TWI365500B - Control method for bonding machine - Google Patents
Control method for bonding machineInfo
- Publication number
- TWI365500B TWI365500B TW097125612A TW97125612A TWI365500B TW I365500 B TWI365500 B TW I365500B TW 097125612 A TW097125612 A TW 097125612A TW 97125612 A TW97125612 A TW 97125612A TW I365500 B TWI365500 B TW I365500B
- Authority
- TW
- Taiwan
- Prior art keywords
- control method
- bonding machine
- bonding
- machine
- control
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080027555A KR100844346B1 (en) | 2008-03-25 | 2008-03-25 | Control method for bonding machine |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200941597A TW200941597A (en) | 2009-10-01 |
TWI365500B true TWI365500B (en) | 2012-06-01 |
Family
ID=39823875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097125612A TWI365500B (en) | 2008-03-25 | 2008-07-07 | Control method for bonding machine |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100844346B1 (en) |
CN (1) | CN101546175A (en) |
TW (1) | TWI365500B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5941705B2 (en) * | 2012-02-29 | 2016-06-29 | ファスフォードテクノロジ株式会社 | 2-axis drive mechanism and die bonder |
CN105470173B (en) * | 2015-12-15 | 2018-08-14 | 上海微电子装备(集团)股份有限公司 | A kind of chip bonding system and method |
JP7102113B2 (en) * | 2017-09-11 | 2022-07-19 | ファスフォードテクノロジ株式会社 | Manufacturing method of die bonding equipment and semiconductor equipment |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3275742B2 (en) | 1996-11-28 | 2002-04-22 | 松下電器産業株式会社 | Chip bonding method |
JP2002231768A (en) * | 2001-02-01 | 2002-08-16 | Shinkawa Ltd | Inner lead bonding device |
JP3747054B2 (en) | 2001-12-04 | 2006-02-22 | Towa株式会社 | Bonding apparatus and bonding method |
KR101132141B1 (en) * | 2006-03-03 | 2012-03-29 | 삼성테크윈 주식회사 | Method for correcting die pickup position |
-
2008
- 2008-03-25 KR KR1020080027555A patent/KR100844346B1/en active IP Right Grant
- 2008-07-07 TW TW097125612A patent/TWI365500B/en active
- 2008-07-28 CN CN200810134603A patent/CN101546175A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN101546175A (en) | 2009-09-30 |
TW200941597A (en) | 2009-10-01 |
KR100844346B1 (en) | 2008-07-08 |
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