CN213782040U - Device for integrating miniature thermoelectric transducer - Google Patents
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- CN213782040U CN213782040U CN202022778353.8U CN202022778353U CN213782040U CN 213782040 U CN213782040 U CN 213782040U CN 202022778353 U CN202022778353 U CN 202022778353U CN 213782040 U CN213782040 U CN 213782040U
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Abstract
The invention relates to the field of semiconductor devices, in particular to a device for integrating a micro thermoelectric transducer. The shock absorption support base of the device is provided with a marble bracket and a shock absorption platform, and the marble bracket is placed on the shock absorption platform; the micro-recognition positioning system is fixed on the marble bracket and the damping platform, the transfer adsorption system is fixed on the marble bracket, the feeder, the substrate sample stage and the controller are fixed on the damping base, the thermoelectric particles and the upper electrode substrate are placed on the feeder, and the lower electrode substrate is fixed on the substrate sample stage; the controller is connected with the microscopic identification and positioning system, the transfer adsorption system and the substrate sample stage through data lines, and the centralized control and linkage process of each part is realized. The invention can successfully transfer small-sized thermoelectric particles to the lower electrode substrate with higher positioning accuracy, realize the graphical arrangement of P-type and N-type thermoelectric particles and further realize the electrical series connection and thermal parallel connection of thermoelectric devices.
Description
Technical Field
The invention relates to the field of semiconductor devices, in particular to a device for integrating a micro thermoelectric transducer.
Background
Among the new energy technologies, the thermoelectric conversion technology has attracted much attention because it can generate electricity by using various waste heat in life production. Meanwhile, a new-generation intelligent flexible micro-nano electronic system represented by wearable and implantable types urgently needs to develop a micro-watt-milliwatt self-powered technology, and the micro-watt-milliwatt self-powered technology is combined with a primary battery technology and a secondary battery technology, so that the running stability of a device is improved, and the service life of the device is prolonged. The thermoelectric material device can generate power by utilizing the temperature difference between the body temperature and the surrounding environment, and becomes an effective solution of the self-powered technology of the portable intelligent flexible electronic device. However, since distributed heat sources such as human body surfaces, electronic components, and chips are low in quality and small in usable size, new demands for miniaturization and high integration are being made for applications of thermoelectric technology.
On the other hand, with the rapid development of application markets such as big data, cloud computing, 5 th generation mobile communication, internet of things, artificial intelligence and the like, the demands of vertical industries such as automobiles, energy sources, communication and the like on optoelectronic products and services must be further expanded, and the optical communication laser is used as a main component of the optical fiber transmission module, and the power consumption and the heating power of the optical communication laser are continuously improved along with the increase of the transmission rate. Because the laser wavelength emitted by the laser chip and the working temperature form a certain linear relation, in order to ensure the stability and the high efficiency of data communication, the laser wavelength needs to be ensured to work within the range of +/-3.5 nm of the central wavelength, so that the working temperature needs to be accurately controlled, and the current thermoelectric device is the only one temperature control module which can meet the requirements and can be industrialized in a large scale. In addition, the current optical communication module has high integration density and small volume, so that the thermoelectric temperature control device is required to have the characteristics of miniaturization and high efficiency.
At present, the industrial production technology of micro thermoelectric devices is mainly focused on several companies such as the united states, japan, and russia, and the raw material production technology, the cutting technology, the integrated transfer technology, and the soldering technology are mainly required for fabricating thermoelectric micro devices. At present, only the cutting technology can meet the manufacturing requirement in China, but no good solution is available for future thermoelectric devices with smaller sizes, and the raw material production technology, the integrated transfer technology and the welding technology are mainly mastered in the countries of the United states, Russia, Japan, Ukrainian and the like. The major domestic markets are also occupied by Ferrotec and KELK Ltd. in Japan, II-VI MARLOW, Phononic and TE technologies, Inc., in the United states, RMT in Russia, and others. The domestic micro thermoelectric device industrialized production technology is in the starting stage, large-scale mass production is not realized, the production automation degree is low, and the stability and the refrigeration performance are still to be greatly improved.
Disclosure of Invention
The invention aims to provide a device for integrating a micro thermoelectric transducer, which can realize a micro thermoelectric device with the device size of less than 10mm multiplied by 5mm, and particularly for a super micro thermoelectric device with the thermoelectric particle in-plane size of less than 0.05mm multiplied by 0.05mm and high integration density, the transfer device is beneficial to the integral transfer of a sample and can realize automatic and rapid integration.
In order to achieve the purpose, the technical scheme of the invention is as follows:
an apparatus for integrating a micro thermoelectric transducer device, the apparatus comprising: shock attenuation support base, micro-discernment positioning system, feeder, transfer adsorption system, base plate sample platform, controller, concrete structure is as follows:
the shock absorption support base is provided with a marble bracket and a shock absorption platform, and the marble bracket is placed on the shock absorption platform; the micro-recognition positioning system is fixed on the marble bracket and the damping platform, the transfer adsorption system is fixed on the marble bracket, the feeder, the substrate sample stage and the controller are fixed on the damping base, the thermoelectric particles and the upper electrode substrate are placed on the feeder, and the lower electrode substrate is fixed on the substrate sample stage; the controller is connected with the microscopic identification and positioning system, the transfer adsorption system and the substrate sample stage through data lines, and the centralized control and linkage process of each part is realized.
The device for integrating the miniature thermoelectric transducer is characterized in that a microscopic identification and positioning system is provided with a set of vertically downward substrate positioning microscope group, a set of vertically upward CCD camera and two sets of horizontal microscope groups, wherein: the base plate positioning microscope group is vertically arranged on a marble bracket horizontal beam above the base plate sample table, and the base plates with different sizes are positioned through manual zooming; the CCD camera is arranged between the feeder on the damping platform and the substrate sample stage and is used for assisting in adjusting the orientation of the thermoelectric particles; the two sets of horizontal microscopes are arranged on the side surface of the base plate sample table, correspond to the upper part of the base plate sample table respectively, and are used for detecting the Z-axis directions of the thermoelectric particles and the lower electrode base plate from two directions.
In the device for integrating the miniature thermoelectric transducer, the substrate positioning microscope group is a variable multiple combined lens, the highest resolution reaches 1 mu m, and the maximum field of view is 20mm in diameter; the CCD camera and the horizontal microscope group are fixed-multiple combined lenses, the resolution is 1 mu m, and the diameter of a view field is 2 mm.
The device for integrating the miniature thermoelectric transducer is characterized in that the feeder is positioned beside the CCD camera and provides a feeding mode of linear arrangement or square array arrangement of braids.
The device for integrating the miniature thermoelectric transducer is characterized in that a transfer adsorption system is provided with an X-Y-Z electric control displacement platform, an inclined rotating platform, an electronic inclinometer, an adsorption mechanical arm, an air pump and a negative pressure pump, wherein: the X-Y-Z electric control displacement platform is installed at the bottom of a horizontal beam of the marble portal frame, the bottom of the X-Y-Z electric control displacement platform is provided with an inclined rotating table, the bottom of the inclined rotating table is provided with an electronic inclinometer and an adsorption mechanical arm, the horizontal part of the adsorption mechanical arm is a hollow 360-degree electric control rotating table, the bottom of the front end of the 360-degree electric control rotating table is provided with a vacuum suction nozzle, the 360-degree electric control rotating table is used for in-plane rotation of the vacuum suction nozzle, the air pump and the negative pressure pump are respectively communicated with the 360-degree electric control rotating table through pipelines, and the vacuum suction nozzle is provided with adsorption array holes to realize negative pressure absorption and positive pressure release.
The device for integrating the miniature thermoelectric transducer is characterized in that the pressure of the vacuum suction nozzle is continuously adjustable within-200 kPa-100 kPa, the diameter of the inner diameter of the vacuum suction nozzle is selectable from 0.02mm to 2mm, and the resolution of the electronic inclinometer is 0.001 degree; the vacuum suction nozzle is made of quartz glass, single crystal alumina, monocrystalline silicon, stainless steel or rubber, wherein: the quartz glass and the single crystal alumina are transparent materials, in-situ monitoring assembly is realized, and the single crystal silicon adopts an MEMS manufacturing process to realize an adsorption array hole with the minimum diameter of 5 mu m.
The device for integrating the miniature thermoelectric transducer comprises a substrate sample table, wherein the substrate sample table is provided with a heating adsorption platform, a pressure sensor, an electronic inclinometer, an inclined rotating table and an X-Y-Z electric control displacement platform, and the heating adsorption platform, the pressure sensor, the electronic inclinometer, the inclined rotating table and the X-Y-Z electric control displacement platform are sequentially arranged from top to bottom.
The design idea of the invention is as follows:
firstly, because the micro thermoelectric device has the characteristics of high integration density of thermoelectric particles, positioning accuracy within 20 mu m and smaller element units, particularly a typical sandwich structure from bottom to top, the micro vacuum suction nozzle can be matched with a precise displacement platform to realize the transfer and the sequential assembly of elements; secondly, the raw materials to be assembled are small in size and disordered in distribution, and a pattern recognition technology is required to be added for position correction.
Based on the above two main design guiding ideas, the invention designs and constructs a whole set of integrated equipment, and has two transfer methods of distributed transfer and integral transfer, thereby obtaining a method for manufacturing micro and ultra-micro thermoelectric devices, and successfully realizing the manufacturing of the thermoelectric devices with the minimum size of 0.5mm multiplied by 0.2 mm.
The invention has the following advantages and beneficial effects:
1. the invention mainly aims at the manufacturing of the micro thermoelectric device, fully considers the characteristic of high requirement on the dimensional precision, uses the high-precision dip angle table and the dip angle instrument to be matched, and dynamically adjusts the parallelism of the material and the substrate, which is particularly important for the micro thermoelectric particles with thin thickness and crisp texture.
2. The invention utilizes the high-precision displacement platform to cooperate with the pressure-adjustable vacuum suction nozzle to transfer and assemble materials, and particularly designs the array vacuum suction head for manufacturing high-integration-density micro devices. The problem of integration failure caused by repeated transfer and accumulated repeated positioning errors of equipment can be solved.
3. The invention discloses a double microscopic CCD identification and positioning system provided with a material and a substrate. The vacuum suction nozzle can be made of transparent materials such as quartz glass, and in-situ recognition alignment assembly is adopted, so that the deviation caused by non-in-situ assembly and error between the vacuum suction nozzle and a camera can be avoided, and the precision and the success rate of manufacturing the ultra-miniature device can be improved. In addition, the in-situ assembly can also record the states of the particles and the substrate during assembly, so that the reason can be conveniently analyzed when errors occur.
4. The invention is provided with two sets of horizontal cameras for calibrating the height difference during integration and improving the success rate of welding devices.
5. All the accessories of the invention are connected with a computer, can be used for image recognition and adjustment, has higher automation degree, and can realize the functions of real-time centering, horizontal adjustment and the like.
6. The integral displacement platform system is arranged on the marble bracket and the air floatation damping platform, and can reduce the influence of the environment and the vibration of the machine during operation on the integration precision.
7. In the mounting process, the mounting height is detected through the bidirectional horizontal microscope group, so that the position is finely corrected. The negative pressure pump and the air pump in the transfer adsorption system can provide negative pressure absorption and positive pressure release for adsorption transfer.
In a word, the invention can successfully transfer small-sized thermoelectric particles to the lower electrode substrate with higher positioning accuracy, realize the graphical arrangement of the P-type thermoelectric particles and the N-type thermoelectric particles, and further realize the electrical series connection and the thermal parallel connection of thermoelectric devices. The experimental device and the operation method combine automation and manual operation, can realize high-efficiency and rapid integration of the micro thermoelectric device, and can be used for industrial production.
Drawings
FIG. 1 is a schematic diagram of an experimental apparatus according to the present invention.
Fig. 2 is a flow chart of a method of integrating a thermoelectric device of the present invention.
FIG. 3 is a schematic view of a 1mm by 2mm micro thermoelectric device.
FIG. 4 is a schematic view of a lower electrode substrate of a 1mm × 2mm micro thermoelectric device.
Description of the drawings: 1-a shock-absorbing support base; 2-microscopic identification positioning system; 3-a feeder; 4-transfer adsorption system; 5-substrate sample stage; 6-micro thermoelectric device; 7-a controller; 11-marble bracket; 12-a shock absorbing platform; 21-substrate positioning microscope set; 22-CCD camera; 23-horizontal microscope set; 41-X-Y-Z electric control displacement platform; 42-inclined rotating table; 43-electronic inclinometer; 44-adsorption robot arm; 45-air pump; 46-negative pressure pump; 47-360 degree electric control rotating platform; 48-vacuum nozzle; 49-adsorption array well; 51-heating adsorption platform; 52-pressure sensor; 53-electronic inclinometer; 54-inclined rotating table; 55-X-Y-Z electric control displacement platform; 61-lower electrode substrate; 62-upper electrode substrate; 63-welding layer; 64-thermoelectric particles.
Detailed Description
In the concrete implementation process, the core of the invention is to provide a device and a method for integrating a micro thermoelectric transducer, the device can be used for realizing the micro thermoelectric device with the device size of less than 10mm multiplied by 5mm, and particularly for the ultra-micro thermoelectric device with the thermoelectric particle in-plane size of within 0.05mm multiplied by 0.05mm and extremely high integration density, the method is beneficial to the integral transfer of a sample and can realize automatic and rapid integration.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1, fig. 1 shows an embodiment of the present invention, and an apparatus for integrating a transfer thermoelectric device mainly includes the following systems: shock attenuation supporting pedestal 1, micro-discernment positioning system 2, feeder 3, transfer adsorption system 4, base plate sample platform 5, controller 7, the concrete structure is as follows:
the shock absorption support base 1 provides a stable working environment for the integral transfer platform, the shock absorption support base 1 is provided with a marble bracket 11 and a shock absorption platform 12, and the marble bracket 11 is placed on the shock absorption platform 12; the microscopic identification positioning system 2 is fixed on the marble support 11 and the damping platform 12, the transfer adsorption system 4 is fixed on the marble support 11, and the feeder 3, the substrate sample stage 5 and the controller 7 are fixed on the damping base 12, so that the relative position precision of the whole system can be guaranteed. The raw material of thermoelectric particles and the upper electrode substrate are placed on feeder 3, and the lower electrode substrate is fixed on substrate sample stage 5.
The microscopic identification positioning system 2 is provided with a set of vertically downward substrate positioning microscope group 21, a set of vertically upward CCD camera 22 and two sets of horizontal microscope groups 23, wherein: the base plate positioning microscope group 21 is vertically arranged on a horizontal beam of the marble bracket 11 above the base plate sample table 5, and can realize the positioning of base plates with different sizes by manual zooming; the CCD camera 22 is arranged between the feeder 3 and the substrate sample stage 5 on the damping platform 12 and is used for assisting in adjusting the orientation of the thermoelectric particles; the two sets of horizontal microscopes are arranged on the side surface of the base plate sample table 5, correspond to the upper part of the base plate sample table 5 respectively, and are used for detecting the Z-axis directions of the thermoelectric particles and the lower electrode base plate from two directions. The substrate positioning microscope group 21 is a variable multiple combined lens, the highest resolution can reach 1 mu m, and the maximum view field has a diameter of 20 mm; the CCD camera 22 and the horizontal microscope group 23 are fixed-multiple combined lenses, the resolution is 1 mu m, and the diameter of a view field is 2 mm.
The feeder 3 is located beside the CCD camera 22 and can provide two feeding modes of a braid linear arrangement or a square array arrangement.
The transfer adsorption system 4 is provided with an X-Y-Z electric control displacement platform 41, an inclined rotating platform 42, an electronic inclinometer 43, an adsorption mechanical arm 44, an air pump 45 and a negative pressure pump 46, wherein: an X-Y-Z electric control displacement platform 41 is arranged at the bottom of a horizontal beam of a marble portal frame 11, an inclined rotating platform 42 is arranged at the bottom of the X-Y-Z electric control displacement platform 41, an electronic inclinometer 43 and an adsorption mechanical arm 44 are arranged at the bottom of the inclined rotating platform 42, the horizontal part of the adsorption mechanical arm 44 is a hollow 360-degree electric control rotating platform 47, a vacuum suction nozzle 48 is arranged at the bottom of the front end of the 360-degree electric control rotating platform 47, the 360-degree electric control rotating platform 47 is used for in-plane rotation of the vacuum suction nozzle 48, an air pump 45 and a negative pressure pump 46 are respectively communicated with the 360-degree electric control rotating platform 47 through pipelines, and adsorption array holes 49 are formed in the vacuum suction nozzle 48 to realize negative pressure suction and positive pressure release; the pressure of the vacuum suction nozzle is continuously adjustable between-200 kPa and 100kPa, the diameter of the inner diameter of the vacuum suction nozzle is selectable between 0.02mm and 2mm, and the resolution of the electronic inclinometer is 0.001 degree. The vacuum suction nozzle can be made of quartz glass, single crystal alumina, monocrystalline silicon, stainless steel or rubber, wherein: the quartz glass and the single crystal alumina are transparent materials, in-situ monitoring assembly can be realized, and the single crystal silicon can adopt an MEMS (micro electro mechanical System) manufacturing Process to realize an adsorption array hole with the minimum diameter of 5 mu m.
The substrate sample stage 5 is provided with a heating adsorption platform 51, a pressure sensor 52, an electronic inclinometer 53, an inclined rotating platform 54 and an X-Y-Z electronic control displacement platform 55, wherein the heating adsorption platform 51, the pressure sensor 52, the electronic inclinometer 53, the inclined rotating platform 54 and the X-Y-Z electronic control displacement platform 55 are arranged from top to bottom in sequence. The heating adsorption platform 51 adopts a PID temperature control mode, and the maximum heating temperature is 400 ℃. The monitoring range of the pressure sensor 52 is 0-100N, the monitoring resolution is 0.05N, and the resolution of the electronic inclinometer is 0.001 degrees.
The controller 7 is connected with the microscopic identification and positioning system 2, the transfer adsorption system 4 and the substrate sample stage 5 through data lines, and realizes the centralized control and linkage process of each part. The transfer adsorption system 4 absorbs and transfers the thermoelectric particles on the feeder 3 to the lower electrode substrate fixed on the substrate sample stage 5, and the process needs to be realized by matching with the pattern recognition and positioning of the microscopic recognition and positioning system 2 and the accurate displacement control of the substrate sample stage 5. The controller 7 can perform image recognition on the image acquired by the microscopic recognition positioning system 2, output the image to the transfer adsorption system 4 and the substrate sample table 5 for automatic position adjustment, regulate and control the pressure of the vacuum suction nozzle 48, realize program-controlled transfer of thermoelectric particles, and input a coordinate file to realize automatic surface mounting of the thermoelectric particles.
In the invention, the technical parameters of the X-Y-Z electric control displacement platforms 41 and 55 are as follows: the travel of the X-Y axis translation table is more than or equal to 30cm, and the repeated positioning precision is less than or equal to 5 mu m; the travel of the Z-axis translation table is more than or equal to 10cm, and the repeated positioning precision is less than or equal to 1 mu m.
As shown in fig. 1-2, the method for integrating micro thermoelectric transducer devices of the present invention mainly comprises the steps of installing a thermoelectric particle raw material tray, installing a lower electrode substrate, calibrating the state of the device, inputting assembly coordinates, assembling thermoelectric particles and an upper electrode substrate, pressurizing by a mechanical arm, heating and welding by a heating table, and testing the electrical performance of the devices, wherein the specific process comprises the following steps:
the transfer and adsorption system 4 provides negative pressure to the adsorption robot 44 through the negative pressure pump 46, and can transfer the thermoelectric particles from the feeder 3 to the lower electrode substrate on the heating and adsorption platform 51 on the top of the substrate sample stage 5. The substrate positioning microscope group 21 is responsible for monitoring and correcting the relative position of the thermoelectric particles and the lower electrode substrate in real time, and assembly precision is guaranteed. The CCD camera 22 is responsible for recognizing the spatial state of the particles, ensuring that no deflection or breakage occurs during assembly. The lateral horizontal microscope group 23 is responsible for monitoring the height deviation of the thermoelectric particles and the lower electrode substrate in real time during the assembly process, and can be used for real-time observation of pressure welding. The two groups of X-Y-Z electric control displacement platforms 41 and 55 are used for aligning the relative positions of the thermoelectric particles and the lower electrode substrate, and the X-Y-Z electric control displacement platform is a three-axis platform formed by combining an X-axis platform, a Y-axis platform and a Z-axis platform. The two groups of inclined rotating tables 42 and 54 calibrate the horizontal state of the adsorption mechanical arm 44 and the heating adsorption platform 51 in real time through angle data fed back by the two electronic inclinometers 43 and 53, ensure the integration precision of micro devices and avoid position dislocation caused by non-parallel of particles and substrates during pressurization. The heating and adsorbing platform 51 is used for adsorbing the lower electrode substrate and heating the lower electrode substrate to realize the welding with the thermoelectric particles. The turntable 52 is used to adjust the angular deviation between the thermoelectric particles and the lower electrode substrate. The controller 7 identifies the images acquired by the microscopic identification and positioning system 2, automatically judges the position deviation between the thermoelectric particles and the corresponding lower electrode substrate, and further controls the transfer adsorption system 4 and the substrate sample stage 5 to carry out position calibration.
When welding, a certain pressure is required to be applied to a welding element, the adsorption mechanical arm moves downwards to extrude thermoelectric particles and a lower electrode substrate, the pressure change of the pressure sensor is read, and meanwhile, the temperature of the adsorption heating table is set to be 10-50 ℃ higher than the melting point of a used welding layer. And judging by a pressure sensor and a side microscope, and quickly closing heating and quickly cooling after melting. The welding process is completed.
The present invention will be further explained or illustrated by examples.
Example 1
As shown in FIG. 1, the apparatus for integrating 1X 2mm micro thermoelectric devices is as described above.
As shown in fig. 3 to 4, in the present embodiment, the 1mm × 2mm micro thermoelectric device 6 mainly includes: the thermoelectric module comprises a lower electrode substrate 61, an upper electrode substrate 62, a welding layer 63 and thermoelectric particles 64, wherein the upper electrode substrate 62 is oppositely arranged above the lower electrode substrate 61, the arrayed welding layer 63 is arranged on the top of the lower electrode substrate 61, the arrayed welding layer 63 is arranged on the bottom of the upper electrode substrate 62, the thermoelectric particles 64 are positioned between the lower electrode substrate 61 and the upper electrode substrate 62, the lower electrode substrate 61 is connected with the bottoms of the thermoelectric particles 64 through the welding layer 63 thereon, and the upper electrode substrate 62 is connected with the tops of the thermoelectric particles 64 through the welding layer 63 thereon.
The integration method comprises the following steps: referring to fig. 2, first, thermoelectric particles 64 (P-type thermoelectric particles, N-type thermoelectric particles) of 0.2mm × 0.2mm × 0.5mm arrayed and upper electrode substrate 62 are placed at the corresponding positions of feeder 3, lower electrode substrate 61 as shown in fig. 4 is mounted on heating adsorption stage 51, and vacuum adsorption is started to fix lower electrode substrate 61. The parallelism of the suction robot arm 44 is calibrated by the electronic inclinometer 43 and the tilt rotary table 42, the parallelism of the heating suction table 51 is calibrated by the electronic inclinometer 53 and the tilt rotary table 54, and the pressure sensor 52 data is cleared.
The positional coordinate information of the two kinds of thermoelectric particles 64 and the positional coordinate information of the lower electrode substrate 61 are input to the controller 7, and the thermoelectric particles 64 and the upper electrode substrate 62 are automatically mounted on the lower electrode substrate 61. After the upper electrode substrate 62 is transferred, the adsorption robot arm 44 maintains the pressing pressure, and when the pressure measured by the precision pressure sensor 52 reaches 0.2N, the temperature of the heating adsorption platform 51 is raised to 230 ℃ for welding. After the pressure is reduced, the temperature is rapidly reduced to complete welding. And finally, testing the electrical performance of the device and inspecting the yield of the product.
The embodiment result shows that the device provided by the invention can accurately measure the in-plane thermal conductivity of some thin-film materials, and particularly can accurately and quickly obtain the thermal conductivity of the thin-film materials for the reason that other commercial test instruments cannot be used for testing the thermal conductivity because the sample size is too small or the light transmittance is high. The method has great promotion effect on the research of material researchers on the thermal property of the film material, and has the application prospect of rapid industrialization.
The present invention provides an apparatus and method for integrating micro thermoelectric transducer devices. The principles and embodiments of the present invention are described herein using specific examples, which are presented only to assist in understanding the method and core concepts of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (6)
1. An apparatus for integrating a micro thermoelectric transducer device, the apparatus comprising: shock attenuation support base, micro-discernment positioning system, feeder, transfer adsorption system, base plate sample platform, controller, concrete structure is as follows:
the shock absorption support base is provided with a marble bracket and a shock absorption platform, and the marble bracket is placed on the shock absorption platform; the micro-recognition positioning system is fixed on the marble bracket and the damping platform, the transfer adsorption system is fixed on the marble bracket, the feeder, the substrate sample stage and the controller are fixed on the damping base, the thermoelectric particles and the upper electrode substrate are placed on the feeder, and the lower electrode substrate is fixed on the substrate sample stage; the controller is connected with the microscopic identification and positioning system, the transfer adsorption system and the substrate sample stage through data lines, and the centralized control and linkage process of each part is realized.
2. The apparatus of claim 1, wherein the microscopic identification positioning system comprises a set of vertically downward substrate positioning microscope, a set of vertically upward CCD camera, and two sets of horizontal microscope, wherein: the base plate positioning microscope group is vertically arranged on a marble bracket horizontal beam above the base plate sample table, and the base plates with different sizes are positioned through manual zooming; the CCD camera is arranged between the feeder on the damping platform and the substrate sample stage and is used for assisting in adjusting the orientation of the thermoelectric particles; the two sets of horizontal microscopes are arranged on the side surface of the base plate sample table, correspond to the upper part of the base plate sample table respectively, and are used for detecting the Z-axis directions of the thermoelectric particles and the lower electrode base plate from two directions.
3. The apparatus of claim 2, wherein the substrate positioning microscope set is a variable power lens assembly, and the CCD camera and the horizontal microscope set are fixed power lens assemblies.
4. The apparatus of claim 1, wherein the feeder is located near the CCD camera to provide feeding of the braid in a linear or square array.
5. The apparatus for integrating micro thermoelectric transducer devices as claimed in claim 1, wherein the transfer-adsorption system is provided with an X-Y-Z electrically controlled displacement platform, an inclined rotary table, an electronic inclinometer, an adsorption mechanical arm, an air pump, a negative pressure pump, wherein: the X-Y-Z electric control displacement platform is installed at the bottom of a horizontal beam of the marble portal frame, the bottom of the X-Y-Z electric control displacement platform is provided with an inclined rotating table, the bottom of the inclined rotating table is provided with an electronic inclinometer and an adsorption mechanical arm, the horizontal part of the adsorption mechanical arm is a hollow 360-degree electric control rotating table, the bottom of the front end of the 360-degree electric control rotating table is provided with a vacuum suction nozzle, the 360-degree electric control rotating table is used for in-plane rotation of the vacuum suction nozzle, the air pump and the negative pressure pump are respectively communicated with the 360-degree electric control rotating table through pipelines, and the vacuum suction nozzle is provided with adsorption array holes to realize negative pressure absorption and positive pressure release.
6. The apparatus of claim 1, wherein the substrate sample stage is provided with a heating adsorption stage, a pressure sensor, an electronic inclinometer, an inclined rotary stage, and an X-Y-Z electrically controlled displacement stage, and the heating adsorption stage, the pressure sensor, the electronic inclinometer, the inclined rotary stage, and the X-Y-Z electrically controlled displacement stage are sequentially arranged from top to bottom.
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| CN202022778353.8U CN213782040U (en) | 2020-11-26 | 2020-11-26 | Device for integrating miniature thermoelectric transducer |
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| CN202022778353.8U CN213782040U (en) | 2020-11-26 | 2020-11-26 | Device for integrating miniature thermoelectric transducer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114975761A (en) * | 2022-05-26 | 2022-08-30 | 北京国木武科电子有限公司 | Automatic welding method for thermoelectric semiconductor device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114975761A (en) * | 2022-05-26 | 2022-08-30 | 北京国木武科电子有限公司 | Automatic welding method for thermoelectric semiconductor device |
| CN114975761B (en) * | 2022-05-26 | 2024-02-02 | 北京国木武科电子有限公司 | Automatic welding method of thermoelectric semiconductor device |
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