KR101214076B1 - Heating adhesive apparatus of printed circuit board for manufacturing camera module - Google Patents

Abstract

PURPOSE: A thermal bonding device of a PCB(printed circuit board) for manufacturing a camera module is provided to bond a PCB by moving the thermal bonding device according to the positions of a plurality of the camera modules while mounting the camera modules, thereby improving productivity by reducing time for bonding. CONSTITUTION: A thermal bonding device of a PCB for manufacturing a camera module comprises mounting units(110), a mount transfer body, a thermal bonding unit(130), and a bonded portion transferring unit(140). A plurality of the camera modules is mounted on the mounting unit. The mount transfer body transfers the mounting units respectively to an X-axis direction and a Y-axis direction. The thermal bonding unit is arranged on the top of the mounting unit. The camera modules are mounted on the mounting units by operating the mount transfer body. The thermal bonding unit heats and pressurizes the PCB being bonded to the camera modules among the mounted camera modules arranged in the lower part of the mounting units, thereby bonding the PCB. The bonded portion transferring unit moves the thermal bonding unit downwardly in a direction of the PCB of the camera module to reach a thermal bonding position.

Description

Thermal bonding device for printed circuit board for manufacturing camera module {Heating adhesive apparatus of printed circuit board for manufacturing camera module}

The present invention relates to a circuit board bonding apparatus for manufacturing a camera module, and more particularly, the bonding speed can be improved by performing a heat bonding operation while moving according to the positions of the plurality of camera modules in a state in which the plurality of camera modules are placed. A printed circuit board thermal bonding apparatus for manufacturing a camera module.

Recently, portable devices such as mobile phones and tablets are provided with a camera module in the form of an electronic component for taking pictures and videos. Conventional camera modules include a lens barrel to which external light is incident, a driving device to drive the lens barrel, an image sensor to convert an image extracted from a light source incident through the lens barrel into a data signal, and a fixed image sensor Module printed circuit board, which is electrically connected to transmit data signal, is connected to the module printed circuit board to transmit the data signal converted from the image sensor to the portable device by electrically connecting between the module printed circuit board and the portable device. It includes a printed circuit board. In general, a rigid printed circuit board (Rigid-PCB) is used for the module printed circuit board for firm support of the camera module, and a flexible printed circuit board (Flexible-PCB) is used for easy external connection. do.

In the manufacturing process of the camera module described above, a circuit board thermal bonding apparatus is used in which a module printed circuit board and a connected printed circuit board are bonded by applying heat and pressure to bond the substrates of different materials to each other.

The conventional circuit board thermal bonding apparatus includes a pressurizer at an upper portion of a camera module having a module printed circuit board fixed at a lower portion thereof, and a heater at a lower portion of a connection printed circuit board bonded to the module printed circuit board. It is provided so that it may pressurize by the operation of a pressurizer in the state heated with the base, and to join. In addition, in order to prevent flow when pressing the camera module to which the module printed circuit board is fixed, bonding is performed in a state in which the camera module and the connected printed circuit board which support the module printed circuit board are respectively supported. And release the supported state after the joining operation.

Such a conventional circuit board thermal bonding apparatus has a problem in that productivity is delayed due to delay in working time as the module printed circuit board is individually supplied and supported by a fixed camera module and a connected printed circuit board. .

In addition, the circuit board thermal bonding apparatus of the prior art is pressure-bonded in a state supported from the top of the heating unit, the thermal contact time is increased in the process of bonding with the support process, heat damage may occur, the heated state There was also a problem that takes a long time to cool in.

In addition, the conventional circuit board thermal bonding apparatus has a module printed circuit board and a connection printed circuit board is located on the lower surface of the camera module, the lower pressure is applied to the upper surface of the camera module when pressed in the pressing portion installed on the upper As it is transmitted to the position, as the pressing force acts on the entire camera module, the loss of the pressing force is large, and if the pressing force is too strong, the camera module is broken, and if it is too small, there is a problem in that the bonding is not good.

The present invention has been invented to improve the above problems, and the problem to be solved by the present invention is to bond by heating and pressurizing to the thermal bonding portion that is moved up and down while moving back and forth and left and right in a state of placing a plurality of camera modules. According to the present invention to provide a printed circuit board thermal bonding apparatus for manufacturing a camera module that can improve the productivity by shortening the time of the thermal bonding process.

The technical problem of the present invention is not limited to those mentioned above, and another technical problem which is not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a printed circuit board thermal bonding apparatus for manufacturing a camera module according to an embodiment of the present invention, in the printed circuit board thermal bonding apparatus for manufacturing a camera module for bonding the printed circuit board during the manufacturing process of the camera module, a plurality of The camera module is placed, and the camera module, which is positioned so that the printed circuit board to be bonded to the upper direction is installed in the lower portion, the lower portion is installed so as to be inserted and supported in a plurality of positions respectively, A settling transfer body installed to move the settling portion in the Y-axis direction and the X-axis direction orthogonal to the horizontal direction, and disposed on an upper portion of the settling portion, and a plurality of the settled on the settling portion by operation of the settling transfer body Bonding printing of the camera module located below the camera module A thermal bonding portion arranged to bond by pressurizing the substrate while heating the substrate, and the thermal bonding portion disposed on one side of the thermal bonding portion, and placed in the settled portion and reaching the position where the thermal bonding is performed. It characterized in that it comprises a joint shanghai sending unit installed to lower the joint.

In addition, the settling portion is disposed in the lower portion of the plurality of the camera module, the settling jig having a plurality of settling grooves of which the upper part is opened so that the printed circuit board portions of the plurality of camera modules in the upper direction is inserted and supported. And a settling bracket disposed under the settling jig and supporting at least one bottom surface of the at least one settling jig, the settling bracket disposed on the settling jig and inserted into the plurality of settling grooves. It is provided to support the printed circuit board located on the upper portion of the camera module, and includes a settle support having a plurality of bonding holes in the form of a long hole so that the bonding operation is performed in the thermal bonding portion of the thermal bonding portion of the printed circuit board. It can be characterized by.

The settle conveying unit is disposed below the settled portion, and includes: a first shaft conveyance supported to move the settled portion in a first axial direction which is one axial direction among the X-axis direction and the Y-axis direction orthogonal to each other in a horizontal direction; The body is disposed in the lower portion of the first shaft conveyance body, provided in the form of a rail extending in the first axis direction so that the first axis conveying body is mounted in a state where the first axis conveying body is mounted to be guided. The first shaft feed rail is installed on the first shaft feed rail, the first shaft feed body is connected to the first shaft feed body and moves along the first shaft feed rail in the first axis direction. A first shaft feeder installed to provide power, and disposed below the first shaft feed rail, the other shaft being disposed in an X-axis direction and a Y-axis direction orthogonal to the first axis direction in a horizontal direction. The settling portion which is supported to move the first axis feed rail in the second axis direction in the second axis direction and moves in the first axis direction along the first axis feed rail, in the second axis direction The second shaft conveying body, which is supported so as to be disposed below the second shaft conveying body, is provided in the form of a rail extending in the second axis direction and the second shaft in a state in which the second shaft conveying body is mounted A second shaft conveying rail, which is installed to guide the movement in a direction, and is installed on the second axis conveying rail, and connected to the second axis conveying body and along the second axis conveying rail; It may be characterized in that it comprises a second shaft feeder installed to provide power to be moved in the second axis direction.

In addition, the thermal bonding portion, which is disposed on the upper part of the settled portion, is disposed on the upper portion of the camera module inserted into the settled portion to be transferred by the operation of the settle transfer portion to press the printed circuit board located on the upper portion. The pressure body is installed, disposed on the upper portion of the pressing body, to provide a power pressurized to join the printed circuit board by lowering the pressing body located above the printed circuit board of the camera module to be thermally bonded. The pressurization operating device is installed, disposed on one side of the pressurized body, the heating device is installed on one side of the pressurized body at the time of pressurizing the printed circuit board, and disposed on one side of the pressurized body, The body, the pressure actuating device, and the heating device are respectively supported to join the joint Characterized in that that may include bonding to the transfer frame it is installed vertically in the high-send operation.

In addition, the bonded shanghai sending unit is disposed on one side of the thermal bonding portion, the thermal bonding portion is located in the upper portion of the printed circuit board of the camera module placed in the settled portion up and down to the position where the thermal bonding operation is performed Shanghai Song body, which is supported to be strong, is disposed on one side of the Shanghai Song body, and provided in the form of a rail extending in the vertical direction and installed to guide the movement in the vertical direction while the Shanghai Song body is mounted. A rail, and installed on the shanghai song rail, and connected to the shanghai song body, which may include a shanghai song device installed to provide power to move the shanghai song body in a vertical direction along the shanghai song rail. It features.

Specific details of other embodiments are included in the detailed description and the drawings.

According to a printed circuit board thermal bonding apparatus for manufacturing a camera module according to an embodiment of the present invention, the thermal bonding portion is moved by heating and pressurizing to a thermal bonding portion that moves up, down, left, and right in a state where a plurality of camera modules are placed, Productivity can be improved by shortening the time of the bonding process.

In addition, by placing the module printed circuit board and the connected printed circuit board bonded to the plurality of camera modules in the upper direction so that the thermal bonding portion is directly heated and pressurized the junction portion to heat up the time of the camera module Minimize the failure force by the pressing force at the correct position with a small force as it acts directly on the position where the pressing force is bonded.

In addition, a plurality of settling grooves having an upper portion of the settled portion in which the plurality of camera modules are placed are provided so that the camera module fixed to the module printed circuit board is inserted and placed in a state where the module printed circuit board is directed upward. When the camera module is inserted, it is maintained in the supported state and can be easily withdrawn to the open top, so that there is no need for other devices according to the support, and thus it is possible to maintain the supported state at the time of bonding by pressing and heating, thereby increasing the bonding speed. Can be improved.

In addition, the thermal bonding is carried out while moving the respective module printed circuit board and the connected printed circuit board in the X-axis and Y-axis direction, the settled portion in which the plurality of camera modules are placed to the lower position of the thermal joint portion which is moved in the Z-axis direction in the vertical direction. By performing the pressurization and heating operation, the speed of the thermal bonding process can be improved by performing the thermal bonding operation while moving in a state where a plurality of camera modules are placed.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 is a view showing a camera module to be bonded in the present invention.
Figure 2 is a perspective view showing a thermal bonding device for a printed circuit board for manufacturing a camera module according to an embodiment of the present invention.
3 is a front view illustrating a printed circuit board thermal bonding apparatus for manufacturing the camera module of FIG. 2.
4 is a plan view illustrating a printed circuit board thermal bonding apparatus for manufacturing the camera module of FIG. 2.
FIG. 5 is a side view illustrating a printed circuit board thermal bonding apparatus for manufacturing the camera module of FIG. 2. FIG.
FIG. 6 is a perspective view illustrating a settling portion and a settling transfer portion which are main parts of a printed circuit board thermal bonding apparatus for manufacturing a camera module of FIG. 2; FIG.
FIG. 7 is an exploded perspective view of part of a settling portion and a settling transfer portion of a printed circuit board thermal bonding apparatus for manufacturing the camera module of FIG. 6; FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.

In describing the embodiments, descriptions of technical contents which are well known in the technical field to which the present invention belongs and are not directly related to the present invention will be omitted. This is for the sake of clarity of the present invention without omitting the unnecessary explanation.

For the same reason, some of the components in the drawings are exaggerated, omitted, or schematically illustrated. In addition, the size of each component does not fully reflect the actual size. The same or corresponding components in each drawing are given the same reference numerals.

Hereinafter, the present invention will be described with reference to the drawings for explaining a printed circuit board thermal bonding apparatus for manufacturing a camera module according to embodiments of the present invention.

2 is a perspective view illustrating a printed circuit board thermal bonding apparatus for manufacturing a camera module according to an embodiment of the present invention, FIG. 3 is a front view illustrating a printed circuit board thermal bonding apparatus for manufacturing a camera module of FIG. 2, and FIG. 4 is FIG. 5 is a plan view illustrating a printed circuit board thermal bonding apparatus for manufacturing a camera module, FIG. 5 is a side view illustrating a printed circuit board thermal bonding apparatus for manufacturing a camera module of FIG. 2, and FIG. 6 is a printed circuit board thermal bonding apparatus for manufacturing a camera module of FIG. 2. 7 is a perspective view illustrating a settling portion and a settling transfer portion of the main portion, and FIG. 7 is a partially exploded perspective view of the settling portion and settling transfer portion, which are main portions of a printed circuit board thermal bonding apparatus for manufacturing a camera module of FIG. 7.

2 to 7, the printed circuit board thermal bonding apparatus 100 for manufacturing a camera module according to an embodiment of the present invention may be connected to an image sensor during a manufacturing process of the camera module 10 so that Heating and pressurizing the module printed circuit board 11 made of a rigid printed circuit board material fixed to the bottom and the connection printed circuit board 12 made of a flexible printed circuit board material so as to transmit a signal generated by the image sensor to the device. It is provided so that it may join by.

The printed circuit board thermal bonding apparatus 100 for manufacturing a camera module includes a settling unit 110 on which a plurality of camera modules 10 are placed, a settling transfer unit 120, a thermal bonding unit 130, and a bonding shanghai sending unit 140. do. The settling unit 110 includes a settling jig 111, a settling bracket 113, and a settling support 114 on which the plurality of camera modules 10 are placed.

The settling jig 111 is disposed below the plurality of camera modules 10, and a portion in which the module printed circuit board 11 and the connection printed circuit board 12 of the plurality of camera modules 10 are joined in an upward direction. It has a plurality of settled grooves 112 of which the upper part is opened so as to be inserted and supported in the upper direction. The settling jig 111 is formed in a plate shape in which a plurality of camera modules 10 are placed, and the settling grooves 112 opened in the upper direction are arranged in a plurality of columns and rows so that the module printed circuit board 11 and the connected printed circuit board 12 are formed. ) Is positioned in the upper direction in an overlapped state, and the remaining camera module 10 is provided to be inserted and supported in the settling groove 112.

The settling bracket 113 is disposed below the settling jig 111 and is installed to support the bottom surface of the at least one settling jig 111 to move together. The settling bracket 113 is installed to be transferred together to the settling conveying unit 120 in a state in which one or a plurality of settling jigs 111 are supported thereon.

The settling support 114 is disposed on the top of the settling jig 111, and is connected to the printed circuit board 11 and the module printed circuit board 11 positioned on the top of the camera module 10 inserted and supported in the plurality of settling grooves 112. A plurality of joining holes having a long hole shape are provided to support 12 from the top, and the joining operation is performed at the thermal bonding portion 130 as a thermal bonding portion of the module printed circuit board 11 and the connection printed circuit board 12 ( 115). The settling support 114 passes through the joint in a state in which the module printed circuit board 11 and the connection printed circuit board 12 positioned on the upper portion of the camera module 10 placed on the top of the settling jig 111 are pressed and supported. Forming the bonding hole 115 is formed to prevent the flow of the module printed circuit board 11 and the connection printed circuit board 12 during thermal bonding to the thermal bonding portion 130 can perform the pressure and heat bonding operation. .

Settlement conveying unit 120 is the Y-axis feed body 121, the Y-axis feed rail 122, the Y-axis feeder 123, the X-axis feed that the support bracket 113 is supported to be conveyed in the Y-axis direction of the front and rear direction The body 124, the X-axis feed rail 125, and the X-axis feeder 126. Here, the direction is defined for the convenience of explanation by the left and right directions, which are orthogonal to the Y axis in the horizontal direction, and the X axis in the drawings. In addition, the settlement transfer unit 120 is shown in the Y-axis direction to be transported to the lower portion of the settle bracket 113, and to be transported in the X-axis direction below the Y-axis, this is for convenience of description, settle bracket ( 113 may be transported in the X-axis direction, and may be installed to be transported in the Y-axis direction below the X-axis. That is, the settlement transfer unit 120 is provided to be moved back and forth left and right at the mutually orthogonal position, the installation position set in the present embodiment is for convenience of description, it will be apparent to those skilled in the art that the installation position can be converted. .

The Y-axis transfer body 121 is disposed below the settling bracket 113 and is supported so that the settling bracket 113 is moved in the Y-axis direction, which is the front-rear direction. The Y-axis transfer body 121 is in the form of a plate that is supported so that the settling bracket 113, which supports at least one or more of the settling jig 111 in which the plurality of camera modules 10 are placed thereon, is moved in the Y-axis direction. It is provided.

The Y-axis feed rail 122 is disposed below the Y-axis feed body 121 and is provided in the form of a rail extending in the Y-axis direction and moves in the Y-axis direction with the Y-axis feed body 121 mounted. To be guided. The Y-axis feed rail 122 is provided to extend in the Y-axis direction in the form of a rail to guide the Y-axis feed body 121 so that the camera module 10 moves in the Y-axis direction.

The Y-axis feeder 123 is installed on the Y-axis feed rail 122, the Y-axis feed body 121 is connected to the Y-axis feed body 121 along the Y-axis feed rail 122 is Y-axis It is installed to provide power moving in the direction. The Y-axis feeder 123 is operated to move the Y-axis feed body 121 mounted on the Y-axis feed rail 122 in the Y-axis direction.

The X-axis feed body 124 is disposed below the Y-axis feed rail 122, and moves the Y-axis feed rail 122 in the X-axis direction in the X-axis direction orthogonal to the Y-axis direction and the horizontal direction. The settling jig 111 which is supported and moved in the Y-axis direction along the Y-axis feed rail 122 is supported to be moved in the X-axis direction. The X-axis transfer body 124 is provided in the form of a plate that the Y-axis transfer rail 125 is supported to transfer the camera module 10 supported to be transferred to the Y-axis in the X-axis direction.

The X-axis conveying rail 125 is disposed below the X-axis conveying body 124 and is provided in the form of a rail extending in the X-axis direction and moves in the X-axis direction with the X-axis conveying body 124 mounted. To be guided.

The X-axis feeder 126 is installed on the X-axis feed rail 125, the X-axis feed body 124 is connected to the X-axis feed body 124 along the X-axis feed rail 125 is X-axis It is installed to provide power moving in the direction.

Accordingly, the X-axis is transferred to the position where the camera module 10 placed in the settling jig 111 is joined to the thermal bonding unit 130 by the operation of the Y-axis feeder 123 and the X-axis feeder 126. Direction and Y-axis direction. That is, the plurality of camera modules 10 inserted and arranged in the settled grooves 112 are thermally bonded to be positioned under the thermal joints 130 which are respectively thermally bonded while being transferred in the X-axis direction and the Y-axis direction in order to thermally bond. Is carried out.

Accordingly, by performing a thermal bonding operation while the plurality of camera modules 10 are seated in the settling jig 111, the thermal bonding operation speed may be improved to increase productivity.

The thermal bonding unit 130 includes a pressurizing body 131, a pressurizing actuator 132, a heating apparatus 133, and a bonding frame 134 for pressing the plurality of camera modules 10 placed in the settling jig 111. Include. The pressurizing body 131 is disposed on the upper part of the settling jig 111, and is disposed on the upper part of the camera module 10 inserted and placed on the settling jig 111, which is transferred by the operation of the settling transfer part 120. The module printed circuit board 11 and the connection printed circuit board 12 are pressurized.

The pressurization actuator 132 is disposed above the pressurizing body, and pressurizes the pressurizing body 131 positioned above the module printed circuit board 11 and the connection printed circuit board 12 of the camera module 10 to be thermally bonded. Up and down is installed to provide a pressurized power for joining the module printed circuit board 11 and the connection printed circuit board 12.

The heating device 133 is disposed on one side of the pressurizing body 131, and is heated on one side when the module printed circuit board 11 and the connected printed circuit board 12 are pressed on one side of the pressurizing body 131. Is installed. The heating device 133 is disposed on one side of the pressing body 131 and is installed to generate heat when the module printed circuit board 11 and the connection printed circuit board 12 are pressurized to be thermally bonded.

Bonding frame 134 is disposed on one side of the pressurizing body 131, the pressurizing body 131, the pressurizing actuator 132, and the heating device 133 are respectively supported by the operation of the shanghai sending unit 140 It is installed to be transported up and down.

The bonding shanghai sending unit 140 includes a shanghai song body 141, a shanghai song rail 142, and a shanghai conveying device 143 is supported to be transported up and down on one side to the bonding frame 134. Shanghai Song body 141 is disposed on one side of the bonding frame 134, the thermal bonding portion 130 is connected to the printed circuit board 11 and the module printed circuit board 11 of the camera module 10 placed in the settling jig 111 It is supported to be moved up and down to a position where the thermal bonding operation is performed in the state located on the substrate 12.

Shanghai Song Rail 142 is disposed on one side of the Shanghai Song body 141, is provided in the form of a rail extending in the vertical direction is installed so that it is guided to move in the vertical direction while the Shanghai Song body 141 is mounted do.

The Shanghai transport device 143 is installed on the Shanghai transport rail 142, and is connected to the Shanghai transport body 141 to drive power in which the Shanghai transport body 141 moves up and down along the Shanghai transport rail 142. It is installed to provide. When the shanghai body 141 is raised by the operation of the shanghai transporting device 143, the camera module 10 minimizes the interference transferred by the operation of the settle transport unit 120, and the camera module 10 at the thermal bonding position. When this is reached, the thermal bonding unit 130 is provided to be lowered to a thermally bonded position.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And is not intended to limit the scope of the invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

Description of the Related Art
100: thermal bonding device 110: settle
111: settling jig 112: settling home
113: settling bracket 114: settling support
115: joining hole 120: settlement transfer portion
121: Y-axis feed body 122: Y-axis feed rail
123: Y-axis feeder 124: X-axis feed body
125: X axis feed rail 126: X axis feed device
130: heat bonding portion 131: pressurized body
132: pressure operating device 133: heating device
134: bonding frame 140: bonding Shanghai
141: Shanghai Song body 142: Shanghai Song Rail
143: Shanghai transport equipment

Claims (5)

In the printed circuit board thermal bonding apparatus for manufacturing a camera module for bonding a printed circuit board during the manufacturing process of the camera module,
A plurality of the camera module is placed, the mounting portion is installed so that the camera module, which is positioned so that the printed circuit board to be bonded to the upper direction is inserted and supported in a plurality of positions, respectively,
Settlement transfer body is disposed in the lower portion, and installed to move the settle portion in the Y-axis direction and X-axis direction orthogonal to the horizontal direction, respectively,
The printed circuit board is disposed on the mounting portion, the plurality of the camera module is placed in the mounting portion by the operation of the settle transfer body, the printed circuit board bonded to the camera module located in the lower portion of the camera module A thermal bonding portion provided to be bonded by pressing while heating the same, and
A joint shanghai sending unit disposed on one side of the thermal bonding unit and installed to lower the thermal bonding unit in the direction of the printed circuit board of the camera module that is placed in the settled part and reaches a thermal bonding position.
Including but not limited to:
The settlement part,
A settling jig disposed under the plurality of camera modules, the settling jig having a plurality of settling grooves opened at an upper portion thereof so that the printed circuit board portions of the plurality of camera modules are inserted and supported in an upward direction;
A settling bracket disposed under the settling jig and installed to support and move at least one lower surface of the settling jig, and
The thermal bonding part is disposed on an upper part of the set jig, and is configured to support the printed circuit board positioned at an upper portion of the camera module inserted into and supported by a plurality of the settle grooves, and is a thermal bonding part of the printed circuit board. Settled support having a plurality of joining holes in the form of a long hole so that the joining operation in the
Printed circuit board thermal bonding apparatus for manufacturing a camera module comprising a. delete The method of claim 1,
The settlement transfer unit,
A first shaft conveying body disposed under the settling portion and supported to move the settling portion in a first axial direction, which is one axial direction among the X and Y axis directions that are orthogonal to each other in a horizontal direction,
It is disposed under the first shaft transfer body, provided in the form of a rail extending in the first axial direction is installed to guide the movement in the first axial direction with the first shaft transfer body is mounted 1-axis feed rail,
Is installed on the first axis conveyance rail, the first axis conveying body is connected to the first axis conveying body is installed to provide power to move the first axis conveying body in the first axis direction along the first axis conveying rail 1 axis feeder,
The first shaft conveyance rail is disposed below the first axis conveyance rail, and the first axis conveyance rail is disposed in the second axis direction which is another one of the X axis direction and the Y axis direction that is orthogonal to the first axis direction in the horizontal direction. A second shaft transfer body which is supported to move in the two axis direction and is supported to move the settle portion moved in the first axis direction along the first axis transfer rail in the second axis direction,
It is disposed in the lower portion of the second shaft transfer body, provided in the form of a rail extending in the second axis direction is installed to guide the movement in the second axis direction with the second axis transfer body is mounted 2-axis feed rail, and
Is installed on the second axis conveying rail, the second axis conveying body is connected to the second axis conveying body is installed to provide power to move the second axis conveying body in the second axis direction along the second axis conveying rail 2-axis feeder
Printed circuit board thermal bonding apparatus for manufacturing a camera module comprising a. The method of claim 1,
The thermal bonding portion,
A pressurizing body disposed above the settled portion and arranged to press the printed circuit board positioned on the top of the camera module inserted into the settled portion transferred by operation of the settled transfer portion to press the printed circuit board;
A pressurization actuator disposed above the pressurizing body and installed to provide a pressurized power for joining the printed circuit board by raising and lowering the pressurizing body positioned above the printed circuit board of the camera module to be thermally bonded. ,
A heating device disposed on one side of the pressing body and installed to heat at one side when pressing the printed circuit board at one side of the pressing body;
The bonding frame is disposed on one side of the pressing body, and the pressing body, the pressing operating device, and the heating device are respectively supported to be transported up and down by the operation of the joining shanghai sending unit.
Printed circuit board thermal bonding apparatus for manufacturing a camera module comprising a. The method of claim 1,
The joining Shanghai Songbu,
A shanghai body which is disposed on one side of the thermal bonding part and is supported to be moved up and down to a position where the thermal bonding operation is performed while the thermal bonding part is located on an upper portion of the printed circuit board of the camera module placed in the mounting part; ,
It is disposed on one side of the shanghai Song body, and provided in the form of a rail extending in the vertical direction Shanghai Song rail is installed to guide the movement in the vertical direction while the Shanghai Song body is mounted, and
The Shanghai Song Rail is installed on the Shanghai Song Rail, and is connected to the Shanghai Song Body to provide power to move the Shanghai Song body in the vertical direction along the Shanghai Song Rail.
Printed circuit board thermal bonding apparatus for manufacturing a camera module comprising a.

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