JP3747054B2 - Bonding apparatus and bonding method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a bonding apparatus and a bonding method for mounting a chip-shaped electronic component formed by cutting a wafer on a substrate.
[0002]
[Prior art]
Conventionally, when a chip-shaped electronic component (hereinafter referred to as a chip) formed by cutting a wafer is mounted on a circuit board (hereinafter referred to as a substrate), it has been performed as follows. First, a chip is picked up from the cut wafer by suction using a bonding head. Next, the bonding head is moved over the substrate to align the chip and the substrate. Next, after lowering the bonding head and mounting the chip on the substrate, the suction is released and the bonding head is raised.
[0003]
[Problems to be solved by the invention]
However, according to the conventional bonding described above, one bonding head performs everything from picking up a chip to mounting on a substrate. Therefore, there is a limit in reducing the cycle time required for one bonding.
Also, in recent years, bonding forms have been diversified, and not only face-up bonding in which the electrode forming surface of the chip faces up but also face-down bonding in which the electrode forming surface of the chip faces down has been adopted. However, according to conventional bonding, when face-down bonding is performed, it is necessary to transfer a chip from one bonding head, invert the chip, and pick up the chip again by the bonding head. Therefore, since it takes time to transfer and invert the chip, it becomes difficult to shorten the cycle time.
[0004]
The present invention has been made in order to solve the above-described problems, and can reduce the cycle time and improve the working efficiency of bonding in correspondence with both face-up bonding and face-down bonding. An object is to provide an apparatus and a bonding method.
[0005]
[Means for Solving the Problems]
In order to solve the above-described technical problem, a bonding apparatus according to the present invention is a bonding apparatus for mounting a chip made of an electronic component on a substrate, and includes a pickup unit that picks up a chip and a pickup unit that moves forward and backward. A transport unit that transports the picked-up chip, a delivery table on which the chip picked up by the pick-up unit is temporarily placed, and a head unit that has at least two heads and receives the transported or temporarily placed chip And the transport unit further has a function of transporting the chip and temporarily placing it on the delivery table, and each of the heads rotates about a predetermined axis by a predetermined angle and moves above the substrate. move the tip, and, together with mounting the chip on the substrate is lowered separately and independently from each other, the head portion One head Chi receives a chip other heads of the head unit that is newly transported or temporarily placed lowered independently and separately one head while mounting the chip on the substrate, the pickup unit Has a function of inverting the picked-up chip, and the head unit receives the inverted chip and performs face-down bonding by attaching it to the substrate, and receives the transferred and temporarily placed chip and the substrate. It has a function of performing face-up bonding by attaching to the head, and the distance that each of the heads descends is the operation of receiving the inverted chip from the pickup unit, and receiving the transferred and temporarily placed chip from the delivery table. It is characterized by enabling both operations .
[0006]
According to this, the pickup unit picks up and inverts the chip, and the head unit receives the inverted chip and attaches it to the substrate. Further, while one head mounts the chip on the substrate, the other head receives the newly transferred chip. Therefore, when face-down bonding is performed, the cycle time required for one bonding is shortened.
[0007]
The transport unit further has a function of transporting the picked-up chip and temporarily placing it on the delivery table. The head unit further has a function of performing face-up bonding by receiving the temporarily placed chip and mounting the chip on the substrate. Therefore, according to the bonding apparatus of the present invention, first, not only face-down bonding but also face-up bonding is possible. Secondly, work efficiency is improved when performing either face-down bonding or face-up bonding.
[0008]
The bonding method according to the present invention is a bonding method for mounting a chip made of an electronic component on a substrate, the step of picking up the chip, the step of conveying the picked-up chip by a slider that moves forward and backward, and the face down and a step of inverting the picked-up chip when performing the bonding, or, Rutotomoni is inverted or temporarily placed and a step of temporarily placing the transported tip when performing a face-up bonding Passing the chip to one of the heads having at least two heads, and moving the chip above the substrate by rotating the head by a predetermined angle about a predetermined axis; the chip instrumentation into one substrate lowered independently and separately heads other heads of the head portion Face-down bonding and a step of performing one of the bonding of the face-up bonding, in the step of performing bonding, other heads than one head other than said other heads of the head portion by The head is lowered independently of the head of the head and receives newly inverted or temporarily placed chips, and the distance by which each of the heads descends is determined by the operation of receiving the inverted chips from the pickup unit, and the transported and temporarily placed chips. It is characterized in that it is possible to perform both the operation of receiving the chip obtained from the delivery table .
[0009]
According to this, the pickup unit picks up and inverts the chip, and the head unit receives the inverted chip and attaches it to the substrate. Further, while one head mounts the chip on the substrate, the other head receives the newly inverted chip. Therefore, when face-down bonding is performed, the cycle time required for one bonding can be shortened.
[0010]
When face-down bonding is performed, the picked-up chip is reversed, or when face-up bonding is performed, the conveyed chip is temporarily placed. In the bonding process, another head in the head portion receives a newly inverted or temporarily placed chip. Thus, according to the bonding method of the present invention, first, both face-down bonding and face-up bonding can be performed. Secondly, work efficiency can be improved when performing either face-down bonding or face-up bonding.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
A bonding apparatus and a bonding method according to a first embodiment of the present invention will be described with reference to FIGS. The present embodiment relates to a bonding apparatus and a bonding method that are applied to face-down bonding and improve the work efficiency of bonding.
1A and 1B are front views respectively showing a step of picking up a chip and a step of inverting the chip when the bonding apparatus according to the present embodiment operates. FIGS. 2A and 2B are front views respectively showing a chip delivery process and a chip alignment process with respect to the substrate when the bonding apparatus of FIG. 1 operates. FIGS. 3A and 3B show a step of bonding a chip to a substrate and picking up the next chip and inverting it when the bonding apparatus of FIG. 1 is operated. It is a front view which shows a delivery process, respectively.
[0012]
In FIG. 1, a wafer table 2 is provided on a base 1 of a bonding apparatus so as to be movable in an X direction (left and right direction in the figure) and a Y direction (front and back directions in the figure). On the wafer table 2, a wafer 3 made of a cut semiconductor substrate, for example, a silicon substrate is placed. The wafer 3 is composed of individual pieces after cutting, that is, chips 4A, 4B, 4C,..., And the electrode forming surface (shown by a thick line in the figure) of each chip 4A, 4B, 4C,. In this manner, the wafer is placed on the wafer table 2.
[0013]
A slider attachment portion 5 is fixed to the base 1, and a slider 6 is attached to the slider attachment portion 5 so as to be slidable in the X direction and the Z direction (vertical direction in the figure). A pickup head 7 is attached to the tip of the slider 6 so as to be rotatable or rotatable about an axis provided along the Y direction. Further, a pickup tool 8 is attached to the surface of the pickup head 7 that faces the wafer 3.
[0014]
A shaft 9 is fixed to the base 1, and an arm 10 is attached to the shaft 9 so as to be rotatable or rotatable. Bonding heads 11 and 12 are attached to both ends of the arm 10 so as to be slidable in the Z direction. Bonding tools 13 and 14 having heaters (not shown) for preheating the chips are attached to the lower surfaces of the bonding heads 11 and 12, respectively. Here, the arm 10, the bonding heads 11 and 12, and the bonding tools 13 and 14 together constitute a head portion 15.
[0015]
The base 1 is provided with a substrate table 16 that is movable in the X direction and the Y direction and is rotatable in the θ direction. On the substrate table 16, a substrate 17 made of, for example, a printed circuit board to which the chips 4A, 4B, 4C,. A bonding paste (not shown) made of, for example, an epoxy resin is applied in advance to a portion of the substrate 17 where the chips 4A, 4B, 4C,.
[0016]
The operation of the bonding apparatus according to the present embodiment will be described with reference to FIGS. First, as shown in FIG. 1A, the pick-up tool 8 picks up one chip 4A from the cut wafer 3 by suction, and the pick-up head 7 and the slider 6 raise the chip 4A.
[0017]
Next, as shown in FIG. 1B, the pickup head 7 is rotated or rotated by 180 ° about an axis provided along the Y direction to invert the chip 4A. Thereby, the electrode formation surface of the chip 4A is positioned on the lower side.
[0018]
Next, as shown in FIG. 2A, the slider 6 moves to the left until the chip 4 </ b> A is positioned directly below the bonding tool 13. Then, the bonding head 11 is lowered, the bonding tool 13 comes into contact with the chip 4A, the pickup tool 8 releases the adsorption, and the bonding tool 13 adsorbs the chip 4A, and then the bonding head 11 is raised. Here, the chip 4 </ b> A is preheated by a heater (not shown) attached to the bonding tool 13.
[0019]
Next, as shown in FIG. 2B, the arm 10 is rotated or rotated by 180 °, and the substrate table 16 is moved in the X direction, Y direction, and θ direction as necessary, to the substrate 17. The chip 4A is aligned with respect to it. Here, for example, using the image data obtained by a camera (not shown), the alignment mark between the chip 4A and the substrate 17 is recognized and alignment is performed. Thereafter, the bonding head 11 is lowered until the chip 4A comes into contact with the substrate 17 and the chip 4A is further pressurized with a predetermined load.
On the other hand, the slider 6 moves to the right and the pickup head 7 rotates or rotates 180 ° to position the pickup tool 8 on the lower side. Further, the wafer table 2 moves to the left until the next chip 4B reaches a predetermined position.
[0020]
Next, as shown in FIG. 3A, the bonding head 11 presses the chip 4A against the substrate 17 for a predetermined time with a predetermined load. After the bonding paste on the substrate 17 is cured in this state, the bonding tool 13 releases the suction. Through the steps so far, the chip 4A is face-down bonded to a predetermined position of the substrate 17.
On the other hand, the pickup tool 8 sucks the next chip 4B, and the pickup head 7 rotates or rotates 180 ° to reverse the next chip 4B. Thus, the electrode forming surface of the chip 4B is positioned on the lower side.
[0021]
Next, as shown in FIG. 3B, the bonding head 11 that has finished bonding the chip 4A is raised. Further, the substrate table 16 moves in the Y direction until the region where the next chip 4B is bonded on the substrate 17 reaches a predetermined position.
On the other hand, the slider 6 moves to the left until the next chip 4B is located directly below the bonding tool 14, the bonding head 12 descends, the bonding tool 14 contacts the chip 4B, and the pickup tool 8 releases the suction. At the same time, after the bonding tool 14 sucks the chip 4B, the bonding head 12 moves up. Here, as in the case of FIG. 2A, the chip 4B is preheated by a heater (not shown) attached to the bonding tool.
[0022]
After that, the operation shown in FIG. 2B and thereafter is performed to bond the chip 4B to the substrate 17. Thereafter, the above-described operation is repeated, and the chips 4C,.
[0023]
As described above, according to this embodiment, while one bonding head 11 attaches the chip 4A to the substrate 17, the other bonding head 12 receives the newly picked up chip 4B. The cycle time required for bonding can be shortened. Therefore, the work efficiency of face-down bonding can be improved.
[0024]
(Second Embodiment)
A bonding apparatus and bonding method according to the second embodiment of the present invention will be described with reference to FIG. The present embodiment is applied not only to face-down bonding but also to face-up bonding, and relates to a bonding apparatus and a bonding method that improve the work efficiency of bonding.
4A and 4B are front views respectively showing a step of picking up a chip and a step of delivering the chip without being inverted when the bonding apparatus according to this embodiment operates. In FIG. 4, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIGS.
[0025]
As shown in FIG. 4, in the present embodiment, a delivery table 18 is provided on the base 1. Here, the slider 6 is provided at a position that does not hinder the bonding heads 11 and 12 from being lowered (see FIG. 5). The height of the delivery table 18 and the position and stroke in the height direction of the bonding heads 11 and 12 are determined so that both the following operations are possible.
The first operation is an operation in which the bonding tools 13 and 14 suck the chips 4A, 4B,... On the delivery table 18 when the bonding heads 11 and 12 are lowered. The second operation is an operation in which the bonding tools 13 and 14 suck the chips 4A, 4B,... Inverted by the pickup head 7 when the bonding heads 11 and 12 are lowered.
[0026]
The bonding apparatus according to the present embodiment operates as follows. First, as in the first embodiment, as shown in FIG. 4A, the pickup tool 8 picks up one chip 4A from the cut wafer 3 by suction, and picks up the pickup head 7 and the slider 6. Raises the chip 4A.
[0027]
Next, as shown in FIG. 4B, the slider 6 moves to the left until the chip 4 </ b> A is located directly below the bonding tool 13 and above the delivery table 18. Thereafter, the pickup head 7 is lowered, the pickup tool 8 releases the suction, and the pickup head 7 is raised. Thus, the chip 4A is temporarily placed on the delivery table 18 with the electrode formation surface positioned on the upper side.
[0028]
Next, the slider 6 moves to the right so that the pickup head 7 does not prevent the bonding head 11 from descending. Then, after the bonding head 11 is lowered and the bonding tool 13 comes into contact with and adsorbs to the chip 4A, the bonding head 11 is raised. Here, as in the first embodiment, the chip 4A is preheated by a heater (not shown) attached to the bonding tool 13.
[0029]
Thereafter, as in the first embodiment, the arm 10 rotates 180 °, the chip 4A is aligned with the substrate 17, and the bonding head is pressed until the chip 4A is pressed against the substrate 17 with a predetermined load. 11 goes down.
On the other hand, the wafer table 2 moves to the left until the next chip 4B reaches a predetermined position.
[0030]
Next, as in the first embodiment, after the bonding head 11 pressurizes the chip 4A against the substrate 17 and the bonding paste on the substrate 17 is cured, the bonding tool 13 is lifted by releasing the suction. Through the steps so far, the chip 4A is face-up bonded to a predetermined position of the substrate 17.
On the other hand, the pickup tool 8, the pickup head 7, and the slider 6 pick up the next chip 4 </ b> B, move it up above the delivery table 18, and temporarily place it on the delivery table 18.
[0031]
As described above, according to this embodiment, while one bonding head 11 attaches the chip 4A to the substrate 17, the other bonding head 12 receives the newly picked up chip 4B. The cycle time required for bonding can be shortened. Also, work efficiency can be improved not only in face-down bonding but also in face-up bonding.
[0032]
In addition, if it is not necessary to share one bonding apparatus for face-up bonding and face-down bonding, it can be dedicated to face-up bonding. In this case, the height of the delivery table 18 and the height direction position and stroke of the bonding heads 11 and 12 may be determined in consideration of only face-up bonding.
[0033]
(Third embodiment)
By the way, in recent years, so-called flip chip bonding, in which the electrode forming surface of the chip and the electrode forming surface of the substrate are opposed to each other and the electrodes are connected with high positioning accuracy, has been widely performed. However, according to the conventional bonding, when performing flip chip bonding, one bonding head also performs an alignment operation, so that it becomes more difficult to shorten the cycle time. The third embodiment of the present invention is intended to shorten the cycle time in flip chip bonding.
[0034]
Hereinafter, a third embodiment of the present invention will be described with reference to FIG. FIG. 5 is a plan view showing a process of bonding a chip and detecting position information of the next chip when the bonding apparatus according to the present embodiment operates. In FIG. 5, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIGS.
[0035]
As shown in FIG. 5, the base 1 is provided with a position detection unit 23 that detects position information of the next chip 4 </ b> C waiting in the process of bonding the chip 4 </ b> B. The position detection unit 23 has a CCD camera, for example, and performs image processing on the detected image information to detect the positions of the chip 4C in the X direction, Y direction, and θ direction, respectively.
A plurality (three in the figure) of wafer cassettes 24 are provided so as to move in the Y direction so that the wafers in the wafer cassette 24 are supplied to the wafer table 2. FIG. 5 shows a state where the top plate of each wafer cassette 24 is virtually removed.
[0036]
The bonding apparatus according to the present embodiment operates as follows. First, as shown in FIG. 5, in the process in which the chip 4B is bonded, the position detection unit 23 detects position information in the X direction, Y direction, and θ direction of the next chip 4C. Further, a certain calculation process is performed to calculate the estimated position information of the chip 4C in a state where the arm 10 is rotated by −90 °, that is, 90 ° in the counterclockwise direction.
[0037]
Next, after the bonding of the chip 4B is completed, the substrate table 16 moves in the Y direction until the region where the next chip 4C is bonded on the substrate 17 is in a predetermined position. Further, the substrate table 16 moves in the X direction, the Y direction, and the θ direction based on the planned position information of the chip 4C. Thus, the alignment of the chip 4C with respect to the substrate 17 is completed while the waiting chip 4C moves above a predetermined position on the substrate 17.
[0038]
As described above, according to the present embodiment, it is possible to significantly reduce the alignment time that is performed after the chip 4C moves to a predetermined position on the substrate 17 in the conventional bonding. Therefore, the working efficiency of bonding can be further improved.
[0039]
In each of the above-described embodiments, the case where the wafer 3 made of a silicon substrate is used has been described. Not limited to this, it is also possible to use a multi-piece printed circuit board in which the chips 4A, 4B, 4C,. In this case, instead of the chips 4A, 4B, 4C,..., Each piece of the resin-sealed printed circuit board cut, that is, each package is bonded to another substrate.
Instead of a silicon substrate, an SOI (Silicon On Insulator) substrate, a compound semiconductor substrate, or the like can be used.
[0040]
Further, the chips 4A, 4B, 4C,... Were picked up from the cut wafer 3. Not only this but the chip | tip which consists of an electronic component of the state accommodated in the tray as a chip | tip 4A, 4B, 4C, ... can also be picked up.
[0041]
Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as necessary within a range not departing from the gist of the present invention. .
[0042]
【The invention's effect】
According to the present invention, while one head mounts a chip on a substrate, another head receives a newly picked-up chip, so that the bonding cycle time can be shortened. In addition, since the pickup unit picks up the chip and inverts it, and the head unit receives the inverted chip and attaches it to the substrate, it is possible to shorten the bonding cycle time even when face-down bonding is performed. .
Therefore, the present invention provides a bonding apparatus and a bonding method that can shorten the cycle time and improve the work efficiency of bonding in correspondence with both face-up bonding and face-down bonding. This is an effective effect.
[Brief description of the drawings]
FIGS. 1A and 1B are front views showing a step of picking up a chip and a step of inverting the chip, respectively, when the bonding apparatus according to the first embodiment of the present invention operates. is there.
FIGS. 2A and 2B are front views showing a chip delivery process and a chip alignment process with respect to a substrate when the bonding apparatus of FIG. 1 operates.
FIGS. 3A and 3B show a step of bonding a chip to a substrate and picking up and reversing the next chip when the bonding apparatus of FIG. 1 operates; It is a front view which shows the process of delivering a chip | tip, respectively.
FIGS. 4A and 4B show a step of picking up a chip and a step of delivering the chip without being inverted when the bonding apparatus according to the second embodiment of the present invention operates. FIG.
FIG. 5 is a plan view showing a step of bonding a chip and detecting position information of the next chip when the bonding apparatus according to the third embodiment of the present invention operates.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base 2 Wafer table 3 Wafer 4 Chip 5 Slider mounting part 6 Slider 7 Pickup head 8 Pickup tool 9 Axis 10 Arm 11, 12 Bonding head (head)
DESCRIPTION OF SYMBOLS 13, 14 Bonding tool 15 Head part 16 Board | substrate table 17 Board | substrate 18 Delivery table 19-22 Bonding head 23 Position detection unit 24 Wafer cassette

Claims (2)

A bonding apparatus for mounting a chip made of electronic components on a substrate,
A pickup section for picking up the chip;
A transport unit that transports the pickup unit and the picked-up chip by a slider that moves forward and backward,
A delivery table on which the chips picked up by the pickup unit are temporarily placed;
A head portion that has at least two heads and receives the transferred or temporarily placed chips, and
The transport unit further has a function of transporting the chip and temporarily placing it on the delivery table;
Each of the heads rotates and moves a predetermined angle around a predetermined axis to move the chip above the substrate, and descends separately and attaches the chip to the substrate. While one of the head units mounts the chip on the substrate, the other head of the head unit descends independently of the one head and is newly transported or temporarily placed. receiving the chip,
The pickup unit has a function of inverting the picked up chip,
The head unit receives the inverted chip and attaches it to the substrate, and performs a face-down bonding function. The head unit receives the transported and temporarily placed chip and attaches the chip to the substrate for face-up bonding. Has the function to perform,
The distance by which each of the heads descends enables both the operation of receiving the inverted chip from the pickup unit and the operation of receiving the transferred and temporarily placed chip from the delivery table. Bonding equipment. A bonding method for mounting a chip made of electronic components on a substrate,
Picking up the chip;
A step of conveying the picked-up chip by a slider that advances and retreats;
When performing a face down bonding comprises the step of inverting the chip is picked up, or, in the case of performing a face-up bonding and a step of temporarily placing the chips that are transported Rutotomoni,
Transferring the inverted or temporarily placed chip to one of the heads having at least two heads;
A step of moving the chip above the substrate by rotating the head portion by a predetermined angle around a predetermined axis;
A step of performing one of face-down bonding and face-up bonding by the one head descending independently of the other heads of the head portion and mounting the chip on the substrate; With
In the bonding step, the other heads other than the one head in the head portion are lowered independently of the heads other than the other heads and newly inverted or temporarily placed. along with the receipt of the,
The distance by which each of the heads descends enables both the operation of receiving the inverted chip from the pickup unit and the operation of receiving the transferred and temporarily placed chip from the delivery table. Bonding method.

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