JP2003060396A - Apparatus and method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component capable of efficiently mounting components on a substrate. SOLUTION: The apparatus for mounting the electronic component takes out the component 5 from a component supply unit 3 by a transfer head 9 and transfers and mounts the component 5 on the substrate 2. The apparatus comprises a substrate recognition camera 15 for imaging, to detect a position of the substrate 2 positioned on a conveying passage 1 by moving independently of the head 9, by advancing or retracting with respect to the substrate 2 positioned on the passage 1. The method for mounting the electronic component comprises an imaging step of imaging the substrate 2 by the camera 15, and a component taking-out step of taking out the component by the head 9 by the supply unit 3, to be executed simultaneously in parallel therewith. Thus, a tact time can be shortened, and the component 5 can be mounted efficiently on the substrate 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component such as a flip chip on a substrate.

[0002]

2. Description of the Related Art As a method of mounting a semiconductor chip on a substrate, a method of electrically connecting the electronic component to the substrate via bumps which are protruding electrodes provided on the lower surface of the electronic component such as a flip chip has been widely used. There is. In this method, since it is necessary to align the electrodes of the substrate and the bumps of the electronic component with high accuracy when the electronic component is mounted on the substrate by the transfer head, the substrate and the bump of the electronic component are generally aligned with each other in the camera. The positional deviation is detected by recognizing the substrate and the bump by picking up the image in step (3), and the positional deviation is corrected during the mounting operation, and then the bump is mounted on the electrode.

[0003]

However, in the conventional mounting apparatus described above, the takt time tends to be delayed because the imaging operation by the camera on the substrate and the mounting operation by the transfer head are performed in the same cycle. Especially, in the case of a multi-piece board in which a large number of unit boards are built in one board, it is necessary to perform position detection for each unit board, and therefore, it takes a long time to perform image pickup and recognition processing, thus improving mounting efficiency. It was a big obstacle in trying.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of efficiently mounting electronic components on a substrate.

[0005]

An electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus for transferring and mounting electronic components on a substrate by a transfer head, and a component supply unit for supplying the electronic components. In the component supply unit, the transfer head including a substrate positioning unit that positions the substrate and a plurality of suction nozzles that suction and hold the electronic component is moved between the component supply unit and the substrate positioning unit. Head moving means for aligning the transfer head at the time of picking up the electronic component and mounting the electronic component on the board positioning portion, and the board moving portion is arranged so as to be able to move forward and backward to advance onto the board of the board positioning portion. Sometimes an image pickup means for picking up the board, a position detecting means for detecting the position of the board based on the image data obtained by the picking up, and a position detecting means for detecting the position. Results and a control section for controlling the head moving means on the basis of.

An electronic component mounting method according to a second aspect is an electronic component mounting method in which an electronic component is taken out from a component supply section by a transfer head that is moved by a head moving means, and is transferred and mounted on a substrate positioned by a substrate positioning section. There
An image pickup step in which an image pickup means arranged so as to be able to move forward and backward with respect to the board positioning section is advanced on the board of the board positioning section to pick up the board, and the position of the board based on the image data obtained by this picking up. Position detection step of detecting the electronic component from the component supply section by the transfer head, and the head moving means based on the position detection result to control the transfer head to the substrate positioning section. And a component mounting step of mounting the electronic component on the substrate by moving the electronic component onto the positioned substrate, and the imaging step in the substrate positioning section and the component extracting step in the component supply section are simultaneously performed in parallel.

An electronic component mounting method according to a third aspect is the electronic component mounting method according to the second aspect, wherein the substrate is a multi-cavity substrate in which a plurality of unit substrates are formed, and in the imaging step. An image is taken for each unit board.

An electronic component mounting method according to a fourth aspect is the electronic component mounting method according to the second aspect, wherein the mounting state inspection is performed by imaging the substrate after mounting the electronic component by the substrate recognition camera.

According to the present invention, the tact time is shortened by simultaneously performing the imaging operation for detecting the board position in the board positioning section and the picking up operation of the electronic component by the transfer head in the component supply section. Therefore, electronic components can be efficiently mounted on the substrate.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2A is a plan view of a substrate to be mounted by the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 3B is a plan view of a unit substrate to be mounted by the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 4 is a flow chart of a mounting operation in the electronic component mounting method according to the embodiment of the present invention, and FIGS. 5 and 6 are process explanatory diagrams of the electronic component mounting method according to the embodiment of the present invention.

First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a substrate 2 on which electronic components are mounted is mounted on a transport path 1 arranged in the X direction.
Is placed. The transport path 1 receives the substrate 2 loaded from the upstream side and positions it at the electronic component mounting position. Therefore, the transport path 1 serves as a board positioning portion for positioning the board 2.

A component supply unit 3 for supplying electronic components is arranged on the front side of the transport path 1. The component feeder 3 is provided with a tray feeder 4 and a tape feeder 6. The tray feeder 4 accommodates electronic components 5 with bumps such as flip chips having bumps formed on the lower surface, and the tape feeder 6 is Various chip-type electronic components (not shown) are accommodated while being held by the tape.

Two Y-axis tables 7A and 7B are disposed above the transport path 1 in the Y direction orthogonal to the transport path 1 with the substrate positioning portion sandwiched therebetween. The Y-axis tables 7A and 7B include: First X-axis table 8 and second X-axis table 14
Has been erected. A transfer head 9 having a plurality of suction nozzles 10 is mounted on the first X-axis table 8,
A board recognition camera 15 is attached to the second X-axis table 14.

Y-axis table 7A and first X-axis table 8
By driving the transfer head 9, the transfer head 9 reciprocates between the component supply unit 3 and the substrate 2 on the substrate positioning unit (conveyance path 1). Then, electronic components 5 with bumps are picked up from the tray feeder 4 of the component supply unit 3 and various chip-type electronic components are picked up from the tape feeder 6, transferred to the substrate 2, and aligned on the substrate 2. Mount at the mounting point of. Therefore, the Y-axis table 7A and the first X-axis table 8 are head moving means.

Y-axis table 7B, second X-axis table 1
By driving 4, the board recognition camera 15 horizontally moves in the XY directions and moves back and forth with respect to the board 2 positioned in the transport path 1. Then, in a state where the board recognition camera 15 has advanced to an arbitrary position above the board 2, an image is taken of the arbitrary position of the board 2 below. The transfer head 9 is equipped with a head-attached camera 11 that moves integrally with the transfer head. By capturing the same object with the head-attached camera 11 and the board recognition camera 15, the transfer head 9 is independent of the transfer head 9. The coordinate system of the substrate recognizing camera 15 that moves in a moving manner and the drive coordinate system of the transfer head 9 can be calibrated.

A component recognition camera 13 and a flux transfer unit 12 are provided in the movement path of the transfer head 9 between the component supply unit 3 and the transport path 1. Transfer head 9 from which electronic component 5 such as a flip chip is taken out by component supply unit 3
When the component passes the component recognition camera 13, the component recognition camera 13 images the electronic components 5 held by the suction nozzle 10 from below. As a result, the electronic component 5
Is recognized, and the electronic component 5 is identified and the position is detected.
After that, the transfer head 9 moves to the flux transfer section 12, and the electronic component 5 held here is transferred to the flux transfer section 1.
The electronic component 5 is moved up and down with respect to the coating surface of 2.
The solder bonding flux is applied to the bumps and the bonding terminals of the chip type component.

Next, the substrate 2 to be mounted will be described with reference to FIG. As shown in FIG. 2A, the substrate 2 is a multi-piece substrate in which a plurality of unit substrates 2a are formed on the same substrate. Recognition marks A and B for position recognition of the entire substrate 2 are formed at diagonal positions of the substrate 2, and the recognition marks A and B are imaged by the substrate recognition camera 15 and the positions are recognized by recognizing the positions. The position is detected.

FIG. 2B shows a unit substrate 2a. Various bonding electrodes such as an electrode 16a to which a bump of the electronic component 5 is bonded and an electrode 16b to which a chip component is bonded are formed on each unit substrate 2a. In addition, at the corner of the unit board 2a, an NG mark (indicated by an X mark in the figure) indicating whether or not the unit board 2a is a defective product that cannot be used.
The mark application position 17 is set. In the inspection in the previous step, if any defect is detected in the unit substrate 2a, the NG mark is applied to the mark application position 17. Then, in the electronic component mounting apparatus, when the board is recognized, N
The unit board 2a in which the G mark is detected is determined to be an NG board and is excluded from the mounting targets.

Next, the configuration of the control system will be described with reference to FIG. In FIG. 3, a CPU 20 is an overall control unit, and controls each unit described below in an integrated manner. The program storage unit 21 stores various programs such as an operation program for executing a mounting operation by the transfer head 9 and a processing program for recognition processing such as board recognition and component recognition. The data storage unit 22 stores various data such as mounting data.

The image recognition unit 23 is provided with the head-attached camera 1
1. The image data obtained by the image pickup by the component recognition camera 13 and the board recognition camera 15 is recognized. As a result, various calibrations such as mutual calibration of the coordinate system between the substrate recognition camera 15 and the transfer head 9, position detection of electronic components held by the transfer head 9, position detection of the substrate 2 on the transport path 1, and the like are performed. Recognition processing is performed. Therefore, the image recognition unit 23 serves as a position detection unit that detects the position of the substrate 2.

The mechanism drive section 24 is controlled by the CPU 20 and drives the following mechanisms. The substrate transfer mechanism 25
This is a transport mechanism for the substrate 2 in the transport path 1. The head moving mechanism 26 (head moving means) moves the transfer head 9 by the Y-axis table 7A and the first X-axis table 8. The camera moving mechanism 27 includes a Y-axis table 7B and a second
The board recognition camera 15 is moved by the X-axis table 14. When the CPU 20 controls the head moving unit 26, the transfer head 9 is aligned with the substrate 2 based on the position detection result of the image recognition unit 23.

The electronic component mounting apparatus is configured as described above, and the electronic component mounting operation will be described below with reference to FIGS. 5 and 6 along the flow chart of FIG. The flow of FIG. 4 shows the operation performed on the substrate 2 among the mounting operations. First, the board 2 to be mounted
Are transported from the upstream side on the transport path 1 and positioned on the substrate positioning portion (ST1). Then, the camera moving mechanism 2
5, the board recognition camera 15 is moved, and FIG.
As shown in FIG. 5, the recognition mark A of the substrate 2 is imaged to recognize the position, and then the recognition mark B is imaged to recognize the position as shown in FIG. 5B (ST2). As a result, the substrate 2
Is detected.

After that, the processing for each unit substrate 2a is performed. That is, each unit substrate 2a of the substrate 2 is imaged, and first, N in the mark application position 17 (see FIG. 2A)
By recognizing the presence or absence of the G mark, the NG unit substrate determined to be defective in the previous process is detected (ST3). The NG unit substrate detected here is excluded from the electronic component mounting target, and the following steps are only for non-defective substrate other than the NG unit substrate. Unit board 2a judged to be non-defective
Is picked up by the board recognition camera 15 and the unit board 2
The mounting point in a is recognized (ST4). This allows
The positions of the electrodes 16a and 16b shown in FIG. 2B are recognized.

The above (ST2), (ST3), (ST
In parallel with the operation of 4), as shown in FIGS. 5A and 5B, the transfer head 9 moves from the tray feeder 4 to the electronic components 5.
And the chip type electronic component is taken out from the tape feeder 6 by the suction nozzle 10, and then the transfer head 9 is moved onto the component recognition camera 13. Then, the electronic component 5 held by the suction nozzle 10 is imaged from below to identify the electronic component and detect the position of the electronic component. Thereafter, as shown in FIG. 6A, the transfer head 9 is moved onto the flux transfer section 12, where the flux is applied to the bumps of the electronic component 5 and the joining terminals of the chip type component.

After this, electronic component mounting is performed (ST
5). That is, the transfer head 9 moves onto the substrate 2, and the electronic component 5 held here is mounted on the mounting point of the unit substrate 2a to be mounted. In this mounting operation, the positional deviations of the electrodes 16a and 16b obtained by the mounting point recognition in (ST4) and the positional deviations obtained by the component recognition by the component recognition camera 13 are corrected, and high mounting position accuracy is secured. .

Thereafter, it is judged whether or not there is an unmounted unit board 2a (ST6). If there is an unmounted unit board 2a, the process returns to (ST3) to target the next unit board 2a. NG unit board detection (ST3), mounting point recognition (ST
4) and electronic component mounting (ST5) are executed. Then, if there is no unmounted unit board 2a in (ST6), the mounting operation is ended.

In the electronic component mounting method shown in the above-mentioned embodiment, an image pickup step of advancing the board recognition camera 15 arranged so as to be able to move forward and backward with respect to the conveyance path 1 onto the board 2 and picking up an image of the board 2, A position detection step of detecting the positions of the recognition marks A and B of the board 2 and the mounting points of the unit board 2a based on the image data obtained by the image pickup, and the transfer head 9 to move the electronic parts 5 from the part supply unit 3 to the electronic parts 5. It includes a component taking-out process of taking out and a component placing process of moving the transfer head 9 onto the substrate 2 and placing the electronic component 5 on the substrate 2 based on the position detection result.

When performing each of the above steps, the image pickup step by the board recognition camera 15 and the component take-out step by the transfer head 9 are simultaneously performed in parallel, and the component mounting step immediately after position detection is performed based on the image pickup result. You can move to. Further, in the above-described embodiment, since the unit substrate 2a is imaged in the state immediately before mounting in the image capturing process, the unit substrate 2a is imaged. Therefore, when a substrate such as a carrier tape which is easily deformed is targeted. Even if there is, it is possible to ensure the mounting quality with excellent positional accuracy.

Although the example in which only the position of the substrate 2 is detected by the image pickup of the substrate recognition camera 15 is shown here, in the process of sequentially picking up the image of each unit board, the mounted unit boards on which the electronic parts are already mounted are mounted. It is also possible to take an image together and detect the presence or absence of the electronic component 5 and the positional deviation based on the result of the image pickup to perform the mounting state inspection. In this way, by providing the board recognition camera 15 independently of the transfer head 9, the board recognition camera 15 can be used for different purposes and a more flexible mounting method can be realized. Has become.

[0030]

According to the present invention, the image pickup operation for recognizing the board position in the board positioning section and the pick-up operation of the electronic component by the transfer head in the component supply section are simultaneously performed. The tact time can be shortened and electronic components can be efficiently mounted on the substrate.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2A is a plan view of a board which is a mounting target of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 2B is a unit board which is a mounting target of the electronic component mounting apparatus according to the embodiment of the present invention. Top view of

FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 4 is a flowchart of a mounting operation in the electronic component mounting method according to the embodiment of the present invention.

FIG. 5 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.

FIG. 6 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.

[Explanation of symbols]

1 transport path 2 substrates 2a unit substrate 3 parts supply department 9 Transfer head 10 Suction nozzle 13 Parts recognition camera 15 Board recognition camera 20 CPU 23 Image recognition unit 26 Head moving mechanism 27 Camera movement mechanism

Continued front page    (72) Inventor Hiroshi Haji             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5E313 AA01 AA11 CC04 EE02 EE03                       EE24 EE25 FF11 FF24 FF28

Claims (4)

[Claims] 1. An electronic component mounting apparatus for transferring and mounting an electronic component on a substrate by a transfer head, comprising: a component supply unit for supplying the electronic component; a substrate positioning unit for positioning the substrate; and the electronic component. The transfer head having a plurality of suction nozzles for sucking and holding is moved between the component supply unit and the board positioning unit, and at the time of taking out electronic components from the component supply unit and mounting electronic components on the board positioning unit. Head moving means for performing a positioning operation of the transfer head, imaging means for movably advancing and retreating with respect to the substrate positioning portion and for imaging the substrate when the substrate positioning portion has advanced onto the substrate, and the imaging means Position detecting means for detecting the position of the substrate based on the image data, and a control section for controlling the head moving means based on the position detection result. An electronic component mounting apparatus characterized by comprising a. 2. An electronic component mounting method for picking up an electronic component from a component supply unit by a transfer head that is moved by a head moving unit, and transferring and mounting the electronic component on a substrate positioned by a substrate positioning unit, wherein And image pickup means for advancing and retracting the image pickup means arranged on the board of the board positioning portion to pick up the board, and a position detecting step for detecting the position of the board based on the image data obtained by this picking up And a component taking-out step of taking out an electronic component from the component supplying section by the transfer head, and controlling the head moving means based on the position detection result to place the transfer head on the substrate positioned by the substrate positioning section. A component mounting step of moving and mounting an electronic component on the substrate, wherein the imaging step in the board positioning section and the component supply section Electronic component mounting method and performing a goods take-out process concurrently. 3. The electronic component mounting method according to claim 2, wherein the board is a multi-piece board in which a plurality of unit boards are formed, and the unit board is imaged in the imaging step. 4. The electronic component mounting method according to claim 2, wherein the mounting state inspection is performed by imaging the substrate after mounting the electronic component with the substrate recognition camera.