TW200941597A - Control method for bonding machine - Google Patents

Abstract

Disclosed is a control method for a bonding machine, comprising: positioning a bonding head for bonding a chip onto a bonding object to an initial position; transferring a chip to the bonding head resulting from that a transfer head picks up the chip and moves to the initial position; sensing positions of the chip transferred to the bonding head and where the chip is to be bonded on the bonding object by a camera moved to a pre-set position thus to calculate a position variation; after compensating for the position variation bonding the chip onto the bonding object by the bonding head; and raising the bonding head to move it to the initial position. According to the present invention, vibration is minimized in the process for bonding the chip on the bonding object, and accordingly the accuracy of the process is enhanced, and the time for the bonding process is shortened, and accordingly the productivity can be increased.

Description

200941597 IX. Description of the Invention: [Technical Field] The present invention relates to a welding machine control method, and more particularly to a welding machine control method, which is capable of shortening the welding-wafer time and minimizing the welding machine Vibration. [Prior Art] In general, a pick-up machine is suitable for electrical interconnection between a wafer and a package by soldering a micro component (e.g., a semiconductor wafer) to a package. The semiconductor wafer can be spliced to the package by hot pressing or ultrasonic welding. Fig. 1 is a schematic view showing an exemplary welding machine, and Fig. 2 is a side view showing a portion of the welding machine. The:fcp pick-up machine has a base 100 甘士牌朱100' which is provided with a guide bow unit 200, which is used to transmit along the place set at t φ and ancient, @金八中 has a plurality of metal patterns a lead frame or a belt; and a transport unit 3, i field & a 〇〇z' for returning the lead frame or the belt to the guiding unit 20A. +化 '法后后' The ¥ wire frame or belt will be referred to as the welding target F. The welding unit 4 for welding a wafer to the soldering-contacting object F is disposed above the guiding unit 2〇〇, and the medium _ and the receiving stage 5 00 are mounted on the guiding unit 5丨Below 200 so that it can move up and down. The welding unit 40〇 includes a head lift 4:?〇# + gossip's text is attached to the subrack 410 of the base frame 100 so that the river can be moved back and forth, that is, along the γ axis. Direction); a first/drive unit (not shown), a basin ', a pair of heads 420: a soldering head 430' that is mounted at the head frame 420 so that it can be left and right (ie, along the X-axis direction) ), under 200941597 (ie, along the Z-axis direction), and in the direction of rotation, and operable to pick up the wafer for soldering; a second drive unit 440 for moving the solder joint 430 left and right; A driving unit 450 for moving the welding head 430 up and down, a fourth driving unit 460 for rotating the welding head 430, a heater (not shown), a vacuum suction unit (not shown), and the like.

The camera unit 600 is mounted below the sub-frame 4 10 so as to be movable back and forth. Camera unit 6 00 includes a camera 610 for focusing up and down on a target; and a camera drive unit (not shown) for moving camera 610 back and forth. The camera 610 is moved forward by the operation of the camera driving unit to sense the position of the wafer sucked to the bonding head 430 and the position at which the wafer is to be soldered on the welding target F. A wafer supply unit 700 for supplying a wafer is mounted at the pedestal 100. Similarly, the wafer transfer unit 800 for picking up the wafer supplied from the wafer supply unit 700 and moving the wafer to a predetermined position is mounted at the pedestal 100. The wafer supply unit 7 includes a wafer stage (not shown) to which a wafer on which a plurality of wafers are disposed can be mounted; a driving unit (not shown) for moving the wafer table; An ejector (not shown) for supporting one of the wafers disposed on the wafer to pick up the wafer. Moreover, the wafer is supplied to the wafer stage by a wafer supply unit (not shown) adjacent to the wafer supply unit 700. The wafer transfer unit 800 includes a guide frame 810 that is mounted at the base frame 100, a transfer head 820 that is movably mounted at the guide frame 810, and operable to pick up the crystals disposed in the wafer supply early 700 The wafer on the circle, 200941597 and the head drive unit 830, are used to move the transfer head 820. Figure 3 is a sequential diagram showing the various stages of the operating process of the main components of the welding machine. Referring to this figure, the operation of the welding machine will be described.

First, the welding target F is moved along the guiding unit 200 by a predetermined distance by the operation of the conveying unit 300. The head drive unit 830 of the wafer transfer unit 800 is operated, whereby the transfer head 820 thus picks up one of the wafers mounted on the wafer on the wafer stage, and then moves it to the wafer transfer position P 1 (stage A of FIG. 3) 1). By the operation of the first and second driving units of the soldering unit 400, the solder joint 430 is moved from the initial position P2 to above the wafer transfer position P1 (stage A2 of Fig. 3). The soldering tip 430 is lowered by the operation of the third driving unit 450, and then the wafer picked up by the transfer head 820 of the wafer transfer unit 800 is sucked. By operation of the camera driving unit, the camera 610 is moved forward toward the preset position P3. When the bonding head 430 moves to the wafer transfer position, the camera 610 moves to the preset position P3 at the same time (stage A2 of Fig. 3). After the soldering head 430 picks up the wafer picked up by the transfer head 80 at the wafer transfer position P1, the soldering head 430 is moved to its initial position P2 by the operation of the first, second, and third driving units (p. Stage 3 of the figure A3). When the weld joint 430 moves to its initial position P 2 , a movement completion signal is transmitted to a control unit (not shown). The initial position P 2 of the welding head 430 and the preset position P3 of the camera are on the same line. 7 200941597

In the state where the camera 610 moves to the initial position P2 of the bonding head 610, where the welding head 410 draws the wafer and where the wafer is to be welded on the welding target F, the suction to the welding head 43 is calculated. The position of the wafer of 0 and the variation between the welding positions on the welding target F. Next, after the camera 610 is moved back, the position of the soldering tip 430 is compensated by the fluctuation, thereby moving to solder the wafer sucked to the soldering tip 430 to the soldering position on the solder target F (stage A4 of FIG. 3). . The welding stage 500 supports the welding target F when the welding head 430 welds the wafer onto the welding target F. After the wafer is welded to the welding target F by the welding head 430, the welding head 430 is moved back to its initial position P2, and the welding target F (i.e., the next lead frame or belt) is moved by the operation of the conveying unit 300. a specific distance. Similarly, the transfer head 820 picks up another wafer disposed on the wafer of the wafer stage and moves to the wafer transfer position P1. The bonding head 430 moves from its initial position P 2 to the wafer transfer position Pb and picks up another wafer picked up by the transfer head 820. Through the above process, another wafer is welded to the welding position on the welding target F. As the above process is repeatedly performed, the wafer disposed on the wafer is thus soldered to the solder target F. However, in the welding machine control method according to the related art, the welding head 430 moves to the wafer transfer position P 1 to receive the wafer from the transfer head 820 that has picked up the wafer, which causes the vibration and the solder joint 4 3 Slow movement of 0. That is, in order to move the bonding head 430 to the wafer transfer position, the bonding head 430 moves with the head frame at the assembly of the bonding head 430, and the first, second, third, and fourth driving units mounted on the head frame. . Due to the heavy moving portion 8 200941597, large vibrations are generated, and the welding head 430 cannot move quickly. Therefore, the accuracy of the soldering process is deteriorated and the process takes a long time. Further, since the movement completion signal must be inspected after the soldering head 403 picks up the wafer picked up by the transfer head 820 and then moves to the initial position P 2 , the soldering process can be delayed. SUMMARY OF THE INVENTION Therefore, the present invention provides a welding machine control method capable of shortening the time required for wafer welding and minimizing vibration in the welding machine. To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and described herein, a welding machine control method is provided comprising: placing a welding head for welding a wafer to a welding target to An initial position; picking up a wafer by a transfer head and moving to the initial position to transfer the wafer to the solder joint; sensing the wafer transferred to the solder joint by a camera moving to a predetermined position a position, and where the wafer is to be soldered on the solder target, thereby calculating a position change φ; after compensating for the position change, the wafer is soldered to the solder target by the solder joint; The welding head is lifted to move it to the initial position. The operation of the transfer head to transfer the wafer to the soldering tip and the operation of the camera to the pre-set position are performed simultaneously. The soldering head, the transfer head, and the camera are placed on the same line, in the state in which the transfer head transfers the wafer to the soldering tip, and the camera moves to a pre-set position for simultaneous execution. 9 200941597 The welding head compensates for positional changes and then descends as the camera moves back to its original position to weld the wafer that is drawn to the welding head to the welding target. Similarly, the soldering tip can compensate for positional variations as it descends to solder the wafer that is drawn to the soldering tip to the solder target. The foregoing and other objects, features, aspects and advantages of the present invention will become apparent from

[Embodiment] A preferred embodiment of the present invention will now be described in detail, examples of which are illustrated in the accompanying drawings. A welding machine as shown in FIGS. 1 and 4 includes a guiding unit 200 which is mounted at the base frame 100 to guide the conveyance of the welding target F; and a conveying unit 300 which is assembled at the guiding unit 200, Thereby, the welding target F is transferred; the welding unit 400 is placed above the guiding unit 200 to weld a wafer onto the welding target F; the welding stage 500 is mounted under the guiding unit 200; the wafer supply unit 700 Mounted at the pedestal 100 to supply the wafer; the wafer transfer unit 800, which transfers the wafer to the soldering unit by the wafer supply unit 700; and a camera unit 600 that senses the wafer that is drawn to the soldering unit 400 The position is the position at which the wafer is to be soldered on the welding target F. The welding unit 400 includes a head frame 420 installed at the sub-frame 41 0 connected to the base frame 100 so as to be slidable back and forth (that is, in the Y-axis direction); a first driving unit 470 for driving the head frame 420; Weld head 430, which can be 10

200941597 is movably mounted on the headstock 420 and is operable to pick up and solder tabs; a second drive unit 440 for moving the solder joints 430 left and right; a drive unit 450 for moving the solder joints 430 up and down; A fourth drive unit 460 is used to rotate the weld head 430. Further, the soldering tip is provided with a heater 480 and a vacuum suction unit (shown) for sucking the wafer. The height from the welding target F to the welding unit 400 is higher than the height in the welding machine of the phase. Here, the height can be adjusted by the sub-frame 410. The welding stage 500 is mounted to the base frame 100 and supports the welding head 430 by being moved upward. The wafer supply unit 700 includes a wafer stage (not shown) on which a wafer can be mounted, wherein a plurality of wafers are disposed on the wafer; a stage unit (not shown) for moving the wafer table; and a top a device (not shown; it is used to support a wafer to be picked up in a wafer disposed on a wafer, and the wafer is supplied to the wafer by a wafer supply (not shown) of an adjacent wafer supply unit 700 The wafer transfer unit 800 includes a guide frame 810 that is mounted at the base frame, and a transfer head 840 that is movably mounted at the guide frame 810 to serve as a wafer disposed on the wafer of the wafer supply unit 700; And a head drive unit 830 for moving the transfer head 840 to transfer the wafer picked up by the transfer head to the soldering head 430. The camera unit 600 is mounted below the subrack 410 so as to be movable. The unit 600 includes a camera 610 for adjusting the up-and-down drive h) to the up-and-down third mover 430. And <> 〇 early 兀 100 and pick up the single 840 back to the next 200941597 focused on a target; and a camera drive unit (not shown) for moving the camera 610 back and forth. The camera 610 is moved to a predetermined position by the operation of the camera driving unit, thereby sensing where the wafer sucked to the bonding head 430 is located and where the wafer is to be soldered on the welding target f. Since the height from the welding target F to the welding unit 4 is higher than two degrees in the related art, both the camera 610 and the conveying head 84 can be placed between the welding target F and the welding head 430 at the same time.

Φ Therefore, the position at which the transfer head 840 transfers the wafer to the bonding head 430, the position previously set to the camera 61, and the bonding head 43 can be set on the same silkworm line. The position at which the transfer head 840 transfers the wafer to the soldering tip 430 is located above the position previously set to the camera 610. Fig. 5 is a flow chart showing an embodiment of a welding machine control method according to the present invention, and Fig. 6 is a sequential view showing stages of the welding machine operation of the welding machine control method according to the present invention. An embodiment of the welding machine control method will be described with reference to Figures 5 and 6. Nr flattening The guiding unit 200 is moved - a predetermined distance. The welding head 430 of the tan 70 is placed at its initial position P2 (stage B 1 of Fig. 6). By the operation of the 颂 driving unit 8 3 传送, the transfer head 840 picks up a wafer by the wafer mounted on the wafer and moves to the initial position Μ 12

The solder joint 430' of 200941597 thus transfers the wafer to the soldering tip 43 (6B2). Here, the transfer head 840 is placed under the soldering head 430. The wafer transferred by the transfer head 840 is placed on one of the soldering heads 43. Next, the soldering head 430 is sucked and transported by the transporting head 84. By the camera driving unit The operation 'camera 61 shifts the previously set position P3. The movement to the preset position p3 is thus placed between the welding head 430 and the welding target ρ. Preferably, the transfer head 840 is executed by transferring the wafer to the soldering operation and when the camera 610 is moved to the preset position P3. Therefore, the 'welding head 43 〇, the transfer head 84 〇, and the μ ϊ n line' and the transfer head 84G are placed on the photographing side (stage B2 of Fig. 6). ', ~ Puyi 丨 inch 迗 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 Where on the object F. The change between the positions of the sensing and the sensing. The camera 6 1 〇 is operated by the camera drive unit. When 1~何〇i υ moves back to its initial position, 2 compensates for the wafer position and the welding position. Move back from the camera 6 1 0 to its initial position, the stone picks up to the soldering head 4 3 晶片 wafer will 垾At the stage of picking up the house map, the surface will be sucked off. The operation of the camera 610 head 430 moves to the same location as the chip and from the camera to its initial 4 3 〇 at the beginning of the 4 3 0 simultaneous object F 13

Welding position of 200941597 (stage B 3 of Figure 6). Alternatively, the variation between the welding positions on the F of the wafer which is drawn to the bonding head 430 can be compensated at the same time as the welding position on the welding head F. When the welding head 430 welds the wafer to the welding target, the welding stage 500 supports the welding target F. The welding stage 500 supports the welding surface so that the welding head 430 can operate the welding by hot pressing F. By moving in the X-axis direction and direction according to the positional change, the welding head aligns the welding positions sucked to the welding head 430 to the target F. The first driving unit 470 and the second driving unit 460 are respectively moved in the X-axis direction, the Y-axis direction, and by the operation of the third driving unit 450. The position of the wafer which is drawn to the bonding head 430 and the variation between the bonding positions (e.g., the relative offset) are generated by the head 840 being transferred to the suction surface of the wafer of the bonding head 430 0. Here, the positional change ^ When the welding target F is transmitted by the conveying unit 300, the pre-positional variation can be slightly generated by the error of the conveying distance. Once the welding head 430 welds the wafer to the welding target 430, it moves to its initial position. Position P2. The position and welding target 43 0 is lowered to the welding position on the welding target F and the welding head 430. One of the lower parts of the special object F is attached to the Y-axis direction of the welding target, the position of the rotating wafer, and the welded portion, and the welding head is moved to the fourth drive and the rotational direction. The soldering tip 430 is thus soldered onto the target F, primarily based on the transfer by the soldering head 430 I. At this time, when the distance is set first, it is born. On the object F, the welding head is further, and as the welding target 14 200941597 is moved by the operation of the conveying unit 300 to a predetermined distance, the welding position of the other wafer is located below the initial position Ρ2. Preferably, the operation of the welding head 430 by moving to its initial position Ρ2 and the operation of the transfer unit 300 by moving the welding target F are simultaneously performed. Once the soldering tip 430 is moved to its initial position Ρ2, the transporting head 840 is moved to transfer the other wafer picked up by the transporting head 840 to the soldering tip 430 which is moved to the initial position Ρ2.

The other wafer sucked to the bonding head 430 is soldered to the bonding position on the welding target F through the aforementioned process. As the above process is repeatedly performed, the wafers disposed on the wafer of the wafer supply unit 700 are thus soldered to the solder target F, for example, a lead frame or tape provided with a plurality of metal patterns. In the present invention, when the bonding head 430 is placed at its initial position Ρ2, the transfer head 8040 of the wafer transfer unit 80 picks up a wafer and transfers the wafer under the bonding head 430. Therefore, the bonding head 430 picks up the transferred wafer, thereby soldering the wafer onto the welding target F. Since the transfer head 840 picks up the wafer and directly transfers the wafer to the bonding head 430, it can reduce the necessary movement of the bonding head 430. In the control method of the related art, after moving to the wafer transfer position Ρ1, the solder head 430 is moved down to pick up the wafer picked up by the transfer head 840, and then moved back to its initial position Ρ 2, and Therefore, the welding head 430 needs to perform considerable movement. However, according to the present invention, since the transfer head 840 picks up the wafer and transfers the wafer to the bonding head 430 placed at the initial position ,2, the bonding head 430 can move less 〇15 200941597 due to the reduction of the movement of the bonding head 430 (especially The movement in the horizontal direction) reduces the occurrence of vibration caused by the movement of the welding head 430 and shortens the time required to perform the welding process. At the same time, since the transfer head 840 moves to the bonding head 430 placed at the initial position P 2 to transfer the wafer, the transfer head 840 thus moves further. However, since the transfer head 840 is relatively light, less vibration is generated and the transfer head 840 moves faster, thereby shortening the time required to perform the welding process.

Further, since the operation of the transfer head 840 placed under the soldering head 430 to transfer the wafer to the soldering head 430, and the operation of the camera unit 61 of the camera unit 600 to move to a predetermined position are simultaneously performed, the soldering process is performed. The required time can be shortened compared to when the camera 610 and the transfer head 840 are sequentially moved, respectively. Meanwhile, since the position of the welding head 430, that is, the position of the welding unit 400, is slightly higher than that implemented in the related art, in order to allow the transfer head 840 and the camera 610 to be placed between the welding head 430 and the welding target F at the same time, Thus, the welding head 430 moves farther than the welding position on the welding target F. However, the moving distance is considerably shortened as compared with the related art in which the bonding head 430 moves to the wafer transfer position, and the bonding head 430 moves vertically, thereby generating less vibration. Further, in the present invention, the soldering head 430 is transferred to the wafer transfer position P1 to acquire a wafer, and is moved again to the initial position P2, so that the related technical steps of checking the movement completion signal are not implemented, thereby further shortening the process. The time required.

As described above, in the present invention, a wafer will be soldered to the welding target F 16 200941597

The vibration in the process is minimized, thereby enhancing the accuracy of the welding process, thereby improving the reliability of the welding machine, and the welding process must be short in time, thereby increasing the productivity, thereby increasing the competition of the welding machine. The embodiments and advantages are merely exemplary and are not considered as a basis for the disclosure. This teaching can be easily implemented to other types of devices. This proxy is intended to be illustrative and not to limit the scope of the claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art. Features, methods, and other features of the exemplary embodiments described herein can be combined in the same manner to obtain additional and/or alternative exemplary embodiments. Since the features of the present invention can be implemented in several forms without departing from the characteristics thereof, it is also to be understood that the above-described embodiments are not limited by any of the details described above unless otherwise indicated. The scope of the patent is to be interpreted broadly within the scope of the invention, and therefore, variations and modifications within the scope and scope of the patent application, or equivalents of the In it. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are included to provide a further understanding of the invention principle. In the drawings: Fig. 1 is a front view, which partially shows an example of a general welding machine; the definition of the limit is not limited to the scope of the Ming Fan 17 200941597 Figure 2 is an enlarged side view, part of it The welding machine is shown; FIG. 3 is a sequence diagram showing various stages in the welding machine control method of the related art; FIG. 4 is an enlarged side view partially showing the welding machine; FIG. 5 is a flow chart, It shows a welding machine control method according to an embodiment of the present invention; and

Figure 6 is a sequential view showing stages of a welding machine control method in accordance with an embodiment of the present invention. [Description of main component symbols] F Welding target P1 Wafer transfer position P2 Initial position P3 Preset position 100 Base frame 200 Guide unit 300 Transfer unit 400 Welding unit 410 Subrack 420 Head frame 430 Weld head 440 Second drive unit 450 Three drive unit 460 Fourth drive unit 470 First drive unit 480 Heater 500 Solder stage 600 Camera unit 610 Camera 700 Chip supply unit 800 Wafer transfer unit 8 10 Guide frame 820 Transfer head 830 Head drive unit 840 Transfer head 18

Claims (1)

200941597 X. Patent Application Range: 1. A welding machine control method comprising: placing a welding head for welding a wafer onto a welding target to an initial position; picking up a wafer and moving at a transfer head After the initial position, transferring the wafer to the soldering tip; sensing a position of the wafer transferred to the soldering tip by a camera moving to a predetermined position, and the wafer is to be soldered on the soldering target Wherein, thereby calculating a positional change; after compensating for the calculated positional change, the wafer is welded to the welding target by the welding head; and lifting the welding head to move it to the initial position. 2. The method of claim 1, wherein the transfer head transfers the wafer to the solder joint, and the operating system by which the camera moves to the predetermined position is simultaneously executed. 3. The method of claim 2, wherein the soldering tip, the transfer head, and the camera are placed on a same line, the state of which is the operation of the transfer head to transfer the wafer to the soldering tip and the camera The operation to move to the preset position is performed simultaneously. 4. The method of claim 1, wherein the welding head compensates for the positional change and then descends when the camera moves 19 200941597 back to its original position to weld the wafer that has been transferred to the soldering tip. To the welding target. 5. The method of claim 1, wherein the soldering tip compensates for the change in position when the soldering tip is lowered to solder the wafer transferred to the soldering tip to the solder target. ❹ ❹ 20