JPH06326156A - Structure of bonding tool - Google Patents

Abstract

PURPOSE:To change the temperature of a bonding tool by using a continuous heating system in the structure of the bonding tool used for connecting a glass substrate and a tape substrate. CONSTITUTION:The structure of a bonding tool consists of a pressure body 2 with a pressure surface 7, a pressure-body moving mechanism 4, a heating element 1 with a heat generating section and a heating-element moving mechanism 3. Through-holes 1 for cooling are formed to the pressure body 2, and the pressure body 2 is heated by a contact with the heating element 1. The heating element 1 is separated, and a refrigerant is flowed into the through-holes 11, thus allowing the cooling of the pressure body 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The bonding rule structure of the present invention relates to the structure of a bonding tool used for connecting a liquid crystal panel to a TAB semiconductor device, connecting a tape wiring board to a driving IC, and the like.

[0002]

2. Description of the Related Art A so-called TAB type semiconductor device in which a semiconductor element is mounted on a tape substrate using a flexible film such as a polyimide film and leads provided on the tape substrate are connected to electrodes of the semiconductor element is widely used. It is put to practical use. Also, a flexible tape has been put into practical use in which a large number of leads are provided on the above-mentioned tape substrate and the flexibility thereof is used to connect between the substrates or between the semiconductor device and the substrate.

FIG. 5 is a schematic view showing an example of a conventional connection method. FIG. 6 is a cross-sectional view showing another conventional example. In FIGS. 5 and 6, a large number of wiring patterns 18 are provided on the outer edge of a glass substrate 17 that constitutes a liquid crystal panel. In the TAB type semiconductor device 29, a semiconductor element 30 is mounted on a tape substrate 16 having wiring on a flexible film, and electrodes 31 of the semiconductor element 30 are on the tape substrate 16.
The leads 19 arranged above are respectively connected.

To connect the leads 19 of the TAB semiconductor device 29 to the wiring pattern 18 of the glass substrate 17 as described above, the leads 19 of the TAB semiconductor device 29 are aligned (aligned) with the wiring pattern 18 of the glass substrate. Then, a connecting agent such as an anisotropic conductive film 20 or an anisotropic conductive adhesive is interposed between the two, and the tape substrate 16 is heated and pressed from above the lead 19 of the TAB semiconductor device 29 with a bonding tool. The connecting agent such as the anisotropic conductive film 20 is cured to connect the lead 19 to the wiring pattern 18.

As the bonding tool used for the connection at this time, there is used a bonding tool 32 of a constant heating system in which a rod-shaped heating element 5 is incorporated in the bonding tool as shown in FIG.

Alternatively, as shown in FIG. 6, there is an electric resistance heating type bonding tool 33 which uses a part of the bonding tool as an electric resistance.

[0007]

However, in the above-mentioned conventional technique, when the bonding tool of the constant heating system is used, the connection temperature at the time of connection is constant when the thermoplastic anisotropic conductive film is used. For this reason, the anisotropic conductive film is in a softened state when the bonding tool is separated from the connection part after the connection, and it is difficult to make a reliable connection between each lead and the electrode. When the anisotropic conductive film is used, the adhesive holding force is lost to the repulsive force of the conductive particles due to the high temperature of the anisotropic conductive film at the time when the bonding tool is separated from the connection part after connection. There was a problem that a reliable connection could not be made.

In order to solve the above problems, according to the electric resistance heating type bonding tool, the heating temperature can be raised to the connectable temperature only when electricity is applied. It was possible to ensure a reliable connection between the leads and the electrode pattern by moving the tool away from the connection.

However, according to the electrical resistance heating type bonding tool, since the bonding tool is used as a heating element, it is necessary to form a heating portion near the bonding portion, and the thickness of the side surface of the bonding portion is extremely reduced. A method of increasing the electric resistance and using it as a heat generating part has been adopted. When the heat generating portion is formed on the bonding tool in this manner, it is very difficult to perform processing for ensuring a uniform temperature over the entire length of the connection portion, and an expensive bonding tool is required.

Further, when the connection is made by using the electric resistance heating type bonding tool, the side surface of the bonding tool is thin and the bonding surface is deformed by the pressure at the time of connection and the heating of the bonding tool. However, there is a problem that a uniform connection pressure and connection temperature cannot be secured over the entire surface of the connection portion, and reliable connection of the connection target cannot be performed.

[0011]

A pressing body having a pressing surface, a pressing body moving mechanism, a heating element having a heating portion and a heating element moving mechanism, and the pressing body contact surface and the heating body contact surface are It has contact surfaces facing each other. The pressurizing body contact surface and the heat generating body contact surface are in contact with each other with a convex curved surface and a concave curved surface facing each other. The heating element and the pressure element contact each other, and the temperature of the pressure element is raised by heat transfer from the heating element. Alternatively, the contact surface of the heating element and the contact surface of the pressurizing element have contact surfaces of irregularities which are inclined and face each other, and contact each other.

By disposing a fluid introduction port and a through hole having a fluid outlet in the pressurizing body, a cooling medium is introduced from the fluid introducing port at the end of bonding to lower the temperature of the pressurizing body at the end of bonding. (EN) Provided is a bonding tool which can achieve a reliable connection by lowering the temperature of a connection portion, stabilize electrical conduction at the time of connection, and prevent deformation of a bonding surface.

[0013]

[Function] A pressure body having a pressure surface, a pressure body moving mechanism,
It is composed of a heating element having a heating section and a heating element moving mechanism, and the pressing element contact surface and the heating element contact surface have contact surfaces facing each other, and the heating element contact surface and the pressing element contact surface oppose each other. The convex and concave surfaces are in contact with each other. The heating element and the pressure element are brought into contact with each other, and the temperature of the pressure element is raised by heat transfer from the heating element.

The heating element contact surface and the pressurizing element contact surface are in contact with each other with inclined and opposed contact surfaces having irregularities.

At the end of bonding, the pressurizing member is provided with a fluid inlet and a through hole having a fluid outlet,
A cooling medium is introduced from the fluid introduction port to cool the temperature of the pressurizing body at the end of bonding to lower the temperature of the connecting portion.

The pressing body of the bonding tool having the above structure is connected to the pressing body moving mechanism and can be operated only by the pressing body. Further, the heating element is also connected to the heating element moving mechanism and can operate independently.

First, by contacting the heating element with the heating element, the heating element is heated to a predetermined temperature required for connection by heat transfer from the heating element. Next, in a state where the pressure body and the heating element are in contact with each other, they move to a matching portion between the lead and the substrate, and heat and pressurize the connection portion. After the end of the predetermined heating time, the heating element is separated from the pressurizing element, and the cooling medium is introduced from the fluid introducing port to cool the pressurizing element. After the heating temperature of the pressurizing body has dropped to a predetermined temperature, the pressurizing body is released from pressure and separated from the upper surface of the connecting portion, whereby the connection can be terminated.

[0018]

EXAMPLE 1 FIG. 1 is a side view showing the structure of a bonding tool according to Example 1 of the present invention, and FIG. 2 shows a part of the bonding tool according to Example 1 of the present invention. It is sectional drawing shown. This embodiment will be described in detail with reference to FIGS. 1 and 2.

In FIG. 1, the bonding tool comprises a heating element 1, a pressing element 2, a heating element moving mechanism 3 and a pressing element moving mechanism 4. A rod-shaped heating element 5 is embedded in the heating element 1 to form a heating portion, and is connected to the heating element moving mechanism 3. The heating element contact portion 6 which is a contact portion of the pressing body 2 with the heating element 1 has a concave slope 8 orthogonal to the long side direction of the pressing surface 7.
The pressurizing body contact portion 9 of the heating element 1 is formed by the convex slope 10 facing the concave slope 8 and is in close contact with each other at the time of contact.

The heating element 1 is made of a metal such as a copper alloy, a nickel-chromium alloy, a nickel-based super heat-resistant alloy, and an ultra-low thermal expansion cast iron, and has a larger volume than the pressurizing element 2.
The pressurizing body 2 is made of a metal such as nickel-based super heat-resistant alloy or ultra-low thermal expansion cast iron, or ceramics such as alumina-based ceramics, silicon carbide or silicon nitride, and the amount of deformation during pressurization and heating is maximized. I decided to suppress it.

Further, a through hole 11 is arranged in the pressurizing body 2 so that compressed air as a cooling medium can flow in through the fluid inlet 12 as shown in FIG.

The above bonding tool will be described below.

In FIG. 1, the pressure body 2 is a pressure body holding portion 13
It is held by the pressurizing body moving mechanism 4 and can be vertically moved by the pressurizing body moving cylinder 14. The pressurizing body moving cylinder 14 is selected to have a size capable of applying a pressure of 0.5 MPa to 5 MPa to the connecting portion in order to secure a pressurizing pressure at the time of connection.

The heating element 1 is constructed by embedding a rod-shaped heating element 5 in the heating element 1 for heating. Further, the heating element 1 is connected to the heating element moving cylinder 15, and the heating element moving cylinder 15 is operated to lower the heating element 1 to bring the concave sloped surface 8 of the pressurizing element 2 into contact with the convex sloped surface 10 of the heating element 1. Let Since the pressurizing body 2 is heated by the heat transfer from the heat generating body 1, the contact surface between the pressurizing body 2 and the heat generating body 1 has a large contact area and a combination of the concave slope surface 8 and the convex slope surface 10 so as to be in close contact with each other. And

After the temperature of the pressurizing surface 7 formed on the pressurizing body 2 rises up to the connectable temperature due to heat transfer from the heat generating body 1, the pressurizing body is moved with the heat generating body 1 in contact with the pressurizing body 2. The pressurizing body 2 is moved by the mechanism 4 so that the pressurizing surface 7 of the pressurizing body 2 is brought into contact with the upper surface of the tape substrate 16 to perform pressurization and heating, and the wiring pattern 18 on the glass substrate 17 aligned and arranged.
And the leads 19 of the tape substrate 16 to the wiring pattern 1
8 and the anisotropic conductive film 20 sandwiched between the leads 19 and arranged.
To connect.

Only the heating element 1 in contact with the pressing element 2 is separated from the pressing element 2 by the heating element moving mechanism 3 after the connection is completed by the heating temperature and the pressing force of the pressing element 2. Compressed air is introduced into the through holes 11 as a cooling medium to cool the pressurizing body 2 while the pressurizing body 2 continues to pressurize. After cooling the pressurizing body 2 with the cooling medium, the inflow of the cooling medium is stopped, the pressurization of the pressurizing body 2 is released, and the pressurizing body 2 is separated from the upper surface of the tape substrate 16 by the pressurizing body moving mechanism 4. The wiring pattern 1 on the lead 19 of the tape substrate 16 and the glass substrate 17
One connection with the anisotropic conductive film 20 with 8 is completed.
The pressure body 2 separated from the tape substrate 16 returns to the fixed position before the connection, and the heat generation body 1 is brought into contact with the pressure body 2 which has returned to the fixed position again by the heat generation body moving mechanism 3 so that It was decided to heat the pressurizing body 2 by the heat conduction of 1 and prepare for the connection again.

In this embodiment, a thermosetting resin is used as the adhesive 21 of the anisotropic conductive film 20, and the anisotropic conductive film 2 is used.
As the conductive particles 22 contained in 0 and electrically connecting the lead 19 and the wiring pattern 18, particles having metal surfaces plated on the plastic particles were used.

Anisotropic conductive film 2 when the tape substrate 17 is connected to the glass substrate 18 by the anisotropic conductive film 20.
As for the connection condition of 0, since the required curing temperature of the anisotropic conductive film 20 used this time is 140 degrees Celsius, the adhesive 2 is applied to the connection portion 23.
In order to secure one curing temperature of 140 degrees Celsius, the temperature of the heating element 1 is set to about 260 degrees Celsius, and the heating element 1 is brought into contact with the pressurizing element 2. By bringing the heating element 1 into contact with the pressure member 2, the temperature of the pressure surface 7 becomes 200 degrees Celsius, and it becomes possible to secure the temperature of 140 degrees Celsius in the connecting portion 23. Furthermore, 0.5MP is applied to the connecting portion 23 by the pressurizing body moving cylinder 14.
The pressure of 5 MPa is applied from a, the pressure is maintained for 5 seconds to 20 seconds, and then the heating element moving mechanism 3 is used to move the heating element 1 to the pressing element 2.
Separated from each other, 2 to 5 liters of compressed air as a cooling medium flows into the through hole 11 per minute from the fluid introduction port 12 shown in FIG. The cooling medium flowing through the through hole 11 is discharged from the fluid outlet 24. After the pressure body 2 is cooled from 70 degrees Celsius to 120 degrees Celsius by the cooling medium, the pressure body 2 is separated from the tape substrate 17 by the pressure body moving mechanism 4 shown in FIG. To finish.

At this time, the connection state of the connection portion 23 was good, and no place was detected that would cause a part of the connection portion 23 to float and cause electrical failure.

(Second Embodiment) FIG. 3 is a perspective view showing the structure of a bonding tool according to a second embodiment of the present invention.

The bonding tool comprises a heating element 1, a heating element moving cylinder 15, a pressure element 2, a pressure element moving mechanism 4 and a pressure element moving cylinder 14, and the pressure element contact portion 9 of the heating element 1 is It is formed by the uneven slope 25. In addition, the heating element contact portion 6 of the pressurizing body 2 has the uneven slope 25 of the pressing body contact portion 9.
It is formed by an uneven slope 26 having a slope opposite to the slope. The heating element contacting part 6 of the pressing element 2 is brought into close contact with the pressing element contacting part 9 of the heating element 1 by the pressing element moving cylinder 14. The pressurizing body 2 receives heat from the heating element 1 heated by the rod-shaped heating element 5 and rises in temperature to a predetermined temperature required for connection. The pressure body contact portion 9 of the heating element 1 is the uneven slope 26,
Since the pressurizing body 2 is formed in a shape facing the convex-concave slope 25 of the heating element contact portion 6 and is in close contact with the pressurizing body 2, the contact area with the pressurizing body 2 is large, and the temperature can be quickly transmitted.

The pressurizing body 2 which has risen to a predetermined temperature is pressurized by the heating element moving cylinder 15 and comes into contact with an object to be connected (not shown) for connection. After connecting for a predetermined time, the pressurizing body 2 is pressurized by the pressurizing force of the pressurizing body moving cylinder 14, and the heating element moving cylinder 15 releases the pressurization and returns to a predetermined position to apply the pressure. Heater contact portion 6 of pressure body 2
The heating element 1 can be detached more. After the heating element 1 is separated, the pressure element 2 is continuously pressurized by the pressure element moving cylinder 14, and the cooling medium is flown into the through hole 11 to cool the pressure element 2. After that, by operating the pressurizing body moving cylinder, the pressurizing body moving cylinder is detached from the connected body, and the pressurizing body contact portion 9 and the heating body contact portion 6 of the heating element 1 come into contact with each other to complete one connection.

(Embodiment 3) FIG. 4 is a side view for explaining the structure of a bonding tool according to a third embodiment of the present invention. The bonding tool includes a heating element 1, a pressurizing element 2, a heating element moving mechanism 3. It is composed of a pressurizing body moving mechanism 4.
The contact portions between the pressurizing body 2 and the heat generating body 1 respectively have a concave curved surface 27 and a convex curved surface 28 that are orthogonal to the long side direction of the pressurizing surface 7 of the pressurizing body 2.
And the concave curved surface 27 and the convex curved surface 28 are arranged to face each other. A rod-shaped heating element 5 is embedded in the heating element 1 and connected to the heating element moving mechanism 3. The heating element contact portion 6 which is a contact portion of the pressing element 2 with the heating element 1 is formed by a concave curved surface 27 orthogonal to the long side direction of the pressing surface 7, and the contact portion of the heating element 1 with the pressing element 2. The pressurizing body contact portion 9 is a convex curved surface 28 that faces the concave curved surface 27, and has a structure in which they are in close contact with each other at the time of contact.

The pressure member contact portion 9 formed on the heat generating element 1 is a convex curved surface 28, and the heat element contact portion 6 formed on the pressure element 2 is a concave curved surface 27 facing the convex curved surface 28. Therefore, the temperature of the heating element 1 heated by the rod-shaped heating element 5 can be efficiently transferred from the convex curved surface 28 of the heating element 1 to the pressing element 2 via the concave curved surface 27 of the pressing element 2. Become. Further, since the volume of the pressure body 2 can be reduced by forming the heating body contact surface 6 of the pressure body 2 into the concave curved surface 27, the heat generation body 1 is separated from the pressure body 2 to form the pressure body 2. Even when the cooling medium is introduced from the cooling medium introducing port into the arranged through hole 11 to cool the pressurizing body 2, the cooling time can be shortened and the working time can be shortened.

[0035]

As described above, in the present invention, the pressurizing body having the pressurizing surface, the pressurizing body moving mechanism, the heat generating body having the heat generating portion, and the heat generating body moving mechanism are provided. The body contact surfaces have contact surfaces facing each other, and the heating element is brought into contact with the pressure body to raise the temperature of the pressure body. The contact surface of the heating element and the contact surface of the pressurizing element are in contact with each other with a convex curved surface and a concave curved surface facing each other. Alternatively, the contact surface of the heating element and the contact surface of the pressurizing element have contact surfaces of irregularities which are inclined and face each other, and contact each other. Furthermore, by arranging a fluid inlet and a through hole with a fluid outlet in the pressurizing body, a cooling medium flows in from the fluid introducing port at the end of connection to lower the temperature of the pressurizing body at the end of bonding and make a connection. By releasing the pressure after lowering the part temperature, the cured state of the connecting agent such as anisotropic conductive film or anisotropic conductive adhesive can be stably maintained, so a stable connected state is secured. It is possible to ensure a reliable connection, and it is possible to continuously and stably secure a connected state without the risk of deformation of the pressing surface even if the temperature of the pressing surface is raised or lowered.

[Brief description of drawings]

FIG. 1 is a side view showing a structure of a bonding tool according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a bonding tool according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing a structure of a bonding tool according to a second embodiment of the present invention.

FIG. 4 is a side view showing a structure of a bonding tool according to a third embodiment of the present invention.

FIG. 5 is a schematic diagram showing an example of a conventional connection method.

FIG. 6 is a schematic diagram showing another example of a conventional connection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heating element 2 Pressurizing element 3 Heating element moving mechanism 4 Pressing element moving mechanism 5 Rod-shaped heating element 6 Heating element contact part 7 Pressing surface 8 Concave sloped surface 9 Pressing element contact part 10 Convex sloped surface 11 Through hole 12 Fluid introduction port 13 Pressurized body holding part 14 Pressurized body moving cylinder 15 Heating element moving cylinder 24 Fluid outlet 25 Convex slope 26 Uneven slope 27 Concave curved surface 28 Convex curved surface

Claims (4)

[Claims] 1. A pressurizing body having a pressurizing surface, a pressurizing body moving mechanism, a heat generating body having a heat generating portion, and a heat generating body moving mechanism, wherein the pressurizing body contact surface and the heat generating body contact surface face each other. Bonding tool structure characterized by having a contact surface. 2. The bonding tool structure according to claim 1, wherein the heating element contact surface and the pressing element contact surface are a convex curved surface and a concave curved surface, respectively, which face each other. 3. The bonding tool structure according to claim 1, wherein the heating element contact surface and the pressure element contact surface each have a concave slope, a convex slope or an uneven slope that are inclined and face each other. 4. The bonding tool structure according to claim 1, wherein the pressurizing body has a fluid inlet and a through hole having a fluid outlet.