JP2024002245A - Soldering device - Google Patents

Abstract

To provide a soldering device that includes an arm capable of canceling thermal elongation and controls a position, a speed, and a posture.SOLUTION: A soldering device includes: first suction means that sucks an upper surface of a work piece by air to float the work piece; a heating head 11 having the first suction means and a temperature sensor capable of adjusting a temperature of the work piece and which can be raised and lowered until it contacts the upper surface of the work piece; a first drive unit that drives the heating head 11 such that the heating head is moved upward/downward; and an adjusting mechanism 40 that causes an upward movement operation of the heating head 11 in a direction opposite to a thermal elongation direction of the heating head 11. By providing the adjusting mechanism 40 that makes a positional adjustment to the heating head, resulting from thermal elongation of an arm supporting the heating head 11, thickness of a solder layer is controlled when the work piece is jointed to a target object through solder. Thus, position, speed and posture are controlled during assembly, and soldering quality can be improved.SELECTED DRAWING: Figure 1

Description

The present invention relates to a soldering device equipped with a mechanism for correcting the position of a heating head.

2. Description of the Related Art Conventionally, there has been known an apparatus for thermocompression bonding an electronic component to a workpiece by heating the electronic component while pressing the electronic component against the workpiece.

The sleeve soldering apparatus of Patent Document 1 includes a sleeve that supplies solder, a heater that heats the sleeve, a movement mechanism that moves the sleeve, a detection section, and a determination section.
The numerical control device of Patent Document 2 has a thermal displacement correction function, and includes a thermal correction data storage means, a correction program analysis means, a correction program determination means, and a correction data correction means.
Conventionally, there has been no known soldering apparatus that includes an arm that performs correction to reduce thermal displacement and that controls the position, speed, and orientation of a heating head during assembly.

Japanese Patent Application Publication No. 11-850 Japanese Patent Application Publication No. 2020-188204

Causes of solder overflow caused by excessive pushing of the emitter during assembly include teaching errors, loosening of equipment parts, and thermal expansion of the head. The present invention solves problems associated with thermal expansion and contraction of the head portion during the steps from the temperature raising step to the temperature lowering step during soldering.

In solder assembly with a heating structure, there is a difference in the amount of thermal expansion of the assembly arm, for example, about 0.28 mm before and after the temperature is raised.
Required precision Soldering equipment that requires high-precision assembly, for example ±0.05 mm, takes a long time to complete the temperature rise of the entire equipment, and if there is a period of downtime, it takes a long time to restart the equipment. If the equipment is temporarily stopped, it will take a long time to restart the equipment, and if the heater is turned off, it will take a long time to restart the equipment, resulting in a large loss of time.

The present invention has been made in view of the above, and an object of the present invention is to provide a soldering device that is equipped with an arm that can cancel thermal expansion and that controls position, speed, and orientation.

The soldering device of the present invention applies solder (2) to the upper surface of a workpiece (3), lowers the workpiece (1) from above the solder, and joins the workpiece to the workpiece through the solder. A soldering device comprising: first suction means (25, 27) for suctioning the upper surface of the workpiece with air to float the workpiece; the first suction means; and a temperature sensor capable of adjusting the temperature of the workpiece; A heating head (11) that is movable up and down until it comes into contact with the upper surface of the workpiece, a first drive section (28) that drives the heating head so that it can be raised and lowered up and down, and a first drive section (28) that can be operated independently of the first suction means. and a second suction means (35, 36) for suctioning the upper surface of the workpiece with air to float the workpiece, and a cooling device capable of cooling the second suction means and the workpiece, and is independent of the heating head. a cooling head (31) which is operable and can be raised and lowered until it comes into contact with the upper surface of the workpiece; a second driving part (29) which drives the cooling head so as to be raised and lowered up and down; A heater that heats the heating head, an adjustment mechanism (40) that creates a rising motion due to the difference in thermal expansion of the heating head, and a command value that controls the positions of the heating head and the cooling head. A configuration including a control device (100) that outputs output to two drive units is adopted.

According to the present invention, the operation of the heating head for heating the workpiece and the operation of the cooling head for cooling the workpiece are independent, and the operation of cooling the workpiece and lowering its temperature is performed without being affected by the heat of the heating head. At this time, the switching speed from workpiece heating to workpiece cooling can be changed in a short time. Good thermal efficiency in raising and lowering the temperature of the workpiece.
Furthermore, by providing an adjustment mechanism that adjusts the position of the heating head in the opposite direction to the thermal expansion direction of the arm that moves the heating head up and down, it is possible to The thickness of the solder is controlled and excess solder is absorbed by the fillet. This makes it possible to control the position, speed, and posture during assembly and improve the soldering quality.

FIG. 3 is a schematic diagram for explaining thickness control of a solder layer by the soldering device of the first embodiment. FIG. 2 is a schematic diagram showing a mechanism of a soldering device according to a first embodiment and a second embodiment. FIG. 3 is a partially enlarged view showing the mechanism of the soldering device of the first embodiment and the second embodiment. FIG. 2 is a partially enlarged view showing the mechanism of the soldering device of the first embodiment. FIG. 3 is a schematic cross-sectional view for explaining the operation of the first embodiment. FIG. 3 is a schematic cross-sectional view for explaining the operation of the first embodiment. The elements on larger scale showing the mechanism of the soldering device of the second embodiment. FIG. 3 is a schematic configuration diagram of a soldering device according to a third embodiment. FIG. 3 is a schematic cross-sectional view illustrating the operation of a comparative soldering device. FIG. 7 is a characteristic diagram showing the measurement results of the expansion amount of the heating head of the soldering device of the comparative embodiment.

Hereinafter, soldering devices according to a plurality of embodiments will be described based on the drawings. In addition, in a plurality of embodiments, substantially the same constituent parts are given the same reference numerals, and description thereof will be omitted.

(First embodiment)
A first embodiment of the present invention will be described based on FIGS. 1 to 4.

The soldering apparatus according to the first embodiment of the present invention will be described with reference to an example in which a workpiece 1 as an emitter shown in FIG. 1 is joined to a collector 5 side. In this case, the semiconductor element 4 and the spacer 3 as the object to be bonded are layered in this order on the upper surface of the collector 5, and the workpiece 1 is soldered to the spacer 3.

A semiconductor element 4 corresponding to the object to be bonded and a spacer 3 corresponding to the object to be bonded are formed in a layered structure in this order on the upper surface of the collector 5 corresponding to the object to be bonded, and the spacer 3 corresponds to a workpiece to be transported above. The emitter 1 is lowered, and the emitter 1 is soldered to the upper surface of the spacer 3 via the solder 2.

By adjusting or controlling the solder layer thickness d shown in FIG. 1(B) by the soldering device 10, the workpiece 1 in the state before soldering shown in FIG. 1(A) can be soldered as shown in FIG. 1(B). Transition to work 1 in the later state.

The soldering apparatus 10 will be explained based on FIGS. 1 to 4. The soldering apparatus 10 includes a heating head 11 that heats the work 1 and a cooling head 31 that cools the work 1 above the work. The heating head 11 and the cooling head 31 have a suction tube (not shown) that sucks the workpiece.
A heating block 60 for heating the collector 5 and a cooling block 70 for cooling the collector 5 are provided below the workpiece.

In this embodiment, the structure on the head side and the structure on the block side are combined to achieve high-speed heating and cooling of the workpiece and high cycle performance.

Regarding the structure of the upper part of the workpiece 1, the heating head 11 is driven by the driving force of the servo motor SM2 corresponding to the first driving part, for example, via a link mechanism 40 including an arm 41, a first rod 42, etc. (not shown). The position is controlled in the vertical and horizontal directions via a movable device consisting of a first loader on the heating side and a second loader on the heating side perpendicular to the first loader. The heating-side first loader and the heating-side second loader correspond to a first drive unit described in the claims.

Regarding the heating head, cooling head, and device for suctioning and adsorbing a workpiece according to this embodiment, the heating head, cooling head, and device for suctioning and adsorbing a workpiece of a soldering apparatus described in JP-A No. 2022-040015 are described. The configuration is similar to the configuration.

The heating head 11 includes suction tubes 25 and 27 as first suction means that can adsorb and remove the workpiece 1 by air pressure, a ceramic heater as a heating device that heats the heating head 11, and a head temperature that adjusts the temperature of the heating head. It has a sheathed thermocouple 21 as a sensor and a contact thermocouple 13 as a contact temperature sensor that contacts the workpiece 1 to adjust the temperature.

This heating head 11 can be preheated by turning on the ceramic heater when the suction tubes 25 and 27 are turned off and the workpiece 1 is not held.
When holding the workpiece 1 by turning on the suction tubes 25 and 27, the sheathed thermocouple 21 is turned off, the contact thermocouple 13 is turned on, and the contact thermocouple 13 is brought into contact with the workpiece 1. Highly accurate temperature control can be performed.

The cooling head 31 is driven by a driving force of a servo motor SM1 corresponding to a drive device to a first cooling-side loader (not shown) and a second cooling-side loader orthogonal thereto, for example, via a link mechanism including arms 94, 95, etc. The position is controlled in the vertical and horizontal directions via a movable device consisting of.

The cooling head 31 has a cooling device consisting of suction pipes 35 and 36 as second suction means capable of adsorbing and removing the workpiece 1 by air pressure, and a cooling water pipe (not shown). The cooling head 31 uses a movable device consisting of a first loader on the cooling side and a second loader on the cooling side to perform suction operations and detachment operations for lifting the workpiece 1 using suction tubes 35 and 36 of the workpiece 1. Do this independently from similar operations in .

Further, the cooling head 31 has a structure in which cooling of the workpiece 1 is not affected by heat separated from the heating head 11, and is not affected by the ceramic heater and the sheath type thermocouple. The cooling head 31 performs an operation of cooling the workpiece 1 and lowering its temperature independently from the operation of the heating head 11 that heats the workpiece 1 and raising its temperature. Therefore, the switching speed from workpiece heating to workpiece cooling (fastest temperature increase/decrease) can be achieved in a short time. Thermal efficiency is good in raising and lowering the temperature of the workpiece 1.

Regarding the lower part of the workpiece 1, the soldering apparatus of this embodiment basically includes a heating block 60 that heats the collector 5 and a cooling block 70 that cools the collector 5. The cooling block 70 has a fixed level L that can support the lower surface of the collector 5 shown in FIG. 1(A). On the other hand, the heating block 60 can be reciprocated up and down with respect to the cooling block 70 by a third drive section 88 corresponding to the servo motor SM3.

The position of the heating block 60 is controlled in the vertical direction by a third drive section 88 .

The heating block 60 includes an adsorption tube 65 as a fourth suction means that can adsorb and remove the collector 5 by air pressure, a ceramic heater (not shown) as a heating device that heats the heating block 60, and a head that adjusts the temperature of the heating block 60. It has a sheathed thermocouple (not shown) as a temperature sensor and a contact thermocouple as a contact temperature sensor that contacts the collector 5 to adjust the temperature.

This heating block 60 can be preheated by turning on the ceramic heater when the collector 5 is not held because the adsorption tube 65 is turned off. In addition, when holding the collector 5 by turning on the suction tube 65, the sheath type thermocouple is turned off, the contact type thermocouple is turned on, and the contact type thermocouple is brought into contact with the collector 5, thereby achieving highly accurate temperature control of the collector 5. It can be performed.

The cooling block 70 has a fixed position level L.

The cooling block 70 has an adsorption pipe 75 as a third suction means capable of adsorbing and removing the collector 5 by air pressure, and a cooling device (not shown) consisting of a cooling water pipe. The cooling block 70 performs an operation of adsorbing the collector 5 and an operation of removing the collector 5 independently from the similar operation of the heating block 60 using the adsorption tube 75 .

Further, the cooling block 70 has a heating/cooling device capable of raising and lowering the temperature, which corresponds to the fifth temperature sensor. The heating and cooling device includes a cartridge heater (cooling side heating mechanism) and a sheath type thermocouple (cooling side block temperature control sensor).

Regarding the cooling of the cooling block 70 and the collector 5, the structure is such that it is not affected by the heat separated from the heating block 60, and the structure is not affected by the ceramic heater and the sheath type thermocouple. The cooling block 70 performs an operation of cooling the collector 5 and lowering its temperature independently from the operation of the heating block 60 which heats the collector 5 and raises its temperature. Therefore, the switching speed from collector heating to collector cooling (the fastest temperature increase/decrease) can be achieved in a short time. Thermal efficiency is good in raising and lowering the temperature of the collector 5.

A cooling block 70 or a heating block 60 can support the collector 5 . Regarding the configuration of the block side at the bottom of the workpiece, the heating and cooling functions are separated.

As shown in FIG. 2, this embodiment includes a control device (PLC) 100 that controls the positions of the heating head 11, the cooling head 31, and the heating block 60. The control device 100 outputs instructions to the servo motors SM1, SM2, and SM3, and the position (operation amount) of each arm is determined by driving each servo motor.

This embodiment includes a link mechanism 40 corresponding to the thermal compression structure shown in FIGS. 3 and 4 that corrects the difference in thermal expansion of the arms of the heating head 11.

As shown in FIGS. 3 and 4, the driving force of the drive unit 28 moves the heating head 11 up and down (up and down) via the link mechanism 40.
In this configuration, a correction mechanism section 44 shown in FIG. 4 is provided at the IV portion of the link mechanism 40.
The correction mechanism section 44 has a slider 47 that corresponds to a movable section that can move up and down guided by the rail 46 of the arm 41 that corresponds to a fixed section. The slider 47 is fixed to the heating head 11 which is movable relative to the rail 46 . One end of a connecting portion 43 is rotatably supported at the upper end of a first rod 42 fixed to the heating head 11, and a second rod 45 is rotatably supported at the other end of the connecting portion 43. The lower end of the second rod 45 is fixed to the arm 41.

The first rod 42 is made of, for example, Super Invar (thermal expansion coefficient 0.24 (×10 ^-6 /°C)) with a relatively low expansion coefficient, and the second rod 45 is made of, for example, aluminum (with a relatively large expansion coefficient). It has a coefficient of thermal expansion of 27.3 (×10 ^-6 /°C)).
For example, if the length of the first rod 42 and the second rod 45 is 20 mm, and the temperature difference between the temperature of the heating head 11 before and after the temperature rise is 80°C, the difference in thermal expansion is 0.043 mm. . This thermal elongation difference is used to cancel out the elongation of the lower end of the heating head 11 in the thermal elongation direction (absorption direction). Thereby, the amount of thermal expansion of the entire arm can be brought close to zero.

The control device 100 instructs each arm of the heating head 11, the cooling head 31, and the heating block 60 with an instruction value of the normal control amount. The vertical height of the arm equipped with a servo motor for the vertical mechanism is controlled.

As shown in FIG. 2, in this embodiment, temperature information of each arm of the heating head 11, cooling head 31, and heating block 60 that adsorbs the workpiece 1 is acquired, and based on the temperature information of each arm, the heating head, A PCL (control device) that issues instructions to the cooling head and heating block, and drive units 28, 29, and 88 that include servo motors SM1, SM2, and SM3 that operate the vertical positions of each arm 41 and the first rod 42. Be prepared. The amount of thermal expansion at the tip of the first rod 42 is calculated from the temperature of the thermocouple corresponding to the temperature sensor, and the amount is included in the control correction amount to be instructed and controlled.

The PLC acquires the temperature of the thermocouple of each arm of the heating head, cooling head, and heating block, and calculates the amount of thermal expansion at the tip of each arm. The correction amount is obtained in advance from the temperature at the time of heating and the amount of thermal expansion.

The PLC instructs each arm of the heating head 11, cooling head 31, and heating block 60 with an instruction value that is a normal control amount plus a thermal expansion correction amount. An arm equipped with a servo motor of the vertical mechanism controls the vertical height according to instructions from the PLC.

This embodiment calculates the amount of thermal expansion of each arm and manipulates the vertical height of each arm to control the position, speed, and posture during soldering assembly, improving the quality of soldering. let

The arm supporting the heating head 11 is shown in FIGS. 3 and 4.
As shown in FIG. 4, the soldering device includes a part of the arm with a thermocompression structure using different metals having different amounts of thermal expansion. Since parts of the arm are made of different metals with different amounts of thermal expansion, a rising motion is created due to the difference in thermal expansion, and the amount of thermal expansion of the entire arm approaches zero. Set the correction amount based on the thermal expansion difference.

The arm that supports the heating head 11 includes an arm 41 that corresponds to a fixed part and a slider 47 that corresponds to a movable part that moves up and down in the axial direction.

(Table 1)

As shown in Table 1, the present invention uses different metals having different amounts of thermal expansion. The linear expansion coefficient of aluminum is 27.3 (×10 ⁻⁶ /° C.).
The linear expansion coefficient of Super Invar is 0.24 (×10 ⁻⁶ /° C.). Super Invar is an alloy of iron, nickel, and cobalt, and is a metal material with a very small coefficient of thermal expansion at room temperature.

For example, by using different metals with different coefficients of thermal expansion, such as aluminum and Super Invar, in the right materials and in the right places, it is possible to create a difference in thermal expansion due to the difference in materials when there is a temperature difference between before and after heating. If you know the temperature difference before the equipment temperature rises (when the equipment starts operating) and after the equipment temperature rises (when the temperature stabilizes after operation), you can determine the amount of thermal expansion by arbitrarily setting the length of the parts of different materials. It is possible to cancel.

Next, the steps of the soldering operation from preparation for soldering to completion of soldering will be explained in order.
<First step>

An example in which the workpiece 1 is joined to the collector 5 side as shown in FIG. 5(A) will be described. A semiconductor element 4 and a spacer 3 are layered in this order on the upper surface of the collector 5, and a workpiece 1 is soldered to the spacer 3. A workpiece 1 is carried into a soldering apparatus 10. Below the work 1, the work 1 is conveyed above the solder 2 on the spacer 3 on the collector 5 side.

The soldering device 10 includes a heating head 11 that heats the work 1 and a cooling head 31 that cools the work 1 on the upper side of the work, and a heating block 60 that heats the collector 5 and a heating block 60 that heats the collector 5 on the lower side of the work. A cooling block 70 is provided.

The heating head 11 is located at a position lower than the cooling head 31. Then, below the heating head 11 and the cooling head 31, the collector 5 side as the object to be bonded is placed on the heating block 60. The collector 5 is sucked in the direction of arrow 90 by the suction tube 65 by the heating block 60 . The heating block 60 is located higher than the cooling block 70.
<Second process>

When the heating head 11 descends to the workpiece 1 placed separately above the solder 2 and comes into contact with the workpiece 1, as shown in FIG. The work 1 to be sucked is attracted to the lower surface of the heating head 11.
<3rd process>

Next, as shown in FIG. 5C, with the heating head 11 adsorbing the workpiece 1, the heating head 11 heats the workpiece 1 by heat conduction in the direction of the arrow 8, and descends to melt the solder 2. Solder joint.
<4th step>

Next, as shown in FIG. 5(D), the heating block 60 is lowered, the upper surface of the cooling block 70 comes into contact with the collector 5, and the suction tube 75 is turned on to suck air in the direction of the arrow 89, thereby removing the collector 5. The suction by the heating block 60 is switched to the suction by the cooling block 70.
<5th step>

Next, as shown in FIG. 6(E), the cooling head 31 is lowered, the lower surface of the cooling head 31 comes into contact with the workpiece 1, and the suction tubes 35 and 36 are turned on to suck air in the direction of the arrow 9, and the workpiece 1 is switched to simultaneous suction by the heating head 11 and the cooling head 31.
The cooling block 70 supports the collector 5 and sucks the collector 5 through the suction tube 75 .
<6th step>

Next, as shown in FIG. 6(F), heat is removed in the direction of arrow 39 to promote cooling and increase the soldering speed. The suction tubes 25 and 27 of the heating head 11 are turned off, and the heating head 11 is lifted from the workpiece 1. Then, the suction by the cooling head 31 is switched on, and at the same time, the cooling water pipe 32 of the cooling head 31 is turned on to promote cooling of the workpiece 1 and the solder 2 bonded thereto.
<7th step>

When the soldering is completed, as shown in FIG. 6(G), the suction tubes 35 and 36 of the cooling head 31 are turned off, suction of the workpiece 1 is stopped, and the cooling head 31 is separated from the workpiece 1, and the operation of the apparatus is stopped. stop. With the above, soldering is completed.

According to the present embodiment, the heating head 11 and the cooling head 31 are driven by different drive devices, and the suction and heating operation of the workpiece 1 and the suction and cooling operation of the workpiece 1 are performed independently. By controlling the operation, it is possible to quickly switch between heating operation and cooling operation. Therefore, the workpiece 1 can be heated, soldered, and cooled at high speed and with high efficiency, improving thermal efficiency, and the workpiece 1 and the spacer 3 as the object to be joined can be joined by the solder 2 at high speed. Can be done.

In the embodiment described above, before switching the suction tubes 25 and 27 of the heating head 11 from on to off, the suction tubes 35 and 36 of the cooling head 31 are turned on and the reception of the workpiece 1 is switched from the heating head 11 to the cooling head 31. At the same time, it is possible to improve the accuracy of the soldering joint positions of the two workpieces 1.

In this embodiment, after the position of the workpiece 1 is specified by suction by the suction tubes 25 and 27 of the heating head 11, the workpiece 1 is located by suction by the suction tubes 35 and 36 of the cooling head 31 at the same time during continuous lifting. positioning accuracy improves.

According to the soldering apparatus of this embodiment, heating and cooling are independent of each other, so there is little temperature change in each of the heating head 11 and the cooling head 31, and cycleability is good. Furthermore, since the workpiece 1 is heated by directly detecting the temperature using the contact thermocouples 13 and 14, defects are less likely to occur. Since the solder 2 is rapidly cooled, voids are less likely to occur and the solder quality is improved.

Furthermore, the furnace-less structure contributes to space savings, energy savings, and equipment cost savings, and since the soldering device can be made into a compact device, it also has the advantage of being easy to maintain.

(Comparison form)
A comparison mode will be explained based on FIGS. 9 to 10.

As shown in FIG. 10, soldering is completed through the steps of heating, assembly, cooling and transferring on the collector side, and cooling and transferring on the emitter side. In the comparative example, during assembly, solder overflow occurs due to excessive pushing of the emitter. One of the causes of excessive emitter indentation is thermal expansion of the heating head.

FIG. 9 shows the change over time in the amount of thermal expansion of the arm of the heating head. As the temperature of the heater increases and time elapses, the amount of thermal expansion increases. After turning on the heater, the temperature rise is completed in 5 minutes, and the thermal elongation is completed in 100 minutes. After the heating of the heater is completed, the amount of thermal elongation is 0.28, which is greater than the product required accuracy of 0.1, and it fluctuates due to abnormal treatment, etc., and there is a concern that solder overflow may occur.

In contrast, according to the above embodiment, even if the temperature before heating the heating head reaches the temperature after heating, the thermal elongation is absorbed by the correction mechanism section 44 having the above-mentioned link mechanism, so that the excess solder Since it is possible to absorb this in the fillet and control the thickness of the solder layer, it is possible to reduce solder quality defects due to solder overflow, etc.

(Second embodiment)
A second embodiment of the present invention will be described based on FIGS. 1, 2, 3, and 7.

The second embodiment is similar to the first embodiment with respect to the configuration shown in FIGS. 1, 2, and 3. The second embodiment includes the configuration shown in FIG. 7 instead of FIG. 4 of the first embodiment.

The heating head 11, the cooling head 31, and the heating block 60 each include an arm.
The configuration of the IV portion shown in FIG. 3 appears in the configuration between the arm 41 and the first rod 42 shown in FIG. The relatively movable structure includes a guide rail 46 that corresponds to a fixed part, and a slider 47 that corresponds to a movable part that is movable relative to the guide rail 46. The thermal compression adjustment mechanism section is composed of a link mechanism section 54. In the link mechanism section 54, a link 55 is rotatably supported by a fulcrum 57 at the tip of a third rod 91 fixed to the arm 41. The link 55 has a fulcrum 56 at a length a in one direction from the fulcrum 57, and a fulcrum 58 at a length b in the opposite direction from the fulcrum 57. The fulcrum 58 is fixed to the tip of a fourth rod 92 fixed to the arm 41.

The coefficient of thermal expansion of the material of the third rod 91 is greater than the coefficient of thermal expansion of the material of the fourth rod 92. For example, the third rod 91 is made of aluminum, and the fourth rod 92 is made of super invar. Set the correction amount based on the thermal expansion difference.
As a result, the use of two different metal materials and the lever principle are used to increase the thermal expansion in the direction of canceling out the thermal expansion in the thermal expansion direction, thereby correcting the thermal expansion and elongation of the arms, etc. before and after the temperature rise, A rising motion of the heating head 11 is created due to the difference in thermal expansion, the thermal expansion is compressed, and the amount of thermal expansion of the entire arm approaches zero. Therefore, surplus solder during soldering can be appropriately absorbed by the fillet, and solder thickness can be appropriately controlled.

As shown in FIG. 7, the second embodiment includes a link mechanism section 54 on the arm.
A correction amount is set for the thermal expansion difference in the absorption direction opposite to the thermal expansion direction.
When the arm 41 is thermally expanded and lowered, the link mechanism section 54 performs an upward movement to reduce the difference in thermal expansion.

The arms of the heating head 11 are shown in FIGS. 3 and 7.
As shown in FIG. 7, the soldering device includes a part of the arm with a thermal compression structure using different metals having different amounts of thermal expansion. Part of the arm is made of two different types of metals with different amounts of thermal expansion, so when there is a temperature difference between before and after heating in the link mechanism, it is possible to create a difference in thermal expansion due to the difference in materials. can.

The thermal compression adjustment mechanism section of the heating head 11 includes a fixed section and a movable section that moves up and down in the axial direction.
A metal with a large amount of thermal expansion and a metal with a small amount of thermal expansion are provided at the fixed portion of the arm 41 so as to extend upward in the axial direction, which is the absorption direction. The fixed part and the movable part of the arm are connected by a fixed connection part and a movable connection part. The metal of the fixed part of the arm is partially made of a dissimilar metal (second metal) that has a larger thermal expansion than the metal of the movable part (first metal) and a dissimilar metal (third metal) that has a smaller thermal expansion than the metal of the movable part. be. The metal of the other parts of the fixed part is the same type of first metal as the metal of the movable part. The movable part of the arm extends downward in the axial direction in the thermal expansion direction due to thermal expansion due to temperature rise, but the second metal and third metal of the fixed part extend more upward in the axial direction due to thermal expansion.

The amount of rise of the movable part due to the amount of thermal expansion of the metal of the fixed part that thermally expands upward in the axial direction is greater than the amount of thermal expansion of the metal of the movable part that expands downward in the axial direction, and the amount of thermal expansion of the entire arm is reduced to 0. get closer to

According to this embodiment, if the temperature difference before the equipment temperature rises (when the equipment starts operating) and after the equipment temperature rises (when the temperature stabilizes after operation), the length of the parts made of different materials can be set arbitrarily. By doing so, it becomes possible to cancel the amount of thermal expansion.

Other basic configurations of the second embodiment are the same as those of the first embodiment.

(Third embodiment)
A third embodiment of the present invention will be described based on FIG. 8.

As shown in FIG. 8, the third embodiment of the present invention acquires temperature information of each arm 41, 93, 94, 95 that supports the heating head 11, cooling head 31, and heating block 60 that adsorbs the workpiece. , a PLC (control device 100) that issues instructions to the heating head 11, cooling head 31, and heating block 60 based on temperature information of each arm 41, 93, 94, and 95, and a servo that operates the vertical position of each arm. It is provided with drive units 28, 29, and 88 consisting of motors SM1, SM2, SM3, and the like. The amount of thermal expansion at the tip of the arm is calculated from the temperatures of thermocouples 101, 102, 103, 104, 105, 106, 107, and 108, which correspond to temperature sensors, and is included in the control correction amount for instruction and control.

A control device (PLC) 100 acquires the temperatures of thermocouples 101, 102, 103, 104, 105, 106, 107, and 108 of each arm of the heating head 11, cooling head 31, and heating block 60, and obtains the temperature of each arm 93. Calculate the amount of thermal elongation at the tips of , 94 and 95. The correction amount is obtained in advance from the temperature at the time of heating and the amount of thermal expansion.

The PLC gives instructions to the arms 41, 93, 94, and 95 that support the heating head 11, the cooling head 31, and the heating block 60, corresponding to an instruction value that is the normal control amount plus the thermal expansion correction amount. According to instructions from the PLC, an arm equipped with a servo motor of the vertical mechanism controls the vertical heights of the heating head 11, cooling head 31, and heating block 60.

In this embodiment, by calculating the amount of thermal expansion of each arm 41, 93, 94, 95 and manipulating the vertical height of each arm 41, 93, 94, 95, position and speed can be adjusted at the time of soldering assembly. , and control posture to improve soldering quality.

Other basic configurations of the third embodiment are the same as those of the first embodiment.
The temperature of each arm is detected by a thermocouple, and the position, speed, and orientation of the heating head can be corrected and controlled according to the detected temperature. Therefore, controlling the thickness of the solder layer δ improves soldering quality. Further, by controlling the position, excess solder can be absorbed by the fillet, and the quality of soldering can be improved.

As described above, the present invention is not limited to the above-described embodiments, and can be implemented in various forms without departing from the gist thereof.
In the soldering apparatus of the present invention, the adjustment mechanism is a link mechanism that uses a material with a different coefficient of thermal expansion as a material that supports the heating head, and changes the positional displacement of the heating head as the temperature of the heating head increases. (40) may be used.
In the soldering device of the present invention, the link mechanism supports a fixing part (41, 46) provided on the first drive part side and the heating head, and is arranged in a gravitational direction and an anti-gravity direction with respect to the fixing part. a movable part (47) that is relatively movable; and a correction mechanism part (44) that uses dissimilar metals with different amounts of thermal expansion between the fixed part and the movable part to bring the positional displacement of the heating head closer to zero. The configuration may include the following.

In the soldering apparatus of the present invention, the correction mechanism section may include a link mechanism section (54) having a thermal compression mechanism using the lever principle.
The soldering device of the present invention may include a slider (47) that allows relative movement between the fixed part and the movable part.

The soldering apparatus of the present invention includes a temperature sensor (101, 102, 103, 108) that detects the temperature of the arm (93, 94, 95) that affects the displacement amount of thermal expansion of the heating head, and the first drive The second drive unit may also include a control device (100) that sends a control signal for correcting thermal expansion corresponding to the temperature detected by the temperature sensor.

1: Emitter (work),
2: Solder,
5: Collector (object to be joined),
10: Soldering device,
11: heating head,
25, 27: Adsorption tube (first suction means),
28: Heating side first loader (first drive section),
29: Heating side second loader (first drive section),
31: Cooling head,
35, 36: Adsorption tube (second suction means),
60: heating block,
65: Adsorption tube (fourth suction means),
70: Cooling block,
75: Adsorption tube (third suction means),
88: Third drive section.

Claims (6)

A soldering device that applies solder (2) to the upper surface of a workpiece (3), lowers the workpiece (1) from above the solder, and joins the workpiece to the workpiece via the solder,
first suction means (25, 27) that suctions the upper surface of the workpiece with air and floats the workpiece;
a heating head (11) that has the first suction means and a temperature sensor that can adjust the temperature of the workpiece, and that can be raised and lowered until it comes into contact with the upper surface of the workpiece;
a first drive unit (28) that drives the heating head so that it can move up and down;
second suction means (35, 36) operable independently from the first suction means to suction the upper surface of the workpiece with air and float the workpiece;
a cooling head (31) that has the second suction means and a cooling device capable of cooling the workpiece, is operable independently from the heating head, and is movable up and down until it comes into contact with the upper surface of the workpiece;
a second drive unit (29) that drives the cooling head so that it can move up and down;
a heater provided in the heating head and heating the heating head;
an adjustment mechanism (40) that creates a rising motion due to a difference in thermal expansion of the heating head;
A soldering apparatus comprising: a control device (100) that outputs command values for controlling the positions of the heating head and the cooling head to the first drive section and the second drive section. 1 . The adjustment mechanism includes a link mechanism ( 40 ) that uses a material with a different coefficient of thermal expansion as a material that supports the heating head, and changes the positional displacement of the heating head as the temperature of the heating head increases. The soldering equipment described. The link mechanism includes a fixed part (41, 46) provided on the first driving part side, and a movable part (47) that supports the heating head and is movable relative to the fixed part in the direction of gravity and in the anti-gravity direction. ), and a correction mechanism section (44) that uses dissimilar metals with different amounts of thermal expansion between the fixed section and the movable section to bring the amount of positional displacement of the heating head close to zero. Soldering equipment. 4. The soldering apparatus according to claim 3, wherein the correction mechanism section includes a link mechanism section (54) having a thermal compression mechanism using a lever principle. The soldering apparatus according to claim 3, further comprising a slider (47) that allows relative movement between the fixed part and the movable part. a temperature sensor (101, 102, 103, 108) that detects the temperature of the arm (93, 94, 95) that affects the displacement amount of thermal expansion of the heating head; and the first drive section or the second drive section. 2. The soldering apparatus according to claim 1, further comprising a control device (100) configured to send out a control signal for correcting thermal elongation corresponding to the temperature detected by the temperature sensor.

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