by a broken line.

FIG. 12 is a sectional view of a pixel of the image sensor 6 used in this embodiment. The same parts as those in FIG. 21 are designated by the same reference numerals. In the present embodiment, unlike the case of FIG. 21, the color filter is not formed inside the image pickup element and is formed on the protection member 3, so that it does not exist under the microlens 62. The outermost light flux incident on the photoelectric conversion unit 64 in this case is shown by a solid line. Compared to FIG. 21, the area where the microlens 62 focuses is larger in the solid line portion, so that the amount of light reaching the photoelectric conversion unit 64 is larger in the case without the color filter. That is, the sensitivity of the image sensor can be apparently increased. For this reason, the color filter 7 is arranged on the protective member 3.

(Second Embodiment) FIG. 13 is a sectional view showing a second embodiment of the image pickup apparatus of the present invention. The same parts as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. In FIG. 14, reference numeral 8 is a spacer for keeping the taking lens 1 and the protective member 3 at an appropriate distance. As described in the first embodiment, the taking lens 1 is made of glass or transparent resin. If the lens is made of glass, the glass molding method is used. If the lens is resin, injection molding, compression molding, or replica on a flat glass substrate. It is manufactured by a method of adding a resin lens part by a manufacturing method. The light-shielding member 2 having a diaphragm opening is provided by printing or the like on the flat surface side of the photographic lens 1 thus manufactured.

Since the color filter 7 may deteriorate (discolor) due to humidity, it is usually provided on the image pickup device 6 side, and the material of the protective member 3 is glass impermeable to water, and further the image pickup device 6 and the protective member 3 are used. Adhesive 5 is applied to the entire fixing portion to completely seal it. However, when the taking lens 1 is made of glass by a glass molding method or a replica method and the taking lens 1 and the protective member 3 are completely sealed, the color filter 7 is provided on the taking lens 1 side. You may distribute it. The adhesive 5 is a protective member for preventing deterioration of the color filter 7, the resin portion of the photographing lens 1 (when the resin molded by the above-described method is present), the microlens 62, the printing paint of the light shielding member 2 and the like. 3 and the image pickup element 6 use a thermo-UV curing type adhesive.

The spacer 8 is made of resin, metal or the like, and is fixed to the protective member 3. As a fixing method, adhesion is a generally used method, but when using resin, a method such as welding using ultrasonic waves or laser may be adopted. The thermal ultraviolet curing adhesive 4 is applied to the upper surface of the fixed spacer 8, and the taking lens 1 is placed on the adhesive 4 to adjust the position. When the adjustment is completed, ultraviolet rays (UV light) are radiated to cure the adhesive 4 to complete the imaging device.

As a method of forming the spacer 8, a method as shown in FIG. 14 may be used. That is, when the lens portion of the photographing lens 1 is manufactured by molding such as the replica method, the overhanging portion 2 is formed on the outer periphery of the lens portion 202.
01 is made at the same time. As a result, a spacer portion having the same effect as the spacer 8 shown in FIG. 13 can be manufactured. Further, the adhesive 4 is applied to the upper surface of the protective member 3 to which the image pickup device 6 is fixed, and the photographing lens 1 is applied from above.
Then, the position is adjusted, and then an ultraviolet ray is irradiated to cure the image, whereby the image pickup device is completed.

(Third Embodiment) Next, a third embodiment of the present invention will be described. 15 to 17 are cross-sectional views showing a third embodiment of the present invention, and in each case, a predetermined gap is formed between the protective member 3 and the image pickup device 6 or between the protective member 3 and the image pickup lens 1 by using beads. To do. 15 to 17, the same parts as those in FIG. 1 are designated by the same reference numerals. 41 and 51 are beads for forming a predetermined gap. Organic polymer or quartz can be selected as the material of the beads, but in the case of quartz beads, there is a possibility of destroying the protective film, electrodes, or switching elements formed on the semiconductor wafer in the pressing step for forming the gap. On the other hand, an organic polymer is more desirable because it allows a wider range of pressure conditions in the pressing process. The third embodiment will be described with reference to these drawings.

First, in the embodiment shown in FIG. 15, the protective member 3 is used.
Beads 51 are provided between the image pickup device 6 and the image pickup device 6. This is a particularly effective method when assembling as shown in FIG. Specifically, first, the adhesive 4 is applied on the protective member 3, the taking lens 1 is placed on the adhesive 4, and the adhesive 5 is cured to manufacture the optical element module 101. At this time, the distance between the lens apex of the taking lens 1 and the bottom surface of the protective member 3 and the inclination thereof are adjusted so that the accuracy is sufficient.
Then, the adhesive 5 in which the beads 51 are mixed in the image pickup device 6
Is applied, and the optical element module 101 is placed on it and pressed so that the distance between the beads 51 is maintained, and the adhesive 5 is cured by ultraviolet irradiation and heating. Since the shape of the beads 51 is controlled with high accuracy, the optical element module 1
01 can be fixed to the image sensor 6 with high precision.

Next, the embodiment shown in FIG. 16 will be described. In FIG. 16, beads 41 are provided between the taking lens 1 and the protective member 3. This is a particularly effective method when assembling as shown in FIG. That is, FIG.
In the case of assembling by the method of No. 0, first, the protective member 3 is placed on the image pickup device 6, the epoxy resin of the adhesive 5 is applied, and the image pickup device module 301 is manufactured by curing the epoxy resin. At this time, the distance and the inclination between the upper surface of the protection member 3 and the image sensor 6 are adjusted so that the accuracy is sufficient. Next, the adhesive 4 in which the beads 41 are mixed in the image sensor module 301
Is applied, and the imaging lens 1 is put on the bead 41.
Then, the adhesive 4 is cured by irradiating with ultraviolet rays and heating. Accordingly, if the taking lens 1 is formed with high accuracy, the taking lens 1 can be easily fixed to the image pickup device module 301.

Next, FIG. 17 shows the taking lens 1 and the protective member 3.
Beads 41 between them, beads 5 between the protection member 3 and the image pickup device 6.
This is an example in which 1 is provided. 17, the same parts as those in FIG. 1 are designated by the same reference numerals. This is the taking lens 1, the protective member 3
This is an effective method when the image pickup device 6 and the image pickup device 6 can be manufactured with high precision. The adhesive 4 and the adhesive 5 in which the beads 41 and 51 are mixed are prepared. And in FIG.
As shown in FIG. 1, first, the adhesive 4 in which the beads 41 are not mixed is applied to the periphery of the taking lens 1 including the effective region of the light beam, and is semi-cured by irradiation with ultraviolet rays. Then beads 4
The adhesive containing 1 is applied to the periphery of the adhesive. This is placed on the protective member 3 and pressed so as to have a space between the beads 41, and is heated and completely cured.

Next, the adhesive 5 mixed with the beads 51 is applied to the periphery of the bottom surface of the optical element module 101 or the top surface of the image pickup element 6 produced by this method,
It is placed on the image pickup device 6 and pressed so that the beads 41 are spaced apart from each other, and is completely cured by irradiation with ultraviolet rays and heating. At this time, the position adjustment of the optical element module 101 and the image pickup element 6 in the plane direction and the rotation adjustment around the optical axis are performed. By doing as described above, the six-axis adjustment as described in the first embodiment is different from the one in the first axial direction and the one in the rotational direction about the second and third axes. Does not need adjustment,
Since only three adjusting shafts are required, the assembly can be performed very easily.

As the assembly procedure, as shown in FIG. 10, the beads 51 are mixed and the protective member 3 and the image pickup device 6 are fixed with the adhesive 5 to fix the image pickup device module 301.
It is also possible to adopt a method in which the image pickup device module 301 and the photographing lens 1 are fixed by using the adhesive 4 in which the beads 41 are mixed after manufacturing the above.

[0041]

As described above, the present invention has the following effects. (1) By forming a light-shielding layer having a diaphragm opening for limiting the light flux on the flat surface of the photographing lens, it is not necessary to adjust the positions of the photographing lens and the diaphragm opening, and the manufacturing process can be simplified. (2) The position adjustment of the photographing lens and the image pickup device may be performed by either the photographing lens and the protective member or the bonding portion between the protective member and the image pickup device, so that the adjustment work can be simplified. (3) By forming a filter on the protective member, the structure of the image sensor can be simplified, and the image sensor can be manufactured easily. (4) By forming a light-shielding layer having a diaphragm opening in the photographing lens and a filter in the protective member, the number of processes for each member is reduced, so that each member can be manufactured with high precision.
Since the yield can be improved, the cost can be reduced. (5) Since the air gap can be formed between the taking lens and the image pickup device by fixing the taking lens and the protective member with a spacer interposed therebetween, an interval can be shortened as compared with the case where the taking lens is filled. (6) By fixing the photographing lens and the protective member or the protective member and the image pickup device with beads at a predetermined gap, the gap between the members can be managed with high accuracy, and 6
Since the adjustment of the axes only requires the adjustment of three axes, the assembling work can be performed very easily. (7) By fixing each member with an adhesive,
The structure of each member can be maintained with high accuracy, the inside can be sealed, and deterioration of the filter and the like can be prevented. (8) By forming the light-shielding layer on the photographing lens by printing, the light-shielding layer can be formed easily with high accuracy.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of an imaging device of the present invention.

FIG. 2 is a schematic diagram showing an image pickup system of a conventional example.

FIG. 3 is a diagram showing a structure of a conventional image sensor.

FIG. 4 is a perspective view showing the imaging lens of FIG.

5 is a view showing a color filter on the protection member of FIG.

6 is a diagram showing an image pickup area of the image pickup device shown in FIG. 1;

FIG. 7 is a diagram showing a pixel arrangement when images are combined in the embodiment of FIG.

FIG. 8 is a diagram showing an apparent pixel arrangement when images are combined in the embodiment of FIG.

FIG. 9 is a view showing the light shielding member of FIG.

FIG. 10 is a diagram showing an assembling procedure of the embodiment of FIG.

FIG. 11 is a diagram showing another assembling procedure of the embodiment of FIG.

12 is a cross-sectional view of a pixel of the image sensor of FIG.

FIG. 13 is a cross-sectional view showing a second embodiment of the present invention.

FIG. 14 is a cross-sectional view showing a modified example of FIG.

FIG. 15 is a diagram showing a third embodiment of the present invention.

FIG. 16 is a diagram showing a third embodiment of the present invention.

FIG. 17 is a diagram showing a third embodiment of the present invention.

FIG. 18 is a diagram illustrating a method of applying the adhesive of FIG.

FIG. 19 is a diagram showing a conventional imaging device.

FIG. 20 is a diagram showing another conventional imaging device.

FIG. 21 is a cross-sectional view showing a conventional image sensor.

[Explanation of symbols] 1 Photographing lens (optical member) 101a-101d lens part 2 light-shielding member 2a-2d aperture opening 3 protection members 4,5 adhesive 6 Image sensor 7 color filters 8 spacers 41,51 beads 62 micro lens 63 wiring section 64 photoelectric converter

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 27/14 H01L 27/14 D 31/0232 31/02 DF term (reference) 2H044 AB02 AB06 AB07 AB17 AB18 AB21 AB26 AG01 2H083 AA02 AA20 AA26 AA32 4M118 AA10 AB03 BA10 GB02 GC08 GC14 GD03 HA20 HA23 HA24 5C024 CY47 CY49 EX23 EX42 EX43 EX52 GZ34 GZ36 5F088 BA15 BA16 BA18 BB03 EA04 HA05 HA10 JA12 JA13

Claims (11)

[Claims] 1. An image pickup apparatus comprising: an image pickup unit; a protective member for protecting the image pickup unit; and an optical member fixed to the protective member for forming a light beam from a subject on the image pickup unit. The optical member has one of the incident surface side and the output surface side formed in a flat surface portion, and a light shielding layer having a diaphragm opening for limiting a light flux is formed in the flat surface portion, and An image pickup device, wherein the protective member is provided with a filter that transmits a light beam having a specific wavelength. 2. The image pickup apparatus according to claim 1, wherein the optical member and the protection member and the protection member and the image pickup means are fixed to each other with an adhesive. 3. The image pickup device according to claim 1, wherein the light shielding layer is formed on an optical member by printing. 4. An image pickup apparatus comprising: an image pickup unit; a protective member for protecting the image pickup unit; and an optical member fixed to the protective member for forming a light flux from a subject on the image pickup unit. In the optical member, either the incident surface side or the emission surface side is formed in a flat surface portion, a light shielding layer having a diaphragm opening for limiting a light flux is formed in the flat surface portion, and the protective member is formed. An image pickup apparatus comprising a filter that transmits a light beam having a specific wavelength, and the optical member and the protective member are fixed to each other with a predetermined space therebetween via a spacer. 5. The image pickup apparatus according to claim 4, wherein the optical member and the protection member, and the protection member and the image pickup means are fixed to each other with an adhesive. 6. The image pickup device according to claim 4, wherein the light shielding layer is formed on an optical member by printing. 7. The spacer according to claim 4, wherein the spacer is formed integrally with the optical member.
The imaging device according to the item. 8. An image pickup apparatus comprising: an image pickup unit; a protective member for protecting the image pickup unit; and an optical member fixed to the protective member for forming a light beam from a subject on the image pickup unit. In the optical member, either the incident surface side or the emission surface side is formed in a flat surface portion, a light shielding layer having a diaphragm opening for limiting a light flux is formed in the flat surface portion, and the protective member is formed. An image pickup characterized in that a filter for transmitting a light beam of a specific wavelength is provided, and the optical member and the protective member or the protective member and the image pickup means are fixed to each other with a predetermined gap therebetween via beads. apparatus. 9. The image pickup apparatus according to claim 8, wherein the optical member and the protection member, and the protection member and the image pickup means are fixed to each other with an adhesive. 10. The imaging device according to claim 8, wherein the light shielding layer is formed on an optical member by printing. 11. The image pickup device according to claim 8, wherein the beads are made of an organic polymer.