CN114975761B - Automatic welding method of thermoelectric semiconductor device - Google Patents
Automatic welding method of thermoelectric semiconductor device Download PDFInfo
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- CN114975761B CN114975761B CN202210589309.3A CN202210589309A CN114975761B CN 114975761 B CN114975761 B CN 114975761B CN 202210589309 A CN202210589309 A CN 202210589309A CN 114975761 B CN114975761 B CN 114975761B
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- 238000003466 welding Methods 0.000 title claims abstract description 23
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 63
- 230000007246 mechanism Effects 0.000 claims abstract description 51
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 22
- 230000003287 optical effect Effects 0.000 claims abstract description 21
- 238000007599 discharging Methods 0.000 claims abstract description 17
- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims description 19
- 239000002994 raw material Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000009987 spinning Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 5
- 238000010792 warming Methods 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 238000012634 optical imaging Methods 0.000 claims description 3
- 230000007306 turnover Effects 0.000 claims description 3
- 230000006872 improvement Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000005679 Peltier effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses an automatic welding method of a thermoelectric semiconductor device, which comprises the following steps: the hot plate feeding and discharging mechanism is used for grabbing a jig with a hot plate to be welded from the hot plate material box and placing the jig on the hot plate alignment mechanism; the hot plate alignment optical assembly photographs and aligns the hot plate to be welded and the upper ceramic plate adsorbed on the hot plate pressurizing assembly; the hot plate pressurizing assembly presses the upper porcelain plate to be welded, and the hot plate heating assembly heats, welds and cools the hot plate to be welded; turning over by a hot sheet turning-over mechanism, and then conveying and adsorbing on a cold sheet pressurizing assembly; the cold sheet feeding and discharging mechanism is used for grabbing a jig with cold sheets to be welded from the cold sheet material box and placing the jig on the cold sheet alignment mechanism; the cold sheet alignment optical assembly photographs and aligns the cold sheet to be welded and the hot sheet adsorbed on the cold sheet pressurizing assembly; the cold sheet pressurizing assembly presses down the hot sheet to pressurize the cold sheet to be welded, and carries out heating welding and cooling treatment through the cold sheet temperature increasing and reducing assembly, and blanking.
Description
Technical Field
The invention relates to the technical field of welding of semiconductor devices, in particular to an automatic welding method of a thermoelectric semiconductor device.
Background
Thermoelectric materials are a class of materials that can directly convert thermal energy into electrical energy, and by the Peltier effect of thermoelectric materials, the potential difference across the material can be converted into a temperature difference. At present, a thermoelectric temperature control material based on the Peltier effect has become an important application and is widely applied to the fields of microelectronics, aerospace and the like.
The thermoelectric semiconductor device is a basic unit of a thermoelectric temperature control device and consists of a cold plate, a hot plate and elements welded on the cold plate and the hot plate; the current market demands for such devices are becoming more sophisticated, smaller and less costly.
The existing production equipment of the thermoelectric semiconductor device has the defects of relatively rough design, low automation degree, large product size and low product size precision; the produced device is not beneficial to application in narrow space and precise structure, and the finished product is high and the yield is low.
Disclosure of Invention
In view of the foregoing problems in the prior art, the present invention provides an automated soldering method for a thermoelectric semiconductor device.
The invention discloses an automatic welding method of a thermoelectric semiconductor device, which comprises the following steps:
the hot plate feeding and discharging mechanism is used for grabbing a jig with a hot plate to be welded from the hot plate material box and placing the jig on the hot plate alignment mechanism;
the hot plate alignment optical assembly photographs and aligns the hot plate to be welded and the upper ceramic plate adsorbed on the hot plate pressurizing assembly;
after the alignment is completed, the hot plate pressurizing assembly presses the upper porcelain plate to be welded, and the hot plate heating and cooling assembly is used for heating, welding and cooling;
after the hot plate is welded, the hot plate is turned over by a hot plate turning mechanism and then conveyed and adsorbed on a cold plate pressurizing assembly;
the cold sheet feeding and discharging mechanism is used for grabbing a jig with cold sheets to be welded from the cold sheet material box and placing the jig on the cold sheet alignment mechanism;
the cold sheet alignment optical assembly photographs and aligns the cold sheet to be welded and the hot sheet adsorbed on the cold sheet pressurizing assembly;
after the alignment is completed, the cold sheet pressurizing assembly presses down the hot sheet to pressurize the cold sheet to be welded, and the cold sheet heating and cooling assembly is used for heating, welding and cooling;
and the cold sheet feeding and discharging mechanism is used for feeding the welded cold and hot sheets.
As a further improvement of the invention, the hot piece feeding and discharging mechanism or the cold piece feeding and discharging mechanism comprises a ground rail, a manipulator and an air cylinder;
the hot sheet or cold sheet raw material is placed in a hot sheet material box or a cold sheet material box, a raw material jig is clamped by an air cylinder when the hot sheet or cold sheet material box is arranged on the hot sheet or cold sheet material box, and the hot sheet or cold sheet raw material is transported to a hot sheet alignment mechanism or a cold sheet alignment mechanism through a ground rail and a manipulator.
As a further improvement of the invention, the hot plate alignment mechanism or the cold plate alignment mechanism comprises a motion module, a lower ceramic plate, an alignment optical assembly and an upper ceramic plate;
the lower ceramic chip is arranged on the motion module, and the upper ceramic chip is arranged above the lower ceramic chip and is adsorbed on the hot chip pressurizing assembly; the hot plate or cold plate alignment optical component is arranged between the upper ceramic plate and the lower ceramic plate;
wherein,
on the hot plate station, the upper ceramic plate is fixedly adsorbed on a hot plate pressurizing assembly, and the lower ceramic plate is a hot plate to be welded;
and on the cold sheet station, the upper ceramic sheet is a welded hot sheet, and the lower ceramic sheet is a cold sheet to be welded.
As a further improvement of the present invention, the alignment optical assembly includes: the CCD, the lens and the up-down rotating mirror are respectively provided with an annular light source at the upper side and the lower side of the up-down rotating mirror;
when the porcelain piece positioning device works, the upper and lower annular light sources are turned on successively, the upper porcelain piece and the lower porcelain piece are photographed and positioned respectively, then the position of the upper porcelain piece is taken as a reference, and the lower porcelain piece is moved to a designated position through the displacement of the motion module, so that the upper and lower alignment is completed.
As a further improvement of the present invention, the hot sheet pressing assembly or the cold sheet pressing assembly includes: the vacuum suction head is used for adsorbing the porcelain piece or the welded heat piece;
the upper ceramic chip or the welded thermal chip is adsorbed on the vacuum suction head, the downward pressing movement module moves downwards to enable the upper ceramic chip to be attached to the lower ceramic chip, the spring pressing mechanism comprises a dynamometer, and when the dynamometer reaches a specified pressure value, the downward pressing movement module stops and keeps the position.
As a further improvement of the present invention, the hot plate warming assembly or the cold plate warming assembly includes: the device comprises a water cooling block pushed by a cylinder, a heating head pushed by the cylinder and a spinning cylinder;
after the jig with the lower ceramic chip is placed at the station, the spinning cylinder descends to press the lower ceramic chip; after the pressurizing assembly pressurizes, the cylinder pushes the heating head to the bottom of the jig, high-frequency heating is carried out, and the heating head is withdrawn after the specified temperature is reached; the cylinder promotes the water cooling piece and goes upward, pastes the tool bottom to its cooling is carried out to the mode of heat conduction.
As a further improvement of the present invention, the hot plate turning mechanism includes: the station transportation linear module, the rotary cylinder, the linear micro-motion cylinder and the finger cylinder;
when the hot plate is welded, the station transportation linear module moves to the station side of the hot plate, the rotary cylinder drives the finger cylinder to rotate, and the linear micro-motion cylinder descends to enable the clamping jaw to reach the position of the hot ceramic plate, and the hot plate is grabbed; and then the rotary cylinder rotates 180 degrees clockwise to finish the turning action, the station transportation linear module moves to the cold sheet station side, and the linear micro-motion cylinder moves upwards to deliver the cold sheet to the vacuum suction head of the cold sheet pressurizing assembly above.
Compared with the prior art, the invention has the beneficial effects that:
the invention realizes the flow line production of the thermoelectric semiconductor device, and has high production efficiency;
the machine vision identification alignment of the upper and lower ceramic chips is carried out at the same station, so that the alignment precision is high;
the invention shortens the welding step time through the high-efficiency temperature-raising and lowering assembly.
Drawings
FIG. 1 is a flow chart of an automated soldering method of a thermoelectric semiconductor device according to one embodiment of the present invention;
FIG. 2 is a schematic diagram of an automated bonding system for thermoelectric semiconductor devices according to one embodiment of the present invention;
FIG. 3 is a schematic view of a portion of the structure of FIG. 2;
fig. 4 is a schematic structural view of the hot plate turnover mechanism in fig. 2.
In the figure:
1. a hot plate feeding and discharging mechanism; 2. a hot plate magazine; 3. a hot plate pressurizing assembly; 4. a thermal sheet alignment optical assembly; 5. a hot plate temperature raising and lowering component; 6. a cold plate pressurizing assembly; 7. a cold piece temperature raising and reducing component; 8. a cold plate alignment optical component; 9. a cold sheet feeding and discharging mechanism; 10. a cold sheet magazine; 11. a hot plate turnover mechanism; 12. a motion module; 13. spinning a cylinder; 14. a water cooling block; 15. a lower ceramic tile; 16. a heating head; 17. a vertically rotating mirror; 18. a lens; 19. a CCD; 20. an annular light source; 21. the porcelain piece is arranged; 22. a vacuum suction head; 23. a spring pressurizing mechanism; 24. pressing down the motion module; 25. a linear micro-motion cylinder; 26. a rotary cylinder; 27. a finger cylinder; 28. and (5) station transportation linear modules.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention is described in further detail below with reference to the attached drawing figures:
as shown in fig. 1, the present invention provides an automated soldering method of a thermoelectric semiconductor device, which is implemented based on an automated soldering system as shown in fig. 2 to 4, comprising:
step 1, a hot plate feeding and discharging mechanism 1 grabs a jig with a hot plate to be welded (comprising a hot plate and a component to be welded on the hot plate) from a hot plate material box 2, and places the jig on a hot plate alignment mechanism;
specific:
the hot plate feeding and discharging mechanism 1 comprises a ground rail, a manipulator and an air cylinder; the hot sheet raw material is placed in a hot sheet material box 2, a raw material jig is clamped by an air cylinder when a hot sheet is arranged, and the hot sheet raw material is transported to a moving module 12 of a hot sheet alignment mechanism through a ground rail and a manipulator;
the hot plate counterpoint mechanism includes: a moving module 12, a lower tile (a thermal tile to be welded) 15, a thermal tile alignment optical assembly 4 and an upper tile (a fixed tile adsorbed on the thermal tile pressurizing assembly 3) 21; the lower ceramic tile 15 is arranged on the movement module 12, the upper ceramic tile 21 is arranged right above the lower ceramic tile 15 and is adsorbed on the hot tile pressurizing assembly 3, and the hot tile alignment optical assembly 4 is arranged between the upper ceramic tile 15 and the lower ceramic tile 21.
Step 2, the hot plate alignment optical assembly 4 photographs and aligns the hot plate to be welded and the upper ceramic plate adsorbed on the hot plate pressurizing assembly 3;
specific:
the hot plate counterpoint optical component includes: the CCD 19, the lens 18 and the up-down turning mirror 17, and an annular light source 20 is respectively arranged on the upper side and the lower side of the up-down turning mirror 17; when in operation, the upper and lower annular light sources 20 are sequentially lightened, and an optical imaging system formed by the CCD 19, the lens 18 and the upper and lower rotating mirrors 17 respectively photographs and positions an upper ceramic chip (a fixed ceramic chip adsorbed on the hot chip pressurizing assembly 3) 21 and a lower ceramic chip (a hot chip to be welded) 15; then, based on the recognition result, the movement module 12 is controlled to move the lower tile 15 to the designated position based on the position of the upper tile 21, and the up-down alignment of the upper tile and the lower tile is completed.
Step 3, after the alignment of the hot plates is completed, pressing the ceramic plates to be welded by the hot plate pressing assembly, and performing heating welding and cooling treatment by the hot plate heating and cooling assembly;
specific:
the hot plate pressing assembly 3 includes: a pressing down movement module 24, a spring pressing mechanism 23 and a vacuum suction head 22; the upper tile 21 is attached to a vacuum cleaner head 22; after the upper and lower ceramic tiles are aligned up and down, the thermal tile alignment optical assembly 4 is moved out, the pressing movement module 24 moves downwards to enable the upper ceramic tile 21 to be attached to the lower ceramic tile 15, the spring pressing mechanism 13 comprises a dynamometer, and when the dynamometer reaches a specified pressure value, the pressing movement module 24 stops and keeps the position.
The hot plate temperature-raising and lowering assembly includes: a water cooling block 14 pushed by a cylinder, a heating head 16 pushed by the cylinder and a spinning cylinder 13; after the jig of the lower ceramic chip 15 is placed at the corresponding station, the spinning cylinder 13 descends to press the lower ceramic chip; after the hot plate pressurizing assembly 3 moves to the upper ceramic plate 21 to be attached to the lower ceramic plate 15, the cylinder pushes the heating head 16 to reach the bottom of the jig, high-frequency heating is carried out, and after the specified temperature is reached, the heating head 16 is withdrawn; the cylinder pushes the water cooling block 14 to move upwards, clings to the bottom of the jig and cools the water cooling block in a heat conduction mode, so that the welding and cooling of the elements on the hot plate are completed.
Step 4, after welding of the hot plate, turning over the hot plate by a hot plate turning-over mechanism 11, and then conveying and adsorbing the hot plate on a cold plate pressurizing assembly 6;
specific:
the hot plate turning mechanism 11 includes: station transportation linear module 28, rotary cylinder 26, linear micro-motion cylinder 25 and finger cylinder 27; when the welding of the hot plate is completed, the mover of the station transportation linear module 28 moves to the station side of the hot plate, the rotary cylinder 26 drives the finger cylinder 27 to rotate, and the linear micro-motion cylinder 25 descends to enable the clamping jaw to reach the position of the hot plate, so that the welded hot plate is grabbed; the rotary cylinder 26 rotates 180 degrees clockwise to finish the turning action, the mover of the station transport linear module 28 moves to the cold sheet station side, and the linear micro-motion cylinder 25 moves upwards to deliver to the vacuum suction head 22 of the cold sheet pressurizing assembly 6 above.
Step 5, a cold sheet feeding and discharging mechanism 9 grabs a jig with a cold sheet to be welded from a cold sheet material box 10 and places the jig on a cold sheet alignment mechanism;
specific:
the structure and the working principle of the cold sheet feeding and discharging mechanism 9 are consistent with those of the hot sheet feeding and discharging mechanism 1.
Step 6, the cold piece alignment optical assembly 8 photographs and aligns the cold piece to be welded and the hot piece adsorbed on the cold piece pressurizing assembly 6;
specific:
the structure and the working principle of the cold sheet alignment optical component 8 are consistent with those of the hot sheet alignment optical component 4;
on the cold sheet station, the upper ceramic sheet 15 is a welded hot sheet, and the lower ceramic sheet 21 is a cold sheet to be welded.
Step 7, after the cold and hot sheet alignment is completed, the cold sheet pressurizing assembly 6 presses down the hot sheet to pressurize the cold sheet to be welded, and the cold sheet heating and cooling assembly is used for heating, welding and cooling;
specific:
the structure and the working principle of the cold sheet pressurizing assembly 6 are consistent with those of the hot sheet pressurizing assembly 3;
the structure and the working principle of the cold plate temperature raising and lowering assembly 7 are consistent with those of the hot plate temperature raising and lowering assembly 5.
And 8, blanking the welded cold and hot sheets by a cold sheet feeding and blanking mechanism 9.
The invention has the advantages that:
the invention realizes the flow line production of the thermoelectric semiconductor device, and has high production efficiency;
the machine vision identification alignment of the upper and lower ceramic chips is carried out at the same station, so that the alignment precision is high;
the invention shortens the welding step time through the high-efficiency temperature-raising and lowering assembly.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. An automated soldering method of a thermoelectric semiconductor device, comprising:
the hot plate feeding and discharging mechanism is used for grabbing a jig with a hot plate to be welded from the hot plate material box and placing the jig on the hot plate alignment mechanism;
the hot plate alignment optical assembly photographs and aligns the hot plate to be welded and the upper ceramic plate adsorbed on the hot plate pressurizing assembly;
after the alignment is completed, the hot plate pressurizing assembly presses the upper porcelain plate to be welded, and the hot plate heating and cooling assembly is used for heating, welding and cooling;
after the hot plate is welded, the hot plate is turned over by a hot plate turning mechanism and then conveyed and adsorbed on a cold plate pressurizing assembly;
the cold sheet feeding and discharging mechanism is used for grabbing a jig with cold sheets to be welded from the cold sheet material box and placing the jig on the cold sheet alignment mechanism;
the cold sheet alignment optical assembly photographs and aligns the cold sheet to be welded and the hot sheet adsorbed on the cold sheet pressurizing assembly; wherein, hot piece counterpoint optical component includes: the CCD, the lens and the up-down rotating mirror are respectively provided with an annular light source at the upper side and the lower side of the up-down rotating mirror; when in operation, the upper and lower annular light sources are lightened successively, namely: firstly, an upper annular light source is turned on, and an optical imaging system consisting of a CCD, a lens and an up-down rotating mirror is used for photographing and aligning an upper ceramic chip; then, a lower annular light source is turned on, and the lower ceramic chip is photographed and aligned through an optical imaging system consisting of a CCD, a lens and an up-down rotating mirror; the position of the upper ceramic chip is taken as a reference, the movement module is controlled to move the lower ceramic chip to a designated position, and the up-down alignment of the upper ceramic chip and the lower ceramic chip is completed;
after the alignment is completed, the cold sheet pressurizing assembly presses down the hot sheet to pressurize the cold sheet to be welded, and the cold sheet heating and cooling assembly is used for heating, welding and cooling;
and the cold sheet feeding and discharging mechanism is used for feeding the welded cold and hot sheets.
2. The automated welding method of claim 1, wherein the hot plate loading and unloading mechanism or the cold plate loading and unloading mechanism comprises a ground rail, a manipulator and a cylinder;
the hot sheet or cold sheet raw material is placed in a hot sheet material box or a cold sheet material box, a raw material jig is clamped by an air cylinder when the hot sheet or cold sheet material box is arranged on the hot sheet or cold sheet material box, and the hot sheet or cold sheet raw material is transported to a hot sheet alignment mechanism or a cold sheet alignment mechanism through a ground rail and a manipulator.
3. The automated welding method of claim 1, wherein the hot or cold plate alignment mechanism comprises a motion module, a lower tile, an alignment optics assembly, and an upper tile;
the lower ceramic chip is arranged on the motion module, and the upper ceramic chip is arranged above the lower ceramic chip and is adsorbed on the hot chip pressurizing assembly; the hot plate or cold plate alignment optical component is arranged between the upper ceramic plate and the lower ceramic plate;
wherein,
on the hot plate station, the upper ceramic plate is fixedly adsorbed on a hot plate pressurizing assembly, and the lower ceramic plate is a hot plate to be welded;
and on the cold sheet station, the upper ceramic sheet is a welded hot sheet, and the lower ceramic sheet is a cold sheet to be welded.
4. The automated welding method of claim 1, wherein the hot plate pressing assembly or cold plate pressing assembly comprises: the vacuum suction head is used for adsorbing the porcelain piece or the welded heat piece;
the upper ceramic chip or the welded thermal chip is adsorbed on the vacuum suction head, the downward pressing movement module moves downwards to enable the upper ceramic chip to be attached to the lower ceramic chip, the spring pressing mechanism comprises a dynamometer, and when the dynamometer reaches a specified pressure value, the downward pressing movement module stops and keeps the position.
5. The automated welding method of claim 1, wherein the hot plate warming assembly or cold plate warming assembly comprises: the device comprises a water cooling block pushed by a cylinder, a heating head pushed by the cylinder and a spinning cylinder;
after the jig with the lower ceramic chip is placed at the station, the spinning cylinder descends to press the lower ceramic chip; after the pressurizing assembly pressurizes, the cylinder pushes the heating head to the bottom of the jig, high-frequency heating is carried out, and the heating head is withdrawn after the specified temperature is reached; the cylinder promotes the water cooling piece and goes upward, pastes the tool bottom to its cooling is carried out to the mode of heat conduction.
6. The automated welding method of claim 1, wherein the hot plate turnover mechanism comprises: the station transportation linear module, the rotary cylinder, the linear micro-motion cylinder and the finger cylinder;
when the hot plate is welded, the station transportation linear module moves to the station side of the hot plate, the rotary cylinder drives the finger cylinder to rotate, and the linear micro-motion cylinder descends to enable the clamping jaw to reach the position of the hot ceramic plate, and the hot plate is grabbed; and then the rotary cylinder rotates 180 degrees clockwise to finish the turning action, the station transportation linear module moves to the cold sheet station side, and the linear micro-motion cylinder moves upwards to deliver the cold sheet to the vacuum suction head of the cold sheet pressurizing assembly above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210589309.3A CN114975761B (en) | 2022-05-26 | 2022-05-26 | Automatic welding method of thermoelectric semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210589309.3A CN114975761B (en) | 2022-05-26 | 2022-05-26 | Automatic welding method of thermoelectric semiconductor device |
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| Publication Number | Publication Date |
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| CN114975761A CN114975761A (en) | 2022-08-30 |
| CN114975761B true CN114975761B (en) | 2024-02-02 |
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| JP2004104041A (en) * | 2002-09-13 | 2004-04-02 | Sony Corp | Thermoelectric converting device and method for manufacturing the same |
| JP2009004520A (en) * | 2007-06-20 | 2009-01-08 | Netsusan Heat Kk | Method for manufacturing thin film type thermo-couple, thin film type thermo-couple manufacturing apparatus used therefor, thin film type thermo-couple manufactured by use thereof |
| JP2011100901A (en) * | 2009-11-06 | 2011-05-19 | Nikon Corp | Method of manufacturing semiconductor device, and transport device |
| CN109483001A (en) * | 2018-12-28 | 2019-03-19 | 湖北赛格瑞新能源科技有限公司 | A kind of welding equipment and welding method for micro thermoelectric device |
| CN208853887U (en) * | 2018-08-14 | 2019-05-14 | 苏州库瑞奇自动化有限公司 | A kind of automatic welding machine with double thermocompression bonding hair styles welding mould group |
| CN213782040U (en) * | 2020-11-26 | 2021-07-23 | 中国科学院金属研究所 | Device for integrating miniature thermoelectric transducer |
-
2022
- 2022-05-26 CN CN202210589309.3A patent/CN114975761B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004104041A (en) * | 2002-09-13 | 2004-04-02 | Sony Corp | Thermoelectric converting device and method for manufacturing the same |
| JP2009004520A (en) * | 2007-06-20 | 2009-01-08 | Netsusan Heat Kk | Method for manufacturing thin film type thermo-couple, thin film type thermo-couple manufacturing apparatus used therefor, thin film type thermo-couple manufactured by use thereof |
| JP2011100901A (en) * | 2009-11-06 | 2011-05-19 | Nikon Corp | Method of manufacturing semiconductor device, and transport device |
| CN208853887U (en) * | 2018-08-14 | 2019-05-14 | 苏州库瑞奇自动化有限公司 | A kind of automatic welding machine with double thermocompression bonding hair styles welding mould group |
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| CN213782040U (en) * | 2020-11-26 | 2021-07-23 | 中国科学院金属研究所 | Device for integrating miniature thermoelectric transducer |
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| CN114975761A (en) | 2022-08-30 |
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