CN105230138B - Electronic component engagement device and electronic component joint method - Google Patents
Electronic component engagement device and electronic component joint method Download PDFInfo
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- CN105230138B CN105230138B CN201580000563.3A CN201580000563A CN105230138B CN 105230138 B CN105230138 B CN 105230138B CN 201580000563 A CN201580000563 A CN 201580000563A CN 105230138 B CN105230138 B CN 105230138B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75824—Translational mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/7592—Load or pressure adjusting means, e.g. sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Abstract
Electronic component engagement device provided by the invention can accurately control the pressing force and amount of movement of electronic component maintaining part；Electronic component engagement device (1) has electronic component elevating mechanism (2) of the electronic component maintaining part (8) for making to maintain electronic component (M) relative to circuit board (P) lifting moving, electronic component (M) is set to be moved to the position that the electronic component electrode (M1) of electronic component (M) is contacted with the circuit board electrode (P1) of circuit board (P) from the position far from circuit board (P), and the metal by capableing of heat fusing is engaged electronic component electrode (M1) with circuit board electrode (P1)；Electronic component elevating mechanism (2) include make electronic component maintaining part (8) high-speed mobile to the distance between electronic component electrode (M1) and circuit board electrode (P1) become predetermined distance (D1) position high-speed moving mechanism (6) and after the distance between electronic component electrode (M1) and circuit board electrode (P1) become predetermined distance (D1), keep electronic component maintaining part (8) mobile and with the Piezoelectric Driving portion (7) of piezoelectric element driving source using speed when being lower than high-speed mobile.
Description
Technical field
The present invention relates to the electronic component engagement devices for engaging electronic component and circuit board etc..
Background technique
(installation) electronic component is engaged by the scolding tin of heat fusing like that disclosed in such as patent document 1 at present it is known that having
Electrode and circuit board electrode device.In the device, the electrode of the electronic component in electronic component maintaining part will remain in
Pressing on an electrode of a circuit board, and heats electronic component and circuit board, makes to be laminated scolding tin melting on the electrode, from
And electrode is engaged with each other by scolding tin.When carrying out the engagement, if electrode to electronic component and between the electrode of circuit board
Apply excessive pressing force, then may result in electrode damage.In addition, being melted if continuing to press after scolding tin melting
Scolding tin can be extruded outflow, it is possible to because outflow scolding tin and keep adjacent electrode short-circuit to each other.Therefore, suitably
Ground sets the pressing force between the electrode of electronic component and the electrode of circuit board, and controls electricity according to the molten condition of scolding tin
Movement of the subassembly towards circuit board.
[existing technical literature]
[patent document]
Patent document 1: JP Publication, special open No. 2011-254032 number
Summary of the invention
But due to be laminated scolding tin on the electrode with a thickness of tens of μm or so, thus require electronic component engagement dress
Set the pressing force and amount of movement that must accurately control electronic component maintaining part.Therefore, the purpose of the present invention is to provide one
Kind can accurately control the pressing force of electronic component maintaining part and the electronic component engagement device of amount of movement.
In order to solve the above problems, electronic component engagement device of the invention has the ministry of electronics industry for making to maintain electronic component
Electronic component elevating mechanism of the part maintaining part relative to circuit board lifting moving, also, electronic component engagement device makes the ministry of electronics industry
Part is moved to the position that the electrode of electronic component is contacted with the electrode of circuit board from the position far from circuit board, and passing through being capable of heat
Molten metal is engaged the electrode of electronic component with the electrode of circuit board；There is electronic component elevating mechanism high speed to move
Motivation structure and low speed mobile mechanism, wherein high-speed moving mechanism makes electronic component maintaining part high-speed mobile to the electricity of electronic component
The distance between pole and the electrode of circuit board become at the position of predetermined distance, in the electrode of electronic component and the electrode of circuit board
The distance between become predetermined distance after, low speed mobile mechanism be lower than high-speed mobile when speed make electronic component maintaining part
Mobile, the driving source of low speed mobile mechanism is piezoelectric element.
In addition, electronic component engagement device has in another implementation form of the invention: load cell, detection
The load being maintained on the electronic component of electronic component maintaining part is acted on from the configuration side of circuit board；Noise measuring sensor,
It detects the noise acted on load cell；And noise signal removing unit, basis are detected by noise measuring sensor
Noise signal out removes noise from the load signal detected by load cell.
In addition, in another implementation form of the invention, noise measuring sensor, load cell and low speed moving machine
Structure along electronic component maintaining part moving direction and arrange.
In addition, high-speed moving mechanism keeps first movement portion mobile, low speed moving machine in another implementation form of the invention
Structure is mounted in the second moving portion, and the second moving portion is mounted on first movement portion in a manner of it can move in the up-down direction
On, also, the second moving portion is supported with the state for applying active force downward by force application part via load cell
In first movement portion.
In addition, electronic component engagement device has configuration of the detection from circuit board in another implementation form of the invention
Side acts on the load cell for the load being maintained on the electronic component of electronic component maintaining part and examines from by load cell
The constant-frequency signal removing mechanism of the signal of assigned frequency is removed in the load signal measured.
In order to solve the above problems, by capableing of the metal of heat fusing for the electrode of the electrode of electronic component and circuit board
In the electronic component joint method engaged, by being heated to electronic component and circuit board, and with from electronic component
The defined state loaded, the amount of movement that detection electronics move downward, to judge fixedly are applied to circuit board
Whether metal melts.
(invention effect)
In accordance with the invention it is possible to accurately control the pressing force and amount of movement of electronic component maintaining part.
Detailed description of the invention
Fig. 1 is the figure for indicating the schematic configuration of electronic component engagement device of embodiment of the present invention.
Fig. 2 is the block diagram electrically constituted that electronic component engagement device is outlined.
Fig. 3 is the enlarged drawing of part A shown in FIG. 1.
Fig. 4 is the flow chart for indicating the movement of electronic component engagement device of embodiment of the present invention.
Fig. 5 be indicate embodiment of the present invention electronic component engagement device movement during piezoelectricity apply signal, load
Sensor signal, noise signal, displacement transducer signal, load corrector signal variation explanatory diagram.
Fig. 6 is the specified position and electronics indicated when electronic component maintaining part high speed decline being made to be moved to specified position
The figure at the interval between component and circuit board.
Fig. 7 is the frame electrically constituted that the electronic component engagement device that another embodiment of the present invention is related to is outlined
Figure.
Fig. 8 is the figure for indicating the example of load cell signal.
Fig. 9 is the figure of the analysis result for the frequency content for indicating load cell signal shown in Fig. 8.
Figure 10 is the signal indicated from after the signal for removing 130Hz and 330Hz in load cell signal shown in Fig. 8
Figure.
Figure 11 is the load cell letter indicated from after the signal for removing 130Hz in load cell signal shown in Fig. 8
Number figure.
Figure 12 is the load cell letter indicated from after the signal for removing 330Hz in load cell signal shown in Fig. 8
Number figure.
(symbol description)
1 electronic component engagement device
2 electronic component elevating mechanisms
4 control units (noise signal removing unit)
6 high-speed moving mechanisms
7 Piezoelectric Driving portions (low speed mobile mechanism)
8 electronic component maintaining parts
14 first movement portions
17 load cells
18 second moving portions
20 noise measuring sensors
22 load cells
30 springs (force application part)
40 bandstop filters (constant-frequency signal removing mechanism)
V2 load cell signal (load signal)
V3 noise signal
M electronic component
M1 electronic component electrode (electrode of electronic component)
M2 component side soldering-tin layer
P circuit board
P1 circuit board electrode (electrode of circuit board)
P2 board side soldering-tin layer
Specific embodiment
(the electronic component engagement device 1 of present embodiment)
Hereinafter, being illustrated referring to attached drawing to the electronic component engagement device 1 that embodiment of the present invention is related to.Below
In explanation, the direction arrow X1 is set as the upside of electronic component engagement device 1, the direction arrow X2 is set as downside, in addition, by arrow
Head Y1 direction, which is set as left side, the direction arrow Y2 is set as to right side is illustrated.Moreover, by be set as on the outside of paper vertical direction
The operator standing place of operation electronic component engagement device 1 is that front is illustrated.
(overall structure of electronic component engagement device 1)
Fig. 1 is the figure that the overall structure of electronic component engagement device 1 is outlined.Fig. 2 is that electronic component is outlined to connect
Attach together set 1 the block diagram electrically constituted.Fig. 3 is the enlarged drawing of part A shown in FIG. 1.As shown in Figure 1, electronic component engagement dress
Setting 1 has electronic component elevating mechanism 2 and circuit board arrangement portion 3, in addition, as shown in Fig. 2, electronic component engagement device 1 also has
There is control unit 4.As shown in figure 3, circuit board P is configured in circuit board arrangement portion 3, in addition, the electronic component engaged with circuit board P
M is maintained on electronic component elevating mechanism 2.Electronic component M includes semiconductor chip, transistor, diode etc..
(electronic component elevating mechanism 2)
Electronic component elevating mechanism 2 has bottom plate 5, high-speed moving mechanism 6, the Piezoelectric Driving portion as low speed mobile mechanism
7 and electronic component maintaining part 8.Bottom plate 5 is mounted on the frame (not shown) or framework for being set to ground etc..
(high-speed moving mechanism 6)
High-speed moving mechanism 6 has motor 9, ball-screw 10 and ball-screw nut 11.Ball-screw 10 via
Shaft coupling (interconnecting piece) 12 is connect with the output shaft 13 of motor 9.Ball-screw nut 11 is fixed in first movement portion 14.
In addition, ball-screw nut 11 is screwed togather with ball-screw 10.First movement portion 14 is via the first guide portion being fixed on bottom plate 5
15 and be installed on bottom plate 5.First guide portion 15 guides first movement portion 14 in a manner of it can move in the up-down direction.
That is, the high-speed moving mechanism 6 with above-mentioned composition can make first movement portion 14 in the up-down direction under the driving of motor 9
It is mobile.
High-speed moving mechanism 6 has displacement sensor 16, so as to detect first movement portion 14 in the up-down direction
Amount of movement, the amount of movement that moves electronic component maintaining part 8 in the up-down direction by high-speed moving mechanism 6.Displacement passes
Sensor 16 can be made of such as linear encoder (linear encoder).
(the second moving portion 18)
Second moving portion 18 is supported in first movement portion 14 via load cell (load cell) 17.In addition,
The spring 30 as force application part is equipped between first movement portion 14 and the second moving portion 18.Spring 30 is from first movement portion 14
Reaction force is obtained, and active force downward is applied to the second moving portion 18 using the reaction force.Second moving portion 18
It is installed in first movement portion 14 via the second guide portion 19 being fixed in first movement portion 14.Second guide portion 19 with
The mode that can be moved in the up-down direction guides the second moving portion 18.That is, the second moving portion 18 via the second guide portion 19 with
The mode that can be moved in the up-down direction is supported in first movement portion 14.Second guide portion 19, which can be used, for example intersects
Roller guide rail (cross roller guide) is constituted.Through such composition, in high rigidity the second moving portion 18 can be protected
It holds in first movement portion 14.Pneumatic type guide rail (air slide guide) also can be used in second guide portion 19.In such structure
In the case where, compared with when using crossed roller guide rail, second can be moved with the state that precision is high and resistance to sliding is small
Portion 18 is supported in first movement portion 14 in a manner of it can move in the up-down direction.
When applying lifting force to the second moving portion 18 from below, the second moving portion 18 is relative to 14 direction of first movement portion
Top is mobile, therefore the lifting force acted in the second moving portion 18 can be measured by load cell 17.
In the second moving portion 18, be sequentially installed with from top (14 side of first movement portion) noise measuring sensor 20,
Load cell 22, displacement sensor 21, Piezoelectric Driving portion 7, ceramic heater 23 and electronic component maintaining part 8.In addition, making an uproar
Sound detection sensor 20, load cell 22 and Piezoelectric Driving portion 7 along electronic component maintaining part 8 moving direction, i.e. on
Lower direction and arrange.
(Piezoelectric Driving portion 7)
Piezoelectric Driving portion 7 has the piezoelectric element of illustration omitted, and is applied according to the piezoelectricity being applied on the piezoelectric element
Signal V1 (referring to Fig. 5) moves electronic component maintaining part 8 downward.Piezoelectric Driving portion 7 is configured to piezoelectric element
Deflection be directly passed to electronic component maintaining part 8, be also configured to piezoelectric element through amount of movement enlarger
Electronic component maintaining part 8 is passed to after deflection amplification.
(displacement sensor 21)
Displacement sensor 21 is the sensor of the amount of movement of detection electronics maintaining part 8, and detection accuracy is substantially
0.01 μm of rank (level), can be used such as capacitive displacement transducer.Capacitive displacement transducer has opposite
Fixed electrode (not shown) and movable electrode (not shown), and utilize capacitance variations caused by the relative movement of two electrodes
And measure the sensor of the amount of movement of electronic component maintaining part 8, wherein fixed electrode is fixed not relative to the second moving portion 18
Dynamic, movable electrode is correspondingly moved with the amount of movement of the electronic component maintaining part 8 moved under the driving in Piezoelectric Driving portion 7
It is dynamic.
(load cell 22, noise measuring sensor 20)
Load cell 22 is the sensor for detecting the load being applied in electronic component maintaining part 8 from below, detection
Precision substantially 0.01N~5N rank, can be used such as piezoelectric element.Noise measuring sensor 20 is that detection acts on load
The sensor of noise on sensor 22, detection accuracy is identical as load cell 22, and it is preferable to use with load cell
22 identical sensors.
(electronic component maintaining part 8)
Electronic component maintaining part 8 can adsorb electronic component M.Do not scheme that is, being equipped on the bottom surface of electronic component maintaining part 8
The hole portion shown, the hole portion are formed negative pressure state by attracting mechanism (not shown), so as to by producing in the hole portion
Raw negative pressure and adsorb electronic component M.
(ceramic heater 23)
Ceramic heater 23 (can be recorded as below the electrode for the electronic component M being maintained in electronic component maintaining part 8
" electronic component electrode ") M1 (referring to Fig. 6) is heated, to keep the soldering-tin layer formed on electronic component electrode M1 (following
It is recorded as " component side soldering-tin layer ") M2 (referring to Fig. 6) melting.
Second moving portion 18 has motor 24.Electronic component maintaining part 8 from noise measuring sensor 20 to lower section is
Component only is configured to be in the driving integrally moved, also, pass through motor 24, and electronic component maintaining part 8 can be made to exist
Rotation in horizontal plane.
(circuit board arrangement portion 3)
Circuit board arrangement portion 3 has for the objective table 25 of configuration circuit plate P and via objective table 25 to circuit board P's
The heater 26 that electrode portion (being recorded as " circuit board electrode " below) P1 is heated.Circuit board arrangement portion 3 has can be on a left side
The movable stage mechanism for the illustration omitted that right direction (direction Y1-Y2) and front and back move up, objective table 25 and heater
26 are mounted on the movable stage mechanism.That is, objective table 25 and heater 26 can be moved up with front-rear direction in left and right directions
It is dynamic.
Control unit 4 (referring to Fig. 2) is the computer with the CPU and memory etc. for carrying out signal processing.It is deposited in memory
Contain control program and the control data etc. for controlling electronic component engagement device 1.As shown in Fig. 2, control unit 4 is according to coming from
The signal of displacement sensor 16, load cell 17, displacement sensor 21 and load cell 22 etc., to motor 9, piezoelectricity
The movement of driving portion 7, ceramic heater 23 and heater 26 etc. is controlled.
As shown in fig. 6, the electronic component M for being maintained at 8 front end of electronic component maintaining part is equipped with multiple electronic component electrodes
M1 is formed with component side soldering-tin layer M2 on the surface of multiple electronic component electrode M1.In addition, being configured on objective table 25
Circuit board P is equipped with multiple circuit board electrode P1, is formed with soldering-tin layer on the surface of multiple circuit board electrode P1 and (is recorded as below
" board side soldering-tin layer ") P2.Electronic component electrode M1 is configured to connect with corresponding with circuit board electrode P1.
The thickness of the board side soldering-tin layer P2 of the thickness and circuit board electrode P1 of the component side soldering-tin layer M2 of electronic component electrode M1 is equal
It is tens of μm or so.Therefore, melt component side soldering-tin layer M2 and board side soldering-tin layer P2, and by electronic component electrode M1
When being electrically connected with circuit board electrode P1, it is necessary between accurately managing between electronic component electrode M1 and circuit board electrode P1
Every, caused with preventing electronic component electrode M1 from contacting with circuit board electrode P1 electronic component electrode M1 or circuit board electrode P1 by
Damage or the scolding tin of melting make between adjacent electronic component electrode M1 or short circuit between circuit board electrode P1.
Electronic component engagement device 1 carries out the joint action illustrated referring to Fig. 4, Fig. 5 by having above-mentioned composition,
The interval between electronic component electrode M1 and circuit board electrode P1 can accurately be managed.Fig. 4 is to indicate that electronic component engages
The figure of the motion flow of device 1.Fig. 5 is that medelling indicates that piezoelectricity applies signal V1, load cell signal V2, noise signal
The figure of the variable condition of V3, displacement transducer signal V4 and load corrector signal V5.
Piezoelectricity applies the voltage signal that signal V1 is applied to Piezoelectric Driving portion 7.Load cell signal V2 is according to work
For load cell 22 load and the voltage signal that exports.Noise signal V3 is that basis acts on noise measuring sensor
20 noise and the voltage signal exported.Displacement transducer signal V4 is protected according to the amount of movement of piezoelectric element, i.e. electronic component
The voltage signal holding the amount of movement in portion 8 and being exported from displacement sensor 21.Load corrector signal V5 is according to V3 pairs of noise signal
Load cell signal V2 be corrected after voltage signal.That is, load corrector signal V5 is from load cell signal V2
Voltage signal after removing noise element.
Control unit 4 generates load corrector signal V5, and measures according to the load corrector signal V5 and act on electricity from below
Load in subassembly maintaining part 8, wherein load corrector signal V5 is according to the noise detected by noise measuring sensor 20
Signal V3, the signal after removing noise in the load cell signal V2 detected by load cell 22.
(movement of electronic component engagement device 1)
Hereinafter, being illustrated for the movement of electronic component engagement device 1.The configuration of electronic component maintaining part 8 is shown in Fig. 1
State at position of readiness, wherein the position of readiness, which refers to, makes electronic component maintaining part by electronic component elevating mechanism 2
8 begin to decline before position.In this state, the board side of each electronic component electrode M1 and each circuit board P of electronic component M
Soldering-tin layer P2 is in the state being mutually aligned respectively on front and back and left and right directions.The alignment can pass through following manner reality
It is existing, it may be assumed that keep objective table 25 mobile towards direction all around by the movable stage mechanism of illustration omitted and pass through electronic
Machine 24 rotates electronic component maintaining part 8 in the horizontal plane.
(step S10)
Control unit 4 drives motor 9, thereby executing make electronic component maintaining part 8 from position of readiness shown in FIG. 1
The high speed lowering action (step S10) of high-speed mobile downward.Ball-screw 10 is revolved by the rotation of motor 9
Turn.The ball-screw nut 11 screwed togather with ball-screw 10 is fixed in first movement portion 14.Therefore, pass through ball-screw 10
It rotates and guides ball-screw nut 11 mobile, thus move first movement portion 14 downward, electronic component maintaining part 8
Decline together with first movement portion 14.Speed of the decrease speed than making electronic component M decline as described by Piezoelectric Driving portion 7
Fastly, for example, 500mm/s.
(step S20, S30)
Control unit 4 detects down position by displacement sensor 16, and electronic component maintaining part 8 is made to drop to specified position S
(referring to Fig. 6) (step S20, S30).Specified position S is the circuit of the electronic component electrode M1 and circuit board P of electronic component M
Plate side soldering-tin layer P2 as close to but discontiguous position.In order to improve operating efficiency, motor 9 is with the progress of high torque (HT) state
Driving, so as to decline electronic component M at a high speed as far as possible.Therefore, if by with the motor 9 of high torque (HT) state-driven
And the circuit board electrode P1 of the electronic component electrode M1 and circuit board P of the electronic component M declined collides, it is likely that cause
Electronic component M or circuit board P is impaired.Therefore, electronic component engagement device 1 makes 8 high speed of electronic component maintaining part drop to regulation
Then position S when make further lowering of from the specified position S movement of electronic component maintaining part 8, as described below, passes through
The driving force in Piezoelectric Driving portion 7 and with the state of low-load carry out (step S40, S50).
As shown in fig. 6, specified position S refers to following positions, it may be assumed that the electronic component electrode M1 of electronic component M is relative to electricity
The position of the circuit board electrode P1 of road plate P separating distance D1 (such as 100 μm) upward.Specified position S is in following institute
It states and starts to carry out like that be set before joint action.
Electronic component M is maintained in electronic component maintaining part 8, makes electronic component maintaining part 8 towards being configured at objective table
Circuit board P decline on 25, and contact electronic component electrode M1 with circuit board electrode P1.Control unit 4 is according to load cell
17 output signal and whether detection electronics electrode M1 contacts with circuit board electrode P1, and measured by displacement sensor 16
Position when electronic component electrode M1 and circuit board electrode P1 are contacted.The contact position measured by displacement sensor 16, can
Using the electricity of moving distance or circuit board P as electronic component maintaining part 8 from the initial position before electronic component M decline
Height of the road plate electrode P1 apart from objective table 25 and detected.Then, according to contact position, will upward with the contact position
The position that the distance for setting separation is D1 is set as specified position S, and stores it in the memory of control unit 4.Here, excellent
Choosing: for muti-piece, such as three pieces, the position that is contacted with circuit board electrode P1 four pieces of circuit board P measurement electronic component electrode M1, and
Specified position S is set according to its average value.
In addition, spring 30 applies the active force downward of such as 50kg to the second moving portion 18.Therefore, it can incite somebody to action
Electronic component electrode M1 is reliably pressed in the state of on circuit board electrode P1, detects the ministry of electronics industry by load cell 17
Whether part electrode M1 contacts with circuit board electrode P1.The active force of spring 30 is very big compared with the driving force in Piezoelectric Driving portion 7.Cause
This, is when the driving force by Piezoelectric Driving portion 7 declines electronic component maintaining part 8 with low-load state, the second moving portion
18 is fixed relative to first movement portion 14.Therefore, displacement sensor 21 can be prevented for the detection accuracy of displacement or born
Set sensor 22 reduces the detection accuracy of load.
Piezoelectric Driving portion 7 is set as by electronics by the pressing force that spring 30 is applied to downward in the second moving portion 18
Such as 500 times to 1500 times or so of pressing force of the member electrode M1 pressing on circuit board electrode P1, can be by the ministry of electronics industry
Part electrode M1 is reliably pressed in the state of on circuit board electrode P1, detects electronic component electrode by load cell 17
Whether M1 contacts with circuit board electrode P1, and displacement sensor 21 can be prevented for the detection accuracy or load-transducing of displacement
Device 22 reduces the detection accuracy of load.It is set by the pressing force that spring 30 is applied to downward in the second moving portion 18
700 times to 1200 times of pressing force for Piezoelectric Driving portion 7 by electronic component electrode M1 pressing on circuit board electrode P1, can
It detects whether electronic component electrode M1 contacts with circuit board electrode P1 better by load cell 17, and can prevent
Displacement sensor 21 reduces the detection accuracy of load the detection accuracy or load cell 22 of displacement.
Control unit 4 makes electronic component maintaining part 8 drop to specified position S (being "Yes" in step S20), stops motor 9
It is only driven (step S30).In addition, control unit 4 passes through PID (proportional-integral-differential, ratio
Example integral differential) it controls and electronic component maintaining part 8 is made to drop to specified position S.It, being capable of high-precision by carrying out PID control
Ground makes electronic component maintaining part 8 be moved to specified position S.State (the step of specified position S is dropped in electronic component maintaining part 8
Rapid S30) under, the circuit board electrode P1 of the electronic component electrode M1 and circuit board P of electronic component M are configured as: mutually not in contact with,
But it is separated by minimum distance, for example above-mentioned distance D1.
Make electronic component electrode M1 and circuit board electricity about from the configuration of electronic component maintaining part 8 in the state of specified position S
The movement of pole P1 contact is by keeping electronic component maintaining part 8 slow with low-load state using Piezoelectric Driving portion 7 as described below
Ground is mobile and carries out.Therefore, distance D1 is smaller in the discontiguous range of electronic component electrode M1 and circuit board electrode P1, then gets over
Can shorten makes electronic component maintaining part 8 be moved to what electronic component electrode M1 was contacted with circuit board electrode P1 from specified position S
Working hour needed for position.But control precision, temperature when in view of keeping electronic component maintaining part 8 mobile using motor 9
Whens tolerance variation and the individual difference of electronic component M and circuit board P of electronic component engagement device 1 caused by equal environment etc.,
If distance D1 is too small, when declining electronic component maintaining part 8 by motor 9, electronic component electrode M1 may be with electricity
Road plate electrode P1 contact.Therefore, although distance D1 is the smaller the better, preferably according to the movement of above-mentioned electronic component maintaining part 8
It controls individual difference of precision, the tolerance variation of electronic component engagement device 1 and electronic component M and circuit board P etc. and is set as
Electronic component electrode M1 and the discontiguous distance of circuit board electrode P1.
(step S40, S50)
Then, as shown in the part after the time T=0 in Fig. 5, control unit 4 applies piezoelectricity to Piezoelectric Driving portion 7 and applies
Signal V1 executes the detection operation (step S40, S50) of detection electronics electrode M1 and the position contacted circuit board electrode P1.
Electronic component maintaining part 8 is correspondingly moved with the size that piezoelectricity applies signal V1, is detected by displacement sensor 21
The amount of movement of electronic component maintaining part 8 is simultaneously exported as displacement transducer signal V4.
Control unit 4 judges whether electronic component electrode M1 contacts with circuit board electrode P1 according to load corrector signal V5.
As described above, load corrector signal V5 is to remove (elimination) from the load cell signal V2 of load cell 22 to be examined by noise
Voltage signal after surveying the noise signal V3 that sensor 20 detects.That is, load corrector signal V5 is to indicate to act on from below
The signal of load in electronic component maintaining part 8.
As shown in figure 5, the voltage that piezoelectricity applies signal V1 becomes larger since time T=0.Piezoelectric Driving portion 7 makes electricity
Subassembly maintaining part 8 moves downward amount of movement corresponding with the piezoelectricity application size of signal V1.Then, work as electronic component
When electrode M1 and board side soldering-tin layer P2 are contacted, loaded due to applying from below to electronic component maintaining part 8, thus such as the time
It is shown when T=t1, riser portions are generated in load corrector signal V5.When load corrector signal V5 becomes assigned voltage VA, control
Portion 4 processed is judged as that electronic component electrode M1 contacts (being "Yes" in step S50) with circuit board electrode P1.In addition, control unit 4 passes through
PID control and keep electronic component maintaining part 8 mobile so that load corrector signal V5 become as defined in voltage VA.
(step S60)
Here, displacement when load corrector signal V5 becomes assigned voltage VA passes shown in when such as time T=t1 in Fig. 5
The voltage VB of sensor signal V4 is led to after so that electronic component maintaining part 8 is dropped to specified position S with the driving by motor 9
Cross the corresponding voltage of distance that Piezoelectric Driving portion 7 keeps electronic component maintaining part 8 mobile further towards lower section.The distance is electricity
When subassembly maintaining part 8 is moved to specified position S between electronic component electrode M1 and circuit board electrode P1 it is actual interval (away from
From), and be the detecting distance that electronic component maintaining part 8 declines in detection operation (step S40, S50).It will be with the detecting distance
The voltage of corresponding displacement transducer signal V4 is stored in the storage that control unit 4 has as detecting distance corresponding voltage VB
In device (step S60).
Then, in the detection operation (step S40) in bind electronic components M next time and circuit board P, the inspection is reached
Before predetermined distance of the ranging from the range of, accelerate the decrease speed of electronic component maintaining part 8.That is, believing in displacement sensor
Before number V4 becomes assigned voltage relative to detecting distance corresponding voltage VB, accelerates piezoelectricity and applies pushing the speed for signal V1,
To accelerate the decrease speed of electronic component maintaining part 8.Thereby, it is possible to shorten carry out detection operation (step S40, S50) when
Between.
For example, accelerating piezoelectricity before 40% that displacement transducer signal V4 reaches detecting distance corresponding voltage VB and applying
Signal V1's pushes the speed.Electronic component maintaining part 8 is moved to electronic component electrode M1 and circuit board electrode when the S of specified position
Actual interval between P1, the variation of the difference according to caused by temperature of electronic component engagement device 1 etc. or circuit board P's is curved
Bent situation etc. and change.Therefore, if the predetermined distance pushed the speed for accelerating piezoelectricity application signal V1 is too long, electronics
Member electrode M1 is possible to collide with circuit board electrode P1.By the way that the assigned voltage is set as detecting distance corresponding voltage VB
30% or more and 70% hereinafter, electronic component electrode M1 can sufficiently reduce and possibility that circuit board electrode P1 collides
Property, and can effectively shorten the time for carrying out detection operation (step S40).
In addition, the detecting distance also can reflect in the S of specified position.Although that is, before starting to carry out joint action
Specified position S is set, still, according to the tolerance variation of electronic component engagement device 1 and electronic component M and circuit board P
Individual difference etc., occasionally there are so that electronic component maintaining part 8 is moved to the case where distance after the S of specified position is not distance D1.
When distance after making electronic component maintaining part 8 be moved to specified position S is greater than distance D1, due to working hour it is elongated and
It is undesirable, conversely, when the distance after making electronic component maintaining part 8 be moved to specified position S is less than distance D1, electronic component electricity
Pole M1 is contacting by pressure in excessive pressing force with circuit board electrode P1, it is possible to leading to electronic component M or circuit board P
It is impaired.In contrast, electronic component maintaining part 8 is dropped to after the S of specified position by basis,
Specified position S is updated using the distance (detecting distance) that Piezoelectric Driving portion 7 keeps electronic component maintaining part 8 mobile, can be shortened
Working hour or prevent electronic component electrode M1 with circuit board electrode P1 contacting by pressure in excessive pressing force.
When load corrector signal V5 becomes assigned voltage VA, that is, it is judged as electronic component electrode M1 and circuit board electrode P1
When contact, as shown in the part between time T=t1~t2 in Fig. 5, reduces piezoelectricity for the time being and apply signal V1.As a result, in electricity
When subassembly electrode M1 and circuit board electrode P1 are contacted, the overshoot (overshoot) of electronic component maintaining part 8 can be prevented, from
And electronic component electrode M1 and circuit board electrode P1 can be prevented impaired.
(step S70, S80, S90, S100)
When electronic component electrode M1 contacts (being "Yes" in step S50) with circuit board electrode P1, control unit 4 adds ceramics
Hot device 23 and heater 26 start to be heated.Then, in the state for contacting electronic component electrode M1 with circuit board electrode P1
Under, as shown in the part of time T=t2~t3 in Fig. 5, control unit 4 is gradually increased piezoelectricity and applies signal V1, from electronic component
Electrode M1 applies defined load (such as 0.5N) (step S70) to circuit board electrode P1.Sentenced according to load corrector signal V5
It is disconnected whether from electronic component electrode M1 to circuit board electrode P1 to be applied with defined load.For example, when load corrector signal V5 becomes
When for voltage VC, it is judged as from electronic component electrode M1 to circuit board electrode P1 and is applied with defined load.
The size of the defined load is as follows, it may be assumed that will not cause to damage to electronic component M and circuit board P, also, as follows
It is described, it, can be by displacement sensor 21 with electronic component when component side soldering-tin layer M2 and board side soldering-tin layer P2 is melted
The form of the displacement of maintaining part 8 downward detects the melting.Then, when be judged as electronic component electrode M1 to circuit board electricity
When the load that pole P1 applies has reached defined load (load corrector signal V5 reaches voltage VC) (being "Yes" in step S70),
Control unit 4 controls piezoelectricity as shown in the part of time T=t3~t4 in Fig. 5 and applies signal V1, to keep this defined
It loads (step S80).It is controlled that is, applying signal V1 to piezoelectricity, so that load corrector signal V5 remains voltage VC (step
S80).At the same time, the position of electronic component maintaining part 8 (is recorded as " providing negative below when will be deemed as load as defined in reaching
Position when load ") at displacement transducer signal V4 value, voltage VD storage (step in memory when as specified loads
S80).In addition, control unit 4 keeps electronic component maintaining part 8 mobile by PID control, so that load corrector signal V5 becomes electricity
Press VC.
To component side soldering-tin layer M2 and board side soldering-tin layer P2 and making ceramic heater 23 and heater 26 generate heat
It is heated, so that it be made to start to melt.When component side soldering-tin layer M2 and board side soldering-tin layer P2 is melted, electronic component electricity
Reaction force when pole M1 presses circuit board electrode P1 reduces.On the other hand, the pressing force of electronic component maintaining part 8 is kept fixed
Constant (step S80).Therefore, electronic component maintaining part 8 moves downward (sinking).About component side soldering-tin layer M2 and circuit
Whether plate side soldering-tin layer P2 is molten, and 8 court of electronic component maintaining part of constant (step S80) can be kept fixed according to pressing force
Whether amount of movement (deflection) downwards has been more than specified value (such as 1 μm) to judge (step S100).
Specifically, control unit 4, which applies signal V1 to piezoelectricity, is controlled such that load corrector signal V5 remains voltage
VC, and position when measuring according to the variable quantity of displacement transducer signal V4 electronic component maintaining part 8 from specified loads (with
The corresponding position voltage VD when specified loads) rise moving distance (deflection of electronic component maintaining part 8) (step S90).
Then, judge whether the moving distance (deflection of electronic component maintaining part 8) has reached predetermined distance (such as 1 μm) (step
S100).About the judgement, when displacement transducer signal V4 is from specified loads voltage VD increase as defined in potential difference Δ V4 and
When becoming sinking voltage VE, it is judged as that the deflection of electronic component maintaining part 8 has reached predetermined distance and (has been in step S100
"Yes").Potential difference Δ V4 is preset as the potential difference for being equivalent to defined deflection, and is stored in control unit 4
Memory in.
(step S110)
(being "Yes" in step S100), control when being judged as that component side soldering-tin layer M2 and board side soldering-tin layer P2 are molten
Portion 4 processed makes electronic component maintaining part 8 stop declining as shown in the part of time T=t4~t5 in Fig. 5 and the position is kept (to sentence
The position of electronic component maintaining part 8 when breaking as component side soldering-tin layer M2 and board side soldering-tin layer P2 molten) (step
S110).That is, when being judged as that component side soldering-tin layer M2 and board side soldering-tin layer P2 are molten (being "Yes" in step S100),
Piezoelectricity application signal V1 is remained into voltage (step S110) at this time.
(step S120)
In the state of making electronic component maintaining part 8 stop declining and keeping its position (step S110), control unit 4 starts
Execute the cooling action (step S120) of the component side soldering-tin layer M2 and board side soldering-tin layer P2 of melting.In the cooling action
In (step S120), stop powering to ceramic heater 23 and heater 26, and the cooling tube 27 having to objective table 25
In be passed through air and electronic component M and circuit board P cooled down.The component side soldering-tin layer M2 and board side melted as a result,
Soldering-tin layer P2 is cooled and starts to solidify.
(step S130, S140)
However, the scolding tin of melting can be heat-shrinked while cooling.Therefore, the electronic component electrode M1 of electronic component M and
The scolding tin that the circuit board electrode P1 of circuit board P may be heat-shrinked is pulled and is damaged.Therefore, control unit 4 makes Piezoelectric Driving portion 7
It is driven and declines electronic component maintaining part 8 with thermal contraction when scolding tin is cooling, thereby executing electronic component is protected
Portion 8 is held with the thermal contraction of scolding tin and the servo-actuated movement (step S140) of the thermal contraction of movement.It is being heat-shrinked servo-actuated movement (step
S140 it in), so as to be kept fixed constant mode by the load (load corrector signal V5) that load cell 22 detects, drives
Dynamic pressure electric drive portion 7 and keep electronic component maintaining part 8 mobile.Due to the component side soldering-tin layer M2 and board side soldering-tin layer of melting
P2 is cooling and is heat-shrinked, thus adds piezoelectricity to Piezoelectric Driving portion 7 and apply signal V1, so that electronic component maintaining part 8 is micro-
Micro- decline.
About servo-actuated movement (step S140) is heat-shrinked, welded preferably for the component side soldering-tin layer M2 and board side of melting
Whether tin layers P2, which is cooled to defined temperature, is judged (step S130), and (step after the temperature as defined in being cooled to
It is "Yes" in S130) the servo-actuated movement of thermal contraction is executed, rather than just executed after cooling action (step S120) just starts.It is managed
By as follows.
When scolding tin is in molten condition, the ratio of thermal contraction caused by temperature change is smaller, furthermore, it is possible to because pole
Small power and deform.Therefore, when scolding tin is in molten condition, so that piezoelectricity is applied signal V1 and be kept fixed constant (step
S110), so that electronic component maintaining part 8 be made not move.Therefore, time point before curing will be started in scolding tin to be heat-shrinked
Servo-actuated movement (step S140).Predetermined temperature in step S130 is that scolding tin will start temperature before curing, for example, 220
℃.Between time T=t4~t5 shown in Fig. 5, the servo-actuated movement (step of thermal contraction is not executed cooling action has started yet
S140)。
(step S150, S160)
Then, control unit 4 makes electronic component maintaining part 8 execute the servo-actuated movement of thermal contraction, while detection part side soldering-tin layer
The temperature (step S150) of the scolding tin of M2 and board side soldering-tin layer P2.When detecting that scolding tin has reached cured temperature enough
(being "Yes" in step S150), control unit 4 releases electronic component maintaining part 8 to the attraction of electronic component M, and makes motor 9
It is driven and electronic component maintaining part 8 is made to move (step S160) upward.So far, joint action is completed, and will be bonded to
The circuit board P of electronic component M is removed from objective table 25.
In addition, the temperature of the scolding tin of component side soldering-tin layer M2 and board side soldering-tin layer P2, can by following manner into
Row speculates, it may be assumed that the temperature of such as electronic component maintaining part 8 is detected using temperature detection sensor (not shown), and according to the inspection
Testing temperature and the temperature for deducing scolding tin.Alternatively, it is also possible to replace detection (suppositions) scolding tin temperature, but according to cool down when
Between, start be heat-shrinked what servo-actuated movement (step S140) or start carried out moving electronic component maintaining part 8 upward
It acts (step S160).
(main effect of present embodiment)
As described above, electronic component engagement device 1 has the electronic component maintaining part 8 for making to maintain electronic component M opposite
In the mobile electronic component elevating mechanism 2 of circuit board P lifting (rising or falling), the electronic component engagement device 1, it can make
Electronic component M is moved to the circuit board of the electronic component electrode M1 and circuit board P of electronic component M from the position far from circuit board P
The position of electrode P1 contact, and by the scolding tin as the metal for capableing of heat fusing by the electronic component electrode M1 of electronic component M
It is engaged with the circuit board electrode P1 of circuit board P.Electronic component elevating mechanism 2 has high-speed moving mechanism 6 and as low speed movement
The Piezoelectric Driving portion 7 of mechanism, wherein high-speed moving mechanism 6 makes 8 high-speed mobile of electronic component maintaining part to the electricity of electronic component M
The distance between the circuit board electrode P1 of subassembly electrode M1 and circuit board P becomes at the position of defined distance D1, and piezoelectricity drives
Portion 7 is moved using piezoelectric element as driving source, in the circuit board electrode of the electronic component electrode M1 and circuit board P of electronic component M
After the distance between P1 becomes defined distance D1, keep electronic component maintaining part 8 mobile with speed when being lower than high-speed mobile.
Electronic component engagement device 1 through such composition, and Piezoelectric Driving portion 7 is used, it can be improved electronic component M's
The distance between the circuit board electrode P1 of electronic component electrode M1 and circuit board P becomes the electronic component after defined distance D1
The amount of movement of maintaining part 8 or the control precision of load capacity.
Electronic component engagement device 1, which includes to detect to act on from the configuration side of circuit board P, is maintained at electronic component maintaining part
The load cell 22 of load on 8 electronic component M, detection act on the noise measuring of the noise on the load cell 22
Sensor 20 and control unit 4 as noise signal removing unit, the control unit 4 are examined according to by the noise measuring sensor 20
The noise signal V3 measured removes noise from the load cell signal V2 detected by load cell 22.
By using Piezoelectric Driving portion 7, the amount of movement of electronic component maintaining part 8 or the control precision of load capacity are improved, but
On the other hand, since load cell 22 is influenced by noise, thus the control precision in Piezoelectric Driving portion 7 reduces.Therefore, lead to
Setting noise measuring sensor 20 is crossed, and according to the noise signal V3 detected by the noise measuring sensor 20, from by loading
Noise is removed in the load cell signal V2 that sensor 22 detects, can be improved the control precision in Piezoelectric Driving portion 7.
Noise measuring sensor 20, load cell 22 and Piezoelectric Driving portion 7 are along the side of movement of electronic component maintaining part 8
To and arrange.
By the way that Piezoelectric Driving portion 7 and load cell 22 are arranged along the moving direction of electronic component maintaining part 8,
It can be improved the detection accuracy of the load cell 22 for the load that detection acts in electronic component maintaining part 8.For example, working as piezoelectricity
When the orientation of driving portion 7 and load cell 22 is tilted relative to the moving direction of electronic component maintaining part 8, electricity is acted on
Load in subassembly maintaining part 8 may be unable to fully be transferred to load cell 22, it is possible to leading to load cell
22 detection accuracy reduces.In contrast, by by Piezoelectric Driving portion 7 and load cell 22 along electronic component maintaining part 8
Moving direction arranged, can be improved the detection accuracy of load cell 22.
Load cell 22 detects the load applied along the moving direction of electronic component maintaining part 8.It is therefore preferable that the greatest extent may be used
The removing of energy ground is applied to the noise on load cell 22 along the moving direction of electronic component maintaining part 8.Therefore, by relative to
Load cell 22 and along the moving direction of electronic component maintaining part 8 arrange noise measuring sensor 20, be easy to pass through noise
Detection sensor 20 detects the noise close to the noise acted on load cell 22.Thereby, it is possible to improve detection effect
In the detection accuracy of the load cell 22 of the load in electronic component maintaining part 8.
High-speed moving mechanism 6 keeps first movement portion 14 mobile.Piezoelectric Driving portion 7 is mounted in the second moving portion 18, this
Two moving portions 18 are mounted in first movement portion 14 in a manner of it can move in the up-down direction.Second moving portion 18 is to be made
Apply the state of active force downward for the spring 30 of force application part and be supported on first movement via load cell 17
In portion 14.
Spring 30 presses downward the second moving portion 18 with the power of such as 50kg.On the other hand, Piezoelectric Driving portion 7 will be electric
Pressing force of the subassembly electrode M1 pressing on circuit board electrode P1 is, for example, 0.5N or so.That is, spring 30 presses downward
Electronic component electrode M1 is greatly pressed pressing on circuit board electrode P1 in Piezoelectric Driving portion 7 by the pressing force of the second moving portion 18
Pressure.
Therefore, it can reliably be pressed in the state of on circuit board electrode P1 by electronic component electrode M1, pass through survey
Force snesor 17 detects whether electronic component electrode M1 contacts with circuit board electrode P1, and can prevent displacement sensor 21
Detection accuracy or load cell 22 for displacement reduce the detection accuracy of load.Spring 30 is moved to second downward
Dynamic portion 18 applies the size of the active force of (pressing) are as follows: even if pressing electronic component electrode M1 in circuit in Piezoelectric Driving portion 7
When on plate electrode P1, the second moving portion 18 will not be relative to the size of first movement portion 14 mobile (fixed).
Scolding tin (the component side soldering-tin layer M2, circuit as the metal for capableing of heat fusing are utilized in electronic component engagement device 1
Plate side soldering-tin layer P2) electronic component that engages the electronic component electrode M1 of electronic component M with the circuit board electrode P1 of circuit board P
In joint method, by being heated to electronic component M and circuit board P, and with from electronic component M to circuit board P fixedly
The state (step S80) loaded as defined in applying, the amount of movement (step S90, S100) of detection electronics M downward, from
And judge whether scolding tin melts.
(other embodiments)
Electronic component engagement device 1 also may be constructed are as follows: as shown in fig. 7, having as constant-frequency signal removing mechanism
Bandstop filter (band-stop filter) 40, from the load cell signal exported by load cell 22 remove rule
Determine the signal of the signal of frequency, the i.e. eigentone of electronic component engagement device 1.
For the inventor of the present application by finding after analysis, most of noise element of load cell signal is by electricity
Caused by the intrinsic vibration of subassembly engagement device 1.Specifically, to the frequency of load cell signal V2 shown in Fig. 8 at
After being analyzed, frequency content shown in Fig. 9 is detected.As shown in figure 9, existing in load cell signal V2 (Fig. 8) big
Measure the frequency content of 130Hz and 330Hz.On the other hand, it is sent out after analyzing the intrinsic vibration of electronic component engagement device 1
Existing, there are intrinsic vibrations near 130Hz and 330Hz.
Therefore, bandstop filter 40 is being used as shown in Figure 7, removing from load cell signal V2 shown in Fig. 8
After the signal of 130Hz and 330Hz, can obtain load cell signal V6 shown in Fig. 10 like that just with load cell 22
The load cell signal that is consistent of actual loading.Figure 11 is to indicate to remove from load cell signal V2 shown in Fig. 8
130HzSignal after load cell signal V2-1 figure.Figure 12 is indicated from load cell signal V2 shown in Fig. 8
The figure of load cell signal V2-2 after removing the signal of 330Hz.In addition, the signal removed from load cell signal
Frequency, it is different according to the difference of the structure of electronic component engagement device or used motor etc., above-mentioned 130Hz and
330Hz is only wherein an example.
In addition, using notch filter (notch filter) by bandstop filter 40, accurately can only remove
The frequency 130Hz and 330Hz of the intrinsic vibration of electronic component engagement device 1.As the frequency removed from load cell signal
The signal of rate can also enumerate the ministry of electronics industry other than the signal of the frequency of the intrinsic vibration of above-mentioned electronic component engagement device 1
The signal of the frequency of the intrinsic vibration generated in the setting environment of part engagement device 1.
Claims (5)
1. a kind of electronic component engagement device, having makes the electronic component maintaining part for maintaining electronic component relative to circuit board
The electronic component elevating mechanism of lifting moving, also, the electronic component engagement device makes the electronic component from far from circuit
The position of plate is moved to the position that the electrode of the electronic component is contacted with the electrode of the circuit board, and passing through being capable of heat fusing
Metal the electrode of the electronic component is engaged with the electrode of the circuit board,
The electronic component engagement device is characterized in that,
The electronic component elevating mechanism has high-speed moving mechanism and low speed mobile mechanism, wherein
The high-speed moving mechanism makes the electronic component maintaining part high-speed mobile to the electrode and the electricity of the electronic component
The distance between the electrode of road plate becomes at the position of predetermined distance,
The electronic component electrode between the electrode of the circuit board at a distance from become the predetermined distance after, it is described
Low speed mobile mechanism keeps the electronic component maintaining part mobile with speed when being lower than the high-speed mobile,
The driving source of the low speed mobile mechanism is piezoelectric element；
The high-speed moving mechanism keeps first movement portion mobile,
The low speed mobile mechanism is mounted in the second moving portion, and second moving portion that can move in the up-down direction
Mode is mounted in the first movement portion,
Second moving portion is supported with the state for applying active force downward by force application part via load cell
In the first movement portion.
2. electronic component engagement device as described in claim 1, which is characterized in that
The electronic component engagement device has:
Load cell, detection is acted on from the configuration side of the circuit board to be maintained at described in the electronic component maintaining part
Load on electronic component,
Noise measuring sensor, detection act on the noise on the load cell, and
Noise signal removing unit is passed according to the noise signal detected by the noise measuring sensor from by the load
Noise is removed in the load signal that sensor detects.
3. electronic component engagement device as claimed in claim 2, which is characterized in that
The noise measuring sensor, the load cell and the low speed mobile mechanism are along the electronic component maintaining part
Moving direction and arrange.
4. electronic component engagement device as described in claim 1, which is characterized in that
The electronic component engagement device has:
Load cell, detection is acted on from the configuration side of the circuit board to be maintained at described in the electronic component maintaining part
Load on electronic component, and
Constant-frequency signal removing mechanism removes assigned frequency from the load signal detected by the load cell
Signal.
5. a kind of electronic component joint method is electrode and circuit board by capableing of the metal of heat fusing for electronic component
The method that electrode is engaged,
The electronic component joint method is characterized in that,
By utilizing electronic component engagement device described in any one of any one of claims 1 to 44 to the electronic component and the electricity
Road plate is heated, and fixedly to apply the defined state loaded, detection to the circuit board from the electronic component
The amount of movement that the electronic component moves downward, to judge whether the metal melts.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-070053 | 2014-03-28 | ||
| JP2014070053 | 2014-03-28 | ||
| PCT/JP2015/055441 WO2015146442A1 (en) | 2014-03-28 | 2015-02-25 | Method and device for joining electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105230138A CN105230138A (en) | 2016-01-06 |
| CN105230138B true CN105230138B (en) | 2019-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201580000563.3A Active CN105230138B (en) | 2014-03-28 | 2015-02-25 | Electronic component engagement device and electronic component joint method |
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| Country | Link |
|---|---|
| JP (2) | JP5964520B2 (en) |
| KR (1) | KR101775448B1 (en) |
| CN (1) | CN105230138B (en) |
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| CN108464065A (en) * | 2016-01-19 | 2018-08-28 | 株式会社富士 | Component mounter |
| JP7106632B2 (en) * | 2018-03-07 | 2022-07-26 | 株式会社Fuji | Component mounting system |
| JP7207152B2 (en) | 2019-05-16 | 2023-01-18 | 株式会社デンソー | SLEEVE SOLDERING APPARATUS AND ELECTRONIC DEVICE MANUFACTURING METHOD |
| US11776930B2 (en) * | 2019-12-16 | 2023-10-03 | Asmpt Singapore Pte. Ltd. | Die bond head apparatus with die holder motion table |
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| JP2002231766A (en) * | 2001-02-07 | 2002-08-16 | Kaijo Corp | Work touch detection circuit for flip-chip bonder |
| JP5317753B2 (en) * | 2009-02-23 | 2013-10-16 | アルファーデザイン株式会社 | Bonder device |
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| CN1574258A (en) * | 2003-06-03 | 2005-02-02 | 松下电器产业株式会社 | Electronic element mounting apparatus and mounting method |
| CN1965401A (en) * | 2004-06-08 | 2007-05-16 | 松下电器产业株式会社 | Component mounting method and component mounting apparatus |
| CN1905981A (en) * | 2004-09-01 | 2007-01-31 | 松下电器产业株式会社 | Method of controlling contact load in electronic component mounting apparatus |
| JP2010219334A (en) * | 2009-03-17 | 2010-09-30 | Nec Corp | Apparatus, method, and program of manufacturing electronic components |
| JP2011254032A (en) * | 2010-06-04 | 2011-12-15 | Shinkawa Ltd | Electronic component mounting apparatus and method thereof |
| CN102959695A (en) * | 2010-06-30 | 2013-03-06 | 株式会社新川 | Electronic component mounting apparatus and electronic component mounting method |
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| Publication number | Publication date |
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| WO2015146442A1 (en) | 2015-10-01 |
| KR20150128909A (en) | 2015-11-18 |
| CN105230138A (en) | 2016-01-06 |
| JPWO2015146442A1 (en) | 2017-04-13 |
| JP2016184760A (en) | 2016-10-20 |
| JP5964520B2 (en) | 2016-08-03 |
| KR101775448B1 (en) | 2017-09-06 |
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