KR102022475B1 - Method for revision of bump realization in flip chip - Google Patents
Method for revision of bump realization in flip chip Download PDFInfo
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- KR102022475B1 KR102022475B1 KR1020150084125A KR20150084125A KR102022475B1 KR 102022475 B1 KR102022475 B1 KR 102022475B1 KR 1020150084125 A KR1020150084125 A KR 1020150084125A KR 20150084125 A KR20150084125 A KR 20150084125A KR 102022475 B1 KR102022475 B1 KR 102022475B1
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- Prior art keywords
- ball
- input
- bump
- model
- flip chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
The present invention relates to a bump recognition correction method of a flip chip, comprising: registering a model ball position in a program; Comparing an input ball which is a position of a bump input from an image with a position of the model ball; Calculating an input ball position having a matching score equal to or greater than a preset value by calculating a matching score of the input ball position with respect to the model ball position; Comparing the angle with the model ball position using only the input ball position having a matching score equal to or greater than the set value, and then rotating the angle of the input ball position with the model ball position; Obtaining a center deviation between the model ball position and the input ball position; Recalculating the center position of the input ball by comparing the center deviation with the respective position deviations of the individual positions of the input ball and the individual positions of the model ball; And correcting the center position of the input ball position based on the center position of the recalculated input ball.
Description
The present invention relates to a bump recognition correction method of a flip chip, and more particularly, to a bump recognition correction method of a flip chip that can more accurately correct a bump recognition error of a flip chip.
In recent years, with the development of electronic and communication technologies, various electronic devices have become smaller and lighter. Accordingly, high integration and miniaturization of electronic components such as semiconductor chips embedded in various electronic devices are essential.
Accordingly, researches on the surface mounting technology for mounting a high density, ultra small surface mount device (SMD) on a printed circuit board (PCB) are being actively conducted.
As such a surface mounting technique, there is a flip chip process in which a bump is connected between an electrode and a substrate of a die, which is a semiconductor chip, instead of a conventional wire bonding technique.
Flip chips are devices that can directly mount electrical devices or semiconductor chips to a mounting pad of a substrate in a face-down form.
When the flip chip is mounted on the substrate, the electrical connection is made through the conductive bumps generated on the surface of the chip, and when the chip is mounted on the substrate, the flip chip is mounted in an inverted state and thus is called a flip chip.
Since flip chips do not require wire bonding, they are much smaller in size than chips that go through a common wire bonding process. In addition, since the bonding of the chip of the wire bond and the substrate is attached one at a time in the wire bonding, it can be performed simultaneously in the flip chip. Performance is also improved.
By the flip chip process, a process of mounting the flip chip on the substrate will be briefly described as follows.
First, a chip is separated from a wafer, and a chip is flipped to perform a bumping process of flipping the upper and lower surfaces.
Then, the inverted chip is moved by the mounter's head to a predetermined position, and a reflow process of applying heat to the surface containing the bump when necessary is performed.
At this time, if necessary, a fluxing process of transferring flux to the bumps is performed.
Next, the pad, which is a predetermined position at which the chip of the substrate is to be mounted, is recognized as a camera vision to recognize the position of the bump, and the bump is brought into contact with the pad to mount the chip.
Finally, heat is applied through reflow to bond the substrate to the chip, and the chip is protected by underfilling with epoxy and curing with heat.
In this flip chip process, the bump recognition parameter is set by using bumps without shape change before transferring the flux, and the position correction of the recognized bump uses the bump ball after the flux transfer, so the flux transfer amount As a result, a difference may occur in the size or shape of each bump ball, which may lower the actual bump recognition success rate.
As described above, if the bump recognition success rate is lowered and the bump position is not corrected properly, a problem such as a short may occur.
The present invention has been made in view of the above-mentioned problems, and the technical problem to be solved by the present invention is to reduce the recognition error of the bump transfer the flux to improve the degree of correction recognition, to prevent the occurrence of defects such as short To provide a bump recognition correction method of a flip chip.
The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.
Bump recognition correction method according to an embodiment of the present invention for solving the problem, the step of registering the model ball position in the program; Comparing an input ball which is a position of a bump input from an image with a position of the model ball; Calculating an input ball position having a matching score equal to or greater than a preset value by calculating a matching score of the input ball position with respect to the model ball position; Comparing the angle with the model ball position using only the input ball position having a matching score equal to or greater than the set value, and then rotating the angle of the input ball position with the model ball position; Obtaining a center deviation between the model ball position and the input ball position; Recalculating the center position of the input ball by comparing the center deviation with the respective position deviations of the individual positions of the input ball and the individual positions of the model ball; And correcting the center position of the input ball position based on the center position of the recalculated input ball.
In this case, the program may be a CAD.
In addition, when the center position of the input ball is recalculated, the input ball as the input balls representing the position deviation of the center deviation and the set value or less at each position deviation between the individual position of the input ball and the individual position of the model ball. It is desirable to recalculate the center position of.
In addition, the input ball may be a bump position where the flux is dipped and transferred to the image by the camera.
Other specific details of the invention are included in the detailed description and drawings.
According to the bump recognition correction method of the flip chip according to an embodiment of the present invention, as the error of the flip chip bump is greatly improved, a defect such as a short may be significantly reduced.
The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.
1 is a schematic diagram showing a state in which bumps are formed on a flip chip, (a) is a view before the flux is dipped in the bump, (b) is a view after the flux is dipped in the bump.
2 is a flowchart illustrating a process of recognizing a bump in the related art.
3 is a flowchart illustrating a process of mounting a flip chip on a substrate after correction of bumps in the related art.
4 is a diagram illustrating a process of comparing a model ball and an input ball according to a bump recognition correction method of a flip chip according to an exemplary embodiment of the present invention.
FIG. 5 is a view illustrating a state in which a model ball and an input ball match in FIG. 4. FIG.
6 is a flowchart sequentially illustrating a bump recognition correction method of a flip chip according to an exemplary embodiment of the present invention.
7 is a view illustrating a state in which bump positions are corrected according to a bump recognition correction method of a flip chip according to an exemplary embodiment of the present invention.
Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments of the present invention make the disclosure of the present invention complete and the general knowledge in the technical field to which the present invention belongs. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.
In addition, the embodiments described herein will be described with reference to cross-sectional and / or schematic diagrams, which are ideal illustrations of the invention. Accordingly, shapes of the exemplary views may be modified by manufacturing techniques and / or tolerances. In addition, each component in each drawing shown in the present invention may be shown to be somewhat enlarged or reduced in view of the convenience of description. Like reference numerals refer to like elements throughout.
Hereinafter, a preferred embodiment of a bump recognition correction method of a flip chip according to the present invention will be described in detail with reference to the accompanying drawings.
First, prior to describing a bump recognition correction method of a flip chip according to an exemplary embodiment of the present invention, a method of recognizing a bump of a flip chip and then correcting it will be described.
1 is a schematic view showing a bump formed on a flip chip, (a) is a view before the flux is dipped in the bump, (b) is a view after the flux is dipped in the bump.
As shown, during the flip chip process, the wiring is made using conductive bumps on the die surface, so when the bumps are bonded to and mounted on the pad surface of the substrate, the joints are cleaned and Flux is transferred to prevent oxide formation.
That is, in the state where the
In the method of transferring the
At this time, it is usually pressed by a force of 1 ~ 2kg, as shown in Figure 1 (b) by the pressing force, the shape of the
As described above, when the shape or size of the
FIG. 2 is a flowchart illustrating a process of recognizing a bump in the related art, and FIG. 3 is a flowchart illustrating a process of mounting a flip chip on a substrate after the recognition correction of the bump in the related art.
As shown in FIG. 2, conventional bump recognition sets bump recognition parameters using bumps without shape deformation before dipping for flux transfer.
That is, as shown in FIG. 1A, before the dipping for flux transfer, bumps without shape deformation are recognized in the order as shown in FIG.
In other words, pick up the flip chip from the shuttle die, and use the camera to recognize the bump of the picked up flip chip. At this time, if recognition of the bump is successful, the teaching is completed, and if the recognition of the bump fails, the recognition parameter is adjusted to recognize the bump again.
However, after the bump recognition, the step of correcting the recognized position of the bump is performed in the state where the flux is transferred to the bump as described above.
That is, as illustrated in FIG. 3, the flip chip is picked up from the shuttle die, the flux is dipped on the bump of the picked up flip chip, and then the bump is transferred to the camera using the camera. At this time, if the bump transfer of the flux is successful, the bump position is corrected, the substrate on which the flip chip is mounted is moved, and then the flip chip is mounted on the substrate.
At this time, when the flux fails to recognize the transferred bumps, an error occurs.
As described above, since the correction of the recognized bump is performed after the flux is dipped and transferred to the bump, as illustrated in FIG. 1B, the bumps may have different shapes or sizes, respectively. As a result, the recognition success rate of the bumps is also lowered, and even if the error of the recognized bumps is corrected, a correction error occurs to cause a short or the like.
Accordingly, the present invention is to provide a bump correction method of a flip chip to prevent the occurrence of defects such as a short by improving the recognition accuracy by reducing the recognition error of the bump transfer the flux.
4 is a view illustrating a process of comparing a model ball and an input ball according to a bump recognition correction method of a flip chip according to an embodiment of the present invention, and FIG. 5 illustrates a state in which a model ball and an input ball are matched in FIG. 4. Figure is shown.
6 is a flowchart sequentially illustrating a bump recognition correction method of a flip chip according to an embodiment of the present invention, and FIG. 7 is a bump position according to the bump recognition correction method of a flip chip according to an embodiment of the present invention. It is a figure which shows the corrected state.
In the bump recognition correction method of the flip chip according to the exemplary embodiment of the present invention, first, the position of the
As shown in FIG. 4, the position of the
At this time, the position of the
That is, among the plurality of bumps, the shape or the size may be changed by the transfer according to the flux dipping, and in this case, some bumps (the input ball 200) having the shape or the size changed as shown in FIG. 5 may be a model. Matching may be performed in a state spaced apart from the
Accordingly, the input balls that do not match the model balls than the set value are determined to have a low matching score, and thus excluded from the calculation of the position of the
In this manner, in addition to the positions of the input balls excluded from the calculation, the positions of the input balls having a high matching score are rotated by reflecting the input balls to the positions of the model balls after the angle comparison with the model balls.
Next, the center deviation of all the input balls and all the model balls is calculated, and the center position of the input ball is recalculated by comparing the calculated total center deviation and each positional deviation of each of the individual input balls and each of the individual model balls. .
At this time, the positional deviation of each individual input ball and each individual model ball is not less than a predetermined distance which is a previously input value, that is, the positional deviation is greater than or equal to a set value. Recalculate.
When the input ball is moved and corrected based on the center position of the input ball recalculated as described above, as shown in FIG. 7, the matching of the
Therefore, as the error for the recognition of the flip chip bumps is greatly improved, the occurrence of defects such as a short may be significantly reduced.
Those skilled in the art will appreciate that the present invention can be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.
100: model ball 200: input ball
Claims (4)
Comparing an input ball which is a position of a bump input from an image with a position of the model ball;
Calculating an input ball position having a matching score equal to or greater than a preset value by calculating a matching score of the input ball position with respect to the model ball position;
Comparing the angle with the model ball position using only the input ball position having a matching score equal to or greater than the set value, and then rotating the angle of the input ball position with the model ball position;
Obtaining a center deviation between the model ball position and the input ball position;
Recalculating the center position of the input ball by comparing the center deviation with the respective position deviations of the individual positions of the input ball and the individual positions of the model ball; And
And correcting the center position of the input ball position based on the center position of the recalculated input ball.
And the program is a CAD.
When recalculating the center position of the input ball,
Bump recognition correction of flip chip, which recalculates the center position of the input ball as the input balls representing the center deviation and the position deviation below the set value at each position deviation of the individual position of the input ball and the model ball. Way.
Bump recognition correction method of the flip chip, the input ball, the bump position, the flux is dipped and transferred to the image input by the camera.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150084125A KR102022475B1 (en) | 2015-06-15 | 2015-06-15 | Method for revision of bump realization in flip chip |
| TW105110989A TWI571992B (en) | 2015-06-15 | 2016-04-08 | Method for revision of bump realization in flip chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150084125A KR102022475B1 (en) | 2015-06-15 | 2015-06-15 | Method for revision of bump realization in flip chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160147415A KR20160147415A (en) | 2016-12-23 |
| KR102022475B1 true KR102022475B1 (en) | 2019-09-18 |
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| KR1020150084125A KR102022475B1 (en) | 2015-06-15 | 2015-06-15 | Method for revision of bump realization in flip chip |
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| TW (1) | TWI571992B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002098511A (en) | 2000-09-26 | 2002-04-05 | Matsushita Electric Ind Co Ltd | Method for inspecting mount condition of conductive ball |
| JP2003060396A (en) | 2001-08-08 | 2003-02-28 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic component |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11307567A (en) * | 1998-02-20 | 1999-11-05 | Fujitsu Ltd | Manufacture of semiconductor device containing bump inspection process |
| JP2007173801A (en) | 2005-12-22 | 2007-07-05 | Unaxis Internatl Trading Ltd | Method of fitting flip chip to substrate |
| KR101507154B1 (en) | 2007-05-09 | 2015-03-31 | 삼성전자주식회사 | Method and apparatus for transmitting and receiving a signal in mobile communication system |
| KR101672840B1 (en) * | 2011-11-09 | 2016-11-08 | 한화테크윈 주식회사 | Multiplication System of flip Chip Mounters |
| EP2891175B1 (en) * | 2012-08-31 | 2019-08-14 | Semiconductor Technologies & Instruments Pte Ltd. | Single ultra-planar wafer table structure for both wafers and film frames |
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2015
- 2015-06-15 KR KR1020150084125A patent/KR102022475B1/en active IP Right Grant
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2016
- 2016-04-08 TW TW105110989A patent/TWI571992B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002098511A (en) | 2000-09-26 | 2002-04-05 | Matsushita Electric Ind Co Ltd | Method for inspecting mount condition of conductive ball |
| JP2003060396A (en) | 2001-08-08 | 2003-02-28 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201644025A (en) | 2016-12-16 |
| TWI571992B (en) | 2017-02-21 |
| KR20160147415A (en) | 2016-12-23 |
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