KR20040003787A - Bonding Equipment For Anisotropic Conductive Film And Circuit Board Of Flat Panel Display - Google Patents

Abstract

PURPOSE: An apparatus for bonding an anisotropic conductive film and a circuit board of a plat panel display is provided to simultaneously bond the anisotropic conductive film and circuit board to a pattern area of a flat panel display glass. CONSTITUTION: An apparatus for bonding an anisotropic conductive film and a circuit board of a plat panel display includes a working table(2), a pair of rotating plates(4a,4b), stages(6) on which glasses and circuit boards are loaded, and a film bonding unit(8) that bonds the anisotropic conductive film to a pattern area of a glass loaded on a stage. The apparatus further includes a circuit board aligning unit(10) that sets and temporarily attach a circuit board to the pattern area of the glass to which the anisotropic conductive film has been bonded, and a circuit board bonding unit(12) that bonds the temporarily bonded circuit board to the pattern area of the glass.

Description

Bonding Equipment For Anisotropic Conductive Film And Circuit Board Of Flat Panel Display}

The present invention relates to an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display, and more particularly, the bonding time of the anisotropic conductive film and the circuit board at the same time to the pattern portion of the flat panel display glass and the time required for the bonding operation The present invention relates to an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display, which can greatly reduce the production cost and improve productivity and work efficiency, as well as maximize the efficiency of the facility, thereby greatly reducing the manufacturing cost.

In general, flat panel display devices such as LCD, ELD, and fluorescent display tubes (VFD) are used for driving chips or circuit boards (e.g., PCBs, FPCs) in order to meet the trend of becoming thinner and shorter. ) And the like are bonded directly to the pattern portion of the glass to make a single article.

If the driving chip or circuit board is directly bonded to the glass, it is not only easy to assemble and maintain, but also does not need to secure a separate wiring space, which makes it more desirable for the miniaturization of the product and thus improves the commercialization. have.

In order to bond the circuit board to the pattern portion of the glass as described above, first, the insulating adhesive layer of the anisotropic conductive film is bonded by an anisotropic conductive film bonding process of bonding the anisotropic conductive film to the pattern portion of the glass. Then, the glass bonded with the insulating adhesive layer is transferred to a circuit board bonding process, that is, a circuit board bonding apparatus, and the circuit board is set on the upper side of the insulating adhesive layer bonded to the pattern portion of the glass by the anisotropic conductive film bonding process. Done.

When the anisotropic conductive film is attached to the pattern portion of the glass as described above, the circuit board bonded to the pattern portion of the glass is smoothly bonded, and at least one of the pattern portion of the glass and the circuit board is bonded when the pattern portion is bonded. Since the formed patterns are insulated from each other and conductive only to the corresponding patterns, the bonding quality can be improved by satisfying the adhesiveness, insulation, and conductivity required for bonding the glass and the circuit board.

The anisotropic conductive film bonding apparatus has a structure in which the anisotropic conductive film is sequentially moved while rotating the supply reel in which the anisotropic conductive film is wound, cut to a predetermined length, and then bonded to the pattern portion of the glass.

In addition, the general structure of the conventional circuit board bonding apparatus described above is provided with a work table, a glass fixing plate for loading glass on the upper side of the work table, and adjacent to the glass fixing plate described above in the work table. A circuit board fixing plate for loading a circuit board, and a glass and a bonding portion for bonding the pattern portion of the circuit board and the glass loaded on the glass fixing plate and the circuit board fixing plate, respectively.

However, the conventional circuit board bonding apparatus has only a structure for bonding the glass and the pattern portion of the circuit board, and after bonding the insulating adhesive layer of the anisotropic conductive film to the pattern portion of the glass by a separate anisotropic conductive film bonding process, the glass It is difficult to expect satisfactory productivity and work efficiency because the work process is complicated and cumbersome, and excessive bonding time is required because the PCB is bonded to the circuit board bonding apparatus.

In addition, the conventional circuit board bonding apparatus has an in-line structure, and thus, continuous bonding is not performed, and excessive holding time is inevitably generated, resulting in an extremely low efficiency of the equipment, thereby increasing production costs. .

In addition, since the conventional circuit board bonding apparatus is provided with one bonding portion in its structure, bonding is performed while generating a predetermined heat for the bonding time determined by the one-pass operation through the bonding head of the bonding portion. The pattern portion of the circuit board and the insulating adhesive layer of the anisotropic conductive film adhered to the pattern portion are thermally deformed, so that satisfactory bonding quality cannot be obtained and structurally, there is a limit in improving the commerciality.

The present invention has been made to solve the conventional problems as described above, the object of the present invention is to simultaneously bond the anisotropic conductive film and the circuit board to the pattern portion of the flat panel display glass and the time required for the bonding operation and The present invention provides an anisotropic conductive film and a circuit board bonding device of a flat panel display that can significantly reduce the manufacturing cost by greatly shortening the process and improving productivity and work efficiency.

In order to realize the object of the present invention as described above, a worktable, a pair of rotating plates fixed to two tables provided spaced apart at predetermined intervals from the working table and rotating in opposite directions, respectively, and a circumference on the upper surface of the rotating plate Films for bonding an anisotropic conductive film to a pattern portion of a glass loaded on the stage, which is provided in a plurality of directions and is provided to be movable between the rotating plates in the worktable and the stage for loading the glass and the circuit board. The circuit board aligning is provided adjacent to one side of the circumferential surface of the rotating plate in the workbench, and setting and temporarily bonding the circuit board to the pattern portion of the glass to which the anisotropic conductive film is bonded by the film bonding part. Part, and is installed adjacent to one side of the circumferential surface of the rotating plate in the work table, and added to the pattern part of the glass. Chakdoen the circuit board provides the adhesive circuit board bonded anisotropic conductive film and a circuit substrate of a flat panel display including a bonding to the device.

1 is an overall perspective view of an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display according to the present invention.

2 is a plan view of an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display according to the present invention.

3 is a front sectional view of an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display according to the present invention.

4 is an enlarged partial view of the stage structure of FIG.

Figure 5 is a perspective view of the film bonding portion of the anisotropic conductive film and circuit board bonding apparatus of a flat panel display according to the present invention.

6 is a perspective view for explaining the operating state of FIG.

7 is a partially enlarged view for explaining the film cutter structure of FIG. 5.

8 is a partially enlarged view for explaining the film bonding head structure of FIG. 5.

9 is a bottom view of the film bonding head of FIG. 8.

10 is a perspective view illustrating a state in which an anisotropic conductive film is bonded to a pattern portion of glass by the film bonding portion of FIG. 5.

11 is a perspective view showing a circuit board aligning part of the anisotropic conductive film and the circuit board bonding apparatus of the flat panel display according to the present invention.

12A and 12B are partial cross-sectional views illustrating a process of setting a circuit board on a pattern portion of glass by the circuit board setting head of FIG. 11.

13A and 13B are plan views illustrating a state in which a pattern portion of a circuit board and a glass is scanned by a circuit board scanning member and a glass scanning member, respectively.

14 is a bottom view of the circuit board setting head of FIG.

Figure 15 is a side cross-sectional view showing a circuit board bonding portion of the anisotropic conductive film and circuit board bonding apparatus of a flat panel display according to the present invention.

FIG. 16 is a bottom view of the circuit board bonding head of FIG. 15.

Hereinafter, a preferred embodiment of the present invention will be described in more detail with reference to the accompanying drawings. In the present embodiment, four stages are installed on the upper surface of the rotating plate of the table and spaced apart in the circumferential direction.

1, 2, and 3, an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display according to the present invention, a work table (2) and two spaced apart at predetermined intervals on the work table (2) A pair of rotary plates 4a and 4b fixed to the table T and rotating in opposite directions, respectively, and four are installed in the circumferential direction on the upper surfaces of the rotary plates 4a and 4b, so that the glass G and the circuit board B ) And the pattern portion of the glass (G) loaded on the stage (6), which is installed to be movable between the stage (6) and the rotating plate (4a, 4b) in the worktable (2) The film bonding portion 8 for bonding the anisotropic conductive film F to G1) and the film bonding portion 8 are installed adjacent to one side of the circumferential surface of the rotating plates 4a and 4b on the worktable 2. 8) A circuit board for setting and temporarily bonding the circuit board B to the pattern portion G1 of the glass G to which the anisotropic conductive film F is bonded by The circuit board B, which is installed adjacent to one side of the circumferential surfaces of the rotary plates 4a and 4b on the lining part 10 and the work table 2, and is temporarily bonded to the pattern part G1 of the glass G. It includes a circuit board bonding portion 12 for bonding.

The work table 2 is a metal pipe having a rectangular cross section is joined by welding or bolting to form a rectangular frame frame, the top plate 14 is installed on the upper side.

The upper plate 14 is made of a plate-shaped metal material having a constant thickness and is integrally installed by welding or bolting on the upper side of the work table 2, and the surface is sag due to a load, an impact, a change in temperature, or the like. It is better if it is a shape and a material which can prevent a deformation | transformation and always maintain a constant flatness.

Referring to the accompanying drawings, a plurality of supports 16 are installed at the lower side of the work table 2 for supporting the work platform 2 on the floor, and the support 16 is made of rubber or spring. It is preferable that the shock absorbing member (not shown) is provided to have a structure that can sufficiently buffer the work table (2) shaken by a minute vibration or shock, and in addition to the installation of a roller caster (not shown) equipped with mobility The worktable 2 described above can be easily moved.

The two tables T are fixed to two auxiliary top plates 18 horizontally spaced apart from the top plate 14 of the work table 2, and the rotary plate 4a is disposed on the upper surface of the table T. And 4b) are respectively installed.

The rotating plate 4a, 4b is formed of a circular metal plate having a predetermined thickness and formed to have a size that can accommodate the circumferential surface of the rotating plate 4a, 4b in the upper plate 14 of the work table (2) It is disposed inside the through hole 20, respectively.

The above-mentioned table T is used as an indexing drive table, and this table T is made of a structure that rotates itself by a separate driving source, such as a general machine tool and an automation facility requiring accurate rotation. Since it is widely used, more detailed description will be omitted.

The table T is electrically connected to the drive switch 22 installed on the upper side of the work table 2, and when the drive switch 22 is pressed once, the table T rotates 90 ° in the opposite direction as shown in FIG. 2. It is set to stop after that.

As described above, the electrical connection structure for stopping the table T by rotating the drive in the predetermined direction by the driving switch 22 can be easily implemented by those skilled in the art. Is omitted.

According to the above embodiment, the table T is controlled by the drive switch 22 which performs switching by hand, but it is not limited thereto.

For example, a foot switch (not shown) is installed on the bottom surface of the work table 2 so that an operator can control the driving of the table T with a foot or use a separate timer (drawings). It is also possible to configure to automatically rotate and stop after the set time has elapsed by installing, and in addition to the control structure and method of the table T that satisfies the object of the present invention is implemented by various applications It is possible to do

Four stages 6 are spaced apart at 90 ° intervals along the circumferential direction on the rotary plates 4a and 4b respectively provided on the upper side of the table T.

3 and 4, the stage 6 is for loading the glass G and the circuit board B, the glass loading surface 24 for loading the glass G on the upper side, Adjacent to the glass loading surface 24, a circuit board loading surface 26 for loading the circuit board B with a predetermined step is formed.

The glass loading surface 24 is provided with a scanning hole 28 having a size that can accommodate the entire pattern portion G1 of the glass G to be loaded, and the scanning holes (4a, 4b) are provided in the rotating plates 4a and 4b. Auxiliary scanning hole 30 corresponding to 28 is drilled.

Although not shown in the drawing, the glass loading surface 24 and the circuit board loading surface 26 of the stage 6 may be loaded by installing an apparatus for fixing the loaded glass G or the circuit board B in a vacuum. The glass G or the circuit board B can be more stably fixed.

On the other hand, between the rotating plate (4a, 4b) of the table (T) is provided with a film bonding portion 8 for bonding the anisotropic conductive film (F) to the pattern portion (G1) of the loaded glass (G). The structure of the film bonding unit 8 will be described in more detail with reference to FIGS. 1, 5, and 6 as follows.

The film bonding part 8 includes a slide plate 32 provided between the two rotating plates 4a and 4b on the upper surface of the work table 2 and one side surface of the slide plate 32. The film supply reel 34 is installed on the supply film for supplying an anisotropic conductive film (F), and the film supply reel 34 is spaced apart from the film supply reel 34 is provided on one side of the slide plate 32 and the film supply reel (34) In the film cutter 36 to cut only the insulating adhesive layer (F1) of the anisotropic conductive film (F) sequentially supplied in a predetermined length and the piston rod of the cylinder (C1) installed on the slide plate (32) A film bonding head 38 for bonding the insulating adhesive layer F1 cut into the predetermined length by the film cutter 36 to the pattern portion G1 of the loaded glass G, and the film bonding head 38 The back paper F2 attached to the back surface of the insulating adhesive layer F1 bonded to the pattern portion G1 of the glass G by It comprises a film recovery reel 40.

First, briefly describing the anisotropic conductive film F wound around the film supply reel 34, the insulating adhesive layer (F1) and the backing paper (F2) attached to one side of the insulating adhesive layer (F1). .

The insulating adhesive layer F1 has a predetermined width and a pattern formed in the pattern portion G1 of the glass G by embedding ball-shaped fine conductive particles inside the insulator made of a thin film (not shown in the drawing). The anisotropic conductive film (F) is already known in the art to bond to the patterns (not shown) formed in the pattern portion (B1) of the circuit board (B) in the state that the negative) are insulated from each other. Since it is used, more detailed description is omitted.

The slide plate 32 is made of a plate-like metal or synthetic resin material, and is installed in such a manner as to cross them between two rotating plates 4a and 4b provided on the upper side of the work table 2.

The slide plate 32 is formed in a “∩” shape so as to be movable along the guide rail U1 installed on the upper plate 14. With this configuration, the glass G is loaded and rotated on the stage 6 fixed to the upper surfaces of the two rotating plates 4a and 4b, respectively, and transferred to the film bonding position, and the upper surface of these stages 6 is loaded. Corresponding to the pattern portion G1 of the glass G, the film bonding head 38 provided on the slide plate 32 may be moved to a position where bonding is possible (see FIG. 6).

The guide rail U1 may be a conventional LM guide having a pair of sliders and guiders, and extensions 42 are formed at both ends of the slide plate 32, and the extension 42 The piston rod of the cylinder C2 fixed to the upper plate 14 of the work table 2 is coupled to the slide plate 32 along the guide rail U1 by the operation of the cylinder C2. It slides and moves.

The film supply reel 34 is formed in a general reel form, and the anisotropic conductive film F is wound in a roll state, and is driven in one direction by a driving motor M2 installed on the rear surface of the slide plate 32. While rotating as described above, the anisotropic conductive film F wound around the supply reel 34 is supplied to the film bonding head 38 described above.

The film cutter 36 cuts only the insulating adhesive layer F1 of the anisotropic conductive film F which is supplied from the film supply reel 34 to the film bonding head 38. 32 is slidably installed in the vertical direction from the inside of the cutter housing 44 provided between the film supply reel 34 and the film bonding head 38.

Referring to FIG. 7, the cutter housing 44 has a film guide groove 46 for guiding the anisotropic conductive film F transported in the horizontal direction, and is perpendicular to the film guide groove 46. A cutter guide groove 48 for guiding the film cutter 36 is formed.

The film guide groove 46 may be moved while the anisotropic conductive film F supplied from the film supply reel 34 is guided, and the film cutter 36 is perpendicular to the cutter guide groove 48. The insulating adhesive layer F1 of the anisotropic conductive film F which is slidably positioned and passes through the film guide groove 46 by the cylinder C3 can be cut.

As described above, the length of the insulating adhesive layer F1 cut into the predetermined length by the film cutter 36 is cut to a size corresponding to the pattern portion G1 of the glass G loaded on the stage 6. In addition, in order to cut the insulating adhesive layer F1 into various lengths, an operation cycle of the cylinder C3 for moving the film cutter 36 may be appropriately set.

5 and 10, the film bonding head 38 is coupled to the piston rod end of the cylinder C1 installed in a vertical direction on one side of the slide plate 32 to drive the cylinder C1. By bonding the insulating adhesive layer (F1) of the anisotropic conductive film (F) to the pattern portion (G1) of the glass (G) loaded on the stage (6) while moving in the vertical direction.

The film bonding head 38 is provided with a pressing surface 38a corresponding to the pattern portion G1 of the loaded glass G, and a heat generating member H for generating predetermined heat is installed inside. (See FIG. 9)

The heating member (H) may be used a conventional coil heater to generate heat according to whether the application of electricity, in addition to the heating member (H) that can improve the bonding quality of the anisotropic conductive film (F) in various ways It is possible to carry out by application.

In addition, a pressure sensing member S is installed between the film bonding head 38 and the piston rod of the cylinder C1, which is a film bonding head 38 coupled to the piston rod of the cylinder C1. When bonding the insulating adhesive layer F1 of the anisotropic conductive film F, the pattern portion G1 of the loaded glass G is prevented from being pressed at an excessive pressure to prevent the pattern portion G1 or the insulating adhesive layer of the glass G from being pressed. It is possible to prevent the F1 from being damaged or deteriorating the bonding quality. That is, when the pressing force sensed by the pressure sensing member S is greater than the set pressure, the operation of the cylinder C1 is stopped.

The pressure sensing member (S) may be used a conventional load cell, in addition to the pressure sensing member that satisfies the object of the present invention can be implemented in various applications.

The film recovery reel 40 is the insulating adhesive layer (F1) of the anisotropic conductive film (F) is bonded to the pattern portion (G1) of the glass (G) by the film bonding head 38, the insulating adhesive layer ( It is for recovering the back paper (F2) attached to the back of the F1), formed in the same shape as the film supply reel 34, that is, the usual reel (Reel) is provided on the back portion of the slide plate 32 The backing paper F2 is wound in a rolled state and collected while being rotated in one direction by the drive motor M2.

As described above, anisotropy sequentially moves between the film supply reel 34, the film cutter 36, the film bonding head 38, and the film recovery reel 40, which are installed on one side of the slide plate 32. A guide roller R for guiding the conductive film F is installed.

The guide roller (R) is made of a conventional roller shape and is rotatably fixed on the slide plate 32 to guide the anisotropic conductive film (F) supplied from the film supply reel (34).

And, the guide roller (R) is more preferable if the structure provided with a tension control member (not shown) such as a spring so that the anisotropic conductive film (F) which is moved while being guided can be supplied while maintaining a constant tension. .

The circuit board B is set on the glass plate G on which the insulating adhesive layer F1 of the anisotropic conductive film F is bonded to the upper plate 14 of the work table 2 by the film bonding unit 8. The circuit board aligning unit 10 for temporarily attaching for a predetermined time is provided.

The structure of the circuit board aligning unit 10 will be described in more detail with reference to FIGS. 1, 11, 12A, 12B, 13A, and 13B.

The circuit board aligning unit 10 includes an aligning plate 50, a horizontal plate 52 movably installed in the longitudinal direction of the aligning plate 50, and the horizontal plate 52. A vertical plate 54 which moves up and down by a cylinder C4 provided at an upper end thereof, and a circuit board setting head 56 coupled to the shaft end of the step motor M3 provided at the vertical plate 54. do.

A guide rail U2 is installed on the lower side of the aligning plate 50 so as to be movable on the worktable 2.

The lower side of the aligning plate 50 is provided with a screw-driven drive motor M4 shaft therethrough, so that the circuit board aligning unit 10 is driven by the driving of the motor M4. ), The circuit board B is moved in the longitudinal direction of the pattern portion G1 of the glass G for bonding.

The horizontal plate 52 is slidably installed by a guide rail U3 installed in the longitudinal direction of the plate 50 at one side of the aligning plate 50 and the guide rail U3. One side is coupled to the drive motor M5 shaft which is disposed in the same direction and is threaded to move in the longitudinal direction of the aligning plate 50 by driving the motor M5.

The vertical plate 54 is installed to be movable in the vertical direction by the guide rail U4 on one side of the horizontal plate 52, the cylinder is installed on the upper side of the horizontal plate 52 on one side The piston rod of (C4) is coupled to move up and down along the guide rail (U4) in the above-described horizontal plate 52 by the drive of the cylinder (C4).

On one side of the vertical plate 54, a step motor M3 is installed in the vertical direction, and a circuit board setting head 56 is installed at the tip of the shaft of the motor M3.

As shown in FIG. 14, the circuit board setting head 56 includes a pressing surface 56a having a size corresponding to the glass G and the pattern portions G1 and B1 of the circuit board B, and the coil heater inside. Heat generating member (H) consisting of.

On the pressing surface 56a of the circuit board setting head 56, the circuit board B housed in a separate circuit board supply tray 58 disposed adjacent to the aligning plate 50 is sucked by vacuum. A suction hole 60 is formed, and the suction hole 60 is connected to a separate vacuum device (not shown) by a hose 62 to form the pattern portion B1 of the circuit board B. The upper surface is sucked by vacuum to load the pattern portion B1 of the circuit board B into the pattern portion G1 of the glass G to which the insulating adhesive layer F1 of the anisotropic conductive film F is bonded.

On the other hand, the upper side and the lower side of the upper plate 14 of the work table 2, the circuit board (B) adsorbed on the circuit board setting head 56 and the glass (G) on which the circuit board (B) is set. The circuit board scanning member 64 and the glass scanning member 66 for scanning the setting position of the) are provided.

The circuit board scanning member 64 is formed at both sides of the pattern portion B1 of the circuit board B at one side in the longitudinal direction of the aligning plate 50 at the upper surface 14 of the upper surface 14 of the work table 2. It is fixed to two brackets 68 so as to correspond to the aligning point B2 indicated at the stage.

In addition, the glass scanning member 66 has a bracket below the scanning hole 28 of the stage 6 and the auxiliary scanning hole 30 of the rotating plate 4a disposed at the point where the circuit board B is set. Two are fixed so as to correspond to the aligning points G2 indicated at both ends of the pattern portion G1 of the glass G fixed to the 70 and loaded on the stage 6 described above.

The circuit board scanning member 64 and the glass scanning member 66 may be used as a micro camera, and these scanning members may be formed by the pattern portions B1 and the circuit boards B and glass G. Each of the alignment points B2 and G2 indicated by G1) is scanned and the scanned data is sent to a control unit (not shown) (see FIGS. 13A and 13B).

Then, the control unit calculates the setting deviation of the circuit board (B) and the glass (G), and if the deviation occurs more than the allowable error range is performed as follows.

That is, the above aligning plate 50 may be set within the tolerance range when the circuit board setting head 56 absorbs the circuit board B and sets it in the pattern portion G1 of the glass G. In addition, while controlling the position and driving of the step motor M3 installed on the horizontal plate 52 and the vertical plate 54, the circuit board B adsorbed to the circuit board setting head 56 is moved in the X direction, Y direction, The glass plate G is set in the pattern portion G1 within the tolerance range while moving in the θ direction.

The circuit board setting head 56 is provided with a cylinder C4 provided at an upper end of the horizontal plate 52 when the circuit board B is set to the pattern portion G1 of the glass G. After setting to the pattern portion (G1) of the glass (G) by pressing at a constant pressure, the heat generating member (H) installed inside the setting head 56 is heated to perform temporary adhesion.

Referring to the accompanying drawings, the pressure sensing member S is installed between the circuit board setting head 56 and the step motor M3 shaft so that the glass head G is temporarily bonded when the setting head 56 is temporarily bonded. ) And the pattern portions G1 and B1 of the circuit board B are prevented from being pressed with excessive pressure, and the pressure sensing member S is a conventional load cell.

The circuit board B, which is set and temporarily bonded to the pattern part G1 of the glass G by the circuit board aligning part 10, is main bonded by the circuit board bonding part 12. Referring to the accompanying drawings, the structure of the circuit board bonding portion 12 will be described in more detail as follows.

1, 15, and 16, the circuit board bonding part 12 is spaced apart from the circuit board aligning part 10 in the upper plate 14 of the work table 2, and the rotating plate is described above. (4a, 4b) The cylinder C5 is installed in the vertical direction on the upper surface of the fixed plate 72 provided adjacent to the circumferential surface, and the circuit board bonding head 74 is coupled to the end of the piston rod of the cylinder C5. Consists of a structure.

The fixing plate 72 serves as a kind of bracket and may be formed in various shapes in addition to the shapes shown in the drawings, and is coupled to the upper plate 14 of the work table 2 by a separate fastening member such as a bolt.

The circuit board bonding head 74 has a pressing surface 74a having a size corresponding to the temporarily bonded glass G and the pattern portions G1 and B1 of the circuit board B, and generates a coil-shaped heat inside. While the member H is installed to generate a predetermined heat according to the application of electricity, the upper surface of the pattern portion B1 of the circuit board B temporarily bonded to the pattern portion G1 of the glass G is pressed. Bonding.

Accordingly, the preferred embodiment of the anisotropic conductive film and the circuit board bonding apparatus of the flat panel display according to an embodiment of the present invention made as described above will be described in more detail with reference to the accompanying drawings.

First, when the drive switch 22 is installed in the front part of the work table 2, that is, the work table 2, as shown in FIG. 1, the loading position of the glass G becomes, and the rotating plate ( 4A and 4B, respectively, the operator loads the glass G to the two stages 6 arranged at the above-mentioned loading positions by hand or by using a conventional loading device (not shown).

When the driving switch 22 is pressed after the loading of the glass G is completed as described above, the two tables T are driven to reverse the two rotating plates 4a and 4b as shown in the drawing. Rotate 90 ° in the direction.

Then, the two stages 6 loaded with the glass G by the above loading process are stopped at the film bonding part 8 provided between the rotating plates 4a and 4b, and the other stage 6 at the loading position. ) Will stop.

The stage 6 stopped at the loading position by the rotation of the rotary plates 4a and 4b as described above may be loaded with the glass G in the same manner as described above, and the stage 6 positioned in the film bonding unit 8 is provided. The insulating film adhesive layer F1 of the anisotropic conductive film F is bonded to the pattern portion G1 of the glass G loaded on the sheet by the film bonding portion 8.

Referring to FIGS. 5, 7 and 8, the bonding process of the insulating adhesive layer F1 will be described. When the stage 6 loaded with the glass G is stopped at the film bonding part 8, the bonding process of the insulating adhesive layer F1 is stopped. The slide plate 32 of one film bonding part 8 moves along the guide rail U1 by the cylinder C2, and moves to the stage 6 of the one side rotation plate 4a.

Then, the film supply reel 34 of the film bonding portion 8 is rotated in one direction to supply the anisotropic conductive film (F) to the film cutter 36, the film cutter 36 is loaded glass ( Only the insulating adhesive layer F1 of the anisotropic conductive film F is cut to a length corresponding to the pattern portion G1 of G) and supplied to the film bonding head 38.

The insulating adhesive layer F1 cut and supplied to the predetermined length as described above is the pattern portion G1 of the glass G loaded on the stage 6 of the one side rotating plate 4a by the film bonding head 38. Bonded to the top side (see FIG. 10)

When the bonding of the insulating adhesive layer F1 is completed as described above, the slide plate 32 moves to the stage 6 of the other rotating plate 4b along the guide rail U1 as shown in FIG. 6) bonding is performed on the pattern portion G1 of the glass G loaded in the same manner as in the bonding process of the insulating adhesive layer F1, and is loaded on the two stages 6 through the bonding process. When the bonding of the insulating adhesive layer F1 to the pattern portion G1 of the glass G is completed, the film bonding portion 8 stops and waits as it is without returning to the initial position. The section 8 may be set to return to the initial position.

After the bonding of the insulating adhesive layer F1 is completed by the above process, if the driving switch 22 is pressed again, the rotating plate rotates by 90 ° and stops, thereby causing the insulating adhesive layer F to be stopped by the circuit board aligning part 10. The circuit board B is set and temporarily bonded to the pattern portion G1 of the bonded glass G. This process will be described in detail with reference to FIGS. 11, 12A, and 12B.

When the stage 6 loaded with the glass G bonded with the insulating adhesive layer F1 is positioned in the circuit board aligning unit 10 by the film bonding process, the circuit board aligning unit ( The circuit board setting head 56 of 10) adsorbs the circuit board B housed in a separate supply tray 58 and moves in the longitudinal direction of the aligning plate 50, thereby extending one side of the plate 50 in the longitudinal direction. In the above it is stopped on the upper side of the circuit board scanning member 64 fixed to the upper plate 14 of the work table (2).

When the circuit board B, which is adsorbed and moved as described above, temporarily stops, the above-mentioned circuit board scanning member 64 is positioned at both ends of the pattern portion B1 of the circuit board B. And at the same time the glass scanning member 66 installed on one side of the lower surface of the upper plate 14 is the pattern portion G1 of the glass G loaded on the stage 6 for the circuit board B to be set. ) Scans the aligning points G2 displayed at both ends (see FIGS. 13A and 13B).

The data scanned by the circuit board scanning member 64 and the glass scanning member 66 is sent to a control unit (not shown), which corresponds to the setting position of the glass G described above. The above setting is performed by correcting the setting position of the circuit board B adsorbed on the circuit board setting head 56 in the X, Y, and θ directions so that the circuit board B can be set within an error range. After setting to the pattern part G1 of the glass G, temporary adhesion is performed for a predetermined time.

In addition, in the pattern portion G1 of the glass G loaded on the two stages 6 positioned in the film bonding portion 8, the insulating adhesive layer of the anisotropic conductive film F is applied in the same manner as in the above-described film bonding process. Bonding F1) and loading the glass G again to the stage 6 arranged at the loading position.

After the above process is completed, when the driving switch 22 is pressed, the rotating plates 4a and 4b are rotated by 90 ° again so that the circuit board B is temporarily bonded to the circuit board aligning unit 10. The two stages 6 which are loading (G) stop at the circuit board bonding section 12 described above (see FIG. 15).

Then, the circuit board bonding head 74 of the circuit board bonding part 12 is moved downward by the cylinder C5, so that the circuit board B is temporarily bonded to the pattern part G1 of the glass G. Bonding is performed on the upper surface of the pattern portion B1 with constant pressure and heat.

At this time, the time for bonding the circuit board B through the circuit board bonding head 74 is set to be within the range of 10 seconds to 20 seconds, although there is a difference depending on the required bonding specifications.

In addition, the anisotropic conductive films are respectively applied to the pattern portion G1 of the glass G loaded on the stage 6 positioned in the film bonding portion 8 and the circuit board aligning portion 10, respectively. The insulating adhesive layer F1 of (F) is bonded, and the circuit board B is set and temporarily bonded.

After the above process is completed, when the driving switch 22 is pressed, the stage 6 on which the glass G, to which the circuit board B is bonded by the circuit board bonding part 12 is loaded, is initially loaded. It stops at the position and the other stages 6 also stop after moving to the next process, respectively.

As described above, when the glass G bonded with the circuit board B is loaded on the stage 6 and stopped at the loading position, the glass G is unloaded and stored in a separate storage tray (not shown). In the unloaded stage 6, another glass G may be loaded to set and bond the insulating adhesive layer F1 and the circuit board B of the anisotropic conductive film F in the same manner as described above.

In the above, a preferred embodiment of an anisotropic conductive film and a circuit board bonding apparatus of a flat panel display according to the present invention has been described, but the present invention is not limited thereto, but the scope of the claims and the detailed description of the invention and the accompanying drawings are various. It is possible to carry out modification by branch, and this also belongs to the scope of the present invention.

As described above, according to the anisotropic conductive film and circuit board bonding apparatus of a flat panel display according to the present invention, two tables are provided on a work table, and a film bonding part, an aligning part, and a circuit board bonding part are respectively installed in the circumferential direction of these tables. By rotating the glass loaded on the stage installed on the rotating plate of the table in a predetermined direction, the structure is bonded to the anisotropic film and the circuit board to simplify the work process and greatly reduce the time required for the bonding work, thereby satisfactory work. Not only can efficiency and productivity be gained, but also the efficiency of the equipment can be doubled, which significantly reduces manufacturing costs.

In addition, the anisotropic conductive film and the circuit board bonding apparatus of the flat panel display according to the present invention divide the bonding time defined by the circuit board aligning unit and the circuit board bonding unit, and then bond the circuit boards in the form of temporarily bonding the circuit boards. By doing so, not only the excessive holding time generated during bonding can be shortened, but also a better bonding quality can be obtained.

Claims (8)

A pair of rotary plates fixed to two tables, which are fixed to two tables spaced apart from each other at predetermined intervals and rotated in opposite directions, and a plurality of rotary plates are provided in the circumferential direction from the upper side of the rotary plate to load glass and circuit board And a film bonding part which is movably installed between the rotating plates at the work table and bonds the anisotropic conductive film to the pattern portion of the glass loaded on the stage, and the circle of the rotating plate at the work table. A circuit board aligning part installed adjacent to one side of the main surface and setting and temporarily bonding the circuit board to a pattern part of the glass to which the anisotropic conductive film is bonded by the film bonding part, and the circumferential surface of the rotating plate described above in the work table It includes a circuit board bonding portion which is installed adjacent to one side and main bonding the circuit board temporarily bonded to the pattern portion of the glass Anisotropic conductive film and circuit board bonding apparatus for flat panel displays. The table as set forth in claim 1, wherein the two tables comprise an indexing drive table, which rotates in opposite directions at the upper side loading position of the work table, and the stage is installed on the upper side of the rotating plate of the table. An anisotropic conductive film and a circuit board bonding apparatus of a flat panel display characterized by moving to a film bonding part, a circuit board aligning part, and a circuit board bonding part. The glass loading surface and the circuit board loading surface on which the glass and the circuit board are loaded are respectively formed, and the glass loading surface has a scanning groove having a size corresponding to the pattern portion of the glass to be loaded. Anisotropic conductive film and circuit board bonding apparatus of a flat panel display, characterized in that. The film bonding unit of claim 1, wherein the film bonding unit is provided on a slide plate, a film supply reel installed on one side of the slide plate to supply an anisotropic conductive film, and a film supply reel spaced apart from the film supply reel. And a film cutter for cutting only the insulating adhesive layer of the anisotropic conductive film sequentially supplied from the film supply reel to a predetermined length, and coupled to the piston rod of the cylinder installed on the slide plate. A flat panel display including a film bonding head for bonding the cut insulating adhesive layer to the pattern portion of the glass and a film recovery reel for recovering the backing paper attached to the back surface of the insulating adhesive layer bonded to the pattern portion of the glass by the film bonding head. Anisotropic conductive film and circuit board bonding devices. The circuit board aligning unit as set forth in claim 1, wherein the circuit board aligning unit is moved up and down by an aligning plate, a horizontal plate provided to be movable in the longitudinal direction of the aligning plate, and a cylinder provided at an upper end of the horizontal plate. And a circuit board setting head coupled to the shaft end of the step motor installed on the vertical plate, wherein the circuit board setting head is a substrate of the anisotropic conductive film bonded to the pattern portion of the glass loaded on the stage. An anisotropic conductive film and a circuit board bonding apparatus for a flat panel display, characterized in that temporary bonding is performed for a predetermined time after setting a circuit board on an upper surface of the insulating adhesive layer. The method according to claim 5, wherein the circuit board adsorbed on the circuit board setting head and the glass on which the substrate is set are scanned by the circuit board scanning member and the glass scanning member, respectively, and the positional deviation of the glass is set at the time of setting. In view of the above, the above-mentioned circuit board is set within a tolerance range. An anisotropic conductive film and a circuit board bonding apparatus for a flat panel display. The method according to claim 6, wherein the circuit board scanning member is installed on one side of the moving direction of the circuit board setting head in the work table, the glass scanning member is drilled in the stage and the rotating plate on the lower side of the work table It is fixed so as to correspond to the scanning hole and the auxiliary scanning hole and scans the positions of the alignment points respectively displayed on both ends of the pattern portion of the circuit board and the glass, and these scanning members are made of a micro camera. Anisotropic conductive film and circuit board bonding device for flat panel displays. 2. The cylinder of claim 1, wherein the circuit board bonding part is spaced apart from the circuit board aligning part on the upper plate of the work table, and is disposed in a cylinder perpendicular to an upper surface of the fixing plate provided adjacent to one side of the circumferential surface of the rotating plate. The circuit board bonding head is installed on the piston rod of the cylinder, and the circuit board, which is set and temporarily bonded to the pattern portion of the glass by the circuit board aligning part, is fixed for a predetermined time through the circuit board bonding head. Anisotropic conductive film and circuit board bonding apparatus for flat panel displays which are bonded by bonding while pressing.