WO1998014821A1 - Appareil de collage sous pression d'un panneau a cristaux liquides, et procede de fabrication d'un dispositif a cristaux liquides - Google Patents

Appareil de collage sous pression d'un panneau a cristaux liquides, et procede de fabrication d'un dispositif a cristaux liquides Download PDF

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Publication number
WO1998014821A1
WO1998014821A1 PCT/JP1997/003577 JP9703577W WO9814821A1 WO 1998014821 A1 WO1998014821 A1 WO 1998014821A1 JP 9703577 W JP9703577 W JP 9703577W WO 9814821 A1 WO9814821 A1 WO 9814821A1
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WO
WIPO (PCT)
Prior art keywords
liquid crystal
panel
crystal panel
crimping
panel support
Prior art date
Application number
PCT/JP1997/003577
Other languages
English (en)
Japanese (ja)
Inventor
Tsutomu Sasaki
Sadaaki Yui
Original Assignee
Seiko Epson Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corporation filed Critical Seiko Epson Corporation
Publication of WO1998014821A1 publication Critical patent/WO1998014821A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Definitions

  • the present invention relates to a pressure bonding apparatus for bonding electronic components such as TCP and liquid crystal driving ICs to electrode terminals formed on a transparent substrate of a liquid crystal panel, and a method for manufacturing a liquid crystal device using the pressure bonding apparatus.
  • a liquid crystal panel is formed by enclosing liquid crystal in a cell gap formed between a pair of opposing transparent substrates.
  • various methods have been conventionally known.
  • a liquid crystal driving IC to a transparent substrate of a liquid crystal panel using a bonding member such as ACF (Anisotropiconpiconductievefi1m: anisotropic conductive film).
  • ACF Adisotropiconpiconductievefi1m: anisotropic conductive film
  • TCP Tepe CarririerPackage: Tape Carrier Package
  • this TCP is a TAB (Tape Automated Bonding) method on a FPC (Flexible Printed Circuit) with a wiring pattern formed on it.
  • a liquid crystal driving IC is mounted by using.
  • the TCP is conductively connected to a transparent substrate of the liquid crystal panel through an ACF heat shield or the like.
  • PCB Print C ircuit B oa (rd: printed circuit board)
  • a liquid crystal driving IC is bonded onto the printed circuit board, and the PCB is conductively connected to the liquid crystal panel using a heat seal.
  • various electronic components such as the liquid crystal driving IC itself, a TCP, and a heat seal are connected on the transparent substrate of the liquid crystal panel.
  • the FPC which is a component of TCP
  • the crimping process was conventionally performed using a crimping device as shown in FIG.
  • the main body of the liquid crystal panel 52 is placed on the panel support 51, and the protruding portion of the transparent substrate 53 a of the liquid crystal panel 52 is placed on the panel support 54. Then, ACF56 is stuck on the overhanging portion of the transparent substrate 53a, and FPC57 is temporarily bonded thereon. After that, the FPC 57 is lowered on the transparent substrate 53 a by lowering the pressure bonding head 58 heated to a predetermined temperature and pressing the FPC 57 onto the protruding portion of the transparent substrate 53 a. Glue to
  • the crimp head is set. With 58, uniform pressure bonding can be performed. However, if the panel support 51 is higher than the predetermined position, as shown in FIG. 9, the overhang portions of the FPC 57 and the substrate 53a cannot be uniformly pressed by the crimping head 58. If the panel support 51 is lower than the predetermined position, as shown in FIG. 10, the liquid crystal panel 52 rises, so that uniform pressing cannot be performed. Further, as a conventional crimping device, there is, for example, a device disclosed in Japanese Patent Application Laid-Open No. 4-70816 or Japanese Patent Application No.
  • Japanese Unexamined Patent Publication No. Hei 7-170816 discloses a structure for electrically connecting a carrier including an IC chip on a transparent substrate of a liquid crystal panel, in which a carrier tape is attached to the transparent substrate. There is disclosed a structure in which a compression head for pressing is supported by an elastic swinging mechanism. Also, Japanese Patent Application Laid-Open No. 5-314130 discloses a structure for conductively connecting a liquid crystal driving IC as a TAB component on a substrate of a liquid crystal panel. There is disclosed a structure in which a liquid crystal driving IC is pressed against a substrate by a pressure block while the liquid crystal driving IC is placed on the substrate. In this structure, a fixed pressure can be instantaneously applied to the liquid crystal drive IC by driving the crimping pro- cedure using two pressurizing cylinders.
  • a support base for supporting the main body of the liquid crystal panel is fixedly installed and corresponds to the above-mentioned panel support.
  • the backup jig can move up and down.
  • arranging the backup jig so that it can move up and down complicates the structure and increases the cost.
  • the bonding between the transparent substrate of the liquid crystal panel and electronic components such as FPCs The state may be unstable.
  • a support table for supporting a liquid crystal panel can be moved in the left-right direction to transport the liquid crystal panel.
  • it cannot move up and down. Therefore, it includes the above-described problems described with reference to FIGS. 8 to 10.
  • the present invention has been made in view of the above problems, and has a simple structure to uniformly cover the entire surface of electronic components such as a liquid crystal driving IC and a heat seal with respect to a liquid crystal panel. It is an object of the present invention to provide a pressure bonding device that can be pressed and adhered evenly. Disclosure of the invention
  • a pressure bonding device for a liquid crystal panel is a pressure bonding device for bonding an electronic component under pressure to a substrate overhanging portion of a liquid crystal panel having a main body portion and a substrate overhanging portion, and supports the liquid crystal panel main body portion.
  • a panel support that supports the overhanging part of the liquid crystal panel, And a crimping head that is arranged to face the panel receiver and is movable in a direction approaching and away from the panel receiver.
  • the panel support is movable in parallel in the same direction as the direction of movement of the crimp head, and is supported by the reaction force applying means.
  • the reaction force applying means can be configured by using an elastic force due to a spring or the like, pneumatic pressure, oil pressure, or the like as a reaction force source.
  • the liquid crystal driving IC itself the heat seal, the TCP (TapEcarRirierPaccage) and the like can be considered.
  • the liquid crystal driving IC itself is directly bonded to the transparent substrate of the liquid crystal panel, that is, when producing a COG (Chip On G 1 ass) type liquid crystal panel, the liquid crystal driving IC and the transparent substrate are used.
  • a bonding member such as ACF is interposed between them to bond them.
  • the situation where the heat seal is bonded to the transparent substrate occurs when the PCB mounting the liquid crystal driving IC is connected to the transparent substrate via the heat seal.
  • an adhesive member such as ACF and a heat seal are interposed between the TCP and the transparent substrate.
  • the panel support supporting the main body of the liquid crystal panel is held in a so-called floating state by the reaction force applying means, so that the liquid crystal panel follows the movement of the crimp head.
  • the liquid crystal panel can move freely, so that the pressure bonding process can be performed while the liquid crystal panel is always placed horizontally, so that the entire area of electronic components such as a liquid crystal driving IC can be pressed with a uniform pressure.
  • the panel supporting base has a movable structure
  • the panel supporting base for supporting the overhanging portion of the liquid crystal panel substrate can be fixedly arranged, so that the portion corresponding to the panel supporting base can be moved up and down.
  • the pressing force applied between the substrate and the electronic component can be stably maintained at a certain level.
  • the liquid crystal panel and the electronic components can be stably and firmly bonded without any variance.
  • the panel support Since a driving device for moving up and down is not required, the structure is simplified and the cost is reduced.
  • the panel support is movably arranged under the action of the reaction force applying means, but the reaction force applying means does not include a special driving device, so that the structure is complicated and the cost is increased. None.
  • the panel support moves in the same direction as the crimping head, as described above, but in addition, the panel support is installed so that it can be tilted and moved within a relatively small angle range. can do. This allows the entire surface of the electronic component to be pressed evenly by the crimping head, even if the temporary bonding state of the electronic component to the liquid crystal panel varies.
  • the method for manufacturing a liquid crystal panel includes: (1) a step of placing a main body of the liquid crystal panel on a panel support; and (2) placing a substrate overhang of the liquid crystal panel on a panel receiving stand. And (3) placing the electronic component on the substrate overhang with an adhesive member in between, and (4) pressing the electronic component toward the panel cradle with a crimping head. Bonding a component to a substrate overhang of the liquid crystal panel.
  • the panel support can be moved in the same direction as the direction of movement of the crimping head and the spring can be moved. It is supported by reaction force applying means such as. BRIEF DESCRIPTION OF THE FIGURES
  • FIG. 1 is a perspective view showing an embodiment of a liquid crystal panel crimping apparatus according to the present invention.
  • FIG. 2 is a side view showing a main part of the crimping device of FIG. 1, particularly a structure of a part supporting a liquid crystal panel.
  • FIG. 3 is a plan view of the structure shown in FIG.
  • FIG. 4 is a front view of the structure shown in FIG.
  • Fig. 5 is a side view showing the state of the structure shown in Fig. 2 during crimping work. is there.
  • FIG. 6 is a perspective view showing an example of a liquid crystal panel to be subjected to a crimping operation.
  • FIG. 7 is a sectional view showing a sectional structure of the liquid crystal panel of FIG.
  • FIG. 8 is a sectional view showing an example of a conventional liquid crystal panel crimping apparatus.
  • FIG. 9 is a sectional view showing one operation state of the conventional device in FIG.
  • FIG. 10 is a sectional view showing another operation state of the conventional device of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 shows an embodiment of a liquid crystal panel crimping apparatus according to the present invention.
  • This crimping apparatus has a crimping operation stage 11, a left panel loading stage 12, and a right panel loading stage 13.
  • the panel positioning unit 16 is disposed on the base 14.
  • the panel positioning unit 16 has a support frame 17 that can rotate about the vertical axis X as a center as shown by an arrow A and can also translate in the front-rear direction as shown by an arrow B, and its support frame 17. It has a guide panel 18 fixed to the upper end of the frame 17 and elongated in the lateral direction.
  • the support frame 17 and the guide panel 18 supported by the support frame 17 can be translated in the direction of arrow B by rotating the front / rear adjustment knob 19 in either direction. .
  • the support frame 17 and the guide panel 18 supported by the support frame 17 are moved around the vertical axis X. Can be rotated.
  • Base 1 4 over 3 stages: left panel loading stage 1 2, crimping stage 1 1 1, and right panel loading stage 1 3
  • each of these table units 23 and 24 has a slide table 26 slidably mounted on a guide rail 22 and a slide table 26. It has an elevating table 28 that is guided by a guide rod 27 that is set up on one bull 26 and moves up and down. The elevating table 28 is driven by an air cylinder 29 disposed on the slide table 26 to move up and down as indicated by an arrow C.
  • the slide table 26 of the left table unit 23 and the slide table 26 of the right table unit 24 are connected to each other by a connection plate 31.
  • a linear drive (not shown) is connected to either the left tape unit 23 or the right table unit 24, and driven by the linear drive unit to drive the left table unit 23 and the right table unit 2 together. 4 As a body, move left and right on guide rails 2 2.
  • This linear drive device can be constituted by an arbitrary structure. For example, it can be constituted by using a feed screw.
  • the left table unit 23 is located on the left panel loading stage 12 and the right table unit 24 is located on the crimping stage 11.
  • the left table unit 23 is driven by the linear drive device and carried to the crimping work stage 11, the right table unit 24 is automatically moved to the right panel loading stage 13 accordingly. Carried.
  • Each of the left table unit 23 and the right table unit 24 is provided with a plurality of, in this embodiment, five, panel supports 1. As shown in FIG. 2, these panel supports 1 are fixed to the upper end of a lift port 32 supported by a lift table 28 so as to be movable up and down.
  • the lifting rod 32 has one panel as shown in Fig. 4. Two are provided in the horizontal direction with respect to the table support table 1, and a balance spring 33 is provided between the lift ports 32.
  • the balance spring 33 is arranged between the adjustment screw 34 fitted to the panel support 1 and the lifting table 28.
  • a guide bin 41 for positioning the liquid crystal panel 2 to be worked from the side is fixed to the upper surface of the panel support 1.
  • a V-groove block 36 is provided at the rear end (left end in the figure) of the panel support 1 and is supported by a bracket 38 extending from the rear end of the lifting table 28.
  • the locking air cylinder 37 thus provided is disposed to face the V-groove block 36.
  • the locking piece 39 formed at the tip of the output shaft of the locking air cylinder 37 is shown in FIG. 2 when the air cylinder 37 is operated and the output shaft is extended. So that it fits in the V groove of the V groove block 36.
  • the panel support 1 is fixedly held, that is, locked so as not to move in any of the vertical and horizontal directions.
  • the locked state of the panel support 1 is released, and the panel support 1 is pushed upward by the elastic force of the balance spring 33 while being supported by the lifting / lowering opening 32.
  • the panel support 1 in this state is floating in the space only by the elastic force of the balance spring 33, and therefore, when an external force in the vertical direction is applied to this panel support 1, Can move freely in the direction of the external force.
  • the panel support 1 Since the panel support 1 is fixed to the upper end of the lift port 3 2 which moves vertically with respect to the lifting table 28, the direction of movement of the panel support 1 is restricted almost vertically. Is done. However, in this embodiment, a slight margin, that is, a gap is provided for the fitting between the lifting / lowering opening pad 32 and the lifting / lowering table 28. For this reason, the panel In addition to the vertical movement, the support base 1 can be tilted and moved within a very small angle range as shown by an arrow D in FIG. 5 and an arrow E in FIG.
  • an air suction opening 54 is opened on the surface of the panel support 1 toward the outside, and an air passage 53 extending from the opening 54 is formed inside the panel support 1. .
  • An air intake device 55 is connected to the air passage 53. When the air intake device 55 is operated, external air is sucked through the opening 54. By this air suction, the liquid crystal panel 2 placed on the non-nel support 1 is held by suction.
  • a plurality of panel supports 4 in this embodiment, five panel supports 4 are arranged in parallel with the guide rails 22 on the base 14. Further, the top plate 4 3 is supported by the columns 42, and five crimping heads 8 are provided so as to hang down from the top plate 4 3. These crimping heads 8 are accurately positioned above the individual panel supports 4. At the upper position of the top plate 43, air cylinders 44 are arranged corresponding to the individual crimp heads 8. The compression head 8 is driven by these air cylinders 44, and moves up and down as shown by arrows FF in FIG.
  • each crimping head 8 is heated to a predetermined temperature by the heater.
  • tape take-up reels 46a and 46b are fixedly installed at left and right side ends of a top plate 43.
  • Tapes 47 made of fluororesin, for example, Teflon (trade name) are wound around these reels.
  • the fluororesin film tape 47 protrudes below the crimping head 8 as shown in FIG.
  • the temperature adjustment and the position adjustment can be performed independently. Therefore, the individual crimping heads 8 can perform the crimping process under the best crimping conditions without being influenced by other crimping heads.
  • this liquid crystal panel 2 is made of a sealing material 7 with a glass 9 second transparent substrate 3b and a spacer 9 interposed therebetween as well as a glass first transparent substrate 3a.
  • a sealing material 7 with a glass 9 second transparent substrate 3b and a spacer 9 interposed therebetween as well as a glass first transparent substrate 3a.
  • the part of the liquid crystal panel 2 in which the liquid crystal 5 is sealed is the main part of the liquid crystal panel.
  • a first transparent electrode 10a is formed on the inner surface of the first transparent substrate 3a, and a second transparent electrode 10b is formed on the inner surface of the second transparent substrate 3b. Then, electrode terminals 48 connected to these transparent electrodes are formed on the protruding portion 3c of the first transparent substrate 3a. A connection terminal 49 for conductively connecting an external circuit is formed at an end of the substrate extension 3c. Further, polarizing plates 51a and 51b are attached to the outer surfaces of the transparent substrates 3a and 3b, respectively.
  • the liquid crystal driving IC 15 When the liquid crystal driving IC 15 is mounted on the liquid crystal panel 2, first, as shown in FIG. 6, ACF 6 is attached to a predetermined position on the overhanging portion 3c of the substrate 3a. Further, the liquid crystal driving IC 15 is placed on the ACF 6, and the liquid crystal driving IC 15 is heated to a predetermined temperature and simultaneously pressed against the substrate extension 3c. Due to this heat-compression bonding, the liquid crystal driving IC 15 and the substrate overhanging portion 3c are fixed to each other by the resin portion of the ACF 6, and at the same time, the liquid crystal driving IC is dispersed by the conductive particles dispersed in the resin.
  • the input and output bumps of IC 15 Conductively connect to the external connection terminal 49 and the electrode terminal 48 on the board.
  • the crimping apparatus is configured such that, for the liquid crystal panel 2 on which the ACF 6 and the liquid crystal driving IC 15 are temporarily bonded at predetermined positions of the substrate overhang portion 3C, the liquid crystal driving IC 15
  • the formal crimping that is, the actual crimping operation, is performed, and the main crimping work will be described below.
  • the left table unit 23 is set on the left panel loading stage 12.
  • the output shaft of the locking air cylinder 37 is extended as shown in FIG. 2, and the locking piece 39 at the end of the output shaft is connected to the V-groove block 3 of the panel support 1. 6, and as a result, the panel support 1 is in an immovable locked state.
  • the air cylinder 29 on the slide table 26 is in an extended state, and the lift table 28 is set to the upper position.
  • the liquid crystal panel 2 to be worked is placed on each panel support 1 in the left table unit 23, and is fixed by suction by air suction.
  • the ACF 6 and the liquid crystal driving IC 15 are temporarily bonded at predetermined positions.
  • the side edge of the liquid crystal panel 2 is pressed against the guide bin 41, and the front end is further guided to the guide panel 1. 8
  • the liquid crystal panel 2 is positioned at a fixed position on the panel support 1. Note that the position of the guide panel 18 can be adjusted to a desired position by appropriately turning both or one of the front / rear adjustment knob 19 and the angle adjustment knob 21 in FIG.
  • the linear drive unit (not shown) for driving the table is activated, and the left table unit 23 moves along the guide rail 22. Then, it is transported to the crimping work stage 11. At this time, the right table unit 24 is carried from the crimping work stage 11 to the right panel loading stage 13. left When the side table 23 is carried to the crimping work stage 11 and stopped there, in FIG. 2, the overhang 3 c of the liquid crystal panel 2 on the panel support 1 is provided with a panel support. It is located at an appropriate distance from the platform 4 at an upper position.
  • the locking air cylinder 37 operates to release the locking piece 39 from the V-groove block 36, releasing the opening of the panel support base 1. Then, the elevating and lowering air cylinder 29 is operated and its output shaft is retracted. Then, the force pushing up the panel support 1 is released, and the panel support 1 descends as shown by the arrow G in FIG. 5, and the substrate overhang 3 c of the liquid crystal panel 2 is moved downward. Stop when the bottom touches or approaches the upper end of panel support 4. Regarding whether to stop the liquid crystal panel 2 in contact with the panel support 4 or in the proximity, that is, in a slightly floating state, there is no problem in terms of function. However, which state is to be set can be adjusted by turning the adjustment screw 34 in FIG.
  • the crimping head 8 descends along with the fluorine-inclined resin film tape 47 as shown by the arrow F, and hits the upper surface of the liquid crystal driving IC 15 on the liquid crystal panel 2, and further. It is pressed against the panel support 4 with a predetermined pressure. As a result, the ACF 6 interposed between the liquid crystal driving IC 15 and the substrate overhang portion 3c of the liquid crystal panel 2 is heated and pressurized. As a result, the liquid crystal driving IC 15 extends over the substrate. Glued to part 3c. In this way, the final pressure bonding of the liquid crystal drive IC 15 is completed.
  • the reason that the fluorine-inclined resin film tape 47 is interposed between the crimping head 8 and the liquid crystal driving IC 15 is that the crimping head 8 directly contacts the bonding IC 15. This is to avoid it.
  • the panel support 1 is supported in a substantially floating state by the elastic reaction force of the balance spring 33 and can move freely in the vertical direction. Hold horizontal It is pressed by the crimping head 8 in the pressed state.
  • the liquid crystal driving IC 15 is stably and strongly adhered to the substrate of the liquid crystal panel 2 without variation.
  • the panel support 1 can be slightly tilted and moved. Even if the temporary bonding state of the liquid crystal driving IC 15 varies, the pressure bonding head 8 can uniformly press the entire surface of the liquid crystal driving IC 15.
  • the pressure bonding head 8 is moved up as shown by the arrow F in FIG. 29 is activated and its output shaft is extended.
  • the lifting table 28 is raised, and the panel support 1 is returned to the upper position shown in FIG.
  • the left table unit 23 in Fig. 1 is returned from the crimping work table 11 to the left panel loading stage 12 again, and the liquid crystal panel 2 that has completed the crimping work is moved from the panel support 1 to the left panel unit 2. Collected.
  • the operator While the left table unit 23 is set on the crimping work stage 11 and the above-described final crimping operation is performed, the operator operates the right table unit 24 placed on the right panel loading stage 13. Then, load the unprocessed liquid crystal panel 2.
  • the right table unit The brunit 24 is automatically carried to the crimping stage 11 and subjected to the final crimping operation. In this way, the final crimping work is performed alternately on the left table brunet 23 and the right table brunet 24.
  • the present invention was applied to the panel.
  • the liquid crystal drive IC itself as an electronic component to be crimped to the liquid crystal panel.
  • the present invention can be applied to the case where another electronic component such as a heat shield TCP is electrically connected to the liquid crystal panel. In these cases, the heat seal, the TCP, and the like are pressed by the pressure bonding head 8.
  • the number of panel supports 1 prepared for each table unit 23, 24 is not limited to five, but may be smaller or larger, and may be one in some cases.
  • one table unit is fixedly installed and the table unit is installed. The crimping work can be performed using only Industrial applicability
  • the entire surface of an electronic component such as a liquid crystal driving IC and a heat seal can be uniformly pressed against a liquid crystal panel by uniformly pressing the same. It is possible to provide a crimping device suitable for the above.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Cette invention concerne un appareil de collage sous pression, lequel permet de presser uniformément, contre un panneau à cristaux liquides, la surface toute entière de composants électroniques tels des circuits intégrés d'actionnement de cristaux liquides, des joints thermiques, etc. Cet appareil permet également de coller ces composants de manière régulière grâce à une structure simple. Une console de support (1) de panneau est montée sur l'extrémité supérieure d'une tige de levage (32) qui se trouve en position verticale et peut se déplacer par rapport à une table (28). La console de support (1) du panneau est montée sur un ressort (33), et le panneau à cristaux liquides (2) est disposé sur cette console de support (1). Le panneau à cristaux liquides (2) est ensuite équilibré, puis arrêté en une position où la partie saillante (3c) d'un substrat transparent entre en contact avec l'extrémité supérieure d'une console de réception (4) du panneau ou se rapproche de celle-ci. Un circuit intégré (15), que l'on souhaite coller au substrat (3c), est poussé vers ce dernier (3c) en faisant descendre une tête de collage sous pression (8), puis collé. Le fait que la console de support (1) du panneau est montée sur un ressort (33) lui permet de se déplacer librement et de suivre le mouvement de la tête de collage sous pression (8). Le circuit intégré (15) peut ainsi être poussé vers le panneau à cristaux liquides d'une manière qui reste stable et dans des conditions constantes.
PCT/JP1997/003577 1996-10-04 1997-10-06 Appareil de collage sous pression d'un panneau a cristaux liquides, et procede de fabrication d'un dispositif a cristaux liquides WO1998014821A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26494696A JP3478020B2 (ja) 1996-10-04 1996-10-04 液晶装置の製造装置および液晶装置の製造方法
JP8/264946 1996-10-04

Publications (1)

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JP3662156B2 (ja) * 2000-01-26 2005-06-22 信越エンジニアリング株式会社 液晶パネル製造装置
US6885427B2 (en) * 2002-03-15 2005-04-26 Lg.Philips Lcd Co., Ltd. Substrate bonding apparatus for liquid crystal display device having alignment system with one end provided inside vacuum chamber
CN1325981C (zh) * 2002-03-20 2007-07-11 Lg.菲利浦Lcd株式会社 粘合机中的工作台结构及其控制方法
KR100685923B1 (ko) * 2002-03-25 2007-02-23 엘지.필립스 엘시디 주식회사 합착 장치 및 이를 이용한 액정표시장치의 제조 방법
JP4552441B2 (ja) * 2004-01-16 2010-09-29 パナソニック株式会社 液晶パネル用部品実装装置
JP4555008B2 (ja) * 2004-07-08 2010-09-29 パナソニック株式会社 部品実装装置
JP4522826B2 (ja) * 2004-11-17 2010-08-11 Ｊｕｋｉ株式会社 電子部品圧着装置
CN101520347B (zh) * 2008-02-26 2010-10-27 界鸿科技股份有限公司 带有压力检测的电子元件取出与置放装置及压力检测方法
KR100947430B1 (ko) * 2008-04-14 2010-03-12 주식회사 성진하이메크 표시 패널 제조를 위한 모듈공정 자동화 장치
KR101511616B1 (ko) * 2013-07-18 2015-04-13 (주)정원기술 반도체 칩 마운팅용 헤드
CN109064886B (zh) * 2018-08-29 2020-04-03 武汉华星光电技术有限公司 一种绑定机台水平对位系统及方法
CN111694175B (zh) * 2020-06-30 2022-06-17 苏州精濑光电有限公司 一种停驻机构及检测装置
CN113253497B (zh) * 2021-06-08 2021-09-07 江苏二五七特显科技集团有限公司 一种高清液晶屏组装工装夹具及组装方法

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CN1209885A (zh) 1999-03-03
KR100476126B1 (ko) 2005-08-24
JPH10111484A (ja) 1998-04-28
KR19990071852A (ko) 1999-09-27
TW473637B (en) 2002-01-21
JP3478020B2 (ja) 2003-12-10
CN1124516C (zh) 2003-10-15

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