KR20030088640A - Anisotropid Conductive Film Bonding Machine - Google Patents

Abstract

PURPOSE: An ACF(Anisotropic Conductive Film) bonding apparatus is provided to be capable of minimizing the waste of a film, improving bonding quality, and maximizing productivity and efficiency. CONSTITUTION: An ACF bonding apparatus is provided with a working table(2), a rotating table(4) installed at the inner portion of the working table, and a stage part(6) installed on the upper surface of the rotating table for loading a glass(G). At this time, the rotating table is capable of rotating and sliding to the lateral and longitudinal direction, and the stage part is capable of moving to the same direction as the rotating table. The ACF bonding apparatus further includes a part installed at one side of the working table for moving to a predetermined location corresponding to a pattern portion(G1) of the glass, and supplying and attaching an ACF.

Description

Anisotropid Conductive Film Bonding Machine

The present invention relates to an anisotropic conductive film bonding apparatus, and more particularly, to an anisotropic conductive film bonding apparatus capable of maximizing productivity and equipment efficiency by greatly shortening the work process and time.

In general, an ACF-Anisotropic Conductive Film is composed of particulate conductive particles (metal particles, carbon, coated plastic particles coated with metal), adhesives (thermoplastic or thermosetting), and additives ( Dispersing agent), etc., to form a conductive adhesive layer in the form of a thin film, and has excellent connection reliability, micro-connectivity, low-temperature connection, and the like. Not only is it widely used for electrical connection such as Tape Carrier Package (TCP), but also recently, it is used as COG (Chip On Glass) mounting material that directly mounts Bare Chip on LCD panel.

In the case of COG, before the bonding of the chip to the pattern of the glass, the film is set on the patterned part in which at least one pattern is formed, and then the film is formed on the entire patterned part while being heated and pressed to a predetermined temperature by a separate bonding device. To the conductive adhesive layer.

The film adhered to the pattern portion of the LCD by the above bonding process is conductive by the conductive particles on the upper side of each pattern, and the conductive particles are independently present between the pattern and the pattern spaced at predetermined intervals, respectively. The pattern of is kept insulated so that the chips bonded on the upper side of the pattern are bonded so as to have conductivity independently only in the corresponding pattern.

Briefly describing the general structure of the anisotropic conductive film bonding apparatus, the worktable, the loading stage is installed on the upper side of the work table and the glass is loaded, the loading stage is installed on the work table and the bonding head is loaded on the loading stage A bonding apparatus is set to correspond to the pattern portion of the glass, and a film supply apparatus for supplying an anisotropic conductive film between the bonding apparatus and the glass.

However, the conventional anisotropic conductive film bonding device is formed in an inline form that cannot be continuously bonded, so that the time required for the bonding operation is excessively reduced, thereby reducing productivity and efficiency of the facility.

In addition, the conventional anisotropic conductive film bonding apparatus bonds the conductive adhesive layer to the entire pattern portion composed of one or more patterns, so that an expensive film is excessively consumed and the film is adhered to the entire pattern portion. Bubbles may occur in the air, resulting in poor bonding quality.

In addition, the conventional anisotropic conductive film bonding apparatus does not correspond to a pattern portion and a pattern in which the structures of the loading stage and the bonding portion are formed in various ways, so that the pattern portion and the structure of the pattern formed on the pattern portion are changed accordingly. As additional devices have to be manufactured, the efficiency and compatibility of the equipment are lacking, which leads to a decrease in work efficiency and an increase in manufacturing costs due to additional expenses.

The present invention has been made to solve the conventional problems as described above, the object of the present invention is to further improve the bonding quality while maintaining the optimum compatibility in response to the structure of the pattern portion formed in a variety of forms while minimizing the consumption of the film In addition to providing an anisotropic conductive film bonding apparatus that can be obtained as well as to maximize the productivity and efficiency of the equipment accordingly.

In order to realize the object of the present invention as described above,

A work table, a rotary table installed inside the work table and rotating in a rotational, lateral and longitudinal direction, and a stage portion provided on an upper surface of the rotary table and moving in the same direction as the table and loaded with glass, A means for supplying and attaching an anisotropic conductive film while at least one is installed adjacent to the outer circumferential surface of the stage in one workbench and moved to a position corresponding to the pattern portion of the glass loaded in the stage;

This means includes a transverse plate and a longitudinal plate which are coupled to a transfer unit which is installed in a direction orthogonal to each other adjacent to the stage portion on the upper side of the workbench, and a loading unit of the stage portion provided on the longitudinal plate. A bonding portion for bonding the anisotropic conductive film to the pattern portion of the glass loaded on the glass plate, a film supply reel installed at one side of the longitudinal plate and supplying the anisotropic conductive film to the bonding portion, and at one side of the longitudinal plate A film cutting portion which is provided between the film supply reel and the bonding portion to cut the conductive adhesive layer of the anisotropic conductive film supplied to the bonding portion to a predetermined length, and the conductive adhesive layer of the anisotropic conductive film is bonded by the bonding portion. Then, the present invention provides an anisotropic conductive film bonding apparatus including a film recovery reel for recovering the backing paper attached to the back surface of the conductive adhesive layer.

1 is an overall perspective view of an anisotropic conductive film bonding apparatus according to the present invention.

FIG. 2 is a partial cutaway perspective view illustrating the rotating table and the stage of FIG. 1. FIG.

3 is a front elevational view of the main part of FIG. 2;

Figure 4 is an enlarged perspective view showing an enlarged structure of the anisotropic conductive film supply and attachment means of FIG.

5 is a front view of FIG. 4.

Figure 6 is an enlarged partial view showing the film cut portion of Figure 4 enlarged.

7 is an operating state diagram for explaining a bonding embodiment of the anisotropic conductive film bonding apparatus according to the present invention.

8 is an operational state diagram for explaining another bonding embodiment of the anisotropic conductive film bonding apparatus according to the present invention.

9 is an operational state diagram illustrating another bonding embodiment of the anisotropic conductive film bonding apparatus according to the present invention.

10 is a reference perspective view for explaining a state in which the loading unit of the anisotropic conductive film bonding apparatus according to the present invention is moved in the transverse direction and the longitudinal direction by the rotary table.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the anisotropic conductive film bonding apparatus according to the present invention will be described in more detail.

1, 2, 3, the anisotropic conductive film bonding apparatus according to the present invention,

The worktable 2, the rotary table 4 which is provided inside the worktable 2, and which is rotated in the rotation, the transverse direction and the longitudinal direction, and the upper side of the rotary table 4, is provided on this table (4). The stage part 6 which moves in the same direction as the glass G and is loaded, and the pattern part G1 of the glass G which is installed on one side of the work table 2 and loaded on the stage part 6. Means for supplying and attaching the anisotropic conductive film (F) while moving to a position corresponding to the?

In the work table 2, the metal pipe member having a rectangular cross section is joined by welding or the like to form a rectangular frame, and an upper plate 8 having a predetermined thickness is provided on the upper side.

The upper plate 8 is coupled by bolting or a similar coupling method on the upper side of the work table 2, and a circular opening 10 is formed inside.

Below the work table 2 is provided with a plurality of supports 12 to be supported on the floor, the support 12 is provided with a cushioning member (not shown), such as rubber or spring, 2) is preferably made of a structure capable of sufficiently buffering the shaking by the minute vibration or shock, and in addition to the roller caster equipped with a locking device may be used, although not shown in the figure.

The lower side of the rotary table 4 is provided with transfer units U1 and U2 in the direction orthogonal to each other on the lower plate 14 of the work table 2, and the auxiliary horizontal plates are provided on the units U1 and U2. (16) and the auxiliary longitudinal plate 18 are provided to support the rotary table 4 so as to be movable in the transverse direction and the longitudinal direction at the work table 2 described above.

An indexing drive table may be used as the rotary table 4, and the indexing drive table has a structure in which the table rotates itself by a separate driving source. The explanation is as follows.

The indexing drive table is composed of a separate drive source, that is, a cam mechanism installed on the shaft of the motor and a cam follower guided to the cam mechanism in a radial manner in which the upper side table is connected to the taper rib of the cam mechanism. Is a mechanism capable of precise rotation without backlash of the pallet because of its preloaded state, and is generally used widely in machine tools or automation devices requiring accurate rotation. .

In addition, the transfer units U1 and U2 installed in the auxiliary horizontal plate 16 and the auxiliary vertical plate 18 use a conventional LM guide composed of a pair of sliders and guiders, and the auxiliary horizontal plate 16 described above. ) Is installed by the transfer unit on the lower plate 14 of the work table 2, and then the transfer unit U2 of the subordinate longitudinal plate 18 is perpendicular to the upper side of the auxiliary transverse plate 16. The lower side of the rotary table 4 is seated and fixed to the auxiliary vertical plate 18.

The first feed motor M1 and the second feed motor M2 are installed between the guiders of the transfer units U1 and U2, and the motor shaft is formed with a threaded portion to form the auxiliary horizontal plate 16 and the auxiliary type. The plate 18 is screwed to one side and the plates 16 and 18 are guided to the transfer units U1 and U2 by the driving of the transfer motors M1 and M2 and slide in the transverse direction and the longitudinal direction. do.

In the above, the transfer units U1 and U2 installed on the auxiliary horizontal plate 16 and the auxiliary vertical plate 18 are constituted by a pair of sliders and guiders, and the auxiliary horizontal plate described above is driven by the driving motors M1 and M2. (16) and the auxiliary longitudinal plate 18 are shown in the description and the drawings, respectively, but this is not intended to be limited to the preferred embodiment of the present invention, but is not limited to this, in addition to the above-described structure of the object of the present invention It is possible to apply all of the satisfactory transfer structure.

The stage unit 6 is to rotate and slidably load one or more glasses (G) on the upper side of the rotary table 4, this structure will be described in more detail with reference to the accompanying drawings as follows. same.

The stage 6 is provided with a rotary plate 20 spaced apart from each other at a predetermined interval from the upper side of the rotary table 4 and moved in the same direction as the rotary table 4, and the rotary plate 20. At least one spaced apart in the circumferential direction of the) is composed of a loading unit 22 is installed.

The rotating plate 20 is disposed inside the opening 10 formed in the upper plate 8 of the work table 2 in combination with the one or more spacers 24 above the rotating table 4.

The spacer 24 has flanges formed on both sides thereof, and fixes the rotating plate 20 at a predetermined interval from the upper side of the rotating table 4 by bolting or a similar coupling method.

The loading unit 22 is a loading stage 26, one or more arranged in the circumferential direction from the upper side of the rotating plate 20, and the loading stage is installed on the lower side of the rotating plate 20 And a loading cylinder 28 for rotatably supporting the 26.

The loading stage 26 is made of a plate-shaped metal material having a predetermined thickness, and is formed in a size capable of supporting the entire surface of the glass G to be loaded.

A guide protrusion 30 is formed at one side edge of the upper surface of the loading stage 26 to guide one side edge of the glass G to be loaded, thereby improving loading accuracy.

Although the loading stage 26 is not shown in the figure, it is preferable that a separate adsorption device is installed to stably load the glass G to be loaded by vacuum adsorption.

The loading cylinder 28 is fixed to the lower side of the rotating plate 20 by a bolt or similar coupling method corresponding to the loading stage 26, and the piston rod tip of the cylinder 28 is It is coupled to the center of the lower side of one loading stage 26 (see Fig. 3).

The loading cylinder 28 is composed of a conventional rotary cylinder in which the piston rod rotates at a predetermined angle to rotatably support the loading stage 26 coupled with the piston rod.

Referring to FIG. 1, the glass G loaded on the loading stage 26 is loaded by a separate supply unit L, which is installed on the work table 2 or separately. It can be installed, in the present embodiment is shown in the drawings as being configured separately from the work table (2).

On the other hand, adjacent to the circumferential edge of the stage (6) is installed on one side of the upper plate (8) of the work table (2) in the pattern (G2) formed in the pattern portion (G1) of the loaded glass (G) Means for supplying and attaching the anisotropic conductive film F are provided, which will be described in more detail with reference to FIGS. 4, 5, and 6.

Prior to the description of the above means, the anisotropic conductive film (F, hereinafter referred to as film) is formed by mixing conductive particles and an adhesive to form a conductive adhesive layer F1 with a predetermined thickness, and on the back portion of the conductive adhesive layer F1. The back paper (F2) is made of a structure attached to the rolled state by the above-described means and are fed while feeding sequentially.

The means for supplying and attaching the film F to the pattern portion G1 of the glass G is orthogonal to each other on one side of the upper plate 8 of the work table 2 adjacent to the stage portion 6. The transverse plate 32 and the longitudinal plate 34 to be coupled to the transfer units (U3, U4) are installed in the direction to be installed, and the loading unit 22 of the stage unit 6 is provided in the longitudinal plate 34 Bonding portion 36 for bonding the conductive adhesive layer F1 of the film F to the pattern portion G1 of the glass G loaded on the sheet), and the bonding portion 36 installed on one side of the vertical plate 34. A film supply reel R1 for supplying the film F to the film 36, and between the film supply reel R1 and the bonding portion 36 at one side of the longitudinal plate 34, the bonding portion. The film cutting part 38 which cut | disconnects the electrically conductive adhesive layer F1 of the film F supplied to the 36 to a predetermined length, and the said electrically-conductive adhesive layer F1 of the film F by the said bonding part 36 are After bonding, this challenge It consists of the film collection reel R2 which collect | recovers the back paper F2 attached to the back surface to the contact layer F1.

The lateral plate 32 is made of a plate-shaped metal material having a predetermined thickness and is installed to be movable in the longitudinal direction (lateral direction) of the work table 2 in combination with the transfer unit U3.

The transfer unit U3 has the same structure as the transfer units U1 and U2 for transferring the rotary table 4, that is, a conventional LM guide composed of a pair of sliders and guiders is used, and a motor between the guiders is used. The transfer motor M3 formed in the screw portion is installed on the shaft, and the motor shaft is screwed with the horizontal plate 32.

The vertical plate 34 is formed of a plate-shaped metal material having a predetermined thickness and forms a horizontal portion 40 and a vertical portion 42 when viewed from the side and is formed in an “L” shape to form the horizontal plate 32. It is installed so as to be movable by the transfer unit U4 which is installed in the direction orthogonal to the transfer unit U3 of this plate 32 from the upper side).

The transfer unit U4 installed on the vertical plate 34 has the same structure as that of the transfer unit U3 installed on the transverse plate 32, that is, a pair of sliders and guiders, and a transfer unit installed between these guiders. The second type plate 34 is moved by the motor M4.

The film supply reel (R1) is wound in the roll state to the film (F) is rotated in one direction to be sequentially supplied to the bonding portion 36 to be made in the form of a common bobbin, the longitudinal plate 34 It is rotatably installed by the drive motor (M5) installed on the back of the vertical portion (42) of the.

The film cut portion 38 is formed of a conductive adhesive layer F1 and a backing paper F2 attached to the conductive adhesive layer F1 in a predetermined thickness. When moving to one bonding part 36, the housing 44 which guides the film F and cuts only the electrically conductive adhesive layer F1 of the said film F provided between them are cut out, It includes a feed cutter 48 slidably installed in the vertical direction by the cylinder 46 from the inside.

The housing 44 is made of a metal material, the guide groove 50 for guiding the film (F) is formed in the center, the slide groove 52 in the direction orthogonal to the guide groove 50 Is formed.

The guide groove 50 smoothly guides the film F supplied from the film supply reel R1, as well as the conductive cutter layer F1 of the guided film F. It is to be smoothly cut by the, it is installed on the vertical portion 42 of the above-mentioned longitudinal plate 34 by a bolt or similar coupling method.

The feed cutter 48 is formed in a shape corresponding to the slide groove 52 and is slidably installed in the groove 52, the cylinder 46 is coupled to the lower side of the housing 44 The conductive adhesive layer F1 of the film F guided by the guide groove 50 is cut while moving along the slide groove 52 by driving.

The cylinder 46 has one pattern formed in the pattern portion G1 of the loaded glass G while appropriately corresponding to the conveying speed of the film F conveyed by the film supply reel R1. G2) It is set to cut the conductive adhesive layer F1 of the film F to a size that can cover the entire pattern G2 corresponding to the size.

The bonding unit 36 bonds the conductive adhesive layer F1 of the film F to the pattern G2 of the glass G loaded in the loading unit 22 while heating and pressing the film for a predetermined time. The structure of this bonding portion 36 will be described in more detail with reference to the accompanying drawings.

The bonding portion 36 is composed of a cylinder 54 and a bonding head 56 provided on the piston rod of the cylinder 54, and is spaced apart from the film supply reel R1, so that the vertical plate ( 34 is installed on one side of the vertical portion (42).

The cylinder 54 is installed on the vertical portion 42 of the vertical plate 34 in a direction orthogonal to the upper plate 8 of the work table 2 by a separate fixing bracket 58.

The cylinder 54 may be a conventional pneumatic cylinder in which the piston rod operates in the longitudinal direction of the rod.

The bonding head 56 is made of a rectangular metal material having excellent thermal conductivity, and is installed on the piston rod, and a heat generating member 60 is installed inside to generate predetermined heat.

The bonding head 56 is formed in a size that can cover the entire pattern G2 formed in the pattern portion G1 of the glass G, and the heat generating member 60 installed inside the bonding head 56. ), A common coil heater in which the heating element is in the form of a coil may be used.

The heat generation temperature of the heat generating member 60 is preferably formed in the range of 30 ° C to 90 ° C. If the temperature is smaller than this temperature range, bubbles in the conductive adhesive layer F1 of the anisotropic conductive film F are bonded during bonding. When the bonding quality is not smoothly discharged and the bonding quality is lowered, and the size is larger than the above range, excessive heat is transferred to the pattern G2 and the film F at the time of bonding, thereby causing a thermal change to deform.

And the bonding time for bonding the film (F) to the pattern portion (G1) through the bonding head 56 by the operation of the cylinder 54 is preferably made in the range of 3 to 5 seconds, the bonding is shorter than this bonding time When the conductive adhesive layer F1 of the film F is not bonded smoothly, the bonding quality is lowered. If the bonding time is exceeded, the productivity and work efficiency due to excessive bonding time are reduced.

Referring to the accompanying drawings, a pressure sensing member 62 is installed between the piston rod and the bonding head 56 of the cylinder 54, the sensing member 62 is a conventional load cell (Load Cell) to be used Can be.

The pressure sensing member 62 senses this when the bonding head 56 presses with excessive pressure when the bonding head 56 presses the pattern G2 of the glass G by the cylinder 54. ) To prevent scratches or partial breakage of the pattern G2 due to excessive pressure.

The pressure sensing member 62 may be applied when the pressing head 56 provided on the piston rod of the cylinder 54 exceeds the set pressure when the bonding head 56 is bonded to the pattern G2 of the pattern portion G1. The operation of one cylinder 54 is stopped.

The film recovery reel R2 is formed in the same bobbin form as the film supply reel R1 and is spaced apart from the film supply reel R1 with the bonding portion 36 interposed therebetween. It is installed in the vertical part 42 of the plate 34.

The film recovery reel R2 is formed on the back surface of the conductive adhesive layer F1 after the conductive adhesive layer F1 of the film F is bonded to the pattern G2 of the glass G by the bonding part 36. For recovering the backing paper F2 attached to the vertical plate 34 in order to smoothly recover the backing paper F2 in association with the operation of the film supply reel R1 and the bonding part 36. It is rotatably installed by the drive motor (M6) installed on the back of the vertical portion (42) of the.

In addition, the vertical part 42 of the vertical plate 34 may rotate the one or more guide rollers 64 adjacent to the film supply reel R1, the film recovery reel R2, and the bonding part 36. Guide the film (F) and the backing paper (F2) to be installed and transported.

The guide roller 64 is formed in the form of a conventional roller to guide the film (F) and the backing paper (F2), although not shown in the drawings, such as a tension adjusting member such as a spring (F) is installed and transported It is more preferable if it is a structure which consists of a structure which can adjust the tension of the smoothly.

In the above embodiment, the means for supplying and attaching the film F is shown in the description and the drawing as one provided adjacent to the circumferential surface of the stage part 6, but the present invention is not limited to this structure, Although not shown in the drawings, one or more mounting apparatuses may be provided to correspond to the above-described loading unit 22 in which one or more are arranged in the circumferential direction of the stage 6, thereby performing multiple bonding operations. Naturally, it belongs to the category of.

The rotary table 4, the transfer motors M1, M2, M3 and M4, the drive motors M5 and M6, and the transfer units U1, U2, U3 and U4 are installed on the work table 2. Or electrically connected to a control box (not shown) which is installed separately or set to be driven by the operation of the control box. Such electrical connection and control methods can be easily performed by those skilled in the art. Since it can be implemented, further detailed description is omitted.

Next, a preferred operating embodiment of the anisotropic conductive film bonding apparatus according to the present invention will be described in more detail with reference to the accompanying drawings. In this embodiment, four loading units spaced apart in the circumferential direction of the rotating plate 20 ( 22) is installed and the rotary table 4 is set to rotate at intervals of 90 ° will be described as an example.

First, as shown in FIG. 1, the glass G is loaded on the loading stage 26 of the loading unit 22 installed on the rotating plate 20 and disposed on the front surface of the work table 2.

The loading of the glass (G) is loaded by the supply unit (L) which is installed integrally or separately configured on the work table (2).

When the rotary table 4 is operated after the glass G is loaded as described above, the table 4 is rotated 90 ° counterclockwise with reference to FIG. 1.

Then, another loading unit 22 in which the glass G is not loaded is positioned on the front side of the work table 2, and the loading unit 22 is loaded with the glass G in the same manner as the loading operation described above. Then, when the rotary table 4 is operated again, the table 4 is rotated 90 degrees counterclockwise again so that the loading unit 22 in which the glass G is initially loaded is connected to the bonding unit 36. It will rotate to the position where bonding is possible from the lower side.

In this case, the film supply reel R1 rotates in one direction to supply the film F to the film cutout 38, and the cutout 38 supplies the conductive adhesive layer F1 of the film F to be transferred. It is continuously cut by the set length and supplied to the bonding part 36.

As described above, the film F from which the conductive adhesive layer F1 is cut is supplied between the bonding head 56 of the bonding portion 36 and the pattern portion G1 of the glass G. (See FIG. 7).

When the cylinder 54 of the bonding portion 36 is operated in the above-described state, the bonding head 56 coupled to the piston rod end of the cylinder 54 is moved downward to the upper side of the pattern G2. Bonding is performed while pressing the conductive adhesive layer F1 of the positioned film F to a predetermined temperature.

When the conductive adhesive layer F1 is bonded to one pattern G2 by the bonding operation, the back paper F2 attached to the back surface of the conductive adhesive layer F1 is wound while being sequentially wound on the film recovery reel R2. As a result, another conductive adhesive layer F1 cut by the film cut part 38 is supplied to a position where bonding is possible under the bonding head 56.

The horizontal plate 32 is bonded to the bonding head 36 of the bonding part 36 at a position corresponding to another pattern G2 formed to be spaced apart from the pattern G2 where the bonding is completed by the transfer unit U3. 56 is moved and stopped to bond the conductive adhesive layer F1 of the film F to the other pattern G2 through the bonding head 56 in the same process as described above.

After completing the bonding to one or more patterns G2 formed in the pattern portion G1 while moving in the longitudinal direction of the pattern portion G1 of the glass G through the above-described process, the rotating table 4 is again replaced. When activated, the glass G in which the conductive adhesive layer F1 of the film F is bonded by the above bonding process is rotated counterclockwise to be spaced apart from the bonding part 36 and another glass G is separated. The loaded loading unit 22 is positioned in the bonding unit 36 described above.

Then, the conductive adhesive layer F1 of the film F may be bonded to the pattern G2 of the glass G in the same manner as in the bonding process, and the glasses G thus bonded are the rotary table 4. After being sequentially rotated by), it is unloaded and stored in a separate storage tray (not shown).

Then, the glass G is unloaded, and the loading unit 22 is loaded with the glass G again and supplied to the bonding unit 36 by the rotary table 4 to the bonding process described above. Similarly, bonding is performed continuously.

In the above, the pattern portions G1 formed on the glass G are formed in one row, and the bonding heads 56 are bonded to the respective patterns G2 while the bonding head 56 is sequentially moved in the longitudinal direction of the pattern portions G1. Although an example is described and shown in the drawings, in addition, when the pattern portion G1 formed in the glass G is formed in an “L” shape, the pattern portion G1 is described by the above-mentioned loading unit 22. ) Is converted into an optimal bonding position to perform bonding.

Referring to FIG. 8, the bonding embodiment of the pattern portion G1 formed in the “L” shape on the glass G will be described in detail as follows.

As shown in the accompanying drawings, when the pattern portion G1 is formed in the glass G in the form of an “L” shape, the pattern portion G1 moves in the longitudinal direction of the pattern portion G1 in one side as in the above-described embodiment. Each of the conductive adhesive layers F1 of the film F is bonded to one or more patterns G2 formed in the layers.

When the bonding is completed to the pattern portion G1 in one row by the bonding process, the loading cylinder 28 installed in the rotating plate 20 at the lower side of the loading unit 22, that is, the loading stage 26 is opened. It is operated to rotate the loading stage as shown in the figure.

Then, the glass G loaded on the loading stage 26 rotates in the same direction so that another pattern portion G1 formed orthogonal to the pattern portion G1 where the bonding is completed is performed. It is arranged in a position where bonding is possible from the lower side.

As described above, when the glass G is rotated and another pattern portion G1 is positioned in a state where bonding is possible by the bonding head 56, the pattern G2 is formed in at least one pattern G2. What is necessary is just to bond each electrically conductive adhesive layer F1 of the film F by the same bonding method as the above-mentioned embodiment.

As shown in FIG. 9, when the pattern G2 formed in the pattern portion G1 of the glass G is formed in two rows, the pattern G2 is arranged in one row in the same manner as in the above-described embodiment. After bonding the electrically conductive adhesive layer F1 of the film F in sequence, the transfer motor M4 of the longitudinal plate 34 installed in the said work bench 2 is driven. (Refer FIG. 4).

Then, the longitudinal plate 34 is moved in the direction shown in the drawing by the driving of the transfer motor M4, and the bonding head 56 installed on the plate 34 is the pattern portion of the glass G. It moves to the position corresponding to the pattern G2 formed in two columns in G1.

When the movement of the bonding head 56 is completed as described above, the conductive adhesive layer F1 of the film F is formed on the pattern G2 formed in two rows through the bonding head 56 in the same manner as the above-described embodiment. The bonding may be performed and the pattern G2 formed in one or more rows may be easily bonded to the pattern portion G1 of the glass G through the above-described method.

In the above-described bonding embodiment, the bonding head 56 of the bonding portion 36 is moved in the transverse direction and the longitudinal direction by the transverse plate 32 and the longitudinal plate 34, and at least one of the bonding heads 56 is formed in the pattern portion G1. Although it demonstrates bonding each electrically conductive adhesive layer F1 of the film F to the formed pattern G2, it is not limited to this.

For example, as shown in FIG. 2, the loading unit 22 installed above the rotating table 4 by the auxiliary horizontal plate 16 and the auxiliary vertical plate 18 provided below the rotating table 4. 11, the bonding head 56 of the bonding portion 36 to the pattern portion (G1) and the pattern (G2) formed in the glass (G) to be loaded by moving in the horizontal and longitudinal direction directly as shown in FIG. Bonding may be performed while moving to an optimum bonding position corresponding to the above. In accordance with the working environment and conditions, the bonding head 56 or the loading unit 22 may be appropriately moved to perform bonding, thereby providing optimum work efficiency. And compatibility can be obtained.

In the above, a preferred embodiment of the anisotropic conductive film bonding apparatus according to the present invention has been described, but the present invention is not limited thereto, and various modifications are made within the scope of the claims and the detailed description of the invention and the accompanying drawings. It is possible and this also belongs to the scope of the present invention.

As described above, the anisotropic conductive film bonding apparatus according to the present invention improves the efficiency of the work process and equipment by performing the bonding while moving the pattern portion and the pattern formed in various forms on the glass to the optimum bonding position, thereby doubling the productivity. can do.

In addition, the anisotropic conductive film bonding apparatus according to the present invention may not only obtain an optimal bonding quality by bonding the conductive adhesive layer of the anisotropic conductive film individually to the pattern corresponding to the pattern in which one or more are formed on the glass, but also such bonding. Manufacturing costs can be greatly reduced by minimizing the consumption of film required for the work.

In addition, the anisotropic conductive film bonding apparatus according to the present invention, by performing bonding while one or more loading units are rotated in sequence by the rotary table, it is possible to perform a continuous bonding operation can significantly shorten the working time and process.

Claims (6)

A work table, a rotary table installed inside the work table and rotating in a rotational, lateral and longitudinal direction, and a stage portion provided on an upper surface of the rotary table and moving in the same direction as the table and loaded with glass, A means for supplying and attaching an anisotropic conductive film while at least one is installed adjacent to the outer circumferential surface of the stage in one workbench and moved to a position corresponding to the pattern portion of the glass loaded in the stage; This means includes a transverse plate and a longitudinal plate which are coupled to a transfer unit which is installed in a direction orthogonal to each other adjacent to the stage portion on the upper side of the workbench, and a loading unit of the stage portion provided on the longitudinal plate. A bonding portion for bonding the anisotropic conductive film to the pattern portion of the glass loaded on the glass plate, a film supply reel installed at one side of the longitudinal plate and supplying the anisotropic conductive film to the bonding portion, and at one side of the longitudinal plate A film cutting portion which is provided between the film supply reel and the bonding portion to cut the conductive adhesive layer of the anisotropic conductive film supplied to the bonding portion to a predetermined length, and the conductive adhesive layer of the anisotropic conductive film is bonded by the bonding portion. An anisotropic conductive film bonding apparatus comprising a film recovery reel to recover the backing paper attached to the back of the conductive adhesive layer. The method according to claim 1, wherein the stage unit, the upper side of the rotary table is provided with a rotary plate spaced apart at predetermined intervals, and one or more loading units are arranged in the circumferential direction of the rotary plate, the loading unit is And a loading stage disposed on an upper side of the rotating plate and loaded with glass, and a loading cylinder installed below the rotating plate and rotatably supporting the loading stage. The method of claim 2, wherein the loading cylinder is an anisotropic conductive film bonding device, characterized in that the rotary cylinder (Rotary Cylinder). The method according to claim 1, wherein the bonding portion is composed of a cylinder and a bonding head installed on the piston rod of the cylinder, is installed on one side of the vertical plate movably installed on the work table is loaded on the loading unit Anisotropic conductive film bonding apparatus characterized by bonding the conductive adhesive layer of the anisotropic conductive film individually in a pattern in which at least one is formed while moving in the longitudinal and transverse directions along the pattern portion of the glass. The method of claim 1, wherein the rotating table is composed of an indexing drive table (Indexing Drive Table), the lower side of the table is provided with an auxiliary horizontal plate and a secondary longitudinal plate coupled to the transfer unit is installed in a direction orthogonal to each other Anisotropic conductive film bonding apparatus for supporting the rotary table so as to be movable in the longitudinal and transverse direction on the work table. The film cutting unit of claim 1, wherein the film cutting unit includes a housing and a transfer cutter slidably installed by a cylinder installed under the housing, wherein the housing includes a guide groove for guiding the anisotropic conductive film and the groove. And a slide groove formed in an orthogonal direction, wherein the feed cutter slides along the slide groove of the housing by the cylinder and has a size corresponding to one pattern formed on the pattern portion of the glass. Anisotropic conductive film bonding apparatus for cutting only the adhesive layer.