JP4357985B2 - Parallel measurement method and adjustment method, parallel measurement apparatus, and component mounting apparatus - Google Patents

Description

  TECHNICAL FIELD The present invention relates to a parallel measurement method of a stage surface and a tool surface, such as a stage surface for board installation in a component mounting apparatus and a tool surface for holding a component of a mounting head, a parallel adjustment method thereof, a parallel measurement apparatus, and a component mounting apparatus. It is.

  Conventionally, as shown in FIG. 5, a substrate to be mounted is placed and positioned on a stage 3 arranged on an XY moving table 2, and IC components are sucked and held by a tool provided on the mounting head 4. Various component mounting apparatuses 1 that are mounted on a substrate are known (see, for example, Patent Document 1).

  In this type of component mounting apparatus, an IC component having a plurality of bump electrodes is heated and pressed with a tool provided on the mounting head 4 against a substrate placed on the stage 3, and the bump electrodes of the IC component are applied to the electrodes of the substrate. In order to stably obtain an appropriate bonding state for all the bump electrodes, it is necessary that the stage surface on the upper surface of the stage 3 and the tool surface on the lower surface of the tool are parallel with high accuracy.

  Therefore, conventionally, prior to mounting production, as shown in FIG. 6A, a substrate 5 is installed on the stage surface 3 a of the stage 3, and a plurality of bump electrodes are formed on the tool surface 6 a of the tool 6 of the mounting head 4. The IC component 7 having 8 is sucked and held, the stage surface 3a and the tool surface 6a are made to face each other, and then the mounting head 4 is moved downward to cope with the pressure applied during bonding as shown in FIG. 6B. After pressurizing with a predetermined load and compressing and plastically deforming the bump electrode 8, the mounting head 4 is raised and the IC component 7 is taken out. As shown in FIG. 6C, bumps at the four corners of the IC component 7 are obtained. The height dimension h of the electrode 8 is measured, and the tilt amount of the stage surface 3a and the tool surface 6a is calculated from the measured value. Then, the inclination of the stage 3 or the tool 4 is adjusted from the detected inclination amount.

  In order to prevent the bonding pressure from fluctuating due to the inclination of the surface of the mounting substrate and the face of the semiconductor chip held on the head surface of the bonding tool, an incorrect bonding state may occur. The pressure sensor is installed to detect the pressure value variation, and the head surface adjustment part provided in the bonding tool adjusts the head surface inclination so that the pressure value is uniform, and the surface of the mounting substrate and the semiconductor chip A technical means for making the face surfaces of these parallel is known (see Patent Document 2).

Also known is a method of measuring the amount of tilt by measuring the distance to the recognition mark by autofocus of the camera (see Patent Document 3).
JP 7-303000 A Japanese Patent Laid-Open No. 11-297664 JP 2001-308597 A

  However, in the conventional parallel measurement / adjustment method as shown in FIG. 6, after the IC component 7 is pressurized, the IC component 7 is taken out and the heights of the bump electrodes 8 at the four corners are measured with a height measuring device. Further, it is necessary to adjust the tilt of the stage 3 by calculating the tilt amount based on the measurement result. Therefore, there is a problem that a lot of time and work man-hours are required for parallel measurement and parallel adjustment, and productivity is lowered.

  In addition, the IC component 7 having the bump electrode 8 is absolutely necessary, and the IC component 7 used for the parallel measurement cannot be reused and must be discarded. However, the recent IC component 7 is highly integrated and highly functional. However, there is a case where it is necessary to perform parallel measurement and adjustment a plurality of times before the completion of the parallel adjustment, and there is a problem that costs are increased.

  On the other hand, with the technical means disclosed in Patent Document 2, such a problem can be solved. However, since pressure sensors have characteristic variations, parallelism is ensured if the pressure values detected by a plurality of pressure sensors are constant. Therefore, correction is necessary, and the characteristics of the pressure sensor change over time, the detection value changes depending on the ambient temperature, and there are individual differences in the amount of change. Periodic calibration and correction are required, and securing parallelism with high accuracy requires a great deal of labor and man-hours. In addition, if the tool is used with pressure applied to the stage, parallelism in the pressurized state is required. It is important to secure the degree, but in this case, this problem becomes prominent, and there is a problem that it is difficult to actually implement.

  Further, as disclosed in Patent Document 3, when applying the parallel measurement method by camera auto-focus, the camera that recognizes the recognition mark on the IC component or the substrate has a magnification of about 2 to 6 times. On the other hand, in order to perform parallelism management in units of 1 μm, if measurement is to be performed in units of 1/10 μm, a camera with a magnification of 20 to 50 times is required, and a dedicated expensive recognition camera is required. There is a problem that the cost is high, and further, since the parallelism in the pressurized state cannot be measured as described above, there is a problem that the parallelism in the pressurized state cannot be accurately measured.

  In view of the above-described conventional problems, the present invention provides a parallel measurement method, a parallel adjustment method, a parallel measurement device, and a component mounting capable of accurately measuring parallelism in a pressurized state at low cost with good workability. An object is to provide an apparatus.

The parallel measurement method of the present invention is a parallel measurement method for measuring the parallelism between a stage surface and a tool surface that can move toward and away from the stage surface, and a jig chip in which a plurality of electrodes are arranged in a substantially distributed manner. Is held on the tool surface and a jig substrate on which a plurality of electrodes are arranged so as to face each electrode of the jig tip is placed on the stage surface, the set pressure is set in multiple stages, detecting said electrode in contact with each other tool face pressed toward the stage surface, between the jig tip and the jig substrate between each stage at a pressure, on the basis of a change in the existing area of the electrode in contact with each other The tilt amount between the stage surface and the tool surface is calculated.

  According to this configuration, the jig chip and the jig substrate can be reused any number of times, so that the cost can be reduced, and the contacted electrode is detected while the tool surface is pressed toward the stage surface. Therefore, it is possible to measure with good workability, and it is possible to accurately measure the parallelism based on the existence region of the electrodes that are in contact with each other in a pressurized state.

  It is also possible to set the set pressing force in a plurality of stages and calculate the amount of inclination based on the change in the existence area of the contacted electrode between the stages.

  In addition, a plurality of electrode pairs composed of two electrodes arranged close to each other and electrically connected to each other are arranged on the jig chip in a distributed manner, and by detecting conduction between the electrode pairs arranged facing the jig substrate. When the contacted electrode pair is detected, the contact of the electrode can be detected simply and with high reliability by the conduction detection.

  In addition, the inclination amount conversion data obtained experimentally in advance from the contact area of the electrodes and the actual inclination amount are stored in advance, and the inclination amount is calculated based on the contact area of the electrodes and the inclination amount conversion data. With a simple process, accurate measurement can be performed.

  The parallel adjustment method of the present invention is a parallel adjustment method for adjusting a stage surface and a tool surface that can move toward and away from the stage surface in parallel, and the stage surface and the tool surface by the parallel measurement method described above. A tilt detection step for detecting the tilt amount, a determination step for determining whether the tilt amount is within the allowable range, and a tilt amount for detecting the stage surface or the tool surface when the tilt amount exceeds the allowable range And the tilt adjustment step to adjust according to the above, after the tilt adjustment step, the process proceeds again to the tilt detection step, and the above steps are repeated until the tilt amount of the stage surface and the tool surface is within an allowable range. Parallel adjustment can be performed with high productivity and high accuracy using the parallel measurement method.

  Also, in the tilt adjustment process, if the height position of the three points that support the stage is adjusted according to the detected tilt amount, the tilt of the stage can be easily adjusted by adjusting the height position of the three points. Parallel adjustment can be performed with good performance.

The parallel measuring device of the present invention is a parallel measuring device that measures the parallelism of the opposing surfaces of a tool that can be moved toward and away from the stage, and can be attached to the tool, and a plurality of electrodes can be mounted on almost the entire surface. The jig chips distributed on the jig, the jig substrate that can be installed on the stage and provided with a plurality of electrodes corresponding to the electrodes of the jig chip, and the jig chip and the jig substrate are in contact with each other. Contact electrode detecting means for detecting an electrode, and electrodes in contact with each other during each stage when the jig chip held on the tool is pressed against the jig substrate with a pressurizing force set in a plurality of stages And an inclination amount calculating means for calculating an inclination amount based on a change in the existing area.

  According to this configuration, it is possible to measure the parallelism in a pressurized state with high workability at low cost with high accuracy by performing the parallel measurement method.

  In addition, a plurality of electrode pairs composed of two electrodes arranged close to each other and electrically connected to each other are arranged on the jig chip, and connected to each electrode pair arranged to face the jig substrate. If the contact detection means is constituted by the continuity detection means, the contact of the electrodes can be detected easily and with high reliability by the continuity detection means.

  In addition, the inclination amount calculation means includes an existence area of electrodes that are in contact with each other, a storage means that stores inclination amount conversion data obtained by experimentally calculating an actual inclination amount, and an existence area of electrodes detected by the contact electrode detection means. And calculating means for calculating the inclination amount based on the inclination amount conversion data, it is possible to measure with high accuracy by simple calculation processing.

  The component mounting apparatus according to the present invention is a component mounting apparatus including a stage for holding and positioning a substrate, and a mounting head having a tool for holding the component and mounting the held component on the substrate. A parallel measuring device is provided, and high-quality component mounting can be realized stably and with good productivity and at a low cost.

  Further, measurement was performed by providing three height adjusting means for supporting the stage so that the position of the height can be adjusted, and by providing a control means for controlling the operation of the height adjusting means according to the amount of tilt detected by the parallel measuring device. The tilt of the stage can be automatically adjusted according to the tilt amount, and the productivity can be further improved.

  According to the parallel measuring method, the parallel adjusting method, the parallel measuring apparatus, and the component mounting apparatus of the present invention, the jig chip and the jig substrate can be reused any number of times, so that the cost can be reduced and the tool can be reduced. Since it is only necessary to detect electrodes that are in contact with the surface pressed against the stage surface, it can be measured with good workability, and the parallelism is accurate based on the existence area of the electrodes that are in contact with each other under pressure. It can be measured well.

  Hereinafter, an embodiment in which the present invention is applied to a parallel measurement / adjustment apparatus for a component mounting apparatus will be described with reference to FIGS. The configuration and mounting operation of the component mounting apparatus are the same as those in the conventional example described with reference to FIGS. 5 and 6, and the same components are denoted by the same reference numerals and description thereof is omitted. First, the parallel measurement / adjustment apparatus will be described.

  In FIG. 1, reference numeral 11 denotes a jig chip that can be attached to the tool 6, which is composed of a glass chip 12 having a high degree of parallelism, and is arranged in close proximity to each other on almost one surface (lower surface). A plurality of electrode pairs 13 composed of two electrodes 13a and 13b are distributed in a matrix. The electrodes 13 a and 13 b of each electrode pair 13 are connected to each other by a connection conductor 14 inside the glass chip 12. Reference numeral 15 a denotes an alignment mark disposed at a corner portion of the jig chip 11.

Reference numeral 16 denotes a jig substrate that can be placed on the stage 3, and a plurality of electrode pairs 17 corresponding to the electrode pairs 13 of the jig chip 11 are arranged. Further, continuity detecting means 18 (D _{1 to} D _n ) for detecting continuity between the two electrodes 17 a and 17 b of each electrode pair 17 is connected. This conduction detecting means 18 can detect that the electrode pair 13 of the jig chip 11 and the electrode pair 17 of the jig substrate 16 are in contact with each other. Thus, the continuity detecting means 18 constitutes a contact electrode detecting means for detecting contact between the electrode pair 13 of the jig chip 11 and the electrode pair 17 of the jig substrate 16. Reference numeral 15 b denotes an alignment mark disposed on the jig substrate 16 so as to correspond to the alignment mark 15 a of the jig chip 11.

  As shown in FIG. 2, the stage 3 is installed on a support table 31. The support table 31 has two adjacent side surfaces engaged with the fixed roller 32, and the other two adjacent side surfaces engaged with a pressing roller 33 biased by a spring 34 so that the support table 31 can be moved up and down and tilted by a small amount. Support rollers 35a, 35b, and 35c are disposed at three locations near one end on one side of the lower surface and the center on the other side. Each of the support rollers 35a, 35b, and 35c is supported by the height adjusting means 36a, 36b, and 36c so that the height can be adjusted independently.

  The height adjusting means 36a, 36b and 36c are movable wedge members 38 which are movable along the inclined guide 37 and whose upper surfaces are horizontally engaged with the support rollers 35a, 35b and 35c, respectively, and the movable wedges. A feed screw mechanism 39 that moves and drives the member 38 and a servo motor 40 that rotationally drives the feed screw are configured. Thus, the height of the support table 31 can be adjusted without changing the height of the support table 31 by adjusting the height of one end of the support table 31 and the other center of the support table 31 with the height adjusting means 36a, 36b, 36c. The inclination of the position can be arbitrarily adjusted.

  Reference numeral 20 denotes a control means of the component mounting apparatus 1, which has a function of controlling the operation of measuring and adjusting the parallelism between the upper surface of the stage 3 and the lower surface of the tool 6, and only the parts related to the function will be described below. To do. A detection signal from the continuity detection means 18 is input to the control means 20 via the detection means input unit 19. In addition, the control unit 20 receives an operation signal and displays an operation state, an operation / display unit 21, a camera 22 that recognizes the alignment marks 15 a and 15 b of the jig chip 11 and the jig substrate 16, and a recognition image thereof. An image recognition unit 24 to which a monitor 23 for displaying the image is connected, a servo motor control unit 25 for controlling the servo motor 40 of the height adjusting means 36a, 36b, 36c for adjusting the height of the three points of the stage 3, and a tool A load control unit 27 that controls the applied pressure of the cylinder device 26 that lowers the mounting head 4 to which the tool 6 is attached and pressurizes the tool 6 to the stage 3 is connected.

  In addition, the existence amount of the electrode pairs 13 and 17 detected as being in contact with each other by the continuity detecting means 18 and the inclination amounts of the actual stage 3 and the tool 6 are experimentally obtained in advance, and the inclination amount created based on the result. A storage unit 29 that stores the conversion data 28 is connected to the control unit 20. Then, the control means 20 calculates the inclination amount of the stage 3 and the tool 6 based on the existence area of the electrode pairs 13 and 17 whose contact state is detected by the continuity detection means 18 and the inclination amount conversion data 28. Has a calculation function.

  Further, the control means 20 calculates the tilt movement amount of the stage 3 according to the calculated tilt amount, and drives and controls the servo motors 40 of the respective height adjustment means 36a, 36b, 36c via the servo motor control unit 25. Accordingly, the tilt adjustment of the stage 3 is performed, and the parallel adjustment of the stage 3 and the tool 6 is performed.

  Next, the parallel adjustment operation of the stage 3 and the tool 6 in the component mounting apparatus 1 having the above configuration will be described with reference to FIG.

  First, the temperature of the stage 3 and the mounting head 4 is set to the temperature at the time of mounting (step S1), the jig substrate 16 is set on the stage 3 (step S2), and the jig chip 11 is picked up by the mounting head 4 (Step S3). Next, the alignment marks 15a and 15b of the jig chip 11 and the jig substrate 16 are recognized (step S4), and based on the recognition result, as shown in FIG. After adjusting the position to place the jig chip 11 on the jig substrate 16, the mounting head 4 is lowered by the cylinder device 26, and as shown in FIG. The tool chip 11 is pressed with a predetermined pressure (step S5).

  At this time, if there is an inclination between the stage 3 and the tool 6, the electrode pairs 13 and 17 are not in contact with each other and become conductive, and as shown in FIG. Even if they are in contact with each other, there is a gap between the electrode pairs 13 and 17 at other portions. The size of the area where the electrode pairs 13 and 17 are in contact with each other and the amount of inclination between the stage 3 and the tool 6 have a correlation, and the correlation is experimental and stable. Has been confirmed.

  Therefore, next, the control unit 20 inputs the detection signal from the continuity detection unit 18 via the detection unit input unit 19, thereby contacting the electrode pair 13 of the jig chip 11 and the electrode pair 17 of the jig substrate 16. The state is detected, and the tilt amount is calculated with reference to the tilt amount conversion data 28 stored in the storage means 29 (step S6). Next, it is determined whether or not the calculated inclination amount is within an allowable range (step S7). If the tilt amount is not within the allowable range, the mounting head 4 is raised (step S8), and the control unit 20 calculates the tilt movement amount of the stage 3 according to the calculated tilt amount (step S9). Then, the servo motor 40 of the height adjusting means 36a, 36b, 36c is driven and controlled via the servo motor control unit 25, so that the stage 3 is tilted so as to be parallel to the tool 6 (step S10). Thereafter, the operations in steps S4 to S7 are repeated again.

  If it is determined in step S7 that the tilt amount is within the allowable range, then the first tilt amount detection result and the final tilt movement amount of the stage 3 are stored (step S11), and the mounting head 4 is raised. (Step S12), the process shifts to a normal production mounting operation. If necessary, the tilt amount conversion data 28 is updated based on the tilt movement amount stored in step S11. In addition, the tilt amount conversion data 28 is created by repeating the above operation while the tool 6 is tilted in various ways.

  According to the present embodiment described above, the jig chip 11 and the jig substrate 16 can be reused any number of times. Therefore, there is no need to waste expensive IC chips and substrates, and the stage 3 can be manufactured at low cost. And parallel measurement of the tool 6 can be performed. Further, since it is only necessary to detect contact between the electrode pairs 13 and 17 in a state where the tool 6 is pressed toward the stage 3, measurement can be performed with good workability. In addition, since the parallelism is measured based on the existence region of the electrodes that are in contact with each other in the pressurized state and at the same temperature as the mounting condition, it is possible to perform measurement with high accuracy. Furthermore, since the contact state is detected by detecting the conduction between the electrode pairs 13 and 17, the detection can be easily performed with high reliability.

  In addition, the storage unit 29 stores inclination amount conversion data 28 obtained experimentally in advance from the presence area of the electrodes that are in contact with each other and the actual inclination amount. Since the amount of tilt is calculated based on the above, parallel measurement with high accuracy can be performed by simple processing.

  Further, the amount of inclination of the stage 3 and the tool 6 is detected by the parallel measurement method described above, and the three height adjusting means 36a according to the amount of inclination detected when the amount of inclination exceeds the allowable range. Since the parallel adjustment is performed by adjusting the movements 36b and 36c, the parallel adjustment can be performed with high productivity and high accuracy.

  In the description of the above embodiment, the example in which the tilt amount of the stage surface and the tool surface is calculated based on the existence region of the electrodes that are in contact with each other in a state of being pressurized with a predetermined pressure and the tilt amount conversion data has been described. The applied pressure may be set in a plurality of stages, and the amount of inclination may be calculated based on the change in the existence area of the contacted electrode between the stages.

  In the above embodiment, an example in which contact detection between the electrode pair 13 of the jig chip 11 and the electrode pair 17 of the jig substrate 16 is performed by simple continuity detection has been described. May be detected. Further, the example in which the contact state is detected by the continuity detection using the electrode pairs 13 and 17 composed of two electrodes has been described. However, instead of the electrode pair, a single electrode is used, and various types of contact due to contact between the electrodes are used. You may make it detect a contact by detecting the change of an electrical property.

  In the above embodiment, the example in which the tilt amount is calculated only for one point and one type of tool on the stage has been described. However, the tilt amount at each point can be calculated and stored, or stored at a plurality of types. The tilt amount for each tool may be calculated and stored.

  In the above embodiment, an example is described in which the amount of tilt is calculated, the stage is tilted after the mounting head is raised, and the jig chip and substrate are recognized again. However, the stage is tilted while the mounting head is lowered. This may be repeated until the tilt amount falls within the allowable range.

  In the above embodiment, the example in which the tilt is moved by the stage has been described. However, the mounting head may be provided with a tilt adjusting unit.

  The parallel measurement / adjustment method and apparatus according to the present invention holds a jig chip on which a plurality of electrodes are arranged on a tool surface, and a jig substrate on which a plurality of electrodes are arranged on a stage surface. The surface is pressed toward the stage surface, the electrodes that are in contact with each other between the jig tip and the jig substrate are detected, and the tilt amount of the stage surface and the tool surface is calculated based on the existence area of the electrodes that are in contact with each other Therefore, it is possible to measure and adjust the parallelism in a pressurized state with high workability at low cost and with high accuracy. This is useful for flip chip mounting for mounting IC components.

The jig | tool chip | tip and jig substrate which are used for inclination measurement in one Embodiment of this invention are shown, (a) is a cross-sectional schematic diagram which shows the structure, (b) is a cross-sectional schematic diagram which shows a pressurization state. The stage inclination adjustment mechanism in the same embodiment is shown, (a) is a plan view showing the arrangement relationship, (b) is a view taken along the line AA of (a). It is a control block diagram in the same embodiment. It is a flowchart of the inclination measurement / adjustment operation in the same embodiment. It is a perspective view which shows the stage and mounting head of a component mounting apparatus. It is process explanatory drawing of the inclination measuring method of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Stage 4 Mounting head 5 Board | substrate 6 Tool 7 IC component 11 Jig chip 13 Electrode pair 16 Jig board 17 Electrode pair 18 Conduction detection means (contact electrode detection means)
20 Control means 28 Inclination amount conversion data 29 Storage means 36a, 36b, 36c Height adjustment means

Claims (10)

A parallel measurement method for measuring the parallelism between a stage surface and a tool surface that can move toward and away from the stage surface. A jig substrate on which multiple electrodes are arranged so as to face each electrode of the tool tip is placed on the stage surface, the set pressure is set in multiple stages, and the tool surface is set on the stage surface with the set pressure in each stage. directed pressurized detects said electrode in contact with each other between the jig tip and the jig substrate between each stage, the inclination of the stage surface and the tool surface based on a change in the presence area of the electrode in contact with each other A parallel measurement method characterized by calculating The jig tip, electrode pair composed of two electrodes which are electrically connected to each other is more distributed while being disposed close to each other, wherein each electrode pair disposed to face the jig tip jig substrate parallel measuring method according to claim 1 Symbol mounting and detects the electrode pair in contact with conduction detecting between. It is possible to store inclination amount conversion data obtained experimentally in advance for the existence area of the electrodes that are in contact with each other and the actual inclination amount, and to calculate the inclination amount based on the existence area of the electrodes that are in contact with each other and the inclination amount conversion data. 3. The parallel measurement method according to claim 1, wherein the parallel measurement method is performed. A parallel adjustment method for adjusting in parallel and toward and away from the movable tool face relative to the stage surface and the stage surface, the inclination of the stage surface and the tool face in either parallel measuring method according to claim 1 to 3 In accordance with an inclination amount detecting step, a determination step for determining whether or not the amount of inclination is within an allowable range, and an amount of inclination detected on the stage surface or tool surface when the amount of inclination exceeds the allowable range A parallel adjustment characterized in that after the inclination adjustment process, the process proceeds to the inclination detection process again and the above steps are repeated until the inclination amount of the stage surface and the tool surface is within an allowable range. Method. 5. The parallel adjustment method according to claim 4 , wherein, in the tilt adjustment step, the height positions of the three points supporting the stage are adjusted according to the detected tilt amount. A parallel measuring device that measures the parallelism of the opposing surfaces of a tool that can move toward and away from the stage, and a jig tip that can be attached to the tool and in which a plurality of electrodes are distributed over almost the entire surface, A jig substrate on which a plurality of electrodes corresponding to each electrode of the jig chip can be installed, and a contact electrode detection means for detecting electrodes in contact with each other between the jig chip and the jig substrate; The amount of inclination based on the change in the presence area of the electrodes that are in contact with each other during each stage when the jig chip held on the tool is pressed against the jig substrate with the pressure set in multiple stages A parallel measuring device comprising: an inclination amount calculating means for calculating Wherein the jig tip is the electrode pairs are multiple distributed consisting of two electrodes which are electrically connected to each other while being disposed close to each other, each electrode being disposed opposite to said jig chip to the jig substrate 7. The parallel measuring apparatus according to claim 6, wherein the contact electrode detecting means is constituted by continuity detecting means connected to each pair. The inclination amount calculation means includes storage means for storing tilt quantity conversion data experimentally determined in advance of the actual inclination of the existence region of the electrodes in contact with each other, the existence region of the electrode detected by the contact electrode detecting means a tilt amount converted data parallel measuring apparatus according to claim 6 or 7 Symbol mounting characterized by being constituted by means for calculating the inclination amount based on. And the stage for holding and positioning a substrate, having said tool holding the component, the held component to a component mounting apparatus and a mounting head for mounting on a substrate, any claim 6-8 A component mounting apparatus comprising the parallel measuring device according to claim 1. Characterized in that a three height adjustment means is provided, the control means controls the operation of height adjusting means in accordance with the amount of tilt detected by the parallel measuring device for supporting the stage so as to be height adjusted The component mounting apparatus according to claim 9 .

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