TW473637B - Apparatus for press-bonding liquid crystal panel and method of producing liquid crystal device - Google Patents

Apparatus for press-bonding liquid crystal panel and method of producing liquid crystal device Download PDF

Info

Publication number
TW473637B
TW473637B TW086114465A TW86114465A TW473637B TW 473637 B TW473637 B TW 473637B TW 086114465 A TW086114465 A TW 086114465A TW 86114465 A TW86114465 A TW 86114465A TW 473637 B TW473637 B TW 473637B
Authority
TW
Taiwan
Prior art keywords
liquid crystal
press
panel
crystal panel
bonding
Prior art date
Application number
TW086114465A
Other languages
Chinese (zh)
Inventor
Tsutomu Sasaki
Sadaaki Yui
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of TW473637B publication Critical patent/TW473637B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Abstract

The present invention provides a press-bonding apparatus which can uniformly press the entire surface areas of electronic components such as a liquid crystal driving IC, a heat seal, etc., onto a liquid crystal panel and can bond them evenly by a simple construction. The feature of the press-bonding device of the present invention is as follows: a panel support table to support the mainbody of the liquid crystal panel, a panel receiving table to support the extension portion of substrate of the liquid crystal panel, and a press-bonding head allocated opposing to the panel receiving table, which can move closer to or away from the direction of the panel receiving table, also, the panel support table is supported by a spring, which can move freely in such a manner as to follow the movement of the press-bonding head.
TW086114465A 1996-10-04 1997-10-03 Apparatus for press-bonding liquid crystal panel and method of producing liquid crystal device TW473637B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26494696A JP3478020B2 (en) 1996-10-04 1996-10-04 Liquid crystal device manufacturing apparatus and liquid crystal device manufacturing method

Publications (1)

Publication Number Publication Date
TW473637B true TW473637B (en) 2002-01-21

Family

ID=17410395

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114465A TW473637B (en) 1996-10-04 1997-10-03 Apparatus for press-bonding liquid crystal panel and method of producing liquid crystal device

Country Status (5)

Country Link
JP (1) JP3478020B2 (en)
KR (1) KR100476126B1 (en)
CN (1) CN1124516C (en)
TW (1) TW473637B (en)
WO (1) WO1998014821A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3662156B2 (en) * 2000-01-26 2005-06-22 信越エンジニアリング株式会社 LCD panel manufacturing equipment
US6885427B2 (en) * 2002-03-15 2005-04-26 Lg.Philips Lcd Co., Ltd. Substrate bonding apparatus for liquid crystal display device having alignment system with one end provided inside vacuum chamber
CN1325981C (en) * 2002-03-20 2007-07-11 Lg.菲利浦Lcd株式会社 Working platform structure of binding machine and its control method
KR100685923B1 (en) * 2002-03-25 2007-02-23 엘지.필립스 엘시디 주식회사 Bonding devise and method for manufacturing liquid crystal display device using the same
JP4552441B2 (en) * 2004-01-16 2010-09-29 パナソニック株式会社 Liquid crystal panel component mounting equipment
JP4555008B2 (en) * 2004-07-08 2010-09-29 パナソニック株式会社 Component mounting equipment
JP4522826B2 (en) * 2004-11-17 2010-08-11 Ｊｕｋｉ株式会社 Electronic component crimping equipment
CN101520347B (en) * 2008-02-26 2010-10-27 界鸿科技股份有限公司 Electronic element-takeout and placing device with pressure detecting function and pressure detecting method
KR100947430B1 (en) * 2008-04-14 2010-03-12 주식회사 성진하이메크 Automatic Module Processing Apparatus For Manufacturing Display Panel
KR101511616B1 (en) * 2013-07-18 2015-04-13 (주)정원기술 Head for mounting a semiconductor chip
CN109064886B (en) * 2018-08-29 2020-04-03 武汉华星光电技术有限公司 Binding machine horizontal alignment system and method
CN111694175B (en) * 2020-06-30 2022-06-17 苏州精濑光电有限公司 Parking mechanism and detection device
CN113253497B (en) * 2021-06-08 2021-09-07 江苏二五七特显科技集团有限公司 High-definition liquid crystal display assembling tool clamp and assembling method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3165215B2 (en) * 1992-02-14 2001-05-14 松下電器産業株式会社 LCD panel component mounting equipment
JP3331570B2 (en) * 1993-09-08 2002-10-07 ソニー株式会社 Thermocompression bonding apparatus, thermocompression bonding method, and method for producing liquid crystal display device

Also Published As

Publication number Publication date
WO1998014821A1 (en) 1998-04-09
CN1209885A (en) 1999-03-03
KR100476126B1 (en) 2005-08-24
CN1124516C (en) 2003-10-15
KR19990071852A (en) 1999-09-27
JPH10111484A (en) 1998-04-28
JP3478020B2 (en) 2003-12-10

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Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees