CN210060038U - Device for loading and unloading chips of multi-path pumping module - Google Patents
Device for loading and unloading chips of multi-path pumping module Download PDFInfo
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- CN210060038U CN210060038U CN201920744352.6U CN201920744352U CN210060038U CN 210060038 U CN210060038 U CN 210060038U CN 201920744352 U CN201920744352 U CN 201920744352U CN 210060038 U CN210060038 U CN 210060038U
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Abstract
The utility model discloses a device for loading and unloading multichannel pumping module's chip, which comprises a frame, its characterized in that be equipped with mobilizable work platform in the frame, the work platform top is equipped with mobilizable laser galvanometer, clamping jaw respectively and takes out the tin device, still be equipped with the alignment in the frame work platform's camera. The utility model discloses can realize carrying out the purpose that this single-way chip was taken off to the chip that damages on the multichannel pumping module targeted laser melting, can also weld the chip of subsiding in order to replace the chip of damage simultaneously, reach the purpose of restoreing multichannel pumping module.
Description
Technical Field
The utility model relates to a technical field of multichannel pumping module, concretely relates to a device for loading and unloading multichannel pumping module's chip.
Background
At present, when a pumping module of a laser is equipped in the market, the vacuum eutectic welding technology is mostly adopted, and the welded tool fixtures are usually designed into a whole, which means that after a plurality of chips are equipped, the chips are welded on the pumping module together in a vacuum welding mode. The bonding method using such a bonding tool causes a problem that the pump module becomes a defective product once one of the chips is damaged in the subsequent assembly process, and in this case, the coupling power of the product does not meet the specified requirement even if the product is manufactured. Therefore, this welding method greatly limits the yield of producing the pump module and causes material waste. The above problems are urgently needed to be solved.
SUMMERY OF THE UTILITY MODEL
In view of the not enough of background art, the utility model provides a device for loading and unloading multichannel pumping module's chip can realize carrying out the purpose that the targeted laser melting was carried out and this single-channel chip was taken off to the chip that damages on the multichannel pumping module, can also paste the chip of subsiding simultaneously in order to replace the chip of damage, reaches the purpose of restoreing multichannel pumping module.
For solving the technical problem, the utility model provides a following technical scheme:
the device for loading and unloading the chips of the multi-path pumping modules comprises a rack, wherein a movable working platform is arranged on the rack, a laser galvanometer, a clamping jaw and a tin pumping device which are respectively movable are arranged above the working platform, and a camera which is aligned with the working platform is also arranged on the rack.
But be equipped with horizontal migration's work platform in the frame, but work platform top is equipped with the laser galvanometer, clamping jaw cylinder and the tin device of taking out that respectively vertical migration.
The machine frame is provided with a first motor, the first motor is in transmission connection with a first screw rod, the first screw rod is in transmission connection with a longitudinal installation seat to move transversely, the longitudinal installation seat is connected with a second motor, the second motor is in transmission connection with a second screw rod, and the second screw rod is in transmission connection with the longitudinal movement of the working platform.
The camera is installed on the laser galvanometer, the laser galvanometer and the tin extracting device are installed on a transverse installation seat, the transverse installation seat can be vertically movably installed on the rack, and the clamping jaw is movably installed on the transverse installation seat.
The clamping jaw mechanism is characterized in that a third motor is arranged on the rack and is in transmission connection with a third screw rod, the third screw rod is in transmission connection with the transverse mounting seat to move up and down, clamping jaws are arranged on clamping jaw cylinders which are transversely arranged, and the clamping jaw cylinders are arranged on the transverse mounting seat in a manner of moving up and down.
And a fourth motor is arranged on the transverse mounting seat, the fourth motor is in transmission connection with a fourth screw rod, and the fourth screw rod is used for transmitting the clamping jaw cylinder to move up and down.
The tin extracting device is provided with a suction nozzle, and the suction nozzle is aligned with the working platform.
Compared with the prior art, the utility model beneficial effect who has is: the utility model overcomes in the past in case the chip damage of the same kind of multichannel pumping module leads to the condemned technical problem of whole product promptly, can carry out pertinence to the chip of damage on the multichannel pumping module and pull down and supplement the replacement chip, reach the purpose of restoreing multichannel pumping module. Therefore, the damaged chip can be effectively and accurately replaced in the installation process, the cost product rate of products is improved, and the waste of materials is effectively reduced.
Drawings
The utility model discloses there is following figure:
FIG. 1 is a schematic view of the present invention;
fig. 2 is a front view of fig. 1.
Detailed Description
As shown in the figure, this kind of a device for loading and unloading multichannel pumping module's chip of this embodiment, including frame 1, be equipped with mobilizable work platform 2 in frame 1, work platform 2 is used for placing the pumping module of treating the repair, is equipped with mobilizable laser galvanometer 3, clamping jaw 41 and tin extraction device 5 respectively above work platform 2, and wherein, laser galvanometer 3 is used for carrying out local heating to the chip that damages, and the principle is as follows: the reflecting angle of a reflecting mirror in the galvanometer component is controlled by a programmable controller to scan focused light spots, and the focused light spots are equivalent to laser beams with specific shapes, namely annular shapes with the size of a chip, due to the high-speed scanning motion of the galvanometer, so that the purpose of locally heating the damaged chip is achieved, and a tube core and gold wires in the middle of the chip cannot be damaged by laser due to the specific properties of the annular laser beams. The clamping jaw 41 is used for clamping damaged chips after the soldering tin is melted, and the tin extracting device 5 is used for sucking residual soldering tin. Still be equipped with the camera 6 of aiming at work platform 2 on the frame 1, camera 6 is used for monitoring whether the heating degree of appointed chip reaches the requirement, and is concrete, sees the melting degree of chip bottom soldering tin, in case up to standard, then closes laser galvanometer 3, stops the heating to the chip.
In this embodiment, a horizontally movable working platform 2 is arranged on the machine frame 1, and a laser galvanometer 3, a clamping jaw cylinder 4 and a tin pumping device 5 which are respectively vertically movable are arranged above the working platform 2.
In this embodiment, the connection mode of the working platform 2 is as follows: the machine frame 1 is provided with a first motor 7, the first motor 7 is in transmission connection with a first screw rod 8, the first screw rod 8 is in transmission connection with a longitudinal mounting seat 9 to move transversely, the longitudinal mounting seat 9 is connected with a second motor 10, the second motor 10 is in transmission connection with a second screw rod 11, and the second screw rod 11 is in transmission connection with the working platform 2 to move longitudinally.
In this embodiment, the laser galvanometer 3, the camera 6, the clamping jaw 41 and the tin extracting device 5 are connected as follows: the camera 6 is installed on the laser galvanometer 3, the laser galvanometer 3 and the tin extracting device 5 are installed on a transverse installation seat 12, the transverse installation seat 12 is installed on the machine frame 1 in a vertically movable mode, and the clamping jaw 41 is installed on the transverse installation seat 12 in a movable mode. Specifically, be equipped with third motor 13 on the frame 1, third motor 13 transmission is connected third lead screw 14, and the horizontal mount pad 12 of third lead screw 14 transmission reciprocates, and clamping jaw 41 is established on the clamping jaw cylinder 4 of horizontal setting, and clamping jaw cylinder 4 can be installed on horizontal mount pad 12 with reciprocating, and clamping jaw cylinder 4 realizes reciprocating through following mode: the transverse mounting base 12 is provided with a fourth motor 15, the fourth motor 15 is in transmission connection with a fourth screw rod 16, and the fourth screw rod 16 is used for driving the clamping jaw cylinder 4 to move up and down.
In the present embodiment, the tin extracting device 5 has a suction nozzle 51, and the suction nozzle 51 is aligned with the work platform 2.
In this embodiment, the first, second, third and fourth motors 15 are all servo motors. The transmission of the longitudinal mounting seat 9, the transverse mounting seat 12, the working platform 2 and the clamping jaw air cylinder 4 can adopt a transmission mode of matching a motor and a screw rod, and can also adopt a transmission mode of matching a chain, a chain wheel and a motor or replacing an air cylinder and the like.
The working principle of the embodiment is as follows:
the pump module which is a defective product is placed on the working platform 2, then the laser galvanometer 3 is moved to the position above a damaged chip of the pump module, the camera 6 moves synchronously with the laser galvanometer 3, then the laser galvanometer 3 is started to locally heat the chip, and the laser galvanometer 3 is closed when soldering tin at the bottom of the chip is melted in place. Then the clamping jaw 41 is moved to the chip position and the chip is taken away, and in the process, the transverse mounting base 12 can be driven by the first motor 7 to move so that the chip is moved to the clamping jaw 41; then the laser galvanometer 3 is opened again, the soldering tin is continuously heated to prevent the soldering tin from solidifying, and in the process, the tin extracting device 5 is moved to enable the suction nozzle 51 to move to the residual soldering tin position after the chip is taken away, and the step of sucking the residual soldering tin is completed.
After damaged chip and remaining soldering tin are cleared up completely, take out the chip of replacement to adopt the unanimous paster technology with this chip subsides in the position of waiting to mend of pumping module, in this process, the melting point of the solder piece of paying attention to the selection will be less than the melting point of the solder piece of damaging the chip before, and set up corresponding reflow soldering temperature curve, carry out secondary welding, so just so can realize the technological effect that the decurrent solder piece of chip of mending is fully even melting, can guarantee other way chip striae simultaneously and remain motionless.
The utility model overcomes in the past in case the chip damage of the same kind of multichannel pumping module leads to the condemned technical problem of whole product promptly, can carry out pertinence to the chip of damage on the multichannel pumping module and pull down and supplement the replacement chip, reach the purpose of restoreing multichannel pumping module. Therefore, the damaged chip can be effectively and accurately replaced in the installation process, the cost product rate of products is improved, and the waste of materials is effectively reduced.
Claims (7)
1. The device for loading and unloading the chips of the multi-path pumping modules comprises a rack and is characterized in that a movable working platform is arranged on the rack, a laser galvanometer, a clamping jaw and a tin pumping device which are respectively movable are arranged above the working platform, and a camera aligned with the working platform is further arranged on the rack.
2. The apparatus according to claim 1, wherein the frame is provided with a horizontally movable working platform, and the laser galvanometer, the clamping jaw cylinder and the tin extracting device are vertically movable above the working platform.
3. The apparatus according to claim 1, wherein the frame is provided with a first motor, the first motor is in transmission connection with a first lead screw, the first lead screw drives the longitudinal mounting base to move laterally, the longitudinal mounting base is connected with a second motor, the second motor is in transmission connection with a second lead screw, and the second lead screw drives the working platform to move longitudinally.
4. The apparatus of claim 1, wherein said camera is mounted on said laser galvanometer, said laser galvanometer and said tin extracting means are mounted on a transverse mounting block, said transverse mounting block is vertically movably mounted on said frame, and said clamping jaws are movably mounted on said transverse mounting block.
5. The apparatus according to claim 4, wherein a third motor is disposed on the frame, the third motor is connected to a third screw rod, the third screw rod drives the horizontal mounting base to move up and down, the clamping jaws are disposed on a clamping jaw cylinder disposed horizontally, and the clamping jaw cylinder is mounted on the horizontal mounting base to move up and down.
6. The device for loading and unloading the chips of the multi-channel pumping modules as recited in claim 5, wherein a fourth motor is disposed on the lateral mounting base, the fourth motor is connected to a fourth lead screw in a transmission manner, and the fourth lead screw drives the clamping jaw cylinder to move up and down.
7. Device for handling chips of multi-way pumping modules according to any of claims 1 to 6, characterized in that the tin extraction device has a suction nozzle, which is aligned with the work platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920744352.6U CN210060038U (en) | 2019-05-22 | 2019-05-22 | Device for loading and unloading chips of multi-path pumping module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920744352.6U CN210060038U (en) | 2019-05-22 | 2019-05-22 | Device for loading and unloading chips of multi-path pumping module |
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| Publication Number | Publication Date |
|---|---|
| CN210060038U true CN210060038U (en) | 2020-02-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920744352.6U Active CN210060038U (en) | 2019-05-22 | 2019-05-22 | Device for loading and unloading chips of multi-path pumping module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110039143A (en) * | 2019-05-22 | 2019-07-23 | 无锡源清瑞光激光科技有限公司 | For loading and unloading the device of the chip of multichannel pump module |
-
2019
- 2019-05-22 CN CN201920744352.6U patent/CN210060038U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110039143A (en) * | 2019-05-22 | 2019-07-23 | 无锡源清瑞光激光科技有限公司 | For loading and unloading the device of the chip of multichannel pump module |
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