JP6577764B2 - Pressure heating / cooling apparatus, flip chip mounting apparatus, flip chip mounting method, and semiconductor device manufacturing method - Google Patents

Description

  The present invention is, for example, a pressure heating / cooling device, a flip chip mounting device, a flip chip mounting method, and a semiconductor manufactured by the mounting method, which are suitable for application to a head portion of a flip chip mounting device for performing flip chip mounting. Relates to the device.

  For semiconductor assembly, when the LSI terminal array is a Peripheral arrangement, mainly wire bonding using gold wires (hereinafter referred to as WB mounting), and in the Area arrangement, flip chip mounting represented by C4 (Controlled Collapse Chip Connection) FC implementation) is used.

  However, in recent years, WB mounting, in which signal waveforms are likely to be disturbed due to high-speed signal generation, may impede LSI performance, and the demand for FC mounting is increasing.

  In C4 mounting, flip-chip mounting machines (hereinafter referred to as “chip positioning”, “pressing”, “heating” and “cooling” functions) are used for mounting LSIs with terminals with pitches of 100 μm or less. , FC mounting is performed to perform soldering, gold-Sn bonding, etc. using FC-Bonder (see Patent Document 1 and FIG. 6).

  However, since the FC-Bonder having both the mounter and reflow furnace functions used in C4 is expensive, high productivity is required. Therefore, it is necessary to shorten the required time by rapid heating / cooling.

  As a countermeasure for the above, a proposal has been made to reduce the heating time by providing a recess in the heater holder before pressurization to prevent escape of heat to the holder (see Patent Document 1 and FIGS. 1 to 4).

  Also, the importance of not damaging LSIs that are becoming composite materials such as High-K materials and Low-K materials is increasing.

JP 11-135573 A

  However, with the conventional FC-Bonder head structure (heater + tool integrated type: see Patent Document 1 and FIG. 6), the heater and the tool are cooled during cooling, so that the solder and adhesive at the joint are cooled via the LSI. Therefore, at the same time as the cooling time becomes long, the heater needs to be heated from the cooling state at the next heating, and it is difficult to shorten the processing time.

  In addition, when cooling after heating, there is a problem that the tool or ceramic block body thermally contracts, resulting in a large joint gap, tensile stress applied to the joint, and destruction of the solder joint in some cases. It was.

  In view of such circumstances, the present invention can shorten the heating / cooling cycle, minimize the influence on the bonding quality due to the heat shrinkage at the time of cooling, the pressure heating cooling apparatus, the flip chip mounting apparatus, and the flip chip mounting method. Another object of the present invention is to provide a semiconductor device manufactured by the mounting method.

  An aspect of the present invention that solves the above-described problems includes a first positioning / moving unit including a first fixed unit and a first movable unit, and a vertical positioning / moving unit provided on the first movable unit of the first positioning / moving unit. Provided in the moving part, the second positioning / moving means provided in the moving part and provided with a second fixed part and a second movable part, and provided in the second movable part of the second positioning / moving means in the vertical direction. A head part that is positioned and moved, a bottom dead center defining member that serves as a reference for a lower end position of the head part, provided in the second fixing part of the second positioning and moving means, and provided in the head part. A third positioning / moving means including a fixed portion and a third movable portion; a tool provided on the head portion and holding a component on a lower surface; a support portion provided on the head portion and supporting the tool; and the head Provided in the department, A cooling unit that cools the tool, and a heating unit that is provided on the head unit and heats the tool, and the third fixing unit of the third positioning moving unit is fixed to the support unit, The heating unit is fixed to the third movable unit, and is movable so as to abut on or separate from the tool by the third positioning moving unit. The second positioning moving unit moves the head unit below the head unit. The pressurizing heating / cooling device can be set so as to contact the dead center defining member with a predetermined load in a downward direction.

  In such an aspect, the head portion is supported by the second positioning moving means in contact with the bottom dead center defining member with a predetermined load, and the downward movement from the contact position with respect to the bottom dead center defining member is restricted. Thus, the tool can be heated in the heating section, and the pressure heating / cooling of the component can be performed without changing the gap below the component. Moreover, since a heating part can be spaced apart from a tool at the time of cooling after heating, cooling can be accelerated | stimulated and a heating part can be made to stand by in a preheating state.

  According to a second aspect of the present invention, in the pressurized heating / cooling device according to the first aspect, the second positioning moving means is a voice coil motor or an actuator.

  In such an aspect, it is possible to relatively easily realize a state in which the head portion is in contact with and supported by the bottom dead center defining member with a predetermined load.

  According to a third aspect of the present invention, in the pressure heating / cooling device according to the first or second aspect, the third positioning moving means is a voice coil motor or an actuator.

  In this aspect, the contact or separation of the heating unit with the tool can be realized relatively easily in a small space.

  According to a fourth aspect of the present invention, in the pressurized heating and cooling apparatus according to any one of the first to third aspects, the cooling means is a cooling apparatus by gas injection.

  In this aspect, the tool can be cooled without taking up space.

  According to a fifth aspect of the present invention, the tool is fixed to a lower end portion of the head portion, and a contact surface of the head portion with the bottom dead center defining member is substantially flush with a lower surface of the tool. The pressure heating / cooling device according to any one of the first to fourth aspects is characterized.

  In this aspect, since there are only parts below the bottom dead center defining member that defines the downward movement position of the head portion, the downward movement of the component due to thermal expansion and contraction of the tool and the support portion is the supportable portion defining member. Therefore, it is possible to prevent the parts from moving due to thermal expansion and contraction of the tool and the support portion.

  According to a sixth aspect of the present invention, there is provided a flip chip mounting apparatus comprising the pressure heating / cooling device according to any one of the first to fifth aspects.

  In such an aspect, the head portion is supported in a float state in which the head portion is in contact with the bottom dead center defining member with a predetermined load by the second positioning moving means, and the head portion is moved downward from the contact position with the bottom dead center defining member. In this state, the tool can be heated in the heating section, and the device that can perform flip chip mounting by pressurizing and cooling the component without changing the gap below the component is realized. it can. Moreover, since the heating part can be separated from the tool after cooling after heating, the cooling can be promoted and the heating part can be kept in a preheated state, so that the mounting cycle can be shortened. .

  According to a seventh aspect of the present invention, there is provided a first positioning / moving means having a first fixed portion and a first movable portion, and a first positioning / moving portion of the first positioning / moving means which is positioned and moved in the vertical direction. A moving part, a second positioning / moving means provided on the moving part and provided with a second fixed part and a second movable part, and a second moving part of the second positioning / moving means provided on the second movable part for positioning in the vertical direction. And a bottom dead center defining member that serves as a reference for the lower end position of the head portion, and a third fixing portion that is provided on the head portion. And a third positioning / moving means having a third movable part, a tool provided on the head part and holding a component on the lower surface, a support part provided on the head part and supporting the tool, and a head part. Provided and cooled the tool A cooling unit provided on the head unit, and a heating unit configured to heat the tool. The third fixing unit of the third positioning moving unit is fixed to the support unit, and the heating unit is provided. Is fixed to the third movable part and is movable so as to abut against or separate from the tool by the third positioning movement means, and the second positioning movement means moves the head part to the bottom dead center. A holding step for holding a mounting component to be mounted on a mounting board on the tool using a flip-chip mounting device, which can be set so as to contact the member downward with a predetermined load, and the second positioning movement An abutting step for setting the head portion in a state of abutting downward with a predetermined load on the bottom dead center defining member by means, and the moving portion is defined by the first positioning moving means on the bottom dead center defining member Where The mounting board terminal and the mounting component terminal are brought into contact with each other via bumps, and the head portion is spaced apart from the bottom dead center defining member upward by a predetermined distance. A lowering step, a heating step of heating the mounting component by the heating unit in contact with the tool by the third positioning movement means after the lowering step, and a terminal of the mounting board by the heating step And a melting step in which the bump melts the terminal of the mounting component so that the head portion is in contact with the bottom dead center defining member, and after the melting step, the heating unit is moved by the third positioning moving means. A cooling step of separating the mounting component from the tool and cooling the mounting component by the cooling means, and after the cooling step, releasing the holding of the mounting component by the tool and the first position In flip-chip mounting method characterized by carrying out, and increasing step of separating the head portion from the mounting board on which the mounting part is raised the mobile unit by order moving means.

  In such an aspect, the head portion is supported by the second positioning moving means in a state in which the head portion is in contact with the bottom dead center defining member with a predetermined load, and the downward movement from the contact position with respect to the bottom dead center defining member is restricted. In this state, the terminal of the mounting board and the terminal of the mounting component are brought into contact with each other via the bump, and the head portion is spaced apart from the bottom dead center defining member by a predetermined distance. By heating the mounting component with the heating part in the contact state, the bump between the terminal of the mounting substrate and the terminal of the mounting component is melted and the head part is lowered, but it contacts the bottom dead center defining member. It stops at the position where it has been placed, and a predetermined gap can be maintained for mounting. Moreover, since it can cool in the state which separated the heating part after the heating, the cooling time of a mounting cycle can be shortened, and the heating part can be made to stand by in a preheating state.

  According to an eighth aspect of the present invention, in the lowering step, the first lowering step of lowering the moving part until the terminal of the mounting substrate and the terminal of the mounting component abut via the bump, and the first After the descending step, the bottom dead center defining portion is set so that a gap between the terminal of the mounting board and the terminal of the mounting component becomes a predetermined size in a state where the head portion is in contact with the bottom dead center defining member. And a second lowering step of lowering the moving part until the position of the member reaches a predetermined position.

  In this aspect, the moving part is lowered until the terminal of the mounting board and the terminal of the mounting component are in contact with each other via the bump, and then the gap is adjusted by precisely moving, thereby shortening the time of the lowering process. be able to.

  A ninth aspect of the present invention is characterized in that, prior to the heating step, a preheating step is performed in which the heating portion is brought into contact with the tool and preheated by the third positioning movement means. In the flip-chip mounting method according to the seventh or eighth aspect.

  In this aspect, the mounting cycle can be shortened by executing the preheating step.

  According to a tenth aspect of the present invention, in the flip-chip mounting method according to any one of the seventh to ninth aspects, the bump is a solder bump provided on a terminal of the mounting substrate.

  In such an aspect, the mounting component can be mounted on the mounting substrate having the solder bumps.

  An eleventh aspect of the present invention resides in a semiconductor device manufactured by the flip chip mounting method according to any one of the seventh to tenth aspects.

The figure which shows typically the flip chip mounting apparatus provided with the pressurization heating cooling device of one Embodiment. The principal part enlarged view which shows operation | movement of a flip chip mounting apparatus. The principal part enlarged view which shows operation | movement of a flip chip mounting apparatus. The principal part enlarged view which shows operation | movement of a flip chip mounting apparatus. The principal part enlarged view which shows operation | movement of a flip chip mounting apparatus. Timing chart showing tool temperature, tool position, and load status.

  FIG. 1 is a diagram schematically illustrating a flip chip mounting apparatus including a pressure heating / cooling apparatus according to an embodiment. As shown in FIG. 1, for example, a first positioning / moving means 10 using a ball screw moving mechanism is provided, and the first positioning / moving means 10 includes a first fixed portion 11 and a first movable portion 12, and a motor. By rotating the first fixed portion 11, which is a ball screw, by 13, the first movable portion 12, which is a nut portion, can be positioned and moved with respect to the first fixed portion 11 in the vertical direction.

  A moving unit 20 is fixed to the first movable unit 12, and the moving unit 20 can be positioned and moved together with the first movable unit 12 in the vertical direction.

  The moving unit 20 includes, for example, a second positioning / moving unit 30 using a voice coil motor (hereinafter referred to as VCM), and the second positioning / moving unit 30 is a second fixed unit fixed to the first movable unit 12. 31 and a second movable portion 32 that can be positioned and moved in the vertical direction with respect to the second fixed portion 31. Here, as will be described in detail later, the second fixed portion 31 is provided with a bottom dead center defining member 21 that defines the lowermost end moving position of the second movable portion 32.

  A head portion 40 is provided at the lower end of the second movable portion 32. The head portion 40 includes a support portion 41 fixed to the second movable portion 32, a tool 42 supported by the lower end portion of the support portion 41, a third positioning / moving means 50 provided on the support portion 41, and a tool 42. And a cooling means 44 which is a cooling device by gas injection for injecting air, nitrogen or the like to the tool 42.

  Here, the support part 41 is provided so that the 3rd positioning movement means 50 and the heating part 43 may be enclosed, and the tool 42 is being fixed to the lower end part. The third positioning / moving means 50 provided inside the support portion 41 is, for example, a voice coil motor (hereinafter referred to as VCM), and includes a third fixed portion 51 and a third movable portion 52, and the third fixed portion. 51 is fixed to the support portion 41, and the third movable portion 52 can be positioned and moved with respect to the third fixed portion 51. Further, the heating unit 43 is fixed to the third movable unit 52, and the heating unit 43 can be positioned and moved with respect to the third fixed unit 51 fixed to the support unit 41. As a result, the heating unit 43 is movable so as to contact or separate from the tool 42 provided on the support unit 41.

  The tool 42 includes a mechanism for holding the mounting component 60. In the present embodiment, the mounting component 60 can be sucked and held by vacuum suction, and the passage 42a for evacuation includes a vacuum pump (not shown) or the like. Connected to suction means. Note that the holding mechanism of the mounting component 60 is not limited to this, and electrostatic adsorption or the like may be employed.

  The tool 42 is provided at the lower end portion of the support portion 41, and the lower surface of the support portion 41 and the lower surface of the tool 42 are in substantially the same position. Actually, the lower surface of the tool 42 is configured to protrude slightly downward from the lower surface of the support portion 41. This is to ensure a clearance for securely holding the mounted component 60 by suction. . Therefore, the lower surface of the tool 42 is said to be substantially in the same position including the case where the lower surface of the tool 42 slightly protrudes from the lower surface of the support portion 41 for such purposes. Of course, as will be described in detail later, if the influence of the thermal expansion and contraction of the tool 42 on the mounting is allowed, the tool 42 is provided on the lower surface of the support portion 41, and the entire tool 42 is below the lower surface of the support portion 41. You may make it protrude to the side.

  In the present embodiment, the bottom surface of the support part 41 is in contact with the bottom dead center defining surface 21a of the bottom dead center defining member 21. Thereby, the head part 40 fixed to the 2nd movable part 32 cannot move below the position where the lower surface of the support part 41 contact | abutted the bottom dead center prescription | regulation surface 21a. The contact with the bottom dead center defining surface 21a is preferably at the same position as the lower surface of the tool 42 in order to minimize the influence on mounting due to thermal expansion and contraction, which will be described later. It is made to contact | abut with the lower surface of the support part 41. FIG.

  Here, the first positioning / moving means 10 can move the moving part 20 in the vertical direction together with the first movable part 12, but the first positioning / moving means 10 is the first relative to the first fixed part 11. A position sensor (not shown) for detecting the position of the movable part 12 is provided, and a load cell (not shown) for detecting a force acting from below on the downward movement of the first movable part 12 is provided. Specifically, when the first positioning / moving means 10 positions and moves the first movable portion 12 downward, the mounting component 60, which is the lower end of the moving portion 20, comes into contact with the lower mounting substrate or the like and has a predetermined load. High-speed control can be performed to move until the above action is detected. In addition, it is possible to perform precise control for precisely positioning and moving so that the position of the bottom dead center defining surface 21a of the bottom dead center defining member 21 is a predetermined position.

  In addition, although the 1st positioning movement means 10 illustrated the thing by a ball screw mechanism, it is not limited to this, The thing by the actuator mechanism driven by liquids, such as air, such as air, oil, such as an air cylinder or an oil cylinder, or A voice coil motor or the like may be employed and is not particularly limited. It is preferable to use a voice coil motor in terms of miniaturization and accuracy.

  In addition, the voice coil motor constituting the second positioning / moving means 30 and the third positioning / moving means 50 includes, for example, a second fixed portion 31 and a third fixed portion 51 that are configured by a yoke containing a magnet, and a second movable portion. The part 32 and the third movable part 52 are composed of coils, and are configured to be able to position and move the coils by controlling the energization current to the coils existing in the magnetic field formed by the magnets. The voice coil motor includes a type in which a magnet serving as a movable portion moves in a magnetic field generated by a yoke and a coil, and the configuration is not particularly limited.

  Further, the second positioning movement means 30 and the third positioning movement means 50 are position detection sensors (not shown) that detect the position of the second movable part 32 or the third movable part 52 with respect to the second fixed part 31 or the third fixed part 51. The second movable part 32 or the third movable part 52 can be positioned and moved.

  Further, the second positioning / moving means 30 includes a load cell 33 that detects a force acting on the second movable portion 32, and the force acting on the second movable portion 32 from below to above is within a predetermined value. In other words, the second movable portion 32 can be positioned and moved so that the load with which the head portion 40 fixed to the second movable portion 32 presses the bottom dead center defining member 21 downward is within a predetermined value. It has become.

  The third positioning / moving means 50 also includes a load cell 53 that detects a force acting on the third movable portion 52, and the force acting on the third movable portion 52 from below to above is within a predetermined value. That is, in other words, the heating unit 43 is brought into contact with the tool 42 so that the load with which the heating unit 43 fixed to the third movable unit 52 presses the tool 42 downward is within a predetermined value. . Note that such a mechanism is not necessarily provided.

  The second positioning / moving means 30 and the third positioning / moving means 50 are not limited to the voice coil motor, but are based on a ball screw mechanism or an actuator mechanism driven by a gas such as air or a liquid such as oil. However, the present invention is not limited to this. However, the present invention is not limited to this. The actuator is driven by a gas such as air or a liquid such as oil, such as an air cylinder or an oil cylinder, or a voice. A coil motor or the like may be employed and is not particularly limited. However, the third positioning / moving means 50 preferably employs a voice coil motor for reasons such as small size and light weight and ensuring accuracy.

  The heating unit 43 may be an electric heater, but is not limited to this, and is not particularly limited, such as an electromagnetic induction heater, a ceramic heater, or an infrared heater.

  Further, the cooling means 44 is not limited to that by gas injection, and a Peltier element, a water cooling mechanism, or the like may be adopted as long as it is allowed in space.

  The first positioning / moving means 10, the second positioning / moving means 30, the third positioning / moving means 50, the heating unit 43, and the cooling unit 44 are controlled by the control unit 70.

  Hereinafter, an example of a flip chip mounting method using the above-described flip chip mounting apparatus will be described with reference to FIGS.

  First, as shown in FIG. 2A, a holding process is performed in which the tool 42 is evacuated and the mounting component 60 including the terminals 61 is sucked and held on the lower surface of the tool 42. In addition, the mounting substrate 80 is placed below the mounting component 60. The mounting substrate 80 includes terminals 81, and solder bumps 82 are provided on the terminals 81.

  Next, as shown in FIG. 2 (b), the second positioning and moving means 30 causes the head portion 40 to move with respect to the bottom dead center defining surface 21 a of the bottom dead center defining member 21 with a predetermined load (hereinafter referred to as a first predetermined load). For example, the state in which the load is lowered downward with a load of 5 g to 15 g, that is, the second movable portion 32 and the head portion 40 apply a load exceeding a predetermined load of 5 g to 15 g from the lower portion to the upper portion. If it receives, it sets so that it may be in the float state which moves upwards with respect to the bottom dead center prescription | regulation surface 21a. The process of setting the second movable part 32 and the head part 40 to the float state by the second positioning and moving means 30 in this way is referred to as a contact process. That is, after this contact step, the second movable portion 32 and the head portion 40 are given buoyancy as an upward load by the second positioning and moving means 30, and (self weight-buoyancy) = first predetermined load. It has become. Here, the first predetermined load minimizes damage to the LSI or the like in which the terminal 61 applies a large load to the solder bump 82 and is connected to the solder bump 82 when the first descending step described later is performed. In order to suppress it, it is set to a small value of about 5 to 15 g. Note that this step may be performed during or after the lowering step shown in FIG.

  Next, as shown in FIG. 3A, the heating unit 43 is moved downward by the third positioning and moving means 50, and the heating unit 43 is brought into contact with the tool 42 with a predetermined load (referred to as a second predetermined load). Let In addition, the heating unit 43 is preheated to a preheated state, for example, 50 to 180 ° C. to prepare for the heating described above. In addition, what is necessary is just to perform the contact | abutting to the tool 42 of this heating part 43, and a preheating process before the heating process mentioned later. The second predetermined load may be anything as long as the heat of the heating unit 43 is transmitted to the tool 42.

  In this state, next, as shown in FIG. 3 (b), the head unit 40 is moved together with the first movable unit 12 by the first positioning / moving unit 10 with high-speed control, and is provided at the lower end of the head unit 40. A first lowering process is performed in which the terminals 61 of the mounting component 60 move until they contact the solder bumps 82 of the mounting substrate 80. This first descending step is completed when the terminal 61 detects the contact with the solder bump 82 by the load detecting means built in the first positioning moving means 10. Since the load cell 33 of the second positioning / moving means 30 detects a load greater than or equal to the first predetermined load due to the contact of the terminal 61 with the solder bump 82, the head unit 40 has the bottom dead center of the bottom dead center defining member 21. From the defined surface 21a, it is in a floating state although it is so small that it cannot be seen.

In this state, the position of the bottom dead center defining surface 21a is P _1, the position of the lower surface of the terminal 61 is Q _1.

Next, as shown in FIG. 4A, the first positioning moving means 10 moves the moving unit 20 together with the first movable unit 12 with fine control, and the position of the bottom dead center defining surface 21a of the bottom dead center defining member 21 Then, the second lowering step is performed in which the gap between the terminal 61 and the terminal 81 in the ideal mounting state is lowered to a position where the gap becomes a predetermined gap. In this case, the bottom dead center defining surface 21a is moved by _{L 1} from _{P 1} to _{P 2.}

At this time, the second movable portion 32 and the head portion 40 does not move, the bumps 82 and solder terminal 61 remains in the state in contact with at the location of Q _1, the lower surface of the head portion 40 of the P ₁ the position, the gap is a gap between the terminal 61 and the terminal 81 is G _1.

Here, the position P ₂ of the bottom dead center defining surface 21a of the bottom dead center defining member 21, the gap between the terminal 61 and the terminal 81 when the lower surface of the head portion 40 is in contact with the bottom dead center defining surface 21a is, It is set to be a predetermined gap (G _{2 in} FIG. 4B).

  Note that the first lowering step is not necessarily implemented, and the position of the bottom dead center defining surface 21a of the bottom dead center defining member 21 may be moved to a predetermined position by precise control of the second positioning moving means 30.

  Next, as illustrated in FIG. 4B, a heating process is performed in which the heating unit 43 is controlled to a heating state in which the solder bumps 82 are melted from preheating, for example, 240 to 260 ° C. Thereby, the solder bump 82 is heated and melted, and the melting process is executed.

At this time, since the solder bump 82 receives the first predetermined load described above from the terminal 61 of the mounting component 60, the mounting component 60 gradually moves downward together with the head portion 40 and the second movable portion 32. At this time, since the first predetermined load is as small as about 5 to 15 g, the solder bump 82 does not drop rapidly due to melting, so that the shape of the solder bump after melting becomes an ideal shape. Also, the movement to the lower surface of the head portion 40 abuts the bottom dead center defining surface 21a, i.e., the position of the lower surface of the head portion 40 is P ₂ from P _1, the lower surface position of the terminal 61 is Q ₁ from is up to _{Q 2,} the moving distance is _{L 1.} Thus, the gap between the terminal 61 and the terminal 81 becomes a predetermined gap _{G 2} from _{G 1.}

  In this heating / melting step, even if the tool 42, the heating unit 43, and the support unit 41 are thermally expanded, the lower surface of the head unit 40 is in contact with the bottom dead center defining surface 21a of the bottom dead center defining member 21. Therefore, the influence of thermal expansion acts only upward, so that there is no influence on the gap between the terminal 61 and the terminal 72.

  As described above, when the solder bump 82 is melted, the load received from the terminal 61 is set to the first predetermined load and is low and constant, and the lower limit value is regulated by the bottom dead center defining member 21. Further, since there is no influence of thermal expansion, the gap between the terminal 81 and the terminal 61 becomes a target gap, and the solder bump 82 becomes an ideal molten solder 82a.

  The first predetermined load is 5 g to 15 g. However, the first predetermined load is not limited to this, and may be a larger load. The first predetermined load in the lowering process and the first predetermined load in the melting process may be different. It may be. Further, as described above, the first predetermined load is a value obtained by subtracting the buoyancy received from the second positioning / moving means 30 from its own weight. However, the first predetermined load should be received downward from the second positioning / moving means 30. Thus, it is possible to make the load greater than its own weight obtained by adding a predetermined load to its own weight.

  Next, as shown in FIG. 5A, the heating unit 43 is changed from the heated state to the preheated state, and the heating unit 43 is moved upward by the third positioning moving unit 50 and separated from the tool 42. In addition, a cooling process is performed in which cooling air is injected from the cooling means 44 to cool the tool 42, the mounting component 60, and the mounting substrate 80.

  At this time, since the heating unit 43 is separated from the tool 42, the tool 42 and the molten solder 82a are rapidly cooled, the heating is stopped while the heating unit 43 is kept in contact with the tool 42, and a cooling process is performed. As a result, the mounting cycle can be significantly shortened.

  In addition, since the heating unit 43 can be kept in a preheated state without being completely stopped, the time until the next mounting cycle can be shortened. Needless to say, the heating unit 43 may be in a preheated state in a state of being separated from the tool 42, not in a preheated state, and in a preheated state in preparation for the next mounting cycle at a predetermined timing.

  Further, in the cooling process, even if the tool 42, the heating unit 43, and the support unit 41 contract, the lower surface of the head unit 40 is in contact with the bottom dead center defining surface 21 a of the bottom dead center defining member 21. Since the effect acts only above the bottom dead center defining surface 21a of the bottom dead center defining member 21, there is no effect on the gap between the terminal 61 and the terminal 81. Does not occur.

  Finally, as shown in FIG. 5B, the mounting component 60 is separated from the tool 42, and the moving unit 20 is moved upward by the first positioning moving unit 10.

FIG. 6 is a timing chart showing the tool temperature of the tool 42, the tool position corresponding to the position of the terminal 61, and the state of the load acting on the terminal 61 in the mounting process described above. As shown in FIG. 6, the region (A) is the first descending step, and the tool position is stopped in a state where the terminal 61 is in contact with the solder bump 82. After that, even if the second lowering step is performed and the bottom dead center defining member 21 is moved downward, the tool position remains unchanged because the terminal 61 is in contact with the solder bump 82. In this state, a first predetermined load is applied to the terminal 61. Region (B) is a heating step. When the tool temperature rises to a predetermined temperature, the solder bumps 82 are melted at a predetermined timing, and the movement of the head portion 40 of the terminal 61 is regulated by the bottom dead center defining member 21. moves by _{L 1} down to the (point (C)). Region (D) is a cooling step, and region (E) is an ascending step. After the tool position has moved to the position defined by the bottom dead center defining member 21 at point (C), the position of the terminal 61 remains unchanged in the subsequent heating / melting process and cooling process.

  In the flip chip mounting method exemplified in the above-described embodiment, the bumps are provided on the mounting substrate side, but may be provided on the mounting component side, and the bumps are not limited to solder, but tin, tin alloy Gold or the like may be used and is not particularly limited.

  The pressure heating / cooling device of the flip chip mounting apparatus of the above-described embodiment is not limited to the flip chip mounting apparatus, and can be used for other purposes. For example, application to semiconductor mounting, optical component mounting such as a lens (lens fixing with an adhesive), and the like can be considered.

G ₂ predetermined gap P ₂ position 10 first positioning moving means 11 first fixed portion 12 first movable portion 13 motor 20 moving portion 21 bottom dead center defining member 21a bottom dead center defining surface 30 second positioning moving means 31 second fixed Part 32 Second movable part 33 Load cell 40 Head part 41 Support part 42 Tool 42 Heating part 42a Passage 43 Heating part 44 Cooling means 50 Third positioning movement means 51 Third fixed part 52 Third movable part 53 Load cell 60 Mounting component 61 Terminal 70 Control Unit 72 Terminal 80 Mounting Board 81 Terminal 82 Solder Bump

Claims (10)

First positioning movement means comprising a first fixed part and a first movable part;
A moving part that is provided in the first movable part of the first positioning moving means and is positioned and moved in the vertical direction;
A second positioning / moving means provided in the moving part, comprising a second fixed part and a second movable part;
A head portion provided in the second movable portion of the second positioning movement means and positioned and moved in the vertical direction;
A bottom dead center defining member provided at the second fixed portion of the second positioning and moving means and serving as a reference for the lower end position of the head portion;
A third positioning / moving means provided on the head portion, and comprising a third fixed portion and a third movable portion;
A tool provided on the head portion for holding the component on the lower surface;
A support portion provided on the head portion and supporting the tool;
A cooling means provided on the head portion for cooling the tool;
A heating unit provided in the head unit for heating the tool;
Comprising
The third fixing portion of the third positioning moving means is fixed to the support portion;
The heating unit is fixed to the third movable unit, and is movable so as to contact or separate from the tool by the third positioning movement unit,
It said second positioning means for moving Ri settable der to abut downward direction at a predetermined weight the head portion relative to the bottom dead center defining member,
The tool is fixed to the lower end portion of the head portion, and the contact surface of the head portion with the bottom dead center defining member is substantially flush with the lower surface of the tool.
A pressure heating and cooling apparatus characterized by the above.   2. The pressurized heating / cooling device according to claim 1, wherein the second positioning / moving means is a voice coil motor or an actuator.   3. The pressurized heating / cooling device according to claim 1, wherein the third positioning / moving means is a voice coil motor or an actuator.   The said heating means is a cooling device by gas injection, The pressurized heating cooling device as described in any one of Claims 1-3 characterized by the above-mentioned. Flip-chip mounting apparatus characterized by comprising a pressure heating cooling device according to any one of claims 1-4. First positioning movement means comprising a first fixed part and a first movable part;
A moving part that is provided in the first movable part of the first positioning moving means and is positioned and moved in the vertical direction;
A second positioning / moving means provided in the moving part, comprising a second fixed part and a second movable part;
A head portion provided in the second movable portion of the second positioning movement means and positioned and moved in the vertical direction;
A bottom dead center defining member provided at the second fixed portion of the second positioning and moving means and serving as a reference for the lower end position of the head portion;
A third positioning / moving means provided on the head portion, and comprising a third fixed portion and a third movable portion;
A tool provided on the head portion for holding the component on the lower surface;
A support portion provided on the head portion and supporting the tool;
A cooling means provided on the head portion for cooling the tool;
A heating unit provided in the head unit for heating the tool;
Comprising
The third fixing portion of the third positioning moving means is fixed to the support portion;
The heating unit is fixed to the third movable unit, and is movable so as to contact or separate from the tool by the third positioning movement unit,
It said second positioning means for moving Ri settable der to abut downward direction at a predetermined weight the head portion relative to the bottom dead center defining member, said tool in the lower end portion of the head portion fixed A contact surface of the head portion with the bottom dead center defining member is substantially flush with the lower surface of the tool , using a flip chip mounting apparatus,
A holding step for holding the mounting component to be mounted on the mounting board on the tool;
A contact step of setting the head portion in a state of contacting the bottom dead center defining member downward with a predetermined load by the second positioning movement unit;
The moving portion is lowered by the first positioning moving means until the bottom dead center defining member is in a predetermined position, and a terminal of the mounting board and a terminal of the mounting component are brought into contact with each other via a bump, and the head a lowering step in which parts are in a state spaced by a predetermined distance upward from the bottom dead center defining member,
After the descending step, a heating step of heating the mounting component by the heating unit in a state of being brought into contact with the tool by the third positioning movement unit;
A melting step in which the bumps melt the terminals of the mounting substrate and the terminals of the mounting component by the heating step, and the head portion is in contact with the bottom dead center defining member;
After the melting step, a cooling step of separating the heating unit from the tool by the third positioning movement unit and cooling the mounting component by the cooling unit;
After the cooling step, the lifting step of releasing the holding of the mounting component by the tool and lifting the moving portion by the first positioning moving means to separate the head portion from the mounting substrate on which the mounting component is mounted; ,
The flip chip mounting method characterized by implementing. The descending step is
A first lowering step of lowering the moving part until the terminal of the mounting substrate and the terminal of the mounting component abut via the bump;
After the first descending step, the head portion is in contact with the bottom dead center defining member,
A second lowering step of lowering the moving portion until the position of the bottom dead center defining member reaches a predetermined position so that a gap between the terminal of the mounting substrate and the terminal of the mounting component has a predetermined size;
The flip-chip mounting method according to claim 6, comprising : Prior to the heating step, a preheating step is performed in which the heating portion is brought into contact with the tool and preheated by the third positioning movement unit.
8. The flip chip mounting method according to claim 6, wherein the flip chip mounting method is used. The flip-chip mounting method according to claim 6 , wherein the bump is a solder bump provided on a terminal of the mounting substrate. The method of manufacturing a semiconductor device characterized by manufacturing a semiconductor device by flip chip mounting method of any one of claims 6-9.