JP2008091804A - Electronic component crimping method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component crimping method of crimping an electronic component on a substrate through a sheet by a crimping tool, which method secures a highly reliable crimping state since the rise of the temperature in crimping can be made fast. <P>SOLUTION: The electronic component crimping method involves arranging an electronic component on a substrate through the jointing material, supporting the substrate on a back-up stage, and heating/pressing the electronic component through the sheet by a crimping tool to crimp the electronic component on the substrate. At least one of the sheet and a heating means is moved to a preheating position to preheat the sheet just before a time, needed for preheating the sheet, obtained by back-counting from the pressing start time for the electronic component, and thereafter, the pressing operation is performed through the preheated sheet by a crimping tool. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  TECHNICAL FIELD The present invention relates to an electronic component crimping method and apparatus, and more particularly to an electronic device capable of ensuring a highly reliable crimped state by increasing the temperature rise during crimping in a method of crimping an electronic component to a substrate via a sheet with a crimping tool. The present invention relates to a component crimping method and apparatus.

  For example, in the manufacturing process of flat display panels such as liquid crystal panels and plasma display panels, electronic components such as TCP (Tape Carrier Package), FPC (Flexible Printed Circuit) and COG (Chip On Glass) are pressure-bonded to the panel as a substrate. Or mounting a printed circuit board on the panel by crimping TCP or FPC mounted on the panel to the printed circuit board, and an electronic component crimping apparatus is used for the crimping process.

  When the electronic component is crimped to the substrate by the electronic component crimping apparatus, as shown in FIG. 11A, an anisotropic conductive material 42 as a bonding member is previously pasted on the substrate 41, and this anisotropic conductive material. The electronic component 43 is temporarily pressure-bonded to the substrate 41 via 42 and supplied to the electronic component crimping apparatus. In the electronic component crimping apparatus, the electronic component 43 is pressed against the substrate 41 by pressurizing the electronic component 43 with the crimping tool 45 while the substrate 41 is supported by the backup stage 44. As shown in FIG. 11B, the anisotropic conductive material 42 is configured by dispersing conductive particles 42b in which a Ni film is formed on the surface of resin particles in a thermosetting resin 42a, and a substrate 41. Between the substrate 41 and the electronic component 43, the conductive particles 42b are brought into contact with each other and the conductivity is ensured at the portion by selectively compressing the portion where the conductivity is to be obtained. Are joined.

  By the way, in the main crimping step, the protruding anisotropic conductive material 42 may adhere to the crimping surface of the crimping tool 45, and in this case, the subsequent main crimping step is adversely affected. Therefore, as shown in FIG. 11A, it is known to perform crimping between the crimping tool 45 and the electronic component 43 via an adhesion preventing sheet 46. It is also known to perform pressure bonding via a cushioning sheet in order to absorb a minute variation in the flatness of the substrate and the thickness dimension of the electronic component and ensure a uniform pressure bonding state. Furthermore, in order to prevent these adhesion preventing sheets and cushioning sheets from being damaged by the heat of the crimping tool, it is also known to crimp these sheets and the crimping tool via a heat resistant sheet. It is also known to press-bond via a sheet obtained by combining any of these sheets.

  In this way, the sheet fed from the supply roll is wound by the winding roll between the electronic component and the crimping tool in the method of crimping the adhesion tool and the electronic component via the adhesion preventing sheet. Prior to the crimping operation by the crimping tool, the sheet is drawn out and slackened so that the sheet is spread on the electronic component. It is known to prevent the occurrence (see, for example, Patent Document 1).

  In the crimping method described in Patent Document 1, when the crimping is completed, the sheet is wound up, the sheet is fed out from the supply roll, the crimped part is moved to the winding side, and the new part comes into contact with the crimping tool. To. At the time of winding, the sheet is in contact with the crimping tool, but if it is left in contact for a long time, there is a risk of thermal deformation, so the winding roll is slightly reversed and the sheet sags below the crimping tool Configured to wait at.

In addition, in a tape crimping apparatus that attaches a tape-shaped anisotropic conductive material to a panel by pressing a tape carrying an anisotropic conductive material on a support tape with a crimping tool, the panel and the crimping tool The tape supply means for supplying the tape in between is provided with a tape positioning part that passes the tape between the crimping tool and the panel and arbitrarily positions the vertical position of the tape, and the tape positioning part is provided between the crimping tool and the panel. A lifting body that can be moved up and down and positioned and has a guide roller and a chuck for the tape is arranged on both sides of the space, and the tape is brought into contact with the panel in a state where no tension is applied by the tape positioning portion. A device that is pressurized with a crimping tool is known (for example, see Patent Document 2).
JP-A-8-184847 Japanese Patent Laid-Open No. 7-270742

  By the way, in recent years, due to an increase in production of flat display panels and a reduction in price, there has been a growing demand for improvement in bonding quality by crimping in order to shorten the tact time of the crimping process for crimping electronic components to a substrate and improve yield.

  However, when the sheet 46 is interposed between the electronic component 43 on the substrate 41 and the crimping tool 45 as described above, the heat of the crimping tool 45 escapes through the sheet 46, and the electronic component 43 and the substrate. It takes time for the temperature of the joint part (crimp part) where the anisotropic conductive material 42 between 41 is arranged to rise to a predetermined temperature, and it is impossible to shorten the tact time of the crimping process. There's a problem.

  In addition, if the temperature of the anisotropic conductive material 42 rises slowly during pressure bonding, the fluidity of the thermosetting resin 42a in the anisotropic conductive material 42 is low as shown in FIGS. 12 (a) and 12 (b). Therefore, the thermosetting resin 42a is cured in a state where the electronic component 43 and the electrode of the substrate 41 are not sufficiently compressed as compared with the compression thickness t for sufficiently joining the electrodes, and as a result. As shown in FIG. 12 (c), the conductive particles 42b in the anisotropic conductive material 42 are not in sufficient contact with each other, resulting in a bonded state in which sufficient conductive bonding is not ensured, and the reliability of the crimp bonding There is a problem that is not secured.

  In the configuration described in Patent Document 1, the sheet is in contact with the crimping tool when the sheet is wound. However, in order to prevent thermal deformation of the sheet, the sheet is immediately sagged below the crimping tool. Therefore, when the sheet is spread again on the electronic component, the temperature drops, and no means for solving the above problem is disclosed or suggested.

  Patent Document 2 only discloses a configuration in which a tape positioning unit that arbitrarily positions the vertical position of the tape is provided in a tape supply unit that supplies the tape between the crimping tool and the panel. It does not disclose or suggest a solution.

  In view of the above-described conventional problems, the present invention can reduce the tact time of the crimping process by shortening the temperature rise at the time of crimping in a method of crimping an electronic component to a substrate through a sheet with a crimping tool, and having high reliability. An object of the present invention is to provide an electronic component crimping method and apparatus capable of ensuring a high crimped state.

  In the electronic component crimping method of the present invention, an electronic component is placed on a substrate via a bonding material, the substrate is supported by a backup stage, and the electronic component is heated and pressurized via a sheet by a crimping tool. In the electronic component crimping method in which the electronic component is crimped to the sheet, the sheet is preheated by moving at least one of the sheet and the heating means to the preheating position just before the time required to preheat the sheet by calculating backward from the start of pressing the electronic component. Then, a pressing operation is performed by a crimping tool through the preheated sheet.

  According to this configuration, the sheet is preheated immediately before the crimping operation, and the crimping operation is performed immediately after the preheating, so that the heat escape to the sheet interposed between the crimping tool and the electronic component during the crimping is suppressed. It is possible to shorten the time required to increase the temperature required for bonding with the bonding material, and to shorten the tact time of the crimping process. In addition, since the temperature rise time at the time of pressure bonding is shortened by preheating the sheet, for example, a single sheet with a material having a low thermal conductivity such as polytetrafluoroethylene and having a required cushioning property is obtained. Even if is used, a desired tact can be realized. The preheating temperature of the sheet is preferably as high as possible below the heat resistant temperature of the sheet. The reason is that the temperature of the crimping tool needs to be set to a temperature (for example, 250 to 350 ° C.) that is higher by about 50 to 100 ° C. than the temperature (for example, 200 to 250 ° C.) required for bonding with the bonding material. The temperature is generally much higher than the heat resistance temperature of the sheet (for example, 260 ° C.), but the pressure-bonding time is short when crimping, so that the sheet can sufficiently withstand that temperature. Is because it is necessary to make the temperature lower than the heat resistant temperature.

  Moreover, when the bonding material is an anisotropic conductive material, the temperature rise of the anisotropic conductive material between the substrate and the electronic component can be accelerated, so that the thermosetting adhesive in the anisotropic conductive material is cured. Can be sufficiently ensured, and the anisotropic conductive material is cured in a surely compressed state. As a result, the conductive bonding is sufficiently ensured and bonded, and the reliability of the pressure bonding can be improved. Therefore, the effect is particularly remarkable.

  In addition, when the sheet and the crimping tool are brought into contact with each other or preheated, the crimping tool is also used as a sheet heating unit, so that it is not necessary to separately provide a heating unit, and the cost can be reduced.

  In addition, if the sheet and the heating means provided separately from the crimping tool are brought into contact with each other or preheated, the heating temperature of the sheet can be controlled stably and accurately, and both the shortening of the crimping time and the bonding reliability can be achieved. Can be achieved stably.

  The electronic component crimping apparatus according to the present invention includes a backup stage that supports a substrate on which the electronic component is disposed via a bonding material, a crimping tool that heats and pressurizes the electronic component, and crimps the electronic component to the substrate, and a crimping tool. And a sheet supply means for supplying a sheet so as to be interposed between the electronic component and the sheet supply means, the sheet supply means has a sheet positioning portion for positioning the sheet between the crimping tool and the electronic component, and is crimped At least one of the sheet positioning part and the crimping tool is moved back by the time required for preheating the sheet by calculating backward from the time when the electronic component is pressed by the tool, and the sheet is positioned at a preheating position in contact with or close to the crimping tool. And a control unit that moves the sheet to a position in contact with or close to the electronic component at the start of pressurization. Advantages can be attained.

  In addition, a heating means is provided separately from the crimping tool, and the sheet supply means has a sheet positioning portion for positioning the sheet between the crimping tool and the electronic component, and the sheet is calculated backward from the start of pressing the electronic component by the crimping tool. At least one of the sheet positioning part and heating means is moved before the time required for preheating of the sheet, and the sheet is placed in a preheating position in contact with or close to the heating means, and the sheet is brought into contact with or close to the electronic component at the start of pressurization. Even if a control unit for moving to the above position is provided, the same effect can be obtained.

  According to the electronic component crimping method and apparatus of the present invention, the sheet is preheated prior to the crimping operation to perform the crimping operation, so that the heat escape to the sheet interposed between the crimping tool and the electronic component at the time of crimping is suppressed. It is possible to shorten the time required to increase the temperature required for bonding with the bonding material, and to shorten the tact time of the crimping process.

  Hereinafter, each embodiment of the electronic component crimping method and apparatus of the present invention will be described with reference to FIGS.

(First embodiment)
First, a first embodiment of the present invention will be described with reference to FIGS. In the present embodiment, an electronic component such as TCP or FPC is pressure-bonded to a panel in a flat panel display (FPD) such as a liquid crystal display device.

  1 to 3, an electronic component crimping apparatus 1 is supplied in a state where an electronic component 3 such as TCP is provisionally crimped to a panel 2 which is an example of a substrate, and the electronic component 3 is heated and pressurized to generate a panel 2. This is a device that performs the main pressure bonding. Specifically, the panel 2 is supplied in a state where the electronic component 3 is temporarily press-bonded to the side end portion thereof via an anisotropic conductive material (ACF) 22 (see FIG. 3) as a bonding material. By heating and pressurizing 3, the electronic component 3 is joined to the panel 2 in a state where the electrode of the electronic component 3 and the electrode of the panel 2 are electrically connected by the anisotropic conductive material 22.

  The electronic component crimping apparatus 1 carries a panel 2 into a predetermined position where final crimping is performed and carries it out after the final crimping, and a backup stage 4 that supports the crimping part of the panel 2 from below. In addition, a pressure bonding device 5 that performs the main pressure bonding of the panel 2 and the electronic component 3 in cooperation with the backup stage 4, and a tape-shaped sheet 7 between the pressure bonding head 6 of the pressure bonding device 5 and the electronic component 3 on the backup stage 4. A sheet supply device 8 to be supplied, a panel transfer device (not shown), a crimping device 5, and a control unit 40 that controls operations of the sheet supply device 8 are provided.

  The sheet 7 is preferably a polytetrafluoroethylene sheet as a material to which the anisotropic conductive material 22 that protrudes at the time of crimping is difficult to adhere, and absorbs the dimensional variation of the panel 2 and the electronic component 3 and is in a uniform crimped state. A silicone rubber sheet is suitable as a material having a cushioning property for ensuring heat resistance, and a polyimide sheet having a very high heat resistance temperature is suitable as a material that suppresses deterioration of physical properties due to heat of the crimping head 6. Therefore, depending on the characteristics required by the crimping conditions, any one of these sheets or a plurality of sheets are used in combination and used in a stacked state, or a composite in which any of these sheets is laminated in advance. A sheet is used. Further, in order to improve the thermal conductivity from the crimping head 6 to the electronic component 3, a metal foil may be laminated or a coating layer may be formed.

  The sheet 7 having a thickness of about 0.05 to 0.3 mm is preferably used. Among them, polytetrafluoroethylene has a low thermal conductivity of 0.245 W / (m · K). If it is thick, heat transfer becomes poor, so a thin sheet of about 0.05 to 0.1 mm is used. On the other hand, silicon rubber has a relatively high thermal conductivity of 0.42 W / (m · K), so that heat transfer can be secured even if it is thick to some extent, and 0.2 to 0. A thick sheet of about 3 mm is used.

  The backup stage 4 is configured by installing a stage member 4a made of quartz or ceramics on a base part 4b. In the crimping process, the side end of the panel 2 is placed on the upper surface of the stage member 4a, and the crimping head 6 and The side part of the panel 2 and the electronic component 3 are sandwiched between them, and are heated and pressed to perform pressure bonding.

  The crimping device 5 is arranged so that the crimping head 6 faces directly above the backup stage 4, and the crimping head 6 is moved up and down by a head driving unit 10 installed on a gate-shaped frame 9. It is configured. A crimping tool 11 that presses the crimping part of the electronic component 3 via the sheet 7 is attached to the lower end of the crimping head 6, and a heater (not shown) that heats the crimping tool 11 is incorporated.

  The sheet supply device 8 includes a sheet supply unit 12 disposed on one side of the crimping device 5, a sheet collection unit 13 disposed on the other side of the crimping device 5, and the electronic component 3 temporarily bonded to the crimping tool 11 and the panel 2. And a sheet positioning portion 14 capable of arbitrarily positioning the vertical position of the sheet 7.

  The sheet supply unit 12 absorbs the loading and unloading of the sheet 7 accompanying the operation of the sheet feeding unit 15 and the sheet positioning unit 14 by rotating the supply roll 16 around which the sheet 7 is wound and feeding the sheet 7 by a predetermined amount. And a tension portion 17 for applying a predetermined tension so as not to cause slack. The tension portion 17 includes a pair of guide rollers 17a and 17b, and a tension roller 17c that is urged to move downward between them with a predetermined force. The sheet collection unit 13 is configured by suction / discharge means 18 that sucks and discharges the sheet 7 with a suction force that does not sag.

  The sheet positioning unit 14 includes a pair of left and right lifting bodies 19a and 19b disposed on both sides of the space between the crimping tool 11 and the electronic component 3 on the panel 2 so as to be able to be lifted and positioned. A guide roller 20 and a chuck 21 are provided at 19a and 19b, and the lifting and lowering bodies 19a and 19b are moved up and down and positioned at a predetermined position while the sheet 7 is sandwiched between the chucks 21, so that the guide rollers 20 and 20 are stretched. The height position of the formed sheet 7 can be arbitrarily positioned. It should be noted that the loading and unloading of the sheet 7 in the sheet supply unit 12 and the sheet collection unit 13 accompanying the change in the height position of the sheet 7 is performed without difficulty by the tension unit 17 and the suction / discharge unit 18.

  Specifically, the positioning position of the sheet 7 by the sheet positioning portion 14 is the first position where the sheet 7 is brought into contact with or close to the electronic component 3 on the panel 2 at the time of crimping, and the panel 2 after crimping is carried out. Therefore, the sheet 7 is moved by the heat of the crimping tool 11 while being brought into contact with or in proximity to the crimping tool 11 before the crimping operation. There are three positions of the third position to preheat. Note that the third position for preheating the sheet 7 is the positioning by the sheet positioning unit 14, but may be the positioning by the movement of the crimping tool 11. In this case, the third position may be substantially the same position as the second position.

  Next, a crimping process for crimping the electronic component 3 to the panel 2 by the electronic component crimping apparatus 1 having the above configuration will be described mainly with reference to an operation flow diagram of FIG.

  In FIG. 4, first, the panel 2 on which the electronic component 3 is temporarily crimped is carried into the electronic component crimping apparatus 1, and the side end portion of the panel 2 on which the electronic component 3 is temporarily crimped is disposed on the backup stage 4 and supported. A panel loading operation is performed (step S1). After the carry-in operation of the panel 2 is started, it is determined whether or not it is time to start preheating during the carry-in operation, wait for the preheat start time (step S2), and then sheet positioning The unit 14 is operated to move the seat 7 to the preheating position (step S3). The preheating start time is set backward from the time required for preheating the sheet 7 by calculating backward from the time when the pressing operation of the electronic component 3 by the crimping tool 11 is started. Next, it is determined whether or not a predetermined time required for preheating has elapsed after the start of preheating. When the preheating time expires (step S4), the carry-in operation of the panel 2 is also completed so that the pressurizing operation can be started. So, immediately enter the crimping operation.

  In the crimping operation, first, the sheet positioning unit 14 is operated to lower the sheet 7 along the crimping part of the electronic component 3 on the panel 2 (step S5), and then the head driving unit 10 is operated. The crimping tool 11 is lowered (step S6), and a final crimping operation is performed in which the crimping part of the electronic component 3 is pressed and heated with the crimping tool 11 (step S7). When the main crimping is finished, the crimping tool 11 is raised (step S8), the sheet 7 is raised to the standby position (step S9), and the panel 2 is unloaded from the electronic component crimping apparatus 1 (step S10). Thereafter, the process returns to step S1 to start the next panel 2 carry-in operation, and the above operation is repeated to sequentially perform the main pressure bonding operation of the electronic component 3 on the panel 2.

  According to the above embodiment, prior to the main crimping operation by the crimping tool 11 in steps S5 to S7, the sheet 7 is preheated in steps S2 to S4 immediately before that, and immediately after the preheating, FIGS. As shown in FIG. 2, the side part of the panel 2 to which the electronic component 3 has been temporarily crimped is supported by the backup stage 4, and the crimping portion of the electronic component 3 is heated by the crimping tool 11 through the sheet 7. -Since it pressurizes and this crimps | bonds, the escape of the heat | fever from the crimping tool 11 to the sheet | seat 7 at the time of crimping | compression-bonding can be suppressed. As a result, as shown by a solid line in FIG. 5, the time t1 when the anisotropic conductive material 22 rises to the temperature required for joining (Ts−δT) is set to the time when the sheet 7 of the conventional example is not preheated (indicated by a broken line). The time t2 required for (shown) can be significantly shortened, and the tact time of the main crimping process can be shortened. Note that Ts is a specified joining temperature of the anisotropic conductive material 22 and is a temperature finally reached at the time of joining, and (Ts−δT) is a temperature at which the joining action is effectively started.

  Moreover, since the temperature rise of the anisotropic conductive material 22 can be accelerated as described above, the fluidity of the thermosetting resin 22a in the anisotropic conductive material 22 as shown in FIGS. 7 (a) and 7 (b). Is compressed to a compression thickness t for ensuring that the electrode of the electronic component 3 and the electrode of the panel 2 are sufficiently electrically joined to each other, and the thermosetting resin 22a is cured in this state. . As a result, the anisotropic conductive material 22 is sufficiently heated and pressurized to be compressed and cured, so that the conductive particles 22b in the anisotropic conductive material 22 are thermally cured as shown in FIG. 6C. As shown in FIG. 7 (c), the conductive resin 22a is electrically conductive so that the electrode of the electronic component 3 and the electrode of the panel 2 are electrically joined from the state before the crimping dispersed and dispersed in the conductive resin 22a. Particles 22b can reliably contact each other and can be bonded in a state in which the conductive state is sufficiently secured, improving the reliability of the pressure bonding compared to the state shown in FIG. 12 (c) of the conventional example. can do.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. In the following description of the embodiment, components common to the preceding embodiment are denoted by the same reference numerals, description thereof is omitted, and only differences will be mainly described.

  In the electronic component crimping apparatus 1 of the above-described embodiment, an example in which the tape-like sheet 7 having a width dimension substantially corresponding to the width dimension of the main crimping portion is supplied along the longitudinal direction of the side end portion of the panel 2. However, in this embodiment, as shown in FIGS. 8 and 9, the belt-like sheet 7 having a width that extends over substantially the entire length of the side end portion of the panel 2 is directed from the side end side of the panel 2 toward the center side. A sheet feeding device 23 for feeding is provided.

  The sheet supply device 23 includes a sheet supply unit 24 disposed at the rear portion (left side in FIG. 8) of the crimping device 5, and a sheet collection unit 25 disposed at the front portion (right side in FIG. 8) of the crimping device 5. A sheet positioning unit 26 is provided for passing the sheet 7 between the crimping tool 11 and the electronic component 3 temporarily bonded to the panel 2 and arbitrarily positioning the vertical position of the sheet 7.

  The sheet supply unit 24 includes a supply roll 27 around which the sheet 7 is wound and a tension unit 28 (shown only in FIG. 9). The supply roll 27 is rotatably supported and includes braking means (not shown) for rotating and braking when necessary. The tension portion 28 is composed of a pair of guide rollers 28a and 28b and a tension roller 28c that is urged to move in a direction away from the pair of guide rollers 28a and 28b. The sheet collecting unit 25 includes a winding roll 29 that winds the sheet 7, a motor 30 that rotationally drives the winding roll 29, and a tension unit 31 (shown only in FIG. 9). The tension part 31 is composed of a pair of guide rollers 31a and 31b and a tension roller 31c, like the tension part 28.

  The sheet positioning unit 26 includes a pair of lifting rollers 32 a and 32 b that are in contact with the sheet 7 from above at both the front and rear positions of the crimping tool 11, and the tension unit 28 of the sheet supply unit 24 and the tension unit of the sheet collection unit 25. The sheet 7 is stretched between the elevating rollers 32a and 32b in a planar shape by the tension applied to the sheet 7 at 31. By the vertical movement and positioning of the elevating rollers 32 a and 32 b, the sheet 7 is retracted upward in order to carry out the panel 2 and the first position when the sheet 7 is brought into contact with or close to the electronic component 3 on the panel 2. Then, the sheet 7 is preheated by the heat of the crimping tool 11 by bringing the crimping tool 11 and the sheet 7 into contact with or in proximity to each other before the crimping operation. It is positioned at three positions of the third position during preheating. Note that the third position for preheating the sheet 7 is the positioning by the sheet positioning unit 26, but may be the positioning by the movement of the crimping tool 11. In this case, the third position may be substantially the same position as the second position.

  In FIG. 8, reference numeral 33 denotes a panel transfer device that carries in and out the panel 2, and is composed of an X table 33a, a Y table 33b, and a Z table 33c. Further, the sheet supply device 23 is installed on a mounting frame 34 in the front-rear direction attached to the middle portion in the vertical direction of the frame 9.

  The crimping process in the present embodiment is also similar to the operation of the first embodiment described with reference to FIG. 4 except that the width of the sheet 7 and the supply direction are different, and the same operational effects are obtained.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG.

  In the second embodiment, the example in which the crimping tool 11 is also used as the means for preheating the sheet 7 and the sheet 7 and the crimping tool 11 are preliminarily brought into close contact or in contact with each other is shown. In the embodiment, the heating means 35 is disposed at both front and rear positions slightly below the crimping tool 11. The crimping process in the present embodiment is also the same as the operation of the first embodiment, and the same operation and effect can be obtained. The heating unit is controlled to be heated to a predetermined temperature by moving at least one of the heating unit 35 and the sheet 7. By heating 35 and the sheet 7 in direct contact, the sheet 7 can be preheated to a desired temperature with high accuracy.

  In the above description of the embodiment, only the example in which the electronic component 3 such as TCP temporarily bonded to the panel 2 via the anisotropic conductive material 22 is permanently bonded is described. The present invention can also be applied to an electronic component crimping apparatus that heats and presses an electronic component temporarily fixed to a substrate via various bonding materials such as an anisotropic conductive material 22 and a nonconductive bonding material.

  According to the electronic component crimping method and apparatus of the present invention, the sheet is preheated prior to the crimping operation to perform the crimping operation, so that the escape of heat to the sheet interposed between the crimping tool and the electronic component during the crimping is suppressed. It is possible to shorten the time required to rise to the temperature required for bonding with the bonding material, and to shorten the tact time of the crimping process, so that it can be suitably used for an electronic component crimping apparatus that crimps electronic components to various substrates. Can do.

1 is an overall perspective view of a first embodiment of an electronic component crimping apparatus according to the present invention. The front view of the embodiment. The side view of the embodiment. The operation | movement flowchart of the same embodiment. The characteristic view of the temperature change of the joining material at the time of pressure bonding. The state at the time of the crimping | compression-bonding start of the embodiment is shown, (a) is a side view of the crimping part, (b) is an enlarged view of the main part, and (c) is a schematic view of the bonding material viewed from the bottom of the panel with a microscope. . The state at the time of the crimping | compression-bonding of the embodiment is shown, (a) is a side view of the crimping part, (b) is an enlarged view of the main part, and (c) is a schematic view of the bonding material viewed from the bottom of the panel with a microscope. The whole perspective view of 2nd Embodiment of the electronic component crimping apparatus of this invention. The front view of the embodiment. The whole front view of 3rd Embodiment of the electronic component crimping apparatus of this invention. The structure of the crimping | compression-bonding part in the electronic component crimping apparatus of a prior art example is shown, (a) is a side view, (b) is composition explanatory drawing of an anisotropic electrically-conductive material. The state at the time of the crimping | compression-bonding in a prior art example is shown, (a) is a side view of a crimping | compression-bonding part, (b) is the principal part enlarged view, (c) is the schematic diagram of the state which looked at the bonding material with the microscope from the panel lower surface.

Explanation of symbols

1 Electronic component crimping device 2 Panel (substrate)
DESCRIPTION OF SYMBOLS 3 Electronic component 4 Backup stage 7 Sheet 8 Sheet supply apparatus 11 Crimping tool 14 Sheet positioning part 22 Anisotropic conductive material (bonding material)
23 Sheet feeding device 26 Sheet positioning unit 35 Heating means 40 Control unit

Claims (6)

  An electronic component is placed on a substrate via a bonding material, this substrate is supported by a backup stage, and the electronic component is crimped to the substrate by heating and pressing the electronic component via a sheet with a crimping tool. In the method, the sheet is preheated by moving at least one of the sheet and the heating means to the preheating position by the time required for the preheating of the sheet by counting backward from the start of pressurization of the electronic component, and then via the preheated sheet. An electronic component crimping method characterized by performing a pressing operation with a crimping tool.   The electronic component crimping method according to claim 1, wherein the bonding material is an anisotropic conductive material.   3. The electronic component crimping method according to claim 1 or 2, wherein the sheet and the crimping tool are brought into contact with or in proximity to each other and preheated.   3. The electronic component crimping method according to claim 1 or 2, wherein the sheet and the heating means provided separately from the crimping tool are brought into contact with each other or brought into close proximity to preheat.   A backup stage that supports a substrate on which electronic components are arranged via a bonding material, a crimping tool that heats and pressurizes the electronic components to crimp the electronic components to the substrate, and a sheet that is interposed between the crimping tool and the electronic components In the electronic component crimping apparatus including the sheet feeding means for feeding the sheet, the sheet feeding means has a sheet positioning portion for positioning the sheet between the crimping tool and the electronic component, and from the start of pressing the electronic component by the crimping tool. Back-calculate and move at least one of the sheet positioning part and the crimping tool just before the time required to preheat the sheet, and place the sheet in a preheating position in contact with or close to the crimping tool. An electronic component crimping apparatus comprising a control unit that moves to a position in contact with or close to the electronic component.   A backup stage that supports a substrate on which electronic components are arranged via a bonding material, a crimping tool that heats and pressurizes the electronic components to crimp the electronic components to the substrate, and a sheet that is interposed between the crimping tool and the electronic components In the electronic component crimping apparatus comprising the sheet feeding means for feeding the sheet, a heating means is provided separately from the crimping tool, and the sheet feeding means has a sheet positioning portion for positioning the sheet between the crimping tool and the electronic component, and is crimped. At least one of the sheet positioning part and heating means is moved backward from the time when the electronic component is pressed by the tool, and the sheet is positioned at a preheating position in contact with or close to the heating means. An electronic component crimping apparatus comprising a control unit that moves the sheet to a position in contact with or close to the electronic component at the start of pressurization.

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