JP2010034341A - Chip mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip mounting device that can shorten a production tact time and mounts a chip such as an integrated circuit element on a substrate such as a printed circuit board with high reliability. <P>SOLUTION: The chip mounting device includes a chip holding means of sucking and holding the chip, a pressure applying means of applying pressure to the chip holding means and also supporting the chip holding means, and a driving control means of enabling the pressure applying means to move along the height of the device, and solders a bump of the chip to an electrode of a substrate disposed at a position opposite the chip. The chip mounting device further includes a predictive control means of predicting an amount of elongation of the chip holding means in a period from heating of the chip holding means to fusion of the bump and inputting a correction command to the driving control means based upon a predicted value of elongation of the chip holding means to control the height position of the pressure applying means. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a chip mounting apparatus for mounting a chip such as an integrated circuit element on a substrate such as a printed circuit board.

  As a device for mounting a chip such as an integrated circuit element on a substrate such as a printed circuit board, a chip mounting device as disclosed in Patent Document 1 has been previously proposed by the present applicant.

  As shown in FIG. 5, the chip mounting apparatus of Patent Document 1 holds a chip holding means 17 that holds the chip 1 and applies a pressing force, and a pressure that supports the chip holding means 17 so as to be movable up and down and applies a pressing force. Applying means 15, Z-axis feeding device 3 for raising and lowering pressure applying means 15, position detecting means 23 for detecting the position of tip holding means 17 moving inside the pressure applying means 15, and position detecting means Drive control means 22 for controlling the Z-axis feeding device 3 in response to the detection signal 23. The pressure applying means 15 is in the shape of a cylinder tube, and is configured so that the piston portion of the tip holding means 17 can move inside. The pressure in the cylinder applied to the piston acts on the tip 1 via the tip holding means 17. Like to do.

  The operation of soldering the chip 1 to the substrate 5 using such a chip mounting apparatus will be described with reference to the time chart of FIG. First, the chip 1 is sucked and held by the chip holding means 17 and the Z-axis feeding device 3 is driven to lower the pressure applying means 15 toward the substrate 5 (from t0 to t1). The substrate 5 and the chip 1 come into contact with each other, the pressurizing means 15 is lowered toward the substrate 5 by the set push amount d1, and the Z-axis feeding device 3 is stopped. At this time, the position detection means 23 detects the distance x1 to the piston portion of the tip holding means 17 (from t1 to t2). Subsequently, the heater 11 built in the chip holding means 17 is turned on, the chip holding means 17 is extended by heating, and the position detecting means 23 detects the distance x2 to the piston portion of the chip holding means 17. Thereafter, the solder of the bumps 1a of the chip 1 starts to melt, and the chip holding means 17 descends inside the pressure applying means 15 due to the melting of the solder. When the distance to the piston portion of the chip holding means 17 detected by the position detecting means 23 reaches x3 (set value), it is determined that the solder of the bump 1a has melted (from t2 to t4). The Z-axis feeding device 3 is driven and the pressure applying means 15 is pulled up so that the gap between the chip 1 and the substrate 5 after the solder cooling becomes a predetermined value d3 along with the determination of the melting of the solder. Then, the heater 11 is turned off to release the suction of the chip 1 and cool the solder (from t4 to t6). Accordingly, the piston portion of the tip holding means 17 moves up and down in the pressurizing means 15 by heating of the heater 11 and melting of the solder, and the position detecting means 23 detects the position of the piston portion of the tip holding means 17. The driving means 22 controls the Z-axis feeding device 3 based on the detection result.

WO2007 / 065559

  However, if the position detection means 23 detects the position of the piston portion of the tip holding means 17 and drives the Z-axis feeding device 3 to control the position of the pressure applying means 15, the detection result until the detection result reaches a predetermined value. It becomes impossible to move to the next operation, and it becomes difficult to shorten the operation time. Therefore, there arises a problem that the production tact time cannot be shortened and the productivity cannot be increased.

  In view of the above problems, the present invention is intended to provide a chip mounting apparatus that can shorten the production tact time and mount a chip such as an integrated circuit element on a substrate such as a printed circuit board with high reliability. .

In order to solve the above problems, the invention described in claim 1
Chip holding means for sucking and holding the chip, pressure applying means for applying pressure to the chip holding means and supporting the chip holding means, and drive control means for moving the pressure applying means in the apparatus height direction; A chip mounting apparatus for soldering the bumps of the chip to the electrodes of the substrate disposed at a position facing the chip,
Predicting the amount of extension of the chip holding means from the heating of the chip holding means to the melting of the bumps of the chip, and applying a correction command to the drive control means based on the predicted value of the elongation of the chip holding means to apply pressure It is the chip | tip mounting apparatus provided with the prediction control means which controls the height position of this.

The invention according to claim 2 is the invention according to claim 1,
The prediction control means predicts the amount of shrinkage of the chip holding means when the heating of the chip holding means is further stopped, and inputs a correction command to the drive control means based on the predicted shrinkage value of the chip holding means and pressurizes It is a chip mounting apparatus which is a prediction control means for controlling the height position of the applying means.

The invention according to claim 3 is the invention according to claim 1 or 2,
The pressure applying means is a cylinder tube, and the tip holding means is composed of a piston and a rod that move inside the cylinder tube, and is supplied to the piston by air supplied from air supply ports provided above and below the cylinder tube. It is a chip mounting apparatus that is configured to be able to adjust the weak pressure that acts.

The invention according to claim 4 is the invention according to any one of claims 1 to 3,
The tip holding means is heated and stopped in advance, the amount of movement of the tip holding means moving inside the pressurizing means is measured as the amount of expansion / contraction, and the amount of expansion / contraction is stored in the amount of expansion / contraction storage means. The chip mounting apparatus includes a configuration in which a correction command input from the prediction control unit to the drive control unit is calculated based on the expansion / contraction amount stored in the expansion / contraction amount storage unit.

  According to the first aspect of the present invention, the prediction control means predicts the elongation amount of the chip holding means between the heating of the chip holding means and the melting of the bumps of the chip, and based on the predicted value of the elongation of the chip holding means. A conventional chip mounting method for performing the next operation based on the detection result while detecting the position of the chip holding means since the correction command is input to the drive control means to control the height position of the pressure applying means. The time during which the height position of the pressure applying means is kept constant is shortened, and the production tact time can be shortened.

  According to the second aspect of the present invention, the position of the pressurizing unit is controlled based on the predicted value of the shrinkage of the chip holding unit that changes gradually with time when the heating of the chip holding unit is stopped. The solder bump can be cooled while keeping the pressure applied to the chip constant. In addition, a shrinkage force is generated between the chip and the substrate due to the cooling of the solder bumps, but since the position of the pressure applying unit is controlled based on the predicted shrinkage of the chip holding unit, the contraction force between the chip and the substrate is reduced. The solder bumps can be prevented from being damaged. Furthermore, the solder bumps can have a uniform shape and high-quality solder bonding can be performed.

  According to invention of Claim 3, the pressure which acts on the piston of a chip | tip holding means with the air supplied from the air supply port provided in the upper and lower sides of the cylinder tube can be made weak. Therefore, even when the solder bump is melted, a pressure that does not damage the solder bump can be applied to the chip holding means.

  According to the invention described in claim 4, since the expansion / contraction characteristics of the chip holding means are stored in advance in the expansion / contraction amount storage means, the position of the chip holding means is detected at the time of actual chip mounting, and the detection result The pressurizing means need not be operated based on the above. Therefore, production tact time can be shortened.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, the code | symbol of the member used by background art is used as it is.

  FIG. 1 is a front view of the chip mounting apparatus according to the present embodiment. The Z-axis feeding device 3 provided in the chip mounting apparatus rotates a feeding mechanism 7 (for example, a ball screw) by a servo motor 6 mounted on the device frame 9, and a slider 8 screwed with this is used as a device frame 9. The guide rail 10 is attached to the guide rail 10 and is moved up and down. The pressure applying means 15 is attached to a bracket 16 connected to the slider 8. An encoder 13 is mounted on the servo motor 6 so that position control can be performed. By controlling the position of the servo motor 6, the height position of the pressure applying means 15 relative to the apparatus height can be adjusted. The measurement of the height position may be performed by the encoder 13 mounted on the servo motor 6 or may be performed by separately providing a linear sensor on the guide rail 10.

  The pressure applying means 15 is composed of a cylinder tube 33 of an air cylinder. The upper part of the chip holding means 17 is composed of a piston 34 and a rod 35 of the air cylinder, and is mounted so as to move up and down in the pressurizing application means 15. The chip holding means 17 is attached to the pressurizing application means 15 via a static pressure air bearing 18 generally called an air bearing. At the lower end of the chip holding means 17, a heater 11 as a heating means and a tool 2 for sucking and holding the chip 1 are provided. The tool 2 is provided with a chip suction hole 24 and holds the chip 1 by suction. The tool 2 can be exchanged according to the size of the chip 1 to be sucked and held. The substrate 5 is held by the substrate holding stage 4 having the substrate suction holes 25.

  The pressure applying means 15 has two air supply ports at the top and bottom. The upper air supply port is the pressurization port 19, and the lower air supply port is the balance pressure port 20. Air from the pump 30 is connected to the pressurizing port 19 through a pressure adjusting means 27a. The pressure adjusting unit 27 a controls the pressure of the pressurizing port 19 based on a signal from the pressurizing port pressure control unit 28. In addition, air from the pump 30 is connected to the balance pressure port 20 via a pressure adjusting means 27b. The pressure adjusting unit 27 b controls the pressure of the balance pressure port 20 based on the signal from the balance pressure port pressure control unit 29. Pressures P1 and P2 adjusted by pressure adjusting means 27a and 27b capable of controlling pressure are supplied from the pressure port 19 and the balance pressure port 20, respectively, and are supplied to the piston 34 of the chip holding means 17 by the differential pressure between the pressurized air. The applied pressure can be controlled. Therefore, weak pressure control can be performed on the chip 1 held by suction by the chip holding means 17. For example, it is possible to apply a weak pressure that does not damage the solder bump even when the solder bump of the chip 1 is heated and melted. When detecting the melting of the solder by the change in the applied pressure to the chip 1 or the change in the height of the chip 1, the pressure applied to the chip 1 is concentrated on the solder bump, so the solder bump may be damaged depending on the state of the applied pressure (bump crash). There is a risk that. For this reason, in the present invention, melting of solder can be detected while applying a weak pressure. An electro-pneumatic regulator or the like is used as the pressure adjusting means 27a and 27b.

  A position detecting means 23 (for example, an eddy current sensor or the like) is provided at the upper end position of the pressure applying means 17 to detect the position of the piston 34 of the tip holding means 17.

  A pressurization port pressure control means 28 and a balance pressure port control means 29 are connected to the drive control means 22, and pressure control of the pressurization applying means 15 is performed so that the set pressure is applied to the chip 1. The drive control unit 22 is connected to an expansion / contraction amount storage unit 31, a prediction control unit 32, and a position detection unit 23, which will be described later, and performs position control of the servo motor 6 of the Z-axis feeding device 3. Further, the expansion / contraction amount storage means 31 and the prediction control means 32 are connected so that data stored in the expansion / contraction amount storage means 31 can be transferred to the prediction control means 32.

  Next, data stored in the expansion / contraction amount storage unit 31 will be described.

  Prior to solder bonding of the chip 1 to the substrate 5, position change due to thermal expansion of the chip holding means 17 is measured in advance using the position detection means 23. First, the pressures of the pressure port 19 and the balance pressure port 20 are adjusted so that the chip holding means 17 has a predetermined applied pressure in a state where the chip 1 and the substrate 5 are not present (in a state where the chip 5 is not sucked and held). Next, the pressure applying unit 15 is lowered using the Z-axis feeding device 3 so that the tool 2 mounted on the lower end of the chip holding unit 17 contacts the substrate holding stage 4.

  Next, the heater 11 provided in the tool 2 is energized to raise the temperature to the set temperature, and the amount of single extension of the chip holding means 17 is measured by the position detection means 23 as the temperature rises. A plurality of measured values are stored in the expansion / contraction amount storage means 31 as a set of elongation amount and elapsed time. For example, as shown in FIG. 2A, there are a plurality of such as (elongation amount Lup1, elapsed time Tup1), (elongation amount Lup2, elapsed time Tup2),..., (Elongation amount Lupn, elapsed time Tupn). Are stored.

  Next, the heater 11 is turned off, and the amount of shrinkage accompanying cooling of the chip holding means 17 is measured by the position detection means 23 as the cooling time elapses. Similar to the measurement of the elongation amount, a plurality of points are stored in the expansion / contraction amount storage means 31 as a set of the shrinkage amount and the elapsed time. For example, as shown in FIG. 2 (b), a plurality of contraction amounts Ldw1, elapsed time Tdw1, (contraction amount Ldw2, elapsed time Tdw2),... Are stored.

  As described above, the expansion / contraction amount characteristic of the chip holding unit 17 is measured in advance and stored in the expansion / contraction amount storage unit. I can guess well. Therefore, when the chip 1 is soldered to the substrate 5, the position detection unit 23 detects the position of the chip holding unit 17 that moves inside the pressure applying unit 15 and determines the next operation based on the detection result. It does not have to be.

  The data stored in the expansion / contraction amount storage means 31 may be stored in advance by heating and cooling the tip holding means 17, but may be corrected based on the operator's knowledge, etc. Data may be entered individually.

  Next, the operation of the chip mounting apparatus will be described using the time chart shown in FIG. In FIG. 3, the time chart shown in FIG. 3A shows the height position with respect to the device height of the pressure applying means 15 in mounting the chip 1, and the lower end of the bump 1 a of the chip 1 is the electrode 5 a of the substrate 5. The reference height (h0 in FIG. 3) is the position in contact with. The time chart shown in FIG. 3B shows the position of the piston 34 of the tip holding means 17 inside the pressurizing means 15, and the lower end of the piston 34 of the tip holding means 17 is the pressurizing means. The position in contact with 15 is shown as the lower end position in the figure. In FIG. 3, a time chart shown in (C) shows ON / OFF timing of energization of the heater 11 of the tool 2. A time chart shown in FIG. 3D shows the pressure (load) applied to the bump 1 a of the chip 1 and the electrode 5 a of the substrate 5.

  In an initial state in which solder bonding between the chip 1 and the substrate 5 is about to start, the pressurizing means 15 is in the raised position (height h1 at the timing t0 in FIG. 3).

  Next, the set pressure command is issued from the drive control means 22 to the pressurization port pressure control means 28 and the balance pressure port pressure control means 29. Based on the command, the pressurizing port pressure control means 28 controls the pressure adjusting means 27a, the balance pressure port pressure control means 29 controls the pressure adjusting means 27b, and the set pressure moves inside the pressurizing application means 15. It acts on the piston 34 of the tip holding means 17. The pressure acting on the piston 34 is set to a weak pressure at which the bump is not damaged even when the solder bump is melted.

  Next, when the Z-axis feeding device 3 is operated based on a command from the drive control means 22, the pressurizing application means 15 is lowered integrally with the tool 2 that holds the chip 1 by suction. The bump 1a of the chip 1 comes into contact with the electrode 5a of the substrate 5 during the downward movement (t1 in FIG. 3).

  Further, the feeding of the pressurizing means 15 by the Z-axis feeding device 3 is continued, and the piston 34 of the tip holding means 17 rises relative to the pressurizing means 15 (from t1 to t2 in FIG. 3).

  Next, when the feed amount of the Z-axis feed device 3 reaches a preset value d1 (bump pushing amount), the descent of the pressurizing means 15 is stopped (t2 in FIG. 3).

  Next, the heater 11 of the tool 2 is energized to heat the bump 1a of the chip 1 to a temperature equal to or higher than the solder melting point. The Z-axis feeding device 3 is driven and controlled in accordance with the heating, and the pressure applying means 15 is raised. The drive control of the Z-axis feeding device 3 is performed as follows. First, the extension amount and elapsed time data of the chip holding means 17 stored in the expansion / contraction amount storage means 31 are transferred to the prediction control means 32. Next, the driving amount of the Z-axis feeding device 3 is calculated by the prediction control means 32 in accordance with the energization timing of the heater 11. Next, a calculation result is inputted from the prediction control means 32 to the drive control means 22, and the Z-axis feeding device 3 is driven based on a command from the drive control means 22.

  For this reason, the pressure applying means 15 rises based on the predicted value of the elongation of the chip holding means 17, so that the elongation of the chip holding means 17 due to the temperature rise of the heater 11 shown from t 2 to t 2 ′ in FIG. In the generated section, the position of the chip holding means 17 inside the pressure applying means 15 does not change. Subsequently, the Z-axis feeding device 3 is driven and controlled so that the chip 1 and the substrate 5 have a predetermined gap height after the solder is cooled, and the pressurizing means 15 is raised to a predetermined height (d3) (FIG. 3). (B) t2 ′ to t3).

  Thus, the gap height between the chip 1 and the substrate 5 after the solder cooling is performed at the stage where the pressurization applying means 15 is raised by driving and controlling the Z-axis feeding device from the start of energization of the heater 11 and the start of melting of the solder is monitored. Since the pressurizing means 15 is positioned on the surface, the pressurizing means 15 is added to the gap height between the chip 1 and the substrate 5 after detecting the melting of the solder. The moving time of the pressure applying means 15 can be shortened. Even if the position of the tip holding means 17 inside the pressure applying means 15 is not detected by the position detecting means 23, the prediction control means 32 is based on the data in the expansion / contraction amount storage means 31 and the extension amount of the tip holding means 17. This is because the Z-axis feeding device 3 is driven based on the predicted value.

  Thereafter, the melting of the bump 1a of the chip 1 is started, and the chip holding means 17 is lowered along with the melting (t4 in FIG. 3). When the position detecting unit 23 detects the lowering of the chip holding unit 17, the energization of the heater 11 is turned off after a predetermined time has elapsed (t5 in FIG. 3). As the energization of the heater 11 is turned off, the cooling of the chip holding means 17 is started and starts to shrink.

  Next, the Z-axis feeding device 3 is driven based on the predicted shrinkage value of the chip holding means 17, and the pressure applying means 15 is lowered. The drive control of the Z-axis feeding device 3 is performed by transferring the extension amount and elapsed time data of the chip holding means 17 stored in the expansion / contraction amount storage means 31 to the prediction control means 32, and the prediction control means 32 energizing the heater 11. After the driving amount of the Z-axis feeding device 3 is calculated in accordance with the OFF timing, the calculation result is input from the prediction control unit 32 to the driving control unit 22, and the Z-axis feeding device 3 is operated based on a command from the driving control unit 22. It is designed to be driven.

  When cooling of the chip holding means 17 is started in a state where the chip 1 is held by suction with the tool 2, the stress due to the shrinkage of the chip holding means 17 acts on the bump 1a of the chip 1 and the bump 1a is broken. there is a possibility. Therefore, as shown in FIG. 4, the Z-axis feeding device 3 is driven and controlled based on the predicted shrinkage value of the tip holding unit 17 to lower the pressurizing unit 15. By controlling the Z-axis feeding device 3 in this way, the bump 1a is prevented from being broken, and the gap after cooling the chip 1 and the substrate 5 can be maintained at a predetermined value d3.

  Next, after a predetermined time has passed since the heater 11 is turned off, the suction holding of the chip 1 is released, the Z-axis feeding device 3 is operated, and the pressurizing unit 15 is raised (t6 in FIG. 3). The timing for releasing the suction holding is performed based on the shrinkage amount and elapsed time data of the chip holding means 17 stored in the expansion / contraction amount storage means 31. If the chip 1 is sucked and held until the chip holding means 17 is cooled to the ambient temperature, the production tact time is extended. Further, when the suction holding of the chip 1 is released at the timing when the heater 11 is turned off, the shape of the bump 1a becomes unstable. Therefore, an optimum timing (timing at which the shape of the bump 1a is good and no breakage occurs) is selected from the shrinkage amount and elapsed time data of the chip holding means 17 stored in the expansion / contraction amount storage means 31, and the chip holding means. The suction holding of the chip 1 by 17 is released.

  With the above operation, a series of solder joints between the chip 1 and the substrate 5 is completed.

  Thus, the amount of expansion and contraction of the chip holding means 17 is stored in advance in the expansion / contraction amount storage means 31, and the chip holding means is used when the actual chip 1 and the substrate 5 are soldered together based on the stored value. 17 is predicted by the prediction control means 32 and a correction command is input to the drive control means 22 to control the height position of the pressure applying means 15. Therefore, the production tact time can be made shorter than the position of the chip holding means 17 inside the pressure applying means 15 is detected by the position detection signal and the pressure applying means 15 is operated based on the detection result.

  In the present invention, the chip 1 refers to an object to be bonded to the substrate 5, for example, an IC chip, a semiconductor chip, an optical element, a surface mount component, a wafer or the like regardless of the type or size. In addition, the substrate 5 refers to a target object to be bonded to the chip 1 regardless of the type or size.

  The means for holding (or supporting) the substrate 5 on the upper surface of the substrate holding stage 4 includes suction holding means by the substrate suction holes 25, electrostatic holding means by static electricity, magnetic holding means by magnets and magnetism, and a plurality of movable claws. It may be any form of holding means, such as mechanical means for gripping the substrate by means of, or mechanical means for holding the substrate by one or more movable claws.

  Further, the substrate holding stage 4 may be provided in either a fixed type or a movable type as required, and in the case of being provided in the movable type, parallel movement control, rotation control, elevation control, parallel movement control. And rotation control, parallel movement control and elevation control, rotation control and elevation control, parallel movement control and rotation control and elevation control, and the like.

  The bumps 1a provided on the chip 1 are objects to be bonded to electrodes 5a (for example, electrodes, dummy electrodes, etc.) provided on the substrate 5, such as solder bumps and stud bumps. Further, the electrode 5a provided on the substrate 5 is bonded to bumps 1a (for example, solder bumps, stud bumps, etc.) provided on the chip 1, such as electrodes with wiring, dummy electrodes not connected to the wiring, etc. This refers to the object of the opponent to be used.

  The feed mechanism 7 and the Z-axis feed device 3 may be of any type as long as the slider 8 can be moved, such as a ball screw type or a linear motor type.

  The chip mounting apparatus in the present invention refers to, for example, a substrate and a chip, a substrate and an adhesive (ACF (Anisotropic Conductive Film), NCF (Non Conductive Film) etc.), etc., which have been previously brought into contact with each other (mounted or provisional press-bonded, etc.) or fixed by pressing, heating and / or vibration means (ultrasonic, piezo element, magnetostrictive element, voice coil, etc.) A broad concept device including a transfer device.

  In the above-described embodiment, the tool 2 is lowered while the chip 1 is held on the tool 2 and the chip 1 is pressed against the substrate 5. However, the present invention is not limited to this. For example, the chip may be mounted on the substrate in advance using an adhesive or the like, and a tool not holding the chip may be lowered to press the chip on the substrate. In this case, when the tool comes into contact with a chip mounted on the substrate in advance, the tool and the chip overlap and come into contact with the substrate.

  Moreover, it is not limited to attaching the tool 2 directly to the lower end of the chip | tip holding | maintenance means 17, If necessary, you may interpose a load cell.

  Further, the position detecting means 23 is not limited to the eddy current sensor, but may be other sensors (laser, optical sensor, etc.).

  Further, when the pressurizing force is high, the pressurizing force may be controlled only by the pressurizing port without using the balance pressure port. Further, the position detection means 23 is not limited to measuring the height position of the tip holding means 17 by detecting the height position of the piston 34 of the tip holding means 17 but directly detecting the height position of the tool 2. It may be mounted so as to be able to.

  In the embodiment, the heater 11 as the heating unit is provided at the lower end of the chip holding unit 17, but the heater 11 may be provided in the substrate holding stage 4. Any configuration is possible as long as the chip 1 and the substrate 5 can be efficiently heated, and the position detection means 23 can detect the elongation in the Z-axis direction due to the thermal expansion of the tool 2 accompanying the heating. Furthermore, heaters may be provided on both the tool 2 side and the substrate holding stage 4 side. As a result, heating of the chip 1 and the substrate 5 can be performed in a short time, and if the heating is further performed by a pulse heater using a ceramic heater, it is possible to raise the temperature with good responsiveness.

It is a front view of the chip mounting apparatus which concerns on embodiment of this invention. It is a graph which shows the amount of expansion | extension and shrinkage | contraction of a chip | tip holding means. It is an operation | movement time chart of the chip mounting apparatus which concerns on embodiment of this invention. It is the figure which showed the state which follows the amount of shrinkage | contraction of a chip | tip holding | maintenance means, and pressurizes an application means. It is a front view of the conventional chip mounting apparatus. It is an operation | movement time chart of the conventional chip mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip 1a Bump 2 Tool 3 Z-axis feeding device 4 Substrate holding stage 5 Substrate 5a Electrode 6 Servo motor 7 Feeding mechanism 8 Slider 9 Device frame 10 Guide rail 11 Heater 13 Encoder 15 Pressurizing means 16 Bracket 17 Chip holding means 18 Static Pressure Air Bearing 19 Pressurization Port 20 Balance Pressure Port 22 Drive Control Means 23 Position Detection Means 24 Chip Adsorption Hole 25 Substrate Adsorption Hole 28 Pressurization Port Pressure Control Means 29 Balance Pressure Port Pressure Control Means 30 Pump 31 Expansion / contraction Amount Storage Means 32 Prediction Control means 33 Cylinder tube 34 Piston 35 Rod 27a, 27b Pressure adjusting means

Claims (4)

Chip holding means for sucking and holding the chip, pressure applying means for applying pressure to the chip holding means and supporting the chip holding means, and drive control means for moving the pressure applying means in the apparatus height direction; A chip mounting apparatus for soldering the bumps of the chip to the electrodes of the substrate disposed at a position facing the chip,
Predicting the amount of extension of the chip holding means from the heating of the chip holding means to the melting of the bumps of the chip, and applying a correction command to the drive control means based on the predicted value of the elongation of the chip holding means to apply pressure A chip mounting apparatus provided with predictive control means for controlling the height position of the chip. In the invention of claim 1,
The prediction control means predicts the amount of shrinkage of the chip holding means when the heating of the chip holding means is further stopped, and inputs a correction command to the drive control means based on the predicted shrinkage value of the chip holding means and pressurizes A chip mounting apparatus which is a prediction control means for controlling the height position of the applying means. In the invention according to claim 1 or 2,
The pressure applying means is a cylinder tube, and the tip holding means is composed of a piston and a rod that move inside the cylinder tube, and is supplied to the piston by air supplied from air supply ports provided above and below the cylinder tube. A chip mounting device that can adjust the weak pressure that acts. In the invention according to any one of claims 1 to 3,
The tip holding means is heated and stopped in advance, the amount of movement of the tip holding means moving inside the pressurizing means is measured as the amount of expansion / contraction, and the amount of expansion / contraction is stored in the amount of expansion / contraction storage means. A chip mounting apparatus having a configuration in which a correction command input from the prediction control unit to the drive control unit is calculated based on the expansion / contraction amount stored in the expansion / contraction amount storage unit.

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