CN219917079U - Automatic eutectic equipment of integral type - Google Patents
Automatic eutectic equipment of integral type Download PDFInfo
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- CN219917079U CN219917079U CN202321045793.XU CN202321045793U CN219917079U CN 219917079 U CN219917079 U CN 219917079U CN 202321045793 U CN202321045793 U CN 202321045793U CN 219917079 U CN219917079 U CN 219917079U
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- 230000005496 eutectics Effects 0.000 title claims abstract description 73
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000002994 raw material Substances 0.000 claims abstract description 15
- 230000006698 induction Effects 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 6
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011027 product recovery Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Abstract
The utility model discloses integrated automatic eutectic equipment, which comprises a working platform, a complete machine control system, a chip wafer platform, a heat sink wafer platform, a eutectic platform, a thimble assembly and a conveying mechanism, wherein the eutectic platform comprises a material receiving manipulator and a eutectic tube seat, the eutectic platform is arranged in the middle of the working platform, and the chip wafer platform and the heat sink wafer platform are respectively arranged at two sides of the eutectic platform; a calibration table is arranged between the chip wafer table and the eutectic table; the conveying mechanism comprises a main shaft, a linear precise motion assembly and a direct-drive motor; the automatic feeding mechanism comprises a frame, raw material bins and finished product bins are respectively arranged on two sides of the frame, a tube seat material taking position and a carrying manipulator are arranged in the middle of the frame, and a conveying tube seat carrier plate conveying line is arranged between the raw material bins and the finished product bins in the frame. The whole eutectic flow is automatically operated integrally, so that the production efficiency is improved, the process precision and automation are improved, the operation time without human intervention is prolonged, and the product yield is high.
Description
Technical Field
The utility model relates to the field of eutectic, in particular to integrated automatic eutectic equipment.
Background
At present, full-automatic eutectic chip mounting equipment of TO (transistor outline) laser devices in the field of photoelectric communication is low in production efficiency, low in automation degree and low in product yield. Particularly, the eutectic crystal of the tube seat has large deviation of the positions of the chips, insufficient melting of heat sinks, complicated eutectic operation, large amount of manual labor force, low production efficiency and incapability of rapid mass production.
The Chinese patent application number 201810287802.3 discloses a eutectic machine, which comprises a machine table and a complete machine control system, wherein the machine table is provided with a loading and unloading system, a eutectic table, a double-wafer table, a chip pickup control system and a chip calibration system, and the loading and unloading system comprises a tube seat tray, a suction nozzle, an air cylinder, a sliding rail, a linear precise XY sliding table and a motor for controlling the linear precise XY sliding table; the double-crystal table comprises a heat sink tray fixing ring, a chip tray fixing ring, a thimble system component and a linear precise XY module, wherein the thimble system component comprises a thimble, a thimble cap and a thimble adjusting system; the chip pickup control system comprises a heat sink suction nozzle, a chip suction nozzle, a motion assembly and a camera. The utility model has the advantages of high automation degree, high product yield and quick mass production capacity by matching with technologies such as multi-axis motion control, visual positioning and the like. However, the whole machine is not provided with a tube seat feeding and discharging system, so that the manual intervention is more, and the operation efficiency is lower. The heat sink suction nozzle and the chip suction nozzle on the main shaft are arranged together, and the chip pick-up and the heat sink pick-up are arranged on the same side by adopting the double-wafer table, so that the chip suction nozzle and the heat sink suction nozzle need to be operated once and again, the middle interval time is waiting, and the total time is too long.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides the integrated automatic eutectic device, which has the advantages of improving the production efficiency, improving the process precision, improving the automation rate, improving the operation time without human intervention and having high product yield.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the integrated automatic eutectic device comprises a working platform, a complete machine control system, a chip wafer platform, a heat sink wafer platform, a eutectic platform, a thimble assembly and a conveying mechanism, wherein the eutectic platform comprises a material receiving manipulator and a eutectic tube seat, the eutectic platform is arranged in the middle of the working platform, and the chip wafer platform and the heat sink wafer platform are respectively arranged at two sides of the eutectic platform; a calibration table is arranged between the chip wafer table and the eutectic table; the conveying mechanism comprises a main shaft, a linear precise motion assembly and a direct-drive motor; an automatic feeding mechanism is arranged on the front side of the working platform and comprises a frame, a raw material bin and a finished product bin are respectively arranged on two sides of the frame, a tube seat material taking position and a carrying manipulator are arranged in the middle of the frame, and a conveying line for conveying tube seat carrier plates is arranged between the raw material bin and the finished product bin on the frame; the material bin is provided with a material carrying plate lifting module, and the finished product bin is provided with a finished product carrying plate lifting cylinder.
As a further improvement, the main shaft is provided with a heat sink positioning camera, a eutectic platform monitoring camera, a chip calibration camera, a chip positioning camera, a heat sink bonding head, a chip bonding head and a chip calibration bonding head, and the heat sink positioning camera, the eutectic platform monitoring camera, the chip calibration camera and the chip positioning camera are respectively and correspondingly arranged above the heat sink wafer platform, the eutectic platform, the chip wafer platform and the calibration platform.
As one preferable mode, the heat sink bonding head, the chip bonding head and the chip calibration bonding head all comprise a Y-axis movement module, a Z-axis movement module and a suction nozzle rotation module; the heat sink bonding head is connected with the heat sink suction nozzle, and the chip bonding head and the chip calibration bonding head are connected with the chip suction nozzle.
Preferably, the Y-axis motion module comprises a Y-axis motor, a Y-axis sensing piece, a Y-axis photoelectric sensor, a Y-axis screw rod and a Y-axis sliding block; the Z-axis motion module comprises a Z-axis motor, a Z-axis sensing piece, a Z-axis photoelectric sensor, a Z-axis screw rod and a Z-axis sliding block.
As a further improvement, the heat sink suction nozzle rotating module at the heat sink joint comprises a synchronous belt, a motor, a photoelectric switch and an induction piece.
As a further improvement, the chip wafer table and the heat sink wafer table both comprise a linear X-axis movement module and a linear Y-axis movement module, a chip disc fixing ring is arranged on the chip wafer table, and the heat sink wafer table is provided with a heat sink disc fixing ring.
Preferably, the calibration table comprises a B-axis exchange table, an X-axis cylinder module and a Y-axis slider module.
As a further improvement, the bottom of the tube seat material taking position is provided with a lifting module, and the side surface of the tube seat material taking position is provided with a blocking cylinder.
As a further improvement, the carrying manipulator comprises an X-axis movement module I, a Y-axis movement module I, a Z-axis movement module I and a tube seat suction nozzle.
The utility model has the beneficial effects that: the whole eutectic flow is automatically operated in an integrated mode, so that the production efficiency is improved, the process precision is improved, the automation rate is improved, the operation time without human intervention is prolonged, the yield of products is high, and the cost is reduced.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a spindle structure according to an embodiment of the present utility model;
FIG. 3 is a schematic view of an automatic feed mechanism according to an embodiment of the present utility model;
FIG. 4 is a schematic diagram of a chip bonding head according to an embodiment of the present utility model;
FIG. 5 is a schematic diagram of a heat sink bonding head according to an embodiment of the present utility model;
FIG. 6 is a schematic diagram of a wafer stage according to an embodiment of the present utility model;
FIG. 7 is a schematic diagram of a calibration stand according to an embodiment of the present utility model;
FIG. 8 is a schematic diagram of a handling robot according to an embodiment of the present utility model;
in the figure: 1. a working platform; 2. a main shaft; 3. a chip wafer stage; 4. a heat sink wafer table; 5. a eutectic station; 6. a thimble assembly; 7. a carrying manipulator; 8. an automatic feeding mechanism; 9. a calibration stand; 10. a heat sink positioning camera; 11. a eutectic stage surveillance camera; 12. the chip calibrates the camera; 13. a chip positioning camera; 14. heat sink bonding head; 15. a chip bonding head; 16. calibrating the bonding head by the chip; 17. a direct drive motor; 18. a raw material bin; 19. a finished product bin; 20. tube seat material taking level; 21. a tube seat carrying disc; 22. a conveying line; 23. a finished product carrying disc lifting cylinder; 24. a chip suction nozzle; 25. a Y-axis motor; 26. a Y-axis induction piece; 27. a Y-axis photoelectric sensor; 28. a Y-axis screw rod; 29. a Y-axis slider; 30. a Z-axis motor; 31. a Z-axis induction piece; 32. a Z-axis photoelectric sensor; 33. a Z-axis slider; 34. a stepping motor; 35. a heat sink suction nozzle; 36. a synchronous belt; 37. a motor; 38. an optoelectronic switch; 39. an induction piece; 40. an X-axis movement module; 41. a linear Y-axis motion module; 42. a chip tray fixing ring; 43. a B-axis exchange table; 44. an X-axis cylinder module; 45. a Y-axis slider module; 46. a tube seat suction nozzle; 47. an X-axis movement module I; 48. a Y-axis movement module I; 49. z-axis motion module I.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 and 2, an integrated automatic eutectic device comprises a working platform 1, a complete machine control system, a chip wafer platform 3, a heat sink wafer platform 4, a eutectic platform 5, a thimble assembly 6 and a conveying mechanism, wherein the eutectic platform 5 comprises a material receiving manipulator and a eutectic tube seat, the eutectic platform 5 is arranged in the middle of the working platform 1, and the chip wafer platform 3 and the heat sink wafer platform 4 are respectively arranged at two sides of the eutectic platform 5; a calibration table 9 is arranged between the chip wafer table 3 and the eutectic table 5; the conveying mechanism comprises a main shaft 2, a linear precise motion assembly and a direct-drive motor 17; the main shaft 2 is provided with a heat sink positioning camera 10, a eutectic table monitoring camera 11, a chip calibration camera 12, a chip positioning camera 13, a heat sink bonding head 14, a chip bonding head 15 and a chip calibration bonding head 16, and the heat sink positioning camera 10, the eutectic table monitoring camera 11, the chip calibration camera 12 and the chip positioning camera 13 are respectively and correspondingly arranged above the heat sink wafer table 4, the eutectic table 5, the chip wafer table 3 and the calibration table 9.
As shown in fig. 2, 4 and 5, the heat sink bonding head 14, the chip bonding head 15 and the chip calibration bonding head 16 all comprise a Y-axis movement module, a Z-axis movement module and a suction nozzle rotation module; the heat sink bonding head 14 is connected with a heat sink suction nozzle 35, the chip bonding head 15 and the chip calibration bonding head 16 are connected with a chip suction nozzle 24, and the chip suction nozzle 24 is controlled by a stepping motor 34. The Y-axis motion module comprises a Y-axis motor 25, a Y-axis sensing piece 26, a Y-axis photoelectric sensor 27, a Y-axis screw rod 28 and a Y-axis sliding block 29; the Z-axis movement module comprises a Z-axis motor 30, a Z-axis sensing piece 31, a Z-axis photoelectric sensor 32, a Z-axis screw rod and a Z-axis sliding block 33. The heat sink suction nozzle rotating module at the heat sink bonding head 14 comprises a synchronous belt 36, a motor 37, a photoelectric switch 38 and an induction piece 39.
As shown in fig. 6, the chip wafer table 3 and the heat sink wafer table 4 both include a linear X-axis motion module 40 and a linear Y-axis motion module 41, a chip tray fixing ring 42 is disposed on the chip wafer table 3, and the heat sink wafer table 4 is provided with a heat sink tray fixing ring. The die wafer stage 3 is substantially identical to the heat sink wafer stage 4.
As shown in fig. 7, the calibration stage 9 includes a B-axis exchanging stage 43, an X-axis cylinder module 44, and a Y-axis slider module 45. The B-axis exchanging table 43 can be adjusted in vertical position.
In the utility model, the main shaft 2 is responsible for picking up heat sinks and chips, so that the heat sinks and the chips are respectively picked up from the heat sink wafer table 4 and the chip wafer table 3 and are placed on the eutectic tube seat of the eutectic table 5. The wafer table is a system for providing heat sink or chip, and comprises a chip wafer table 3, a heat sink wafer table 4, a thimble assembly 6 and a linear precise XY module. The XY direction position of slip table is adjusted to initial stage adjusting screw manual respectively for thimble assembly 6 is in suitable position. The complete machine control system controls the linear precise XY module to move, and precisely identifies and positions the heat sink or the chip through the image identification and positioning system. When the heat sink or the chip is identified and positioned, the air cylinder pushes the guide table to move along the direction of the sliding rail, the pulley moves upwards along the slope of the guide table, the thimble cap is pushed to move upwards to be close to the heat sink chip, the servo motor rotates to drive the connecting rod, the thimble is pushed to move upwards to jack up the heat sink and the chip, and the heat sink suction nozzle or the chip suction nozzle sucks the heat sink or the chip. And meanwhile, the photoelectric switch turntable rotates to the closing position of the photoelectric switch, the air cylinder is retracted after receiving the signal, the guide table is retracted, and the thimble is retracted downwards.
Wherein the heat sink picks up: the motion assembly controls the heat sink bonding head 14 to move to a proper position along the X-axis (the motion direction of the rotor of the direct-drive motor is the X-axis), the heat sink bonding head 14 finely adjusts the Y-axis (the motion of the servo single-axis module sliding block is the Y-axis) according to parameters, the Z-axis (the motion direction of the stepping single-axis module sliding block is the Z-axis) drives the heat sink suction nozzle 35 downwards until the suction nozzle is just contacted with the heat sink, at the moment, the photoelectric sensing component is just disconnected with the photoelectric switch, the heat sink is sucked by vacuumizing in the suction nozzle, the Z-axis moves upwards until the photoelectric sensing component is closed with the photoelectric switch, the upward motion is stopped, the heat sink bonding head 14 moves the heat sink on the heat sink suction nozzle 15 to the position above the heat sink automatic calibration camera along the X-axis direction, the motor 37 rotates to drive the synchronous belt 36 to rotate, the rotating shaft drives the heat sink picked up by the heat sink suction nozzle 35 to slowly rotate, and meanwhile the camera collects information, and the whole machine control system performs automatic visual identification calibration. After the calibration is completed, the rotation is stopped, the photoelectric switch turntable and the photoelectric switch are closed, the heat sink on the heat sink suction nozzle 35 is moved to the position right above the eutectic table 5 along the X direction by the movement assembly, and the heat sink is attached to the tube seat of the eutectic table 5.
Chip pickup: the chip bonding head 15 moves to a proper position along the X direction, the chip bonding head 15 finely adjusts the Y axis according to parameters, the Z axis drives the suction nozzle downwards to move until the chip suction nozzle 24 is just contacted with the chip, at the moment, the photoelectric sensing part is just disconnected with the photoelectric switch, the suction nozzle is vacuumized to suck the chip, the Z axis moves upwards until the photoelectric sensing part is closed with the photoelectric switch, the upward movement is stopped, the chip bonding head 15 moves the chip on the suction nozzle to the position right above the calibration table 9 along the X direction, and as shown in fig. 7, the calibration table 9 comprises a B-axis exchange table 43, an X-axis cylinder module 44 and a Y-axis slide block module 45. The Z axis drives the chip suction nozzle 24 downwards until the chip just contacts the B axis exchanging table 43, at the moment, the suction nozzle is turned off in vacuum, and the chip is attached to the B axis exchanging table 43. After the parameters are acquired through image recognition of the chip calibration camera, the calibration table 9 completes position and angle adjustment of the chip through program control, the chip is sucked and picked up by the suction nozzle of the chip calibration bonding head 16, the chip on the suction nozzle is moved to the position right above the eutectic table 5 table along the X direction by the chip calibration bonding head 16, and the chip is attached to the tube seat of the eutectic table 5.
Eutectic station: is responsible for fixing and heating the tube seat. The tube seat is placed on a finger suction nozzle of the material receiving manipulator, and simultaneously, the tube seat is sucked by vacuumizing in the finger suction nozzle. The servo motor drives the rotating shaft to rotate, so that the finger suction nozzle is changed from a vertical state to a horizontal state. The pneumatic sliding table moves forward horizontally, the tube seat on the suction nozzle is inserted into the eutectic tube seat on the eutectic table 5, meanwhile, the clamping jaw cylinder moves inwards to drive the tube seat clamping jaw to clamp the tube seat, the compression spring compresses to play a buffering role, and the tube seat is prevented from being damaged due to overlarge clamping jaw force. The eutectic table 5 heats the pipe seat by using a heating rod, the heating temperature is 420 ℃, and the heat-sensitive sensor monitors the heating temperature in real time; the nitrogen component on the eutectic table 5 slowly blows hot nitrogen, so that the oxidation of the tube seat and the solder is reduced; the air holes are designed on the upper surface of the eutectic table 5, so that hotter air flow can be blown away, and the upper camera can be conveniently used for visual identification.
As shown in fig. 1 and 3, an automatic feeding mechanism 8 is arranged at the front side of the working platform 1, the automatic feeding mechanism 8 comprises a frame, a raw material bin 18 and a finished product bin 19 are respectively arranged at two sides of the frame, a tube seat material taking position 20 and a carrying manipulator 7 are arranged in the middle of the frame, and a conveying line 22 for conveying a tube seat carrier disc 21 is arranged between the raw material bin 18 and the finished product bin 19 on the frame; the material bin 18 department is equipped with the raw materials carrier plate lifting module, the tube socket is got the material level 20 bottom and is equipped with lifting module, and the side is equipped with and blocks the cylinder. The lifting module comprises a tray clamp, a lifting carrier, a screw rod, a sliding block, a photoelectric sensing part and a motor. The finished product bin 19 is provided with a lifting carrier and a finished product carrier plate lifting cylinder 23. Mechanical locks for limiting the movement of the tube seat carrier plate 21 are arranged at the positions of the raw material bin 18 and the finished product bin 19.
As shown in fig. 8, the handling manipulator 7 includes an X-axis movement module i 47, a Y-axis movement module i 48, a Z-axis movement module i 49, and a nozzle 46, which are a raw material delivery nozzle and a finished product recovery nozzle.
Automatic feed system: the automatic feeding pipe seat feeding and discharging device consists of a carrying manipulator 7 and an automatic feeding component and is responsible for feeding and discharging pipe seats.
Feeding a raw material pipe seat: lifting the module to the position contacting the tube seat carrier 21, locking the cylinder by the raw material bin 18, releasing the mechanical lock catch, lifting the module to the height of one tube seat carrier 21, locking the cylinder by the raw material bin 18, locking the mechanical lock catch, lifting the module to the conveying line 22, conveying the tube seat carrier 21 to the tube seat material taking position 20 by the conveying line 22, lifting the tube seat carrier 21 by the lifting module at the bottom of the material taking position, separating the tube seat carrier 21 from the conveying line 22, clamping the cylinder by the tube seat material taking position 20, and positioning the tube seat carrier 21; the linear precise XY module is controlled by the whole machine control system, the carrying manipulator 7 moves to the upper part of the tube seat carrying disc 21, after being positioned to the tube seat in the tube seat carrying disc 21, the air cylinder pushes the suction nozzle to move downwards along the sliding rail, and after contacting the tube seat, the suction nozzle is vacuumized to suck the tube seat. The cylinder reversely pushes the suction nozzle to move upwards, the photoelectric sensing component and the photoelectric switch are closed, after receiving signals, the linear precise XY sliding table is controlled to convey the tube seat to the finger suction nozzle of the eutectic table material receiving manipulator, and the material receiving manipulator places the tube seat on the tube seat of the crystal table. And the eutectic finished tube seat is put back to the original position of the raw tube seat through a suction nozzle of the conveying manipulator 7.
Discharging a finished tube seat: the clamping cylinder of the tube seat material taking position 20 is loosened, the tube seat carrying disc 21 is lowered by the lifting module at the bottom of the material taking position, the tube seat carrying disc 21 returns to the conveying line 22, the conveying line 22 conveys the tube seat carrying disc 21 to the finished product bin 19, the finished product carrying disc lifting cylinder 23 at the bottom of the finished product bin 19 jacks up the tube seat carrying disc 21, the finished product bin 19 locks the cylinder to work, the mechanical lock is locked, the finished product carrying disc lifting cylinder 23 at the bottom of the finished product bin 19 is lowered, and the finished product carrying disc is put in storage.
Claims (9)
1. The utility model provides an automatic eutectic equipment of integral type, includes work platform (1), complete machine control system, chip wafer platform (3), heat sink wafer platform (4), eutectic platform (5), thimble subassembly (6) and conveying mechanism, eutectic platform (5) are including receiving material manipulator and eutectic tube socket, its characterized in that: the eutectic table (5) is arranged in the middle of the working platform (1), and the chip wafer table (3) and the heat sink wafer table (4) are respectively arranged at two sides of the eutectic table (5); a calibration table (9) is arranged between the chip wafer table (3) and the eutectic table (5); the conveying mechanism comprises a main shaft (2), a linear precise motion assembly and a direct-drive motor (17); an automatic feeding mechanism (8) is arranged on the front side of the working platform (1), the automatic feeding mechanism (8) comprises a frame, a raw material bin (18) and a finished product bin (19) are respectively arranged on two sides of the frame, a tube seat material taking position (20) and a carrying manipulator (7) are arranged in the middle of the frame, and a conveying line (22) for conveying tube seat carrier plates (21) is arranged between the raw material bin (18) and the finished product bin (19) on the frame; the material bin (18) is provided with a material carrying disc lifting module, and the finished product bin (19) is provided with a finished product carrying disc lifting cylinder (23).
2. The integrated automated eutectic apparatus of claim 1, wherein: the novel chip alignment device is characterized in that a heat sink positioning camera (10), a eutectic table monitoring camera (11), a chip alignment camera (12), a chip alignment camera (13), a heat sink bonding head (14), a chip bonding head (15) and a chip alignment bonding head (16) are arranged on the main shaft (2), and the heat sink positioning camera (10), the eutectic table monitoring camera (11), the chip alignment camera (12) and the chip alignment camera (13) are respectively and correspondingly arranged above the heat sink wafer table (4), the eutectic table (5), the chip wafer table (3) and the alignment table (9).
3. The integrated automated eutectic apparatus of claim 2, wherein: the heat sink bonding head (14), the chip bonding head (15) and the chip calibration bonding head (16) comprise a Y-axis movement module, a Z-axis movement module and a suction nozzle rotation module; the heat sink bonding head (14) is connected with the heat sink suction nozzle (35), and the chip bonding head (15) and the chip calibration bonding head (16) are connected with the chip suction nozzle (24).
4. An integrated automated eutectic device according to claim 3, wherein: the Y-axis motion module comprises a Y-axis motor (25), a Y-axis sensing piece (26), a Y-axis photoelectric sensor (27), a Y-axis screw rod (28) and a Y-axis sliding block (29); the Z-axis movement module comprises a Z-axis motor (30), a Z-axis sensing piece (31), a Z-axis photoelectric sensor (32), a Z-axis screw rod and a Z-axis sliding block (33).
5. An integrated automated eutectic device according to claim 3, wherein: the heat sink suction nozzle rotating module at the heat sink bonding head (14) comprises a synchronous belt (36), a motor (37), a photoelectric switch (38) and an induction piece (39).
6. The integrated automated eutectic apparatus of claim 1, wherein: the chip wafer table (3) and the heat sink wafer table (4) comprise a linear X-axis movement module (40) and a linear Y-axis movement module (41), a chip disc fixing ring (42) is arranged on the chip wafer table (3), and the heat sink wafer table (4) is provided with a heat sink disc fixing ring.
7. The integrated automated eutectic apparatus of claim 1, wherein: the calibration table (9) comprises a B-axis exchange table (43), an X-axis cylinder module (44) and a Y-axis sliding block module (45).
8. The integrated automated eutectic apparatus of claim 1, wherein: the bottom of the tube seat material taking position (20) is provided with a lifting module, and the side surface of the tube seat material taking position is provided with a blocking cylinder.
9. The integrated automated eutectic apparatus of claim 1, wherein: the carrying manipulator (7) comprises an X-axis movement module I (47), a Y-axis movement module I (48), a Z-axis movement module I (49) and a tube seat suction nozzle (46).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321045793.XU CN219917079U (en) | 2023-05-05 | 2023-05-05 | Automatic eutectic equipment of integral type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321045793.XU CN219917079U (en) | 2023-05-05 | 2023-05-05 | Automatic eutectic equipment of integral type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219917079U true CN219917079U (en) | 2023-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321045793.XU Active CN219917079U (en) | 2023-05-05 | 2023-05-05 | Automatic eutectic equipment of integral type |
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| Country | Link |
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| CN (1) | CN219917079U (en) |
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2023
- 2023-05-05 CN CN202321045793.XU patent/CN219917079U/en active Active
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