JP3478020B2 - 液晶装置の製造装置および液晶装置の製造方法 - Google Patents
液晶装置の製造装置および液晶装置の製造方法Info
- Publication number
- JP3478020B2 JP3478020B2 JP26494696A JP26494696A JP3478020B2 JP 3478020 B2 JP3478020 B2 JP 3478020B2 JP 26494696 A JP26494696 A JP 26494696A JP 26494696 A JP26494696 A JP 26494696A JP 3478020 B2 JP3478020 B2 JP 3478020B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- panel
- crimping
- panel support
- crystal panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26494696A JP3478020B2 (ja) | 1996-10-04 | 1996-10-04 | 液晶装置の製造装置および液晶装置の製造方法 |
TW086114465A TW473637B (en) | 1996-10-04 | 1997-10-03 | Apparatus for press-bonding liquid crystal panel and method of producing liquid crystal device |
PCT/JP1997/003577 WO1998014821A1 (fr) | 1996-10-04 | 1997-10-06 | Appareil de collage sous pression d'un panneau a cristaux liquides, et procede de fabrication d'un dispositif a cristaux liquides |
CN97191875A CN1124516C (zh) | 1996-10-04 | 1997-10-06 | 液晶屏的压接装置及液晶器件的制造方法 |
KR10-1998-0704136A KR100476126B1 (ko) | 1996-10-04 | 1997-10-06 | 액정패널의압착장치및액정장치의제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26494696A JP3478020B2 (ja) | 1996-10-04 | 1996-10-04 | 液晶装置の製造装置および液晶装置の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002212645A Division JP3707453B2 (ja) | 2002-07-22 | 2002-07-22 | 液晶装置の製造装置および液晶装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10111484A JPH10111484A (ja) | 1998-04-28 |
JP3478020B2 true JP3478020B2 (ja) | 2003-12-10 |
Family
ID=17410395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26494696A Expired - Lifetime JP3478020B2 (ja) | 1996-10-04 | 1996-10-04 | 液晶装置の製造装置および液晶装置の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3478020B2 (fr) |
KR (1) | KR100476126B1 (fr) |
CN (1) | CN1124516C (fr) |
TW (1) | TW473637B (fr) |
WO (1) | WO1998014821A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3662156B2 (ja) * | 2000-01-26 | 2005-06-22 | 信越エンジニアリング株式会社 | 液晶パネル製造装置 |
US6885427B2 (en) * | 2002-03-15 | 2005-04-26 | Lg.Philips Lcd Co., Ltd. | Substrate bonding apparatus for liquid crystal display device having alignment system with one end provided inside vacuum chamber |
CN1325981C (zh) * | 2002-03-20 | 2007-07-11 | Lg.菲利浦Lcd株式会社 | 粘合机中的工作台结构及其控制方法 |
KR100685923B1 (ko) * | 2002-03-25 | 2007-02-23 | 엘지.필립스 엘시디 주식회사 | 합착 장치 및 이를 이용한 액정표시장치의 제조 방법 |
JP4552441B2 (ja) * | 2004-01-16 | 2010-09-29 | パナソニック株式会社 | 液晶パネル用部品実装装置 |
JP4555008B2 (ja) * | 2004-07-08 | 2010-09-29 | パナソニック株式会社 | 部品実装装置 |
JP4522826B2 (ja) * | 2004-11-17 | 2010-08-11 | Juki株式会社 | 電子部品圧着装置 |
CN101520347B (zh) * | 2008-02-26 | 2010-10-27 | 界鸿科技股份有限公司 | 带有压力检测的电子元件取出与置放装置及压力检测方法 |
KR100947430B1 (ko) * | 2008-04-14 | 2010-03-12 | 주식회사 성진하이메크 | 표시 패널 제조를 위한 모듈공정 자동화 장치 |
KR101511616B1 (ko) * | 2013-07-18 | 2015-04-13 | (주)정원기술 | 반도체 칩 마운팅용 헤드 |
CN109064886B (zh) * | 2018-08-29 | 2020-04-03 | 武汉华星光电技术有限公司 | 一种绑定机台水平对位系统及方法 |
CN111694175B (zh) * | 2020-06-30 | 2022-06-17 | 苏州精濑光电有限公司 | 一种停驻机构及检测装置 |
CN113253497B (zh) * | 2021-06-08 | 2021-09-07 | 江苏二五七特显科技集团有限公司 | 一种高清液晶屏组装工装夹具及组装方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3165215B2 (ja) * | 1992-02-14 | 2001-05-14 | 松下電器産業株式会社 | 液晶パネルの部品実装装置 |
JP3331570B2 (ja) * | 1993-09-08 | 2002-10-07 | ソニー株式会社 | 熱圧着装置と熱圧着方法および液晶表示装置の生産方法 |
-
1996
- 1996-10-04 JP JP26494696A patent/JP3478020B2/ja not_active Expired - Lifetime
-
1997
- 1997-10-03 TW TW086114465A patent/TW473637B/zh not_active IP Right Cessation
- 1997-10-06 WO PCT/JP1997/003577 patent/WO1998014821A1/fr active IP Right Grant
- 1997-10-06 CN CN97191875A patent/CN1124516C/zh not_active Expired - Fee Related
- 1997-10-06 KR KR10-1998-0704136A patent/KR100476126B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1209885A (zh) | 1999-03-03 |
KR100476126B1 (ko) | 2005-08-24 |
JPH10111484A (ja) | 1998-04-28 |
KR19990071852A (ko) | 1999-09-27 |
TW473637B (en) | 2002-01-21 |
CN1124516C (zh) | 2003-10-15 |
WO1998014821A1 (fr) | 1998-04-09 |
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