KR101775448B1 - Method and device for joining electronic component - Google Patents

Method and device for joining electronic component Download PDF

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Publication number
KR101775448B1
KR101775448B1 KR1020157028214A KR20157028214A KR101775448B1 KR 101775448 B1 KR101775448 B1 KR 101775448B1 KR 1020157028214 A KR1020157028214 A KR 1020157028214A KR 20157028214 A KR20157028214 A KR 20157028214A KR 101775448 B1 KR101775448 B1 KR 101775448B1
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electronic component
electrode
substrate
moving
load
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KR1020157028214A
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Korean (ko)
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KR20150128909A (en
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겐지 나이토
시게아키 가와카미
나오토 가미지마
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아스리트 에프에이 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/7592—Load or pressure adjusting means, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H01L2224/81815—Reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Operations Research (AREA)
  • Wire Bonding (AREA)

Abstract

The pressing force and the movement amount of the electronic component holding part? Provided is an electronic component joining device which can be controlled with precision. And an electronic part lifting mechanism 2 for lifting and moving the electronic part holding part 8 for holding the electronic part M toward the board P and for moving the electronic part M to a position To the position where the electronic component electrode M 1 of the electronic component M and the substrate electrode P 1 of the substrate P are in contact with each other so that the electronic component electrode M 1 and the substrate electrode P 1 can be thermally melted The electronic component lifting mechanism 2 is configured such that the distance between the electronic component electrode M1 and the substrate electrode P1 becomes a predetermined distance D1 A high speed moving mechanism 6 for moving the electronic component holding portion 8 at a high speed and a high speed moving mechanism 6 for moving the electronic component holding portion 8 at a high speed after the distance between the electronic component electrode M1 and the substrate electrode P1 reaches a predetermined distance D1. And the piezo drive unit 7, in which the electronic component holding unit 8 is moved at a lower speed and the drive source is a piezoelectric element.

Figure 112015097637114-pct00001

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic component joining apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding device for electronic component for bonding an electronic component to a substrate or the like.

For example, as disclosed in Patent Document 1, a device for bonding (mounting) an electrode of an electronic component and an electrode of the substrate by means of solder that is thermally fused is known.

The device presses the electrode of the electronic component held by the electronic component holding portion against the electrode of the substrate and heats the electronic component and the substrate, melts the solder laminated on the electrode, and bonds the electrodes together by soldering.

When this bonding is performed, if an excessive pressing force is applied between the electrode of the electronic component and the electrode of the substrate, the electrode may be damaged.

If the solder continues to be pressed even after the solder is melted, the melted solder is pushed out and is likely to flow out, and there is a possibility that the adjacent electrodes are short-circuited by the flowing solder.

Therefore, the pressing force between the electrode of the electronic component and the electrode of the substrate is made appropriate, and control is performed to move the electronic component toward the substrate in accordance with the melting state of the solder.

Japan special feature 2011-254032

However, since the thickness of the solder laminated on the electrode is about several tens of micrometers, the electronic component bonding apparatus is required to have high precision in controlling the pressing force and the moving amount of the electronic component holding portion.

Therefore, it is an object of the present invention to provide an electronic component bonding apparatus capable of controlling the pressing force and the moving amount of the electronic component holding unit with high precision.

In order to solve the problems described above, an electronic component bonding apparatus of the present invention has an electronic component lifting mechanism for lifting and moving an electronic component holding portion holding an electronic component toward a substrate, The electrode of the electronic component and the electrode of the substrate are bonded to each other through a thermally fusible metal while moving the electrode of the component to a position where the electrode of the component and the electrode of the substrate are in contact with each other, A high-speed moving mechanism for moving the electronic component holding portion at a high speed until the distance between the electrode of the electronic component and the electrode of the substrate becomes a predetermined distance; Speed moving mechanism for moving the electronic component holding portion, and the driving source of the low-speed moving mechanism is a piezo element.

According to another aspect of the present invention, there is provided an electronic component holding apparatus comprising: a load sensor for detecting a load acting on a side where a substrate is placed with respect to an electronic component held by an electronic component holding unit; a noise detecting sensor for detecting noise acting on the load sensor; And noise signal removing means for removing noise from the load signal detected by the load sensor based on the noise signal detected by the load sensor.

In another aspect of the invention, the noise detection sensor, the load sensor, and the low-speed moving mechanism are arranged along the moving direction of the electronic component holding portion.

According to another aspect of the present invention, the high-speed moving mechanism moves the first moving section, and the low-speed moving mechanism is provided in the second moving section that is vertically movable with respect to the first moving section, And is supported by the first moving part through the load cell in a state of being bent downward by the urging means.

According to another aspect of the present invention, there is provided an electronic component holding apparatus comprising: a load sensor for detecting a load acting on a side on which a substrate is placed with respect to an electronic component held by an electronic component holding unit; a predetermined sensor for removing a signal of a predetermined frequency from a load signal detected by the load sensor Frequency signal removing means.

There is provided an electronic component joining method for joining an electrode of an electronic component and an electrode of a substrate via a metal capable of heat melting, comprising the steps of heating an electronic component and a substrate, The presence or absence of melting of the metal is determined by detecting the amount of movement of the electronic component downward in a state where the load of the electronic component is constantly added.

According to the present invention, it is possible to provide an electronic component bonding apparatus capable of controlling the pressing force and the movement amount of the electronic component holding section with high precision.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram showing a schematic configuration of an electronic component bonding apparatus according to an embodiment of the present invention. Fig.
2 is a block diagram schematically showing an electrical configuration of an electronic component bonding apparatus.
3 is an enlarged view of a portion A shown in Fig.
4 is a flow chart showing the operation of the electronic component bonding apparatus according to the embodiment of the present invention.
Fig. 5 is an explanatory diagram showing changes of a piezo-applied signal, a load sensor signal, a noise signal, a displacement sensor signal, and a load correction signal during operation of the electronic component bonding apparatus according to the embodiment of the present invention.
6 is a view showing a predetermined position when the electronic part holding portion is moved to a predetermined position at a high speed and an interval between the electronic part and the substrate.
Fig. 7 is another embodiment of the present invention. Fig. 2 is a block diagram schematically showing an electrical configuration of a related electronic component joining apparatus. Fig.
8 is a diagram showing an example of a load sensor signal.
FIG. 9 is a view showing a result of analyzing a frequency component of a load sensor signal shown in FIG. 8. FIG.
10 is a diagram illustrating signals obtained by removing 130 Hz and 330 Hz signals from the load sensor signal shown in FIG.
11 is a view showing a load sensor signal from which a signal of 130 Hz is removed from a load sensor signal shown in FIG.
12 is a view showing a load sensor signal from which a signal of 330 Hz is removed from a load sensor signal shown in FIG.

(Electronic component bonding apparatus 1 of the present embodiment)

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an electronic component bonding apparatus 1 according to an embodiment of the present invention will be described with reference to the drawings.

In the following description, the direction of the arrow X1 is set to the upper side of the electronic component joining apparatus 1, the direction of the arrow X2 is downward, and the direction of the arrow Y1 is set to the left side and the direction of the arrow Y2 to the right side .

The front side directly facing the drawing will be described as the front side where the operator who operates the electronic component joining apparatus 1 stands.

(Overall configuration of electronic component bonding apparatus 1)

Fig. 1 schematically shows an entire configuration of an electronic component bonding apparatus 1. As shown in Fig.

2 is a block diagram schematically showing the electrical configuration of the electronic component bonding apparatus 1. As shown in Fig.

3 is an enlarged view of a portion A shown in Fig.

As shown in Fig. 1, the electronic component bonding apparatus 1 has an electronic component lifting mechanism 2 and a substrate mounting section 3, and has a control section 4 as shown in Fig.

As shown in Fig. 3, the substrate P is mounted on the substrate mounting portion 3, and the electronic component lifting mechanism 2 holds an electronic component M bonded to the substrate P.

The electronic component M includes a semiconductor chip, a transistor, a diode, and the like.

(Electronic component lifting mechanism 2)

The electronic component lifting mechanism 2 has a base plate 5, a high-speed moving mechanism 6, a piezo driving section 7 as a low-speed moving mechanism, and an electronic component holding section 8.

The base plate 5 is provided to a frame or a case, which is not shown, provided on a floor surface or the like.

(High-speed movement mechanism 6)

The high-speed moving mechanism 6 has a motor 9, a ball screw 10 and a ball screw nut 11.

The ball screw 10 is coupled to the output shaft 13 of the motor 9 through a coupling 12.

The ball screw nut (11) is fixed to the first moving part (14).

The ball screw nut (11) is screwed to the ball screw (10).

The first moving part 14 is provided on the base plate 5 through a first guide part 15 fixed to the base plate 5. [

The first guide portion 15 guides the first moving portion 14 so as to be movable up and down.

That is, the high-speed moving mechanism 6 having the above-described configuration can move the first moving section 14 in the up-and-down direction by driving the motor 9.

The high-speed moving mechanism 6 has a displacement sensor 16 and a moving amount of the first moving section 14 in the up-and-down direction, that is, The moving amount can be detected.

The displacement sensor 16 can be constituted by, for example, a linear encoder.

(The second moving unit 18)

The first moving part 14 is supported by a second moving part 18 via a load cell 17.

Between the first moving part 14 and the second moving part 18, a spring 30 serving as a biasing means is provided.

The spring 30 obtains a reaction force at the first moving part 14 and buckles the second moving part 18 downward by this reaction force.

The second moving part 18 is provided in the first moving part 14 through the second guide part 19 fixed to the first moving part 14. [

The second guide portion 19 guides the second moving portion 18 so as to be movable up and down.

That is, the second moving part 18 is supported so as to be movable in the vertical direction with respect to the first moving part 14 through the second guide part 19.

The second guide portion 19 may be configured to use, for example, a cross roller guide.

With this configuration, it is possible to maintain the second moving portion 18 at a high rigidity with respect to the first moving portion 14.

The second guide portion 19 may use an air slide guide.

With this configuration, the second moving portion 18 can be moved in the vertical direction with respect to the first moving portion 14 with high precision and low sliding friction compared with the case of using the cross roller guide .

The second moving part 18 is displaced upward relative to the first moving part 14 and the load cell 17 is displaced upward by the load cell 17, 2 The pushing force acting on the moving part 18 can be measured.

[0020]

A load sensor 22, a displacement sensor 21, a piezo drive unit 7, a ceramic heater (not shown), and the like are attached to the second moving unit 18 from the upper side (the first moving unit 14 side) a ceramic heater 23 and an electronic component holder 8 are provided in this order.

The noise detection sensor 20, the load sensor 22, and the piezo drive 7 are arranged along the moving direction of the electronic component holding portion 8, that is, the vertical direction.

(The piezo driver 7)

The piezoelectric driver 7 has a piezoelectric element (not shown), and the electronic component holding portion 8 is provided in correspondence to the piezo applying signal V1 (see FIG. 5) applied to the piezo element Move downward.

The piezo driving part 7 may be configured to transmit the deformation amount of the piezo element to the electronic part holding part 8 as it is or to enlarge the deformation amount of the piezo element through the displacement amount increasing mechanism to transfer it to the electronic part holding part 8 .

(Displacement sensor 21)

The displacement sensor 21 is a sensor for detecting the amount of displacement of the electronic component holder 8. [

The detection accuracy is generally 0.01 mu m level, and for example, a capacitive displacement sensor can be used.

The capacitance displacement type displacement sensor is composed of a stationary electrode which is not displaced with respect to the second moving portion 18 and a movable electrode which is displaced in accordance with the displacement amount of the electronic component holding portion 8 displaced by the piezo driving portion 7 A displacement electrode is provided to face each other and a displacement amount of the electronic component holding portion 8 is measured by using a change in capacitance due to the relative movement of the two electrodes.

(Load sensor 22, noise detection sensor 20)

The load sensor 22 is a sensor for detecting a load applied to the electronic component holding portion 8 from below.

The detection accuracy is generally in the range of 0.01 N to 5 N, for example, a piezo element can be used.

The noise detection sensor 20 is a sensor for detecting noise acting on the load sensor 22. The detection accuracy is preferably equivalent to that of the load sensor 22 and a sensor equivalent to the load sensor 22 is preferably used.

(Electronic component holder 8)

The electronic component holder 8 can adsorb the electronic component M. [

That is, on the lower surface of the electronic component holding portion 8, there is provided a not-shown hole portion which becomes a negative pressure by a suction mechanism (not shown), and the electronic component M Can be adsorbed.

(Ceramic heater 23)

The ceramic heater 23 heats an electrode (hereinafter referred to as an electronic component electrode) M1 (see FIG. 6) of the electronic component M held by the electronic component holding portion 8, The solder layer (hereinafter referred to as the component side solder layer) M2 (see FIG. 6) formed in the solder layer M1 can be melted.

The second moving section 18 is provided with a motor 24.

The components from the noise detecting sensor 20 to the lower electronic component holding portion 8 are integrally moved and the electronic component holding portion 8 is rotated in the horizontal plane by the drive of the motor 24 .

(Substrate mounting section 3)

The substrate mounting section 3 is provided with a stage 25 on which a substrate P is placed and an electrode section (hereinafter referred to as a substrate electrode) P1 of the substrate P via a stage 25 And a heater 26 for heating.

The substrate stage 3 has a movable stage mechanism which can move in the left and right directions (Y1-Y2 direction) and forward and backward directions. The stage 25 and the heater 26 are arranged on the movable stage mechanism Respectively.

That is, the stage 25 and the heater 26 can move in the left-right direction and the front-rear direction.

The control unit 4 (see Fig. 2) is a computer having a CPU and a memory for performing signal processing.

A control program and control data for controlling the electronic component bonding apparatus 1 are stored in the memory.

2, based on signals from the displacement sensor 16, the load cell 17, the displacement sensor 21, and the load sensor 22, the control unit 4 controls the motor 9, The driving unit 7, the ceramic heater 23, the heater 26, and the like.

6, a plurality of electronic component electrodes M1 having a component-side solder layer M2 formed on its surface are provided on the electronic component M held at the tip of the electronic component holding portion 8. As shown in Fig.

The substrate P placed on the stage 25 is provided with a plurality of substrate electrodes P1 having a solder layer (hereinafter referred to as substrate-side solder layer) P2 formed on its surface.

The electronic component electrode M1 and the substrate electrode P1 are arranged so as to be connectable one to the other.

The layer thickness of the component side solder layer M2 of the electronic component electrode M1 and the layer thickness of the substrate side solder layer P2 of the substrate electrode P1 are all several tens of μm.

Therefore, when the component-side solder layer M2 and the substrate-side solder layer P2 are melted and the electronic component electrode M1 and the substrate electrode P1 are electrically connected, the electronic component electrode M1 and the substrate electrode P1 of the electronic component electrode M1 or the substrate electrode P1 is damaged to damage the electronic component electrode M1 or the substrate electrode P1 or between the electronic component electrodes M1 to which the molten solder is adjacent it is necessary to control the interval between the electronic component electrode M1 and the substrate electrode P1 with high precision so as not to shorten the gap between the electronic component electrode M1 and the substrate electrode P1.

The electronic component bonding apparatus 1 has the above-described structure and performs the bonding operation described with reference to Figs. 4 and 5, so that the bonding between the electronic component electrode M1 and the substrate electrode P1 The interval can be managed with high accuracy.

Fig. 4 is a view showing a flow of operation of the electronic component bonding apparatus 1. Fig.

5 is a diagram schematically showing a change state of a piezo applying signal V1, a load sensor signal V2, a noise signal V3, a displacement sensor signal V4 and a load (load) correction signal V5 .

The piezo applying signal (V1) is a voltage signal applied to the piezo driving part (7).

The load sensor signal V2 is a voltage signal output according to the load acting on the load sensor 22. [

The noise signal V3 is a voltage signal output in accordance with the noise acting on the noise detection sensor 20. [

The displacement sensor signal V4 is a voltage signal outputted from the displacement sensor 21 in accordance with the amount of displacement of the piezo element, that is, the amount of displacement of the electronic part holding portion 8.

The load correction signal V5 is a voltage signal obtained by correcting the load sensor signal V2 by the noise signal V3.

That is, the load correction signal V5 is a voltage signal obtained by removing noise components from the load sensor signal V2.

The control unit 4 outputs the load correction signal V5 obtained by removing the noise based on the noise signal V3 detected by the noise detection sensor 20 from the load sensor signal V2 detected by the load sensor 22 And based on this load correction signal V5, the load acting on the electronic component holder 8 from below is measured.

(Operation of electronic component bonding apparatus 1)

Hereinafter, the operation of the electronic component bonding apparatus 1 will be described.

Fig. 1 shows a state in which the electronic component holding portion 8 is disposed at a standby position before the electronic component lifting mechanism 2 starts to descend.

In this state, the electronic component electrodes M1 of the electronic component M and the substrate-side solder layer P2 of the respective substrates P are in the state of being aligned in the front-rear direction and the left-right direction have.

This alignment can be performed by moving the stage 25 in the front, rear, left, and right directions by means of a movable stage mechanism (not shown) and rotating the electronic component holding portion 8 in the horizontal plane by the motor 24 have.

(Step S10)

The control unit 4 drives the motor 9 to execute a fast descent operation for moving the electronic component holding unit 8 at a high speed downward from the stand-by position shown in Fig. 1 (step S10).

The rotation of the motor 9 causes the ball screw 10 to rotate.

A ball screw nut (11) screwed to the ball screw (10) is fixed to the first moving part (14).

Therefore, the ball screw nut 11 is lead by the rotation of the ball screw 10, so that the first moving part 14 moves downward, and the electronic part holding part 8 also moves in the first movement And falls along with the descent of the part (14).

The descending speed is higher than the descending speed of the electronic component M by the piezo driving unit 7, which will be described later, and is, for example, 500 mm / second.

(Steps S20 and S30)

The control section 4 detects the lowering position by the displacement sensor 16 and lowers the electronic component holding section 8 to the predetermined position S (see Fig. 6) (steps S20 and S30).

This predetermined position S is a position at which the electronic component electrode Ml of the electronic component M and the substrate-side solder layer P2 of the substrate P do not contact with each other and is as close as possible.

The motor 9 is driven with high torque so as to lower the electronic component M as fast as possible in order to increase the efficiency of the operation.

Therefore, when the electronic component electrode M 1 of the electronic component M lowered by the high-torque motor 9 collides against the substrate electrode P 1 of the substrate P, There is a possibility of damaging the surface P of the film.

Thereupon, the electronic component joining apparatus 1 moves the electronic component holding section 8 to the predetermined position S at a high speed, and further moves down the electronic component holding section 8 from the predetermined position S , And is performed with a low load by the driving force of the piezo driving unit 7 (steps S40 and S50), as will be described later.

6, the predetermined position S is set so that the electronic component electrode M 1 of the electronic component M is spaced from the substrate electrode P 1 of the substrate P by a distance D 1 (for example, 100 μm) And is located at the upper side.

This predetermined position S is set before starting the joining operation as follows.

The electronic component M is held on the electronic component holding portion 8 and lowered toward the substrate P placed on the stage 25 to bring the electronic component electrode M1 into contact with the substrate electrode P1.

The control unit 4 detects whether or not the electronic component electrode M1 is in contact with the substrate electrode P1 based on the output signal of the load cell 17 and detects the position of contact with the displacement electrode 16 .

The contact position measured by the displacement sensor 16 is a moving distance of the electronic component holding portion 8 from an initial position before the electronic component M is lowered or a moving distance of the substrate electrode P1 of the substrate P Can be detected as the height from the stage 25.

Then, based on the contact position, the position above the distance D1 is set as the predetermined position S and stored in the memory of the control section 4.

It is possible to measure the positions at which the electronic component electrode M1 contacts the substrate electrode P1 with respect to a plurality of, for example, three or four substrates P, and set a predetermined position S based on the average value thereof desirable.

Further, the spring 30 urges the second moving portion 18 downward with a force of, for example, 50 kg.

Therefore, when the electronic component electrode M1 is detected by the load cell 17 to be in contact with the substrate electrode P1 in a state in which the electronic component electrode M1 is reliably pressed against the substrate electrode P1 .

The biasing force of the spring 30 is extremely large as compared with the driving force of the piezo driving part 7. [

The second moving portion 18 does not move with respect to the first moving portion 14 when the electronic part holding portion 8 is lowered at a low load by the driving force of the piezo driving portion 7. [

Therefore, it is possible to prevent the accuracy of the displacement detection by the displacement sensor 21 and the accuracy of the load detection by the load sensor 22 from being lowered.

The pressing force that the spring 30 urges the second moving portion 18 downward against the pressing force that the piezo driving portion 7 presses the electronic component electrode M1 onto the substrate electrode P1 is set to, The electronic component electrode M 1 is contacted with the substrate electrode P 1 by the load cell 17 while the electronic component electrode M 1 is reliably pressed against the substrate electrode P 1, It is possible to prevent the displacement sensor 21 from detecting the displacement detection accuracy and the load sensor 22 from the load detection accuracy.

The pressing force by which the spring 30 presses the second moving portion 18 downward against the pressing force by which the piezoelectric driving portion 7 presses the electrode M1 of the electronic component onto the substrate electrode P1 is changed from 700 times to 1200 It is possible to more suitably detect the contact of the electronic component electrode M1 with respect to the substrate electrode P1 by the load cell 17 and at the same time to detect the accuracy of the displacement detection by the displacement sensor 21 and the load It is possible to prevent the accuracy of the load detection by the sensor 22 from being lowered.

The control unit 4 stops driving the motor 9 (step S30) if the electronic component holding unit 8 is lowered to the predetermined position S (Yes in step S20).

Further, the control unit 4 causes the electronic part holding unit 8 to descend to the predetermined position S by PID control (Proportional-Integral-Derivative Controller).

By carrying out the PID control, the electronic part holding portion 8 can be moved accurately at the predetermined position S.

The electronic component electrode M 1 of the electronic component M and the substrate electrode P 1 of the substrate P are electrically connected to each other in the state where the electronic component holding portion 8 is lowered to the predetermined position S (step S 30) Although they are not in contact with each other, they are arranged so as to approach each other at an interval of a distance D1 as described above.

The operation of bringing the electronic component electrode M1 into contact with the substrate electrode P1 from the state where the electronic component holding portion 8 is disposed at the predetermined position S is performed by the piezo driving portion 7 So that the electronic component holding portion 8 is slightly moved with the load.

Therefore, the distance D1 is as narrow as possible within the range in which the electronic component electrode M1 does not contact the substrate electrode P1. The electronic component holding portion 8 is moved from the predetermined position S to the electronic component electrode M1 And the substrate electrode P1 are brought into contact with each other.

However, the accuracy of the movement control of the electronic component holder 8 by the motor 9, the change in tolerance due to the environment such as the temperature of the electronic component bonding apparatus 1, The distance D1 between the electronic component electrode M1 and the electronic component electrode M1 is set to be smaller than the distance between the electrode member M1 and the substrate electrode 2 when the electronic component holder 8 is lowered by the motor 9, (P1).

Therefore, although it is preferable that the distance D1 is small, the precision of the movement control of the electronic component holding portion 8, the variation of the tolerance of the electronic component bonding apparatus 1, P, it is preferable that the distance is such that the electronic component electrode M1 and the substrate electrode P1 are not in contact with each other.

(Steps S40 and S50)

5, the control section 4 applies the piezo applying signal V1 to the piezo driving section 7 so that the electronic component electrode M1 is applied to the substrate electrode P1 And executes a search operation for detecting a contact position (steps S40 and S50).

The electronic component holding portion 8 is displaced according to the magnitude of the piezo applying signal V1 and this displacement amount is detected as the displacement sensor signal V4 by the displacement sensor 21. [

The control unit 4 determines whether or not the electronic component electrode M1 is in contact with the substrate electrode P1 based on the load correction signal V5.

The load correction signal V5 is a voltage obtained by removing (canceling) the noise signal V3 detected by the noise detection sensor 20 from the load sensor signal V2 of the load sensor 22, Signal.

That is, the load correction signal V5 is a signal indicating a load acting on the electronic component holder 8 from below.

As shown in Fig. 5, the voltage of the piezo applying signal V1 gradually increases from time T = 0.

The piezo driving part 7 moves the electronic part holding part 8 downward with a displacement amount corresponding to the size of the piezo applying signal V1.

When the electronic component electrode M1 contacts the substrate-side solder layer P2, a load is applied to the electronic component holding portion 8 from below. Therefore, as shown at time T = tl, the load correction signal V5 ) Occurs.

The control unit 4 determines that the electronic component electrode M1 has contacted the substrate electrode P1 when the load correction signal V5 reaches the predetermined voltage VA (Yes in step S50).

The control section 4 also moves the electronic component holding section 8 by PID control such that the load correction signal V5 becomes a predetermined voltage VA.

(Step S60)

5, the voltage VB of the displacement sensor signal V4 when the load correction signal V5 reaches the predetermined voltage VA is supplied to the electronic component holding section 8, Is a voltage corresponding to the distance moved further downward by the piezo driving part 7 after being lowered to the predetermined position S by the driving of the motor 9. [

This distance is an actual distance (distance) between the electronic component electrode M1 and the substrate electrode P1 when the electronic component holding portion 8 is moved to the predetermined position S, and the search operation , S50) is the search distance at which the electronic component holding portion 8 is lowered.

The voltage of the displacement sensor signal V4 corresponding to this search distance is stored in the memory provided in the control section 4 as the search distance corresponding voltage VB (step S60).

Then, in the search operation (step S40) when the next electronic component M is joined to the substrate P, the lowering speed of the electronic component holder 8 up to a predetermined distance in the range of this search distance .

That is, until the displacement sensor signal V4 reaches a predetermined voltage with respect to the search distance corresponding voltage VB, the rate of increase of the piezo applied signal V1 is increased, and the falling speed of the electronic component holding section 8 .

Thus, the time for performing the search operation (steps S40 and S50) can be shortened.

For example, the rate of increase of the piezo apply signal V1 is increased until the displacement sensor signal V4 reaches 40% of the search distance corresponding voltage VB.

When the electronic component holding portion 8 is moved to the predetermined position S by the change of the gap due to the temperature or the like of the electronic component joining apparatus 1 or the curvature of the substrate P or the like, ) And the substrate electrode Pl changes.

Therefore, if the predetermined distance for increasing the rate of increase of the piezo-applied signal V1 is made too long, there is a possibility that the electronic component electrode M1 and the substrate electrode P1 collide with each other.

By setting the predetermined voltage to 30% or more and 70% or less of the search range corresponding voltage VB, not only the possibility of collision between the electronic component electrode M1 and the substrate electrode P1 can be sufficiently low, (Step S40) can be effectively shortened.

Further, the search distance may be reflected at the predetermined position (S).

That is, the predetermined position S is set before the bonding operation is started, but the electronic component M is held by the electronic component holding portion (not shown) by the variation of the tolerance of the electronic component bonding apparatus 1 and the individual difference between the electronic component M and the substrate P. 8 is moved to the predetermined position S may not be the distance D1.

When the distance when the electronic component holding portion 8 is moved to the predetermined position S is longer than the distance D1, it is not preferable because the process time becomes longer. On the other hand, There is a possibility that the electrode M1 may contact the substrate electrode P1 with excessive pressure and damage the electronic component M or the substrate P. [

On the other hand, when the electronic component holding portion 8 is lowered to the predetermined position S by the driving of the motor 9, the electronic component holding portion 8 is moved to the predetermined position (S) based on the distance (search distance) S can be shortened to shorten the processing time and prevent the electronic component electrode M1 from contacting the substrate electrode P1 with excessive pressure.

When the load correction signal V5 reaches the predetermined voltage VA, that is, when it is determined that the electronic component electrode M1 has contacted the substrate electrode P1, As a result, the piezo applied signal V1 is temporarily lowered.

This makes it possible to prevent overshoot of the electronic component holding portion 8 when the electronic component electrode M1 contacts the substrate electrode P1 and to prevent overshoot of the electronic component electrode M1 and the substrate electrode P1 can be prevented from being damaged.

(Steps S70, S80, S90, S100)

The control unit 4 starts heating by the ceramic heater 23 and the heater 26 in accordance with the contact between the electronic component electrode M1 and the substrate electrode P1 (Yes in step S50).

The control unit 4 gradually increases the piezo applying signal V1 as shown at time T = t2 to t3 in Fig. 5 in a state where the electronic component electrode M1 is in contact with the substrate electrode P1, A predetermined load (for example, 0.5 N) is added from the electronic component electrode M 1 to the substrate electrode P 1 (step S70).

Whether or not a predetermined load is applied to the substrate electrode P1 from the electronic component electrode M1 is determined based on the load correction signal V5.

For example, when the load correction signal V5 becomes the voltage VC, it is determined that a predetermined load is applied to the substrate electrode P1 from the electronic component electrode M1.

This predetermined load is a size that does not cause damage to the electronic component M and the substrate P and also causes the component side solder layer M2 and the substrate side solder layer P2 to be melted , The melting can be detected by the displacement sensor 21 as a displacement toward the lower side of the electronic component holding portion 8.

When the control unit 4 determines that the load on the substrate electrode P1 from the electronic component electrode M1 reaches a predetermined load (when the load correction signal V5 becomes the voltage VC) (Yes in step S70), the piezo applying signal V1 is controlled so that the predetermined load is maintained (step S80), as shown in time T = t3 to t4 in Fig.

That is, the piezo applying signal V1 is controlled so that the load correcting signal V5 is held at the voltage VC (step S80).

In accordance with this, the value of the displacement sensor signal V4 at the position of the electronic component holding portion 8 (hereinafter referred to as a predetermined load position) when it is determined that the predetermined load has been reached is set to a predetermined load voltage VD) (step S80).

The control section 4 also moves the electronic component holding section 8 by PID control such that the load correction signal V5 becomes the voltage VC.

The component side solder layer M2 and the substrate side solder layer P2 are heated and melted by the heat of the ceramic heater 23 and the heater 26. [

When the component side solder layer M2 and the substrate side solder layer P2 are melted, the reaction force when the electronic component electrode M1 presses the substrate electrode P1 is reduced.

On the other hand, the pressing force of the electronic component holding portion 8 is kept constant (step S80).

Therefore, the electronic component holding portion 8 moves downward (descends downward).

Whether or not the component side solder layer M2 and the substrate side solder layer P2 have been melted can be determined by the amount of movement of the electronic component holding portion 8 in the downward direction in which the pressing force is kept constant (step S80) (Step S100) by judging whether or not the amount of the ink droplets exceeds the predetermined value (for example, 1 m).

Specifically, the control unit 4 controls the electronic part holding unit 8 to move the position of the electronic part holding unit 8 at a predetermined load position (when a predetermined load is applied) while controlling the piezo applying signal V1 so that the load correcting signal V5 is held at the voltage VC. (The position corresponding to the voltage VD) (the amount of decrease in the depth of the electronic component holding portion 8) is measured based on the amount of change in the displacement sensor signal V4 (step S90).

Then, it is determined whether or not the moving distance (the amount of descent of the electronic component holding portion 8) reaches a predetermined distance (for example, 1 mu m) (step S100).

This determination is made based on the fact that when the displacement sensor signal V4 becomes the voltage VE which increases from the predetermined load potential VD only by the predetermined potential difference DELTA V4 to the depth VE, It is determined that the predetermined distance has been reached (Yes in step S100).

The potential difference DELTA V4 is previously set as a potential difference corresponding to the amount of descent to a predetermined depth and stored in the memory of the control section 4. [

(Step S110)

When it is determined that the component-side solder layer M2 and the substrate-side solder layer P2 have melted (Yes in step S100), the control section 4 sets the time Likewise, when the lowering of the electronic component holding portion 8 is stopped and the position (the position of the electronic component holding portion 8 when it is judged that the component side solder layer M2 and the substrate side solder layer P2 have melted) (Step S110).

That is, when it is determined that the component side solder layer M2 and the substrate side solder layer P2 have melted (Yes in step S100), the voltage of the piezo applying signal V1 is held at the voltage at that time (Step S110).

(Step S120)

The controller 4 stops the lowering of the electronic component holder 8 and maintaining the position of the component side solder layer M2 and the substrate side solder layer P2 The cooling operation is started (step S120).

In this cooling operation (step S120), the energization to the ceramic heater 23 and the heater 26 is turned off and air is supplied to the cooling pipe 27 provided on the stage 25 Thereby cooling the electronic component (M) and the substrate (P).

As a result, the melted component-side solder layer (M2) and the substrate-side solder layer (P2) are cooled to start solidification.

(Steps S130 and S140)

However, the melted solder shrinks when cooled.

Therefore, there is a possibility that the electronic component electrode M 1 of the electronic component M and the substrate electrode P 1 of the substrate P are attracted by the heat-shrinkable solder and are damaged.

Thereupon, the control section 4 drives the piezo drive section 7 so that the electronic component holding section 8 is lowered in accordance with the heat shrinkage of the solder to be cooled, thereby causing the electronic component holding section 8 to follow the heat shrinkage of the solder (Step S140).

The thermal shrinkage follow-up operation (step S140) is performed by driving the piezo drive unit 7 such that the load (load correction signal V5) detected by the load sensor 22 is constant and moving the electronic part holding unit 8 .

The melted component side solder layer M2 and the substrate side solder layer P2 are cooled and heat shrinked so that the piezo drive signal V1 is supplied to the piezo drive part 7 so that the electronic component holding part 8 is slightly lowered .

The thermal shrinkage follow-up operation (step S140) is not performed immediately after the cooling operation (step S120), and the melted component side solder layer M2 and the substrate side solder layer P2 are cooled to a predetermined temperature (Step S130), and after cooling to a predetermined temperature (Yes in step S130), it is preferable to execute the process.

The reason for this is as follows.

When the solder is in a molten state, the rate of heat shrinkage due to the temperature change is small, and the solder may be deformed by an extremely minute force.

Therefore, when the solder is in a molten state, the piezo-applied signal V1 is kept constant (step S110), thereby preventing the electronic component holder 8 from moving.

Therefore, the heat shrinkage follow-up operation (step S140) is performed at the timing immediately before the solder begins to harden.

The predetermined temperature in step S130 is a temperature immediately before the solder begins to harden, for example, 220 占 폚.

During the time T = t4 to t5 shown in FIG. 5, even if the cooling operation is started, the heat shrink follow-up operation (step S140) is not executed.

(Steps S150 and S160)

The controller 4 then detects the temperature of the solder of the component side solder layer M2 and the substrate side solder layer P2 while the electronic component holding portion 8 performs a heat shrink compliant operation (step S150).

The control unit 4 cancels the suction of the electronic component M by the electronic component holding unit 8 and detects that the temperature of the motor 9 (step S150) To move the electronic component holding portion 8 upward (step S160).

Thus, the bonding operation is completed, and the substrate P on which the electronic component M is bonded is taken out of the stage 25.

The temperatures of the solder layers M2 of the component side solder layer M2 and the solder layers P2 of the substrate side are detected by a temperature detection sensor other than the one shown in Fig. Based on the temperature, the temperature of the solder can be inferred.

It is also possible to start the heat shrinking follow-up operation (step S140) or to move the electronic component holding part 8 upward (step S160) by the cooling time instead of detecting the solder temperature ).

(Main effect of this embodiment)

As described above, the electronic component joining apparatus 1 has the electronic component lifting mechanism 2 for lifting and moving the electronic component holding portion 8 holding the electronic component M toward the substrate P, The electronic component M is moved from the position separated by the substrate P to the position where the electronic component electrode Ml of the electronic component M and the substrate electrode P1 of the substrate P are in contact with each other, The electronic component electrode M 1 of the substrate P and the substrate electrode P 1 of the substrate P can be bonded together via solder as a metal capable of thermal melting.

The electronic part lifting mechanism 2 is a mechanism for lifting and lowering the electronic component M until the distance between the electronic component electrode M1 of the electronic component M and the substrate electrode P1 of the substrate P becomes a predetermined distance D1. A high speed moving mechanism 6 for moving the holding part 8 at a high speed and a high speed moving mechanism 6 for moving the holding part 8 at a predetermined distance And a piezoelectric driving unit 7 using the piezoelectric element as a driving source as a low-speed moving mechanism for moving the electronic component holding unit 8 at a lower speed than the high speed after the electronic component holding unit 8 becomes the driving unit D1.

The distance between the electronic component electrode M 1 of the electronic component M and the substrate electrode P 1 of the substrate P is set to be It is possible to increase the precision of the control of the movement amount and the load weight of the electronic component holder 8 after the predetermined distance D1 has been reached.

The electronic component bonding apparatus 1 includes a load sensor 22 for detecting a load acting on the electronic component M held by the electronic component holding portion 8 from the side where the substrate P is placed, A noise detection sensor 20 that detects noise acting on the sensor 22 and a noise sensor 22 that detects the noise signal V3 detected by the load sensor 22 based on the noise signal V3 detected by the noise detection sensor 20 And a control section 4 as a noise signal removing means for removing noise from the load sensor signal V2.

The movement of the electronic component holding portion 8 and the load weight can be controlled with high accuracy and the load sensor 22 is affected by the noise by using the piezo driver 7, The accuracy of control is lowered.

Thereupon, the noise detection sensor 20 is provided, and based on the noise signal V3 detected by the noise detection sensor 20, noise is detected from the load sensor signal V2 detected by the load sensor 22 It is possible to improve the precision of the control of the piezo driver 7.

The noise detection sensor 20, the load sensor 22, and the piezo drive 7 are arranged along the moving direction of the electronic component holder 8.

The piezoelectric driver 7 and the load sensor 22 are arranged along the moving direction of the electronic component holding portion 8 so that the detection of the load sensor 22 for detecting the load acting on the electronic component holding portion 8 Precision can be improved.

For example, when the arrangement direction of the piezo drive part 7 and the load sensor 22 is inclined with respect to the moving direction of the electronic component holding part 8, the load acting on the electronic component holding part 8 is a load There is a possibility that the sensor 22 is not sufficiently transmitted, and the detection accuracy of the load sensor 22 may be lowered.

In contrast, by arranging the piezo driving part 7 and the load sensor 22 along the moving direction of the electronic component holding part 8, the detection accuracy of the load sensor 22 can be improved.

The load sensor 22 detects a load acting in the moving direction of the electronic component holding portion 8.

Therefore, it is preferable to eliminate noise applied to the load sensor 22 in the moving direction of the electronic component holding portion 8 as much as possible.

Therefore, by arranging the noise detecting sensor 20 along the moving direction of the electronic component holding portion 8 with respect to the load sensor 22, the noise close to the noise acting on the load sensor 22 can be detected by the noise detecting sensor 20 ).

Thus, the detection accuracy of the load sensor 22 for detecting the load acting on the electronic component holding portion 8 can be improved.

The high-speed moving mechanism 6 moves the first moving part 14.

The piezo driving part 7 is provided in the second moving part 18 which is provided so as to be movable in the vertical direction with respect to the first moving part 14. [

The second moving part 18 is supported by the first moving part 14 via the load cell 17 while being urged downward by the spring 30 serving as the biasing means.

The spring 30 presses the second moving portion 18 downward, for example, with a force of 50 kg.

On the other hand, the pressing force by which the piezoelectric driver 7 presses the electronic component electrode M1 onto the substrate electrode P1 is, for example, about 0.5 N or so.

That is, the pressing force for pressing the second moving portion 18 downward by the spring 30 is extremely large as compared with the pressing force for pressing the electronic component electrode M1 onto the substrate electrode Pl by the piezo driving portion 7 .

Therefore, the electronic component electrode M 1 can detect contact with the substrate electrode P 1 by the load cell 17 in a state where the electronic component electrode M 1 is reliably pressed against the substrate electrode P 1, At the same time, the accuracy of displacement detection by the displacement sensor 21 and the accuracy of load detection by the load sensor 22 can be prevented from being lowered.

The magnitude of the force by which the spring 30 biases the second moving portion 18 downward is such that even when the piezo driving portion 7 presses the electronic component electrode M1 onto the substrate electrode Pl, The movable portion 18 does not move with respect to the first movable portion 14 (it can be floated).

The electronic component bonding apparatus 1 is a bonding apparatus for bonding an electronic component electrode M1 of an electronic component M and a substrate electrode P1 of a substrate P to a solder (a component side solder layer M2, The electronic component M and the substrate P are heated and a predetermined load is applied from the electronic component M to the substrate P The presence or absence of melting of the solder is determined by detecting the amount of movement of the electronic component M downward (steps S90 and S100) in a state where the electronic component M is constantly added (step S80).

(Another embodiment)

7, the electronic component joining apparatus 1 is provided with a band-stop filter 40 as a predetermined frequency signal removing means. The electronic component joining apparatus 1 includes a load sensor 22, The signal of the frequency of the natural vibration of the electronic component bonding apparatus 1 may be removed as the signal of the predetermined frequency.

The inventor of the present invention has found that most of the noise component of the load sensor signal is attributed to the natural vibration of the electronic component joining apparatus 1 by analysis (analysis).

Specifically, as a result of analyzing the frequency component of the load sensor signal V2 shown in Fig. 8, the frequency component shown in Fig. 9 was detected.

As shown in Fig. 9, the load sensor signal V2 (Fig. 8) has many frequency components of 130 Hz and 330 Hz.

On the other hand, as a result of analyzing the natural vibration of the electronic component bonding apparatus 1, it was found that there is natural vibration in the vicinity of 130 Hz and 330 Hz.

As a result of removing the 130 Hz and 330 Hz signals from the load sensor signal V2 shown in Fig. 8 by using the band-stop filter 40 as shown in Fig. 7, the load sensor signal V6 shown in Fig. It is possible to obtain a load sensor signal that is very suitable for the actual load of the load sensor 22 as shown in FIG.

11 is a view showing a load sensor signal V2-1 from which a signal of 130 Hz is removed from the load sensor signal V2 shown in Fig.

12 is a view showing a load sensor signal V2-2 from which the 330 Hz signal is removed from the load sensor signal V2 shown in Fig.

The frequency of the signal removed from the load sensor signal differs depending on the structure of the electronic component joining apparatus and the motor used, and the above-mentioned 130 Hz and 330 Hz are merely examples.

Further, by using a notch filter in the band-stop filter 40, only 130 Hz and 330 Hz, which are the frequencies of the natural vibration of the electronic component joining apparatus 1, can be precisely removed.

The signal of the frequency to be removed from the load sensor signal includes not only the signal of the frequency of the natural vibration of the electronic component joining apparatus 1 but also the frequency of the frequency of the natural vibration generated in the environment where the electronic component joining apparatus 1 is installed Signal may be targeted.

One… Electronic component joining device
2… Electronic component lifting mechanism
4… The control unit (noise signal removing means)
6 ... High-speed moving mechanism
7 ... Piezo drive (low-speed movement mechanism)
8… The electronic component-
14 ... The first moving part
17 ... Load cell
18 ... The second moving part
20 ... Noise detection sensor
22 ... Load sensor
30 ... Spring (biasing means)
40 ... The band-stop filter (predetermined frequency signal removing means)
V2 ... Load sensor signal (load signal)
V3 ... Noise signal
M ... Electronic parts
M1 ... Electronic component electrode (electrode of electronic component)
M2 ... The component side solder layer
P ... Board
P1 ... The substrate electrode (electrode of the substrate)
P2 ... The substrate-side solder layer

Claims (6)

And an electronic component lifting mechanism for lifting and moving the electronic component holding portion holding the electronic component toward the substrate, wherein the electronic component is moved from a position spaced apart from the substrate to a position at which the electrode of the electronic component contacts the electrode of the substrate An electrode of the electronic component and an electrode of the substrate are bonded to each other through a thermally fusible metal,
The electronic component lifting mechanism includes:
A fast moving mechanism for moving the electronic component holder at a first speed until a distance between an electrode of the electronic component and an electrode of the substrate becomes a predetermined distance;
And a low speed moving mechanism for moving the electronic component holding portion at a second speed lower than the first speed after a distance between the electrode of the electronic component and the electrode of the substrate reaches the predetermined distance,
The high-speed moving mechanism moves the first moving part,
Wherein the low-speed moving mechanism is provided in a second moving part which is provided so as to be vertically movable with respect to the first moving part,
The second moving portion is supported by the first moving portion via the load cell in a state where the second moving portion is urged downward by the urging means,
The driving source of the slow moving mechanism is a piezo element
And the electronic component is bonded to the electronic component. The method according to claim 1,
A load sensor for detecting a load acting on the electronic component held by the electronic component holding portion from a side on which the substrate is placed;
A noise detection sensor for detecting a noise acting on the load sensor,
And noise signal removing means for removing noise from a load signal detected by said load sensor based on a noise signal detected by said noise detecting sensor. 3. The method of claim 2,
Wherein the noise detecting sensor, the load sensor, and the low-speed moving mechanism are arranged along a moving direction of the electronic component holding portion. The method according to claim 1,
A load sensor for detecting a load acting on the electronic component held by the electronic component holding portion from a side on which the substrate is placed;
And a predetermined frequency signal removing means for removing a signal of a predetermined frequency from a load signal detected by the load sensor. An electronic component joining method for joining an electrode of an electronic component and an electrode of a substrate via a metal capable of heat melting,
An electronic component joining apparatus according to any one of claims 1 to 4, wherein the electronic component and the substrate are heated, and a predetermined load is applied to the substrate from the electronic component The presence or absence of the melting of the metal is determined by detecting the amount of movement of the electronic component downward
Wherein the electronic parts are bonded to each other. delete
KR1020157028214A 2014-03-28 2015-02-25 Method and device for joining electronic component KR101775448B1 (en)

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