JP2022040015A - Soldering apparatus - Google Patents

Abstract

To provide a soldering apparatus carrying out temperature raising and lowering with high efficiency in the process of heating and cooling a workpiece.SOLUTION: A soldering apparatus 10 lowers a workpiece 1, and joins the workpiece 1 to a spacer 3 via a solder 2. A heating head body 20 capable of vertically moving until abutting on an upper face of the workpiece 1 sucks the upper face of the workpiece 1 with air, has a contact type thermocouple 13 which can adjust temperatures of absorption pipes 25 and 27 floating the workpiece 1, and the workpiece 1, and can vertically move until abutting on the upper face of the workpiece 1. The cooling head body 30 has: second suction means 35 and 36 which can operate independently of the absorption pipes 25 and 27, sucks the upper face of the workpiece 1 with air to floating the workpiece; and a cooling apparatus 32 capable of cooling the workpiece 1, and can operate independently of the heating head body 20 and vertically move until abutting on the upper face of the workpiece 1.SELECTED DRAWING: Figure 10

Description

The present invention relates to an apparatus in which a work is heated by a head having a heating mechanism and soldered to an object to be joined.

Conventionally, there is known a device that thermocompression-bonds an electronic component to a work by heating the electronic component while pressing it against the work.

Japanese Unexamined Patent Publication No. 2001-358455

In this device, the electronic component is heated by energizing the ceramic heater to generate heat while pressing the electronic component and the substrate, and heating the electronic component via a thermocompression bonding tool. As a result, the temperature of the joint between the electronic component and the electrode of the substrate is raised according to the heating pattern, and when the joint reaches a predetermined temperature, the solder bumps are melted and solder joint is performed by thermocompression bonding. In the cooling step, air is applied to the upper surface of the ceramic heater to cool the ceramic heater.

Therefore, in the heating and cooling steps in the temperature raising step and the cooling step, there is a delay in the temperature response at the time of raising the temperature and the time of lowering the temperature.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to highly efficiently raise and lower the temperature in the steps of heating, soldering, and cooling the work when performing the soldering work. The purpose is to provide a soldering device to perform.

In the soldering apparatus of the present invention, the solder (2) is applied to the upper surface of the object to be bonded (3), the work (1) is lowered from above the solder, and the work is bonded to the object to be bonded via the solder. First suction means (25, 26, 27) that sucks the upper surface of the work with air to float the work, the first suction means, and a temperature sensor (13) capable of adjusting the temperature of the work. , 14), a heating head main body (20) that can be raised and lowered until it comes into contact with the upper surface of the work, a first driving unit (28, 29) that drives the heating head main body so that it can be raised and lowered, and the first. 1. Second suction means (35, 36) that can be operated independently of the suction means and suck the upper surface of the work with air to float the work, the second suction means, and a cooling device capable of cooling the work. The cooling head main body (30) having (32), which can be operated independently of the heating head main body and can be raised and lowered until it comes into contact with the upper surface of the work, and the cooling head main body are driven so as to be raised and lowered. A second drive unit (38, 39) and a heater (15, 16, 17, 18, 19) provided on the heating head main body to heat the heating head main body are provided.

According to this soldering apparatus, the cooling head main body performs an operation of cooling and lowering the temperature of the work independently of the operation of the heating head main body without being affected by the heat of the heating head. Therefore, the switching speed from the work heating to the work cooling can be performed in a short time. Good thermal efficiency in raising and lowering the temperature of the work.

It is a front view which shows the structure of the soldering apparatus by 1st Embodiment. It is a partially enlarged view of FIG. FIG. 3 is a view taken along the line III of FIG. It is a partially enlarged view of FIG. FIG. 3 is a sectional view taken along line VV of FIG. FIG. 2 is a sectional view taken along line VI-VI of FIG. FIG. 5 is a sectional view taken along line VII-VII of FIG. It is a VIII arrow view of FIG. It is a figure which shows the work used in 1st Embodiment, (A) is a plan view, (B) is a side view. It is a figure explaining the operation of the soldering apparatus of 1st Embodiment, (A) is the schematic sectional view which shows the 1st process, (B) is the front view which shows the state of the work of 1st process. It is a figure explaining the operation of the soldering apparatus of 1st Embodiment, (A) is the schematic sectional view which shows the 2nd process, (B) is the front view which shows the state of the work of 2nd process. It is a figure explaining operation of the soldering apparatus of 1st Embodiment, (A) is a schematic sectional view which shows 3rd process, (B) is a front view which shows the state of the work of 3rd process. It is a figure explaining operation of the soldering apparatus of 1st Embodiment, (A) is a schematic sectional view which shows 4th process, (B) is a front view which shows the state of the work of 4th process. It is a figure explaining the operation of the soldering apparatus of 1st Embodiment, (A) is a schematic sectional view which shows the 5th process, (B) is the front view which shows the state of the work of the 5th process. It is a figure explaining operation of the soldering apparatus of 1st Embodiment, (A) is a schematic sectional view which shows 6th process, (B) is a front view which shows the state of the work of 6th process. It is a characteristic diagram which shows an example of temperature control of the soldering apparatus of 2nd Embodiment. It is a perspective view which shows the structure of the lower part of the soldering apparatus according to 3rd Embodiment. It is a front view corresponding to FIG. 1 which shows the structure of the soldering apparatus according to 3rd Embodiment. It is a top view which shows the structure of the soldering apparatus according to 3rd Embodiment. 19 is a cross-sectional view taken along the line XX-XX of FIG. FIG. 19 is a cross-sectional view taken along the line XXI-XXI of FIG. It is a schematic sectional drawing explaining the operation of the soldering apparatus of 3rd Embodiment. It is a schematic sectional drawing explaining the operation of the soldering apparatus of 3rd Embodiment.

Hereinafter, the first embodiment of the soldering apparatus of the present invention will be described with reference to the drawings. Hereinafter, in a plurality of embodiments, substantially the same configurations are designated by the same reference numerals and description thereof will be omitted.
(First Embodiment)

In the soldering apparatus of the first embodiment of the present invention, an example of joining the work 1 as an emitter shown in FIG. 9 to the collector 5 side will be described. In this case, the semiconductor element 4 and the spacer 3 as the object to be joined have a layered structure on the upper surface of the collector 5, and the work 1 is solder-bonded to the spacer 3.

The work 1 in the state before joining shown in FIG. 10 (A) goes through the states shown in FIGS. 11 (A) to 12 (A), 13 (A), and 14 (A), and is shown in FIG. 15 (A). The work shifts to the state after solder joining shown in A).

The soldering apparatus will be described with reference to FIGS. 1 to 8. The soldering apparatus 10 includes a heating head 11 for heating the work 1 and a cooling head 31 for cooling the work 1. In this embodiment, the joint on the collector 5 side is placed on the upper surface of the heater 50 for heating the solder 2.

In the heating head 11, the position of the heating head main body 20 is controlled in the vertical direction and the horizontal direction by the movable device 24 including the heating side first loader 28 and the heating side second loader 29 orthogonal to the heating side first loader 28. The heating side first loader 28 and the heating side second loader 29 correspond to the first drive unit described in the claims.

The heating head 11 includes suction tubes 25, 26, 27 as a first suction means capable of sucking and detaching the work 1 by air pressure, and ceramic heaters 15, 16, 17, 18 as a heating device for heating the heating head main body 20. , 19, Sheath type thermocouples 21 and 22 as a head temperature sensor for adjusting the temperature of the heating head body 20, and contact type thermocouples 13 and 14 as a contact type temperature sensor for adjusting the temperature by contacting the work 1. is doing. The contact thermocouples 13 and 14 correspond to the first temperature sensor described in the claims.

The heating head 11 can be preheated by turning on the ceramic heaters 15, 16, 17, 18, and 19 when the work 1 is not held by turning off the suction tubes 25, 26, and 27. Further, when the work 1 is held by turning on the suction tubes 25, 26, 27, the sheath type thermocouples 21 and 22 are turned off, the contact type thermocouples 13 and 14 are turned on, and the contact type thermocouples 13 and 14 are turned on. It is possible to perform high-precision temperature control of the work 1 by bringing it into contact with 1. The sheathed thermocouples 21 and 22 correspond to the second temperature sensor described in the claims.

In the cooling head 31, the cooling head main body 30 is vertically and horizontally controlled by a movable device 34 including a cooling side first loader 38 and a cooling side second loader 39 orthogonal to the cooling side first loader 38. The cooling side first loader 38 and the cooling side second loader 39 correspond to the second drive unit described in the claims.

The cooling head 31 has a cooling device including suction pipes 35 and 36 and a cooling water pipe 32 as a second suction means capable of sucking and removing the work 1 by air pressure. The cooling head 31 performs an operation of sucking and removing the work 1 by the suction pipes 35 and 36 of the work 1 by the movable device 34 including the first loader 38 on the cooling side and the second loader 39 on the cooling side. It is performed independently of the same operation of the heating head 11.

Further, the cooling head 31 has a structure that is not affected by the heat separated from the heating head 11 for cooling the cooling head main body 30 and the work 1, and the ceramic heaters 15, 16, 17, 18, 19 and the sheath type thermoelectric. It has a structure that is not affected by the ratio of 21 and 22. The cooling head 31 performs an operation of cooling and lowering the temperature of the work 1 independently of the operation of the heating head 11 for heating and raising the temperature of the work 1. Therefore, the switching speed from the work heating to the work cooling (fastest ascending / descending temperature) can be performed in a short time. Thermal efficiency is good when raising and lowering the temperature of the work 1. Further, as shown in FIG. 9, the configuration is highly accurate because two works 1 can be soldered to the collector 5 side at the same time.

Next, the steps of the soldering operation from the soldering preparation to the completion of the soldering will be described in order based on FIGS. 10 to 15.

<First step>
As shown in FIG. 10, an example of joining the work 1 to the collector 5 side will be described. The semiconductor element 4 and the spacer 3 have a layered structure on the upper surface of the collector 5 in this order, and the work 1 is solder-bonded to the spacer 3. The work 1 is carried into the soldering device 10. The work 1 is conveyed below the work 1 above the solder 2 on the spacer 3 on the collector 5 side.

The soldering apparatus 10 includes a heating head 11 for heating the work 1 and a cooling head 31 for cooling the work 1. The heating head main body 20 is in a position lower than the cooling head main body 30. Then, below the heating head main body 20 and the cooling head main body 30, the collector 5 side as an object to be joined is placed on the heater 50.

<Second step>
When the heating head main body 20 descends with respect to the work 1 separately placed above the solder 2 shown in FIG. 10 and comes into contact with the work 1 as shown in FIG. 11, the suction pipes 25, 26, and 27 are turned on. The work 1 sucked in the direction of the arrow 7 is sucked on the lower surface of the heating head main body 20.

<Third step>
Next, as shown in FIG. 12, in a state where the heating head main body 20 has adsorbed the work 1, the work 1 is heated and lowered by heat conduction from the heating head 11 in the direction of arrow 8, and the solder 2 is melted and soldered. do.

<4th step>
Next, as shown in FIG. 13, the cooling head 31 is lowered, the lower surface of the cooling head main body 30 is brought into contact with the work 1, the suction tubes 35 and 36 are turned on, air is sucked in the direction of arrow 9, and the work 1 is brought into contact with the work 1. The suction of the heating head 11 and the suction by the cooling head 31 are switched to simultaneous suction.

<Fifth step>
Then, as shown in FIG. 14, heat is taken in the direction of arrow 41 to promote cooling and increase the solder bonding speed. The suction pipes 25, 26, and 27 of the heating head 11 are turned off, and the heating head 11 is lifted from the work 1. Then, the suction is switched to the cooling head 31, and at the same time, the cooling water pipe 32 of the cooling head 31 is turned on to promote the cooling of the work 1 and the solder 2 bonded to the work 1.

<Sixth step>
When the solder bonding is completed, as shown in FIG. 15, the suction pipes 35 and 36 of the cooling head 31 are turned off, the suction of the work 1 is stopped, the cooling head 31 is separated from the work 1, and the operation of the device is stopped. .. With the above, the solder joining is completed.

According to the present embodiment, the heating head 11 and the cooling head 31 are driven by different driving devices, and the suction and heating operations of the work 1 and the suction and cooling operations of the work 1 are performed independently, so that they can be switched. It is possible to switch between heating operation and cooling operation at high speed by controlling the operation. Therefore, the work 1 can be heated, soldered, and cooled at high speed and with high efficiency, the thermal efficiency can be improved, and the work 1 by the solder 2 and the spacer 3 as an object to be joined can be joined at high speed. Can be done.

In the above-described embodiment, the suction pipes 35 and 36 of the cooling head 31 are turned on and the work 1 is received from the heating head 11 to the cooling head 31 before the suction pipes 25, 26 and 27 of the heating head 11 are switched from on to off. Since the switching is performed, the accuracy of the soldering joint positions of the two workpieces 1 can be improved at the same time.

In the present embodiment, after the position of the work 1 is specified by the suction pipes 25, 26, 27 of the heating head 11, the suction pipes 35, 36 of the cooling head 31 simultaneously use the suction pipes 35, 36 of the cooling head 31 during continuous lifting. Since the work 1 is adsorbed, the position accuracy is improved.

According to the soldering apparatus of the present embodiment, since heating and cooling are independent of each other, the temperature changes of the heating head 11 and the cooling head 31 are small, and the cycleability is good. Further, since the work 1 is heated by directly detecting the temperature with the contact thermocouples 13 and 14, defects are less likely to occur. Since the solder 2 is rapidly cooled, voids are less likely to occur, and the solder quality is improved.

In addition, the furnace-less structure contributes to space saving, energy saving, and equipment cost saving, and the soldering equipment can be made into a small size, so that it has the advantage of good maintainability.

(Second embodiment)
The soldering apparatus of the second embodiment of the present invention uses the apparatus of the first embodiment shown in FIGS. 1 to 8, and the operation thereof is as shown in FIGS. 10 to 15.
A semiconductor element and a spacer as an object to be joined are formed in a layered structure on the upper surface of the collector in this order, the emitter carried above the spacer descends, and the emitter is solder-bonded on the upper surface of the spacer.
In this solder joining step, the temperature of each element of the heating head, the emitter, the collector, and the cooling head is controlled with respect to the solder melting temperature of 229 ° C., for example, as shown in FIG.

Here, the heating head target temperature T1, the preheating target temperature T2 for preheating the emitter, the melt holding upper limit temperature T3, the preheating target temperature T4 for preheating the collector, and the cooling head temperature T5 are set.

As shown in FIGS. 1 to 8, the soldering apparatus includes a heating head 11 for heating the emitter as the work 1 and a cooling head 31 for cooling the emitter. In this embodiment, the joint on the collector 5 side is placed on the upper surface of the heater 50 for heating the solder 2.
Next, a specific embodiment of temperature control will be illustrated and described.

(1) Preheating process:
In the preheating process, the temperature of the emitter and collector is adjusted as follows.
The emitter is heated by the second preheating heater 52.
The collector as the bonded portion is heated by the first preheating heater 50 as a heater. The collector is adjusted to a preheating target temperature T4, for example 220 ° C. or lower.

(2) Work lift process:
In the step of holding and lifting the emitter sucked by the heating head, the heating head is set to the heating head target temperature T1 for example, 310 ° C. At this time, the emitter heated by the heating head is adjusted to a preheating target temperature T2, for example, 290 ° C., which is a solder melting temperature of 229 ° C. or higher.
The collector is adjusted to a preheating target temperature T4, for example 220 ° C. or lower.

(3) Temperature rise step (solder melting step):
In the process of melting the solder, the heating head is lowered above the collector side. Then, the heat of the emitter is taken away, while the solder on the upper surface of the spacer on the collector side is heated. This melts the solder and joins the emitter and spacer.
At the time of melting, the emitter is set to a melting holding temperature in the range of, for example, 250 to 270 ° C. The temperature on the collector side rises instantly when melting.

After the solder is melted, the temperature of the solder is lowered to solidify the solder, and the temperatures of the emitter, spacer, semiconductor element and collector are lowered.
After that, the solder is held at a preheating target temperature T4, for example, 220 ° C., which is a solder melting temperature of 229 ° C. or lower.
As a result, the emitter is bonded to the spacer on the collector side via solder.
When solidified, the bonding of the emitter is completed at the set temperature of the heating head of 310 ° C and the set temperature of the collector of 220 ° C to obtain the target height of the emitter with respect to the collector, and the melt holding temperature is set to 260 to pull up the emitter-bonded solder. Set to ° C.

(4) Delivery process:
The cooling head then descends to hold the emitter. Then, the means for holding the emitter is switched from the heating head to the cooling head. The cooling head draws heat from the emitter.
The heating head releases the holding of the emitter. As a result, the means for holding the emitter is switched from the heating head to the cooling head. The process of applying heat to the solder is switched to the process of removing heat.

(5) Temperature lowering process:
Next, in the step of solidifying the solder, the cooling head holds the emitter and removes heat from the solder through the emitter to rapidly solidify the solder.
The heating head is heated in preparation for the next step.
As described above, the cycle from the preheating process to the temperature lowering process is repeated.

As described above, when melting the solder, heat is applied to the solder from above to melt the solder. Next, when solidifying the solder, heat is taken from the solder from above and the solder is solidified.
In the present embodiment, the heating head is equipped with two temperature sensors for temperature control, and the sensors are switched, the temperature control temperature setting is switched, and the heater output is forcibly turned off.

(I) Before adsorption of the emitter: Adjust the temperature to 310 ° C. of the head temperature sensor.
(Ii) At the time of emitter adsorption: The sensor is switched and the temperature is adjusted to the emitter temperature sensor 290 ° C.
(Iii) When the emitter is in contact with the solder: the temperature is adjusted to 260 ° C.
(Iv) When the cooling head is in contact with the emitter: The heating head heater output is set to 0%.
(V) Emitter opening: Sensor switching Head temperature The temperature of the sensor is adjusted to 310 ° C.

In this way, the operation of forcibly applying heat to the emitter and then forcibly removing heat from the emitter is applied.

(Third embodiment)
In the soldering apparatus of the third embodiment of the present invention, the configuration of the head side of the upper part of the work uses the apparatus of the first embodiment shown in FIGS. 1 to 7, and the operation thereof is as shown in FIGS. 10 to 15. be.
In this third embodiment, the configuration on the head side and the configuration on the block side are combined to speed up the temperature rise and fall of the work and to achieve high cycle performance.

As shown in FIGS. 17 to 21, the soldering apparatus of the third embodiment separates the heating and cooling functions for the block-side configuration of the lower part of the work.

A schematic diagram of the configuration of the soldering apparatus of the third embodiment is as shown in FIG. 22 (A). The operation of this soldering device operates in the order of FIGS. 22 (A), (B), (C), (D), FIG. 23 (E), (F), and (G).

A semiconductor element 4 corresponding to the object to be bonded and a spacer 3 corresponding to the object to be bonded are formed in a layered structure in this order on the upper surface of the collector 5 corresponding to the object to be bonded, and correspond to a work conveyed above the spacer 3. The emitter 1 is lowered, and the emitter 1 is solder-bonded on the upper surface of the spacer 3 via the solder 2.

The structure of the upper part of the work is basically the same as that of the first embodiment, and the soldering apparatus includes a heating head 11 for heating the emitter as the work 1 and a cooling head 31 for cooling the emitter. There is.
FIG. 17 shows the configuration of the lower part of the work, and the configuration of the upper part of the work is omitted.

As shown in FIGS. 17 to 21, the soldering apparatus 80 of the third embodiment includes a heating block main body 60 and a cooling block main body 70 in place of the heater 50 of the first embodiment.
The soldering apparatus 80 basically includes a heating block main body 60 for heating the collector 5 and a cooling block main body 70 for cooling the collector 5. As shown in FIGS. 22 and 23, the cooling block main body 70 has a fixed level L capable of supporting the lower surface of the collector 5. On the other hand, the heating block main body 60 can be reciprocated up and down with respect to the cooling block main body 70 by the movable device 88 (third drive unit).

The position of the heating block main body 60 is controlled in the vertical direction by the movable device 88. The movable device 88 corresponds to the third drive unit described in the claims.

The heating block main body 60 adjusts the temperature of the suction tube 65 as a fourth suction means capable of sucking and detaching the collector 5 by air pressure, the ceramic heater 62 as a heating device for heating the heating block main body 60, and the heating block main body 60. It has a sheath-type thermocouple 63 as a head temperature sensor and a contact-type thermocouple 83 as a contact-type temperature sensor that adjusts the temperature by contacting with the collector 5. The contact thermocouple 83 corresponds to the third temperature sensor described in the claims.

The heating block main body 60 can be preheated by turning on the ceramic heater 62 when the collector 5 is not held by turning off the suction tube 65. Further, when the collector 5 is held by turning on the suction tube 65, the sheath type thermocouple 63 is turned off, the contact type thermocouple 83 is turned on, and the contact type thermocouple 83 is brought into contact with the collector 5, so that the collector 5 has high accuracy. Can perform various temperature control. The sheathed thermocouple 63 corresponds to the fourth temperature sensor described in the claims.

The position level L of the cooling block main body 70 is fixed.

The cooling block main body 70 has a cooling device including a suction pipe 75 and cooling water pipes 77 and 78 as a third suction means capable of sucking and removing the collector 5 by air pressure. The cooling block main body 70 performs an operation of sucking and detaching the collector 5 by the suction pipe 75 independently of the same operation of the heating block main body 60.

Further, the cooling block main body 70 has heating / cooling devices 72 and 73 capable of raising and lowering the temperature corresponding to the fifth temperature sensor. The heating / cooling devices 72 and 73 include a cartridge heater (cooling side heating mechanism) and a sheath type thermocouple (cooling side block temperature control sensor).

The cooling block main body 70 and the collector 5 have a structure that is not affected by the heat separated from the heating block main body 60, and is not affected by the ceramic heater 62 and the sheathed thermocouple 63. The cooling block main body 70 performs an operation of cooling and lowering the temperature of the collector 5 independently of the operation of the heating block main body 60 that heats and raises the temperature of the collector 5. Therefore, the switching speed from collector heating to collector cooling (fastest ascending / descending temperature) can be performed in a short time. Thermal efficiency is good when raising and lowering the temperature of the collector 5.

The cooling block main body 70 or the heating block main body 60 can support the collector 5.
<First step>

As shown in FIG. 22 (A), an example of joining the work 1 to the collector 5 side will be described. The semiconductor element 4 and the spacer 3 have a layered structure on the upper surface of the collector 5 in this order, and the work 1 is solder-bonded to the spacer 3. The work 1 is carried into the soldering device 10. The work 1 is conveyed below the work 1 above the solder 2 on the spacer 3 on the collector 5 side.

The soldering device 10 includes a heating head 11 for heating the work 1 and a cooling head 31 for cooling the work 1 on the upper side of the work, and a heating block main body 60 for heating the collector 5 and a collector on the lower side of the work. It is provided with a cooling block main body 70 for cooling 5.

The heating head main body 20 is in a position lower than the cooling head main body 30. Then, below the heating head main body 20 and the cooling head main body 30, the collector 5 side as an object to be joined is placed on the heating block main body 60. The collector 5 is sucked by the heating block main body 60 by the suction tube 65 in the direction of the arrow 90. The heating block main body 60 is in a position higher than the cooling block main body 70.
<Second step>

When the heating head main body 20 descends with respect to the work 1 separately placed above the solder 2 and comes into contact with the work 1 as shown in FIG. 22 (B), the suction pipes 25, 26, and 27 are turned on to indicate arrows. The work 1 sucked in the seven directions is sucked on the lower surface of the heating head main body 20.
<Third step>

Next, as shown in FIG. 22C, in a state where the heating head main body 20 has adsorbed the work 1, the work 1 is heated and lowered by heat conduction from the heating head 11 in the direction of arrow 8 to melt the solder 2. , Solder joint.
<4th step>

Next, as shown in FIG. 22 (D), the heating block main body 60 is lowered, the upper surface of the cooling block main body 70 is brought into contact with the collector 5, the suction pipe 75 is turned on, air is sucked in the direction of the arrow 91, and the collector is collected. 5 is switched from the suction of the heating block main body 60 to the suction by the cooling block main body 70.
<Fifth step>

Next, as shown in FIG. 23 (E), the cooling head 31 is lowered, the lower surface of the cooling head main body 30 is brought into contact with the work 1, the suction tubes 35 and 36 are turned on, and air is sucked in the direction of arrow 9. The work 1 is switched between suction by the heating head 11 and simultaneous suction by the cooling head 31.
The cooling block main body 70 supports the collector 5 and sucks the collector 5 by the suction pipe 75.
<Sixth step>

Next, as shown in FIG. 23 (F), heat is taken in the direction of arrow 41 to promote cooling and increase the solder bonding speed. The suction pipes 25, 26, and 27 of the heating head 11 are turned off, and the heating head 11 is lifted from the work 1. Then, the suction is switched to the cooling head 31, and at the same time, the cooling water pipe 32 of the cooling head 31 is turned on to promote the cooling of the work 1 and the solder 2 bonded to the work 1.
<7th step>

When the solder joining is completed, as shown in FIG. 23 (G), the suction pipes 35 and 36 of the cooling head 31 are turned off, the suction of the work 1 is stopped, the cooling head 31 is separated from the work 1, and the operation of the device is performed. To stop. With the above, the solder joining is completed.
(Other embodiments)

In the first embodiment, the heater is installed on the lower surface of the collector, but in the present invention, the embodiment in which the heater is not installed is also possible.

The solder bonding apparatus of the first embodiment of the present invention has described an example of a work in which an emitter is bonded to the collector side, but in the present invention, the bonded object and the object to be bonded are not limited to this example.
Further, in the description of the second embodiment, in FIG. 16, specific control temperature indications such as T1, T2, and a cooling temperature of 220 ° C. are shown, but the present invention is not limited to these specific temperature indications.

The present invention also includes an embodiment in which heating and cooling are functionally separated only from the lower part of the work to speed up the temperature rise and fall of the work and to achieve high cycle performance.

As described above, the present invention is not limited to the above-described embodiment, and can be implemented in various forms without departing from the spirit of the invention.

1: Emitter (work),
2: Solder,
5: Collector (joint),
10: Soldering equipment,
11: Heating head,
13, 14: Contact thermocouple (temperature sensor),
15, 16, 17, 18, 19: Ceramic heater (heater),
20: Heating head body,
21, 22: Sheath type thermocouple (temperature sensor),
25, 26, 27: Suction tube (first suction means),
28: Heating side first loader (first drive unit),
29: Heating side second loader (first drive unit),
30: Cooling head body,
31: Cooling head,
32: Cooling water pipe (cooling device),
35, 36: Suction tube (second suction means),
38: Cooling side first loader (second drive unit),
39: Cooling side second loader (second drive unit),
50: Heater (heating device, first heater),
52: Second preheater,
60: Heating block body,
62: Ceramic heater (4th temperature sensor),
63: Sheath type thermocouple (4th temperature sensor),
65: Suction tube (4th suction means),
70: Cooling block body,
72, 73: Heating / cooling device (fifth temperature sensor),
75: Suction tube (third suction means),
83: Contact thermocouple (third temperature sensor),
88: Third drive unit.

Claims (11)

A soldering device that applies solder (2) to the upper surface of the object to be bonded (3), descends the work (1) from above the solder, and joins the work to the object to be bonded via solder.
The first suction means (25, 26, 27) that sucks the upper surface of the work with air to float the work, and
A heating head main body (20) having the first suction means and temperature sensors (13, 14) capable of adjusting the temperature of the work and being able to move up and down until it comes into contact with the upper surface of the work.
The first drive unit (28, 29) that drives the heating head body up and down so as to be able to move up and down.
The second suction means (35, 36), which can be operated independently of the first suction means and sucks the upper surface of the work with air to float the work,
A cooling head body (30) having the second suction means and a cooling device (32) capable of cooling the work, which can be operated independently of the heating head body and can be raised and lowered until it comes into contact with the upper surface of the work. When,
The second drive unit (38, 39) that drives the cooling head body up and down so as to be able to move up and down,
A soldering device provided on the heating head main body and provided with heaters (15, 16, 17, 18, 19) for heating the heating head main body. The soldering according to claim 1, wherein the temperature sensor included in the heating head main body is a first temperature sensor (13, 14) for detecting the temperature of the work, and the work temperature is controlled based on the first temperature sensor. Device. The soldering apparatus according to claim 2, wherein the heating head main body includes a second temperature sensor (21, 22) for detecting the temperature of the heating head main body. The soldering according to any one of claims 1 to 3, wherein the first suction means and the second suction means have a mechanism for sucking a predetermined area on the upper surface of the work on a surface that can come into contact with the work. Device. The heating head main body has a pair of legs (41, 42) capable of sucking two workpieces at the same time, and one leg (41) has a first heater (15, 16). The soldering apparatus according to any one of claims 1 to 4, wherein the second heater (18, 19) is provided on the other leg portion (42). The soldering apparatus according to any one of claims 1 to 5, further comprising a heater (50) for heating the object to be joined on the lower side of the work. The process of preheating the work held by the heating head to a temperature higher than the solder melting temperature, and
The process of lowering the work and joining the work through the solder to the object to be joined with solder applied to the upper surface.
The process of switching the means for holding the work from the heating head to the cooling head, and
A soldering method comprising the step of removing heat from the work by the cooling head. A third suction means (75) that sucks the lower surface of the object to be joined with air and fixes the object to be joined.
A cooling block main body (70) having the third suction means and a heating / cooling device (72, 73) capable of heating and cooling the object to be joined, and capable of supporting the object to be joined at the lower part of the object to be joined.
It has a fourth suction means (65) that can operate independently of the third suction means and can suck the lower surface of the object to be joined and fix the object to be joined, and supports the object by contacting it. And the heating block body (60) that can be heated,
A third drive unit (88) that drives the heating block body up and down so as to be able to move up and down.
The soldering apparatus according to claim 1, further comprising a third temperature sensor (83) capable of adjusting the temperature of the object to be joined. The soldering apparatus according to claim 8, further comprising a fourth temperature sensor (62) for detecting the temperature of the heating block main body. The soldering apparatus according to claim 8, further comprising a fifth temperature sensor (72, 73) for detecting the temperature of the cooling block main body. In addition to the process according to claim 7.
A process of heating the object to be joined from the lower surface side with a heating block before joining the work and the object to be joined.
The step of switching the means for supporting the object to be joined from the heating block to the cooling block, and
The soldering method according to claim 7, further comprising a step of removing heat from the object to be joined by the cooling block after switching from the heating block to the cooling block.

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